A circuit board packaging transfer system

Abstract

A circuit board packaging transfer system belongs to the technical field of printed circuit board conveying and packaging. The system includes: a stacking component and a transfer device. There are a pair of stacking components, each including a horizontal guide groove, the end of which is provided with a vertical guide groove, and there is an arc transition structure at the junction of the two. The horizontal guide groove and the vertical guide groove are used for laying buffer strips. At the front end of the horizontal guide groove, there is a slot cutting component for processing a card slot on the buffer strip. Below the horizontal guide groove, there is a cutting knife, and the vertical guide groove is provided with a cutting knife hole for the cutting knife to pass through; the outer side walls of the two vertical guide grooves of the paired stacking components are arranged opposite to each other, and the two horizontal guide grooves are at the same horizontal height; the transfer device is used to transfer the circuit board to the middle of the paired stacking components, and the transfer device at least has the function of controlling the circuit board to move in the vertical and horizontal directions. This solution can achieve automated packaging, has a high packaging efficiency, and the circuit boards packaged by this solution can effectively prevent scratches between adjacent circuit boards.

Description

Technical Field

[0001] The present invention belongs to the technical field of printed circuit board conveying and packaging, and particularly relates to a circuit board packaging and transfer system. Background Art

[0002] To ensure the safety of circuit boards during storage and transportation, the circuit boards need to be packaged after processing. The currently common packaging method is to use a bubble bag to vacuum package the stacked circuit boards. To improve efficiency during the packaging process, existing packaging equipment also uses robotic arms or adsorption transfer devices to automatically complete the stacking of circuit boards. Although the existing packaging process has high efficiency, this type of packaging method allows the surfaces of adjacent circuit boards to come into direct contact, resulting in a risk of scratching the circuits on the circuit board surface. Summary of the Invention

[0003] To solve the deficiencies of the prior art, the present invention provides a circuit board packaging and transfer system, which can achieve automated packaging, has high packaging efficiency, and the circuit boards packaged using this solution can effectively prevent scratching between adjacent circuit boards.

[0004] To achieve the objectives of the present invention, the following solution is proposed:

[0005] A circuit board packaging and transfer system includes: a stacking component and a transfer device.

[0006] There is at least one pair of stacking components, which includes a horizontally arranged transverse guide groove, and a vertically downward longitudinal guide groove at its end. There is an arc transition structure at the junction of the two. The top surface of the transverse guide groove and the outer side wall of the longitudinal guide groove are both used to lay and guide the movement of a buffer strip. The buffer strip has toughness. A cutting groove component is provided at the front end of the transverse guide groove for processing a card slot on the surface of the buffer strip. The card slot is perpendicular to the movement direction of the buffer strip. A cutting knife is provided below the transverse guide groove, which is perpendicular to the movement direction of the buffer strip on the longitudinal guide groove. The longitudinal guide groove is provided with a cutting knife hole for passing through the cutting knife; the outer side walls of the two longitudinal guide grooves of the paired stacking components are arranged opposite to each other, and the two transverse guide grooves are at the same horizontal height; the distance between the surfaces of the buffer strips located in the two longitudinal guide grooves on both sides is less than the width of the circuit board, and the distance between the bottom surfaces of the two card slots on both sides is greater than the width of the circuit board;

[0007] The transfer device is used to transfer circuit boards to the middle of the paired stacking components, and the transfer device at least has the function of controlling the movement of the circuit board in the vertical and horizontal directions.

[0008] The beneficial effects of the present invention are as follows:

[0009] 1. This solution uses the card slots of the buffer strips to fix the circuit boards at intervals, effectively preventing contact between adjacent circuit boards, thereby avoiding scratching of the circuit boards.

[0010] 2. The solution realizes the automatic transfer, stacking and packaging processes of the circuit board, has a higher degree of automation, and can effectively improve the packaging and transfer efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described herein are only for illustrating the selected embodiments and not all possible implementation schemes, let alone intended to limit the scope of the present invention.

[0012] Figure 1 The overall structural schematic diagram of the preferred solution of the present application is shown.

[0013] Figure 2 The end view of the preferred solution of the present application is shown.

[0014] Figure 3 Shown is Figure 2 The partial enlarged view at A in

[0015] Figure 4 The bottom structural schematic diagram of the stacking component is shown.

[0016] Figure 5 The top structural schematic diagram of the stacking component is shown.

[0017] Figure 6 The overall structural schematic diagram of the stacking component after laying the buffer strip is shown.

[0018] Figure 7 Shown is Figure 6 The partial enlarged view at B in

[0019] Reference numerals in the drawings: stacking component - 1, transverse guide groove - 11, limit strip - 112, longitudinal guide groove - 12, cutter hole - 121, extension plate - 122, cutter - 13, friction wheel - 14, rotating motor - 15, circular blade - 16, driven bevel gear - 161, transmission shaft - 162, driving bevel gear - 163, driving motor - 164, position sensor - 17, cutting groove component - 2, cutting line - 21, belt pulley - 22, U-shaped frame - 23, cutting motor - 24, gantry - 25, lead screw - 26, transfer device - 3, horizontal transfer component - 31, vertical transfer component - 32, suction cup - 33, track - 41, telescopic device - 42, conveying track - 43, lifting component - 44, support plate - 45, lifting device - 46, buffer strip - 9, card slot - 91, guide groove - 92. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will describe the embodiments of the present invention in detail with reference to the drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0021] As shown Figures 1 to 6 in the figure, a circuit board packaging transfer system includes: a stacking component 1 and a transfer device 3

[0022] There is at least a pair of stacking components 1, which includes a horizontally arranged transverse guide groove 11, and a vertically downward longitudinal guide groove 12 is provided at its end. There is an arc transition structure at the junction of the two. The top surface of the transverse guide groove 11 and the outer side wall of the longitudinal guide groove 12 are both used to lay and guide the movement of the buffer strip 9. The buffer strip 9 has toughness, so that it can smoothly pass through the arc transition structure between the transverse guide groove 11 and the longitudinal guide groove 12. The buffer strip 9 can be made of an EPE strip or a flexible foam strip. Specifically, in this embodiment, the outer side wall of the longitudinal guide groove 12 refers to the side wall of the longitudinal guide groove 12 facing the rear of the transverse guide groove 11. The buffer strip 9 enters from the front end of the transverse guide groove 11 and exits from the rear end, and then enters from the upper end of the longitudinal guide groove 12 and finally exits from the lower end of the longitudinal guide groove 12. During the movement of the buffer strip 9, its back is closely attached to the top surface of the transverse guide groove 11 and the outer side wall of the longitudinal guide groove 12. A cutting groove component 2 is provided at the front end of the transverse guide groove 11 for processing a card slot 91 on the surface of the buffer strip 9. The card slot 91 is perpendicular to the moving direction of the buffer strip 9, and can also be understood as the card slot 91 being perpendicular to the top surface of the transverse guide groove 11 and the connecting line direction of the front and rear ends of the transverse guide groove 11. The card slot 91 is the "groove" structure, so it must penetrate the back of the buffer strip 9. Therefore, there must be a predetermined interval between the bottom of the card slot 91 and the back of the buffer strip 9. A cutting knife 13 is provided below the transverse guide groove 11, which is perpendicular to the moving direction of the buffer strip 9 on the longitudinal guide groove 12, and can also be understood as the cutting knife 13 being perpendicular to the connecting line direction between the upper and lower ends of the longitudinal guide groove 12. The longitudinal guide groove 12 is provided with a cutting knife hole 121 for passing through the cutting knife 13; the outer side walls of the two longitudinal guide grooves 12 of the paired stacking components 1 are arranged oppositely, and the two transverse guide grooves 11 are at the same horizontal height; the distance between the surfaces of the buffer strips 9 located in the two longitudinal guide grooves 12 is less than the width of the circuit board, and the distance between the bottom surfaces of the two card slots 91 is greater than the width of the circuit board.

[0023] The transfer device 3 is used to transfer the circuit board to the middle of the paired stacking components 1. The transfer device 3 at least has the function of controlling the movement of the circuit board in the vertical and horizontal directions. To achieve the above purpose, a multi-axis robotic arm or a mechanical device with horizontal and vertical drives can be used.

[0024] The conveying track 43 is arranged below the middle position of the same pair of stacking components 1, and the conveying direction of the conveying track 43 is as Figure 1The direction indicated by the arrow is consistent with the extension direction of the card slot 91 and is used to convey the packing box. A lifting assembly 44 is provided below the conveying track 43. The lifting assembly 44 includes multiple support plates 45 inserted between the rollers of the conveying track 43 and is used to control the lifting and lowering of the packing box on the conveying track 43. The lifting assembly 44 is located below the middle position of the stacking assemblies 1 arranged in pairs. A lifting device 46 is provided at the bottom of the lifting assembly 44 and is used to control the lifting and lowering of the lifting assembly 44. During operation, when an empty packing box moves to a position above the lifting assembly 44, the packing box is lifted to a predetermined position by the lifting assembly 44, so that the packing box is sleeved outside the lower ends of the two longitudinal guide grooves 12, thereby enabling the stacked circuit boards to be more smoothly loaded into the packing box. After the buffer strip 9 is cut off, the stacked circuit boards can automatically fall into the packing box under the action of gravity. After the above work is completed, the lifting assembly 44 descends, separating the packing box from the longitudinal guide grooves 12 and then falling onto the conveying track 43 again. Then, the conveying track 43 is used to output it. The position where the packing box moves to above the lifting assembly 44 can be detected by setting a sensor on the side of the conveying track 43 to detect the position signal of the packing box. When the sensor detects the position signal of the packing box, it indicates that the packing box has moved to a predetermined position above the lifting assembly 44. At this time, the lifting assembly 44 can lift the packing box upward.

[0025] Using the above structure, the most basic packaging transfer solution of this scheme can be realized. The specific process is as follows: When used for the first time, manually lay the buffer strip 9 on the two sets of stacking components 1. When laying, first insert the front end of the buffer strip 9 into the front end of the transverse guide groove 11. When the front end of the buffer strip 9 crosses the predetermined position of the grooving component 2, use the grooving component 2 to open a groove 91 with a predetermined depth on the top surface of the buffer strip 9. Then continue to move the buffer strip 9 towards the end of the transverse guide groove 11. After the buffer strip 9 moves a predetermined distance each time, use the grooving component 2 to process a groove 91 on its top surface, and then bypass the buffer strip 9 around the arc transition structure and insert it into the upper end of the longitudinal guide groove 12. Thus, the work content of manually laying the buffer strip 9 during the first use is completed, and then the circuit board can be automatically transferred and stacked. At this time, the top surface of the buffer strip 9 at the arc transition structure will present an arc bending state under the guidance of the arc transition structure, so that the corresponding groove 91 at this location is in an open state; use the transfer device 3 to control the position of the circuit board in the vertical direction to align it with the open groove 91 and make the circuit board located between the two sets of stacking components 1. Then use the transfer device 3 to control the circuit board to pass through the grooves 91 in the open state on both sides. Since the distance between the surfaces of the buffer strips 9 in the two longitudinal guide grooves 12 is less than the width of the circuit board, and the distance between the bottom surfaces of the two grooves 91 is greater than the width of the circuit board, the two sides of the circuit board in the width direction are exactly located in the grooves 91 on both sides; use the transfer device 3 to push the circuit board inserted into the groove 91 downward, and the bottom surface of the circuit board will abut against the solid part below the groove 91, and use the solid part abutting against the circuit board to push the two buffer strips 9 to move downward together towards the lower end of the longitudinal guide groove 12. The transfer device 3 can control the descending distance of the circuit board and simultaneously achieve the purpose of controlling the moving distance of the buffer strip 9. When the circuit board moves downward a predetermined distance, the transfer device 3 is separated from the circuit board and starts to prepare for transferring the next circuit board. The predetermined distance that the circuit board moves downward is the same as the distance between adjacent grooves 91. It can also be understood conversely that the transfer device 3 controls the descending distance of the circuit board, and this distance is also the distance for processing the grooves 91 on the buffer strip 9. That is, after the transfer device 3 transfers and moves a circuit board downward each time, the grooving component 2 opens a groove 91 on the top surface of the buffer strip 9 to ensure the continuity and uniformity of the grooves 91 on the buffer strip 9; after using the transfer device 3 to stack multiple circuit boards along the longitudinal guide groove 12 on the buffer strip 9, use the cutting knife 13 to pass through the cutting knife hole 121 to cut the buffer strip 9. Thus, a packaging state of stacking multiple circuit boards in a group is formed. The reciprocating movement of the cutting knife 13 can be controlled by a telescopic cylinder or a linear motor to achieve the purpose of cutting the buffer strip 9. During the specific working process, the two longitudinal guide grooves 12 can be inserted into the packaging box, so that the buffer strip 9 with the circuit boards stacked at intervals automatically falls into the packaging box.In the above solution, the circuit board is spaced and fixed by the card slot 91 of the buffer strip 9, effectively preventing contact between adjacent circuit boards, thereby avoiding scratching of the circuit boards; and the above solution realizes the automatic transfer, stacking and packaging processes of the circuit boards, has a higher degree of automation, and can effectively improve the packaging transfer efficiency of the circuit boards.

[0026] Preferably, as Figures 3 to 5 and Figure 7 shown, a friction wheel 14 is provided on the inner side of the included angle at the junction of the longitudinal guide groove 12 and the transverse guide groove 11. The outer wall of the friction wheel 14 is tangent to the outer side wall of the longitudinal guide groove 12 and the top surface of the transverse guide groove 11. One-fourth of the outer surface of the friction wheel 14 is in contact with the buffer strip 9, and the friction wheel 14 is rotatably arranged around the axis. Since the longitudinal guide groove 12 and the transverse guide groove 11 are respectively in the vertical and horizontal planes, they are perpendicular to each other. In addition, since the friction wheel 14 is located on the inner side of the included angle between the longitudinal guide groove 12 and the transverse guide groove 11, one-fourth of the outer surface of the friction wheel 14 must be exposed between the outer side wall of the longitudinal guide groove 12 and the top surface of the transverse guide groove 11, so as to replace the arc transition structure between the longitudinal guide groove 12 and the transverse guide groove 11 and contact the back surface of the buffer strip 9. In this way, the friction force of the buffer strip 9 at the arc bending part can be reduced, so that the buffer strip 9 can move downward more smoothly under the pushing action of the circuit board.

[0027] Preferably, the surface of the friction wheel 14 is provided with a structure for increasing friction, such as Figure 3 , Figure 5 shown, the stacking component 1 is provided with a rotating motor 15 for driving the friction wheel 14 to rotate. When the friction wheel 14 rotates, the linear velocity of the outer surface is consistent with the speed at which the transfer device 3 drives the circuit board to descend. This solution uses the rotating motor 15 to drive the friction wheel 14 to rotate, which can not only avoid the upward friction force of the friction wheel 14 on the buffer strip 9, but also use the friction wheel 14 to increase the driving force for the buffer strip 9 to move downward along with the circuit board, making it easier for the buffer strip 9 to move downward. The structure for increasing friction provided on the surface of the friction wheel 14 can increase the friction force for driving the buffer strip 9 to move downward. The convex strips arrayed along the circumferential outer wall of the friction wheel 14 can be used as the structure for increasing friction, or the rubber layer sprayed or adhered on the surface of the friction wheel 14 can also be used as the structure for increasing friction.

[0028] Preferably, as Figures 5 to 7As shown in the figure, a circular blade 16 is provided on each side of the front end of the transverse guide groove 11 for machining guide grooves 92 on both sides of the buffer strip 9. The guide grooves 92 are arranged along the length direction of the buffer strip 9 and are located between the back surface of the buffer strip 9 and the bottom surface of the card slot 91. Limiting strips 112 are provided in parallel on both sides of the top surface of the transverse guide groove 11 and on both sides of the outer side wall of the longitudinal guide groove 12 for matching the guide grooves 92. When the buffer strip 9 is conveyed in the transverse guide groove 11, the limiting strips 112 are clamped in the guide grooves 92 on both sides of the buffer strip 9 to ensure that the back surface of the buffer strip 9 is attached to the top surface of the transverse guide groove 11 and the outer side wall of the longitudinal guide groove 12, so that the buffer strip 9 can move smoothly along the tracks of the transverse guide groove 11 and the longitudinal guide groove 12, and it can prevent the buffer strip 9 from separating from the longitudinal guide groove 12 when the cutting knife 13 cuts. Specifically, the two circular blades 16 are driven by motors independently arranged. By arranging the guide grooves 92 between the back surface of the buffer strip 9 and the bottom surface of the card slot 91, the card slot 91 can be exposed between the limiting strips 112 arranged on the two longitudinal guide grooves 12 to prevent the edge of the circuit board from contacting the limiting strips 112 during stacking.

[0029] Further preferably, as Figure 5 shown, driven bevel gears 161 are coaxially provided at the bottom of the circular blades 16. A transmission shaft 162 is provided at the bottom of the transverse guide groove 11, and driving bevel gears 163 meshing with the two driven bevel gears 161 are respectively provided at both ends thereof. A driving motor 164 is provided at the bottom of the transverse guide groove 11, and it is connected to the transmission shaft 162 by means of parallel gear transmission for driving the transmission shaft 162 to rotate, thereby driving the two circular blades 16 to rotate, so as to facilitate the synchronous rotation of the two circular blades 16, and the cutting directions of the two circular blades 16 towards the buffer strip 9 are the same.

[0030] Preferably, as Figure 5 、 Figure 6As shown in the figure, the grooving assembly 2 includes a cutting line 21 with an annular structure and a pair of parallel belt pulleys 22. The two belt pulleys 22 tension the cutting line 21 with clothes. The two belt pulleys 22 are rotatably arranged on both sides of a U-shaped frame 23, and the U-shaped opening of the U-shaped frame 23 faces downward. The closest distance between the two belt pulleys is greater than the width of the buffer strip 9. The U-shaped frame 23 is provided with a cutting motor 24 for driving one of the belt pulleys 22 to rotate. The cutting line 21 between the two belt pulleys is parallel to the extending direction of the card slot 91. The U-shaped frame 23 is movably arranged above the transverse guide groove 11 in the vertical direction. Specifically, the movement of the U-shaped frame 23 can be controlled by a vertically arranged cylinder. When processing the card slot 91, the cutting motor 24 drives the belt pulley 22 to rotate, so that the cutting line 21 rotates rapidly. Then, the U-shaped frame 23 is moved downward to make the cutting line 21 gradually contact the buffer strip 9, and the rotating cutting line 21 is used to process the card slot 91 on the top surface of the buffer strip 9. By controlling the descending height of the U-shaped frame 23, the depth of the card slot 91 is determined. In this embodiment, a gantry 25 is provided at the top of the transverse guide groove 11, and a vertically arranged lead screw 26 is provided on the gantry 25. The lead screw 26 passes through the U-shaped frame 23, and the lead screw 26 is driven by an independently arranged motor. Sliders are provided at both ends of the U-shaped frame 23, and the sliders are respectively slidably connected to the columns on both sides of the gantry 25, so as to guide the U-shaped frame 23. The independently arranged motor drives the U-shaped frame 23 to move in the vertical direction through the lead screw 26. As another preferred structure, a disk-shaped blade can also be provided and coaxially installed on the main shaft of a motor. The disk-shaped blade is perpendicular to the connecting line of the front and rear ends of the transverse guide groove 11. The lower edge of the disk-shaped blade is at the same horizontal plane as the bottom surface of the card slot 91, and a moving device is provided for driving the motor to reciprocally move along the extending direction of the card slot 91, so as to process the card slot 91 on the top surface of the buffer strip 9 with the disk-shaped blade.

[0031] Preferably, as Figure 3As shown in the figure, on one side of at least one longitudinal guide groove 12 of the same group of stacking components 1, there is a position sensor 17 for detecting the in-place signal of the circuit board. The position signal of the circuit board detected by it is used as the basis for starting the cutting knife 13 and the grooving component 2, and as the basis for the transfer device 3 to stop moving downward, and counting is carried out. The position sensor 17 is located below the cutting knife 13, and the distance between it and the cutting knife 13 is equal to half of the distance between adjacent card slots 91. During operation, when the position sensor 17 detects the in-place signal of each circuit board, it counts once; at the same time, the transfer device 3 stops pushing the circuit board downward, and at this time, the buffer strip 9 also stops moving downward. When the counting times reach the set value of the system, the cutting knife 13 passes through the cutting knife hole 121 to cut the buffer strip 9, and the cutting position is in the middle of adjacent card slots 91 to ensure that the circuit boards above and below the cut part still have card slots 91 for limiting; while the position sensor 17 detects each circuit board, the grooving component 2 processes the top surface of the buffer strip 9 to make the card slots 91 have a consistent interval.

[0032] As a further preference, when the system is equipped with a friction wheel 14, a rotating motor 15 and a position sensor 17 at the same time, when the position sensor 17 detects the in-place signal of the circuit board, the rotating motor 15 stops working, and the driving of the buffer strip 9 by the friction wheel 14 stops.

[0033] Preferably, as Figure 1 、 Figure 2 shown in the figure, the transfer device 3 includes a horizontally arranged horizontal transfer component 31, and a vertical transfer component 32 is arranged below its moving part. The lower end of the moving rod of the vertical transfer component 32 is provided with a horizontally placed suction cup 33. The horizontal transfer component 31 is used to drive the vertical transfer component 32 to reciprocate horizontally, and the moving track is parallel to the extending direction of the card slots 91 and is located in the middle of two groups of stacking components 1 arranged in pairs. The vertical transfer component 32 is used to drive the suction cup 33 to reciprocate vertically, and the suction cup 33 is used to suck the circuit board on the feeding track. During operation, the circuit board on the vertical rod of the feeding track is sucked up by the suction cup 33, and then the circuit board is moved to a predetermined height by the vertical transfer component 32 to align the circuit board with the open card slots 91. Then, the horizontal transfer component 31 drives the vertical transfer component 32 and the circuit board to move towards the card slots 91 and inserts the circuit board into the open card slots 91. Then, the vertical transfer component 32 pushes the circuit board downward by a predetermined distance, and this predetermined distance is the same as the distance between adjacent card slots 91. Then, the suction cup 33 releases the circuit board, and the next circuit board is transferred in the same way as above. The circuit boards transferred to the buffer strip 9 will be in a stacked packaging state along the longitudinal guide groove 12.

[0034] Preferably, the distance between two sets of stacking components 1 in the same pair has an adjustment function. With this arrangement, during packaging, the lower ends of the two longitudinal guide grooves 12 can be inserted into the packaging box, and then the stacking components 1 are moved towards both ends, so that the inner side walls of the two longitudinal guide grooves 12 are pressed against the opposite inner walls of the packaging box, thereby achieving the purpose of positioning and fixing the packaging box; and by adjusting the distance between the stacking components 1, circuit boards of different widths can also be packaged.

[0035] As another preferred embodiment, multiple pairs of stacking components 1 are provided along the extending direction of the card slot 91 to adapt to the packaging of longer circuit boards.

[0036] Specifically, as Figure 1 、 Figure 2 shown, fixed-position tracks 41 are provided below the transverse guide grooves 11 of the packaging transfer system. The extending direction of the tracks 41 is the same as the length direction of the transverse guide grooves 11. The bottoms of the transverse guide grooves 11 are respectively slidably connected to the corresponding tracks 41 below. Telescopic devices 42 are provided at the outer ends of the tracks 41 for automatically adjusting the distance between two sets of stacking components 1 in the same pair.

[0037] More preferably, the distance between the lower end surface of the longitudinal guide groove 12 and the cutter 13 is greater than or equal to one time the pitch of adjacent card slots 91 to ensure that the buffer strip 9 is still in contact with the longitudinal guide groove 12 during cutting, and less than three times the pitch of adjacent card slots 91 to reduce the friction between the buffer strip 9 below the cut and the longitudinal guide groove 12. The circuit board below the cut can automatically fall under the action of gravity.

[0038] More preferably, as Figure 4 、 Figure 5 shown, the lower end of the longitudinal guide groove 12 extends downward to be provided with an extension plate 122. During packaging, the extension plate 122 is inserted into the packaging box, and the extension plate 122 is pressed against the inner wall of the packaging box to achieve the function of positioning and fixing the packaging box.

[0039] The above are only the preferred embodiments of the present invention, and do not represent the only or limit the present invention. Those skilled in the art should understand that without departing from the scope of the present invention, various changes or equivalent substitutions made to the present invention all fall within the scope of protection of the present invention.

Claims

1. A circuit board packaging transfer system, characterized in that, Including: The stacking component (1), with at least a pair, includes a horizontally arranged transverse guide groove (11), the end of which is provided with a vertically downward longitudinal guide groove (12). There is an arc transition structure at the junction of the two. The top surface of the transverse guide groove (11) and the outer side wall of the longitudinal guide groove (12) are both used for laying the buffer strip (9) and guiding the movement of the buffer strip (9). The front end of the transverse guide groove (11) is provided with a cutting groove component (2) for processing a card slot (91) on the surface of the buffer strip (9). The card slot (91) is perpendicular to the moving direction of the buffer strip (9). Below the transverse guide groove (11) is provided a cutting knife (13), which is perpendicular to the moving direction of the buffer strip (9) on the longitudinal guide groove (12). The longitudinal guide groove (12) is provided with a cutting knife hole (121) for the cutting knife (13) to pass through; the outer side walls of the two longitudinal guide grooves (12) of the paired stacking components (1) are arranged oppositely, and the two transverse guide grooves (11) are at the same horizontal height; the distance between the surfaces of the buffer strips (9) located in the two longitudinal guide grooves (12) on both sides is less than the width of the circuit board, and the distance between the bottom surfaces of the two card slots (91) on both sides is greater than the width of the circuit board; The transfer device (3) is used to transfer the circuit board to the middle of the paired stacking components (1), and the transfer device (3) at least has the function of controlling the movement of the circuit board in the vertical and horizontal directions.

2. The circuit board packaging transfer system according to claim 1, characterized in that, Inside the included angle at the junction of the longitudinal guide groove (12) and the transverse guide groove (11) is provided a friction wheel (14), the outer wall of which is tangent to the outer side wall of the longitudinal guide groove (12) and the top surface of the transverse guide groove (11). One-fourth of the outer surface of the friction wheel (14) is in contact with the buffer strip (9), and the friction wheel (14) is rotatably arranged.

3. The circuit board packaging transfer system according to claim 2, characterized in that, The surface of the friction wheel (14) is provided with a structure for increasing friction. The stacking component (1) is provided with a rotating motor (15) for driving the friction wheel (14) to rotate. When the friction wheel (14) rotates, the linear velocity of its outer surface is the same as the speed at which the transfer device (3) drives the circuit board to move vertically downward.

4. A circuit board packaging transfer system according to claim 1, characterized in that, On both sides of the front end of the transverse guide groove (11) are each provided a circular blade (16) for processing guide grooves (92) on both sides of the buffer strip (9). The guide grooves (92) are arranged along the length direction of the buffer strip (9). The guide grooves (92) are located between the back surface of the buffer strip (9) and the bottom surface of the card slot (91). On both sides of the top surface of the transverse guide groove (11) and on both sides of the outer side wall of the longitudinal guide groove (12) are parallelly provided limiting strips (112) for matching the guide grooves (92).

5. A circuit board packaging transfer system according to claim 4, characterized in that, At the bottom of each circular blade (16) is coaxially provided a driven bevel gear (161). At the bottom of the transverse guide groove (11) is provided a transmission shaft (162), and at both ends thereof are respectively provided driving bevel gears (163) meshing with the two driven bevel gears (161). At the bottom of the transverse guide groove (11) is provided a driving motor (164), which is connected to the transmission shaft (162) by means of parallel gear transmission.

6. The circuit board packaging transfer system according to claim 1, characterized in that, The grooving assembly (2) includes a cutting line (21) with an annular structure and a pair of parallel belt pulleys (22). The two belt pulleys (22) tighten the cutting line (21). The two belt pulleys (22) are rotatably arranged on both sides of a U-shaped frame (23), and the U-shaped opening of the U-shaped frame (23) faces downward. The closest distance between the two belt pulleys (22) is greater than the width of the buffer strip (9). The U-shaped frame (23) is provided with a cutting motor (24) for driving one of the belt pulleys (22) to rotate. The cutting line (21) between the two belt pulleys (22) is parallel to the extending direction of the card slot (91). The U-shaped frame (23) is movably arranged above the transverse guide groove (11) in the vertical direction.

7. A circuit board packaging transfer system according to claim 1, characterized in that, On one side of at least one longitudinal guide groove (12) of the same pair of stacking assemblies (1), there is a position sensor (17) for detecting the in-place signal of the circuit board. The position sensor (17) is located below the cutting knife (13), and the distance between it and the cutting knife (13) is equal to half of the distance between adjacent card slots (91).

8. A circuit board packaging transfer system according to claim 1, characterized in that, The transfer device (3) includes a horizontally arranged horizontal transfer assembly (31). A vertical transfer assembly (32) is provided below the moving part of the horizontal transfer assembly (31). A horizontally placed suction cup (33) is provided at the lower end of the moving rod of the vertical transfer assembly (32). The horizontal transfer assembly (31) is used to drive the vertical transfer assembly (32) to reciprocate horizontally. The moving track is parallel to the extending direction of the card slot (91) and is located in the middle of two groups of stacking assemblies (1) arranged in the same pair. The vertical transfer assembly (32) is used to drive the suction cup (33) to reciprocate vertically. The suction cup (33) is used to suck the circuit board on the feeding track.

9. A circuit board packaging transfer system according to claim 1, wherein The distance between the same pair of stacking assemblies (1) is adjustable.

10. A circuit board packaging transfer system according to claim 1, characterized in that, It also includes a conveying track (43) provided below the middle position between the same pair of stacking assemblies (1). Its conveying direction is consistent with the extending direction of the card slot (91) and is used to convey the packing box. A lifting assembly (44) is provided below the conveying track (43). It includes multiple support plates (45) passing through the rollers of the conveying track (43) and is used to control the lifting of the packing box on the conveying track (43). The lifting assembly (44) is located below the middle position between the same pair of stacking assemblies (1). A lifting device (46) is provided at the bottom of the lifting assembly (44) and is used to control the lifting of the lifting assembly (44).

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