Epoxy molding compound and preparation method and application thereof

Abstract

The invention relates to the field of electronic packaging materials, and discloses an epoxy molding compound as well as a preparation method and application thereof. Based on the total weight of the epoxy molding compound, the epoxy molding compound contains 13 to 20 weight percent of epoxy resin, 6 to 14 weight percent of a curing agent, 0.05 to 0.2 weight percent of a curing accelerator, 70 to 78 weight percent of filler, 0.1 to 1 weight percent of a coupling agent, 0.1 to 4 weight percent of a stress modifier, 0.1 to 2 weight percent of a release agent, 3 to 8 weight percent of a flame retardant, 0.01 to 0.3 weight percent of an ion trapping agent and 0.3 to 0.6 weight percent of a coloring agent, wherein the curing accelerator is 2-undecylimidazole, and the curing accelerator is 2-undecylimidazole; and the coupling agent is gamma-mercaptopropyl trimethoxy silane and / or gamma-glycidyl ether oxypropyl trimethoxy silane. The invention further discloses a preparation method of the silane coupling agent. The epoxy molding compound is simple to prepare, shows relatively high bonding performance and demolding performance when being used for packaging semiconductor components, and has relatively high operability and reliability.

Description

Technical Field

[0001] The invention relates to the field of electronic packaging materials, and in particular to an epoxy molding compound and a preparation method and application thereof. Background Art

[0002] Epoxy molding compound is a microelectronic packaging material containing epoxy resin composition. It is mainly used for packaging and protection of semiconductor chips. With its low cost, high production efficiency and reasonable reliability, it has become one of the most common and important packaging materials for modern semiconductor packaging. With the miniaturization, lightweight and high performance of electronic equipment, high integration and multi-pinning of electronic components are required, which puts forward new requirements for the reliability and operability of epoxy molding compound. Epoxy molding compound must ensure that it will not delaminate or crack due to excessive stress under different service environments, and the electrical performance of the chip will not fail due to excessive ion content; at the same time, the increase in the number of input / output terminals of semiconductor components and the continuous miniaturization of size require higher operability, so that the packaged components can be easily separated from the molding mold. If the demolding between the mold and the epoxy molding compound is not complete, the stress will cause delamination and mold contamination, reducing the packaging quality and efficiency. This requires higher adhesion of epoxy molding compound to the chip and various frame surfaces and better demolding performance.

[0003] Research shows that the key to improving packaging reliability is to improve airtightness. There should be no delamination at the contact interface between the plastic encapsulation material and the frame and chip. The most direct and effective way to inhibit the delamination of epoxy plastic encapsulation material is to reduce the amount of release agent such as wax. However, reducing the amount of release agent will lead to poor demolding performance from the molding mold, making it difficult to balance adhesion and demolding performance. Therefore, it is urgent to improve the formula of epoxy plastic encapsulation material to balance adhesion and demolding performance to obtain high operability and high reliability. Summary of the invention

[0004] The purpose of the present invention is to overcome the problem that the epoxy molding compound in the prior art has high stress and is difficult to take into account both high operability and high reliability, and to provide an epoxy molding compound and a preparation method and application thereof. The epoxy molding compound has a low thermal expansion coefficient and a bending modulus, so that the epoxy molding compound has low stress and high reliability, and has good demoulding performance and bonding performance, is easy to operate, and can be used as a packaging material for packaging semiconductor components. The preparation method of the epoxy molding compound includes raw material mixing, kneading and molding, and the process is simple and the conditions are mild, which is conducive to actual production.

[0005] In order to achieve the above object, the present invention provides an epoxy molding compound on the one hand, which contains 13-20wt% of epoxy resin, 6-14wt% of curing agent, 0.05-0.2wt% of curing accelerator, 70-78wt% of filler, 0.1-1wt% of coupling agent, 0.1-4wt% of stress modifier, 0.1-2wt% of release agent, 3-8wt% of flame retardant, 0.01-0.3wt% of ion capture agent and 0.3-0.6wt% of colorant based on the total weight of the epoxy molding compound; Wherein, the curing accelerator is 2-undecylimidazole; and the coupling agent is γ-mercaptopropyltrimethoxysilane and / or γ-glycidyloxypropyltrimethoxysilane.

[0006] Preferably, the coupling agent is a combination of γ-mercaptopropyltrimethoxysilane and γ-glycidyloxypropyltrimethoxysilane, and the weight ratio of γ-mercaptopropyltrimethoxysilane to γ-glycidyloxypropyltrimethoxysilane is 1.5-3:1.

[0007] Preferably, the epoxy resin is at least one of o-phenylphenol-formaldehyde epoxy resin, dicyclopentadiene epoxy resin and polycyclic aromatic hydrocarbon epoxy resin.

[0008] Preferably, the curing agent is at least one of phenolic resin, polycyclic aromatic hydrocarbon epoxy resin and phenol-aralkyl epoxy resin.

[0009] Preferably, the filler is at least one of aluminum nitride, boron nitride, silicon nitride, silicon dioxide and aluminum oxide.

[0010] Preferably, the coupling agent is γ-mercaptopropyltrimethoxysilane and γ-glycidyloxypropyltrimethoxysilane.

[0011] Preferably, the stress modifier is at least one of silicone oil, silicone rubber and carboxyl-terminated polybutadiene acrylonitrile.

[0012] Preferably, the stress modifier is a mixture of silicone oil and organic silicone rubber or a mixture of silicone oil and carboxyl-terminated polybutadiene acrylonitrile.

[0013] Preferably, the release agent is at least one of oxidized polyethylene wax, ethylene bis stearic acid polyamide wax, polyethylene wax and carnauba wax.

[0014] Preferably, the flame retardant is at least one of magnesium hydroxide, aluminum hydroxide, zinc borate and triphenylphosphine oxide.

[0015] Preferably, the ion scavenger is a synthetic hydrotalcite and / or an inorganic ion scavenger.

[0016] The second aspect of the present invention provides a method for preparing the aforementioned epoxy molding compound, which comprises the following steps: mixing epoxy resin, curing agent, curing accelerator, filler, coupling agent, stress modifier, release agent, flame retardant, ion capture agent and colorant, kneading the obtained mixture, and then molding the kneaded mixture.

[0017] Preferably, the mixing is carried out in a high-speed mixer, and the mixing conditions include: first mixing the filler for 10-15 minutes, then adding the coupling agent and mixing for 3-5 minutes, and then adding the epoxy resin, curing agent, curing accelerator, stress modifier, release agent, flame retardant, colorant and ion capture agent in sequence, and continuing mixing for 30-60 minutes.

[0018] Preferably, the mixing conditions include: temperature of 30-90° C. and time of 1-5 min.

[0019] The third aspect of the present invention provides the use of the aforementioned epoxy molding compound in the semiconductor component packaging process.

[0020] The epoxy molding compound described in the present invention has a lower thermal expansion coefficient and bending modulus, so that the epoxy molding compound has lower stress and higher reliability, and has both good demolding performance and bonding performance. When used as a packaging material for packaging semiconductor components, it has good packaging reliability and operability, broadens the processing window for semiconductor component packaging, has a long mold cleaning cycle, and at the same time improves the packaging quality and efficiency, and reduces the failure rate caused by mold contamination and delamination during the packaging process.

[0021] According to the preparation method of the epoxy molding compound of the present invention, through simple raw material mixing, kneading and molding, the process is simple and the conditions are mild, which is conducive to large-scale production. DETAILED DESCRIPTION

[0022] The specific embodiments of the present invention are described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0023] The endpoints and any values ​​of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of each range, the endpoint values ​​of each range and the individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.

[0024] The present invention provides an epoxy molding compound, which contains, based on the total weight of the epoxy molding compound, 13-20wt% of epoxy resin, 6-14wt% of curing agent, 0.05-0.2wt% of curing accelerator, 70-78wt% of filler, 0.1-1wt% of coupling agent, 0.1-4wt% of stress modifier, 0.1-2wt% of release agent, 2-8wt% of flame retardant, 0.01-0.3wt% of ion capture agent and 0.3-0.6wt% of colorant; Wherein, the curing accelerator is 2-undecylimidazole; and the coupling agent is γ-mercaptopropyltrimethoxysilane and / or γ-glycidyloxypropyltrimethoxysilane.

[0025] In the epoxy molding compound of the present invention, preferably, based on the gross weight of the epoxy molding compound, the epoxy molding compound contains 13-18wt% of epoxy resin, 6-9wt% of curing agent, 0.07-0.15wt% of curing accelerator, 70-76wt% of filler, 0.1-0.6wt% of coupling agent, 0.1-2wt% of stress modifier, 0.1-1.5wt% of release agent, 3-7wt% of flame retardant, 0.02-0.25wt% of ion trap and 0.3-0.5wt% of colorant. In the present invention, the above-mentioned epoxy encapsulation material component ratio is adopted, which can take into account high operability and high reliability during molding, and has good continuous molding performance and high adhesion.

[0026] In the epoxy molding compound of the present invention, preferably, the coupling agent is a combination of γ-mercaptopropyltrimethoxysilane and γ-glycidyloxypropyltrimethoxysilane, and the weight ratio of γ-mercaptopropyltrimethoxysilane to γ-glycidyloxypropyltrimethoxysilane is 1.5-3:1, more preferably 1.6-2.5:1.

[0027] In epoxy molding compound of the present invention, preferably, the epoxy resin is at least one of o-phenylphenol aldehyde type epoxy resin, dicyclopentadiene type epoxy resin and polycyclic aromatic hydrocarbon type epoxy resin. More preferably, the epoxy resin is o-phenylphenol aldehyde type epoxy resin and / or dicyclopentadiene type epoxy resin. Most preferably, the epoxy resin is a mixing of o-phenylphenol aldehyde type epoxy resin and dicyclopentadiene type epoxy resin. In the present invention, the epoxy resin ratio of the above combination is adopted to meet the packaging requirements of epoxy molding compound and achieve good packaging reliability.

[0028] In the present invention, the polycyclic aromatic hydrocarbon epoxy resin refers to an epoxy resin containing multiple aromatic rings in a repeating unit, such as phenol biphenyl alkyl epoxy resin, trisphenol methane multifunctional epoxy resin, biphenyl epoxy resin and naphthol aralkyl epoxy resin.

[0029] In the epoxy molding compound of the present invention, preferably, the curing agent is at least one of phenolic resin, polycyclic aromatic hydrocarbon epoxy resin and phenol-aralkyl epoxy resin.

[0030] In the epoxy molding compound of the present invention, preferably, the filler is at least one of aluminum nitride, boron nitride, silicon nitride, silicon dioxide and aluminum oxide. More preferably, the filler is at least one of aluminum nitride, boron nitride and silicon dioxide. Most preferably, the filler is aluminum nitride and / or silicon dioxide.

[0031] In the epoxy molding compound of the present invention, preferably, the filler is at least one of fused angular silica, spherical silica and fumed silica. In a specific embodiment, a mixture of different types of silica can be used to adjust the mechanical and thermal conductivity to meet the application requirements of the epoxy molding compound. For example, a mixture of fused angular silica and spherical silica can be used to obtain an epoxy molding compound with low stress and good thermal conductivity.

[0032] In the epoxy molding compound of the present invention, preferably, the maximum particle size of the fused angular silica and spherical silica is 75 μm to prevent the mechanical properties of the epoxy molding compound from being affected by excessively large particles.

[0033] In the epoxy molding compound of the present invention, preferably, the coupling agent is γ-mercaptopropyltrimethoxysilane and γ-glycidyloxypropyltrimethoxysilane. In the present invention, a mixture of the above two coupling agents can obtain better curing effect and mechanical properties after curing, and has higher bonding and demoulding properties.

[0034] In the epoxy molding compound of the present invention, preferably, the stress modifier is at least one of silicone oil, silicone rubber and carboxyl-terminated polybutadiene acrylonitrile.

[0035] In the epoxy molding compound of the present invention, preferably, the stress modifier is silicone oil and organic silicone rubber and / or carboxyl-terminated polybutadiene acrylonitrile.

[0036] In the present invention, the stress modifier mentioned above is used to reduce the stress of the epoxy molding compound, avoid delamination or cracking caused by high stress after packaging, and has higher packaging reliability.

[0037] In the epoxy molding compound of the present invention, preferably, the release agent is at least one of oxidized polyethylene wax, ethylene bis stearic acid polyamide wax, polyethylene wax and carnauba wax. More preferably, the release agent is at least two of oxidized polyethylene wax, ethylene bis stearic acid polyamide wax, polyethylene wax and carnauba wax. Most preferably, the release agent is a mixture of oxidized polyethylene wax and ethylene bis stearic acid polyamide wax, or a mixture of polyethylene wax and carnauba wax. In the present invention, the above-mentioned release agent is used to effectively reduce the stress of the epoxy molding compound, improve adhesion and demoulding properties, and make the epoxy molding compound have both high packaging reliability and high operability.

[0038] In the epoxy molding compound of the present invention, preferably, the flame retardant is at least one of magnesium hydroxide, aluminum hydroxide, zinc borate and triphenylphosphine oxide. More preferably, the flame retardant is at least two of magnesium hydroxide, aluminum hydroxide, zinc borate and triphenylphosphine oxide. In a specific embodiment, the use of a variety of flame retardants can minimize the impact on the packaging effect of the epoxy molding compound while ensuring the flame retardant effect, for example, the flame retardant is a mixture of magnesium hydroxide, zinc borate and triphenylphosphine oxide.

[0039] In the epoxy molding compound of the present invention, preferably, the ion capture agent is a synthetic hydrotalcite and / or an inorganic ion capture agent. More preferably, the ion capture agent is a synthetic hydrotalcite and an inorganic ion capture agent. In a specific embodiment, the synthetic hydrotalcite and the inorganic ion capture agent can be commercially available products, and the use of synthetic hydrotalcite and the inorganic ion capture agent in combination can achieve better results.

[0040] In the epoxy molding compound of the present invention, preferably, the colorant is carbon black.

[0041] The epoxy molding compound described in the present invention has a lower thermal expansion coefficient and bending modulus, so that the epoxy molding compound has lower stress and higher reliability, and has both good demolding performance and bonding performance. When used as a packaging material for packaging semiconductor components, it has good packaging reliability and operability, broadens the processing window for semiconductor component packaging, has a long mold cleaning cycle, and at the same time improves the packaging quality and efficiency, and reduces the failure rate caused by mold contamination and delamination during the packaging process.

[0042] The present invention also provides a method for preparing the epoxy molding compound described above, which comprises the following steps: mixing epoxy resin, curing agent, curing accelerator, filler, coupling agent, stress modifier, release agent, flame retardant, ion capture agent and colorant, kneading the obtained mixture, and then molding the kneaded mixture.

[0043] In the method of the present invention, preferably, the mixing is carried out in a high-speed mixer, and the mixing conditions include: first mixing the filler for 10-15 minutes, then adding the coupling agent and mixing for 3-5 minutes, and then adding the epoxy resin, curing agent, curing accelerator, stress modifier, release agent, flame retardant, colorant and ion capture agent in sequence, and continuing mixing for 30-60 minutes.

[0044] In the method of the present invention, preferably, the mixing conditions include: temperature of 30-90°C and time of 1-5 min. More preferably, the temperature is 35-85°C and time of 2-4 min. In the present invention, the above-mentioned preparation process can be used to fully mix the raw materials and obtain a uniform epoxy molding compound, thereby ensuring the quality and stability of the product.

[0045] In the method of the present invention, preferably, the mixing is performed in an extruder. In a specific embodiment, the extruder can be selected according to actual needs, for example, a twin-screw extruder can be used to control the arrangement of the screw blocks to meet specific shape requirements.

[0046] In a specific embodiment of the present invention, the preparation method of the aforementioned epoxy molding compound comprises the following steps: Based on the total weight of the epoxy molding compound: (1) Mix 70-78wt% of filler for 10-15min, then add 0.1-1wt% coupling agent and mix for 3-5min; (2) adding 13-20wt% of epoxy resin, 6-14wt% of curing agent, 0.05-0.2wt% of curing accelerator, 0.1-4wt% of stress modifier, 0.1-2wt% of release agent, 2-8wt% of flame retardant, 0.01-0.3wt% of ion capture agent and 0.3-0.6wt% of colorant to the mixture obtained in step (1), and then mixing for 30-60 minutes; (3) Kneading the mixture obtained in step (2) at 30-90° C. for 1-5 min, and then molding the kneaded material.

[0047] According to the preparation method of the epoxy molding compound of the present invention, through simple raw material mixing, kneading and molding, the process is simple and the conditions are mild, which is conducive to large-scale production.

[0048] The present invention also provides the use of the aforementioned epoxy molding compound in the semiconductor component packaging process. When the aforementioned epoxy molding compound is used for continuous packaging of semiconductor components, it can effectively avoid mold flow marks and mold sticking cracks caused by wax and resin components in the epoxy molding compound gathering on the surface and being oxidized by high temperature during the continuous packaging process, and can perform continuous molding for more than 600 times without reducing the packaging quality.

[0049] The following examples further illustrate the epoxy molding compound and its preparation method and application of the present invention. The examples are implemented based on the technical solution of the present invention, and provide detailed implementation methods and specific operation processes, but the protection scope of the present invention is not limited to the following examples.

[0050] The experimental methods in the following examples, unless otherwise specified, are all conventional methods in the art. The experimental materials used in the following examples, unless otherwise specified, are all commercially available.

[0051] In a specific embodiment of the present invention, the following commercially available experimental materials can be used: 1. Fused angular silica, DF-1220M, purchased from Jiangsu Lianrui New Materials Co., Ltd., with a maximum particle size of 75 μm; 2. Spherical silica, NQ-101, purchased from Jiangsu Lianrui New Materials Co., Ltd., with a maximum particle size of 75 μm; 3. Fumed silica, QS-102, purchased from Tokuyama Chemical Co., Ltd., Japan; 4. Aluminum nitride, NA1240W, purchased from Jiangsu Lianrui New Materials Co., Ltd., with a maximum particle size of 75 μm; 5. o-Benzene phenolic epoxy resin, SQCN700-3, purchased from Jinan Shengquan Group Co., Ltd., epoxy equivalent 198, softening point 63.5°C; 6. Dicyclopentadiene epoxy resin, HP-7200L, purchased from DIC China, epoxy equivalent 245; 7. Phenol biphenyl alkyl type epoxy resin, SQXN-323, purchased from Jinan Shengquan Group Co., Ltd., epoxy equivalent 275, softening point 55.4°C; 8. Phenolic resin, Resicare3010M, purchased from Shanghai Hengfeng New Material Technology Co., Ltd.; 9. Polycyclic aromatic hydrocarbon epoxy resin, Resicare3900, purchased from Shanghai Hengfeng New Material Technology Co., Ltd., hydroxyl equivalent 203, softening point 69.1°C; 10. Phenol-aralkyl epoxy resin, Resicare3600L, purchased from Shanghai Hengfeng New Material Technology Co., Ltd., hydroxyl equivalent 174.5, softening point 69.5°C; 11. 2-Undecyl imidazole, C11Z-A, purchased from Shikoku Chemical Co., Ltd., Japan; 12. γ-Mercaptopropyltrimethoxysilane, SICO-S313 (KBM 803), purchased from Shandong SICO New Materials Co., Ltd.; 13. γ-Glycidyloxypropyltrimethoxysilane A, SICO-A118 (KBM 573), purchased from Shandong SICO New Materials Co., Ltd.; 14. γ-Glycidyloxypropyltrimethoxysilane B, KH560, purchased from Jiangsu Chenguang Coupling Agent Co., Ltd.; 15. Magnesium hydroxide, H5IV, Shanghai Zhongjiang Chemical Co., Ltd.; 16. Aluminum hydroxide, BE033, purchased from Nippon Light Metal Co., Ltd.; 17. Triphenylphosphine oxide, C 18 H 15 OP, Shanghai Kanglang Technology Co., Ltd.; 18. Zinc borate, ZB, purchased from US Borax inc; 19. Carboxyl-terminated polybutadiene acrylonitrile, CTBN, purchased from Shenzhen Jiadida Chemical Co., Ltd.; 20. Silicone oil, SF 8421EG, purchased from Dow Corning, USA, epoxy silicone oil; 21. Silicone rubber, KMP594, purchased from Shin-Etsu Chemical Co., Ltd., Japan; 22. Oxidized polyethylene wax, clariant, Shanghai Shuangsheng Chemical Co., Ltd., softening point 71.8°C; 23. Ethylene bis stearate polyamide wax, EBS, Nanjing Tianshi New Material Technology Co., Ltd., softening point 143°C; 24. Polyethylene wax 161P, purchased from Sanyo Chemical Industries, Ltd., Japan; 25. Carnauba wax, purchased from Tianjin Dongli Lichang Chemical Co., Ltd., softening point 82.3°C; 26. Synthetic hydrotalcite, synthetic hydrotalcite DHT-4A polyolefin acid absorber, purchased from Kyowa Industry Co., Ltd., Japan; 27. Inorganic ion scavenger, IXE-100, Beijing Esser Technology Co., Ltd.; 28. Carbon black JY2021, purchased from Sichuan Zhenghao Special Carbon Black Co., Ltd.; 29. Carbon black CARBON BLACK, purchased from Mitsubishi Chemical Corporation of Japan; 30. Carbon black JY140 was purchased from Sichuan Zhenghao Special Carbon Black Co., Ltd.

[0052] Example 1 (1) 53.71 g of fused angular silica and 18 g of spherical silica were mixed for 13 min, and then 0.19 g of γ-mercaptopropyltrimethoxysilane and 0.1 g of γ-glycidyloxypropyltrimethoxysilane A were added and mixed for 4 min; (2) 10.33 g of o-phenylphenol-formaldehyde epoxy resin, 4.35 g of dicyclopentadiene epoxy resin, 7.35 g of phenolic resin, 0.1 g of 2-undecyl imidazole, 0.1 g of silicone oil, 0.1 g of carboxyl-terminated polybutadiene acrylonitrile, 0.03 g of oxidized polyethylene wax and 0.08 g of ethylene bis stearic acid polyamide wax, 0.58 g of magnesium hydroxide, 1.68 g of triphenylphosphine oxide, 2.79 g of zinc borate, 0.08 g of synthetic hydrotalcite DHT-4A polyolefin acid absorber, 0.15 g of inorganic ion scavenger IXE-100 and 0.38 g of carbon black JY2021 were added to the mixture obtained in step (1) in sequence, and then mixed for 50 min; (3) The mixture obtained in step (2) was kneaded at 60° C. for 3 min, and then the kneaded material was molded. The obtained epoxy molding amount was recorded as A1.

[0053] Example 2 (1) 56.02 g of fused angular silica and 15.1 g of spherical silica were mixed for 10 min, and then 0.19 g of γ-mercaptopropyltrimethoxysilane and 0.1 g of γ-glycidyloxypropyltrimethoxysilane A were added and mixed for 5 min; (2) 14.50 g of o-phenolic epoxy resin, 7.43 g of phenolic resin, 0.1 g of 2-undecyl imidazole, 0.1 g of silicone oil, 0.2 g of silicone rubber, 0.5 g of polyethylene wax, 0.3 g of carnauba wax, 0.58 g of magnesium hydroxide, 1.68 g of triphenylphosphine oxide, 2.79 g of zinc borate, 0.03 g of synthetic hydrotalcite DHT-4A polyolefin acid absorber and 0.38 g of carbon black JY2021 were added to the mixture obtained in step (1) in sequence, and then mixed for 60 minutes; (3) The mixture obtained in step (2) was kneaded at 60° C. for 3 min, and then the kneaded material was molded. The obtained epoxy molding amount was recorded as A2.

[0054] Example 3 (1) 61.55 g of fused angular silica, 9.8 g of spherical silica, 0.4 g of fumed silica and 0.1 g of aluminum nitride were mixed for 15 min, and then 0.22 g of γ-mercaptopropyltrimethoxysilane and 0.1 g of γ-glycidyloxypropyltrimethoxysilane B were added and mixed for 3 min; (2) 13.50 g of o-phenylphenol-formaldehyde epoxy resin, 0.1 g of phenol biphenyl alkyl epoxy resin, 7.33 g of phenolic resin, 0.1 g of phenol-aralkyl epoxy resin, 0.1 g of 2-undecyl imidazole, 0.1 g of silicone oil, 0.05 g of oxidized polyethylene wax, 0.08 g of ethylene bis stearic acid polyamide wax, 0.52 g of magnesium hydroxide, 0.06 g of aluminum hydroxide, 1.68 g of triphenylphosphine oxide, 2.79 g of zinc borate, 0.14 g of inorganic ion scavenger IXE-100 and 0.38 g of carbon black CARBONBLACK were added to the mixture obtained in step (1) in sequence, and then mixed for 35 minutes; (3) The mixture obtained in step (2) was kneaded at 70° C. for 3 min, and then the kneaded material was molded. The obtained epoxy molding amount was recorded as A3.

[0055] Example 4 (1) 56.02 g of fused angular silica and 15.3 g of spherical silica were mixed for 15 min, and then 0.19 g of γ-mercaptopropyltrimethoxysilane and 0.1 g of γ-glycidyloxypropyltrimethoxysilane A were added and mixed for 3 min; (2) 14.50 g of o-benzaldehyde epoxy resin, 7.43 g of phenolic resin, 0.1 g of 2-undecyl imidazole, 0.1 g of silicone oil, 0.2 g of silicone rubber, 0.4 g of polyethylene wax, 0.2 g of carnauba wax, 0.58 g of magnesium hydroxide, 1.68 g of triphenylphosphine oxide, 2.79 g of zinc borate, 0.03 g of synthetic hydrotalcite DHT-4A polyolefin acid absorber and 0.38 g of carbon black JY140 were added to the mixture obtained in step (1) in sequence, and then mixed for 45 minutes; (3) The mixture obtained in step (2) was kneaded at 75° C. for 3 min, and then the kneaded material was molded. The obtained epoxy molding amount was recorded as A4.

[0056] Example 5 (1) 53.42 g of fused angular silica and 18 g of spherical silica were mixed for 12 min, and then 0.19 g of γ-mercaptopropyltrimethoxysilane and 0.1 g of γ-glycidyloxypropyltrimethoxysilane A were added and mixed for 4 min; (2) 13.27 g of o-phenylphenol-formaldehyde epoxy resin, 1.33 g of dicyclopentadiene epoxy resin, 7.43 g of phenolic resin, 0.1 g of 2-undecyl imidazole, 0.1 g of silicone oil, 0.4 g of polyethylene wax, 0.2 g of carnauba wax, 0.58 g of magnesium hydroxide, 1.68 g of triphenylphosphine oxide, 2.79 g of zinc borate, 0.03 g of synthetic hydrotalcite DHT-4A polyolefin acid absorber and 0.38 g of carbon black JY2021 were added to the mixture obtained in step (1) in sequence, and then mixed for 55 minutes; (3) The mixture obtained in step (2) was kneaded at 50° C. for 3 min, and then the kneaded material was molded. The obtained epoxy molding amount was recorded as A5.

[0057] Example 6 (1) 53.37 g of fused angular silica and 18 g of spherical silica were mixed for 15 min, and then 0.19 g of γ-mercaptopropyltrimethoxysilane and 0.1 g of γ-glycidyloxypropyltrimethoxysilane A were added and mixed for 5 min; (2) 10.33 g of o-phenylphenol-formaldehyde epoxy resin, 4.35 g of dicyclopentadiene epoxy resin, 7.35 g of phenolic resin, 0.1 g of 2-undecyl imidazole, 0.1 g of silicone oil, 0.4 g of polyethylene wax, 0.2 g of carnauba wax, 0.58 g of magnesium hydroxide, 1.68 g of triphenylphosphine oxide, 2.79 g of zinc borate, 0.08 g of synthetic hydrotalcite DHT-4A polyolefin acid absorber and 0.38 g of carbon black JY2021 were added to the mixture obtained in step (1) in sequence, and then mixed for 50 min; (3) The mixture obtained in step (2) was kneaded at 90° C. for 3 min, and then the kneaded material was molded. The obtained epoxy molding amount was recorded as A6.

[0058] The formulation composition data of Examples 1-6 are shown in Table 1 below.

[0059] Table 1

[0060] Example 7 The method of Example 1 was adopted, except that the coupling agent was 0.29 g of γ-glycidyloxypropyltrimethoxysilane, and the obtained epoxy molding compound was recorded as A7.

[0061] Example 8 The method of Example 1 was adopted, except that the coupling agent was 0.29 g of γ-mercaptopropyltrimethoxysilane, and the obtained epoxy molding compound was recorded as A8.

[0062] Comparative Example 1 The method of Example 1 was adopted, except that the curing accelerator was 0.10 g of triphenylphosphine oxide, and the obtained epoxy molding amount was recorded as D1.

[0063] Comparative Example 2 The method of Example 1 was adopted, except that the coupling agent was 0.29 g of N-phenyl-3-aminopropyltrimethoxysilane, and the obtained epoxy molding compound was recorded as D2.

[0064] Comparative Example 3 The method of Example 1 is adopted, except that the stress modifier is not added, and the obtained epoxy molding compound is recorded as D3.

[0065] Test Case The performance indicators of the epoxy molding materials A1-A6 and D1-D3 obtained in Examples 1-6 and Comparative Examples 1-3 were tested with reference to the Test Methods for Epoxy Resins for Electronic Packaging (GB / T 40564-2021), and the continuous molding number of the above epoxy molding materials on the same packaging equipment was recorded (the continuous molding number is the number of completed packaging moldings when defects such as post-molding dirty film, sticking mold and bright spots first appear in the continuous molding process). The results are shown in Table 2: Table 2

[0066] It can be seen that the epoxy molding compound of the present invention has a lower thermal expansion coefficient and bending modulus, so that it has lower stress and reliability after packaging; the Cu bonding force before post-curing is generally higher than 400N, the Cu bonding force after post-curing is generally higher than 550N, and the continuous molding number is generally greater than 600 times, indicating that it has both high bonding force and demoulding performance, which is beneficial to improving the packaging quality and efficiency during continuous packaging, improving the reliability of packaging, reducing the proportion of failures caused by mold contamination and delamination during the packaging process, and having high operability and reliability; the method for preparing the epoxy molding compound is simple and suitable for large-scale production applications.

[0067] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An epoxy molding compound, characterized in that: Based on the total weight of the epoxy molding compound, the epoxy molding compound contains 13-20wt% of epoxy resin, 6-14wt% of curing agent, 0.05-0.2wt% of curing accelerator, 70-78wt% of filler, 0.1-1wt% of coupling agent, 0.1-4wt% of stress modifier, 0.1-2wt% of release agent, 3-8wt% of flame retardant, 0.01-0.3wt% of ion capture agent and 0.3-0.6wt% of colorant; Wherein, the curing accelerator is 2-undecylimidazole; and the coupling agent is γ-mercaptopropyltrimethoxysilane and / or γ-glycidyloxypropyltrimethoxysilane.

2. The epoxy molding compound according to claim 1, characterized in that: The coupling agent is a combination of γ-mercaptopropyl trimethoxysilane and γ-glycidyl ether oxypropyl trimethoxysilane, and the weight ratio of γ-mercaptopropyl trimethoxysilane to γ-glycidyl ether oxypropyl trimethoxysilane is 1.5-3:

1.

3. The epoxy molding compound according to claim 1, characterized in that: The epoxy resin is at least one of o-phenylphenol-formaldehyde epoxy resin, dicyclopentadiene epoxy resin and polycyclic aromatic hydrocarbon epoxy resin.

4. The epoxy molding compound according to claim 1, characterized in that: The curing agent is at least one of phenolic resin, polycyclic aromatic hydrocarbon epoxy resin and phenol-aralkyl epoxy resin.

5. The epoxy molding compound according to claim 1, characterized in that: The filler is at least one of aluminum nitride, boron nitride, silicon nitride, silicon dioxide and aluminum oxide.

6. The epoxy molding compound according to claim 1, characterized in that: The stress modifier is at least one of silicone oil, silicone rubber and carboxyl-terminated polybutadiene acrylonitrile; Preferably, the stress modifier is silicone oil and silicone rubber and / or carboxyl-terminated polybutadiene acrylonitrile.

7. The epoxy molding compound according to claim 1, characterized in that: The release agent is at least one of oxidized polyethylene wax, ethylene bis stearic acid polyamide wax, polyethylene wax and carnauba wax.

8. The epoxy molding compound according to claim 1, characterized in that: The flame retardant is at least one of magnesium hydroxide, aluminum hydroxide, zinc borate and triphenylphosphine oxide.

9. The epoxy molding compound according to claim 1, characterized in that: The ion capture agent is synthetic hydrotalcite and / or an inorganic ion capture agent.

10. The method for preparing the epoxy molding compound according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: mixing epoxy resin, curing agent, curing accelerator, filler, coupling agent, stress modifier, release agent, flame retardant, ion capture agent and colorant, kneading the obtained mixture, and then molding the kneaded mixture.

11. The method according to claim 10, characterized in that The mixing is carried out in a high-speed mixer, and the mixing conditions include: first mixing the filler for 10-15 minutes, then adding the coupling agent and mixing for 3-5 minutes, and then adding the epoxy resin, curing agent, curing accelerator, stress modifier, release agent, flame retardant, colorant and ion capture agent in sequence, and continuing mixing for 30-60 minutes.

12. The method according to claim 10, characterized in that The mixing conditions include: temperature of 30-90° C. and time of 1-5 min.

13. Use of the epoxy molding compound according to any one of claims 1 to 9 in the packaging process of semiconductor components.

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