High-strength modified polyaryletherketone profile and preparation method thereof

Abstract

The invention relates to the technical field of high polymer material processing, in particular to a high-strength modified polyaryletherketone profile and a preparation method thereof.The preparation method includes the steps that S1, chopped fibers are subjected to surface activating treatment after being heated and dried to remove impurities, then ultrasonic dipping treatment is conducted in an interface treatment solution, and interface treatment fibers are obtained after taking out and drying; an interface treatment agent contained in the interface treatment solution is bisphenol AF type polyaryletherketone PI-PAEK containing an imide side group; s2, the interface treating agent and polyaryletherketone resin are adopted or not adopted to be subjected to melt blending to serve as matrix resin, the matrix resin and the interface treating fibers are subjected to melt blending extrusion, granulation and forming, and the high-strength modified polyaryletherketone profile is obtained; the modified polyaryletherketone profile disclosed by the invention has relatively high mechanical property and glass transition temperature and relatively low thermal expansion coefficient.

Description

Technical Field

[0001] The invention relates to the technical field of polymer material processing, and in particular to a high-strength modified polyaryletherketone profile and a preparation method thereof. Background Art

[0002] With the advancement of technology, the demand for engineering materials continues to grow, and their performance has also been significantly improved. A variety of special engineering plastics with high temperature resistance (generally refers to long-term working temperatures exceeding 200°C) have emerged on the market, such as polyimide (PI), polyaryletherketone (PAEK) series, and liquid crystal polymer (LCP). In the PAEK series, there are many types such as polyetheretherketone (PEEK), polyetherketoneketone (PEKK), and polyetherketone (PEK). This type of material has become a very widely used special engineering plastic due to its excellent performance, such as long-term use temperature exceeding 250°C, and excellent corrosion resistance, wear resistance, self-lubrication and hydrolysis resistance. These high-performance materials play an important role in high-tech fields such as aviation, aerospace, military industry, electronics and electrical, analytical instruments, semiconductors, and petrochemicals.

[0003] In actual application scenarios, profiles account for more than half of the plastic product forms. However, during the extrusion process of fiber-reinforced polyaryletherketone profiles, due to its surface inertness and high viscosity, it is difficult to form an effective bond with the fiber surface, which makes it difficult for modified polyaryletherketone profiles to achieve the expected performance during the extrusion process, which largely limits its use in multiple application scenarios. Summary of the invention

[0004] In order to solve the above technical problems, a high-strength modified polyaryletherketone profile and a preparation method thereof are provided. In the process of profile preparation, the present invention introduces bisphenol AF polyaryletherketone (PI-PAEK) containing imide side groups to improve the interface compatibility between the fiber and the matrix resin, thereby greatly improving the mechanical strength and use temperature of the profile.

[0005] The preparation method of high-strength modified polyaryletherketone profile comprises the following steps:

[0006] S1, the short-cut fibers are heat-dried to remove impurities and then surface activated, and then ultrasonically immersed in an interface treatment solution, and then taken out and dried to obtain interface-treated fibers;

[0007] The interface treatment agent contained in the interface treatment solution has the following specific chemical structure:

[0008]

[0009] S2. Using or not using the interface treatment agent and melt blending with polyaryletherketone resin as the matrix resin, and melt blending with the interface treatment fiber to extrude, granulate and shape to obtain a high-strength modified polyaryletherketone profile.

[0010] Furthermore, the interface treatment agent has a number average molecular weight of 10,000 to 30,000 g / mol, a weight average molecular weight of 30,000 to 60,000 g / mol, and a PDI in the range of 1-3.

[0011] Furthermore, the high-strength modified polyaryletherketone profile comprises, based on 100%, interface treated fibers ≥ 5% and matrix resin ≥ 60%;

[0012] The interface treatment agent in the interface treated fiber accounts for 5wt%-40wt%;

[0013] The interface treatment agent accounts for 0wt%-50wt% in the base resin.

[0014] Further, the chopped fibers are selected from one or more of chopped carbon fibers, chopped glass fibers, chopped basalt fibers, chopped ceramic fibers, chopped PBO fibers, and chopped aramid fibers;

[0015] The polyaryletherketone resin is selected from one or more of polyetheretherketone (PEEK), polyetherketone (PEK), polyetherketoneketone (PEKK), polyetheretherketoneketone (PEEKK) and polyetherketoneetherketoneketone (PEKEKK).

[0016] Furthermore, the mass concentration of the interface treatment solution is 0.05g / mL-0.5g / mL, and the solvent for dissolving the interface treatment agent is selected from one of chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and dimethyl sulfoxide.

[0017] Furthermore, the temperature of the hot baking to remove impurities is greater than 150°C and the processing time is greater than 1 hour; the temperature of the drying is greater than 150°C and the drying time is at least 5 hours;

[0018] The surface activation treatment is plasma bombardment treatment, the bombardment gas is a mixture of one or more of oxygen, air, nitrogen, and argon, the bombardment power is 500-2500W, and the treatment time is 20 seconds to 120 seconds;

[0019] The ultrasonic power of the ultrasonic immersion treatment is 200-1800W, the treatment time is greater than 1h, and the heating temperature during the treatment is 80-250°C.

[0020] Furthermore, the processing temperature during the melt blending extrusion is 350-400°C, the conveyor belt speed is 5-20Hz, the pelletizing speed is 100-1500r / min, and the interface treated fiber is fed by side feeding;

[0021] The molding is firstly melted at 380-420°C and then extruded to a mold at a speed of 3-30r / min to fix the shape, and the shaping temperature is 180-240°C.

[0022] Another aspect of the present invention provides a high-strength modified polyaryletherketone profile obtained by the above preparation method, wherein the high-strength modified polyaryletherketone profile comprises, based on 100%, interface treated fibers ≥ 5% and matrix resin ≥ 60%;

[0023] The interface treated fiber is a product of short-cut fiber that is activated after heat drying to remove impurities and treated with an interface treatment agent, wherein the interface treatment agent accounts for 5wt%-40wt%;

[0024] The matrix resin is a blended composite of an interface treatment agent and a polyaryletherketone resin, wherein the interface treatment agent accounts for 0wt%-50wt%;

[0025] The specific chemical structure of the interface treatment agent is as follows:

[0026]

[0027] Beneficial technical effects:

[0028] The present invention heat-dries and removes impurities from the fiber and activates it, then uses bisphenol AF type polyaryletherketone PI-PAEK containing imide side groups as an interfacial compatibilizer to cause the amide bond of PI-PAEK to react with activated groups such as -OH on the fiber surface under ultrasonic conditions, and then uses polyaryletherketone resin or a blend of polyaryletherketone and PI-PAEK as a matrix resin to manufacture profiles, thereby improving the interfacial bonding performance between the inorganic fiber and the polyaryletherketone, solving the problems of poor compatibility and uneven dispersion between the fiber and the polyaryletherketone, improving the tensile strength and glass transition temperature of the polyaryletherketone profile, and reducing the thermal expansion coefficient. DETAILED DESCRIPTION

[0029] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Unless otherwise specifically stated, the numerical value set forth in these embodiments does not limit the scope of the present invention. The technology and method known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology and method should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values.

[0031] The experimental methods in the following examples without specifying specific conditions are usually measured in accordance with national standards; if there is no corresponding national standard, they are carried out in accordance with general standard requirements or general methods.

[0032] The following examples use polyetheretherketone as a representative of polyaryletherketone resins, which is provided by Jiangsu Junhua Special Polymer Materials Co., Ltd. The melt index range of PEEK resin is 8-10 g / 10 min (400° C., 2.16 Kg).

[0033] The chopped fiber used below takes chopped carbon fiber as an example, the T700 chopped carbon fiber provided by Zhongfu Shenying.

[0034] The preparation method of the bisphenol AF type polyaryletherketone (PI-PAEK) containing imide side groups used below can be found in the Chinese patent application number 202411516988.7 of Shandong Junhao High Performance Polymer Co., Ltd., which describes the preparation method of the polymer in detail in Example 1. Specifically, it is prepared by condensation polymerization of bisphenol AF containing two imide groups and 4,4'-difluorobenzophenone.

[0035] Preparation Example 1

[0036] According to the method of Example 1 in the Chinese patent with application number 202411516988.7 of Shandong Junhao High Performance Polymer Co., Ltd., bisphenol AF containing two imide groups is first synthesized, and then bisphenol AF type polyaryletherketone (PI-PAEK) containing imide side groups is produced. According to the range shown in the patent: polycondensation reaction temperature 160-180°C, reaction time 4-12h, the number average molecular weight of the obtained PI-PAEK is 10,000 to 30,000 g / mol, the weight average molecular weight is 30,000 to 60,000 g / mol, and PDI is in the range of 1-3.

[0037] A preferred preparation example is shown below.

[0038] Specific preparation process:

[0039] (1) Synthesis of bisphenol AF containing two imide groups (i.e. monomer a)

[0040]

[0041] In a 1000mL three-necked flask equipped with a reflux condenser, a nitrogen inlet and outlet, and an electric stirrer, 322gDMF, 73.25g (0.2mol) 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, and 65.17g (0.44mol) phthalic anhydride were added in sequence. Stir and dissolve at room temperature and react for 6h. Then add 31mL acetic anhydride and continue stirring for 1h. Then add 31mL triethylamine and continue stirring for 1h. After the reactants are cooled to room temperature, pour them into a poor solvent such as pure water, and the resulting precipitate is repeatedly washed with pure water. After the product is dried, it is recrystallized from a mixture of ethyl acetate / toluene. After filtering and drying the crystallized product, bisphenol AF (i.e., monomer a) containing two imide groups is obtained. The yield is 73%.

[0042] Monomer a 1 H NMR: δH(DMSO-d6,400MHz)10.45(s,2H,OH),7.85-7.95(m,8H,Ar-H),7.40(s,2H,Ar-H),7.20-7.25(d,2H,Ar-H),7.05-7.10(d,2H,Ar-H).

[0043] FTIR of bisphenol AF containing imide (cm -1 ):3390(-OH),1785(imide,C=O),1716(imide,C=O),1387(CN),1253(CF3).

[0044] DSC: Tm of monomer a is 192-194°C.

[0045] (2) Synthesis of bisphenol AF polyaryletherketone (PI-PAEK) containing imide side groups

[0046]

[0047] In a 1000mL three-necked flask equipped with a mechanical stirrer, nitrogen inlet and outlet, water separator and reflux condenser, add 62.65g (0.1mol) of diphenol monomer a (bisphenol AF containing imide in step 1), 21.82g (0.1mol) of 4,4'-difluorobenzophenone, 18.0g (0.13mol) of anhydrous K2CO3, 235g of DMF and 25mL of toluene. Under N2 atmosphere, stir at 60°C until the solid material is completely dissolved. After stirring and heating at 140°C for 2h, the generated water azeotropes with toluene, and the azeotropes are removed through the water separator. Then, the polymerization reaction was continued at 160° C. with stirring for 7 h to obtain a viscous mixed solution; the viscous mixed solution was poured into a mixed solution of 600 mL of ethanol and water (volume ratio of 1:1) to precipitate a polymer; the mixture was soaked in a hot ethanol aqueous solution (volume ratio of ethanol to water of 1:2, temperature of 80° C.) for 30 min, and the mixture was repeated three times. After filtering and drying, a bisphenol AF type polyaryletherketone (PI-PAEK) containing imide side groups was obtained, and its M n =2.58×10 4 g / mol, M w =5.7×10 4 g / mol, PDI = 2.21; T g =185°C, its tensile strength is 87MPa, and its elongation at break is more than 30%; it can be dissolved by heating in DMF, DMAc, NMP, and DMSO, and it can be dissolved at room temperature in CHCl3 and THF. The following implementation cases use PI-PAEK with this parameter, and of course, other PI-PAEK with other parameters within the above range can also be used in other cases.

[0048] Example 1

[0049] The preparation method of high-strength modified polyaryletherketone profile comprises the following steps:

[0050] S1. After the chopped carbon fiber was heat-dried and impurity-removed at 250°C for 4 hours, it was flattened and subjected to surface plasma bombardment treatment. The plasma-generating gas was air, and the plasma instrument power was 600W for 100 seconds.

[0051] At the same time, prepare the interface treatment solution: add 200g of PI-PAEK prepared in Preparation Example 1 into 1000mL NMP. Add in batches and stir until dissolved evenly.

[0052] Then, 1 kg of the chopped carbon fibers treated in the above method were ultrasonically impregnated in the interface treatment solution, with an ultrasonic power of 500 W, an ultrasonic impregnation treatment temperature of 120° C., and a treatment time of 6 h. After the treatment, the fibers were filtered out and dried at 180° C. for 5 h to obtain 1.15 kg of interface treated fibers.

[0053] In this case, the PI-PAEK interface treatment agent accounts for about 13.04% of the interface-treated fibers;

[0054] S2, using PEEK as the matrix resin, mixing the interface treated fiber and PEEK in a mass ratio of 30:70 and drying at 180°C for 5 hours, melt-blending and extruding the PEEK resin in a screw extruder, while the interface treated fiber is fed into the blending through the side feed, the processing temperature during extrusion is set to 388°C, the conveyor belt speed is set to 12Hz, the pelletizer speed is set to 600r / min, and the composite material pellets are obtained after granulation;

[0055] In this case, the PEEK matrix resin accounts for 70wt% of the composite material and the interface-treated fiber accounts for 30wt%.

[0056] Before manufacturing the profile, the composite material pellets are dried at 120°C for 5 hours to remove moisture from the particles, then melted at 380-420°C, and then extruded into a mold at a speed of 15r / min. The molding temperature is 180-240°C. This time, a plate mold with a width of 600mm and a thickness of 20mm is used to obtain a high-strength modified polyaryletherketone plate.

[0057] Example 2

[0058] The profile preparation process of this case is the same as that of Example 1, except that the matrix resin in S2 is a melt blend of PEEK and PI-PAEK interface treatment agent. Specifically, PEEK and PI-PAEK interface treatment agent are first mixed in a mass ratio of 6:4 and then melt-blended, extruded and granulated at 380-390°C to obtain the matrix resin.

[0059] In this case, the interface treated fiber accounts for 30wt% of the composite material, PEEK accounts for 42wt%, and the additionally added PI-PAEK interface treatment agent accounts for 28wt% (the total PI-PAEK interface treatment agent accounts for about 31.9wt% in the composite material).

[0060] Example 3

[0061] The profile preparation process of this case is the same as that of Example 1, except that the matrix resin in S2 is a melt blend of PEEK and PI-PAEK interface treatment agent. Specifically, PEEK and PI-PAEK interface treatment agent are first mixed in a mass ratio of 8:2 and then melt-blended, extruded and granulated at 380-390°C to obtain the matrix resin.

[0062] In this case, the interface treated fiber accounts for 30wt% of the composite material, PEEK accounts for 56wt%, and the additionally added PI-PAEK interface treatment agent accounts for 14wt% (the total PI-PAEK interface treatment agent accounts for about 17.9wt% in the composite material).

[0063] Example 3

[0064] The profile preparation process of this case is the same as that of Example 1, except that the matrix resin in S2 is a melt blend of PEEK and PI-PAEK interface treatment agent. Specifically, PEEK and PI-PAEK interface treatment agent are first mixed in a mass ratio of 9:1 and then melt-blended, extruded and granulated at 380-390°C to obtain the matrix resin.

[0065] In this case, the interface treated fiber accounts for 30wt% of the composite material, PEEK accounts for 63wt%, and the additionally added PI-PAEK interface treatment agent accounts for 7wt% (the total PI-PAEK interface treatment agent accounts for about 10.9wt% in the composite material).

[0066] Example 4

[0067] The preparation method of high-strength modified polyaryletherketone profile comprises the following steps:

[0068] S1. After the chopped carbon fiber was heat-dried and impurity-removed at 300°C for 3.5 hours, it was flattened and subjected to surface plasma bombardment treatment. The plasma-generating gas was air, and the plasma instrument power was 800W for 60 seconds.

[0069] Meanwhile, prepare the interface treatment solution: add 350 g of PI-PAEK prepared in Preparation Example 1 into 1000 mL of DMAc. Add in batches and stir until dissolved evenly.

[0070] Then, 1 kg of the chopped carbon fibers treated in the above method were ultrasonically impregnated in the interface treatment solution, with an ultrasonic power of 800 W, an ultrasonic impregnation treatment temperature of 180° C., and a treatment time of 5 h. After the treatment, the fibers were filtered out and dried at 180° C. for 5 h to obtain 1.32 kg of interface treated fibers.

[0071] In this case, the PI-PAEK interface treatment agent accounts for about 24.24% of the interface-treated fibers;

[0072] S2, using PEEK as the matrix resin, mixing the interface treated fiber and PEEK in a mass ratio of 40:60 and drying at 180°C for 5 hours, melt-blending and extruding the PEEK resin in a screw extruder, while the interface treated fiber is fed into the blending through the side feed, the processing temperature during extrusion is set to 390°C, the conveyor belt speed is set to 12Hz, the pelletizer speed is set to 600r / min, and the composite material pellets are obtained after granulation;

[0073] In this case, the PEEK matrix resin accounts for 60wt% of the composite material and the interface-treated fiber accounts for 40wt%.

[0074] Before manufacturing the profile, the composite material pellets are dried at 120°C for 5 hours to remove moisture from the particles, then melted at 380-420°C, and then extruded into a mold at a speed of 15r / min. The molding temperature is 180-240°C. This time, a plate mold with a width of 600mm and a thickness of 20mm is used to obtain a high-strength modified polyaryletherketone plate.

[0075] Example 5

[0076] The preparation method of high-strength modified polyaryletherketone profile comprises the following steps:

[0077] S1. After the chopped carbon fiber was heat-dried and impurity-removed at 400°C for 3 hours, it was flattened and subjected to surface plasma bombardment treatment. The plasma-generating gas was air, and the plasma instrument power was 1000W for 40 seconds.

[0078] Meanwhile, prepare the interface treatment solution: add 100g of PI-PAEK prepared in Preparation Example 1 into 1000mL of DMSO. Add in batches and stir until dissolved evenly.

[0079] Then, 1 kg of the chopped carbon fibers treated by the above method were ultrasonically impregnated in the interface treatment solution, with an ultrasonic power of 1000 W, an ultrasonic impregnation treatment temperature of 220° C., and a treatment time of 4 h. After the treatment, the fibers were filtered out and dried at 180° C. for 5 h to obtain 1.09 kg of interface treated fibers.

[0080] In this case, the PI-PAEK interface treatment agent accounts for about 8.26% of the interface-treated fibers;

[0081] S2, using PEEK as the matrix resin, mixing the interface treated fiber and PEEK in a mass ratio of 20:80 and drying at 180°C for 5 hours, melt-blending and extruding the PEEK resin in a screw extruder, while the interface treated fiber is fed into the blending through the side feed, the processing temperature during extrusion is set to 395°C, the conveyor belt speed is set to 12Hz, the pelletizer speed is set to 600r / min, and the composite material pellets are obtained after granulation;

[0082] In this case, the PEEK matrix resin accounts for 80wt% of the composite material and the interface-treated fiber accounts for 20wt%.

[0083] Before manufacturing the profile, the composite material pellets are dried at 120°C for 5 hours to remove moisture from the particles, then melted at 380-420°C, and then extruded into a mold at a speed of 15r / min. The molding temperature is 180-240°C. This time, a plate mold with a width of 600mm and a thickness of 20mm is used to obtain a high-strength modified polyaryletherketone plate.

[0084] Comparative Example 1

[0085] The preparation process of the composite material in this case is the same as that in Example 1, except that short-cut carbon fibers that have only been heat-dried to remove impurities are melt-blended, extruded, granulated, and molded with PEEK in a mass ratio of 30:70.

[0086] Comparative Example 2

[0087] The composite material preparation process of this case is the same as that of Example 1, except that the interface treatment agent in the interface treatment solution is SPEEK (sulfonation degree is 36%), and the proportion of SPEEK interface treatment agent in the interface treatment fiber is controlled to be basically the same as that in Example 1.

[0088] The above embodiments and comparative examples were subjected to performance tests, and the results are shown in Table 1.

[0089] Table 1 Composite material ratio and performance of each case

[0090]

[0091] As shown in Table 1, after the carbon fiber is heat-dried to remove impurities, the tensile strength of PEEK in Comparative Example 1 is increased by 14.1%, but the thermal expansion coefficient is still large; after SPEEK is grafted with plasma treatment in Comparative Example 2, the tensile strength is increased by about 21.7% compared with pure PEEK. The PEEK composite material sheet prepared by the present invention by heat-dried carbon fiber to remove impurities and grafted with PI-PAEK after plasma activation provides better interface bonding performance between carbon fiber and PEEK with more PI-PAEK grafting, and the tensile strength is at least increased by 31% compared with pure PEEK, and the thermal expansion coefficient is at least decreased by 28% compared with pure PEEK, which greatly expands the use scenarios and service life of the material. In addition, the glass transition temperature of PI-PAEK is 185°C, which is much higher than 143°C of pure PEEK. PI-PAEK replaces a part of PEEK as the matrix resin in a blended manner, which can increase the glass transition temperature of the composite material, thereby improving the performance of the composite material under high temperature conditions.

[0092] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for preparing a high-strength modified polyaryletherketone profile, characterized in that: The steps include: S1, the short-cut fibers are heat-dried to remove impurities and then surface activated, and then ultrasonically immersed in an interface treatment solution, and then taken out and dried to obtain interface-treated fibers; The interface treatment agent contained in the interface treatment solution has the following specific chemical structure: S2. Using or not using the interface treatment agent and melt blending with polyaryletherketone resin as the matrix resin, and melt blending with the interface treatment fiber to extrude, granulate and shape to obtain a high-strength modified polyaryletherketone profile.

2. The method for preparing the high-strength modified polyaryletherketone profile according to claim 1, characterized in that: The interface treatment agent has a number average molecular weight of 10,000 to 30,000 g / mol, a weight average molecular weight of 30,000 to 60,000 g / mol, and a PDI in the range of 1-3.

3. The method for preparing the high-strength modified polyaryletherketone profile according to claim 2, characterized in that: The high-strength modified polyaryletherketone profile comprises, based on 100%, interface treated fibers ≥ 5% and matrix resin ≥ 60%; The interface treatment agent in the interface treated fiber accounts for 5wt%-40wt%; The interface treatment agent accounts for 0wt%-50wt% in the base resin.

4. The method for preparing the high-strength modified polyaryletherketone profile according to claim 3, characterized in that: The chopped fibers are selected from one or more of chopped carbon fibers, chopped glass fibers, chopped basalt fibers, chopped ceramic fibers, chopped PBO fibers, and chopped aramid fibers; The polyaryletherketone resin is selected from one or more of polyetheretherketone, polyetherketone, polyetherketoneketone, polyetheretherketoneketone and polyetherketoneetherketoneketone.

5. The method for preparing the high-strength modified polyaryletherketone profile according to claim 3, characterized in that: The mass concentration of the interface treatment solution is 0.05 g / mL-0.5 g / mL, and the solvent for dissolving the interface treatment agent is selected from one of chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and dimethyl sulfoxide.

6. The method for preparing the high-strength modified polyaryletherketone profile according to claim 3, characterized in that: The temperature of the hot baking for impurity removal is greater than 150°C and the processing time is greater than 1h; the temperature of the drying is greater than 150°C and the drying time is at least 5h; The surface activation treatment is plasma bombardment treatment, the bombardment gas is a mixture of one or more of oxygen, air, nitrogen, and argon, the bombardment power is 500-2500W, and the treatment time is 20 seconds to 120 seconds; The ultrasonic power of the ultrasonic immersion treatment is 200-1800W, the treatment time is greater than 1h, and the heating temperature during the treatment is 80-250°C.

7. The method for preparing the high-strength modified polyaryletherketone profile according to claim 3, characterized in that: The processing temperature during the melt blending extrusion is 350-400°C, the conveyor belt speed is 5-20Hz, the pelletizing speed is 100-1500r / min, and the interface treated fiber is fed by side feeding; The molding is firstly melted at 380-420°C and then extruded to a mold at a speed of 3-30r / min to fix the shape, and the shaping temperature is 180-240°C.

8. High-strength modified polyaryletherketone profile, characterized in that: The profile is calculated as 100% including: interface treated fiber ≥ 5%, matrix resin ≥ 60%; The interface treated fiber is a product of short-cut fiber that is activated after heat drying to remove impurities and treated with an interface treatment agent, wherein the interface treatment agent accounts for 5wt%-40wt%; The matrix resin is a blended composite of an interface treatment agent and a polyaryletherketone resin, wherein the interface treatment agent accounts for 0wt%-50wt%; The specific chemical structure of the interface treatment agent is as follows:

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