High-strength modified polyaryletherketone profile and method for producing the same

Abstract

The application relates to the technical field of high polymer material processing, in particular to a high-strength modified polyaryletherketone profile and a preparation method thereof, S1, chopped fibers are subjected to surface activation treatment after being heated and impurity-removed, then are subjected to ultrasonic immersion treatment in an interface treatment solution, and the interface treatment fibers are obtained by taking out and drying; the interface treatment agent contained in the interface treatment solution is a bisphenol AF type polyaryletherketone PI-PAEK containing an imide side group; S2, the interface treatment agent is used or not used to melt blend with polyaryletherketone resin as a matrix resin, and the interface treatment fibers are subjected to melt blending extrusion, granulation and molding to obtain the high-strength modified polyaryletherketone profile; the modified polyaryletherketone profile has high mechanical properties, a high glass transition temperature and a low thermal expansion coefficient.

Description

Technical Field

[0001] This invention relates to the field of polymer material processing technology, specifically to high-strength modified polyaryletherketone profiles and their preparation methods. Background Technology

[0002] With technological advancements, the demand for engineering materials continues to grow, and their performance has significantly improved. A variety of high-temperature resistant (generally referring to long-term operating temperatures exceeding 200°C) specialty engineering plastics have emerged in the market, such as polyimide (PI), polyaryletherketone (PAEK) series, and liquid crystal polymers (LCP). The PAEK series encompasses various types, including polyetheretherketone (PEEK), polyetherketoneketone (PEKK), and polyetherketone (PEK). These materials, due to their superior properties, such as long-term operating temperatures exceeding 250°C, and excellent corrosion resistance, wear resistance, self-lubrication, and hydrolysis resistance, have become widely used specialty engineering plastics. These high-performance materials play a crucial role in high-tech fields such as aerospace, military, electronics, analytical instruments, semiconductors, and petrochemicals.

[0003] In practical applications, profiles account for more than half of the form of plastic products. However, during the extrusion of fiber-reinforced polyaryletherketone (PAEK) profiles, due to their surface inertness and high viscosity, it is difficult to form an effective bond with the fiber surface. This makes it difficult for modified PAEK profiles to achieve the expected performance during extrusion, which greatly limits their use in many application scenarios. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides high-strength modified polyaryletherketone (PI-PAEK) profiles and their preparation method. During the profile preparation process, this invention introduces bisphenol AF-type PI-PAEK (PI-PAEK) containing imide side groups to improve the interfacial compatibility between the fiber and the matrix resin, thereby significantly enhancing the mechanical strength and operating temperature of the profile.

[0005] The preparation method of high-strength modified polyaryletherketone profiles includes the following steps:

[0006] S1. After the short-cut fibers are heat-dried to remove impurities, they are subjected to surface activation treatment, then ultrasonically impregnated in an interface treatment solution, and finally dried to obtain interface-treated fibers.

[0007] The interface treatment agent contained in the interface treatment solution has the following specific chemical structure:

[0008]

[0009] S2. Using or not using the interface treatment agent, the polyaryletherketone resin is melt-blended as a matrix resin and then melt-blended, extruded, granulated, and molded with the interface-treated fiber to obtain a high-strength modified polyaryletherketone profile.

[0010] Furthermore, the interface treatment agent has a number-average molecular weight of 10,000 to 30,000 g / mol, a weight-average molecular weight of 30,000 to 60,000 g / mol, and a PDI in the range of 1-3.

[0011] Furthermore, the high-strength modified polyaryletherketone profile comprises, on a 100% basis: interface-treated fiber ≥5% and matrix resin ≥60%;

[0012] The interface treatment agent in the interface-treated fiber accounts for 5wt%-40wt%;

[0013] The interface treatment agent in the matrix resin accounts for 0wt%-50wt%.

[0014] Furthermore, the chopped fibers are selected from one or more of chopped carbon fibers, chopped glass fibers, chopped basalt fibers, chopped ceramic fibers, chopped PBO fibers, and chopped aramid fibers;

[0015] The polyaryletherketone resin is selected from one or more of polyetheretherketone (PEEK), polyetherketone (PEK), polyetherketoneketone (PEKK), polyetheretherketoneketone (PEEKK), and polyetherketoneetherketoneketone (PEKEKK).

[0016] Furthermore, the mass concentration of the interface treatment solution is 0.05 g / mL to 0.5 g / mL, and the solvent for dissolving the interface treatment agent is selected from one of chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and dimethyl sulfoxide.

[0017] Furthermore, the temperature for hot drying to remove impurities is greater than 150°C and the processing time is greater than 1 hour; the temperature for drying is greater than 150°C and the drying time is at least 5 hours.

[0018] The surface activation treatment is a plasma bombardment treatment, and the bombardment gas is one or more of oxygen, air, nitrogen, and argon. The bombardment power is 500-2500W and the treatment time is 20 to 120 seconds.

[0019] The ultrasonic impregnation treatment has an ultrasonic power of 200-1800W, a treatment time of more than 1 hour, and a heating temperature of 80-250℃.

[0020] Furthermore, the processing temperature during melt blending extrusion is 350-400℃, the conveyor belt speed is 5-20Hz, the pelletizing speed is 100-1500r / min, and the interface-treated fibers are fed from the side.

[0021] The molding process involves first melting the material at 380-420℃ and then extruding it into a mold at a speed of 3-30 r / min for shaping. The shaping temperature is 180-240℃.

[0022] In another aspect, the present invention provides a high-strength modified polyaryletherketone profile obtained by the above preparation method, wherein the high-strength modified polyaryletherketone profile comprises, on a 100% basis: interface-treated fiber ≥5% and matrix resin ≥60%;

[0023] The interface-treated fiber is a product of short-cut fiber that has been activated after being heat-dried to remove impurities and then treated with an interface treatment agent, wherein the interface treatment agent accounts for 5wt%-40wt%.

[0024] The matrix resin is a blend of an interface treatment agent and a polyaryletherketone resin, wherein the interface treatment agent accounts for 0 wt%-50 wt%.

[0025] The interface treatment agent has the following specific chemical structure:

[0026]

[0027] Beneficial technical effects:

[0028] This invention involves heat-drying and activating fibers to remove impurities, then using bisphenol AF-type polyaryletherketone (PI-PAEK) containing imide side groups as an interfacial compatibilizer. Under ultrasonic conditions, the amide bonds of PI-PAEK react with activated groups such as -OH on the fiber surface. Subsequently, profiles are manufactured using polyaryletherketone resin or a blend of polyaryletherketone and PI-PAEK as the matrix resin. This improves the interfacial bonding performance between inorganic fibers and polyaryletherketone, solves the problems of poor compatibility and uneven dispersion between fibers and polyaryletherketone, increases the tensile strength and glass transition temperature of polyaryletherketone profiles, and reduces the coefficient of thermal expansion. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0030] Unless otherwise specifically stated, the numerical values ​​set forth in these embodiments do not limit the scope of the invention. Techniques and methods known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques and methods should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0031] Experimental methods not specified in the following examples are generally performed according to national standards; if there is no corresponding national standard, they are performed according to general standard requirements or general methods.

[0032] The following examples use polyetheretherketone (PEEK) as a representative of polyaryletherketone (PAEK) resins, provided by Jiangsu Junhua Special Polymer Materials Co., Ltd. The melt index of PEEK resin is 8-10 g / 10 min (400℃, 2.16 kg).

[0033] The short-cut fibers used below are chopped carbon fibers, specifically T700 short-cut carbon fibers provided by Zhongfu Shenying.

[0034] The preparation method of the bisphenol AF type polyarylether ketone (PI-PAEK) containing imide side groups used below can be found in Chinese Patent Application No. 202411516988.7 of Shandong Junhao High Performance Polymer Co., Ltd., which describes the preparation method of the polymer in detail in Example 1. Specifically, it is prepared by polycondensation of bisphenol AF containing two imide groups with 4,4'-difluorobenzophenone.

[0035] Preparation Example 1

[0036] According to the method in Example 1 of Chinese Patent Application No. 202411516988.7 of Shandong Junhao High Performance Polymer Co., Ltd., bisphenol AF containing two imide groups is first synthesized, and then bisphenol AF type polyarylether ketone (PI-PAEK) containing imide side groups is produced. According to the range shown in the patent: polycondensation reaction temperature 160-180℃, reaction time 4-12h, the PI-PAEK that can be produced has a number average molecular weight of 10,000 to 30,000 g / mol, a weight average molecular weight of 30,000 to 60,000 g / mol, and a PDI in the range of 1-3.

[0037] The following are preferred preparation examples.

[0038] Specific preparation process:

[0039] (1) Synthesis of bisphenol AF (i.e. monomer a) containing two imide groups

[0040]

[0041] In a 1000 mL three-necked flask equipped with a reflux condenser, nitrogen inlet and outlet, and an electric stirrer, 322 g of DMF, 73.25 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, and 65.17 g (0.44 mol) of phthalic anhydride were added sequentially. The mixture was stirred and dissolved at room temperature and reacted for 6 h. Then, 31 mL of acetic anhydride was added, and stirring continued for 1 h. Next, 31 mL of triethylamine was added, and stirring continued for 1 h. After cooling the reactants to room temperature, they were poured into a poor solvent such as pure water, and the resulting precipitate was repeatedly washed with pure water. The product was dried and recrystallized from an ethyl acetate / toluene mixture. The crystallized product was filtered and dried to obtain bisphenol AF (i.e., monomer a) containing two imide groups. The yield was 73%.

[0042] monomer a 1 H NMR: δH(DMSO-d6,400MHz)10.45(s,2H,OH),7.85-7.95(m,8H,Ar-H),7.40(s,2H,Ar-H),7.20-7.25(d,2H,Ar-H),7.05-7.10(d,2H,Ar-H).

[0043] FTIR (cm) of bisphenol AF containing imide -1 ):3390(-OH),1785(imide,C=O),1716(imide,C=O),1387(CN),1253(CF3).

[0044] The DSC Tm of monomer a is 192–194 °C.

[0045] (2) Synthesis of bisphenol AF-type polyarylether ketones (PI-PAEK) containing imide side groups

[0046]

[0047] In a 1000 mL three-necked flask equipped with a mechanical stirrer, nitrogen inlet and outlet, water separator, and reflux condenser, 62.65 g (0.1 mol) of bisphenol monomer a (bisphenol AF containing imide from step 1), 21.82 g (0.1 mol) of 4,4'-difluorobenzophenone, 18.0 g (0.13 mol) of anhydrous K₂CO₃, 235 g of DMF, and 25 mL of toluene were added. Under a nitrogen atmosphere, the mixture was stirred at 60 °C until the solids were completely dissolved. After stirring and refluxing at 140 °C for 2 hours, the resulting water azeotropically reacted with toluene; the azeotrope was removed using a water separator. Then, the polymerization reaction was continued at 160℃ for 7 hours with stirring to obtain a viscous mixture. The viscous mixture was poured into a 600 mL solution of ethanol and water (volume ratio 1:1), precipitating the polymer. The polymer was then soaked in a hot ethanol-water solution (ethanol to water volume ratio 1:2, temperature 80℃) for 30 minutes, repeated three times. After filtration and drying, bisphenol AF type polyarylether ketone (PI-PAEK) containing imide side groups was obtained. n =2.58×10 4 g / mol, M w =5.7×10 4 g / mol, PDI = 2.21; T g At 185℃, its tensile strength is 87MPa and its elongation at break is over 30%. It can be dissolved by heating in DMF, DMAc, NMP, and DMSO, and it can be dissolved at room temperature in CHCl3 and THF. The following implementation examples use PI-PAEK with these parameters. Of course, other PI-PAEKs with parameters within the above range can also be used in other examples.

[0048] Example 1

[0049] The preparation method of high-strength modified polyaryletherketone profiles includes the following steps:

[0050] S1. After the short-cut carbon fibers are heat-dried at 250℃ for 4 hours to remove impurities, they are laid flat and subjected to surface plasma bombardment treatment. The plasma-generated gas is air, and the plasma instrument is bombarded for 100 seconds at a power of 600W.

[0051] Meanwhile, prepare the interface treatment solution: add 200g of PI-PAEK from Preparation Example 1 to 1000mL of NMP. It can be added in batches, and the solution can be stirred and dissolved evenly.

[0052] Then, 1 kg of the previously treated short-cut carbon fibers were ultrasonically impregnated in the interface treatment solution. The ultrasonic power was 500 W, the temperature for ultrasonic impregnation was 120 °C, and the treatment time was 6 h. After the treatment was completed, the fibers were filtered out and dried at 180 °C for 5 h to obtain 1.15 kg of interface-treated fibers.

[0053] In this case, the PI-PAEK interface treatment agent accounts for approximately 13.04% of the interface-treated fiber;

[0054] S2. Using PEEK as the matrix resin, interface-treated fibers and PEEK are mixed at a mass ratio of 30:70 and dried at 180℃ for 5 hours. The PEEK resin is melt-blended and extruded in a screw extruder, while the interface-treated fibers are fed into the blending process via side feeding. The extrusion processing temperature is set to 388℃, the conveyor belt speed is set to 12Hz, and the pelletizer speed is set to 600r / min. After granulation, composite material granules are obtained.

[0055] In this case, the composite material contains 70 wt% PEEK matrix resin and 30 wt% interface-treated fiber.

[0056] Before manufacturing the profile, the composite material granules were dried at 120℃ for 5 hours to remove moisture from the particles, then melted at 380-420℃, and then extruded into the mold at a speed of 15r / min. The molding temperature was 180-240℃. In this case, a plate mold with a width of 600mm and a thickness of 20mm was used to obtain a high-strength modified polyaryletherketone plate.

[0057] Example 2

[0058] The profile preparation process in this case is the same as in Example 1. The difference is that the matrix resin in S2 is a melt blend of PEEK and PI-PAEK interface treatment agent. Specifically, PEEK and PI-PAEK interface treatment agent are first mixed in a mass ratio of 6:4 and then melt blended, extruded and granulated at 380-390°C to obtain the matrix resin.

[0059] In this case, the composite material contains 30 wt% interface-treated fiber, 42 wt% PEEK, and 28 wt% additional PI-PAEK interface treatment agent (the total PI-PAEK interface treatment agent accounts for approximately 31.9 wt% of the composite material).

[0060] Example 3

[0061] The profile preparation process in this case is the same as in Example 1. The difference is that the matrix resin in S2 is a melt blend of PEEK and PI-PAEK interface treatment agent. Specifically, PEEK and PI-PAEK interface treatment agent are first mixed at a mass ratio of 8:2 and then melt blended, extruded and granulated at 380-390°C to obtain the matrix resin.

[0062] In this case, the composite material contains 30 wt% interface-treated fiber, 56 wt% PEEK, and 14 wt% additional PI-PAEK interface treatment agent (the total PI-PAEK interface treatment agent accounts for approximately 17.9 wt% of the composite material).

[0063] Example 3

[0064] The profile preparation process in this case is the same as in Example 1. The difference is that the matrix resin in S2 is a melt blend of PEEK and PI-PAEK interface treatment agent. Specifically, PEEK and PI-PAEK interface treatment agent are first mixed at a mass ratio of 9:1 and then melt-blended, extruded and granulated at 380-390°C to obtain the matrix resin.

[0065] In this case, the composite material contains 30 wt% interface-treated fiber, 63 wt% PEEK, and 7 wt% additional PI-PAEK interface treatment agent (the total PI-PAEK interface treatment agent accounts for approximately 10.9 wt% of the composite material).

[0066] Example 4

[0067] The preparation method of high-strength modified polyaryletherketone profiles includes the following steps:

[0068] S1. After the short-cut carbon fibers are heat-dried at 300℃ for 3.5 hours to remove impurities, they are laid flat and subjected to surface plasma bombardment treatment. The plasma-generated gas is air, and the plasma instrument is bombarded for 60 seconds at a power of 800W.

[0069] Meanwhile, prepare the interface treatment solution: add 350g of PI-PAEK from Preparation Example 1 to 1000mL of DMAc. It can be added in batches, and the solution can be stirred and dissolved evenly.

[0070] Then, 1 kg of the previously treated short-cut carbon fibers were ultrasonically impregnated in the interface treatment solution. The ultrasonic power was 800 W, the temperature for ultrasonic impregnation was 180 °C, and the treatment time was 5 h. After the treatment was completed, the fibers were filtered out and dried at 180 °C for 5 h to obtain 1.32 kg of interface-treated fibers.

[0071] In this case, the PI-PAEK interface treatment agent accounts for approximately 24.24% of the interface-treated fiber;

[0072] S2. Using PEEK as the matrix resin, interface-treated fibers and PEEK are mixed at a mass ratio of 40:60 and dried at 180℃ for 5 hours. The PEEK resin is then melt-blended and extruded in a screw extruder, while the interface-treated fibers are fed into the blending process via side feeding. The extrusion processing temperature is set to 390℃, the conveyor belt speed is set to 12Hz, and the pelletizer speed is set to 600r / min. After granulation, composite material granules are obtained.

[0073] In this case, the composite material contains 60 wt% PEEK matrix resin and 40 wt% interface-treated fiber.

[0074] Before manufacturing the profile, the composite material granules were dried at 120℃ for 5 hours to remove moisture from the particles, then melted at 380-420℃, and then extruded into the mold at a speed of 15r / min. The molding temperature was 180-240℃. In this case, a plate mold with a width of 600mm and a thickness of 20mm was used to obtain a high-strength modified polyaryletherketone plate.

[0075] Example 5

[0076] The preparation method of high-strength modified polyaryletherketone profiles includes the following steps:

[0077] S1. After the short-cut carbon fibers are heat-dried at 400℃ for 3 hours to remove impurities, they are laid flat and subjected to surface plasma bombardment treatment. The plasma-generated gas is air, and the plasma instrument is bombarded for 40 seconds at a power of 1000W.

[0078] Meanwhile, prepare the interface treatment solution: add 100g of PI-PAEK from Preparation Example 1 to 1000mL of DMSO. It can be added in batches, and the solution can be stirred and dissolved evenly.

[0079] Then, 1 kg of the previously treated short-cut carbon fibers were ultrasonically impregnated in the interface treatment solution. The ultrasonic power was 1000 W, the temperature for ultrasonic impregnation was 220℃, and the treatment time was 4 h. After the treatment was completed, the fibers were filtered out and dried at 180℃ for 5 h to obtain 1.09 kg of interface-treated fibers.

[0080] In this case, the PI-PAEK interface treatment agent accounts for approximately 8.26% of the interface-treated fiber;

[0081] S2. Using PEEK as the matrix resin, interface-treated fibers and PEEK are mixed at a mass ratio of 20:80 and dried at 180℃ for 5 hours. The PEEK resin is then melt-blended and extruded in a screw extruder, while the interface-treated fibers are fed into the blending process via side feeding. The extrusion processing temperature is set to 395℃, the conveyor belt speed is set to 12Hz, and the pelletizer speed is set to 600r / min. After granulation, composite material granules are obtained.

[0082] In this case, the composite material contains 80 wt% PEEK matrix resin and 20 wt% interface-treated fiber.

[0083] Before manufacturing the profile, the composite material granules were dried at 120℃ for 5 hours to remove moisture from the particles, then melted at 380-420℃, and then extruded into the mold at a speed of 15r / min. The molding temperature was 180-240℃. In this case, a plate mold with a width of 600mm and a thickness of 20mm was used to obtain a high-strength modified polyaryletherketone plate.

[0084] Comparative Example 1

[0085] The composite material preparation process in this case is the same as that in Example 1. The difference is that short-cut carbon fibers that have only undergone heat drying to remove impurities are melt-blended with PEEK at a mass ratio of 30:70, extruded, granulated, and molded.

[0086] Comparative Example 2

[0087] The composite material preparation process in this case is the same as in Example 1. The difference is that the interface treatment agent in the interface treatment solution is SPEEK (sulfonation degree of 36%), and the proportion of SPEEK interface treatment agent in the interface treatment fiber is controlled in a basically the same way as in Example 1.

[0088] Performance tests were conducted on the above embodiments and comparative examples, and the results are shown in Table 1.

[0089] Table 1 Composite material ratios and properties for each case

[0090]

[0091] As shown in Table 1, in Comparative Example 1, after removing impurities from carbon fibers by hot baking, the tensile strength of PEEK increased by 14.1%, but the coefficient of thermal expansion remained relatively high. In Comparative Example 2, after plasma treatment and grafting SPEEK, the tensile strength increased by approximately 21.7% compared to pure PEEK. The PEEK composite material sheet prepared by this invention through hot baking to remove impurities from carbon fibers and then activating them with plasma and grafting PI-PAEK provides better interfacial bonding between carbon fibers and PEEK due to the increased PI-PAEK grafting. The tensile strength is increased by at least 31% compared to pure PEEK, and the coefficient of thermal expansion is reduced by at least 28%, significantly expanding the application scenarios and service life of this material. Furthermore, the glass transition temperature of PI-PAEK is 185℃, much higher than the 143℃ of pure PEEK. Replacing a portion of PEEK with PI-PAEK as the matrix resin through blending can increase the glass transition temperature of the composite material, thereby improving its performance at high temperatures.

[0092] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. Process for the production of high-strength modified polyarylene ether ketone profiles, characterized in that, Includes the following steps: S1. After the short-cut fibers are heat-dried to remove impurities, they are subjected to surface activation treatment, then ultrasonically impregnated in an interface treatment solution, and finally dried to obtain interface-treated fibers. The interface treatment agent contained in the interface treatment solution has the following specific chemical structure: ； The interface treatment agent has a number-average molecular weight of 10,000 to 30,000 g / mol, a weight-average molecular weight of 30,000 to 60,000 g / mol, and a PDI in the range of 1 to 3. S2. Using or not using the interface treatment agent, the polyaryletherketone resin is melt-blended as a matrix resin and then melt-blended, extruded, granulated, and molded with the interface-treated fiber to obtain a high-strength modified polyaryletherketone profile.

2. The process for the preparation of high-strength modified poly (arylene ether ketone) profiles according to claim 1, characterized in that, The high-strength modified polyaryletherketone profile comprises, on a 100% basis: interface-treated fiber ≥5%, matrix resin ≥60%; The interface treatment agent in the interface-treated fiber accounts for 5wt%-40wt%; The interface treatment agent in the matrix resin accounts for 0wt%-50wt%.

3. The method for preparing high-strength modified polyaryletherketone profiles according to claim 2, characterized in that, The chopped fibers are selected from one or more of chopped carbon fiber, chopped glass fiber, chopped basalt fiber, chopped ceramic fiber, chopped PBO fiber, and chopped aramid fiber; The polyaryletherketone resin is selected from one or more of polyetheretherketone, polyetherketone, polyetherketoneketone, polyetheretherketoneketone, and polyetherketoneetherketoneketone.

4. The process for the preparation of high-strength modified poly (arylene ether ketone) sections according to claim 2, characterized in that, The interface treatment solution has a mass concentration of 0.05 g / mL to 0.5 g / mL, and the solvent for dissolving the interface treatment agent is selected from chloroform, N , N -Dimethylformamide, N , N - One of dimethylacetamide, N-methylpyrrolidone, and dimethyl sulfoxide.

5. The method for preparing high-strength modified polyaryletherketone profiles according to claim 2, characterized in that, The hot drying temperature for impurity removal is greater than 150°C and the processing time is greater than 1 hour; the drying temperature is greater than 150°C and the drying time is at least 5 hours. The surface activation treatment is a plasma bombardment treatment, and the bombardment gas is one or more of oxygen, air, nitrogen, and argon. The bombardment power is 500-2500W and the treatment time is 20 to 120 seconds. The ultrasonic impregnation treatment has an ultrasonic power of 200-1800W, a treatment time of more than 1 hour, and a heating temperature of 80-250℃.

6. The method of producing a high-strength modified poly (arylene ether ketone) profile according to claim 2, characterized by, The processing temperature during melt blending extrusion is 350-400℃, the conveyor belt speed is 5-20Hz, the pelletizing speed is 100-1500r / min, and the interface-treated fiber is fed by side feeding. The molding process involves first melting the material at 380-420℃ and then extruding it into a mold at a speed of 3-30 r / min for shaping. The shaping temperature is 180-240℃.

7. High-strength modified polyarylene ether ketone profile, characterized in that, The profiles, calculated at 100%, include: interface-treated fibers ≥5%, and matrix resin ≥60%; The interface-treated fiber is a product of short-cut fibers that have been heat-dried to remove impurities, activated, and then treated with an interface treatment agent, wherein the interface treatment agent accounts for 5wt%-40wt%; The matrix resin is a blend of an interface treatment agent and a polyaryletherketone resin, wherein the interface treatment agent accounts for 0 wt%-50 wt%; The interface treatment agent has the following specific chemical structure: ； The interface treatment agent has a number-average molecular weight of 10,000 to 30,000 g / mol, a weight-average molecular weight of 30,000 to 60,000 g / mol, and a PDI in the range of 1 to 3.

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