Rod sticking glue as well as preparation method and application thereof

Abstract

The invention discloses stick glue and a preparation method and application thereof.The stick glue comprises a component A and a component B. The component A comprises epoxy resin, cardanol glycidyl ether, an epoxy reactive diluent, heat conduction filler, a defoaming agent, an anti-settling agent, a coloring agent, a thixotropic agent and a coupling agent; the component B comprises a curing agent, a curing accelerator, a defoaming agent, an anti-settling agent, a thixotropic agent, a heat-conducting filler, a non-active diluent and a coloring agent; the anacardol glycidyl ether molecule contains an epoxy group and a long-chain alkyl group, the epoxy group and the epoxy resin participate in a curing reaction together, and the long-chain alkyl group improves the flexibility of the epoxy adhesive and reduces adhesive falling and deformation caused by high linear speed in the cutting process; the addition of the heat-conducting filler enhances the heat conductivity of the stick glue, improves the non-uniform heat conduction at the chamfers in the glue curing process, enables the volume change of the adhesive surface to be more uniform, and avoids the problem that the stress concentration of the silicon wafer is easy to cause unfilled corners.

Description

Technical Field

[0001] The invention relates to the field of photovoltaic single crystal silicon wafer processing, and in particular to a stick adhesive and a preparation method and application thereof. Background Art

[0002] With the development of the photovoltaic industry, the trend has become to increase the size and thinness of photovoltaic silicon wafers and the corresponding thinning of cutting wires. The continuous progress of photovoltaic silicon rod cutting technology has also put forward higher requirements for stick glue. In the prior art, in response to the technical problem that stick glue increases the pH and conductivity of the cutting liquid recycling and supply system, China's invention patent CN112940658A proposes a two-component stick glue that can maintain the stability of the cutting liquid recycling and supply system; the utility model patent CN218663614U proposes a photovoltaic crystal rod three-in-one glue automatic production line to realize the industrial automation production of glue; and the invention patent CN117400429A provides a silicon wafer cutting method, device, equipment and system. When controlling the silicon wafer cutting equipment to perform silicon wafer cutting operations, the wire speed of the cutting line, the wire supply of the cutting line and the cutting position are comprehensively considered to effectively improve the control accuracy of silicon wafer cutting, and improve the yield rate and production efficiency of silicon wafer cutting.

[0003] However, there are still some problems with the adhesive that have not been paid attention to and solved. At present, photovoltaic silicon adhesive uses two-component epoxy resin as the main component. When the silicon rod is glued at a constant temperature, it needs to be pre-cured for 5 to 20 minutes to ensure that the silicon rod can maintain the correct position, and then fully cured for 2.5 to 3 hours. The fully cured adhesive can withstand the vibration force generated by the silicon rod during the cutting process. Due to the speed change and temperature change when cutting the silicon rod, the uneven temperature inside the colloid leads to uneven curing and internal stress. In addition, the stress is concentrated at the chamfer of the silicon rod itself, which is relatively brittle, has a large volume shrinkage rate, and increases the stress on the contact surface. It is easier to break during the cutting process, increasing the risk of missing corners of the silicon wafer.

[0004] Therefore, it is necessary to solve the problem of instantaneous heat generated by the adhesive stick during the cutting process, and the problem of uneven heat conduction causing damage to the silicon wafer after the temperature change during debonding. Summary of the invention

[0005] The main purpose of the present invention is to provide a sticky glue and a preparation method and application thereof, aiming to solve the technical problem that the existing sticky glue is easily damaged during the cutting process.

[0006] In order to achieve the above-mentioned object, the first aspect of the present invention provides a stick adhesive, comprising component A and component B, wherein the component A comprises: epoxy resin, cardanol glycidyl ether, epoxy reactive diluent, thermal conductive filler, defoamer, anti-settling agent, colorant, thixotropic agent and coupling agent;

[0007] The B component includes: a curing agent, a curing accelerator, a defoaming agent, an anti-settling agent, a thixotropic agent, a thermal conductive filler, an inactive diluent and a colorant.

[0008] Furthermore, the A component includes the following raw materials in parts by weight: 35-65 parts of bisphenol A epoxy resin, 5-20 parts of glycidyl ester epoxy resin, 1-10 parts of cardanol glycidyl ether, 1-5 parts of epoxy reactive diluent, 25-50 parts of thermal conductive filler, 0.1-3 parts of defoaming agent, 0.05-5 parts of anti-settling agent, 0.5-1 parts of coloring agent, 0.1-3 parts of thixotropic agent, and 0.01-3 parts of coupling agent; the B component includes the following raw materials in parts by weight: 35-60 parts of curing agent, 2-10 parts of curing accelerator, 0.1-3 parts of defoaming agent, 0.05-5 parts of anti-settling agent, 0.5-1 parts of coloring agent, 0.1-3 parts of thixotropic agent, 10-25 parts of thermal conductive filler, and 10-20 parts of inactive diluent.

[0009] Furthermore, the thermally conductive filler is aluminum oxide.

[0010] Furthermore, the bisphenol A epoxy resin is E51 type, and the glycidyl ester epoxy resin is diglycidyl adipate.

[0011] Furthermore, the curing agent is polyethyleneimine; the curing accelerator is triethylamine; the defoaming agent is KS-603; the anti-settling agent is a titanate coupling agent; the thixotropic agent is polyamide-modified hydrogenated castor oil; the inactive diluent is dibutyl phthalate; and the coupling agent is KH560.

[0012] The second aspect of the present invention provides a method for preparing a stick adhesive, comprising the following steps:

[0013] S1, adding epoxy resin, cardanol glycidyl ether, epoxy reactive diluent, thermal conductive filler, defoamer, anti-settling agent, colorant, thixotropic agent and coupling agent into a stirring tank, dispersing and stirring evenly to obtain the A component;

[0014] S2, adding a curing agent, a curing accelerator, a defoaming agent, an anti-settling agent, a thixotropic agent, a thermal conductive filler, an inactive diluent and a colorant into a mixing tank, dispersing and stirring the mixture to obtain the B component;

[0015] S3, mixing the component A and the component B in a ratio of 1:1 to 1.1 to obtain.

[0016] Furthermore, the preparation method of the cardanol glycidyl ether comprises the following steps:

[0017] S4, adding a certain proportion of cardanol, epichlorohydrin and benzyltriethylammonium chloride into a reaction kettle, stirring evenly, and then adding sodium hydroxide solution to react to obtain a reactant;

[0018] S5, washing the reactant to neutrality and separating the organic phase;

[0019] S6, subjecting the organic phase to reduced-pressure rotary evaporation to obtain the cardanol glycidyl ether.

[0020] Furthermore, the molar ratio of the cardanol, epichlorohydrin and benzyltriethylammonium chloride is 1:0.8:0.2.

[0021] A third aspect of the present invention provides an application of stick glue in silicon wafer cutting.

[0022] Beneficial effects:

[0023] The invention discloses a stick adhesive and a preparation method and application thereof. The stick adhesive is prepared by modifying epoxy resin with cardanol glycidyl ether. The cardanol glycidyl ether molecule contains epoxy groups and long-chain hydrocarbon groups. The epoxy groups participate in the curing reaction together with the epoxy resin. The long-chain hydrocarbon groups can be inserted into the network structure of the epoxy resin after curing, thereby improving the flexibility of the epoxy adhesive and reducing the glue falling and deformation caused by high line speed during cutting. Meanwhile, the curing reaction process can be accelerated, the curing time of the glue can be reduced, the bonding time can be reduced, the interval time from the stick adhesive to the slice can be shortened, and the risk of silicon chip damage can be reduced. Furthermore, the long-chain hydrocarbon group has a certain steric hindrance effect, so that the stick adhesive can maintain good fluidity and processability from the time of curing to the time of being used on a machine, thereby extending the effective time for the stick adhesive to maintain high performance, namely, the applicability period, thereby ensuring the stability of the glue state and improving the bonding effect of the stick adhesive.

[0024] Epoxy resin and other matrix materials have poor thermal conductivity. The addition of thermal conductive fillers in the present invention enhances the thermal conductivity of the adhesive stick glue, can form a thermal conductive channel inside the glue, improves the uneven heat conduction at the chamfer during the glue curing process, and makes the volume change of the adhesive surface more uniform, thus avoiding the problem of missing corners easily caused by stress concentration at the silicon wafer.

[0025] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the embodiments. DETAILED DESCRIPTION

[0026] The experimental methods in the following examples of the present invention, where no specific conditions are specified, are usually carried out under conventional conditions or under conditions recommended by the manufacturers. The various commonly used chemical reagents used in the examples are all commercially available products.

[0027] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0028] The terms "including" and "having" and any variations thereof of the present invention are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment comprising a series of steps is not limited to the listed steps or modules, but may optionally include steps not listed, or may optionally include other steps inherent to these processes, methods, products or equipment.

[0029] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments. It should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present invention. In addition, in the following description, the description of known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0030] The present invention is further described in the following examples, but the examples are not intended to limit the scope of protection of the present invention.

[0031] An embodiment of the present invention provides a stick adhesive, comprising component A and component B, wherein component A comprises: epoxy resin, cardanol glycidyl ether, epoxy reactive diluent, thermal conductive filler, defoamer, anti-settling agent, colorant, thixotropic agent and coupling agent;

[0032] The B component includes: a curing agent, a curing accelerator, a defoaming agent, an anti-settling agent, a thixotropic agent, a thermal conductive filler, an inactive diluent and a colorant.

[0033] Since problems such as chipped corners and broken edges of silicon wafers during the cutting process are often caused by the epoxy resin layer being too brittle and directly breaking during the cutting process, the present invention introduces cardanol which has a benzene ring structure and a long-chain hydroxyl structure. The cardanol glycidyl ether prepared from cardanol as a raw material has both strength and good flexibility. Introducing it into the epoxy resin can effectively improve the toughness and reduce the brittleness, thereby reducing the risk of silicon wafer breakage and damage.

[0034] More specifically, the cardanol in the cardanol glycidyl ether is a natural biomass phenol extracted from cashew nut shell oil, with a benzene ring structure and a long carbon chain hydroxyl group. The glycidyl ether contains an epoxy group and has strong reaction activity. The stick glue is modified by the cardanol glycidyl ether on the epoxy resin. The cardanol glycidyl ether molecule contains an epoxy group and a long-chain hydrocarbon group. The epoxy group and the epoxy resin participate in the curing reaction together, and the long-chain hydrocarbon group has a certain steric hindrance effect, so that the stick glue can maintain good fluidity and processability for a period of time, thereby extending the application period of the adhesive, ensuring the stability of the state of the glue, and improving the adhesion effect of the stick glue; further, the long-chain hydrocarbon group can be inserted into the network structure of the epoxy resin after curing, improving the flexibility of the epoxy adhesive, and reducing the glue drop and deformation caused by the high line speed during the cutting process; at the same time, it can also reduce the curing time of the glue, reduce the bonding time, shorten the interval time from the stick to the slice, and reduce the risk of damage to the silicon wafer.

[0035] Epoxy resin and other matrix materials have poor thermal conductivity. The addition of thermal conductive fillers in the present invention enhances the thermal conductivity of the adhesive stick, forms a thermal conductive channel inside the glue, improves the uneven heat conduction at the chamfer during the glue curing process, and makes the volume change of the adhesive surface more uniform, thus avoiding the problem of missing corners easily caused by stress concentration at the silicon wafer.

[0036] In the above embodiment, the epoxy reactive diluent in component A has epoxy groups in its structure, which can participate in the curing reaction, reduce the viscosity of the component, and enhance fluidity; while the inactive diluent in component B does not react chemically with the curing agent, including acetone, toluene, xylene, dibutyl phthalate, etc., which enhances fluidity without affecting the basic properties of the stick adhesive. Preferably, the epoxy reactive diluent in component A is 1,4-butanediol diglycidyl ether, and the inactive diluent component of component B is dibutyl phthalate.

[0037] In one embodiment, the A component includes the following raw materials in parts by weight: 35-65 parts of bisphenol A epoxy resin, 5-20 parts of glycidyl ester epoxy resin, 1-10 parts of cardanol glycidyl ether, 1-5 parts of epoxy reactive diluent, 25-50 parts of thermal conductive filler, 0.1-3 parts of defoaming agent, 0.05-5 parts of anti-settling agent, 0.5-1 parts of coloring agent, 0.1-3 parts of thixotropic agent, and 0.01-3 parts of coupling agent; the B component includes the following raw materials in parts by weight: 35-60 parts of curing agent, 2-10 parts of curing accelerator, 0.1-3 parts of defoaming agent, 0.05-5 parts of anti-settling agent, 0.5-1 parts of coloring agent, 0.1-3 parts of thixotropic agent, 10-25 parts of thermal conductive filler, and 10-20 parts of inactive diluent.

[0038] In one embodiment, the thermally conductive filler is alumina, preferably spherical alumina, which has lower surface energy and better surface fluidity than other forms of alumina and can be more evenly mixed with the polymer matrix.

[0039] In one embodiment, the bisphenol A epoxy resin is E51 type, and the glycidyl ester epoxy resin is diglycidyl adipate. In other embodiments, other types of epoxy resins may also be used.

[0040] In one embodiment, the curing agent is polyethyleneimine; the curing accelerator is triethylamine; the defoaming agent is KS-603; the anti-settling agent is a titanate coupling agent; the thixotropic agent is polyamide-modified hydrogenated castor oil; the inactive diluent is dibutyl phthalate; and the coupling agent is KH560.

[0041] In one embodiment, the ingredients of the defoaming agent, anti-settling agent, and thixotropic agent in component A and component B are consistent. Preferably, the colorants are selected differently. For example, the colorant in component A is titanium dioxide, and the colorant in component B is iron oxide. The different colors make it easy to distinguish.

[0042] The second aspect of the present invention provides a method for preparing a stick adhesive, comprising the following steps:

[0043] S1, adding epoxy resin, cardanol glycidyl ether, epoxy reactive diluent, thermal conductive filler, defoamer, anti-settling agent, colorant, thixotropic agent and coupling agent into a stirring tank, dispersing and stirring evenly to obtain the A component;

[0044] S2, adding a curing agent, a curing accelerator, a defoaming agent, an anti-settling agent, a thixotropic agent, a thermal conductive filler, an inactive diluent and a colorant into a mixing tank, dispersing and stirring the mixture to obtain the B component;

[0045] S3, mixing the component A and the component B in a ratio of 1:1 to 1.1 to obtain.

[0046] In one embodiment, the preparation method of cardanol glycidyl ether comprises the following steps:

[0047] S4, adding a certain proportion of cardanol, epichlorohydrin and benzyltriethylammonium chloride into a reaction kettle, stirring evenly, and then adding sodium hydroxide solution to react to obtain a reactant;

[0048] S5, washing the reactant to neutrality and separating the organic phase;

[0049] S6, subjecting the organic phase to reduced-pressure rotary evaporation to obtain the cardanol glycidyl ether.

[0050] In one embodiment, the molar ratio of the cardanol, epichlorohydrin and benzyltriethylammonium chloride is 1:0.8:0.2. In this embodiment, cardanol and epichlorohydrin are reactants, benzyltriethylammonium chloride is a catalyst, and the ratio of cardanol to epichlorohydrin should be in the range of 1:0.8-1.2, otherwise the epoxide value of the product will be low.

[0051] A third aspect of the present invention provides an application of stick glue in silicon wafer cutting.

[0052] The epoxy resin, epoxy reactive diluent, curing agent, curing accelerator, defoaming agent, anti-settling agent, thixotropic agent, plasticizer and coupling agent described in the present invention are not particularly limited and are well known to those skilled in the art. The raw materials used in the specific embodiments are all commercially available. The specific embodiments are as follows:

[0053] Example 1

[0054] ① Preparation of Cardanol Glycidyl Ether

[0055] Add cardanol, epichlorohydrin and benzyltriethylammonium chloride in a molar ratio of 1:0.8:0.02 to a four-necked flask, stir at a constant temperature of 60°C for 4 hours, heat to 80°C after complete dissolution, maintain for 4 hours, cool to below 60°C, add two drops of 30% NaOH solution by mass, continue stirring and reacting for 3 hours, and cool to room temperature. Wash the reactant with warm water until it is neutral, separate the organic phase in a separatory funnel, maintain the temperature of vacuum rotary evaporation at about 90°C under vacuum conditions, evaporate the water and epichlorohydrin contained in the organic phase, and finally obtain cardanol glycidyl ether.

[0056] ②Preparation of component A

[0057] The temperature of the reactor was controlled at 20-45°C, and 35 parts of bisphenol A epoxy resin, 5 parts of glycidyl ester epoxy resin, 1 part of cardanol glycidyl ether, 1 part of 1,4-butanediol diglycidyl ether, 25 parts of thermal conductive filler magnesium oxide, 0.1 part of KS-603, 0.05 part of titanate coupling agent, 0.5 part of titanium dioxide, 0.1 part of polyamide modified hydrogenated castor oil, and 0.01 part of KH560 were added, and the mixture was dispersed and stirred for 1.5 hours to obtain component A.

[0058] ③Preparation of component B

[0059] The temperature of the reaction kettle was controlled at 20-45° C., 35 parts of polyethyleneimine, 2 parts of triethylamine, 0.1 parts of KS-603, 0.05 parts of titanate coupling agent, 0.5 parts of iron oxide, 0.1 parts of polyamide-modified hydrogenated castor oil, 10 parts of thermal conductive filler magnesium oxide, and 10 parts of dibutyl phthalate were added, and the mixture was dispersed and stirred for 1.5 hours to obtain component B.

[0060] Mix component A and component B in a 1:1 ratio to make stick glue, and then use it online.

[0061] Example 2

[0062] ① The preparation method of cardanol glycidyl ether is consistent with that in Example 1.

[0063] ②Preparation of component A

[0064] The temperature of the reactor was controlled at 20-45° C., 65 parts of bisphenol A epoxy resin, 20 parts of glycidyl ester epoxy resin, 10 parts of cardanol glycidyl ether, 5 parts of 1,4-butanediol diglycidyl ether, 50 parts of spherical alumina as a thermal conductive filler, 3 parts of KS-603, 5 parts of titanate coupling agent, 1 part of titanium dioxide, 3 parts of polyamide-modified hydrogenated castor oil, and 3 parts of KH560 were added, and the mixture was dispersed and stirred for 3 hours to obtain component A.

[0065] ③Preparation of component B

[0066] The temperature of the reaction kettle was controlled at 20-45° C., 60 parts of polyethyleneimine, 10 parts of triethylamine, 3 parts of KS-603, 5 parts of titanate coupling agent, 1 part of iron oxide, 3 parts of polyamide-modified hydrogenated castor oil, 25 parts of spherical alumina as a thermal conductive filler, and 20 parts of dibutyl phthalate were added, and the mixture was dispersed and stirred for 3 hours to obtain component B.

[0067] Mix component A and component B in a 1:1 ratio to make stick glue, and then use it online.

[0068] Example 3

[0069] ① The preparation method of cardanol glycidyl ether is consistent with that in Example 1.

[0070] ②Preparation of component A

[0071] The temperature of the reactor was controlled at 20-45°C, and 50 parts of bisphenol A epoxy resin, 12 parts of glycidyl ester epoxy resin, 5 parts of cardanol glycidyl ether, 2.5 parts of 1,4-butanediol diglycidyl ether, 38 parts of thermal conductive filler flaky aluminum oxide, 1.5 parts of KS-603, 2.5 parts of titanate coupling agent, 0.8 parts of titanium dioxide, 1.5 parts of polyamide modified hydrogenated castor oil, and 1.5 parts of KH560 were added, and the mixture was dispersed and stirred for 2 hours to obtain component A.

[0072] ③Preparation of component B

[0073] The temperature of the reaction kettle was controlled at 20-45° C., 50 parts of polyethyleneimine, 6 parts of triethylamine, 1.5 parts of KS-603, 2.5 parts of titanate coupling agent, 0.8 parts of iron oxide, 0.5 parts of polyamide-modified hydrogenated castor oil, 17.5 parts of thermal conductive filler flaky aluminum oxide, and 15 parts of dibutyl phthalate were added, and the mixture was dispersed and stirred for 2 hours to obtain component B.

[0074] Mix component A and component B in a 1:1 ratio to make stick glue, and then use it online.

[0075] Comparative Example 1

[0076] The difference between this comparative example and Example 1 is that cardanol glycidyl ether is not added in this comparative example 1.

[0077] Comparative Example 2

[0078] The difference between this comparative example and Example 1 is that the cardanol glycidyl ether is replaced by common glycidyl ether.

[0079] Comparative Example 3

[0080] The difference between this comparative example and Example 1 is that in this comparative example 3, the glycidyl ester epoxy resin is replaced by bisphenol A epoxy resin.

[0081] Comparative Example 4

[0082] The only difference between this comparative example and Example 1 is that the thermal conductive filler is replaced by calcium carbonate.

[0083] In this experiment, the following performance tests were performed on the glue samples prepared in Examples 1 to 3 and the glue samples prepared in Comparative Examples 1 to 4, respectively, to compare the hardness after curing, thermal conductivity, tensile strength, time to attach the stick after gluing, and the chip drop rate, edge collapse rate and corner missing rate after cutting.

[0084] in:

[0085] (1) Tensile strength test: The tensile strength is tested according to the standard GB / T30776-2014;

[0086] (2) Curing time test: The curing time (stick-on time) is tested according to the standard GB / T13477.5-2002;

[0087] (3) Shore hardness test: Shore hardness is tested according to GB / T2411-2008 standard;

[0088] (4) Thermal conductivity test: The thermal conductivity is tested using a thermal conductivity meter;

[0089] The performance test results are as follows:

[0090]

[0091] It can be seen from the above performance test results that compared with comparative examples 1 to 2, embodiments 1 to 3 have a more obvious improvement in tensile strength, a 25% reduction in curing time, and a reduction in the chip drop rate by nearly half, indicating that cardanol glycidyl ether has enhanced the tensile properties and can shorten the time for sticking, proving that the presence of long-chain alkyl groups in cardanol glycidyl ether enhances the flexibility of the stick adhesive, and that the epoxy groups in cardanol glycidyl ether participate in the curing; compared with comparative examples 3 to 4, embodiments 1 to 3 have an increase in hardness of about 10%, an increase in thermal conductivity by 1 times, an improvement in tensile strength, and a reduction in chip drop rate. The rate is greatly improved, which is sufficient to prove that the addition of thermally conductive filler not only increases the thermal conductivity of the adhesive stick, making the heat conduction more uniform, but also improves the hardness, thereby greatly reducing the chipping rate, edge collapse rate and corner missing rate. Among them, in Comparative Example 3, the glycidyl ester epoxy resin is replaced by bisphenol A epoxy resin, and its edge collapse rate and corner missing rate are relatively the largest. This is because the ester bond in the molecular structure of the glycidyl ester epoxy resin can give the adhesive stick a certain flexibility, while the benzene ring in the structure of the bisphenol A epoxy resin is rigid, which is not conducive to thermal conductivity, and thus the tensile strength is poor, and the chipping rate, edge collapse rate and corner missing rate are relatively high.

Claims

1. A stick glue, characterized in that: It comprises component A and component B, wherein component A comprises: epoxy resin, cardanol glycidyl ether, epoxy reactive diluent, thermal conductive filler, defoamer, anti-settling agent, colorant, thixotropic agent and coupling agent; The B component includes: a curing agent, a curing accelerator, a defoaming agent, an anti-settling agent, a thixotropic agent, a thermal conductive filler, an inactive diluent and a colorant.

2. The stick adhesive according to claim 1, characterized in that: The A component comprises the following raw materials in parts by weight: 35-65 parts of bisphenol A epoxy resin, 5-20 parts of glycidyl ester epoxy resin, 1-10 parts of cardanol glycidyl ether, 1-5 parts of epoxy reactive diluent, 25-50 parts of thermal conductive filler, 0.1-3 parts of defoamer, 0.05-5 parts of anti-settling agent, 0.5-1 parts of colorant, 0.1-3 parts of thixotropic agent, and 0.01-3 parts of coupling agent; the B component comprises the following raw materials in parts by weight: 35-60 parts of curing agent, 2-10 parts of curing accelerator, 0.1-3 parts of defoamer, 0.05-5 parts of anti-settling agent, 0.5-1 parts of colorant, 0.1-3 parts of thixotropic agent, 10-25 parts of thermal conductive filler, and 10-20 parts of inactive diluent.

3. The stick adhesive according to claim 1 or 2, characterized in that: The thermal conductive filler is aluminum oxide.

4. The stick adhesive according to claim 2, characterized in that: The bisphenol A epoxy resin is E51 type, and the glycidyl ester epoxy resin is diglycidyl adipate.

5. The stick adhesive according to claim 1, characterized in that: The curing agent is polyethyleneimine; the curing accelerator is triethylamine; the defoaming agent is KS-603; the anti-settling agent is a titanate coupling agent; the thixotropic agent is polyamide-modified hydrogenated castor oil; the inactive diluent is dibutyl phthalate; and the coupling agent is KH560.

6. A method for preparing stick glue, characterized in that: The method for preparing the stick adhesive according to any one of claims 1 to 5 comprises the following steps: S1, adding epoxy resin, cardanol glycidyl ether, epoxy reactive diluent, thermal conductive filler, defoamer, anti-settling agent, colorant, thixotropic agent and coupling agent into a stirring tank, dispersing and stirring evenly to obtain the A component; S2, adding a curing agent, a curing accelerator, a defoaming agent, an anti-settling agent, a thixotropic agent, a thermal conductive filler, an inactive diluent and a colorant into a mixing tank, dispersing and stirring the mixture to obtain the B component; S3, mixing the component A and the component B in a ratio of 1:1 to 1.1 to obtain.

7. The method for preparing the sticky adhesive according to claim 6, characterized in that: The stirring time is 1.5 to 3 hours, and the stirring temperature is 20 to 45°C.

8. The method for preparing the sticky glue according to claim 6, characterized in that: The preparation method of the cardanol glycidyl ether comprises the following steps: S4, adding a certain proportion of cardanol, epichlorohydrin and benzyltriethylammonium chloride into a reaction kettle, stirring evenly, and then adding sodium hydroxide solution to react to obtain a reactant; S5, washing the reactant to neutrality and separating the organic phase; S6, subjecting the organic phase to reduced-pressure rotary evaporation to obtain the cardanol glycidyl ether.

9. The method for preparing the sticky glue according to claim 8, characterized in that: The molar ratio of the cardanol, epichlorohydrin and benzyltriethylammonium chloride is 1:0.8:0.

2.

10. Use of the stick adhesive according to any one of claims 1 to 5 in silicon wafer cutting.

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