Wafer non-electrolytic electroplating machine

Abstract

The invention is suitable for the technical field of wafer electroplating equipment, and provides a wafer electroless electroplating machine. Comprising a tank body, a middle electroplating tank is arranged in the middle of the interior of the tank body, an electroless electroplating liquid supply tank is arranged on the outer side of the middle electroplating tank, and the electroless electroplating liquid supply tank is used for storing electroless electroplating liquid; a storage and loading seat is rotationally arranged in the middle of the bottom of the middle electroplating bath, a wafer bearing unit is stored and loaded on the storage and loading seat, and multiple layers of horizontally arranged wafers are stored and loaded on the wafer bearing unit; the liquid supply unit is arranged in the middle electroplating bath and comprises a plurality of liquid spraying pipes, the liquid spraying pipes are elastically and rotatably mounted at the bottom of the middle electroplating bath, a plurality of spraying heads are vertically arranged on the liquid spraying pipes in an array mode, and the liquid spraying pipes are arranged at the bottom of the middle electroplating bath in an array mode; the liquid supply unit and the liquid discharge unit are arranged on the outer side of the storage and loading seat in a circumferential array manner; and the cover plate covers the groove body.

Description

Technical Field

[0001] The invention relates to the technical field of wafer electroplating equipment, in particular to an electroless wafer plating machine. Background Art

[0002] Electroless plating is a mature electroplating technology, which is currently mainly used on non-wafer items; therefore, there are no strict requirements for the uniformity of the coating thickness, and there are very few requirements for micro-hole plating. In recent years, with the rapid development of semiconductor technology, the opportunities for applying electroless plating technology to wafers have also increased significantly; for example, the electroplating technology of the backside guide holes of silicon wafers or gallium arsenide wafers.

[0003] With the advancement of technology, there are increasingly higher requirements for uniformity of coating thickness and micropore electroplating. In the prior art, the electroless plating solution flows from bottom to top during the electroplating process, resulting in the upper wafer contacting the electroless plating solution that reacts with the bottom wafer, resulting in wafers at different heights contacting the electroless plating solution, resulting in differences in coating thickness. In order to solve this technical problem, a wafer electroless plating machine is proposed. Summary of the invention

[0004] The object of the present invention is to provide a wafer electroless plating machine to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A wafer electroless plating machine comprises: a tank body, wherein an intermediate plating tank is arranged in the middle position inside the tank body, an electroless plating liquid supply tank is arranged outside the intermediate plating tank, and the electroless plating liquid supply tank is used to store the electroless plating liquid; a storage seat is rotatably arranged in the middle position at the bottom of the intermediate plating tank, a wafer carrying unit is stored on the storage seat, and multiple layers of horizontally arranged wafers are stored on the wafer carrying unit; A liquid supply unit is arranged inside the intermediate electroplating tank, the liquid supply unit includes a plurality of liquid spray pipes, the liquid spray pipes are elastically rotatably mounted at the bottom of the intermediate electroplating tank, the liquid spray pipes are vertically arrayed with a plurality of nozzles, and the plurality of liquid spray pipe arrays are arranged at the bottom of the intermediate electroplating tank; A liquid discharge unit is arranged inside the intermediate electroplating tank, wherein the liquid supply unit and the liquid discharge unit are arranged in a circumferential array outside the storage seat, and the liquid discharge unit includes a plurality of absorption tubes, which are installed at the bottom of the intermediate electroplating tank, and a plurality of liquid suction ports are arranged in a vertical array on the absorption tubes; A rotating assembly that drives a plurality of nozzles to rotate at a set angle simultaneously; and a cover plate covered on the trough body.

[0006] As a further solution of the present invention: the nozzle is radially tilted relative to the storage base, and the tilting direction of the nozzle is opposite to the rotation direction of the wafer carrying unit.

[0007] As a further solution of the present invention: a liquid supply part is also provided inside the intermediate electroplating tank, the liquid supply part is arc-shaped, and a plurality of liquid spray pipes are rotatably installed on the liquid supply part, the liquid supply part is fixedly installed inside the intermediate electroplating tank, the internal flow channel of the liquid supply part is connected with the internal flow channel of the liquid spray pipe, the input end of the liquid supply part is connected with the output end of the liquid supply pipe, the input end of the liquid supply pipe is arranged in the electroless plating liquid supply tank, and a first circulation pump is also arranged on the liquid supply pipe.

[0008] As a further solution of the present invention: a liquid absorption piece is also provided inside the intermediate electroplating tank, and the liquid absorption piece is arc-shaped. A plurality of absorption tubes are rotatably installed in a semicircular cutout on the liquid absorption piece, and the liquid absorption piece is fixedly installed inside the intermediate electroplating tank. The internal flow channel of the liquid absorption piece is connected with the internal flow channel of the absorption tube, and the output end of the liquid absorption piece is connected with the input end of the liquid absorption tube. The output end of the liquid absorption tube is arranged in the electroless plating liquid supply tank, and a second circulation pump is arranged on the liquid absorption tube.

[0009] As a further solution of the present invention: the rotating assembly includes an incomplete gear fixedly mounted on the outside of the spray pipe, a drive ring is connected to the outside of the storage seat, and a plurality of tooth segments are arranged in an array on the outside of the drive ring, and the tooth segments are used to mesh with adjacent incomplete gears.

[0010] As a further solution of the present invention: the bottom of the spray pipe is rotatably installed in the circular groove at the bottom of the middle electroplating tank, and a first elastic member is sleeved on the outside of the spray pipe, and the two ends of the first elastic member are respectively fixedly installed on the spray pipe and the side wall of the circular groove.

[0011] As a further solution of the present invention: a lifting mechanism for driving the storage seat to reciprocate and rise and fall is arranged between the rotating shaft rotatably arranged at the bottom of the intermediate electroplating tank and the storage seat.

[0012] As a further solution of the present invention: the lifting mechanism includes a matching sleeve mounted on the outside of the rotating shaft, and the matching sleeve is fixedly installed on the trough body; the storage seat is elastically slidably installed on the rotating shaft up and down, and two matching shafts are arranged in a circular array on the outer side of the bottom of the storage seat, and the lower side of the matching shaft abuts against the upper edge of the matching sleeve, and a plurality of lifting protrusions are arranged in an array on the top of the matching sleeve.

[0013] As a further solution of the present invention: the matching sleeve is installed at the bottom of the middle electroplating tank through a support rod, one end of the support rod is fixedly installed on the outside of the matching sleeve, and the other end of the support rod is fixedly installed at the bottom of the middle electroplating tank.

[0014] As a further solution of the present invention: the lifting protrusion is inclined on one side facing the matching shaft, and is vertical on the other side.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the wafer carrying unit is driven to rotate by rotating the storage carrier, and a plurality of liquid supply parts are arranged on the liquid spray pipe along the height direction, and a liquid absorption part is arranged on the corresponding position absorption pipe, so that the electroless plating liquid sprayed by the liquid supply part flows in a laminar flow manner, so that each layer of wafers in the wafer carrying unit can be in contact with the electroless plating liquid with the same properties, thereby improving the electroplating effect, while the electroless plating liquid in the prior art flows from bottom to top, resulting in the electroless plating liquid that the wafer in the upper layer contacts is the electroless plating liquid that reacts with the bottom wafer, resulting in the electroless plating of wafers at different heights in contact liquid, resulting in differences in the electroplating effect; and during the electroplating process, the wafer carrier unit rotates, so that each position of the wafer can be perfectly electroplated; the liquid spray pipe can rotate to a set angle under the drive of the rotating component, and then return to its initial state under the action of elasticity. Since the wafer carrier unit rotates with the storage base, the electroless plating liquid may rotate with the periphery of the wafer carrier unit, resulting in a reduction in the electroless plating liquid entering the wafer carrier unit. By setting the liquid spray pipe to swing back and forth, this situation can be reduced, so that the electroless plating liquid can enter the wafer carrier unit when the wafer carrier unit rotates. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The present invention is a schematic structural diagram of an electroless wafer plating machine according to an embodiment of the present invention.

[0017] Figure 2 The internal structure of an electroless wafer plating machine according to an embodiment of the present invention is shown in FIG. Figure 1 .

[0018] Figure 3 The internal structure of an electroless wafer plating machine according to an embodiment of the present invention is shown in FIG. Figure 2 .

[0019] Figure 4 The figure is a schematic diagram of the flow direction of electroless plating liquid inside an electroless wafer plating machine according to an embodiment of the present invention.

[0020] Figure 5 The present invention is a schematic diagram of the structure of a liquid spray pipe in an electroless wafer plating machine according to an embodiment of the present invention.

[0021] Figure 6 The present invention is a schematic structural diagram of a rotating component in an electroless wafer plating machine according to an embodiment of the present invention.

[0022] Figure 7 The present invention is a schematic diagram of the structure of a rotating shaft in an electroless wafer plating machine according to an embodiment of the present invention.

[0023] Figure 8 The present invention is a schematic structural diagram of a matching sleeve in an electroless wafer plating machine according to an embodiment of the present invention.

[0024] In the figure: 10-tank body, 20-cover plate, 101-middle electroplating tank, 102-electroless plating solution supply tank, 103-wafer carrying unit, 104-storage seat, 105-rotating shaft, 106-driving ring, 107-tooth segment, 108-liquid spray pipe, 109-nozzle, 110-absorption pipe, 111-suction port, 112-liquid supply part, 113-liquid supply pipe, 114-liquid absorption part, 115-liquid absorption pipe, 116-incomplete gear, 117-first elastic part, 118-driving motor, 119-matching sleeve, 120-matching shaft, 121-support rod, 122-second elastic part, 123-installation groove, 124-slide groove, 125-slider. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] See also Figures 1 to 8The present invention provides an electroless electroplating machine for wafers. The electroless electroplating machine for wafers drives the wafer carrying unit 103 to rotate by rotating the storage carrier 104, and a plurality of liquid supply parts 112 are arranged on the liquid spraying pipe 108 along the height direction, and a liquid absorbing part 114 is arranged on the corresponding position absorption pipe 110, so that the electroless plating liquid sprayed by the liquid supply part 112 can flow in a laminar flow manner, so that each layer of wafers in the wafer carrying unit 103 can contact with the electroless plating liquid with the same properties, thereby improving the plating effect. In the prior art, the electroless plating liquid flows from bottom to top, resulting in that the electroless plating liquid contacted by the wafer at the upper layer is the electroless plating liquid that reacts with the bottom wafer, resulting in the wafers at different heights contacting each other. and during the electroplating process, the wafer carrier unit 103 is rotated, so that each position of the wafer can be perfectly plated; the liquid spray pipe 108 can be rotated to a set angle under the drive of the rotating component, and then return to the initial state under the action of elasticity. Since the wafer carrier unit 103 rotates with the storage holder 104, the electroless plating liquid may rotate with the periphery of the wafer carrier unit 103, resulting in a reduction in the electroless plating liquid entering the wafer carrier unit 103. By setting the liquid spray pipe 108 to swing back and forth, this situation can be reduced, so that the electroless plating liquid can enter the wafer carrier unit 103 when the wafer carrier unit 103 rotates.

[0027] See also Figures 1 to 8 , a structural diagram of a wafer electroless plating machine provided by an embodiment of the present invention, the wafer electroless plating machine includes: a tank body 10 and a cover plate 20 covering the tank body 10, an intermediate plating tank 101 is arranged in the middle position inside the tank body 10, an electroless plating liquid supply tank 102 is arranged outside the intermediate plating tank 101, and the electroless plating liquid supply tank 102 is used to store the electroless plating liquid; a storage seat 104 is rotatably arranged in the middle position at the bottom of the intermediate plating tank 101, a wafer carrying unit 103 is stored on the storage seat 104, and multiple layers of horizontally arranged wafers are stored on the wafer carrying unit 103.

[0028] In some embodiments, a liquid supply unit and a liquid discharge unit are provided inside the intermediate electroplating tank 101, and the liquid supply unit and the liquid discharge unit are arranged in a circular array on the outside of the storage base 104; the liquid supply unit includes a plurality of liquid spray pipes 108, and the liquid spray pipes 108 are elastically rotatably installed at the bottom of the intermediate electroplating tank 101, and the liquid spray pipes 108 are vertically arrayed with a plurality of nozzles 109, and the plurality of liquid spray pipes 108 are arrayed at the bottom of the intermediate electroplating tank 101; the liquid discharge unit includes a plurality of absorption pipes 110, and the plurality of absorption pipes 110 are installed at the bottom of the intermediate electroplating tank 101, and a plurality of suction ports 111 are vertically arrayed on the absorption pipes 110; a rotating component is driven to simultaneously rotate the plurality of nozzles 109 at a set angle.

[0029] like Figure 4As shown, in some embodiments, the nozzle 109 is radially tilted relative to the storage base 104 , and the tilting direction of the nozzle 109 is opposite to the rotation direction of the wafer carrying unit 103 .

[0030] In some embodiments, in order to supply liquid to a plurality of liquid spray tubes 108, a liquid supply part 112 is further provided inside the intermediate electroplating tank 101. The liquid supply part 112 is arc-shaped, and a plurality of liquid spray tubes 108 are rotatably mounted on the liquid supply part 112. The liquid supply part 112 is fixedly mounted inside the intermediate electroplating tank 101. The internal flow channel of the liquid supply part 112 is connected to the internal flow channel of the liquid spray tube 108. The input end of the liquid supply part 112 is connected to the output end of the liquid supply tube 113. The input end of the liquid supply tube 113 is provided in the electroless plating liquid supply tank 102, and a first circulation pump is also provided on the liquid supply tube 113 to provide power for the input of the electroless plating liquid.

[0031] In some embodiments, in order to provide power for the drainage of several absorption tubes 110, a liquid absorption piece 114 is further provided inside the intermediate electroplating tank 101. The liquid absorption piece 114 is arc-shaped. Several absorption tubes 110 are rotatably installed in the semicircular cutout on the liquid absorption piece 114. The liquid absorption piece 114 is fixedly installed inside the intermediate electroplating tank 101. The internal flow channel of the liquid absorption piece 114 is connected to the internal flow channel of the absorption tube 110. The output end of the liquid absorption piece 114 is connected to the input end of the liquid absorption tube 115. The output end of the liquid absorption tube 115 is provided in the electroless plating solution supply tank 102, and a second circulation pump is provided on the liquid absorption tube 115, so as to provide power for the discharge of the electroless plating solution.

[0032] like Figure 2 , Figure 3 , Figure 6 , Figure 7 and 8 As shown, in some embodiments of the present invention, the rotating assembly includes an incomplete gear 116 fixedly sleeved on the outside of the liquid spraying pipe 108, and the outside of the storage base 104 is connected to a driving ring 106. A plurality of tooth segments 107 are arranged in an array on the outside of the driving ring 106, and the tooth segments 107 are used to mesh with adjacent incomplete gears 116. Several incomplete gears 116 mesh with the tooth segments 107 at the same time, or do not mesh with the tooth segments 107 at the same time. In this way, when the tooth segments 107 rotate with the driving ring 106, they intermittently mesh with the incomplete gears 116, thereby driving the spray head 109 to rotate intermittently. When the tooth segments 107 are disengaged from the incomplete gears 116, the liquid spraying pipe 108 returns to its initial state under the action of elasticity.

[0033] In some embodiments of the present invention, in order to realize that the liquid spraying pipe 108 is elastically rotatably mounted at the bottom of the middle electroplating tank 101, the bottom of the liquid spraying pipe 108 is rotatably mounted in the circular groove at the bottom of the middle electroplating tank 101, and a first elastic member 117 is sleeved on the outer side of the liquid spraying pipe 108, and the two ends of the first elastic member 117 are respectively fixedly mounted on the liquid spraying pipe 108 and the side wall of the circular groove. The first elastic member 117 can be a torsion spring.

[0034] In some embodiments of the present invention, a lifting mechanism for driving the storage seat 104 to reciprocate and rise and fall is also provided between the rotating shaft 105 rotatably provided at the bottom of the intermediate electroplating tank 101 and the storage seat 104 .

[0035] In some embodiments of the present invention, the lifting mechanism includes a matching sleeve 119 sleeved on the outside of the rotating shaft 105, and the matching sleeve 119 is fixedly mounted on the tank body 10; the storage seat 104 is elastically slidably mounted on the rotating shaft 105 up and down, and two matching shafts 120 are arranged in a circular array on the outside of the bottom of the storage seat 104, and the lower side of the matching shaft 120 abuts against the upper edge of the matching sleeve 119, and a plurality of lifting protrusions are arranged in an array on the top of the matching sleeve 119. In this way, when the rotating shaft 105 drives the storage seat 104 to rotate, the matching shaft 120 is driven to rotate during the rotation of the storage seat 104, and the matching shaft 120 intermittently passes through the arc-shaped protrusion during the rotation, and the storage seat 104 is driven to reciprocate up and down under the action of the arc-shaped protrusion, so that the wafer in the wafer carrying unit 103 on the storage seat 104 can move up and down, so that the wafer can contact the electroless plating solution at different heights, improve the plating quality, and under the lifting protrusion.

[0036] like Figure 2 and Figure 3 As shown, in some embodiments of the present invention, the matching sleeve 119 is installed at the bottom of the middle electroplating tank 101 through a support rod 121, one end of the support rod 121 is fixedly installed on the outside of the matching sleeve 119, and the other end of the support rod 121 is fixedly installed at the bottom of the middle electroplating tank 101. There are no less than two support rods 121.

[0037] like Figure 8 As shown, in some embodiments of the present invention, one side of the lifting protrusion is inclined and the other side is vertical. In this way, when the mating shaft 120 hits the inclined side during the rotation, the mating shaft 120 drives the storage seat 104 to rise. When the mating shaft 120 is transferred to the vertical position on the other side, the mating shaft 120 leaves the lifting protrusion, causing the mating shaft 120 to vibrate, shaking off the bubbles on the surface of the wafer and improving the quality. The lifting protrusion is inclined on the side facing the mating shaft 120.

[0038] In some embodiments of the present invention, a roller may be sleeved on the outer side of the mating shaft 120 , and the roller abuts against the mating sleeve 119 .

[0039] like Figure 5As shown, in some embodiments of the present invention, a mounting groove 123 is provided at the bottom of the wafer carrying unit 103, and the upper end of the rotating shaft 105 is slidably arranged in the mounting groove 123, and a second elastic member 122 is sleeved on the outer side of the rotating shaft 105, and the two ends of the second elastic member 122 are respectively fixedly mounted on the storage seat 104 and the rotating shaft 105, so that the rotating shaft 105 is elastically mounted on the storage seat 104. The second elastic member 122 can be a coil spring.

[0040] In some embodiments of the present invention, sliders 125 are symmetrically arranged on the outer side of the rotating shaft 105. The sliders 125 are slidably set in adjacent slide grooves 124. The slide grooves 124 are set on the side walls of the installation grooves 123, and the slide grooves 124 are vertical.

[0041] As some embodiments of the present invention, in order to drive the rotating shaft 105 to rotate, the rotating shaft 105 is rotatably installed on the trough body 10, and a driving motor 118 is also fixedly installed on the trough body 10. The output end of the driving motor 118 is transmission-connected to the rotating shaft 105, and the driving motor 118 provides power for the rotation of the rotating shaft 105.

[0042] In some embodiments of the present invention, a plurality of ultrasonic units are arranged in an array on the side wall of the electroless plating solution supply tank 102 to uniformly disturb the electroless plating solution in the intermediate plating tank 101, thereby making the contact between the electroless plating solution and the wafer more uniform.

[0043] The working principle of the present invention is: The wafer carrier unit 103 with the wafers is placed in the center of the storage seat 104, and then the cover plate 20 is covered on the tank body 10. The driving motor 118 drives the rotating shaft 105 to drive the storage seat 104 to rotate. During the rotation of the storage seat 104, the mating shaft 120 contacts the lifting protrusion on the surface of the mating sleeve 119, so that the storage seat 104 rises and falls during the rotation, and one side of the lifting protrusion is vertical, and the storage seat 104 can fall suddenly; at the same time, the storage seat 104 drives the rotating shaft 105 to rotate, and the several tooth segments 107 on the rotating shaft 105 rotate together, and the tooth segments 107 mesh with the adjacent incomplete gear 116, thereby driving the spray pipe 108 to deflect. When the incomplete gear 116 is engaged, the liquid spray pipe 108 is deflected. After the tooth segment 107 is separated from the tooth segment 107, the liquid spraying pipe 108 is restored to the initial position under the elastic action of the first elastic member 117. At the same time, the liquid supply pipe 113 inputs the electroless plating liquid in the electroless plating liquid supply tank 102 into the liquid supply member 112 to supply the liquid spraying pipes 108, and sprays it out through the nozzle 109 on the liquid spraying pipe 108. At the same time, the liquid suction pipe 115 sucks the electroless plating liquid in the intermediate plating tank 101 into the electroless plating liquid supply tank 102 through the liquid suction member 114, the absorption pipe 110 and the suction port 111 on the absorption pipe 110, and the cycle continues. The wafer carrier unit 103 is driven to rotate by rotating the storage carrier 104, and a plurality of liquid supply parts 112 are arranged along the height direction on the liquid spraying pipe 108, and a liquid absorbing part 114 is arranged on the corresponding position absorption pipe 110, so that the electroless plating liquid sprayed by the liquid supply part 112 can flow in a laminar flow manner, so that each layer of wafers in the wafer carrier unit 103 can be in contact with the electroless plating liquid with the same properties, thereby improving the electroplating effect; and during the electroplating process, the wafer carrier unit 103 is rotated, so that each position of the wafer can be perfectly Electroplating is performed; the liquid spray pipe 108 can be rotated to a set angle under the drive of the rotating component, and then return to the initial state under the action of elasticity. Since the wafer supporting unit 103 rotates with the storage base 104, the electroless plating liquid may rotate with the periphery of the wafer supporting unit 103, resulting in a reduction in the electroless plating liquid entering the wafer supporting unit 103. By setting the liquid spray pipe 108 to swing back and forth, this situation can be reduced, so that the electroless plating liquid can enter the wafer supporting unit 103 when the wafer supporting unit 103 rotates.

[0044] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0046] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0048] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0049] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A wafer electroless plating machine, characterized in that: include: A tank body (10), wherein an intermediate electroplating tank (101) is arranged at a middle position inside the tank body (10), an electroless plating solution supply tank (102) is arranged outside the intermediate electroplating tank (101), and the electroless plating solution supply tank (102) is used to store electroless plating solution; a storage seat (104) is rotatably arranged at a middle position at the bottom of the intermediate electroplating tank (101), a wafer carrying unit (103) is stored on the storage seat (104), and multiple layers of horizontally arranged wafers are stored on the wafer carrying unit (103); A liquid supply unit is arranged inside the intermediate electroplating tank (101), the liquid supply unit comprises a plurality of liquid spray pipes (108), the liquid spray pipes (108) are elastically rotatably mounted at the bottom of the intermediate electroplating tank (101), the liquid spray pipes (108) are vertically arrayed with a plurality of nozzles (109), and the plurality of liquid spray pipes (108) are arrayed at the bottom of the intermediate electroplating tank (101); A liquid discharge unit is arranged inside the intermediate electroplating tank (101), the liquid supply unit and the liquid discharge unit are arranged in a circular array outside the storage seat (104), the liquid discharge unit comprises a plurality of absorption tubes (110), the plurality of absorption tubes (110) are installed at the bottom of the intermediate electroplating tank (101), and a plurality of liquid suction ports (111) are arranged in a vertical array on the absorption tubes (110); A rotating assembly driving a plurality of nozzles (109) to simultaneously rotate at a set angle; and a cover plate (20) covering the tank body (10).

2. The electroless wafer plating machine according to claim 1, characterized in that: The nozzle (109) is radially inclined relative to the storage base (104), and the inclination direction of the nozzle (109) is opposite to the rotation direction of the wafer carrying unit (103).

3. The electroless wafer plating machine according to claim 1, characterized in that: A liquid supply component (112) is also provided inside the intermediate electroplating tank (101). The liquid supply component (112) is arc-shaped. The plurality of liquid spray pipes (108) are rotatably mounted on the liquid supply component (112). The liquid supply component (112) is fixedly mounted inside the intermediate electroplating tank (101). The internal flow channel of the liquid supply component (112) is connected to the internal flow channel of the liquid spray pipe (108). The input end of the liquid supply component (112) is connected to the output end of the liquid supply pipe (113). The input end of the liquid supply pipe (113) is provided in the electroless plating liquid supply tank (102), and a first circulation pump is also provided on the liquid supply pipe (113).

4. The electroless wafer plating machine according to claim 3, characterized in that: A liquid absorbing member (114) is also provided inside the intermediate electroplating tank (101). The liquid absorbing member (114) is arc-shaped. A plurality of absorption tubes (110) are rotatably mounted in a semicircular cutout on the liquid absorbing member (114). The liquid absorbing member (114) is fixedly mounted inside the intermediate electroplating tank (101). The internal flow channel of the liquid absorbing member (114) is connected to the internal flow channel of the absorption tube (110). The output end of the liquid absorbing member (114) is connected to the input end of the liquid absorbing tube (115). The output end of the liquid absorbing tube (115) is arranged in the electroless plating solution supply tank (102), and a second circulation pump is arranged on the liquid absorbing tube (115).

5. The electroless wafer plating machine according to claim 1, characterized in that: The rotating assembly comprises an incomplete gear (116) fixedly sleeved on the outside of the liquid spraying pipe (108); the outside of the storage seat (104) is connected to a driving ring (106); a plurality of tooth segments (107) are arranged in an array on the outside of the driving ring (106); the tooth segments (107) are used to mesh with adjacent incomplete gears (116).

6. The electroless wafer plating machine according to claim 5, characterized in that: The bottom of the liquid spray pipe (108) is rotatably mounted in a circular groove at the bottom of the middle electroplating tank (101), and a first elastic member (117) is sleeved on the outside of the liquid spray pipe (108), with the two ends of the first elastic member (117) respectively fixedly mounted on the liquid spray pipe (108) and the side wall of the circular groove.

7. The electroless wafer plating machine according to claim 6, characterized in that: A lifting mechanism for driving the storage seat (104) to reciprocately lift and lower is arranged between a rotating shaft (105) rotatably arranged at the bottom of the intermediate electroplating tank (101) and the storage seat (104).

8. The electroless wafer plating machine according to claim 7, characterized in that: The lifting mechanism comprises a matching sleeve (119) sleeved on the outside of the rotating shaft (105), wherein the matching sleeve (119) is fixedly mounted on the trough body (10); a storage seat (104) is elastically slidably mounted on the rotating shaft (105) up and down, and two matching shafts (120) are arranged in a circular array on the outside of the bottom of the storage seat (104), and the lower side of the matching shaft (120) abuts against the upper edge of the matching sleeve (119), and a plurality of lifting protrusions are arranged in an array on the top of the matching sleeve (119).

9. The electroless wafer plating machine according to claim 8, characterized in that: The matching sleeve (119) is installed at the bottom of the middle electroplating tank (101) via a support rod (121), one end of the support rod (121) is fixedly installed on the outside of the matching sleeve (119), and the other end of the support rod (121) is fixedly installed at the bottom of the middle electroplating tank (101).

10. The electroless wafer plating machine according to claim 9, characterized in that: The lifting protrusion is inclined on one side facing the matching shaft (120), and vertical on the other side.

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