Packaging structure of fiber-optic gyroscope integrated device and fiber-optic gyroscope integrated device thereof

Abstract

The invention discloses a packaging structure of a fiber-optic gyroscope integrated device and the fiber-optic gyroscope integrated device thereof, the packaging structure comprises a silicon-based optical path board, a plurality of mounting grooves are formed in the silicon-based optical path board, and the plurality of mounting grooves are configured to be arranged at intervals along the optical path direction; the fiber-optic gyroscope assembly comprises a light source component, an isolator, a detector, a coupling modulation component and an optical fiber, and the plurality of mounting grooves are respectively arranged corresponding to the light source component, the isolator, the detector, the coupling modulation component and the optical fiber; the light source component, the isolator, the detector, the coupling modulation component and the optical fiber are configured to complete optical coupling after being installed in the installation grooves. According to the packaging structure of the fiber-optic gyroscope integrated device, the structure is simple, and the optical coupling requirement can be met after each part in the fiber-optic gyroscope assembly is mounted in the corresponding mounting groove, so that the assembly of the fiber-optic gyroscope is more convenient and easier, the fiber-optic gyroscope has good integration, and the overall size of the packaging structure is smaller.

Description

Technical Field

[0001] The present invention relates to the technical field of optical device packaging, and in particular to a packaging structure of a fiber optic gyroscope integrated device and the fiber optic gyroscope integrated device. Background Art

[0002] As a high-precision inertial sensor, fiber optic gyroscope is widely used in aerospace, navigation, automobile and military fields, with the advantages of high stability, low drift and high sensitivity. With the continuous development of modern technology, the requirements for the integration and miniaturization of fiber optic gyroscope are increasing.

[0003] The fiber optic gyroscope includes a large number of optical elements. When the fiber optic gyroscope is packaged and processed, multiple optical elements need to be optically coupled so that the multiple optical elements can form the required optical path link to meet the use needs of the fiber optic gyroscope. In the related art, the packaging and assembly of multiple optical elements in the fiber optic gyroscope is difficult when optically coupled, and the integration is low, which makes the packaging volume of the fiber optic gyroscope larger. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention is to propose a packaging structure of an integrated fiber optic gyroscope device, which can make the fiber optic gyroscope more convenient and easy to couple and assemble, and has better integration, so that the packaging volume of the fiber optic gyroscope is smaller.

[0005] The invention provides a packaging structure of a fiber optic gyroscope integrated device.

[0006] The present invention also provides a fiber optic gyroscope integrated device having the above packaging structure.

[0007] According to the first aspect of the present invention, the packaging structure of the fiber optic gyroscope integrated device includes: a silicon-based optical circuit board, a plurality of mounting grooves are formed on the silicon-based optical circuit board, and the plurality of mounting grooves are configured to be arranged at intervals along the optical path direction; a fiber optic gyroscope assembly, the fiber optic gyroscope assembly includes a light source component, an isolator, a detector, a coupling modulation component and an optical fiber, and the plurality of mounting grooves are arranged corresponding to the light source component, the isolator, the detector, the coupling modulation component and the optical fiber, wherein the light source component, the isolator, the detector, the coupling modulation component and the optical fiber are configured to complete optical coupling after being installed in each of the mounting grooves.

[0008] According to the packaging structure of the fiber optic gyroscope integrated device of the present invention, a silicon-based optical circuit board and a fiber optic gyroscope assembly are provided, and a plurality of mounting grooves are provided on the silicon-based optical circuit board. The plurality of mounting grooves are respectively arranged corresponding to the light source component, the isolator, the detector, the coupling modulation component and the optical fiber in the fiber optic gyroscope assembly. The structure is simple, and the requirements of optical coupling can be met after each component in the fiber optic gyroscope assembly is installed in the corresponding mounting groove, thereby making the assembly of the fiber optic gyroscope more convenient and easy, and making the fiber optic gyroscope have good integration, so that the overall volume of the packaging structure is small.

[0009] In some embodiments of the present invention, the light source component includes: a broadband light source, which is configured to emit a light beam along a first direction; a heat dissipation silicon plate and a silicon lens, wherein the broadband light source is arranged on the heat dissipation silicon plate, and in the first direction, the silicon lens is located on the transmission path of the light beam, wherein the silicon lens and the heat dissipation silicon plate are an integrally formed part.

[0010] In some embodiments of the present invention, the plurality of mounting grooves include: a first positioning groove, the light source component is disposed in the first positioning groove, and the light source component is configured to emit a light beam along a first direction; a second positioning groove, the second positioning groove is arranged on one side of the first positioning groove in the first direction, the coupling modulation component is disposed in the second positioning groove, and a light inlet port is formed at one end of the coupling modulation component facing the light source component, and the light inlet port is located on the transmission path of the light beam.

[0011] In one embodiment of the present invention, the plurality of installation grooves further include a third positioning groove, wherein the third positioning groove is arranged on a side of the second positioning groove in the first direction away from the first positioning groove, and the optical fiber is installed in the third positioning groove, and in the first direction, one end of the third positioning groove is connected to the second positioning groove and the other end passes through the silicon-based optical circuit board, and a light output port for outputting a light beam is formed at one end of the coupling modulation component facing the optical fiber, and the light output port is arranged opposite to the end of the optical fiber facing the coupling modulation component.

[0012] In some examples of the present invention, the third positioning groove is a V-shaped groove, and the outer peripheral surface of the optical fiber is arranged tangent to two groove wall surfaces of the third positioning groove.

[0013] In some examples of the present invention, the number of the third positioning grooves is two, and the two third positioning grooves are arranged at intervals in the second direction. The number of the optical fibers is two, and the two optical fibers are arranged in a one-to-one correspondence with the two third positioning grooves. Two light output ports are formed at one end of the coupling modulation member facing the third positioning groove, and the two light output ports are arranged in a one-to-one correspondence with the two optical fibers, and the second direction intersects with the first direction.

[0014] In some examples of the present invention, the silicon-based optical circuit board is formed with a mounting boss, the mounting boss is arranged on the side of the second positioning groove in the first direction away from the first positioning groove, and the third positioning groove is formed on the boss surface of the mounting boss.

[0015] In one example of the present invention, the packaging structure also includes a silicon-based circuit board, which is stacked with the silicon-based optical circuit board. The silicon-based circuit board is disposed on a side of the silicon-based optical circuit board having the mounting boss, and the silicon-based circuit board cooperates with the mounting boss to press and fix the optical fiber.

[0016] In some specific embodiments of the present invention, the silicon-based optical circuit board is also formed with a supporting boss, the supporting boss extends along the first direction and is arranged on one side of the second positioning groove in the second direction, the supporting boss is connected to the mounting boss, the boss surface of the supporting boss is coplanar with the boss surface of the mounting boss, and the silicon-based circuit board is fixed to the supporting boss and the mounting boss.

[0017] In a specific embodiment of the present invention, the packaging structure also includes a first electrical connection plate, which is arranged on the silicon-based optical circuit board and is located on the other side of the second positioning groove in the second direction. The silicon-based circuit board is formed with an avoidance gap, and the first electrical connection plate is located in the avoidance gap in a third direction, and the third direction is the stacking direction of the silicon-based optical circuit board and the silicon-based circuit board.

[0018] In one embodiment of the present invention, the plurality of mounting grooves further include: a fourth positioning groove, in the first direction, the fourth positioning groove is arranged between the first positioning groove and the second positioning groove, the isolator is arranged in the fourth positioning groove, and the isolator is located on the transmission path of the light beam; a fifth positioning groove, the fifth positioning groove is arranged between the fourth positioning groove and the second positioning groove, and the detector is arranged in the fifth positioning groove.

[0019] The fiber optic gyroscope integrated device according to the second aspect of the present invention comprises the packaging structure of the fiber optic gyroscope integrated device according to the first aspect of the present invention.

[0020] According to the fiber optic gyroscope integrated device of the present invention, by setting the packaging structure of the fiber optic gyroscope integrated device of the first aspect, a silicon-based optical circuit board and a fiber optic gyroscope assembly are set, and a plurality of mounting grooves are set on the silicon-based optical circuit board. The plurality of mounting grooves are respectively arranged corresponding to the light source component, the isolator, the detector, the coupling modulation component and the optical fiber in the fiber optic gyroscope assembly. The structure is simple, and the requirements of optical coupling can be met after each component in the fiber optic gyroscope assembly is installed in the corresponding mounting groove, thereby making the assembly of the fiber optic gyroscope more convenient and easy, and making the fiber optic gyroscope have good integration, so that the overall volume of the packaging structure is small.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of a packaging structure of an optical fiber gyroscope integrated device according to an embodiment of the present invention;

[0023] Figure 2 is a schematic diagram of assembling a silicon-based optical circuit board and a silicon-based circuit board according to an embodiment of the present invention;

[0024] Figure 3 is a schematic diagram of a silicon-based optical circuit board according to an embodiment of the present invention;

[0025] Figure 4 is a schematic diagram of a light source component according to an embodiment of the present invention;

[0026] Figure 5 is a schematic diagram of a silicon-based circuit board according to an embodiment of the present invention;

[0027] Figure 6 is a schematic diagram of a photoresist coating process in a production process of a silicon lens according to an embodiment of the present invention;

[0028] Figure 7 is a schematic diagram of an exposure and development process of a silicon lens in a production process according to an embodiment of the present invention;

[0029] Figure 8 is a schematic diagram of an etching process in a production process of a silicon lens according to an embodiment of the present invention;

[0030] Fig. 9 is a schematic diagram of a silicon lens and a heat dissipation silicon plate as a whole before an etching process in a production process according to an embodiment of the present invention;

[0031] Fig.10 is a schematic diagram of a silicon lens and a heat dissipation silicon plate as a whole after an etching process in a production process according to an embodiment of the present invention;

[0032] Fig.11 is a schematic diagram of a heat dissipation silicon plate, a silicon lens and a second electrical connection sheet in a light source component according to an embodiment of the present invention;

[0033] Fig.12 is a schematic diagram of a heat dissipation silicon plate, a silicon lens, a second electrical connection sheet and pre-placed solder in a light source component according to an embodiment of the present invention;

[0034] Fig.13 It is a cross-sectional view of the packaging structure of the fiber optic gyroscope integrated device according to an embodiment of the present invention at the third positioning groove.

[0035] Reference numerals:

[0036] 10. Silicon-based optical circuit board;

[0037] 11, mounting groove; 111, first positioning groove; 112, second positioning groove; 113, third positioning groove; 114, fourth positioning groove; 115, fifth positioning groove;

[0038] 12. Mounting boss; 13. Supporting boss;

[0039] 20. Fiber optic gyroscope assembly;

[0040] 21. Light source component;

[0041] 211, heat dissipation silicon plate; 212, silicon lens; 213, broadband light source; 214, second electrical connection sheet; 215, pre-set solder; 216, temperature sensor;

[0042] 22. Coupling modulation component; 23. Optical fiber; 24. Isolator; 25. Detector;

[0043] 30. Silicon-based circuit board; 301. Avoidance gap;

[0044] 40. a first electrical connection sheet;

[0045] 100. Packaging structure. DETAILED DESCRIPTION

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0047] Reference below Figure 1-Figure 13 The packaging structure 100 of the fiber optic gyroscope integrated device according to the first embodiment of the present invention is described.

[0048] like Figure 1-Figure 13As shown, the packaging structure 100 of the fiber optic gyroscope integrated device according to an embodiment of the present invention includes: a silicon-based optical circuit board 10 and a fiber optic gyroscope assembly 20. A plurality of mounting grooves 11 are formed on the silicon-based optical circuit board 10, and the plurality of mounting grooves 11 are configured to be arranged at intervals along the optical path direction; the fiber optic gyroscope assembly 20 includes a light source component 21, an isolator 24, a detector 25, a coupling modulation component 22 and an optical fiber 23, and the plurality of mounting grooves 11 are arranged corresponding to the light source component 21, the isolator 24, the detector 25, the coupling modulation component 22 and the optical fiber 23, wherein the light source component 21, the isolator 24, the detector 25, the coupling modulation component 22 and the optical fiber 23 are configured to complete optical coupling after being installed in each mounting groove 11.

[0049] In this embodiment, the fiber optic gyroscope assembly 20 includes a light source component 21, an isolator 24, a detector 25, a coupling modulation component 22 and an optical fiber 23, wherein the light source component 21 is used to generate a light beam, the isolator 24 is used to prevent the reflected light returning to the light source component 21 from interfering with the light beam generated by the light source, the coupling modulation component 22 is used to perform necessary splitting, modulation and other processing on the light beam signal generated by the light source component 21 and then introduce it into the optical fiber ring for subsequent processing, the detector 25 is used to receive the optical signal output after the light beam passes through the optical fiber ring of the fiber optic gyroscope, and convert it into an electrical signal for processing, and the optical fiber 23 refers to an optical fiber structure connected to the optical fiber ring and cooperating with the coupling modulation component 22 to guide the optical signal.

[0050] In this embodiment, by arranging a light source component 21, an isolator 24, a detector 25, a coupling modulation component 22 and an optical fiber 23 in the fiber optic gyroscope assembly 20, the fiber optic gyroscope assembly 20 can cooperate with the optical fiber ring outside the packaging structure 100 to form a complete optical path to meet the use requirements of the fiber optic gyroscope.

[0051] In this embodiment, the packaging structure 100 is provided with a silicon-based optical circuit board 10. The silicon-based optical circuit board 10 refers to an optical circuit board using silicon material as a substrate. Silicon has good mechanical stability and thermal stability. Silicon material processing has mature processing technology and production processes, such as cutting, photolithography, etching and other micro-processing methods for silicon in the CMOS (Complementary Metal-Oxide-Semiconductor) process. Therefore, silicon material can use mature processing technology to meet the processing and manufacturing requirements of structures with high dimensional precision.

[0052] It is understandable that the fiber optic gyroscope is a high-precision sensor that measures angular velocity using the principle of interference. The optical coupling accuracy and stability between the various components in the fiber optic gyroscope have an important impact on the measurement reliability of the finished beam gyroscope in actual use. Optical coupling refers to the process of efficiently transmitting an optical signal from one optical element to another optical element. When the optical coupling between the various components in the fiber optic gyroscope has low accuracy or poor stability, the fiber optic gyroscope will have problems such as decreased measurement accuracy, decreased measurement stability, and high operating power consumption. In this embodiment, the beam coupling between the various components in the fiber optic gyroscope may include but is not limited to the coupling between the light source component 21 and the coupling modulation component 22, the coupling between the coupling modulation component 22 and the optical fiber 23, the coupling between the detector 25 and the coupling modulation component 22, the coupling between the isolator 24 and the light source component 21 and the coupling modulation component 22, and the like.

[0053] In the related art, when assembling the various components in the fiber optic gyroscope, the relative positions of the various components in the optical path direction and the height direction need to be adjusted one by one to meet the needs of optical coupling. Since the optical coupling requires high precision and stability and has a large number of components, the assembly and adjustment of the various components during optical coupling is difficult and the assembly efficiency is low.

[0054] For example, in order to meet the needs of high-precision optical coupling of the fiber optic gyroscope, the relative position accuracy and stability between the various components in space are very high, and the relative positions of the various components in various directions need to be accurately and carefully adjusted, which makes the adjustment process more complicated. For example, during the adjustment process, after the relative positions of two components in one direction are adjusted into place, they need to be adjusted again in another direction, so that the relative positions of the two components are moved, adjusted and repositioned multiple times, which makes the assembly efficiency of the fiber optic gyroscope low and the assembly difficulty high.

[0055] In the present embodiment, a plurality of mounting grooves 11 are arranged on the silicon-based optical circuit board 10, and each component in the fiber optic gyroscope assembly 20 is arranged in a corresponding mounting groove 11. Since the silicon-based optical circuit board 10 can be manufactured by micro-nano processing technology, the plurality of mounting grooves 11 on the silicon-based optical circuit board 10 can be formed on the silicon-based optical circuit board 10 by micro-nano processing technology, so that the mounting grooves 11 can have good dimensional accuracy. For example, the depth dimension, length dimension and width dimension of the mounting groove 11 can all be processed and formed with high precision, and the relative positions of the plurality of mounting grooves 11 can also be more accurate.

[0056] In this embodiment, by setting the mounting groove 11, after each component is installed in the mounting groove 11, the position of the component in space can be accurately and stably positioned, and each component does not need to be adjusted and aligned multiple times to achieve stable and reliable optical coupling. At the same time, since the optical coupling accuracy of each component in the fiber optic gyroscope assembly 20 of this embodiment is relatively high, the dimensional accuracy of the groove processed by conventional cutting, milling and other processing methods is difficult to meet the packaging and assembly requirements of the fiber optic gyroscope assembly. In this embodiment, by setting the mounting groove 11 on the silicon-based optical circuit board 10, the mounting groove 11 can be processed and manufactured using micro-nano processing technology, so that the mounting groove 11 can have nanometer-level dimensional accuracy, so that the mounting groove 11 can well meet the requirements of high-precision optical coupling during the packaging and assembly of the fiber optic gyroscope assembly 20.

[0057] Therefore, in the packaging structure 100 of the present embodiment, during production and processing, the silicon-based optical circuit board 10 can accurately process the mounting groove 11 according to the sizes of the light source component 21, the detector 25, the coupling modulation component 22 and other components in the fiber optic gyroscope assembly 20, and according to the relative positions between the various components in the fiber optic gyroscope assembly 20 required for optical coupling, the silicon-based optical circuit board 10 can process the corresponding mounting groove 11 and maintain an accurate relative position relationship between the plurality of mounting grooves 11, for example, the mounting groove 11 corresponding to the light source component 21 and other components has an accurate depth dimension, so that each component is in the depth direction of the mounting groove 11 (such as Figure 1 The relative position of the mounting grooves 11 corresponding to the light source assembly 21 and other components in the optical path direction in the fiber optic gyroscope is also kept accurate, so that the relative positions of the various components in the optical path direction are also kept accurate.

[0058] When assembling the packaging structure 100 of the fiber optic gyroscope integrated device and realizing high-precision optical coupling of various components in the fiber optic gyroscope assembly 20, the assembler only needs to assemble and fix the light source component 21, the detector 25 and other components in the fiber optic gyroscope assembly 20 into the corresponding mounting grooves 11, so that good optical coupling can be formed between the light source component 21, the detector 25 and other components, thereby making the assembly of the fiber optic gyroscope more convenient and easy.

[0059] In the present embodiment, a silicon-based optical circuit board 10 is provided, and a plurality of mounting grooves 11 are provided on the silicon-based optical circuit board 10. The light source component 21, the detector 25 and other components in the fiber optic gyroscope assembly 20 are respectively provided in the corresponding mounting grooves 11, so that the plurality of mounting grooves 11 can form precise size structures and relative positions on the silicon-based optical circuit board 10 according to the arrangement requirements of the relative positions of the optical coupling of the various components in the fiber optic gyroscope assembly 20, so that the various components in the fiber optic gyroscope assembly 20 can form an optical coupling that meets the requirements after being assembled into the corresponding mounting grooves 11, eliminating the operations and processes such as individual adjustment between the various components and adjustment of the relative height position by providing matching parts, making the assembly and packaging of the fiber optic gyroscope more convenient and easy, thereby making the production and processing of the fiber optic gyroscope more efficient.

[0060] In the present embodiment, the light source component 21, isolator 24, detector 25, coupling modulation component 22 and optical fiber 23 in the fiber optic gyroscope assembly 20 are all arranged on the silicon-based optical circuit board 10, so that most of the components of the fiber optic gyroscope are well integrated into the silicon-based optical circuit board 10, which can well avoid the overall structural dispersion and large volume caused by the independent packaging of each component, make the overall structure of the fiber optic gyroscope more compact, better integrated, and make the packaging volume of the fiber optic gyroscope smaller, which can make the overall operation of the fiber optic gyroscope more stable to a certain extent.

[0061] According to the packaging structure 100 of the fiber optic gyroscope integrated device of the embodiment of the present invention, a silicon-based optical circuit board 10 and a fiber optic gyroscope assembly 20 are provided. A plurality of mounting grooves 11 are provided on the silicon-based optical circuit board 10. The plurality of mounting grooves 11 are respectively arranged corresponding to the light source component 21, the isolator 24, the detector 25, the coupling modulation component 22 and the optical fiber 23 in the fiber optic gyroscope assembly 20. The structure is simple, and the requirements of optical coupling can be met after each component in the fiber optic gyroscope assembly 20 is installed in the corresponding mounting groove 11, thereby making the assembly of the fiber optic gyroscope more convenient and easy, and making the fiber optic gyroscope have good integration, so that the overall volume of the packaging structure 100 is small.

[0062] In some embodiments of the present invention, reference Figure 1 and Figure 4 As shown, the light source component 21 may include: a broadband light source 213, a heat dissipation silicon plate 211 and a silicon lens 212, wherein the broadband light source 213 is configured to be along a first direction (eg Figure 1 The broadband light source 213 is disposed on the heat dissipation silicon plate 211. In the first direction, the silicon lens 212 is located on the transmission path of the light beam, wherein the silicon lens 212 and the heat dissipation silicon plate 211 are integrally formed.

[0063] In this embodiment, the light source component 21 is provided with a broadband light source 213, which refers to a light source that can emit a continuous spectrum or cover a wide wavelength range, and can provide stable light output in a relatively wide wavelength range. In this embodiment, the broadband light source 213 is used to emit a light beam along a first direction, so that the light source component 21 can provide a higher signal-to-noise ratio, thereby greatly improving the measurement accuracy of the fiber optic gyroscope. The signal-to-noise ratio refers to the ratio of the intensity of the useful signal to the intensity of the background noise. A higher signal-to-noise ratio enables the fiber optic gyroscope to obtain more accurate data when it is in operation.

[0064] In this embodiment, the light source component 21 is provided with a heat dissipation silicon plate 211, and the broadband light source 213 is arranged on the heat dissipation silicon plate 211. The structure is simple, and the heat dissipation silicon plate 211 can provide good support and heat dissipation effects for the broadband light source 213, so that the broadband light source 213 can operate stably, thereby making the light source component 21 operate more stably.

[0065] In this embodiment, the heat dissipation silicon plate 211 refers to a plate processed from silicon material, so that the heat dissipation silicon plate 211 and the silicon-based optical circuit board 10 have the same material, so that after the light source component 21 is set in the mounting groove 11 on the silicon-based optical circuit board 10, the heat dissipation silicon plate 211 and the silicon-based optical circuit board 10 have the same thermal expansion coefficient, so that the light source component 21 can be more stably and reliably located in the mounting groove 11 during operation and maintain a stable position state, thereby making the operation of the fiber optic gyroscope more stable and reliable.

[0066] In this embodiment, the light source component 21 is also provided with a silicon lens 212, which is located on the transmission path of the light beam, so that the light beam emitted by the broadband light source 213 can be more accurately and completely coupled to the coupling modulation component 22 and other components behind it under the focusing or shaping effect of the silicon lens 212, thereby reducing the loss in the light beam transmission process and meeting the use requirements of the fiber optic gyroscope.

[0067] In this embodiment, a silicon lens 212 is provided to optically couple the broadband light source 213 with the coupling modulation component 22, etc. Since silicon has excellent infrared transmittance and exhibits particularly good performance at communication and fiber optic sensing wavelengths, the silicon lens 212 can well meet the use requirements and is easy to produce using mature semiconductor processing technology or photolithography, etching and other processing methods in micro-nano processing technology, meeting the needs of large-scale production of the silicon lens 212, and further meeting the needs of mass production of the packaging structure 100 of the fiber optic gyroscope integrated device. Compared with the use of high-quality aspheric lenses, anti-reflection coating lenses and GRIN (Gradient Index) lenses, etc., the silicon lens 212 has low material cost and high processing yield rate, and low manufacturing cost, thereby greatly reducing the production cost of the fiber optic gyroscope.

[0068] In this embodiment, the silicon lens 212 and the heat dissipation silicon plate 211 are set as an integrally formed part, so that the silicon lens 212 and the heat dissipation silicon plate 211 can be processed and formed as a whole, and the silicon lens 212 and the heat dissipation silicon plate 211 can be processed using silicon materials using semiconductor manufacturing technology and micro-nano processing technology, so that the heat dissipation silicon plate 211 has good dimensional accuracy, and the silicon lens 212 and the heat dissipation silicon plate 211 can form an accurate positional relationship and positional accuracy that meet the needs during the processing and manufacturing process, thereby avoiding the increase in assembly difficulty and complexity caused by the position assembly when the silicon lens 212 and the heat dissipation silicon plate 211 are separately set, making the assembly of the light source component 21 more convenient and easy, thereby making the overall packaging and assembly of the fiber optic gyroscope more convenient and easy, thereby greatly reducing the production difficulty and cost of the fiber optic gyroscope.

[0069] The silicon lens 212 and the heat dissipation silicon plate 211 are provided as an integral part, which can make the overall structure of the light source component 21 more compact, and to a certain extent, the overall volume of the light source component 21 can be set smaller, so that the overall integration of the packaging structure 100 of the fiber optic gyroscope integrated device is better. Optionally, the light source component 21 can be packaged and assembled in a COC (chip on carrier) packaging manner.

[0070] In some embodiments of the present invention, reference Figure 1 and Figure 2 As shown, the multiple mounting grooves 11 may include: a first positioning groove 111 and a second positioning groove 112, the light source component 21 is arranged in the first positioning groove 111, and the light source component 21 is configured to emit a light beam along a first direction; the second positioning groove 112 is arranged on one side of the first positioning groove 111 in the first direction, the coupling modulation component 22 is arranged in the second positioning groove 112, and a light inlet port is formed at one end of the coupling modulation component 22 facing the light source component 21, and the light inlet port is located on the transmission path of the light beam.

[0071] In this embodiment, a first positioning groove 111 and a second positioning groove 112 are provided in the plurality of mounting grooves 11, the light source component 21 is provided in the first positioning groove 111, the coupling modulation component 22 is provided in the second positioning groove 112, and the light inlet port of the coupling modulation component 22 is arranged on the transmission path of the light beam, with simple structure, convenient arrangement, easy assembly, accurate positioning, and stable and reliable fixation. After the light source component 21 and the coupling modulation component 22 are respectively assembled into the first positioning groove 111 and the second positioning groove 112, the light source component 21 can stably and reliably realize optical coupling with the coupling modulation component 22, so that when the fiber optic gyroscope is operating, the light beam can be stably and reliably injected from the light source component 21 into the light inlet port of the coupling modulation component 22, so that the coupling modulation component 22 can stably perform light beam coupling, beam splitting, and modulation and other processes for subsequent processing, thereby enabling the fiber optic gyroscope to operate stably and reliably.

[0072] In one embodiment of the present invention, reference Figure 1 and Figure 2 As shown, the plurality of mounting grooves 11 may further include a third positioning groove 113, the third positioning groove 113 being arranged on the side of the second positioning groove 112 away from the first positioning groove 111 in the first direction, the optical fiber 23 being installed in the third positioning groove 113, in the first direction, one end of the third positioning groove 113 being connected to the second positioning groove 112 and the other end passing through the silicon-based optical circuit board 10, a light emitting port for emitting a light beam being formed at one end of the coupling modulation component 22 facing the optical fiber 23, and the light emitting port being arranged opposite to one end of the optical fiber 23 facing the coupling modulation component 22.

[0073] In this embodiment, a third positioning groove 113 is further provided in the plurality of mounting grooves 11. The third positioning groove 113 is provided on the side of the second positioning groove 112 in the first direction away from the first positioning groove 111. The structure is simple and the arrangement is reasonable. The optical fiber 23 is installed in the third positioning groove 113, so that the optical fiber 23 can achieve good optical coupling with the coupling modulation component 22.

[0074] It can be understood that the light beam derived from the coupling modulation component 22 needs to be introduced from the end of the optical fiber 23 into the optical fiber 23 to be transmitted in the optical fiber 23. At the same time, the optical fiber 23 needs to be connected to the optical fiber ring outside the packaging structure 100 to meet the operation needs of the fiber optic gyroscope. In this embodiment, one end of the third positioning groove 113 is connected to the second positioning groove 112 and the other end passes through the silicon-based optical circuit board 10, which can effectively avoid the structure of the silicon-based optical circuit board 10 from hindering the transmission of the light beam to the optical fiber 23, thereby making the assembly and optical coupling between the optical fiber 23 and the coupling modulation component 22 more convenient and easy.

[0075] A light output port for outputting a light beam is formed at one end of the coupling modulation component 22 facing the optical fiber 23. The light output port and the end of the optical fiber 23 facing the coupling modulation component 22 are arranged relative to each other. The structure is simple, and the optical coupling requirements between the coupling modulation component 22 and the optical fiber 23 can be well met. The light loss when the light beam is transmitted from the light output port to the optical fiber 23 can be reduced to a certain extent, so that the operation efficiency of the entire optical path system is higher when the fiber optic gyroscope is in operation.

[0076] In some examples of the present invention, reference Figure 3 and Fig.13 As shown, the third positioning groove 113 may be a V-shaped groove, and the outer peripheral surface of the optical fiber 23 is arranged tangent to two groove walls of the third positioning groove 113 .

[0077] In this embodiment, the third positioning groove 113 is configured as a V-shaped groove, that is, the cross-section of the third positioning groove 113 perpendicular to its extension direction can be V-shaped, and the outer peripheral surface of the optical fiber 23 is arranged tangent to the two groove walls of the third positioning groove 113, so that the assembly and positioning of the optical fiber 23 in the third positioning groove 113 is more convenient and accurate, so that the optical fiber 23 can stably and reliably form high-precision optical coupling with the coupling modulation component 22 after being assembled into the third positioning groove 113.

[0078] Compared with setting the third positioning groove 113 as a semicircular or semi-arc shape that matches the outer peripheral surface of the optical fiber 23, setting the third positioning groove 113 as a V-shaped groove can be conveniently processed and formed on the silicon-based optical circuit board 10 while meeting the high positioning accuracy of the optical fiber 23 and the third positioning groove 113, thereby reducing the production and processing difficulty of the silicon-based optical circuit board 10 and reducing the production and manufacturing cost of the packaging structure 100 to a certain extent.

[0079] In some examples of the present invention, reference Figure 3 and Fig.13 As shown, the number of the third positioning grooves 113 can be two, and the two third positioning grooves 113 are arranged in the second direction (such as Figure 3 The optical fibers 23 are arranged at intervals in the left and right directions as shown, the number of the optical fibers 23 is two, the two optical fibers 23 are arranged in a one-to-one correspondence with the two third positioning grooves 113, and two light output ports are formed at one end of the coupling modulation member 22 facing the third positioning groove 113, the two light output ports are arranged in a one-to-one correspondence with the two optical fibers 23, and the second direction intersects with the first direction.

[0080] In this embodiment, the number of the third positioning grooves 113 is set to two, and the two third positioning grooves 113 are arranged at intervals in the second direction. The number of optical fibers 23 is the same as the number of the third positioning grooves 113 and is arranged one-to-one corresponding to the third positioning grooves 113. The structure is simple and can meet the operation and use requirements of the fiber optic gyroscope.

[0081] In this embodiment, the coupling modulation member 22 is provided with two light output ports, and the two light output ports are arranged in one-to-one correspondence with the two optical fibers 23, so that the coupling modulation member 22 can stably and reliably form high-precision optical coupling with the two optical fibers 23. The second direction intersects with the first direction, which means that the second direction and the first direction can be arranged perpendicularly, or can be arranged only intersecting non-perpendicularly, that is, arranged to intersect at an acute angle or an obtuse angle, for example, the second direction and the first direction can be arranged at an angle of 30°, 60°, 80°, 120°, 150° or 170°.

[0082] In some examples of the present invention, Figure 3As shown, the silicon-based optical circuit board 10 may be formed with a mounting boss 12 , which is disposed on a side of the second positioning groove 112 away from the first positioning groove 111 in the first direction, and a third positioning groove 113 is formed on the boss surface of the mounting boss 12 .

[0083] In this embodiment, the silicon-based optical circuit board 10 is formed with a mounting boss 12, and the mounting boss 12 is arranged on the side of the second positioning groove 112 away from the first positioning groove 111 in the first direction. The mounting boss 12 forms a third positioning groove 113, which has a simple structure and can well meet the coupling and assembly requirements of the optical fiber 23 and the light output port of the coupling modulation component 22, so that the cooperation between the optical fiber 23 and the light output port in the depth direction of the mounting groove 11 is more convenient and accurate. The mounting boss 12 can play a stable supporting role for the optical fiber 23, so that the optical fiber 23 can be stably and reliably fixed in the third positioning groove 113.

[0084] In one example of the present invention, reference Figure 1 and Figure 3 As shown, the packaging structure 100 may also include a silicon-based circuit board 30, which is stacked with the silicon-based optical circuit board 10. The silicon-based circuit board 30 is arranged on a side of the silicon-based optical circuit board 10 having a mounting boss 12, and the silicon-based circuit board 30 cooperates with the mounting boss 12 to press and fix the optical fiber 23.

[0085] In the present embodiment, the packaging structure 100 further includes a silicon-based circuit board 30. The silicon-based circuit board 30 refers to a circuit board structure manufactured using silicon material as a substrate. The silicon-based circuit board 30 can be manufactured using production processes such as semiconductor processing. The silicon-based circuit board 30 can integrate electronic components and circuits such as signal processing, light source driving, and control units required for the fiber optic gyroscope, thereby greatly simplifying the system complexity of the fiber optic gyroscope, allowing the fiber optic gyroscope to perform high-speed and accurate signal processing during operation. At the same time, the highly integrated silicon-based circuit board 30 cooperates with the silicon-based optical path board 10 to make the overall structure of the packaging structure 100 more compact, thereby making the overall volume of the fiber optic gyroscope more compact, so that the fiber optic gyroscope can better meet the use needs in portable or compact devices.

[0086] Since silicon has excellent thermal conductivity, a silicon-based circuit board 30 is provided in the present embodiment so that the heat generated by the electronic components and circuits integrated thereon during operation can be better dissipated, thereby allowing the silicon-based circuit board 30 to operate more stably, and further allowing the fiber optic gyroscope to operate more stably.

[0087] In this embodiment, the silicon-based circuit board 30 is arranged on the side of the silicon-based optical circuit board 10 with the mounting boss 12 and cooperates with the mounting boss 12 to press and fix the optical fiber 23. Specifically, the side surface of the silicon-based circuit board 30 facing the mounting boss 12 cooperates with the boss surface of the mounting boss 12. The silicon-based circuit board 30 can cover the opening of the third positioning groove 113 and press and fix the optical fiber 23 in the third positioning groove 113, so that the optical fiber 23 is fixed in the third positioning groove 113 more stably and reliably, and the optical coupling stability of the optical fiber 23 and the coupling modulation member 22 is better. In this embodiment, the silicon-based circuit board 30 is used to press and fix the optical fiber 23, which has a simple structure and can avoid adding a separate pressing structure, thereby reducing the number of parts in the packaging structure 100, making the overall structure of the packaging structure 100 more compact and more integrated.

[0088] In this embodiment, the silicon-based circuit board 30 is arranged on a side of the silicon-based optical circuit board 10 having the mounting boss 12, so that the silicon-based circuit board 30 and the silicon-based optical circuit board 10 can be stacked and arranged, with a simple structure and compact arrangement, so that the overall structure of the packaging structure 100 is more compact and has better integration. The silicon-based circuit board 30 and the silicon-based optical circuit board 10 are both made of silicon materials, so that the silicon-based circuit board 30 and the silicon-based optical circuit board 10 can be mass-produced and processed using mature semiconductor processing technology, micro-nano processing technology, etc., so that the packaging structure 100 can better meet the needs of large-scale production.

[0089] In some specific embodiments of the present invention, Figure 3 As shown, the silicon-based optical circuit board 10 can also be formed with a supporting boss 13, which extends along the first direction and is arranged on one side of the second positioning groove 112 in the second direction, the supporting boss 13 is connected to the mounting boss 12, the boss surface of the supporting boss 13 is coplanar with the boss surface of the mounting boss 12, and the silicon-based circuit board 30 is fixed to the supporting boss 13 and the mounting boss 12.

[0090] In the present embodiment, a supporting boss 13 is also formed on the silicon-based optical circuit board 10. The supporting boss 13 extends along the first direction and is arranged on one side of the second positioning groove 112 in the second direction. The silicon-based circuit board 30 is fixed on the supporting boss 13 and the mounting boss 12. The structure is simple, so that the silicon-based circuit board 30 and the silicon-based optical circuit board 10 have a larger matching contact area, thereby making the assembly and fixation of the silicon-based circuit board 30 and the silicon-based optical circuit board 10 more convenient and reliable.

[0091] The support boss 13 extends along the first direction, which can facilitate stable support of the silicon-based circuit board 30 in the first direction. The support boss 13 is connected to the mounting boss 12, and the boss surface of the support boss 13 is coplanar with the boss surface of the mounting boss 12. The structure is simple, so that the support boss 13 and the mounting boss 12 can be processed and formed together on the silicon substrate. The support boss 13 and the mounting boss 12 can cooperate to form a flat mounting surface structure for convenient assembly and fixation with the silicon-based circuit board 30, making the packaging structure 100 more convenient during assembly.

[0092] In one embodiment of the present invention, the silicon-based circuit board 30 and the silicon-based optical circuit board 10 can be bonded and connected. This makes it easier and more reliable to assemble and fix the silicon-based circuit board 30 and the silicon-based optical circuit board 10. Exemplarily, when the silicon-based circuit board 30 and the silicon-based optical circuit board 10 are assembled and fixed, a thermosetting adhesive can be applied between the silicon-based circuit board 30 and the boss surfaces of the supporting boss 13 and the mounting boss 12 of the silicon-based optical circuit board 10 for bonding.

[0093] In a specific embodiment of the present invention, reference Figure 3 and Figure 5 As shown, the packaging structure 100 may further include a first electrical connection sheet 40, which is disposed on the silicon-based optical circuit board 10 and is located on the other side of the second positioning groove 112 in the second direction. The silicon-based circuit board 30 is formed with an avoidance notch 301. The first electrical connection sheet 40 is disposed on the silicon-based optical circuit board 10 and is located on the other side of the second positioning groove 112 in the second direction. Figure 3 The upper and lower directions shown in the figure are located in the avoidance gap 301 , and the third direction is the stacking direction of the silicon-based optical circuit board 10 and the silicon-based circuit board 30 .

[0094] In this embodiment, the packaging structure 100 is provided with a first electrical connection sheet 40, which is arranged on the silicon-based optical circuit board 10 and is located on the other side of the second positioning groove 112 in the second direction. The structure is simple and the arrangement is reasonable, which can facilitate the electrical connection between the coupling modulation component 22 on the silicon-based optical circuit board 10 and the circuit and electronic components on the silicon-based circuit board 30, thereby meeting the operation and use requirements of the optical fiber gyroscope. The silicon-based circuit board 30 is provided with an avoidance gap 301, and the first electrical connection sheet 40 is located in the avoidance gap 301 in the third direction, so that when the silicon-based circuit board 30 and the various components on the silicon-based optical circuit board 10 are electrically connected through the first electrical connection sheet 40 as needed, the avoidance gap 301 can play a good avoidance role, so that the electrical connection structure can be smoothly arranged in the third direction, so that the overall connection structure arrangement of the silicon-based circuit board 30 and the silicon-based optical circuit board 10 can be made more compact to a certain extent, so that the overall integration of the packaging structure 100 is better and the volume is smaller, so that the integration of the optical fiber gyroscope is higher. Optionally, the first electrical connection sheet 40 may be formed on the silicon-based optical circuit board 10 by deposition.

[0095] In one embodiment of the present invention, reference Figure 1 and Figure 3 As shown, the multiple mounting grooves 11 may also include: a fourth positioning groove 114 and a fifth positioning groove 115. In the first direction, the fourth positioning groove 114 is arranged between the first positioning groove 111 and the second positioning groove 112, and the isolator 24 is arranged in the fourth positioning groove 114. The isolator 24 is located on the transmission path of the light beam; the fifth positioning groove 115 is arranged between the fourth positioning groove 114 and the second positioning groove 112, and the detector 25 is arranged in the fifth positioning groove 115.

[0096] In this embodiment, the plurality of mounting grooves 11 further include a fourth positioning groove 114 and a fifth positioning groove 115. The isolator 24 is arranged in the fourth positioning groove 114, and the detector 25 is arranged in the fifth positioning groove 115. The structure is simple, the assembly is convenient and the positioning is accurate. The isolator 24 is located on the transmission path of the light beam, so that the isolator 24 and the light source component 21 and the coupling modulation component 22 can stably and reliably form high-precision optical coupling, which well meets the operation requirements of the fiber optic gyroscope.

[0097] In some embodiments of the present invention, the light source component 21 , the isolator 24 , the detector 25 , the coupling modulation component 22 and the optical fiber 23 may all be bonded and fixed to the mounting groove 11 .

[0098] In this embodiment, the light source component 21, the isolator 24, the detector 25, the coupling modulation component 22 and the optical fiber 23 are all bonded and fixed to the mounting groove 11. Specifically, the light source component 21 can be bonded and fixed to the first positioning groove 111, the isolator 24 can be bonded and fixed to the fourth positioning groove 114, the detector 25 can be bonded and fixed to the fifth positioning groove 115, the coupling modulation component 22 is bonded and fixed to the second positioning groove 112, and the optical fiber 23 is bonded and fixed to the third positioning groove 113. The structure is simple and the fixation is convenient and reliable, so that the light source component 21 and the isolator 24, the detector 25, the coupling modulation component 22 and the optical fiber 23 can form a stable and reliable positional relationship, so that the various components in the fiber optic gyroscope assembly 20 can form a stable optical coupling, so that the fiber optic gyroscope is more stable and reliable during operation.

[0099] Optionally, the light source component 21 and the first positioning groove 111, the coupling modulation component 22 and the second positioning groove 112, the isolator 24 and the fourth positioning groove 114, and the detector 25 and the fifth positioning groove 115 can be bonded and fixed using silver glue, and the optical fiber 23 and the third positioning groove 113 can be bonded and fixed using optical UV glue (Ultraviolet Curable Adhesive).

[0100] In some embodiments of the present invention, the dimensional accuracy of the mounting groove 11 may be ±50 nm.

[0101] In this embodiment, the dimensional accuracy of the mounting groove 11 is set to ±50nm, so that each mounting groove 11 can more accurately position the components in the corresponding fiber optic gyroscope assembly 20, so that each component in the fiber optic gyroscope assembly 20 can stably and reliably form high-precision optical coupling after being assembled into the corresponding mounting groove 11, thereby well meeting the operation requirements of the fiber optic gyroscope and improving the overall performance and stability of the fiber optic gyroscope.

[0102] In some embodiments of the present invention, the silicon-based optical circuit board 10 may be configured to be made by micro-nano processing technology.

[0103] In the present embodiment, the silicon-based optical circuit board 10 is configured to be made by a micro-nano processing technology. The processing technology is mature, so that the silicon-based optical circuit board 10 can have good processing quality and can be processed on a large scale at a low production cost. The dimensional accuracy of the processed multiple mounting grooves 11 and the dimensional accuracy of structures such as the supporting bosses 13 and the mounting bosses 12 can well meet the design requirements of the packaging structure 100, so that the packaging structure 100 can stably and reliably meet the operation requirements of the fiber optic gyroscope.

[0104] Exemplarily, when the silicon-based optical circuit board 10 is processed and manufactured using a micro-nano processing technology, the silicon-based optical circuit board 10 can select high-quality single-crystal silicon wafers as raw materials for processing. After the surface of the single-crystal silicon wafer is cleaned, photoresist is coated, and the shape pattern required by the silicon-based optical circuit board 10 is formed by photolithography technology. Then, the material is removed by dry or wet etching to form the required shape structure, such as forming the required installation grooves 11. The depth of the installation groove 11 can be determined by etching corresponding limit marks on the single-crystal silicon wafer in the photolithography process to form a mounting groove 11 structure that meets the requirements. The processed silicon-based optical circuit board 10 can be smoothed or annealed as needed to improve the overall structural characteristics of the surface quality.

[0105] In one embodiment of the present invention, the silicon-based circuit board 30 can also be configured to be made by micro-nano processing technology. In this way, the silicon-based circuit board 30 can have good processing quality and can be processed on a large scale at a low production cost, and the dimensional accuracy of the silicon-based circuit board 30 and the dimensional accuracy of the structures such as the avoidance notch 301 can be higher, so that the silicon-based circuit board 30 can be better stacked with the silicon-based optical circuit board 10.

[0106] Exemplarily, when the silicon-based circuit board 30 is processed and manufactured by adopting micro-nano processing technology, the silicon-based circuit board 30 can also select high-quality single-crystal silicon wafers as raw materials for processing. The single-crystal silicon wafers are processed into silicon-based circuit boards 30 of the required shape through photolithography, etching, thin film deposition and other production processes, and the required circuits are formed on the silicon-based circuit boards 30. Exemplarily, when there are multiple silicon-based circuit boards 30, multiple silicon-based circuit boards 30 can be stacked and tightly integrated through advanced packaging technologies such as through silicon via technology or redistribution layer technology, and multiple layers of silicon-based circuit boards 30 can be vertically interconnected in the stacking direction to reduce the routing length when the silicon-based circuit board 30 is electrically connected to the silicon-based optical circuit board 10, so that the overall structure of the silicon-based circuit board 30 and the silicon-based optical circuit board 10 is more compact.

[0107] In one embodiment of the present invention, the heat dissipation silicon plate 211 and the silicon lens 212 can be configured to be made by micro-nano processing technology. In this way, the dimensional accuracy of the silicon lens 212 and the heat dissipation silicon plate 211 can well meet the use requirements, which is convenient for the batch production and processing of the light source component 21, so that the packaging structure 100 has higher production efficiency and lower production cost.

[0108] Exemplarily, when the heat dissipation silicon plate 211 and the silicon lens 212 are processed and manufactured using micro-nano processing technology, the heat dissipation silicon plate 211 and the silicon lens 212 can select high-quality single-crystal silicon wafers to be integrally processed and formed through processes such as photolithography and etching. For example, the single-crystal silicon wafer can select a suitable thickness according to the light coupling requirements of each component in the fiber optic gyroscope. In the photolithography process, the single-crystal silicon wafer can be sequentially subjected to photoresist coating, exposure, development, etc. to form the outline of the silicon lens 212, and then the three-dimensional surface of the silicon lens 212 is formed in the etching process. After etching, the silicon lens 212 can obtain a smooth and high-quality lens surface through thermal oxidation or chemical mechanical polishing. Furthermore, the surface of the silicon lens 212 can be polished again to eliminate micro-light defects, reduce the scattering of the light beam and improve the transmittance. The surface of the silicon lens 212 can also be coated with an anti-reflection film to reduce light loss and improve the transmittance.

[0109] In one embodiment of the present invention, reference Figure 1 and Figure 4 As shown, the packaging structure 100 may further include a thermoelectric cooler, which is arranged on a side of the silicon-based optical circuit board 10 away from the mounting groove 11, and at least a portion of the thermoelectric cooler is arranged relative to the first positioning groove 111 in a third direction. The light source component 21 may further be provided with a temperature sensor 216, which is electrically connected to the thermoelectric cooler.

[0110] In this embodiment, a thermoelectric cooler is arranged on the side of the silicon-based optical circuit board 10 away from the installation groove 11. The thermoelectric cooler can play a role in cooling and dissipating heat. Since the light source component 21 generates a lot of heat during operation, at least part of the thermoelectric cooler in this embodiment is arranged relative to the first positioning groove 111 in a third direction, so that the thermoelectric cooler can play a good heat dissipation role for the light source component 21 in the first positioning groove 111, so that the light source component 21 can operate stably and reliably.

[0111] In this embodiment, the light source component 21 is provided with a temperature sensor 216, and the temperature sensor 216 is electrically connected to the thermoelectric cooler. The temperature sensor 216 can detect the temperature of the light source component 21 in real time, so that the thermoelectric cooler can accurately control the temperature according to the information obtained by the temperature sensor 216, so that the broadband light source 213 in the light source component 21 can be in a stable temperature environment, thereby reducing the influence of temperature on the output power and beam wavelength of the broadband light source 213, reducing the increase in light loss caused by the slight displacement of the light source component 21 under the action of temperature, and allowing the fiber optic gyroscope to operate more stably and reliably.

[0112] In this embodiment, the thermoelectric cooler is arranged on the side of the silicon-based optical circuit board 10 away from the mounting groove 11, so that the thermoelectric cooler, the silicon-based circuit board 30 and the silicon-based optical circuit board 10 can be stacked, thereby making the packaging structure 100 more compact and better integrated.

[0113] In one embodiment of the present invention, the light source component 21 may further include a second electrical connection piece 214 , through which the temperature sensor 216 and the thermoelectric cooler may be electrically connected, and the broadband light source 213 and the silicon-based circuit board 30 may be electrically connected.

[0114] This facilitates the electrical connection between the temperature sensor 216 in the light source component 21 and the thermoelectric cooler, so that the broadband light source 213 can be conveniently electrically connected to the silicon-based circuit board 30. Optionally, the second electrical connection sheet 214 can be formed on the heat dissipation silicon board 211 by deposition.

[0115] In some examples of the present invention, Figure 4 As shown, the light source component 21 may further include a pre-set solder 215, the pre-set solder 215 is provided on the heat dissipation silicon plate 211, and the broadband light source 213 is fixed on the heat dissipation silicon plate 211 through the pre-set solder 215. This can facilitate the assembly and fixation of the broadband light source 213 on the heat dissipation silicon plate 211. Exemplarily, the pre-set solder 215 can be formed on the heat dissipation silicon plate 211 by electroplating or deposition.

[0116] Reference below Figure 1-Figure 13 The fiber optic gyroscope integrated device according to the embodiment of the second aspect of the present invention is described.

[0117] like Figure 1-Figure 13 As shown, the fiber optic gyroscope integrated device according to an embodiment of the present invention includes a packaging structure 100 of the fiber optic gyroscope integrated device according to the first aspect of the present invention.

[0118] Other structures and operations of the fiber optic gyroscope integrated device according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0119] According to the fiber optic gyroscope integrated device of the embodiment of the present invention, by setting the packaging structure 100 of the fiber optic gyroscope integrated device of the first embodiment, by setting the silicon-based optical circuit board 10 and the fiber optic gyroscope assembly 20, a plurality of mounting grooves 11 are set on the silicon-based optical circuit board 10, and the plurality of mounting grooves 11 are respectively arranged corresponding to the light source component 21, the isolator 24, the detector 25, the coupling modulation component 22 and the optical fiber 23 in the fiber optic gyroscope assembly 20. The structure is simple, so that the various components in the fiber optic gyroscope assembly 20 can meet the needs of optical coupling after being installed in the corresponding mounting grooves 11, thereby making the assembly of the fiber optic gyroscope more convenient and easy, and making the fiber optic gyroscope have good integration, so that the overall volume of the packaging structure 100 is small.

[0120] The following will refer to Figure 1-Figure 13 A packaging structure 100 of an integrated fiber optic gyroscope device according to a specific embodiment of the present invention is described.

[0121] like Figure 1-Figure 13 As shown, the packaging structure 100 of the fiber optic gyroscope integrated device includes a silicon-based optical circuit board 10 , a silicon-based circuit board 30 , a fiber optic gyroscope component 20 , a thermoelectric cooler, and a first electrical connection sheet 40 .

[0122] The silicon-based optical circuit board 10 extends along the first direction and is formed with a supporting boss 13 and a mounting boss 12. Six mounting grooves 11 are provided on the silicon-based optical circuit board 10. The six mounting grooves 11 are respectively a first positioning groove 111, a second positioning groove 112, two third positioning grooves 113, a fourth positioning groove 114 and a fifth positioning groove 115. The first positioning groove 111, the second positioning groove 112 and the third positioning groove 113 are arranged in sequence along the first direction, the two third positioning grooves 113 are arranged side by side in the second direction and are formed on the boss surface of the mounting boss 12, the third positioning groove 113 is a V-shaped groove, the supporting boss 13 extends along the first direction and is located on one side of the second positioning groove 112 in the second direction, three first electrical connecting sheets 40 are provided, and the three first electrical connecting sheets 40 are arranged along the first direction and are arranged on the other side of the second positioning groove 112 in the second direction, the supporting boss 13 is connected to the mounting boss 12, and the supporting boss 13 and the boss surface of the mounting boss 12 are arranged coplanarly.

[0123] The fourth positioning groove 114 is disposed between the first positioning groove 111 and the second positioning groove 112 in the first direction, and the fifth positioning groove 115 is disposed between the fourth positioning groove 114 and the second positioning groove 112 and staggered with the fourth positioning groove 114 in the second direction.

[0124] The silicon-based circuit board 30 is integrated with multiple third electrical connection sheets and electronic circuit structures such as resistors, capacitors, and electrical chips. The silicon-based circuit board 30 is provided with an avoidance gap 301, which penetrates the silicon-based circuit board 30 along the third direction and is arranged opposite to the first electrical connection sheet 40 in the third direction. The silicon-based circuit board 30 is fixed to the support boss 13 and the mounting boss 12 by means of thermosetting adhesive. The number of silicon-based circuit boards 30 in this embodiment is not specifically limited. The silicon-based circuit board 30 can be set to one or more according to the arrangement requirements of electronic circuits, etc. For example, when the number of silicon-based circuit boards 30 is multiple, multiple silicon-based circuit boards 30 can be stacked and arranged in the third direction and assembled and packaged through silicon vias and other technologies to achieve compact connection and assembly of multiple silicon-based circuit boards 30 and the silicon-based optical circuit board 10.

[0125] The fiber optic gyro assembly 20 includes a light source component 21 , an isolator 24 , a detector 25 , a coupling modulation component 22 , and an optical fiber 23 . The light source component 21 includes a broadband light source 213, a heat dissipation silicon plate 211, a silicon lens 212, a temperature sensor 216, a second electrical connection piece 214 and a pre-set solder 215. The broadband light source 213 can be a semiconductor optical chip. The light beam band output by the semiconductor optical chip is 1310nm or 1550nm. The semiconductor optical chip can be set as a wide-linewidth high-power laser. The broadband light source 213 is fixed on the heat dissipation silicon plate 211 by welding with the pre-set solder 215. The temperature sensor 216 is a thermistor. The temperature sensor 216 is arranged on the second electrical connection piece 214 and is arranged close to the broadband light source 213 in the second direction. The second electrical connection piece 214 is a gold layer thin film and there are four of them. The second electrical connection piece 214 is deposited on the heat dissipation silicon plate 211. The pre-set solder 215 can be gold-tin solder or tin-silver solder. The pre-set solder 215 can be deposited or electroplated on the heat dissipation silicon plate 211. The silicon lens 212 is integrally processed with the heat dissipation silicon plate 211 . The light source component 21 is fixed to the first positioning groove 111 by silver glue. The broadband light source 213 and the silicon lens 212 are arranged in the first direction. The broadband light source 213 emits a light beam toward the silicon lens 212 along the first direction.

[0126] The isolator 24 is fixed in the fourth positioning groove 114 by silver glue. The coupling modulation component 22 is an integrated optical chip based on lithium niobate, which plays the role of a coupler and a modulator. The coupling modulation component 22 is fixed in the second positioning groove 112 by silver glue. Two optical fibers 23 are provided. The two optical fibers 23 are respectively fixed in the third positioning groove 113 by optical UV glue. The coupling modulation component 22 has a light input port and a light output port. The light input port faces the isolator 24, and two light output ports are arranged in the second direction and face the two third positioning grooves 113 respectively.

[0127] refer to Fig.13 As shown in the figure, H represents the height of the center of the cross section of the optical fiber 23 on the silicon-based optical circuit board 10 in the third direction, and L represents the distance between the centers of the two optical fibers 23 in the second direction. The center distance between the two light output ports in the second direction can be the same as L, and the height of the two light output ports in the third direction on the silicon-based optical circuit board 10 can be the same as H, so that the light beam emitted from the light output port can be stably and reliably injected into the optical fiber 23, so that the coupling modulation component 22 can form a good optical coupling with the optical fiber.

[0128] The detector 25 is fixed in the fifth positioning groove 115 by silver glue, and the position of the fifth positioning groove 115 can be reasonably arranged as needed so that the detector 25 can form a stable optical coupling with the coupling modulation component 22 on the light beam loop.

[0129] The silicon-based circuit board 30 is arranged on one side of the silicon-based optical circuit board 10 having the mounting groove 11 and is bonded and fixed to the boss surface of the supporting boss 13 and the boss surface of the mounting boss 12 by thermosetting adhesive. The thermoelectric cooler is arranged on the side of the silicon-based optical circuit board 10 facing away from the silicon-based circuit board 30.

[0130] In this embodiment, a silicon-based optical circuit board 10 and a fiber optic gyroscope assembly 20 are provided. A plurality of mounting grooves 11 are provided on the silicon-based optical circuit board 10. The plurality of mounting grooves 11 are arranged one by one corresponding to the light source component 21, the isolator 24, the detector 25, the coupling modulation component 22 and the optical fiber 23 in the fiber optic gyroscope assembly 20. The structure is simple, so that the components in the fiber optic gyroscope assembly 20 can meet the needs of optical coupling after being installed in the corresponding mounting grooves 11, thereby making the assembly of the fiber optic gyroscope more convenient and easy, and making the fiber optic gyroscope have good integration, so that the arrangement positions of the components can be arranged more compactly through the processing and molding of the high-precision mounting grooves 11, thereby shortening the path of the light beam transmitted between the plurality of components, reducing the light loss, making the operation stability of the optical gyroscope better and the power consumption well reduced, thereby improving the transmission efficiency of the optical signal, making the measurement accuracy and signal quality of the fiber optic gyroscope better, and making the overall volume of the packaging structure 100 smaller.

[0131] When the fiber optic gyroscope is assembled, the packaging structure 100 only needs to be assembled with the external optical fiber ring to complete the assembly of the fiber optic gyroscope. When the packaging structure 100 is assembled, each component is installed and fixed in the corresponding installation groove 11 and assembled in place. The light input and output ports of each component can be on the transmission path of the light beam emitted by the broadband light source 213. In other words, the light beam emission port of the light source component 21 and the input and output ports of the isolator 24 and the light input port of the coupling modulation component 22 are on the same optical axis, and the two light output ports of the coupling modulation component 22 are on the same optical axis with the two optical fibers 23. The optical axis refers to the center line of the light beam transmission. In this embodiment, the center line of the light beam emitted by the light source component 21 can be set as the system optical axis of the fiber optic gyroscope. Multiple installation grooves 11 can be accurately set and processed on the silicon-based optical circuit board 10 according to the size and relative position of the system optical axis in the first direction, the second direction and the third direction. Therefore, after each component is installed in the corresponding installation groove 11 and assembled in place, high-precision optical coupling of each component can be achieved with good stability and reliability, thereby making the packaging and assembly of the fiber optic gyroscope more convenient and easy, and the production efficiency of the fiber optic gyroscope can be greatly improved.

[0132] Since the silicon-based circuit board 30, the silicon-based optical circuit board 10, and the heat dissipation silicon plate 211 and the silicon lens 212 in the light source component 21 can be produced using mature micro-nano processing technology, the packaging structure 100 can be produced in large quantities, at low cost and with high quality, thereby playing a good role in promoting the low-cost, miniaturization and integration development of fiber optic gyroscopes.

[0133] In the present embodiment, a silicon-based circuit board 30 and a silicon-based optical circuit board 10 are provided. Since silicon material is compatible with a variety of materials and devices, the electronic circuit devices or structures and the various components in the fiber optic gyroscope assembly 20 can be well integrated into the silicon-based circuit board 30 or the silicon-based optical circuit board 10. In addition, silicon material has good thermal stability and mechanical strength, so that the silicon-based circuit board 30 and the silicon-based optical circuit board 10 can have good heat dissipation effect and structural stability, so that the various electronic circuits in the packaging structure 100 and the various components in the fiber optic gyroscope assembly 20 can operate stably, and the overall structural stability and reliability of the packaging structure 100 are better, thereby making the operation stability and reliability of the fiber optic gyroscope better. In addition, the highly integrated fiber optic gyroscope makes the overall mechanical stability of the packaging structure 100 better, thereby reducing the impact of environmental interference such as temperature changes and vibrations on the stability of the operation of the fiber optic gyroscope, so that the fiber optic gyroscope can still operate stably in harsh environments.

[0134] The following are the dimensions, number of independent components, coupling connection points, and optical loss parameters of the packaging structure 100 of this embodiment, the existing discrete device packaging structure, and the partially integrated packaging structure, wherein the number of independent components refers to the number of components that are not integrated together, the coupling connection points refer to the number of independent components that need to be coupled, and the optical loss refers to the optical loss in the fiber optic gyroscope:

[0135] The size of the packaging structure 100 in this embodiment is 23.5mm*8mm*6mm, the number of independent components is one, the number of coupling connection points is zero, and the optical loss is 4.5dB; the size of the traditional discrete device packaging structure is 40mm*40mm*20mm, the number of independent components is four, the number of coupling connection points is three, and the optical coupling loss is 10dB; the size of the partially integrated packaging structure is 25mm*14mm*8mm, the number of independent components is two, the number of coupling connection points is one, and the optical coupling loss is 6dB.

[0136] It can be seen from the above that the packaging structure 100 of the fiber optic gyroscope integrated device in this embodiment has a smaller size, fewer independent components, fewer coupling connection points and smaller optical loss, making the assembly and manufacturing of the fiber optic gyroscope more convenient and easier, while also reducing the time and cost of debugging and calibration. The packaging structure 100 has a higher overall integration and a smaller size, and can be better suited for application scenarios with limited space, such as drones, portable devices, etc.

[0137] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0138] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0139] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0140] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0141] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A packaging structure of an integrated fiber gyroscope device, characterized in that: include: A silicon-based optical circuit board (10), wherein a plurality of mounting grooves (11) are formed on the silicon-based optical circuit board (10), and the plurality of mounting grooves (11) are arranged to be spaced apart along the optical path direction; A fiber optic gyroscope assembly (20), the fiber optic gyroscope assembly (20) comprising a light source component (21), an isolator (24), a detector (25), a coupling modulation component (22) and an optical fiber (23), wherein a plurality of mounting grooves (11) are respectively arranged corresponding to the light source component (21), the isolator (24), the detector (25), the coupling modulation component (22) and the optical fiber (23), wherein the light source component (21), the isolator (24), the detector (25), the coupling modulation component (22) and the optical fiber (23) are configured to complete optical coupling after being installed in each of the mounting grooves (11).

2. The packaging structure of the fiber optic gyroscope integrated device according to claim 1, characterized in that: The light source component (21) comprises: A broadband light source (213), wherein the broadband light source (213) is configured to emit a light beam along a first direction; A heat dissipation silicon plate (211) and a silicon lens (212), wherein the broadband light source (213) is arranged on the heat dissipation silicon plate (211), and in the first direction, the silicon lens (212) is located on the transmission path of the light beam, wherein the silicon lens (212) and the heat dissipation silicon plate (211) are an integrally formed part.

3. The packaging structure of the fiber optic gyroscope integrated device according to any one of claims 1 or 2, characterized in that: The plurality of mounting slots (11) include: A first positioning groove (111), the light source component (21) being arranged in the first positioning groove (111), and the light source component (21) being configured to emit a light beam along a first direction; A second positioning groove (112), the second positioning groove (112) being arranged on one side of the first positioning groove (111) in a first direction, the coupling modulation component (22) being arranged in the second positioning groove (112), and a light inlet port being formed at one end of the coupling modulation component (22) facing the light source component (21), the light inlet port being located on a transmission path of the light beam.

4. The packaging structure of the fiber optic gyroscope integrated device according to claim 3, characterized in that: The plurality of mounting grooves (11) further include a third positioning groove (113), wherein the third positioning groove (113) is arranged on a side of the second positioning groove (112) in the first direction away from the first positioning groove (111), and the optical fiber (23) is installed in the third positioning groove (113). In the first direction, one end of the third positioning groove (113) is connected to the second positioning groove (112) and the other end passes through the silicon-based optical circuit board (10). An optical output port for outputting a light beam is formed at one end of the coupling modulation component (22) facing the optical fiber (23), and the optical output port is arranged opposite to one end of the optical fiber (23) facing the coupling modulation component (22).

5. The packaging structure of the fiber optic gyroscope integrated device according to claim 4, characterized in that: The third positioning groove (113) is a V-shaped groove, and the outer peripheral surface of the optical fiber (23) is arranged tangent to two groove wall surfaces of the third positioning groove (113).

6. The packaging structure of the fiber optic gyroscope integrated device according to claim 4, characterized in that: The number of the third positioning grooves (113) is two, and the two third positioning grooves (113) are arranged at intervals in the second direction. The number of the optical fibers (23) is two, and the two optical fibers (23) are arranged in a one-to-one correspondence with the two third positioning grooves (113). Two light output ports are formed at one end of the coupling modulation component (22) facing the third positioning grooves (113), and the two light output ports are arranged in a one-to-one correspondence with the two optical fibers (23). The second direction intersects with the first direction.

7. The packaging structure of the fiber optic gyroscope integrated device according to claim 4, characterized in that: The silicon-based optical circuit board (10) is formed with a mounting boss (12), the mounting boss (12) being arranged on a side of the second positioning groove (112) in the first direction away from the first positioning groove (111), and the third positioning groove (113) being formed on a boss surface of the mounting boss (12).

8. The packaging structure of the fiber optic gyroscope integrated device according to claim 7, characterized in that: It also includes a silicon-based circuit board (30), the silicon-based circuit board (30) and the silicon-based optical circuit board (10) are stacked, the silicon-based circuit board (30) is arranged on a side of the silicon-based optical circuit board (10) having the mounting boss (12), and the silicon-based circuit board (30) cooperates with the mounting boss (12) to press and fix the optical fiber (23).

9. The packaging structure of the fiber optic gyroscope integrated device according to claim 8, characterized in that: The silicon-based optical circuit board (10) is also formed with a supporting boss (13), the supporting boss (13) extending along the first direction and arranged on one side of the second positioning groove (112) in the second direction, the supporting boss (13) being connected to the mounting boss (12), the boss surface of the supporting boss (13) being arranged coplanar with the boss surface of the mounting boss (12), and the silicon-based circuit board (30) being fixed to the supporting boss (13) and the mounting boss (12).

10. The packaging structure of the fiber optic gyroscope integrated device according to claim 9, characterized in that: The invention also comprises a first electrical connection sheet (40), wherein the first electrical connection sheet (40) is arranged on the silicon-based optical circuit board (10) and is located on the other side of the second positioning groove (112) in the second direction, the silicon-based circuit board (30) is formed with an avoidance gap (301), and the first electrical connection sheet (40) is located in the avoidance gap (301) in a third direction, and the third direction is the stacking direction of the silicon-based optical circuit board (10) and the silicon-based circuit board (30).

11. The packaging structure of the fiber optic gyroscope integrated device according to claim 3, characterized in that: The plurality of mounting slots (11) further include: a fourth positioning groove (114), wherein in the first direction, the fourth positioning groove (114) is arranged between the first positioning groove (111) and the second positioning groove (112), the isolator (24) is arranged in the fourth positioning groove (114), and the isolator (24) is located on the transmission path of the light beam; A fifth positioning groove (115), wherein the fifth positioning groove (115) is arranged between the fourth positioning groove (114) and the second positioning groove (112), and the detector (25) is arranged in the fifth positioning groove (115).

12. A fiber optic gyroscope integrated device, characterized in that: A packaging structure comprising the fiber optic gyroscope integrated device according to any one of claims 1-11.

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