Sensor, electronic product and preparation method

Abstract

The invention discloses a sensor, an electronic product and a preparation method. The sensor comprises a substrate; the shell comprises a shielding area and a non-shielding area; the insulating layer is arranged on the non-shielding area of the shell, the shell is arranged on the substrate after a shielding part in the shielding area is removed, so that the substrate is electrically connected with the shell, the shell and the substrate are matched to define a containing cavity, and the shell is arranged on the substrate and is provided with a shielding part in the non-shielding area. And the shell can be connected with a shell of an electronic product through the insulating layer. According to the sensor, the shielding area on the shell of the sensor is shielded, and then the insulating layer is arranged on the non-shielding area of the shell, so that the sensor and the shell of an electronic product are effectively isolated, the shell of the sensor is prevented from being in direct contact with the shell of the electronic product, galvanic corrosion is avoided, and damage or failure of the electronic product is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product manufacturing, and more specifically, to a sensor, an electronic product and a preparation method thereof. Background Art

[0002] At present, watches and mobile phones are becoming thinner and lighter, and many watch cases are made of aluminum or alumina. However, in order to have a stronger product strength and better protect the internal chip, the sensor shell is usually made of stainless steel.

[0003] In general, the sensor shell is in direct contact with the inside of the smartwatch or smartphone case. Due to the significant difference in electric potential between aluminum and stainless steel, galvanic corrosion is very likely to occur after the two come into contact, especially when there are solutions such as seawater and swimming pool water (when the watch or mobile phone is used in similar scenarios). In addition, the electrode potential of aluminum is relatively negative, and it is easy to lose electrons and become an anode, while stainless steel becomes a cathode, causing the corrosion rate of aluminum to accelerate, that is, the watch case or mobile phone case is corroded, especially in a high temperature and high humidity environment, which can easily accelerate corrosion, causing the waterproof performance of the smartwatch or mobile phone to deteriorate and the product to fail. Summary of the invention

[0004] An object of the present invention is to provide a new technical solution for a sensor, an electronic product and a preparation method, which can at least solve the problem in the prior art that the housing of the sensor and the housing of the electronic product are corroded due to the potential difference, resulting in product failure.

[0005] According to a first aspect of the present invention, a sensor is provided, comprising: a substrate; a shell, the shell comprising a shielding area and a non-shielding area; an insulating layer, the insulating layer being arranged on the non-shielding area of ​​the shell, the shell being arranged on the substrate after removing a shielding member of the shielding area, so that the substrate is electrically connected to the shell, the shell and the substrate cooperate to define a accommodating cavity, and the shell can be connected to the outer shell of an electronic product through the insulating layer.

[0006] Optionally, the shielding area is located at the bottom of the shell, and the shielding area of ​​the shell is bonded and connected to the substrate through a conductive adhesive.

[0007] Optionally, the insulating layer is deposited on the non-shielding area of ​​the shell by physical vapor deposition or electrophoresis.

[0008] Optionally, the insulating layer is made of diamond or silicon carbide material.

[0009] Optionally, a waterproof adhesive layer is provided in the accommodating cavity.

[0010] Optionally, a sealing ring is provided on the outer periphery of the shell.

[0011] Optionally, the substrate is a circuit board, a chip is provided on the circuit board, and the chip is located in the accommodating cavity.

[0012] A second aspect of the present invention provides a method for preparing a sensor, which is used to prepare the sensor described in the above embodiment, and the preparation method comprises:

[0013] Setting a shielding area and a non-shielding area on the outer surface of the housing of the sensor;

[0014] Depositing an insulating layer at the non-shielded area of ​​the housing;

[0015] The shielding area of ​​the shell is arranged on the substrate through conductive glue, so that the shell and the substrate are electrically connected.

[0016] Optionally, the method for preparing the sensor further comprises:

[0017] Cleaning the shell;

[0018] After cleaning, dry at 50-90℃ for 0.5-1h.

[0019] A third aspect of the present invention provides an electronic product, comprising: a housing; and the sensor described in the above embodiment, wherein the housing of the sensor is connected to the housing via an insulating layer.

[0020] The sensor of the present invention shields the shielding area on the sensor shell, and then provides an insulating layer on the non-shielding area of ​​the shell, thereby effectively isolating the sensor from the shell of the electronic product, preventing the sensor shell from directly contacting the shell of the electronic product, avoiding the occurrence of galvanic corrosion, and preventing product failure.

[0021] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0023] Figure 1 is a top view of a sensor according to an embodiment of the present invention;

[0024] Figure 2 yes Figure 1 Section along line AA.

[0025] Reference numerals:

[0026] substrate 10;

[0027] Housing 20;

[0028] Insulation layer 30;

[0029] Conductive adhesive 40;

[0030] Waterproof adhesive layer 50;

[0031] Sealing ring 60;

[0032] Chip 70;

[0033] Direction identification mark 80. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0036] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0037] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0038] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0039] In the specification and claims of the present invention, if the term "first" or "second" is involved, it may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0040] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" involved should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] The sensor according to the embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0043] like Figure 1 and Figure 2 As shown, the sensor according to the embodiment of the present invention includes a substrate 10 , a housing 20 and an insulating layer 30 .

[0044] Specifically, the housing 20 includes a shielding area and a non-shielding area. The insulating layer 30 is disposed on the non-shielding area of ​​the housing 20. The housing 20 is disposed on the substrate 10 after removing the shielding member of the shielding area, so that the substrate 10 is electrically connected to the housing 20. The housing 20 cooperates with the substrate 10 to define a receiving cavity, and the housing 20 can be connected to the housing of the electronic product through the insulating layer 30.

[0045] In other words, if Figure 1 and Figure 2 As shown, the sensor according to an embodiment of the present invention is mainly composed of a substrate 10, a shell 20 and an insulating layer 30. The sensor may be a pressure sensor, a temperature sensor or other types of sensors. It should be noted that the sensor of the present invention is a sensor with high sealing performance and needs to be in direct contact with the environment. There is a problem that the shell 20 of the sensor is in contact with the outer shell of the electronic product. For the sensor of the present invention, the outer wall of the shell 20 is sealed with the inner wall of the groove of the outer shell of the electronic product through a sealing ring 60 to prevent leakage from the gap and cause water to enter the whole machine. For other ordinary low-requirement sensor devices, an independent or integrated protection module can be set on the shell opening.

[0046] like Figure 2 As shown, in the sensor of the present invention, the housing 20 has a shielding area and a non-shielding area. The insulating layer 30 is arranged on the non-shielding area of ​​the housing 20. The housing 20 can be arranged on the substrate 10 after removing the shielding member of the shielding area, so as to ensure that the substrate 10 and the housing 20 can form an electrical connection. The housing 20 cooperates with the substrate 10 to define a receiving cavity. The housing 20 can be connected to the housing of the electronic product through the insulating layer 30, effectively isolating the sensor from the housing of the electronic product, preventing the housing 20 of the sensor from directly contacting the housing of the electronic product, avoiding the occurrence of galvanic corrosion, and preventing product failure.

[0047] It should be noted that, usually, in order to meet the miniaturization and lightweight design requirements of electronic products, the outer shell of electronic products (for example, watches or mobile phones) is made of aluminum or alumina, and the housing 20 of the sensor is made of stainless steel. Due to the significant difference in potential between aluminum and stainless steel, galvanic corrosion is very likely to occur after the two come into contact, especially when there are solutions such as seawater and swimming pool water (when watches or mobile phones are used in similar scenarios). In addition, the electrode potential of aluminum is relatively negative, and it is easy to lose electrons and become an anode, while stainless steel becomes a cathode, which causes the corrosion rate of aluminum to accelerate, that is, the watch case or mobile phone case is corroded, especially in a high temperature and high humidity environment, which is easy to accelerate corrosion, causing the waterproof performance of smart watches or mobile phones to decrease and the product to fail.

[0048] Therefore, according to the sensor of the embodiment of the present invention, the shielding area on the sensor shell 20 is shielded, and then an insulating layer 30 is provided on the non-shielding area of ​​the shell 20, so as to effectively isolate the sensor and the housing of the electronic product, prevent the sensor shell 20 from directly contacting the housing of the electronic product, avoid the occurrence of galvanic corrosion, and prevent the electronic product from being damaged or failing.

[0049] According to an embodiment of the present invention, the shielding area is located at the bottom of the housing 20 , and the shielding area of ​​the housing 20 is bonded and connected to the substrate 10 via a conductive adhesive 40 .

[0050] In other words, Figure 2 As shown, the shielding area is located at the bottom of the shell 20. After the bottom of the shell 20 is shielded, in the process of setting the insulating layer 30 on the shell 20, it is ensured that there is no insulating layer 30 at the shielding area at the bottom of the shell 20. In the process of bonding the shell 20 and the substrate 10 by the conductive adhesive 40, it is ensured that the shell 20 and the substrate 10 are electrically connected, which not only avoids the galvanic corrosion effect when the shell 20 of the sensor contacts the shell of the electronic product, but also ensures the conductivity of the shell 20 of the sensor, and ensures that the sensor has good RF (RF: Radio Frequency) performance and antistatic performance.

[0051] According to an embodiment of the present invention, the insulating layer 30 is deposited on the non-shielding area of ​​the housing 20 by physical vapor deposition or electrophoresis.

[0052] That is to say, the insulating layer 30 can be deposited in the non-shielded area of ​​the shell 20 by physical vapor deposition or electrophoresis. Physical vapor deposition and electrophoresis can ensure the compactness of the insulating coating, the uniformity of the thickness, the firmness of the bonding, etc., and can ensure that the insulating material (insulating layer 30) does not fall off under reliability conditions such as high temperature, high humidity and high pressure. In the present invention, taking physical vapor deposition as an example, shielding is performed on the places where the shell 20 of the sensor does not need to be insulated, and then physical vapor deposition is performed to deposit a layer of insulating layer 30 in the non-shielded area of ​​the shell 20, thereby avoiding the galvanic corrosion effect that occurs when the shell 20 of the sensor contacts the outer shell of the electronic product, and also ensuring the conductivity of the shell 20 itself, ensuring that the sensor has good RF performance and antistatic performance.

[0053] According to one embodiment of the present invention, the insulating layer 30 may be made of diamond or silicon carbide material. Diamond or silicon carbide material has good contact and fit with the stainless steel housing 20. In addition, the material itself has high hardness and wear resistance, and is particularly suitable for use as an insulating material on a metal surface.

[0054] According to one embodiment of the present invention, Figure 2 As shown, a waterproof adhesive layer 50 is provided in the accommodating cavity. In other words, a waterproof adhesive layer 50 can be provided in the accommodating cavity to further improve the waterproof performance of the sensor.

[0055] According to one embodiment of the present invention, Figure 2 As shown, a sealing ring 60 is provided on the outer periphery of the housing 20. That is, a sealing ring 60 can be provided on the outer periphery of the housing 20 of the sensor, and the sealing ring 60 is located between the housing 20 of the sensor and the housing of the electronic product to form an effective seal. The sealing ring 60 can be an O-ring, and the material of the sealing ring 60 can be silicone to prevent water vapor or other impurities from entering the interior of the product.

[0056] According to one embodiment of the present invention, Figure 2 As shown, the substrate 10 is a circuit board, and a chip 70 is arranged on the circuit board, and the chip 70 is located in the accommodation cavity. In other words, the substrate 10 can be a circuit board, and the substrate 10 and the housing 20 can be bonded and connected by silver glue (conductive glue 40). The chip 70 is arranged on the circuit board, and the chip 70 is located in the accommodation cavity, forming a complete sensor.

[0057] In summary, according to the sensor of the embodiment of the present invention, the shielding area on the sensor shell 20 is shielded, and then an insulating layer 30 is set on the non-shielding area of ​​the shell 20 to effectively isolate the sensor and the housing of the electronic product, prevent the sensor shell 20 from directly contacting the housing of the electronic product, avoid the occurrence of galvanic corrosion, and prevent damage or failure of the electronic product.

[0058] Of course, for those skilled in the art, other structures of the sensor (such as the direction identification mark 80, etc.) and their working principles are understandable and achievable, and will not be described in detail in the present invention.

[0059] According to a second aspect of the present invention, a method for preparing a sensor is provided, which is used to prepare the sensor in the above embodiment, and the preparation method comprises:

[0060] S1. Setting a shielding area and a non-shielding area on the outer surface of the sensor housing 20;

[0061] S2, depositing an insulating layer 30 at a non-shielded area of ​​the housing 20;

[0062] S3. The shielding area of ​​the housing 20 is disposed on the substrate 10 through the conductive adhesive 40 to electrically connect the housing 20 and the substrate 10.

[0063] In other words, if Figure 1 and Figure 2 As shown, the method for preparing a sensor according to an embodiment of the present invention is used to prepare the sensor in the above embodiment. In the method for preparing a sensor according to an embodiment of the present invention, first, a shielding area and a non-shielding area can be set on the outer surface of the housing 20 of the sensor, and the area at the bottom of the housing 20 that does not need insulation is shielded, and then an insulating layer 30 is deposited in the non-shielding area of ​​the housing 20. The insulating layer 30 can be made of diamond or silicon carbide material. Diamond or silicon carbide material has good contact and fit with the stainless steel housing 20. In addition, the material itself has high hardness and wear resistance, and is particularly suitable for use as an insulating material for metal surfaces. In the present invention, taking physical vapor deposition as an example, shielding is performed at the place where the housing 20 of the sensor does not need insulation, and then physical vapor deposition is performed to deposit a layer of insulating layer 30 in the non-shielding area of ​​the housing 20, thereby avoiding the galvanic corrosion effect that occurs when the housing 20 of the sensor contacts the outer shell of the electronic product, and also ensuring the conductivity of the housing 20 itself, ensuring that the sensor has good RF performance and antistatic performance. Finally, the shielding area of ​​the housing 20 is disposed on the substrate 10 through the conductive adhesive 40 , so that the housing 20 and the substrate 10 are electrically connected.

[0064] According to one embodiment of the present invention, the method for preparing the sensor further includes:

[0065] Cleaning the housing 20;

[0066] After cleaning, dry at 50-90℃ for 0.5-1h.

[0067] That is to say, in the preparation method of the sensor of the present invention, first, the shell 20 is cleaned. After cleaning, it can be dried at 50-90°C for 0.5-1h. Then, the non-top area of ​​the shell 20 (the area that does not require insulation) is shielded. Finally, it is placed in a physical vapor deposition or electrophoresis box, rotated for deposition, uniformity is ensured, and the entire production process is completed after inspection and packaging. According to the sensor of the embodiment of the present invention, the shielding area on the shell 20 of the sensor is shielded, and an insulating layer 30 is deposited on the non-shielding area of ​​the shell 20, thereby avoiding the galvanic corrosion effect that occurs when the shell 20 of the sensor contacts the outer shell of the electronic product, and ensuring the conductivity of the shell 20 itself, thereby ensuring that the sensor has good RF performance and antistatic properties.

[0068] According to a third aspect of the present invention, an electronic product is provided, comprising a housing and the sensor of the above embodiment, wherein a housing 20 of the sensor is connected to the housing via an insulating layer 30 .

[0069] In other words, the electronic product according to the embodiment of the present invention may be a mobile phone, a watch or other smart product, and the electronic product is mainly composed of a housing and the sensor of the above embodiment, and the housing 20 of the sensor is connected to the housing through an insulating layer 30. The shielding area on the housing 20 of the sensor is shielded, and then the insulating layer 30 is provided on the non-shielding area of ​​the housing 20, so as to effectively isolate the sensor from the housing of the electronic product, prevent the housing 20 of the sensor from directly contacting the housing of the electronic product, avoid the occurrence of galvanic corrosion, and prevent the electronic product from being damaged or failing.

[0070] Of course, for those skilled in the art, other structures and working principles of electronic products are understandable and achievable, and will not be described in detail in the present invention.

[0071] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A sensor, characterized in that: include: base(10); A housing (20), the housing (20) comprising a shielding area and a non-shielding area; An insulating layer (30), wherein the insulating layer (30) is arranged on the non-shielding area of ​​the shell (20); the shell (20) is arranged on the substrate (10) after removing the shielding member of the shielding area, so that the substrate (10) and the shell (20) are electrically connected; the shell (20) and the substrate (10) cooperate to define a receiving cavity; and the shell (20) can be connected to the outer shell of the electronic product through the insulating layer (30).

2. The sensor according to claim 1, characterized in that The shielding area is located at the bottom of the shell (20), and the shielding area of ​​the shell (20) is bonded and connected to the substrate (10) via a conductive adhesive (40).

3. The sensor according to claim 1, characterized in that The insulating layer (30) is deposited on the non-shielding area of ​​the shell (20) by means of physical vapor deposition or electrophoresis.

4. The sensor according to claim 1, characterized in that The insulating layer (30) is made of diamond or silicon carbide material.

5. The sensor according to claim 1, characterized in that A waterproof adhesive layer (50) is provided in the accommodating cavity.

6. The sensor according to claim 1, characterized in that A sealing ring (60) is provided on the outer periphery of the housing (20).

7. The sensor according to claim 1, characterized in that The substrate (10) is a circuit board, a chip (70) is provided on the circuit board, and the chip (70) is located in the accommodating cavity.

8. A method for preparing a sensor, used for preparing the sensor according to any one of claims 1 to 7, characterized in that: The preparation method comprises: A shielding area and a non-shielding area are provided on the outer surface of a housing (20) of the sensor; Depositing an insulating layer (30) at the non-shielded area of ​​the housing (20); The shielding area of ​​the shell (20) is arranged on the substrate (10) through a conductive adhesive (40) so that the shell (20) and the substrate (10) are electrically connected.

9. The method for preparing a sensor according to claim 8, characterized in that: Also includes: Cleaning the shell (20); After cleaning, dry at 50-90℃ for 0.5-1h.

10. An electronic product, characterized in that: include: shell; The sensor according to any one of claims 1 to 7, wherein the housing (20) of the sensor is connected to the casing via an insulating layer (30).

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