Equipment testing methods, electronic devices and storage media

Abstract

This application discloses a device testing method, electronic device, and storage medium, belonging to the field of testing technology. The method includes: performing aging tests on multiple target test items in response to a test start command; and powering on the power supply terminal of the SIM card interface during the aging test of the multiple target test items. This allows for prolonged power-on operation on the power supply terminal of the SIM card interface without increasing production line testing time, thereby stimulating potential defects in the target power supply circuit supplying power to the SIM card interface. After completing the aging test of the multiple target test items, a card identification test is performed with a SIM card connected to the SIM card interface to determine if there is a risk of failure in the target power supply circuit. This helps to intercept faulty devices with abnormal target power supply circuits and ensure the quality of the equipment leaving the factory.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a device testing method, electronic device, and storage medium. Background Technology

[0002] Currently, some defective mobile phones on the market cannot recognize Subscriber Identity Module (SIM) cards. These defective phones contain faulty chips related to the SIM card. The faulty parts of these chips are used to power the SIM card, and therefore, their failure affects the recognition of the SIM card, causing related malfunctions. Therefore, there is an urgent need for a device testing method to intercept these defective phones before they leave the factory. Summary of the Invention

[0003] This application provides a device testing method, electronic device, and storage medium that can determine whether the target power supply circuit supplying power to the power supply terminal of the SIM card interface is at risk of failure. This helps to intercept faulty devices with abnormal target power supply circuits and ensure the quality of devices leaving the factory. The technical solution is as follows:

[0004] Firstly, a device testing method is provided, applied to an electronic device including a SIM card interface. In this method, in response to a test start command, aging tests are performed on multiple target test items. During the aging tests of the multiple target test items, the power supply to the SIM card interface is powered on. After completing the aging tests of the multiple target test items, a card recognition test is performed with a SIM card connected to the SIM card interface.

[0005] During the aging test of electronic devices with multiple target test items, the power supply terminal of the SIM card interface is powered on. The purpose is to conduct an aging test on the target power supply circuit in the electronic device that supplies power to the power supply terminal of the SIM card interface.

[0006] In this application, the electronic device can undergo aging tests on multiple target test items simultaneously, including the target power supply circuit. This allows for prolonged power-on operation of the SIM card interface without increasing production line testing time, simulating real-world user scenarios and highlighting potential defects in the target power supply circuit. After completing the aging tests on multiple target test items, a card recognition test is performed with a SIM card connected to the SIM card interface. This determines whether the target power supply circuit is at risk of failure, helping to intercept faulty devices with abnormal target power supply circuits and ensuring the quality of the equipment before it leaves the factory.

[0007] Optionally, the SIM card interface is not connected to the SIM card during the aging test of multiple target test items.

[0008] In this application, the electronic device can power on the SIM card interface during aging tests of multiple target test items without inserting a SIM card. This allows for convenient and quick aging testing.

[0009] Optionally, the operation of aging test on multiple target test items can be: performing aging test on multiple target test items sequentially. Correspondingly, the operation of powering on the power terminal of the SIM card interface during the aging test of multiple target test items can be: for any one of the multiple target test items, powering on the power terminal of the SIM card interface at the start of the aging test of this target test item, and powering off the power terminal of the SIM card interface at the end of the aging test of this target test item.

[0010] In this application, the electronic device simultaneously powers on the power supply terminal of the SIM card interface during the aging test of this target test item, i.e., performs the aging test of the target power supply circuit in parallel, thus not increasing the testing time of the production line. Furthermore, the electronic device triggers the power-on and power-off of the SIM card interface terminal at the start and end of the aging test of this target test item, resulting in simple control logic and saving processing resources.

[0011] Optionally, for any one of the multiple target test items, the operation of powering on the SIM card interface at the start of the aging test of this target test item and powering off the SIM card interface at the end of the aging test of this target test item can be as follows: for any one of the multiple target test items, if the power supply test switch of this target test item is in the on state, then power on the SIM card interface at the start of the aging test of this target test item and power off the SIM card interface at the end of the aging test of this target test item.

[0012] The power supply test switch for any target test item indicates whether the aging test of the target power supply circuit should be performed in parallel during the aging test of this target test item. That is, if the power supply test switch for this target test item is in the ON state, the aging test of the target power supply circuit needs to be performed in parallel during the aging test of this target test item. If the power supply test switch for this target test item is in the OFF state, the aging test of the target power supply circuit does not need to be performed in parallel during the aging test of this target test item.

[0013] In this application, the aging test duration of the target power supply circuit is the sum of the aging test durations of all target test items with the power supply test switch in the on state. Thus, the aging test duration of the target power supply circuit can be flexibly adjusted by using the power supply test switch for each of the multiple target test items, thereby better meeting the aging test requirements of the target power supply circuit.

[0014] Optionally, in response to a test start command, before performing aging tests on multiple target test items, a test configuration interface can be displayed. This interface includes multiple test items and a power supply test switch for each of the multiple test items. In response to an operation to turn on the power supply test switch of any one of the multiple test items, the power supply test switch for that test item is switched to the on state.

[0015] In this application, users can flexibly turn the power supply test switch of each test item on or off in the test configuration interface, thereby flexibly adjusting the aging test duration of the target power supply circuit, and thus better meeting the aging test requirements of the target power supply circuit.

[0016] Furthermore, in response to the selection operation of any one of multiple test items, this test item can be identified as the target test item.

[0017] In this application, users can flexibly configure target test items in the test configuration interface, thereby better meeting the aging test requirements of electronic devices.

[0018] Optionally, the electronic device also includes a test application, a test service, and a test driver; the operation of powering on the power terminal of the SIM card interface at the start of the aging test of this target test item can be as follows: when the aging test of this target test item begins, the test application calls the test service to trigger the test driver to send a power-on command to the target chip. The power-on command is used to instruct the target chip to power on the power terminal of the SIM card interface.

[0019] Optionally, the operation of powering down the SIM card interface at the end of the aging test of this target test item can be as follows: when the aging test of this target test item ends, the test application triggers the test driver to send a power-down command to the target chip by calling the test service. The power-down command is used to instruct the target chip to power down the SIM card interface.

[0020] In this application, a long-term power-on stress test of the SIM interface power supply terminal can be implemented on the production line via software without increasing production line testing time. This can stimulate potential defects in the target power supply circuit, help intercept faulty equipment with abnormal target power supply circuits, and improve the quality of equipment leaving the factory.

[0021] Optionally, after performing a card recognition test with a SIM card connected to the SIM card interface, an alert message can be output if the SIM card cannot be recognized, indicating a card recognition failure so that the user can take timely action. For example, the user can perform fault interception, fault analysis, and fault repair to ensure the quality of the device upon delivery.

[0022] Secondly, a device testing apparatus is provided, which has the function of implementing the device testing method described in the first aspect. The device testing apparatus includes at least one module, which is used to implement the device testing method provided in the first aspect.

[0023] Thirdly, an electronic device is provided, comprising a processor and a memory. The memory stores programs that support the electronic device in executing the device testing method provided in the first aspect, and stores data related to implementing the device testing method described in the first aspect. The processor is configured to execute the programs stored in the memory. The electronic device may further include a communication bus for establishing a connection between the processor and the memory.

[0024] Fourthly, a computer-readable storage medium is provided, wherein instructions are stored therein, which, when executed on a computer, cause the computer to perform the device testing method described in the first aspect.

[0025] Fifthly, a computer program product containing instructions is provided, which, when run on a computer, causes the computer to perform the device testing method described in the first aspect.

[0026] The technical effects achieved by the second, third, fourth, and fifth aspects mentioned above are similar to those achieved by the corresponding technical means in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a device failure bathtub curve provided in an embodiment of this application;

[0028] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0029] Figure 3 This is a block diagram of a software system for an electronic device provided in an embodiment of this application;

[0030] Figure 4 This is a flowchart of a device testing method provided in an embodiment of this application;

[0031] Figure 5 This is a schematic diagram of a test configuration interface provided in an embodiment of this application;

[0032] Figure 6 This is a schematic diagram of a test configuration interface and a test parameter configuration interface provided in an embodiment of this application;

[0033] Figure 7 This is a schematic diagram of another test configuration interface provided in an embodiment of this application;

[0034] Figure 8 This is a schematic diagram of an aging test process provided in an embodiment of this application;

[0035] Figure 9 This is a schematic diagram of the structure of a device testing apparatus provided in an embodiment of this application. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0037] It should be understood that "multiple" as mentioned in this application refers to two or more. In the description of this application, unless otherwise stated, " / " indicates "or," for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist, for example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, to facilitate a clear description of the technical solutions of this application, the terms "first," "second," etc., are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first," "second," etc., do not limit the quantity or execution order, and that "first," "second," etc., do not necessarily imply differences.

[0038] The terms "one embodiment" or "some embodiments" used in this application mean that one or more embodiments of this application include the specific features, structures, or characteristics described in that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this application do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, the terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0039] The following describes the terms used in the embodiments of this application.

[0040] Stress testing: refers to a testing method that simulates real-world environments by designing various stress conditions in order to evaluate the reliability and performance of products or devices.

[0041] The application scenarios involved in the embodiments of this application are described below.

[0042] The production of electronic equipment involves complex manufacturing processes and the extensive use of components and materials. Both manufacturing defects and component defects can be categorized into obvious defects and latent defects. Both types of defects can cause electronic equipment to malfunction. Obvious defects are those that will become apparent before the electronic equipment is used. Latent defects are those that are not yet apparent before use but will quickly become apparent during operation. Typically, latent defects cannot be detected using conventional inspection methods. If components with latent defects are not inspected, they will manifest as malfunctions during the operation of the electronic equipment, leading to increased repair rates and higher maintenance costs.

[0043] Currently, some faulty devices on the market are unable to recognize SIM cards. These devices contain faulty chips related to the SIM card. For example, some chips may have short-circuited pins, or their electrostatic discharge (ESD) protection units may be burnt out. Other examples include short-circuited or open-circuited pins in near-field communication (NFC) chips, or burnt-out metal-oxide-semiconductor (MOS) transistors in the corresponding modules. These chip failures can affect the SIM card's power supply circuitry, thus hindering SIM card recognition.

[0044] Analysis revealed that these chips typically exhibit potential defects introduced during the manufacturing process of electronic devices. For example, damage to the internal protective components of the chip might occur due to static electricity on the production line. After the electronic device leaves the factory, these chips may malfunction after a period of user use, subsequently rendering the SIM card unrecognizable.

[0045] Currently, there is no stress testing for the power supply circuit (hereinafter referred to as the target power supply circuit) that powers the SIM card in these chips during the production process of electronic devices. As a result, faulty devices with abnormal target power supply circuits enter the market, leading to an increase in product return rates and a poor user experience.

[0046] Therefore, this application proposes a device testing method that, during the aging test of the basic functions of an electronic device, adds a stress test to the target power supply circuit of the electronic device, aiming to intercept faulty devices with abnormal target power supply circuits. The stress test of the target power supply circuit can also be called an aging test of the target power supply circuit, used to check the reliability of the target power supply circuit in the electronic device.

[0047] It should be noted that the target power supply circuit described in this application embodiment is a circuit used to power the SIM card. The target power supply circuit may include wires and components for transmitting electrical energy, as well as some related circuit protection components, etc., which are not limited in this application embodiment.

[0048] The equipment testing method provided in this application can be performed at the aging stage in the production line. The aging stage is used to perform aging tests. Specifically, the aging stage can apply stress to stimulate potential defects in electronic devices, causing early faults in electronic devices to be exposed in advance, reducing the defect rate of electronic devices, and ensuring the quality of a large number of electronic devices leaving the factory.

[0049] Figure 1 This is a schematic diagram of a device failure bathtub curve provided in an embodiment of this application. Since the failure rate curve of most devices over time resembles a bathtub, the failure rate curve is called a bathtub curve. Figure 1 As shown, the failure rate of the device over time can be roughly divided into the following three stages:

[0050] The first stage is the early failure period. In the initial stages of device use, the failure rate is relatively high, but it decreases rapidly over time. During this stage, device failures are mostly caused by defects in design, materials, and the manufacturing process.

[0051] The second stage is the period of accidental failure. After the device has been in use for a period of time, the failure rate can drop to a low level and basically stabilize. During this stage, the failure of the device is mainly caused by accidental factors.

[0052] The third stage is the wear-out failure period. After a considerable period of use, the device enters the wear-out failure period, characterized by a rapid increase in the failure rate over time. During this stage, device failure is primarily caused by wear factors such as aging, fatigue, abrasion, and corrosion.

[0053] Since early failures in the early failure period can be exposed relatively quickly after the device is put into use, aging tests can be performed before the device leaves the factory to intercept devices that fail early.

[0054] In this embodiment of the application, the aging process can simulate the actual usage scenario of the user, keeping the power supply end of the SIM card interface powered on for a long time to apply electrical stress to stimulate potential defects in the target power supply circuit, in order to intercept the target power supply circuit that fails due to electrostatic damage or other reasons, and ensure that the target power supply circuit in the electronic device leaving the factory has no risk of early failure, thereby ensuring that the electronic device leaving the factory can normally recognize the SIM card.

[0055] The electronic devices involved in the embodiments of this application will be described below.

[0056] The device testing method provided in this application can be applied to any electronic device capable of installing a SIM card. This electronic device can be a mobile phone, tablet computer, laptop computer, handheld computer, personal digital assistant (PDA), wearable device, smart screen, mobile internet device (MID), virtual reality (VR) device, augmented reality (AR) device, artificial intelligence (AI) audio, terminal in industrial control, terminal in self-driving, terminal in remote medical surgery, terminal in smart grid, terminal in transportation safety, terminal in smart city, terminal in smart home, etc. This application does not limit the application to these specific devices.

[0057] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. See also... Figure 2The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, a sensor module 180, buttons 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a SIM card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0058] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0059] Processor 110 may include one or more processing units, such as: application processor (AP), modem processor, graphics processing unit (GPU), image signal processor (ISP), controller, memory, video codec, digital signal processor (DSP), baseband processor, and / or neural network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.

[0060] The external storage interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor 110 through the external storage interface 120 to perform data storage functions, such as saving music, video, and other files on the external memory card.

[0061] Internal memory 121 can be used to store computer-executable program code, which includes instructions. Processor 110 executes various functional applications and data processing of electronic device 100 by running the instructions stored in internal memory 121. Internal memory 121 may include a program storage area and a data storage area. The program storage area may store the operating system, at least one application program required for a function, etc. The data storage area may store data created by electronic device 100 during use, etc. Furthermore, internal memory 121 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, universal flash storage (UFS), etc.

[0062] For example, the wireless communication function of electronic device 100 can be implemented by antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor, and baseband processor.

[0063] For example, electronic device 100 can implement display functions through GPU, display screen 194, and application processor, etc.

[0064] For example, electronic device 100 can perform shooting functions through ISP, camera 193, video codec, GPU, display 194 and application processor, etc.

[0065] For example, electronic device 100 can implement audio functions, such as music playback and recording, through audio module 170, speaker 170A, receiver 170B, microphone 170C, headphone jack 170D and application processor.

[0066] The SIM card interface 195 is used to connect a SIM card. The SIM card can be inserted into or removed from the SIM card interface 195 to make contact with and separate from the electronic device 100. The electronic device 100 can support one or N SIM card interfaces, where N is an integer greater than 1. The SIM card interface 195 can support Nano SIM cards, Micro SIM cards, SIM cards, etc. Multiple cards can be inserted into the same SIM card interface 195 simultaneously. The multiple cards can be of the same or different types. The SIM card interface 195 is also compatible with different types of SIM cards. The SIM card interface 195 is also compatible with external memory cards. The electronic device 100 interacts with the network through the SIM card to realize functions such as calls and data communication. In some embodiments, the electronic device 100 uses an eSIM, i.e., an embedded SIM card. The eSIM card can be embedded in the electronic device 100 and cannot be separated from the electronic device 100.

[0067] The software system of electronic device 100 will be described next.

[0068] The software system of electronic device 100 can adopt a layered architecture, event-driven architecture, microkernel architecture, microservice architecture, or cloud architecture. This application embodiment uses a layered Android system as an example to illustrate the software system of electronic device 100.

[0069] Figure 3 This is a block diagram of a software system for an electronic device 100 provided in an embodiment of this application. See also... Figure 3 A layered architecture divides software into several layers, each with a clear role and function. Layers communicate with each other through software interfaces. In some embodiments, the Android system is divided into an application layer, an application framework layer, the Android Runtime, a system layer, and a kernel layer.

[0070] The application layer can include a series of application packages. For example... Figure 3 As shown, the application package may include test applications, camera, gallery, calendar, call, map, navigation, Bluetooth, music, video, SMS, and other applications. Among them, the test applications can support aging tests on relevant components in electronic device 100.

[0071] The application framework layer provides application programming interfaces (APIs) and a programming framework for applications in the application layer. The application framework layer includes some predefined functions. For example... Figure 3As shown, the application framework layer can include a window manager, content providers, a view system, a phone manager, a resource manager, and a notification manager. The window manager manages window programs. It can obtain the screen size, determine if a status bar is present, lock the screen, and capture the screen. The content provider stores and retrieves data, making this data accessible to the application. This data can include videos, images, audio, made and received phone calls, browsing history and bookmarks, and phone books. The view system includes visual controls, such as controls for displaying text and controls for displaying images. The view system can be used to build the application's display interface, which can consist of one or more views, such as a view displaying SMS notification icons, a view displaying text, and a view displaying images. The phone manager provides communication functions for the electronic device 100, such as managing call status (including connection and disconnection). The resource manager provides the application with various resources, such as localized strings, icons, images, layout files, and video files. The notification manager allows the application to display notification information in the status bar, which can be used to convey informational messages and can disappear automatically after a short pause without user interaction. For example, the notification manager is used to notify users of download completions and message alerts. The notification manager can also display notifications as icons or scrolling text in the system's top status bar, such as notifications from background applications. Furthermore, the notification manager can appear as dialog boxes on the screen, such as displaying text messages in the status bar, emitting sounds, causing electronic devices to vibrate, or flashing indicator lights.

[0072] The Android Runtime comprises the core libraries and the virtual machine. The Android Runtime is responsible for the scheduling and management of the Android system. The core libraries consist of two parts: one part contains the functionalities that Java calls, and the other part is the core Android library itself. The application layer and application framework layer run in the virtual machine. The virtual machine executes the Java files of the application layer and application framework layer as binary files. The virtual machine is used to perform functions such as object lifecycle management, stack management, thread management, security and exception management, and garbage collection.

[0073] The system layer can include multiple functional modules, such as: a test service, a surface manager, media libraries, a 3D graphics processing library (such as OpenGL ES), and a 2D graphics engine (such as SGL). Test applications can call the test service through interfaces provided by the test service (such as the Java Native Interface (JNI)) to trigger aging tests on relevant devices. The surface manager manages the display subsystem and provides fusion of 2D and 3D layers for multiple applications. The media library supports playback and recording of various common audio and video formats, as well as still image files. The media library supports various audio and video encoding formats, such as MPEG4, H.264, MP3, AAC, AMR, JPG, and PNG. The 3D graphics processing library implements 3D graphics drawing, image rendering, compositing, and layer processing. The 2D graphics engine is the drawing engine for 2D graphics.

[0074] The kernel layer is the layer between hardware and software. It can include test drivers, display drivers, camera drivers, audio drivers, sensor drivers, etc. Among these, the test drivers can perform aging tests on relevant devices.

[0075] The device testing method provided in the embodiments of this application will be explained in detail below.

[0076] Figure 4 This is a flowchart of a device testing method provided in an embodiment of this application. This method can be applied to electronic devices, such as those described above. Figures 2 to 3 The electronic device 100 described in the embodiment. See also... Figure 4 The method includes the following steps.

[0077] Step 401: In response to the test start command, the electronic device performs aging tests on multiple target test items.

[0078] The test start command is used to instruct the commencement of aging testing. For example, the test start command may be triggered by a user within the electronic device, or it may be sent to the electronic device by another device; this embodiment of the application does not limit this.

[0079] The multiple target test items are all test items that require aging tests. For example, the multiple target test items can be test items for components in electronic devices (including but not limited to batteries, speakers, microphones, motors, cameras, sensors, etc.). For example, the multiple target test items may include battery test items, speaker test items, microphone test items, motor test items, camera test items, sensor test items, etc., and this application embodiment does not limit this.

[0080] In some embodiments, multiple target test items may be pre-set.

[0081] For example, the multiple target test items may be those that are set by default in the electronic device. Alternatively, the multiple target test items may be specified to the electronic device by other devices; for instance, other devices may send instruction messages to the electronic device to indicate multiple target test items that need to be subjected to aging tests.

[0082] In other embodiments, multiple target test items may be selected by the user on the electronic device before starting the test.

[0083] For example, the electronic device can display a test configuration interface, which may include multiple test items. The user can select the appropriate test item from this interface based on testing requirements. If the user selects any one of the multiple test items in the test configuration interface, the electronic device, in response to this selection, can designate that test item as the target test item.

[0084] In this way, users can flexibly configure target test items in the test configuration interface, thereby better meeting the aging test requirements of electronic devices.

[0085] For example, Figure 5 This is a schematic diagram of a test configuration interface 500 provided in an embodiment of this application. The test configuration interface 500 includes multiple test items 501. Users can click to select a test item 501 from among the multiple test items 501, such as... Figure 5 As shown, users can click to select battery test item 501, speaker test item 501, and sensor test item 501. The electronic device can use the user-selected test item 501 as the target test item.

[0086] Optionally, the electronic device may store test parameters corresponding to each of the multiple test items, and these test parameters may include the number of aging tests, the duration of the aging test, etc.

[0087] In some cases, the test parameters for any test item can be the default settings in the electronic device. In other cases, the test parameters for any test item can be set by the user in the electronic device.

[0088] For example, the user in Figure 6 In the test configuration interface 500 shown in Figure (a), after clicking a test item 501, the electronic device can display... Figure 6Figure (b) shows the test parameter configuration interface 600 for test item 501. Users can set the test parameters for test item 501 in the test parameter configuration interface 600, such as setting the number of aging tests to 50 and the aging test duration to 2 hours.

[0089] Optionally, such as Figure 5 or Figure 6 As shown, the test configuration interface 500 may also include a start test control 502. Users can trigger a test start command by operating (including but not limited to clicking) the start test control 502. In response to this test start command, the electronic device can perform aging tests on each target test item according to the test parameters of each of the multiple target test items selected by the user.

[0090] When electronic devices undergo aging tests on multiple target test items, the aging tests can be performed sequentially on the multiple target test items. That is, the aging test on one target test item is completed before the aging test on the next target test item is performed.

[0091] For example, aging tests for any given test item typically require multiple test tasks. Electronic devices can be placed in different test environments (with varying temperatures, humidity levels, durations, or number of tests) to perform the corresponding test tasks. A specific test task simulates the tasks that the device corresponding to that test item needs to perform during actual user use.

[0092] The operation of aging test of electronic device on any target test item is similar to the operation of aging test of one device on one test item in related technologies, and will not be described in detail in the embodiments of this application.

[0093] It should be noted that after performing an aging test on any target test item, the electronic device can obtain the test result for that target test item. Optionally, the test result of this target test item can be used to indicate the degree of aging of that target test item.

[0094] Step 402: Power on the SIM card interface during the aging test of the electronic device for multiple target test items.

[0095] A SIM card interface is an interface used to enable communication between an electronic device and a SIM card. The SIM card interface is used to connect a SIM card. For example, a SIM card interface may include a SIM card holder, etc.

[0096] In this embodiment of the application, the electronic device powers on the power supply terminal of the SIM card interface in order to perform an aging test on the target power supply circuit in the electronic device used to power the power supply terminal of the SIM card interface.

[0097] In this embodiment, the electronic device can perform aging tests on the target power supply circuit while simultaneously conducting aging tests on multiple target test items. This allows for prolonged power-on operation of the SIM card interface without increasing production line testing time, simulating actual user scenarios, stimulating potential defects in the target power supply circuit, and thus helping to intercept target power supply circuits at risk of failure.

[0098] Optionally, the SIM card interface can be unconnected during aging tests of multiple target test items. That is, the electronic device can be powered on at the SIM card interface without a SIM card inserted during the aging tests of multiple target test items. This allows for convenient and quick aging tests.

[0099] In some embodiments, step 402 may be performed by: the electronic device powering on the power terminal of the SIM card interface at the start of the aging test of multiple target test items, and powering off the power terminal of the SIM card interface at the end of the aging test of multiple target test items.

[0100] In other words, the SIM card interface is powered on at the start of the aging test for the first of the multiple target test items. Power to the SIM card interface is maintained throughout the aging test for each of the multiple target test items. Power to the SIM card interface is de-powered at the end of the aging test for the last of the multiple target test items.

[0101] In this way, the electronic device performs a continuous power-on on the SIM card interface in parallel while aging tests are conducted on multiple target test items as a whole. This means that the target power supply circuit is aged in parallel, thus not increasing the production line's testing time. Furthermore, the electronic device triggers the power-on and power-off of the SIM card interface at the start and end of the overall aging test of multiple target test items, resulting in simple control logic and saving processing resources.

[0102] In some other embodiments, step 402 may be performed as follows: for any one of the multiple target test items, the electronic device powers on the power supply terminal of the SIM card interface when the aging test of the target test item begins, and powers off the power supply terminal of the SIM card interface when the aging test of the target test item ends.

[0103] In this way, the electronic device simultaneously powers on the SIM card interface while performing aging tests on this target test item, thus performing aging tests on the target power supply circuit in parallel without increasing the production line's testing time. Furthermore, the electronic device triggers the power-on and power-off of the SIM card interface at the start and end of the aging test for this target test item, resulting in simple control logic and saving processing resources.

[0104] In one possible approach, the electronic device can simultaneously apply a continuous power supply to the power terminal of the SIM card interface while performing aging tests on each of the multiple target test items.

[0105] In this case, the aging test duration of the target power supply circuit is the sum of the aging test durations of multiple target test items. This allows for long-term aging tests of the target power supply circuit without increasing production line testing time, which helps to expose potential defects in the target power supply circuit.

[0106] In another possible approach, the electronic device can simultaneously power on the SIM card interface while aging tests are performed on a subset of the target test items, but not power on the SIM card interface while aging tests are performed on the other subset of target test items.

[0107] For example, each of the multiple target test items has a corresponding power supply test switch. The power supply test switch for any target test item indicates whether to perform a concurrent aging test on the target power supply circuit during the aging test of that target test item. That is, if the power supply test switch for that target test item is in the ON state, then a concurrent aging test on the target power supply circuit needs to be performed during the aging test of that target test item. If the power supply test switch for that target test item is in the OFF state, then a concurrent aging test on the target power supply circuit does not need to be performed during the aging test of that target test item.

[0108] For any one of the multiple target test items, if the power supply test switch for that target test item is in the ON state, the electronic device can power on the SIM card interface at the start of the aging test for that target test item and power off the SIM card interface at the end of the aging test for that target test item. If the power supply test switch for that target test item is in the OFF state, the electronic device will only perform the aging test for that target test item, without performing the power-on and power-off operations on the SIM card interface.

[0109] In this case, the aging test duration of the target power supply circuit is the sum of the aging test durations of all target test items with the power supply test switch in the on state. Thus, the aging test duration of the target power supply circuit can be flexibly adjusted by controlling the power supply test switch of each of the multiple target test items, thereby better meeting the aging test requirements of the target power supply circuit.

[0110] Optionally, the state of the power supply test switch for each of the multiple target test items can be preset.

[0111] For example, the state of the power supply test switch for each of the multiple target test items can be a default setting in the electronic device. Alternatively, the state of the power supply test switch for each of the multiple target test items can be specified to the electronic device by another device; for example, the other device can send an indication message to the electronic device to indicate the state of the power supply test switch for each of the multiple target test items.

[0112] Optionally, the state of the power supply test switch for each of the multiple target test items can be set by the user in the electronic device before starting the test.

[0113] As an example, the power supply test switch for each of the multiple test items can be displayed in the test configuration interface.

[0114] Specifically, the electronic device can display a test configuration interface, which may include multiple test items and a power supply test switch for each test item. Users can turn the power supply test switch of the corresponding test item on or off in this test configuration interface according to their testing needs. If the user triggers an operation to turn on the power supply test switch of any one of the multiple test items in the test configuration interface, the electronic device will respond by switching the power supply test switch of that test item to the on state. Conversely, if the user triggers an operation to turn off the power supply test switch of any one of the multiple test items in the test configuration interface, the electronic device will respond by switching the power supply test switch of that test item to the off state.

[0115] In this way, users can flexibly turn the power supply test switch of each test item on or off in the test configuration interface, thereby flexibly adjusting the aging test duration of the target power supply circuit and better meeting the aging test requirements of the target power supply circuit.

[0116] for example, Figure 7This is a schematic diagram of a test configuration interface 700 provided in an embodiment of this application. The test configuration interface 700 includes multiple test items 701 and a power supply test switch 703 for each test item 701. Users can turn the power supply test switches 703 of each test item 701 on or off. When a user turns on the power supply test switch 703 of any test item 701, the electronic device can switch the power supply test switch 703 of that test item 701 to the on state. When a user turns off the power supply test switch 703 of any test item 701, the electronic device can switch the power supply test switch 703 of that test item 701 to the off state.

[0117] As another example, the power supply test switch for any one of the multiple test items can be displayed in the test parameter configuration interface for that test item.

[0118] Specifically, the electronic device can display a test parameter configuration interface for any test item, which may include a power supply test switch. The user can turn the power supply test switch on or off in this interface according to testing requirements. If the user triggers an on operation to turn the power supply test switch on in the interface, the electronic device will respond by switching the power supply test switch for that test item to the on state. Conversely, if the user triggers a off operation to turn the power supply test switch off in the interface, the electronic device will respond by switching the power supply test switch for that test item to the off state.

[0119] For example, the user in Figure 6 In the test configuration interface 500 shown in Figure (a), after clicking a test item 501, the electronic device can display... Figure 6 Figure (b) shows the test parameter configuration interface 600 for test item 501, which includes a power supply test switch 601. When the user turns on the power supply test switch 601, the electronic device can switch the power supply test switch 601 for test item 501 to the on state. When the user turns off the power supply test switch 601, the electronic device can switch the power supply test switch 601 for test item 501 to the off state.

[0120] Step 403: After the electronic device completes the aging test for multiple target test items, it performs a card recognition test with a SIM card connected to the SIM card interface.

[0121] After completing aging tests on multiple target test items, the electronic device can obtain the test results for each of the multiple target test items. Simultaneously, the electronic device also completes the aging test on the target power supply circuit. Afterwards, to obtain the test results for the target power supply circuit, a SIM card can be inserted into the electronic device, that is, the SIM card is connected to the SIM card interface, and then the electronic device is run normally to perform a card recognition test, i.e., to test whether the electronic device can recognize the inserted SIM card.

[0122] If the electronic device can recognize the inserted SIM card, it means that the target power supply circuit has not been triggered to have any potential defects after the aforementioned aging test. Therefore, it can be determined that the target power supply circuit has no risk of failure, and thus the test result of the target power supply circuit can be determined as a pass.

[0123] If the electronic device cannot recognize the inserted SIM card, it indicates that the target power supply circuit has been exposed to potential defects after the aforementioned aging test. Therefore, it can be determined that the target power supply circuit is at risk of failure, and the test result of the target power supply circuit is that the test failed.

[0124] In some embodiments, if the electronic device cannot recognize the inserted SIM card, it can output a reminder message. This reminder message is used to alert the user of a card recognition failure so that the user can take timely action. For example, the user can perform fault interception, fault analysis, and fault repair to ensure the device's factory quality.

[0125] In this embodiment, in response to a test start command, the electronic device performs aging tests on multiple target test items. During the aging tests of these target test items, the power supply terminal of the SIM card interface is powered on. This allows for prolonged power-on operation of the SIM card interface without increasing production line testing time, thereby stimulating potential defects in the target power supply circuit supplying power to the SIM card interface. After completing the aging tests of the multiple target test items, a card identification test is performed with a SIM card connected to the SIM card interface to determine if the target power supply circuit has a failure risk. This helps to intercept faulty devices with abnormal target power supply circuits, ensuring the quality of the equipment before it leaves the factory.

[0126] In some embodiments, such as Figure 3 As shown, the software system of an electronic device includes test applications, test services, and test drivers. The following section will combine... Figure 3 The software system of the electronic device shown is used to illustrate the above-mentioned device testing method. For example, the method includes the following steps (1) to (3).

[0127] It should be noted that the electronic device can perform the aging test process described in steps (1) and (2) below without inserting a SIM card.

[0128] (1) The test application displays the test configuration interface.

[0129] For example, the test configuration interface can be Figure 6 or Figure 7 The test configuration interface is shown. Users can select multiple target test items and activate the power supply test switch for at least one of the target test items in this interface. Optionally, users can also manipulate the start test control in the test configuration interface to trigger a test start command, instructing the test application to begin aging tests.

[0130] (2) After the test application detects the test start command in the test configuration interface, it performs aging tests on multiple target test items in sequence.

[0131] In this case, the test application can perform steps A to F while aging testing any target test item.

[0132] Step A: If the power supply test switch for this target test item is in the ON state, the test application will call the test service to power on the SIM card interface when the aging test of this target test item begins.

[0133] Step B: In response to the call request from the test application, the test service calls the test driver to power on the power supply of the SIM card interface.

[0134] Step C: In response to the call request of the test service, the test driver sends a power-on command to the target chip to power on the power supply terminal of the SIM card interface.

[0135] The target chip is used to supply power to the power supply terminal of the SIM card interface, and includes a target power supply circuit. The test driver can send a power-on command to the target chip, which instructs the target chip to power on the power supply terminal of the SIM card interface. After receiving the power-on command, the target chip can power on the power supply terminal of the SIM card interface through the target power supply circuit.

[0136] Step D: When the aging test of this target test item ends, the test application calls the test service to power down the power supply of the SIM card interface.

[0137] Step E: In response to the call request from the test application, the test service calls the test driver to power down the power supply of the SIM card interface.

[0138] Step F: In response to the call request of the test service, the test driver sends a power-down command to the target chip to power down the power supply of the SIM card interface.

[0139] This power-down command instructs the target chip to power down the SIM card interface. Upon receiving this command, the target chip can stop supplying power to the SIM card interface through the target power supply circuit, thereby powering down the SIM card interface.

[0140] For example, Figure 8 This is a schematic diagram of an aging test process provided in an embodiment of this application. See also... Figure 8 Aging tests are performed sequentially on N target test items. During the aging test of the N target test items, one or more target test items (such as...) can be... Figure 8 During the aging tests of target test items 1 and 2 shown, a continuous power-on operation is performed on the power supply terminal of the SIM card interface in parallel. That is, the power supply terminal of the SIM card interface is powered on at the beginning of the aging test of a certain target test item, and powered off at the end of the aging test of that target test item. In this way, the continuous power-on operation on the power supply terminal of the SIM interface is kept in parallel with the original aging test operation of the target test item, so as not to add extra test time.

[0141] It should be noted that after completing the aging test for multiple target test items, a SIM card can be inserted into the electronic device for subsequent card recognition testing.

[0142] (3) Test the application to perform card recognition test to determine whether the target power supply circuit is at risk of failure.

[0143] If the SIM card is successfully recognized, it can be determined that the target power supply circuit is not at risk of failure. If the SIM card fails to be recognized, it can be determined that the target power supply circuit is at risk of failure, and it is necessary to intercept the target power supply circuit.

[0144] In this embodiment, a long-term power-on stress test of the SIM interface power supply terminal can be implemented on the production line via software without increasing production line testing time. This can stimulate potential defects in the target power supply circuit, help intercept faulty equipment with abnormal target power supply circuits, and improve the quality of equipment leaving the factory.

[0145] Figure 9 This is a schematic diagram of a device testing apparatus provided in an embodiment of this application. The apparatus can be implemented as part or all of an electronic device by software, hardware, or a combination of both. The electronic device includes a SIM card interface and can be described above. Figures 2 to 3 The electronic device 100 described in the embodiment. See also... Figure 9 The device includes: an aging test module 901, a power-on module 902, and a card recognition test module 903.

[0146] Aging test module 901 is used to perform the above... Figure 4 Step 401 in the embodiment;

[0147] Power-on module 902 is used to execute the above. Figure 4 Step 402 in the embodiment;

[0148] Card recognition test module 903 is used to perform the above... Figure 4 Step 403 in the embodiment.

[0149] Optionally, the SIM card interface is not connected to the SIM card during the aging test of multiple target test items.

[0150] Optionally, the aging test module 901 is used for:

[0151] Aging tests were performed sequentially on multiple target test items;

[0152] Optionally, the power-on module 902 is used for:

[0153] For any one of the multiple target test items, power is applied to the SIM card interface at the start of the aging test for that target test item, and power is de-energized to the SIM card interface at the end of the aging test for that target test item.

[0154] Optionally, the power-on module 902 is used for:

[0155] For any one of the multiple target test items, if the power supply test switch of this target test item is in the on state, the power supply terminal of the SIM card interface is powered on when the aging test of this target test item begins, and the power supply terminal of the SIM card interface is powered off when the aging test of this target test item ends.

[0156] Optionally, the device further includes:

[0157] The display module is used to display the test configuration interface, which includes multiple test items and the power supply test switch for each of the multiple test items.

[0158] The activation module is used to switch the power supply test switch of any one of the multiple test items to the on state in response to the activation operation of the power supply test switch of that test item.

[0159] Optionally, the device further includes:

[0160] The determination module is used to determine the target test item in response to the selection operation of any one of a plurality of test items.

[0161] Optionally, the device further includes:

[0162] The reminder module is used to output a reminder message if the SIM card cannot be recognized, so as to indicate that a card recognition failure has occurred.

[0163] In this embodiment, in response to a test start command, aging tests are performed on multiple target test items. During the aging tests of these target test items, the power supply terminal of the SIM card interface is powered on. This allows for prolonged power-on operation of the SIM card interface's power supply terminal without increasing production line testing time, thereby stimulating potential defects in the target power supply circuit supplying power to the SIM card interface. After completing the aging tests of the multiple target test items, a card identification test is performed with a SIM card connected to the SIM card interface to determine if the target power supply circuit has a failure risk. This helps to intercept faulty devices with abnormal target power supply circuits, ensuring the quality of the equipment before it leaves the factory.

[0164] It should be noted that the device testing apparatus provided in the above embodiments is only illustrated by the division of the above functional modules during device testing. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0165] The functional units and modules in the above embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of the embodiments of this application.

[0166] The equipment testing apparatus and equipment testing method embodiments provided in the above embodiments belong to the same concept. The specific working process and technical effects of the units and modules in the above embodiments can be found in the method embodiment section, and will not be repeated here.

[0167] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. The computer program product includes one or more computer instructions. When the computer instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line, DSL) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer, or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., Digital Versatile Discs (DVDs)), or semiconductor media (e.g., Solid State Disks (SSDs)).

[0168] The above-described embodiments are optional embodiments provided by this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the technical scope disclosed in this application should be included within the protection scope of this application.

Claims

1. A device testing method, characterized in that, Applied to an electronic device, the electronic device including a SIM card interface, the method includes: In response to a test start command, aging tests are performed on multiple target test items, all of which are test items for devices in the electronic device; During the aging test of the multiple target test items, the power supply terminal of the SIM card interface is powered on to perform an aging test on the target power supply circuit, which is the circuit in the electronic device used to supply power to the power supply terminal of the SIM card interface. After completing the aging test of the multiple target test items, a card recognition test is performed with a SIM card connected to the SIM card interface.

2. The method as described in claim 1, characterized in that, During the aging test of the multiple target test items, the SIM card interface was not connected to a SIM card.

3. The method as described in claim 1, characterized in that, The aging test performed on multiple target test items includes: Aging tests are performed sequentially on the multiple target test items; The step of powering on the power supply terminal of the SIM card interface during the aging test of the multiple target test items includes: For any one of the plurality of target test items, the power supply terminal of the SIM card interface is powered on when the aging test of the target test item begins, and powered off when the aging test of the target test item ends.

4. The method as described in claim 3, characterized in that, The step of powering on the SIM card interface at the start of the aging test for any one of the plurality of target test items and powering off the SIM card interface at the end of the aging test for that target test item includes: For any one of the multiple target test items, if the power supply test switch of the target test item is in the on state, the power supply terminal of the SIM card interface is powered on when the aging test of the target test item begins, and the power supply terminal of the SIM card interface is powered off when the aging test of the target test item ends.

5. The method as described in claim 4, characterized in that, Before performing aging tests on multiple target test items in response to the test start command, the method further includes: The test configuration interface is displayed, which includes multiple test items and a power supply test switch for each of the multiple test items; In response to the activation operation of the power supply test switch of any one of the plurality of test items, the power supply test switch of the test item is switched to the on state.

6. The method as described in claim 5, characterized in that, After displaying the test configuration interface, it also includes: In response to the selection operation of any one of the plurality of test items, the one test item is determined as the target test item.

7. The method as described in any one of claims 3 to 6, characterized in that, The electronic device further includes a test application, a test service, and a test driver; the step of powering on the power supply terminal of the SIM card interface at the start of the aging test of the target test item includes: When the aging test of a target test item begins, the test application calls the test service to trigger the test driver to send a power-on command to the target chip. The power-on command is used to instruct the target chip to power on the power terminal of the SIM card interface.

8. The method as described in any one of claims 3 to 6, characterized in that, The electronic device further includes a test application, a test service, and a test driver; the step of powering down the SIM card interface at the end of the aging test of the target test item includes: When the aging test of a target test item ends, the test application calls the test service to trigger the test driver to send a power-down command to the target chip. The power-down command is used to instruct the target chip to power down the power supply terminal of the SIM card interface.

9. The method according to any one of claims 1 to 6, characterized in that, After performing the card recognition test with a SIM card connected to the SIM card interface, the method further includes: If the SIM card cannot be recognized, a notification message will be output to indicate a card recognition failure.

10. An electronic device, characterized in that, The electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the method as described in any one of claims 1 to 9.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions that, when executed on a computer, cause the computer to perform the method as described in any one of claims 1 to 9.

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