Light-emitting substrate, backlight module and display device

Abstract

The application discloses a light-emitting substrate, a backlight module and a display device, and belongs to the technical field of display. The light-emitting substrate provided by the application comprises a back plate, a driving circuit layer and a plurality of light-emitting units. The light-emitting unit comprises a reflecting layer, a paving layer and a light-emitting chip. Since the light-emitting surface of the light-emitting chip faces the reflecting layer, the light emitted by the light-emitting chip is first transmitted to one side of the back plate, and then is reflected by the reflecting layer arranged on the inner wall of the counterbore on the back plate, so that the path of the light emitted by the light-emitting chip is prolonged. In this way, after the light-emitting substrate is integrated in the backlight module, the distance between the light-emitting substrate and the diffusion plate in the backlight module does not need to be increased, the backlight module can have a better light mixing effect, and the overall thickness of the backlight module is relatively low.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a light-emitting substrate, a backlight module, and a display device. Background Technology

[0002] A liquid crystal display (LCD) is a flat, ultra-thin display device that typically includes a liquid crystal display panel and a backlight module. The backlight module provides a light source for the liquid crystal display panel. The backlight module typically includes a housing, and a light-emitting substrate and a diffuser plate mounted within the housing. The diffuser plate is located on the light-emitting side of the light-emitting substrate.

[0003] The light-emitting substrate includes a backplate and multiple light-emitting chips located on one side of the backplate, with the light-emitting surface of each chip facing away from the backplate. That is, the light-emitting surface of each chip can face a diffuser plate. Since the light emitted from each light-emitting chip in the light-emitting substrate needs to travel a certain distance to achieve effective light mixing, the distance between the diffuser plate and the light-emitting substrate is usually referred to as the mixing distance.

[0004] To ensure high uniformity of brightness from the backlight module and improve LCD display performance, the mixing distance between the diffuser and the light-emitting substrate is typically increased. However, increasing the mixing distance leads to an increase in the thickness of the backlight module, resulting in a significant increase in the overall thickness of the LCD. Summary of the Invention

[0005] This application provides a light-emitting substrate, a backlight module, and a display device, which can solve the problem of poor light mixing performance of existing light-emitting substrates. The technical solution is as follows:

[0006] On the one hand, a light-emitting substrate is provided, the light-emitting substrate comprising: a back plate, a driving circuit layer and a plurality of light-emitting units;

[0007] The back plate has multiple countersunk holes on one side;

[0008] The drive circuit layer is located on the side of the back plate with the countersunk hole, and the orthographic projection of the drive circuit layer on the back plate does not coincide with the area where the countersunk hole is located.

[0009] The plurality of light-emitting units are all located on the side of the back plate with the countersunk holes, and the plurality of light-emitting units correspond to the plurality of countersunk holes; the light-emitting unit includes: a reflective layer, a padding layer and a light-emitting chip;

[0010] In this configuration, the reflective layer in the light-emitting unit is attached to the inner wall of the corresponding countersunk hole; the padding layer in the light-emitting unit at least partially fills the corresponding countersunk hole; the light-emitting chip in the light-emitting unit is located on the side of the padding layer away from the back plate, and the light-emitting surface of the light-emitting chip faces the reflective layer; the light-emitting chip is electrically connected to the driving circuit layer.

[0011] Optionally, the orthographic projection of the light-emitting chip in the light-emitting unit onto the back plate is located within the area where the corresponding countersunk hole is located.

[0012] Optionally, the inner wall surface of the countersunk hole is an arc-shaped concave surface.

[0013] Optionally, a portion of the bedding layer fills the countersink, while another portion of the bedding layer is located outside the countersink;

[0014] The side of the padding layer facing away from the back plate is parallel to the back plate, and the side of the padding layer facing away from the back plate is bonded to the light-emitting surface of the light-emitting chip.

[0015] Optionally, the underlayment has a positioning groove on the side facing away from the back plate, and the bottom surface of the positioning groove is parallel to the back plate;

[0016] A portion of the light-emitting chip is located within the positioning groove.

[0017] Optionally, the light-emitting substrate further includes an encapsulation layer, which is located on the side of the plurality of light-emitting units facing away from the back plate, and the encapsulation layer covers the plurality of light-emitting units.

[0018] Optionally, the encapsulation layer includes: a plurality of separately disposed encapsulation units, the plurality of encapsulation units corresponding to the plurality of light-emitting units, and the encapsulation units encapsulating the corresponding light-emitting units.

[0019] Optionally, the side of the packaging unit facing away from the backplate has an arc-shaped convex surface.

[0020] Optionally, the encapsulation unit directly contacts the area of ​​the padding layer on the side opposite to the backplate where the light-emitting chip is not disposed;

[0021] Wherein, the refractive index of the encapsulation layer is greater than the refractive index of the padding layer, or the refractive index of the encapsulation layer is less than the refractive index of the padding layer.

[0022] Optionally, the drive circuit layer has a plurality of first cutout areas, the plurality of first cutout areas corresponding to the plurality of countersunk holes, and the area where the countersunk holes are located is within the orthographic projection of the corresponding first cutout area on the back plate;

[0023] The light-emitting substrate further includes: a first electrode and a second electrode distributed in the first hollow area, wherein the first electrode and the second electrode are both electrically connected to the driving circuit layer.

[0024] The light-emitting chip has a first solder foot and a second solder foot on the side opposite to the padding layer. The first solder foot is electrically connected to the first electrode, and the second solder foot is electrically connected to the second electrode.

[0025] Optionally, when the light-emitting substrate includes multiple encapsulation units, the multiple encapsulation units correspond to the multiple first cutout areas, and the encapsulation units encapsulate the first electrode and the second electrode within the corresponding first cutout area.

[0026] Optionally, the light-emitting substrate further includes: a first connecting lead and a second connecting lead, wherein the first solder pad is electrically connected to the first electrode through the first connecting lead, and the second solder pad is electrically connected to the second electrode through the second connecting lead.

[0027] Optionally, the light-emitting substrate further includes: a reflective ink layer, the reflective ink layer being located on the side of the driving circuit layer away from the back plate, the reflective ink layer having a plurality of second cutout areas, the plurality of second cutout areas corresponding to the plurality of first cutout areas, the orthographic projection of the first cutout area on the back plate being located within the orthographic projection of the corresponding second cutout area on the back plate.

[0028] On the other hand, a backlight module is provided, the backlight module comprising: a housing, and a light-emitting substrate mounted in the housing, the light-emitting substrate being any of the light-emitting substrates described above.

[0029] In another aspect, a display device is provided, the display device comprising: a liquid crystal display panel and a backlight module, wherein the backlight module is the backlight module described above.

[0030] The beneficial effects of the technical solutions provided in this application include at least the following:

[0031] Because the light-emitting surface of the LED faces the reflective layer, the light emitted from the LED is first transmitted to one side of the backplate, and then reflected by the reflective layer on the inner wall of the recessed hole on the backplate, thus extending the path of the light emitted from the LED. In this way, by integrating this LED substrate into the backlight module, it is not necessary to increase the distance between the LED substrate and the diffuser plate in the backlight module, ensuring a good light mixing effect for the backlight module and resulting in a lower overall thickness of the backlight module. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a top view schematic diagram of a light-emitting substrate provided in this application;

[0034] Figure 2 yes Figure 1 A schematic diagram of a film structure of a light-emitting substrate at AA' is shown;

[0035] Figure 3 This is a top view of a single light-emitting unit provided in an embodiment of this application;

[0036] Figure 4 yes Figure 3 A schematic diagram of a film structure for a light-emitting unit at BB' is shown;

[0037] Figure 5 This is a schematic diagram of the optical path in a light-emitting unit provided in this application;

[0038] Figure 6 This is a schematic diagram of the optical path in another light-emitting unit provided in this application;

[0039] Figure 7 yes Figure 1 A schematic diagram of the partial film structure of the light-emitting substrate at AA' is shown;

[0040] Figure 8 This is a schematic diagram of the optical path in another type of light-emitting unit provided in this application;

[0041] Figure 9 This is a schematic diagram of the optical path in another type of light-emitting unit provided in this application;

[0042] Figure 10 yes Figure 1 A schematic diagram of another film structure of the light-emitting substrate at AA' is shown;

[0043] Figure 11 This is a structural schematic diagram of a backlight module provided in this application. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0045] Please refer to Figure 1 and Figure 2 , Figure 1 This is a top view schematic diagram of a light-emitting substrate provided in this application. Figure 2 yes Figure 1 The diagram shows a film structure of a light-emitting substrate at AA'. The light-emitting substrate 000 may include: a backplate 100, a driving circuit layer 200, and a plurality of light-emitting units 300.

[0046] The back plate 100 has multiple countersunk holes 101 on one side.

[0047] The drive circuit layer 200 is located on the side of the back plate 100 with the countersunk hole 101, and the orthographic projection of the drive circuit layer 200 on the back plate 100 does not coincide with the area where the countersunk hole 101 is located.

[0048] Multiple light-emitting units 300 are located on the side of the back plate 100 with countersunk holes 101, and the multiple light-emitting units 300 correspond to the multiple countersunk holes 101. For example, as shown... Figure 1 and Figure 2 As shown, multiple light-emitting units 300 are arrayed on one side of the back plate 100 with countersunk holes 101, and each light-emitting unit 300 corresponds one-to-one with a countersunk hole 101. Here, the orthographic projection of each light-emitting unit 300 on the back plate 100 can overlap with the corresponding countersunk hole 101.

[0049] The light-emitting unit 300 may include a reflective layer 301, a padding layer 302, and a light-emitting chip 303. The reflective layer 301 of the light-emitting unit 300 is attached to the inner wall of the corresponding countersunk hole 101; the padding layer 302 of the light-emitting unit 300 at least partially fills the corresponding countersunk hole 101; the light-emitting chip 303 of the light-emitting unit 300 is located on the side of the padding layer 302 facing away from the backplate 100, and the light-emitting surface of the light-emitting chip 303 faces the reflective layer 301; the light-emitting chip 303 can be electrically connected to the driving circuit layer 200. Here, the driving circuit layer 200 in the light-emitting substrate 000 can drive the light-emitting chip 303 to emit light.

[0050] In this embodiment, under the driving action of the driving circuit layer 200, the light-emitting chip 303 can emit light in the direction toward the backplate 100. After passing through the padding layer 302, the light can be reflected by the reflective layer 301 disposed on the inner wall of the countersunk hole 101, so that the reflected light can pass through the padding layer 302 and be emitted away from the backplate 100. It should be noted that the material of the padding layer 302 in the light-emitting unit 300 can be a transparent organic material to ensure that the light emitted from the light-emitting surface of the light-emitting chip 303 and the light reflected by the reflective layer 301 can pass through the padding layer 302 normally.

[0051] Here, the light emitted from the light-emitting chip 303 is first transmitted to one side of the backplate 100, and then reflected by the reflective layer 301 disposed on the inner wall of the countersunk hole 101 on the backplate 100, which can extend the path of the light emitted from the light-emitting chip 303. In this way, after integrating this light-emitting substrate 000 into the backlight module, it is not necessary to increase the distance between the light-emitting substrate 000 and the diffuser plate in the backlight module, so as to ensure that the backlight module has a good light mixing effect and the overall thickness of the backlight module is low.

[0052] In summary, the light-emitting substrate provided in this application includes a backplane, a driving circuit layer, and multiple light-emitting units. Each light-emitting unit includes a reflective layer, a padding layer, and a light-emitting chip. Since the light-emitting surface of the light-emitting chip faces the reflective layer, the light emitted from the chip first travels to one side of the backplane and is then reflected by the reflective layer disposed on the inner wall of the recessed aperture on the backplane, thus extending the path of the light emitted from the chip. Therefore, by integrating this light-emitting substrate into the backlight module, it is not necessary to increase the distance between the light-emitting substrate and the diffuser plate in the backlight module to ensure a good light mixing effect in the backlight module, resulting in a lower overall thickness of the backlight module.

[0053] In the embodiments of this application, please refer to Figure 3 , Figure 3 This is a top view of a single light-emitting unit provided in an embodiment of this application. Figure 4 yes Figure 3 The diagram shows a film structure of the light-emitting unit at BB'. The orthographic projection of the light-emitting chip 303 in the light-emitting unit 300 onto the back plate 100 is located in the area where the corresponding countersunk hole 101 is located. In this case, it can be ensured that more of the light emitted by the light-emitting chip 303 can be reflected by the reflective layer 301 attached to the inner wall of the countersunk hole 101, thereby improving the utilization rate of light.

[0054] The inner wall surface of the countersunk hole 101 can be a concave arc surface. Correspondingly, the reflective layer 301 attached to the inner wall of the countersunk hole 101 is also a concave arc surface. For incident light at different angles, the reflective layer 301 can adjust its exit angle, optimizing the range of the light emission angle of the light-emitting unit 300. When the inner wall surface of the countersunk hole 101 is a concave arc surface, the optical axis M of the light-emitting chip 303 can coincide with the central axis N of the concave arc surface. In this case, the light emitted by the light-emitting chip 303, after being reflected by the reflective layer 301, can be uniformly emitted around the light-emitting chip 303, ensuring the overall light emission effect of the light-emitting unit 300.

[0055] It should be noted that when the inner wall surface of the countersunk hole 101 is a concave arc surface, the range of the light-emitting unit 300's light viewing angle can be adjusted by adjusting the curvature of the concave arc surface. For an example, please refer to... Figure 5 and Figure 6 , Figure 5This is a schematic diagram of the optical path in a light-emitting unit provided in this application. Figure 6 This is a schematic diagram of the optical path in another light-emitting unit provided in this application. For example... Figure 5 As shown, when the curvature of the concave surface is relatively large, the light emitted by the light-emitting chip 303 has a larger angle of view after passing through the reflective layer 301; for example... Figure 6 As shown, when the curvature of the concave surface is relatively small, the light emitted by the light-emitting chip 303 has a smaller angle of view after passing through the reflective layer 301.

[0056] In the light-emitting substrate 000, the curvature of the countersunk hole 101 can be adjusted according to actual needs. For example, for light-emitting substrates 000 of the same specifications, when the number of light-emitting units 300 in the light-emitting substrate 000 is relatively small, the distance between adjacent light-emitting units 300 is relatively large, and the curvature of the countersunk hole 101 corresponding to each light-emitting unit 300 can be relatively large. In this way, the light emission angle range of each light-emitting unit 300 is relatively large, which can ensure that the brightness of the area where the light-emitting unit 300 is located is not much different from the brightness of the areas between adjacent light-emitting units 300, avoiding obvious lamp shadows in the area where the light-emitting unit 300 is located, and improving the display effect of the display device. When the number of light-emitting units 300 in the light-emitting substrate 000 is relatively large, the distance between adjacent light-emitting units 300 is relatively small, and the curvature of the countersunk hole 101 corresponding to each light-emitting unit 300 can be relatively small. In this way, even if the light emission angle of each light-emitting unit 300 is relatively small, it can be ensured that the brightness of the area where the light-emitting unit 300 is located is not much different from the brightness of the area between adjacent light-emitting units 300, thus avoiding obvious light shadows in the area where the light-emitting unit 300 is located. At the same time, it can also improve the display brightness at the normal viewing angle of the display device and improve the display effect of the display device.

[0057] Please refer to this again. Figure 4 The padding layer 302 is located on the side of the reflective layer 301 facing away from the backplate 100, and the padding layer 302 at least partially fills the corresponding countersunk hole 101. In one possible case, a portion of the padding layer 302 fills the countersunk hole 101, while another portion of the padding layer 302 is located outside the countersunk hole 101. The side of the padding layer 302 facing away from the backplate 100 is parallel to the backplate 100, and this side is bonded to the light-emitting surface of the light-emitting chip 303.

[0058] In this way, the light-emitting surface of the light-emitting chip 303 is parallel to the back plate 100, so that the light emitted from the light-emitting surface of the light-emitting chip 303 can be uniformly emitted in a direction away from the back plate 100 after being reflected by the reflective layer 301 provided on the inner wall of the recess 101.

[0059] Please refer to the following in this application: Figure 7 , Figure 7 yes Figure 1 The diagram shows a partial film structure of the light-emitting substrate at AA'. The padding layer 302 may have a positioning groove 302a on the side facing away from the back plate 100, and a portion of the light-emitting chip 303 may be located within the positioning groove 302a. Here, the bottom surface of the positioning groove 302a is parallel to the back plate 100, and the light-emitting surface of the light-emitting chip 303 can be bonded to the bottom surface of the positioning groove 302a to ensure that the light-emitting surface of the light-emitting chip 303 is parallel to the back plate 100, thus ensuring the uniformity of light emission from the light-emitting unit 300.

[0060] For example, the positioning groove 302a may have an adhesive film, and the padding layer 302 is bonded to the light-emitting surface of the light-emitting chip 303 through the adhesive film.

[0061] It should be noted that, in order to ensure that the light-emitting chip 303 can be accurately fixed on the side of the padding layer 302 facing away from the backplate 100, a positioning groove 302a can be pre-set on the side of the padding layer 302 facing away from the backplate 100. Here, the orthographic projection of the positioning groove 302a on the backplate 100 can be located in the area where the countersunk hole 101 is located, and the center point of the orthographic projection of the positioning groove 302a on the backplate 100 can coincide with the central axis N of the countersunk hole 101. In this way, during the subsequent process of transferring the light-emitting chip 303 to the side of the padding layer 302 facing away from the backplate 100 through the die bonding process, it is only necessary to ensure that a portion of the light-emitting chip 303 is located within the positioning groove 302a, which can ensure that the orthographic projection of the light-emitting chip 303 on the backplate 100 is located in the area where the countersunk hole 101 is located, and that the optical axis M of the light-emitting chip 303 coincides with the central axis N of the countersunk hole 101.

[0062] Optional, such as Figure 4 As shown, the light-emitting chip 303 has a first solder pad 3031 and a second solder pad 3032 on the side opposite to the padding layer 302. The first solder pad 3031 and the second solder pad 3032 of the light-emitting chip 303 are electrically connected to the driving circuit layer 200, so that the light-emitting substrate 000 can drive the light-emitting chip 303 to emit light through the driving circuit layer 200. Here, one of the first solder pad 3031 and the second solder pad 3032 can be a positive solder pad, and the other can be a negative solder pad.

[0063] The driving circuit layer 200 has a plurality of first cutout areas 200a, which correspond to a plurality of countersunk holes 101. The area where the countersunk hole 101 is located is within the orthographic projection of the corresponding first cutout area 200a on the back plate 100. The light-emitting substrate 000 may further include: a first electrode 501 and a second electrode 502 distributed within the first cutout areas 200a, both of which are electrically connected to the driving circuit layer 200.

[0064] Specifically, the first solder pin 3031 is electrically connected to the first electrode 501 to achieve the electrical connection between the first solder pin 3031 and the drive circuit layer 200, and the second solder pin 3032 is electrically connected to the second electrode 502 to achieve the electrical connection between the second solder pin 3022 and the drive circuit layer 200.

[0065] For example, the light-emitting substrate 000 may further include: a first connecting lead 601 and a second connecting lead 602, a first solder pad 3031 being electrically connected to a first electrode 501 via the first connecting lead 601, and a second solder pad 3032 being electrically connected to a second electrode 502 via the second connecting lead 602. That is, one end of the first connecting lead 601 is connected to the first solder pad 3031, and the other end of the first connecting lead 601 is connected to the first electrode 501; one end of the second connecting lead 602 is connected to the second solder pad 3032, and the other end of the second connecting lead 602 is connected to the second electrode 502.

[0066] The first connecting lead 601 and the second connecting lead 602 can be made of conductive metal material. For example, the first connecting lead 601 is connected to the first solder pad 3031 and the first electrode 501 by soldering, and the second connecting lead 602 is connected to the second solder pad 3032 and the second electrode 502 by soldering.

[0067] Optionally, the light-emitting substrate 000 further includes an encapsulation layer 400, which is located on the side of the plurality of light-emitting units 300 facing away from the back plate 100, and encapsulation layer 400 covers the plurality of light-emitting units 300. Encapsulation layer 400 also covers the first electrode 501 and the second electrode 502 electrically connected to the driving circuit layer 200, as well as the first connection lead 601 and the second connection lead 602. In this way, encapsulation layer 400 can both protect the electrical connection between the light-emitting units 300 and the driving circuit layer 200 and improve the structural stability of the light-emitting substrate 000, thus extending the service life of the light-emitting substrate 000.

[0068] The encapsulation layer 400 can be implemented in several ways. In one possibility, the encapsulation layer 400 can be integrally encapsulated on the side of the multiple light-emitting units 300 facing away from the backplate 100. In another possibility, the encapsulation layer 400 can include multiple separately arranged encapsulation units 401, which correspond to the multiple light-emitting units 300 and encapsulate the corresponding light-emitting unit 300. This application will further illustrate the application by taking the encapsulation layer 400 including multiple separately arranged encapsulation units 401 as an example.

[0069] like Figure 4As shown, when the encapsulation layer 400 includes a plurality of separately disposed encapsulation units 401, the plurality of encapsulation units 401 can correspond to a plurality of light-emitting units 300, and the encapsulation unit 401 encapsulates the corresponding light-emitting unit 300. Here, the plurality of encapsulation units 401 also correspond to a plurality of first cutout areas 200a in the driving circuit layer 200, and the encapsulation unit 401 encapsulates the first electrode 501 and the second electrode 502, as well as the first connecting lead 601 and the second connecting lead 602, within the corresponding first cutout area 200a.

[0070] The side of the encapsulation unit 401 away from the back plate 100 can be an arc-shaped convex surface. Since the refractive index of the encapsulation unit 401 is greater than the refractive index of the air outside the light-emitting substrate 000, the light can be further dispersed evenly after being emitted from the encapsulation unit 401, thereby further improving the light mixing effect.

[0071] For example, the encapsulation unit 401 can be a light-transmitting adhesive layer, such as, but not limited to, silicone or epoxy resin. In one possible implementation, when forming the encapsulation unit 401, a recess corresponding to the encapsulation unit 401 can be pre-formed on a release film, and then the encapsulation unit 401 can be formed by pressing the release film onto the surface of the semi-cured epoxy resin layer or silicone layer. It should be noted that in some other possible implementations, the encapsulation unit 401 can also be formed using at least one of, but not limited to, etching, physical blasting, and exposure and development processes, which will not be elaborated here.

[0072] The encapsulation unit 401 is in direct contact with the area of ​​the padding layer 302 on the side facing away from the backplate 100 where the light-emitting chip 303 is not located. This area of ​​the padding layer 302 on the side facing away from the backplate 100 where the light-emitting chip 303 is not located is the area where light is emitted after being reflected by the reflective layer 301. When the refractive index of the encapsulation layer 400 differs from that of the padding layer 302, light will refract when entering the encapsulation layer 400 from the padding layer 302, further adjusting the range of the light emission angle of the light-emitting unit 300. For an example, please refer to... Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of the optical path in another type of light-emitting unit provided in this application. Figure 9 This is a schematic diagram of the optical path in another type of light-emitting unit provided in this application.

[0073] In one possible scenario, the refractive index of the encapsulation layer 400 is greater than that of the padding layer 302, such as... Figure 8As shown, at the interface where the padding layer 302 and the encapsulation layer 400 meet, light rays emitted at an emission angle X from a first viewing angle are refracted into light rays at a second viewing angle after entering the encapsulation layer 400. The emission angle Z1 of the second viewing angle light rays is smaller than the emission angle X of the first viewing angle light rays. That is, when the refractive index of the encapsulation layer 400 is greater than that of the padding layer 302, the range of the emission viewing angle of the light-emitting unit 300 is reduced. This is suitable for light-emitting substrates 000 with a large number of light-emitting units 300 and a small distance between adjacent light-emitting units 300, which can improve the display brightness at the viewing angle of the display device and improve the display effect of the display device.

[0074] In another possible scenario, the refractive index of the encapsulation layer 400 is less than that of the padding layer 302. For example... Figure 9 As shown, at the interface where the padding layer 302 contacts the encapsulation layer 400, light rays emitted at an emission angle X (first viewing angle) are refracted into light rays at a third viewing angle after entering the encapsulation layer 400. The emission angle Z2 of the third viewing angle light rays is greater than the emission angle X of the first viewing angle light rays. That is, when the refractive index of the encapsulation layer 400 is less than that of the padding layer 302, the range of the emission angle of the light-emitting unit 300 is increased. This is suitable for light-emitting substrates 000 with a small number of light-emitting units 300 and a large distance between adjacent light-emitting units 300. It can ensure that the brightness of the area where the light-emitting unit 300 is located is not much different from the brightness of the area between adjacent light-emitting units 300, avoiding obvious light shadows in the area where the light-emitting unit 300 is located, and improving the display effect of the display device.

[0075] It should be noted that light will also be refracted when it exits from the encapsulation layer 400 to the outside of the light-emitting substrate 000, which is not shown in the optical path diagram provided in this application.

[0076] Optional, please refer to again Figure 4 The light-emitting substrate 000 may further include: a reflective ink layer 700, the reflective ink layer 700 being located on the side of the driving circuit layer 200 away from the back plate 100, the reflective ink layer 700 having a plurality of second cutout areas 700a, the plurality of second cutout areas 700a corresponding to a plurality of first cutout areas 200a, the orthographic projection of the first cutout area 200a on the back plate 100 being located within the orthographic projection of the corresponding second cutout area 700a on the back plate 100.

[0077] It should be noted that the reflective ink layer 700 can be a white ink layer. Through this reflective ink layer 700, part of the light rays that are directed toward the area between adjacent light-emitting units 300 in the light-emitting substrate 000 can be reflected toward the light-emitting direction of the light-emitting substrate 000, thereby improving the utilization rate of light and increasing the display brightness of the display device.

[0078] Furthermore, the reflective ink layer 700 is formed before the first connecting lead 601 and the second connecting lead 602 are soldered. The reflective ink layer 700 can be used to protect the traces in the driving circuit layer 200. Through the protective effect of the reflective ink layer 700, the parts in the driving circuit layer 200 that do not need to be soldered can be prevented from being damaged, thereby improving the soldering efficiency of the light-emitting chip 303 and improving the yield of the light-emitting substrate 000.

[0079] Please refer to Figure 10 , Figure 10 yes Figure 1 The diagram shows another film layer structure of the light-emitting substrate at AA'. In some possible implementations, the light-emitting substrate 000 may further include an insulating layer 800, located between the driving circuit layer 200 and the reflective ink layer 700, with the orthographic projection of the insulating layer 800 on the backplate 100 overlapping with the orthographic projection of the reflective ink layer 700 on the backplate 100. That is, the insulating layer 800 has a plurality of third cutout areas 800a, which correspond to a plurality of second cutout areas 700a, and the orthographic projection of the third cutout area 800a on the backplate 100 overlaps with the orthographic projection of the corresponding second cutout area 700a on the backplate 100. The insulating layer 800 can be used to protect the traces in the driving circuit layer 200, improving the yield of the light-emitting substrate 000.

[0080] In summary, the light-emitting substrate provided in this application includes a backplane, a driving circuit layer, and multiple light-emitting units. Each light-emitting unit includes a reflective layer, a padding layer, and a light-emitting chip. Since the light-emitting surface of the light-emitting chip faces the reflective layer, the light emitted from the chip first travels to one side of the backplane and is then reflected by the reflective layer disposed on the inner wall of the recessed aperture on the backplane, thus extending the path of the light emitted from the chip. Therefore, by integrating this light-emitting substrate into the backlight module, it is not necessary to increase the distance between the light-emitting substrate and the diffuser plate in the backlight module to ensure a good light mixing effect in the backlight module, resulting in a lower overall thickness of the backlight module.

[0081] This application also provides a backlight module 900, please refer to... Figure 11 , Figure 11 This is a schematic diagram of the structure of a backlight module provided in this application. The backlight module 900 may include: a housing 1000, and a light-emitting substrate 000 installed in the housing 1000, wherein the light-emitting substrate 000 is any of the light-emitting substrates given above.

[0082] The backlight module 900 may further include: an inner frame 1100, a diffuser plate 1200, and an optical film 1300 mounted within the housing 1000. The diffuser plate 1200 and the optical film 1300 are stacked on the light-emitting side of the light-emitting substrate 000, with the diffuser plate 1200 closer to the light-emitting substrate 000 than the optical film 1300. The distance between the light-emitting substrate 000 and the diffuser plate 1200 is the light mixing distance d. The inner frame 1200 supports the diffuser plate 1200 and the optical film 1300, ensuring a certain light mixing distance d between the diffuser plate 1200 and the light-emitting substrate 000. When the light-emitting substrate 000 is the light-emitting substrate provided in the embodiments of this application, even if the light mixing distance d is small, the light mixing performance of the backlight module can be good, thereby meeting the requirement of a small backlight module thickness while ensuring the light mixing effect.

[0083] It should be noted that the optical film 1300 in the backlight module 900 may include at least one of a lower prism sheet, an upper prism sheet, and a diffuser sheet stacked in a direction perpendicular to and away from the diffuser plate 1200.

[0084] This application also provides a display device, which includes a liquid crystal display panel and a backlight module 900. The backlight module 900 is the aforementioned backlight module, wherein the back side of the liquid crystal display panel can be connected to the backlight module 900. This display device can be any product or component with display function, such as a mobile phone, tablet computer, television, advertising machine, display screen, digital photo frame, etc.

[0085] Optionally, the LCD panel can be fixedly connected to the backlight module 900 via a connecting layer, which can be a material with cushioning capabilities such as foam or rubber.

[0086] In this embodiment, the liquid crystal display panel may include: an array substrate and a color filter substrate disposed opposite to each other, and a liquid crystal layer located between the array substrate and the color filter substrate. The array substrate is closer to the backlight module 900 relative to the color filter substrate; that is, the backlight module may be distributed on the side of the array substrate away from the color filter substrate.

[0087] It should be noted that, since the liquid crystal molecules in the liquid crystal layer only have a modulating effect on polarized light, a first polarizer needs to be placed on the side of the array substrate facing away from the color filter substrate, and a second polarizer needs to be placed on the side of the color filter substrate facing away from the array substrate. Here, the polarization direction of the first polarizer can be perpendicular to the polarization direction of the second polarizer.

[0088] In this configuration, the light emitted from the backlight module 900, after passing through the first polarizer, can be converted into first polarized light. The array substrate, the color filter substrate, and the liquid crystal layer located between them can adjust the first polarized light.

[0089] For example, by adjusting the array substrate, the color filter substrate, and the liquid crystal layer located between them, the polarization direction of the first polarized light can be deflected to be parallel to the polarization direction of the second polarizer, and this light can be transmitted through the second polarizer.

[0090] For example, by adjusting the array substrate, the color filter substrate, and the liquid crystal layer located between them, the polarization direction of the first polarized light can be made perpendicular to the polarization direction of the second polarizer, and this light cannot be transmitted through the second polarizer.

[0091] Furthermore, since each pixel area in the LCD panel can adjust the incoming light, the LCD panel can display the corresponding image by adjusting the light in each pixel area.

[0092] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0093] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0094] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A light-emitting substrate, characterized by, The light-emitting substrate comprises a backboard, a driving circuit layer, a plurality of light-emitting units and an encapsulation layer; The backboard has a plurality of counterbores on one side thereof; The driving circuit layer is located on the side of the backboard having the counterbores, and the orthographic projection of the driving circuit layer on the backboard does not coincide with the area where the counterbores are located; The plurality of light-emitting units are located on the side of the backboard having the counterbores, and the plurality of light-emitting units correspond to the plurality of counterbores; the light-emitting unit comprises a reflecting layer, a padding layer and a light-emitting chip; the reflecting layer in the light-emitting unit is attached to the inner wall of the corresponding counterbores; a part of the padding layer is filled into the counterbores, and another part of the padding layer is located outside the counterbores, and the side of the padding layer away from the backboard is parallel to the backboard; the light-emitting chip in the light-emitting unit is located on the side of the padding layer away from the backboard, the light-emitting surface of the light-emitting chip faces the reflecting layer, and is bonded to the side of the padding layer away from the backboard, and the light-emitting chip is electrically connected to the driving circuit layer; The encapsulation layer is located on the side of the plurality of light-emitting units away from the backboard, and the encapsulation layer wraps the plurality of light-emitting units.

2. The light emitting substrate of claim 1, wherein, The orthographic projection of the light-emitting chip in the light-emitting unit on the backboard is located in the area where the corresponding counterbores are located.

3. The light-emitting substrate according to claim 2, characterized in that, The inner wall surface of the counterbores is an arc-shaped concave surface.

4. The light emitting substrate of claim 1, wherein, The side of the padding layer away from the backboard has a positioning groove, and the bottom surface of the positioning groove is parallel to the backboard; A part of the light-emitting chip is located in the positioning groove.

5. The light emitting substrate of claim 1, wherein, The encapsulation layer comprises a plurality of encapsulation units arranged separately, the plurality of encapsulation units correspond to the plurality of light-emitting units, and the encapsulation unit wraps the corresponding light-emitting unit.

6. The light emitting substrate of claim 5, wherein, The side of the encapsulation unit away from the backboard is an arc-shaped convex surface.

7. The light emitting substrate of claim 5, wherein, The encapsulation unit directly contacts the area of the side of the padding layer away from the backboard where the light-emitting chip is not arranged; The refractive index of the encapsulation layer is greater than the refractive index of the padding layer, or the refractive index of the encapsulation layer is less than the refractive index of the padding layer.

8. The light emitting substrate of any of claims 1-7, wherein, The driving circuit layer has a plurality of first hollow areas, the plurality of first hollow areas correspond to the plurality of counterbores, and the area where the counterbores are located is located in the orthographic projection of the corresponding first hollow area on the backboard; The light-emitting substrate further comprises a first electrode and a second electrode distributed in the first hollow area, and the first electrode and the second electrode are both electrically connected to the driving circuit layer; The side of the light-emitting chip away from the padding layer has a first solder leg and a second solder leg, the first solder leg is electrically connected to the first electrode, and the second solder leg is electrically connected to the second electrode.

9. The light-emitting substrate according to claim 8, characterized in that, In the case where the light-emitting substrate comprises a plurality of encapsulation units, the plurality of encapsulation units correspond to the plurality of first hollow areas, and the encapsulation unit wraps the first electrode and the second electrode in the corresponding first hollow area.

10. The light emitting substrate of claim 8, wherein, The light-emitting substrate further comprises a first connecting lead and a second connecting lead, the first solder leg is electrically connected to the first electrode through the first connecting lead, and the second solder leg is electrically connected to the second electrode through the second connecting lead.

11. The light emitting substrate of claim 8, wherein, The light-emitting substrate further comprises a light-reflecting ink layer located on the side of the driving circuit layer away from the back plate, the light-reflecting ink layer having a plurality of second hollow areas corresponding to the plurality of first hollow areas, the orthographic projection of the first hollow area on the back plate being located within the orthographic projection of the corresponding second hollow area on the back plate.

12. A backlight module, characterized in that, The backlight module comprises a housing and a light-emitting substrate installed in the housing, the light-emitting substrate being any one of the light-emitting substrates as claimed in claims 1-11.

13. A display device comprising: Comprising: A liquid crystal display panel and a backlight module, the backlight module being the backlight module as claimed in claim 12.

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