Buffering dustproof sticker for computer mainboard

Abstract

The invention discloses a computer mainboard buffer dustproof sticker which comprises a release film, an adhesive layer, a foam layer, an anti-static adhesive tape and an insulating film which are arranged from top to bottom. A pull lug part is arranged on the outer side of the release film and extends out of the whole buffering dustproof sticker; the insulating film is provided with avoiding holes used for avoiding electronic elements on the mainboard. The computer mainboard buffering dustproof sticker is a simple and effective protection tool, and can provide buffering, dustproof and anti-static protection for the mainboard under the condition that heat dissipation is not obviously influenced, so that the mainboard is prevented from being influenced by dust, impact, vibration and static accumulation.

Description

Technical Field

[0001] The invention relates to the technical field of dustproof stickers, and in particular to a buffer dustproof sticker for a computer motherboard. Background Art

[0002] With the continuous advancement of science and technology, the precision of electronic equipment and mechanical parts is getting higher and higher, and the requirements for protective materials are becoming increasingly stringent. The computer motherboard is the core component of the computer system, on which a large number of precision electronic components are installed, such as BIOS chips, I / O control chips, expansion slots, etc., and its performance and life are affected by many factors such as dust, static electricity, and vibration. Dust accumulation may cause poor heat dissipation, short circuits, or component damage, while vibration may affect the stability of precision components on the motherboard. Therefore, it is particularly important to develop a protective material that can both prevent dust and buffer vibration. Traditional dustproof and buffering designs often have problems such as general buffering effect, insufficient dustproof effect, and easy to affect heat dissipation effect, which cannot meet the needs of efficient protection.

[0003] Therefore, it is necessary to develop a buffer dust sticker that can provide effective protection for the motherboard without significantly affecting the heat dissipation and is easy to use. Summary of the invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a computer motherboard buffering and dustproof sticker, which is a simple and effective protective tool that can provide buffering, dustproof and anti-static protection for the motherboard without significantly affecting the heat dissipation, thereby protecting the motherboard from dust, impact, vibration and static electricity accumulation.

[0005] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0006] A computer motherboard buffer dust sticker comprises a release film, an adhesive layer, a foam layer, an antistatic tape and an insulating film arranged from top to bottom; the release film has a pull ear portion on the outer side, and the pull ear portion extends to the outside of the entire buffer dust sticker; the insulating film is provided with avoidance holes for avoiding electronic components on the motherboard.

[0007] Furthermore, the release film includes a PET film and a release agent coating disposed on one side of the PET film.

[0008] Furthermore, the release film is a three-piece structure, including a middle piece located in the middle and a left piece and a right piece located on the left and right sides.

[0009] Furthermore, the adhesive layer includes a PET substrate and acrylic adhesive layers arranged on both sides of the PET substrate.

[0010] Furthermore, the foam layer includes a plurality of foam blocks designed according to the distribution of electronic components on the computer motherboard.

[0011] Furthermore, the foam block is a polyurethane foam block.

[0012] Furthermore, the antistatic tape includes a PET substrate and an adhesive layer arranged on one side of the PET substrate; one side of the antistatic tape having the adhesive layer is bonded to the insulating film, and the other side of the antistatic tape is bonded to the foam layer through a double-sided adhesive layer.

[0013] Furthermore, the double-sided adhesive layer includes a PET substrate and acrylic adhesive layers arranged on both sides of the PET substrate.

[0014] Furthermore, the insulating film is a polyester film.

[0015] Furthermore, the thickness of the release film is 75±5 μm, the thickness of the adhesive layer is 50 μm, the thickness of the foam layer is 0.5-6.5 mm, the thickness of the antistatic tape is 50 μm, and the thickness of the insulating film is 75±5 μm.

[0016] The beneficial effects of the present invention are:

[0017] The buffer dustproof sticker of the present invention includes a release film, an adhesive layer, a foam layer, an antistatic tape and an insulating film; wherein the release film has a pull ear portion, which can be easily torn off. In addition, the release film is a three-piece structure, including a left piece, a middle piece and a right piece, which can facilitate assembly line operation and improve the accuracy of pasting; wherein the foam layer includes a number of foam blocks designed according to the distribution of electronic components on the computer motherboard, which can provide a buffering function to protect the motherboard from the impact, vibration and the like; and, the foam layer also has better heat resistance and can be used for a long time. The antistatic tape has an antistatic function, which can prevent static electricity accumulation and avoid damage to the motherboard and the electronic components on the motherboard. The insulating film has avoidance holes, which can avoid interference with the higher protruding electronic components on the motherboard.

[0018] The buffer dustproof sticker of the present invention is a simple and effective protective tool. When used, it is attached to the computer motherboard and can provide buffering, dustproof and anti-static protection for the motherboard without significantly affecting the heat dissipation, thereby protecting the motherboard from dust, impact, vibration and static electricity accumulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of a buffer dustproof sticker for a computer motherboard of the present invention.

[0020] In the figure, 1: release film, 11: middle piece, 12: left piece, 13: right piece, 14: pull ear part; 2: adhesive layer; 3: foam layer, 31: foam block; 4: antistatic tape; 5: insulating film, 51: avoidance hole; 6: double-sided adhesive layer. DETAILED DESCRIPTION

[0021] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0022] like Figure 1 The computer motherboard buffer dust sticker shown includes a release film 1, an adhesive layer 2, a foam layer 3, an antistatic tape 4 and an insulating film 5 arranged from top to bottom; the outer side of the release film 1 has a pull ear portion 14, and the pull ear portion 14 extends to the outside of the entire buffer dust sticker; the insulating film 5 is provided with an avoidance hole 51 for avoiding electronic components on the motherboard.

[0023] The release film 1 includes a PET film and a release agent coating disposed on one side of the PET film. The release film is a three-piece structure, including a middle piece 11 located in the middle part and a left piece 12 and a right piece 13 located on the left and right sides. When in use, the middle piece 11 in the middle part is first pasted, and then the left piece 12 and the right piece 13 on the two sides are pasted, which is convenient for assembly line operation and can improve the accuracy of pasting.

[0024] The adhesive layer 2 includes a PET substrate and acrylic adhesive layers arranged on both sides of the PET substrate.

[0025] The foam layer 3 includes a plurality of foam blocks designed according to the distribution of electronic components on the computer motherboard. The foam blocks 31 are polyurethane foam blocks. The shape of each foam block 31 is designed according to the electronic components, such as being square, L-shaped, etc.

[0026] The antistatic tape 4 is a single-sided tape, which includes a PET substrate and an adhesive layer arranged on one side of the PET substrate; one side of the antistatic tape 4 having the adhesive layer is bonded to the insulating film 5, and the other side of the antistatic tape 4 is bonded to the foam layer 3 through a double-sided adhesive layer 6.

[0027] The double-sided adhesive layer 6 includes a PET substrate and acrylic adhesive layers arranged on both sides of the PET substrate.

[0028] Wherein, the insulating film 5 is a polyester film.

[0029] The shapes of the adhesive layer 2 and the double-sided adhesive layer 6 are designed to correspond to the shape of the foam block 31 .

[0030] Example 1

[0031] like Figure 1 The computer motherboard buffer dust sticker shown includes a release film 1, an adhesive layer 2, a foam layer 3, an antistatic tape 4 and an insulating film 5 arranged from top to bottom; the outer side of the release film 1 has a pull ear portion 14, and the pull ear portion 14 extends to the outside of the entire buffer dust sticker; the insulating film 5 is provided with an avoidance hole 51 for avoiding electronic components on the motherboard.

[0032] The release film 1 includes a PET film and a release agent coating disposed on one side of the PET film. The release film 1 is a three-piece structure, including a middle piece 11 located in the middle part and a left piece 12 and a right piece 13 located on the left and right sides. When in use, the middle piece 11 in the middle part is first pasted according to the process, and then the left piece 12 and the right piece 13 on the two sides are pasted, which is convenient for assembly line operation and can improve the accuracy of pasting. In this embodiment, the release film 1 adopts SYB7515, the color is blue, the thickness is 75±5μm, and the release force is 15±5g / inch.

[0033] In this embodiment, the adhesive layer 2 is made of TESA 61350, including a black PET substrate and acrylic adhesive layers arranged on both sides of the PET substrate, with a thickness of 50 μm, a tensile strength of 20 N / cm, and a 180-degree peeling force of >8 N / cm.

[0034] The foam layer 3 includes a plurality of foam blocks 31 designed according to the distribution of electronic components on the computer motherboard. The foam block 31 is a polyurethane foam block. In this embodiment, the foam block 31 is 4701-60-25093-04, and its dimensional stability: the test conditions are: 22 hours @ 176℉ (80℃), forced convection oven, maximum change: ±5%, and its thermal expansion coefficient is 2.3-3.1×10 -4 in / in / ℃, temperature resistance: 70℃*8H.

[0035] The antistatic tape 4 is a single-sided tape, which includes a PET substrate and an adhesive layer arranged on one side of the PET substrate; one side of the antistatic tape 4 having the adhesive layer is bonded to the insulating film 5, and the other side of the antistatic tape 4 is bonded to the foam layer 3 through a double-sided adhesive layer 6. In this embodiment, the antistatic tape 4 adopts TESA 7950, which has a thickness of 50 μm, a tensile strength of 36.7 N / cm, and a dielectric breakdown voltage of 4500 V. In this embodiment, the double-sided adhesive layer 6 includes a PET substrate and an acrylic adhesive layer arranged on both sides of the PET substrate, and the double-sided adhesive layer 6 adopts TESA 61350, which has a thickness of 50 μm, a tensile strength of 20 N / cm, and a 180-degree peeling force>8 N / cm.

[0036] The insulating film 5 is a polyester film, using FAD FBE-75, which is a black PET (polyester film), with a bright surface, uniform color, opaque, non-fading, and good adhesion to ink and silicone oil coating, good dimensional stability at high temperature, and can still maintain excellent flatness after heating; its thickness is 75±5μm, and the surface impedance is ≥10 12 / ohm.

[0037] When in use, tear off the release film 1 on the buffer dustproof sticker, and then stick the buffer dustproof sticker on the computer motherboard through the adhesive layer 2; when pasting, adapt and paste according to the distribution of electronic components on the computer motherboard, and the avoidance holes 51 on the insulating film 5 are adapted to the raised electronic components on the motherboard.

[0038] The buffer dustproof sticker of the present invention comprises a release film 1, an adhesive layer 2, a foam layer 3, an antistatic tape 4 and an insulating film 5; wherein the release film 1 has a pull ear portion 14, which can be easily torn off. In addition, the release film 1 is a three-piece structure, including a left piece 12, a middle piece 11 and a right piece 13, which can facilitate assembly line operation and improve the accuracy of the coating; wherein the foam layer 3 comprises a plurality of foam blocks 31 designed according to the distribution of electronic components on the computer motherboard, which can provide a buffering function to protect the motherboard from the influence of impact, vibration, etc.; moreover, the foam layer 3 also has better heat resistance and can be used for a long time. wherein the antistatic tape 4 has an antistatic function, which can prevent static electricity accumulation and avoid damage to the motherboard and the electronic components on the motherboard. wherein the insulating film 5 has an avoidance hole 51, which can avoid interference with the higher protruding electronic components on the motherboard.

[0039] The buffer dustproof sticker of the present invention is a simple and effective protective tool. When used, it is attached to the computer motherboard and can provide buffering, dustproof and anti-static protection for the motherboard without significantly affecting the heat dissipation, thereby protecting the motherboard from dust, impact, vibration and static electricity accumulation.

[0040] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0041] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A computer motherboard buffer dust sticker, characterized in that: It includes a release film, an adhesive layer, a foam layer, an antistatic tape and an insulating film arranged from top to bottom; the outer side of the release film has a pull ear portion, which extends to the outside of the entire buffer dustproof sticker; the insulating film is provided with an avoidance hole for avoiding electronic components on the mainboard.

2. A computer motherboard buffer dust sticker according to claim 1, characterized in that: The release film comprises a PET film and a release agent coating arranged on one side of the PET film.

3. A computer motherboard buffer dust sticker according to claim 1, characterized in that: The release film is a three-piece structure, including a middle piece located in the middle, and a left piece and a right piece located on the left and right sides.

4. A computer motherboard buffer dust sticker according to claim 1, characterized in that: The adhesive layer comprises a PET substrate and acrylic adhesive layers arranged on both sides of the PET substrate.

5. The computer motherboard buffer dust sticker according to claim 1, characterized in that: The foam layer includes a plurality of foam blocks designed according to the distribution of electronic components on the computer mainboard.

6. A computer motherboard buffer dust sticker according to claim 5, characterized in that: The foam block is a polyurethane foam block.

7. A computer motherboard buffer dust sticker according to claim 1, characterized in that: The antistatic tape comprises a PET substrate and an adhesive layer arranged on one side of the PET substrate; one side of the antistatic tape having the adhesive layer is bonded to the insulating film, and the other side of the antistatic tape is bonded to the foam layer through a double-sided adhesive layer.

8. A computer motherboard buffer dust sticker according to claim 7, characterized in that: The double-sided adhesive layer comprises a PET substrate and acrylic adhesive layers arranged on both sides of the PET substrate.

9. The computer motherboard buffer dust sticker according to claim 1, characterized in that: The insulating film is a polyester film.

10. A computer motherboard buffer dust sticker according to claim 1, characterized in that: The thickness of the release film is 75±5 μm, the thickness of the adhesive layer is 50 μm, the thickness of the foam layer is 0.5-6.5 mm, the thickness of the antistatic tape is 50 μm, and the thickness of the insulating film is 75±5 μm.

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