Microcrystal nanometer suspension intelligent card with naked eye 3D effect and manufacturing process

Abstract

The invention relates to the related technical field of chip intelligent card processing, in particular to a microcrystal nano suspension intelligent card with a naked eye 3D effect and a manufacturing process, and the microcrystal nano suspension intelligent card with the naked eye 3D effect comprises a card substrate, a card panel, a circuit board, a microchip, a back microcrystal nano suspension layer and a front microcrystal nano suspension layer, an installation groove is formed in the card substrate, the card panel is installed on the card substrate, the circuit board is embedded in the installation groove in the card substrate, the microchip is embedded in a microchip clamping groove in the circuit board, the back microcrystal nanometer suspension layer is arranged on the outer side face of the card substrate, and the front microcrystal nanometer suspension layer is arranged on the outer side face of the card panel. Through the arrangement of the back microcrystalline nanometer suspension layer and the front microcrystalline nanometer suspension layer, the surface wear resistance of the intelligent card is effectively improved, and the overall aesthetic property of the intelligent card can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field related to chip smart card processing, and in particular to a microcrystalline nano-suspension smart card with naked-eye 3D effect and a manufacturing process thereof. Background Art

[0002] A chip smart card is a plastic card with a microchip embedded in it. The smart card needs to interact with data through a reader / writer. The smart card is equipped with a CPU, RAM, and I / O, and can process a large amount of data by itself without interfering with the work of the host CPU. The smart card can also filter out erroneous data to reduce the burden on the host CPU. It is suitable for occasions with a large number of ports and a faster communication speed. The integrated circuit in the card includes a central processing unit CPU, an EEPROM, a random access memory RAM, and an operating system in the card solidified in the read-only memory ROM. The data in the card is divided into external reading and internal processing parts. The existing Chinese patent document with announcement number CN218782620U discloses a smart card that is easy to replace a built-in chip, which includes a first card face, a second card face is arranged on the front of the first card face, a buckle bolt is symmetrically processed on the top of the first card face, a buckle seat used in conjunction with the buckle bolt is processed on the top of the second card face, a first card slot and a second card slot are respectively opened inside the first card face, a smart chip is placed inside the first card slot, a limiting hole is opened inside the second card slot, and a chip limiting strip is arranged on the front of the first card face; The smart card in the above document is connected by snapping the first card surface and the second card surface, and the chip can be placed between the first card surface and the second card surface for limiting. The chip can be replaced by separating the first card surface and the second card surface, thereby avoiding the traditional one-piece processing. After the chip is demagnetized or damaged, the entire smart card needs to be replaced, which reduces the processing cost. However, the snapping structure will cause the card body size to become larger, and the snapping structure is easy to affect the stability of the snapping structure during the bumping process, thereby causing the separation of the card surface, thereby causing damage to the internal chip. For this reason, the present invention proposes a microcrystalline nano-suspension smart card with naked-eye 3D effect and a manufacturing process to solve the above problems. Summary of the invention

[0003] The purpose of the present invention is to provide a microcrystalline nano-suspension smart card with naked-eye 3D effect and a manufacturing process to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a microcrystalline nano-suspension smart card with naked-eye 3D effect, the microcrystalline nano-suspension smart card with naked-eye 3D effect comprising: A card base plate, wherein a mounting groove is provided on the card base plate; A card panel, wherein the card panel is mounted on the card substrate; A circuit board, wherein the circuit board is embedded in a mounting groove on the card substrate; A microchip, wherein the microchip is embedded in a microchip slot mounted on a circuit board; A back microcrystalline nano suspension layer, wherein the back microcrystalline nano suspension layer is arranged on the outer side of the card substrate; The front microcrystalline nano suspension layer is arranged on the outer side of the card panel.

[0005] Preferably, a primary connecting ear is integrally formed on the edge of the card substrate, and a secondary connecting ear is integrally formed on the edge of the card panel. The primary connecting ear and the secondary connecting ear are symmetrically arranged in a group and are arranged correspondingly.

[0006] Preferably, glue grooves are provided on the card base plate and the primary connecting ear, a main heat conducting ring is pre-embedded on the outer surface of the card panel, a secondary heat conducting ring is pre-embedded on the secondary connecting ear, the main heat conducting ring and the secondary heat conducting ring are integrally formed, and the inner surfaces of the main heat conducting ring and the secondary heat conducting ring are integrally formed with adhesive plates, the adhesive plates are arranged corresponding to the glue grooves, the glue grooves are filled with hot melt adhesive, and the hot melt adhesive forms a bonding effect on the adhesive plate, the card panel and the secondary connecting ear.

[0007] Preferably, the main heat conducting ring, the secondary heat conducting ring and the adhesive plate are all cast from copper, the heat resistant temperatures of the card base plate, the card panel, the circuit board, the microchip, the back microcrystalline nano suspension layer and the front microcrystalline nano suspension layer are all greater than one hundred and twenty degrees, and the melting temperature of the hot melt colloid is eighty degrees.

[0008] Preferably, the cross section of the glue groove is convex-shaped, and a glue hole is opened on the glue plate. The glue hole is located at the lower side end of the glue plate, and the hot melt glue is immersed in the glue hole.

[0009] Preferably, a stabilizing groove is provided at the upper side end of the adhesive plate, and after the card panel is cast, the plate body of the card panel is embedded in the stabilizing groove.

[0010] Preferably, the front microcrystalline nano suspension layer and the back microcrystalline nano suspension layer are made of the same material, and the formula (by mass percentage) of the back microcrystalline nano suspension layer includes: Nano silicon dioxide 30-40%; Lithium silicate 10-12%; Epoxy resin 15-25%; Nano-alumina 5-8%; Glass ionomer cement 8-11%; Waterborne polyurethane 7-10%; Surfactant 9-14%.

[0011] A process for manufacturing a microcrystalline nano-suspended smart card with a naked-eye 3D effect, the process for manufacturing a microcrystalline nano-suspended smart card with a naked-eye 3D effect is used to manufacture the microcrystalline nano-suspended smart card with a naked-eye 3D effect, and the process for manufacturing a microcrystalline nano-suspended smart card with a naked-eye 3D effect comprises: Step 1: Preparation process of microcrystalline nano suspension. In the preparation process of the microcrystalline nano suspension, nano silicon dioxide, lithium silicate, epoxy resin, nano aluminum oxide, glass ionomer cement, waterborne polyurethane and surfactant are proportioned and then mixed by a mixing device: Step 2: Microcrystalline nano suspension performance test process, in which the particle size distribution of the suspension is tested using a dynamic light scattering instrument to obtain the average particle size and particle size distribution range of the nanoparticles in the suspension, and then evaluate the dispersibility and stability of the suspension, so as to help achieve a more uniform coating effect and higher smart card performance; Step 3: a microcrystalline nano suspension layer coating process, in which the back microcrystalline nano suspension layer and the front microcrystalline nano suspension layer are coated and formed by an inkjet coating device; Step 4: a microcrystalline nano suspension layer curing process, wherein the microcrystalline nano suspension layer is cured by ultraviolet curing equipment; Step 5: Microcrystalline nano-suspension layer performance evaluation process, the microcrystalline nano-suspension layer performance evaluation process includes mechanical property test, chemical stability test and electrical property test.

[0012] Preferably, the raw material mixing process in the preparation process of the nanosuspension includes a mechanical stirring and dispersing process and an ultrasonic dispersing process. In the mechanical stirring and dispersing process, a high-speed rotating agitator generates a strong shear force so that the nanomaterials are evenly dispersed and mixed in the liquid to form a primary mixed liquid. In the ultrasonic dispersing process, a cavitation effect is generated by high-frequency vibration to break the agglomeration between the nanomaterials and achieve uniform dispersion of nanoparticles to prepare a microcrystalline nanosuspension.

[0013] Preferably, in the mechanical property test, the hardness, wear resistance and impact resistance of the suspension layer are quantitatively analyzed using mechanical property testing equipment to ensure that the suspension layer can withstand the use requirements in various complex environments; In the chemical stability test, the stability of the suspension layer in different chemical media is evaluated to ensure that the smart card can maintain stable performance in various application scenarios; During the performance evaluation process, test data from different batches of products are compared to timely identify potential problems and make improvements. In addition, the performance of the suspension layer is studied through an analytical model.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. A microcrystalline nano suspension smart card with naked eye 3D effect is provided which is composed of a card substrate, a card panel, a circuit board, a microchip, a back microcrystalline nano suspension layer and a front microcrystalline nano suspension layer, and a primary connection ear is provided at the edge of the card substrate, and a secondary connection ear is provided at the edge of the card panel, and a glue groove is provided on the card substrate and the primary connection ear, and a main heat conduction ring is pre-embedded on the card panel, and a secondary heat conduction ring is pre-embedded on the secondary connection ear, and a bonding plate is provided on the inner surface of the main heat conduction ring and the secondary heat conduction ring, so that the bonding plate is bonded by hot melt colloid to effectively increase the bonding area, thereby ensuring the connection stability between the card substrate and the card panel, and the hot melt colloid can be dissolved by a hot air gun in the later stage, so as to facilitate the disassembly and maintenance of the card substrate and the card panel; 2. By setting the back microcrystalline nano suspension layer and the front microcrystalline nano suspension layer, the surface wear resistance of the smart card is effectively improved, and the overall aesthetics of the smart card can be improved.

[0015] 3. The cross section of the glue groove is set to a convex shape, and glue holes are opened on the glue plate, so that the hot melt glue flows into the bottom gap and glue holes of the glue groove, so that after the hot melt glue solidifies, the glue plate and the glue groove can form a mutually meshing whole, thereby further ensuring the connection stability between the card substrate and the card panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 for Figure 1 A schematic diagram of the structure enlargement in the middle; Figure 3 A half-section view of the present invention; Figure 4 for Figure 3 A magnified schematic diagram of the structure at B in the middle; Figure 5 This is a schematic structural diagram of a card substrate of the present invention; Figure 6 for Figure 5 A magnified schematic diagram of the structure at C in the middle; Figure 7 This is a schematic diagram of the card panel structure of the present invention; Figure 8 for Figure 7 A magnified schematic diagram of the structure at D in the middle; Fig. 9 This is a schematic diagram of the distribution of the adhesive bonding plates of the present invention; Fig.10 for Fig. 9 The enlarged schematic diagram of the structure at E in the middle; Fig.11 It is a process flow chart of the present invention.

[0017] In the figure: card substrate 1, card panel 2, circuit board 3, microchip 4, back microcrystalline nano suspension layer 5, front microcrystalline nano suspension layer 6, primary connection ear 7, secondary connection ear 8, glue groove 9, main heat conduction ring 10, secondary heat conduction ring 11, glue plate 12, hot melt glue 13, glue hole 14, stabilizing groove 15. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1-11 The present invention provides the following three preferred embodiments: Embodiment 1: A microcrystalline nano-suspension smart card with naked-eye 3D effect, the microcrystalline nano-suspension smart card with naked-eye 3D effect comprises a card substrate 1, a card panel 2, a circuit board 3, a microchip 4, a back microcrystalline nano-suspension layer 5 and a front microcrystalline nano-suspension layer 6. The card substrate 1 is provided with a mounting groove, the card panel 2 is mounted on the card substrate 1, the circuit board 3 is embedded in the mounting groove installed on the card substrate 1, the microchip 4 is embedded in the microchip card slot installed on the circuit board 3, the back microcrystalline nano-suspension layer 5 is arranged on the outer side of the card substrate 1, and the front microcrystalline nano-suspension layer 6 is arranged on the outer side of the card panel 2. By setting the back microcrystalline nano-suspension layer 5 and the front microcrystalline nano-suspension layer 6, the surface wear resistance of the smart card is effectively improved, and the overall aesthetics of the smart card can be improved.

[0020] Preferably, a primary connecting ear 7 is integrally formed on the edge of the card substrate 1, and a secondary connecting ear 8 is integrally formed on the edge of the card panel 2. The primary connecting ear 7 and the secondary connecting ear 8 are symmetrically arranged in a group, and the primary connecting ear 7 and the secondary connecting ear 8 are correspondingly arranged. Preferably, a glue groove 9 is provided on the card substrate 1 and the primary connecting ear 7, a main heat conducting ring 10 is pre-embedded on the outer surface of the card panel 2, and a secondary heat conducting ring 11 is pre-embedded on the secondary connecting ear 8. The main heat conducting ring 10 and the secondary heat conducting ring 11 are integrally formed, and the inner surfaces of the main heat conducting ring 10 and the secondary heat conducting ring 11 are integrally formed with a bonding plate 12, the bonding plate 12 is arranged corresponding to the bonding groove 9, and the bonding groove 9 is filled with hot melt adhesive 13, and the hot melt adhesive 13 forms an adhesive effect on the bonding plate 12, the card panel 2, and the secondary connecting ear 8. The primary connecting ear 7 and the secondary connecting ear 8 can facilitate the connection between the smart card and the key chain, and can be hung as an ornament to increase the aesthetics.

[0021] Preferably, the main heat conducting ring 10, the secondary heat conducting ring 11, and the adhesive plate 12 are all made of copper, the heat resistant temperature of the card substrate 1, the card panel 2, the circuit board 3, the microchip 4, the back microcrystalline nano suspension layer 5, and the front microcrystalline nano suspension layer 6 are all greater than 120 degrees, and the melting temperature of the hot melt colloid 13 is 80 degrees. A microcrystalline nano suspension smart card with a naked eye 3D effect composed of a card substrate 1, a card panel 2, a circuit board 3, a microchip 4, a back microcrystalline nano suspension layer 5, and a front microcrystalline nano suspension layer 6 is provided, and a primary connection ear 7 is provided at the edge of the card substrate 1, a secondary connection ear 8 is provided at the edge of the card panel 2, and by connecting the card substrate 1 and the primary connection ear A glue groove 9 is provided on the connecting ear 7, and a main heat conducting ring 10 is embedded in the card panel 2, a secondary heat conducting ring 11 is embedded in the secondary connecting ear 8, and a bonding plate 12 is provided on the inner surfaces of the main heat conducting ring 10 and the secondary heat conducting ring 11, so that the bonding plate 12 is bonded by the hot melt adhesive 13 to effectively increase the bonding area, thereby ensuring the connection stability between the card substrate 1 and the card panel 2, and the hot melt adhesive 13 can be blown hot air to the main heat conducting ring 10 and the secondary heat conducting ring 11 by a hot air gun at a later stage, so that the hot melt adhesive 13 can be dissolved by utilizing the heat conducting effect of the main heat conducting ring 10, the secondary heat conducting ring 11 and the bonding plate 12, thereby facilitating the disassembly and maintenance of the card substrate 1 and the card panel 2.

[0022] Example 2: Please refer to Figure 2-10On the basis of the first embodiment, preferably, the cross-section of the glue groove 9 is convex, and a glue hole 14 is opened on the glue plate 12, and the glue hole 14 is located at the lower side end of the glue plate 12, and the hot melt glue 13 is immersed in the glue hole 14. By setting the cross-section of the glue groove 9 to be convex and opening the glue hole 14 on the glue plate 12, the hot melt glue 13 flows into the bottom gap of the glue groove 9 and the glue hole 14, so that after the hot melt glue 13 solidifies, the glue plate 12 and the glue groove 9 can form a mutually meshing whole, thereby further ensuring the connection stability between the card base plate 1 and the card panel 2.

[0023] Preferably, a stabilizing groove 15 is provided at the upper side end of the adhesive plate 12. After the card panel 2 is cast, the plate body of the card panel 2 is embedded in the stabilizing groove 15. By setting the stabilizing groove 15, the connection strength of the main heat conducting ring 10 and the secondary heat conducting ring 11 on the card panel 2 and the secondary connecting ear 8 is improved.

[0024] Preferably, the front microcrystalline nano suspension layer 6 and the back microcrystalline nano suspension layer 5 are made of the same material, and the formula (by mass percentage) of the back microcrystalline nano suspension layer 5 includes: Nano silicon dioxide 35%; Lithium silicate 10%; Epoxy resin 21%; Nano-alumina 6%; Glass ionomer cement 9%; Waterborne polyurethane 8%; Surfactant 11%.

[0025] Example 3: Please refer to Fig.11 On the basis of the second embodiment, a process for manufacturing a microcrystalline nano-suspended smart card with naked-eye 3D effect is provided. The process for manufacturing a microcrystalline nano-suspended smart card with naked-eye 3D effect is used to manufacture the above-mentioned microcrystalline nano-suspended smart card with naked-eye 3D effect. The process for manufacturing a microcrystalline nano-suspended smart card with naked-eye 3D effect comprises: Step 1: Preparation process of microcrystalline nano suspension. In the preparation process of the microcrystalline nano suspension, nano silicon dioxide, lithium silicate, epoxy resin, nano aluminum oxide, glass ionomer cement, waterborne polyurethane and surfactant are proportioned and then mixed by a mixing device: Step 2: Microcrystalline nano suspension performance test process, in which the particle size distribution of the suspension is tested using a dynamic light scattering instrument to obtain the average particle size and particle size distribution range of the nanoparticles in the suspension, and then evaluate the dispersibility and stability of the suspension, so as to help achieve a more uniform coating effect and higher smart card performance; Step 3: a microcrystalline nano-suspended layer coating process, in which the back microcrystalline nano-suspended layer 5 and the front microcrystalline nano-suspended layer 6 are coated and formed by an inkjet coating device; Step 4: a microcrystalline nano suspension layer curing process, wherein the microcrystalline nano suspension layer is cured by ultraviolet curing equipment; Step 5: Microcrystalline nano-suspension layer performance evaluation process, the microcrystalline nano-suspension layer performance evaluation process includes mechanical property test, chemical stability test and electrical property test.

[0026] Preferably, the raw material mixing process in the preparation process of the nanosuspension includes a mechanical stirring and dispersing process and an ultrasonic dispersing process. In the mechanical stirring and dispersing process, a high-speed rotating agitator generates a strong shear force so that the nanomaterials are evenly dispersed and mixed in the liquid to form a primary mixed liquid. In the ultrasonic dispersing process, a cavitation effect is generated by high-frequency vibration to break the agglomeration between the nanomaterials and achieve uniform dispersion of nanoparticles to prepare a microcrystalline nanosuspension.

[0027] Preferably, in the mechanical property test, the hardness, wear resistance and impact resistance of the suspension layer are quantitatively analyzed using mechanical property testing equipment to ensure that the suspension layer can withstand the use requirements in various complex environments; In the chemical stability test, the stability of the suspension layer in different chemical media is evaluated to ensure that the smart card can maintain stable performance in various application scenarios; During the performance evaluation process, test data from different batches of products are compared to timely identify potential problems and make improvements. In addition, the performance of the suspension layer is studied through an analytical model.

[0028] Although the above describes the illustrative specific implementation methods of the present application so that technicians in this technical field can understand the present application, the present application is not limited to the scope of the specific implementation methods. For ordinary technicians in this technical field, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations using the concept of the present application are protected.

Claims

1. A microcrystalline nano suspension smart card with naked eye 3D effect, characterized in that: The microcrystalline nano suspension smart card with naked eye 3D effect comprises: A card base plate (1), wherein a mounting groove is provided on the card base plate (1); A card panel (2), wherein the card panel (2) is mounted on the card substrate (1); A circuit board (3), wherein the circuit board (3) is embedded in a mounting groove on the card base plate (1); A microchip (4), wherein the microchip (4) is embedded in a microchip slot mounted on the circuit board (3); A back microcrystalline nano suspension layer (5), wherein the back microcrystalline nano suspension layer (5) is arranged on the outer side of the card substrate (1); A front microcrystalline nano suspension layer (6), wherein the front microcrystalline nano suspension layer (6) is arranged on the outer side of the card panel (2).

2. The microcrystalline nano suspension smart card with naked eye 3D effect according to claim 1, characterized in that: The edge of the card base plate (1) is integrally formed with a primary connection ear (7), and the edge of the card panel (2) is integrally formed with a secondary connection ear (8), and the primary connection ear (7) and the secondary connection ear (8) are symmetrically arranged in a group, and the primary connection ear (7) and the secondary connection ear (8) are arranged correspondingly.

3. The microcrystalline nano suspension smart card with naked eye 3D effect according to claim 2, characterized in that: The card base plate (1) and the primary connecting ear (7) are both provided with a glue groove (9); the outer surface of the card panel (2) is pre-buried with a main heat conducting ring (10); the secondary connecting ear (8) is pre-buried with a secondary heat conducting ring (11); the main heat conducting ring (10) and the secondary heat conducting ring (11) are integrally formed; the inner surfaces of the main heat conducting ring (10) and the secondary heat conducting ring (11) are both integrally formed with a glue plate (12); the glue plate (12) is arranged corresponding to the glue groove (9); the glue groove (9) is filled with a hot melt glue (13); the hot melt glue (13) forms a bonding effect on the glue plate (12), the card panel (2), and the secondary connecting ear (8).

4. The microcrystalline nano suspension smart card with naked eye 3D effect according to claim 3, characterized in that: The main heat conducting ring (10), the secondary heat conducting ring (11), and the adhesive plate (12) are all made of copper. The heat resistant temperatures of the card substrate (1), the card panel (2), the circuit board (3), the microchip (4), the back microcrystalline nano suspension layer (5), and the front microcrystalline nano suspension layer (6) are all greater than 120 degrees. The melting temperature of the hot melt colloid (13) is 80 degrees.

5. The microcrystalline nano suspension smart card with naked eye 3D effect according to claim 4, characterized in that: The cross section of the adhesive groove (9) is convex-shaped, and the adhesive plate (12) is provided with an adhesive hole (14). The adhesive hole (14) is located at the lower side end of the adhesive plate (12), and the hot melt adhesive (13) is immersed in the adhesive hole (14).

6. The microcrystalline nano suspension smart card with naked eye 3D effect according to claim 5, characterized in that: The upper side end of the adhesive plate (12) is provided with a stabilizing groove (15), and after the card panel (2) is cast, the plate body of the card panel (2) is embedded in the stabilizing groove (15).

7. The microcrystalline nano suspension smart card with naked eye 3D effect according to claim 1, characterized in that: The front microcrystalline nano suspension layer (6) and the back microcrystalline nano suspension layer (5) are made of the same material. The formula (by mass percentage) of the back microcrystalline nano suspension layer (5) includes: Nano silicon dioxide 30-40%; Lithium silicate 10-12%; Epoxy resin 15-25%; Nano-alumina 5-8%; Glass ionomer cement 8-11%; Waterborne polyurethane 7-10%; Surfactant 9-14%.

8. A process for manufacturing a microcrystalline nano-suspension smart card with naked-eye 3D effect, characterized in that: The manufacturing process of the microcrystalline nano suspension smart card with naked eye 3D effect is used to manufacture any one of the microcrystalline nano suspension smart cards with naked eye 3D effect of claims 1 to 7, and the manufacturing process of the microcrystalline nano suspension smart card with naked eye 3D effect comprises: Step 1: Preparation process of microcrystalline nano suspension. In the preparation process of the microcrystalline nano suspension, nano silicon dioxide, lithium silicate, epoxy resin, nano aluminum oxide, glass ionomer cement, waterborne polyurethane and surfactant are proportioned and then mixed by a mixing device: Step 2: Microcrystalline nano suspension performance test process, in which the particle size distribution of the suspension is tested using a dynamic light scattering instrument to obtain the average particle size and particle size distribution range of the nanoparticles in the suspension, and then evaluate the dispersibility and stability of the suspension, so as to help achieve a more uniform coating effect and higher smart card performance; Step 3: a microcrystalline nano-suspended layer coating process, in which the back microcrystalline nano-suspended layer (5) and the front microcrystalline nano-suspended layer (6) are coated and formed by using an inkjet coating device; Step 4: a microcrystalline nano suspension layer curing process, wherein the microcrystalline nano suspension layer is cured by ultraviolet curing equipment; Step 5: Microcrystalline nano-suspension layer performance evaluation process, the microcrystalline nano-suspension layer performance evaluation process includes mechanical property test, chemical stability test and electrical property test.

9. The process for manufacturing a microcrystalline nano-suspension smart card with naked-eye 3D effect according to claim 8, characterized in that: The raw material mixing process in the preparation process of the nano suspension includes a mechanical stirring and dispersing process and an ultrasonic dispersing process. In the mechanical stirring and dispersing process, a high-speed rotating stirrer generates a strong shear force, so that the nanomaterials are evenly dispersed and mixed in the liquid to form a primary mixed liquid. In the ultrasonic dispersing process, a cavitation effect is generated by high-frequency vibration to break the agglomeration between the nanomaterials and achieve uniform dispersion of nanoparticles to prepare a microcrystalline nano suspension.

10. The manufacturing process of a microcrystalline nano suspension smart card with naked eye 3D effect according to claim 9, characterized in that: In the mechanical property test, the mechanical property testing equipment is used to quantitatively analyze the hardness, wear resistance and impact resistance of the suspension layer to ensure that the suspension layer can withstand the use requirements in various complex environments; In the chemical stability test, the stability of the suspension layer in different chemical media is evaluated to ensure that the smart card can maintain stable performance in various application scenarios; During the performance evaluation process, test data from different batches of products are compared to timely identify potential problems and make improvements. In addition, the performance of the suspension layer is studied through an analytical model.

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