Intelligent digital production system, method, equipment and medium
By introducing testing, maintenance and binding modules into the intelligent digital production system, the production speed slowdown caused by re-investment after test failure is solved, and a more efficient production process and higher product pass rate is achieved.
Patent Information
- Application Number
- CN202411922896.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-04-25
AI Technical Summary
After the product test fails, the re-investment operation of the intelligent digital production system will slow down the production speed, especially the electronic products cannot be successfully tested through simple re-investment, resulting in a reduced production efficiency.
An intelligent digital production system is designed, including testing modules, maintenance modules and binding modules. The test module tests the test electronic products and generates binding instructions. The binding module binds the failed test product with the barcode and flows into the repair module according to the failure reason. The repair module repairs products with barcodes, binds the number of repairs that have been repaired through the product with the barcode, and reflows into the test module.
By binding the test failure reasons of the electronic products to be tested, the product is repaired according to the failure reasons and re-placed into the test module, the work process of the next station is avoided, the production efficiency of the intelligent digital production system is improved, and the pass rate of electronic products is ensured.
Smart Images
Figure CN119886927A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of digital production technology, and in particular to an intelligent digital production system, method, equipment and medium. Background Art
[0002] As living standards improve, consumers' demands for products are becoming more diversified and personalized. This requires factories to respond quickly to market changes and provide products that meet consumer needs. Intelligent digital production systems can help companies achieve rapid customization and production to meet the diverse needs of consumers, while also speeding up production.
[0003] Most factories have adopted intelligent digital production systems. When the intelligent digital production system tests the product, if the product does not meet the production requirements, the product will be placed in a defective workstation or a re-testing workstation for re-testing. However, if the specific reason for the product test failure is unclear, the re-testing operation will also slow down the production speed of the product, especially electronic products, which cannot be re-tested successfully only by re-testing. Some factories have set up maintenance stations to repair electronic products, but directly enter the next station after maintenance. The next station does not have relevant records of the test module, which delays the production speed of the next station, thereby negatively affecting the production efficiency of the intelligent digital production system, making the intelligent digital production system unable to reach the expected production level.
[0004] Therefore, the present invention provides a new solution to solve this problem. Summary of the invention
[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide an intelligent digital production system, method, equipment and medium, which effectively solve the problem of reducing production efficiency due to the heavy investment method in the intelligent digital production system.
[0006] In a first aspect, an embodiment of the present application provides an intelligent digital production system, the intelligent digital production system comprising a testing module, a maintenance module, and a binding module; The testing module is used to test the electronic products to be tested flowing on the production line through the testing equipment to obtain test-failed products, generate binding instructions based on the test-failed products, and send the binding instructions to the binding module; the binding instructions include the test failure reasons of the test-failed products; The binding module is used to bind the test-failed product with the barcode to be bound based on the binding instruction to obtain the test-failed product with the barcode, and flow the test-failed product with the barcode into the maintenance module according to the test failure reason; The maintenance module is used to scan the test-failed product with the barcode to obtain a scanning result, and to repair the test-failed product with the barcode based on the scanning result to obtain a repaired product, and to bind the repair number of the repaired product with the barcode, so that the bound repaired product can flow back into the test module of the production line for testing.
[0007] In combination with the first aspect, the embodiment of the present application provides a first possible implementation of the first aspect, wherein the test module is used to test the electronic products to be tested flowing on the production line to obtain the test failed products before being specifically used to: The test module performs a secondary test on the repaired products with bar codes, and generates a test verification instruction after obtaining the products that failed the secondary test; the test verification instruction includes the reason for the failure of the secondary test; The test module performs equipment detection on the test equipment in the test module and the maintenance module based on the reason for the failure of the secondary test.
[0008] In combination with the first aspect, an embodiment of the present application provides a second possible implementation of the first aspect, wherein, when the test module performs equipment detection on the test equipment in the test module and the maintenance module based on the cause of the secondary test failure, the test module is specifically used to: The test module is based on whether the test failure reason and the secondary test failure reason meet the preset bad condition; If so, the test module generates a detection instruction to perform equipment detection on the test equipment in the test module and the maintenance module.
[0009] In combination with the first aspect, an embodiment of the present application provides a third possible implementation of the first aspect, wherein the test module, when the test module generates a detection instruction to perform equipment detection on the test module and the test equipment in the maintenance module, is specifically used to: The test module calls the collected multiple sensor signals in the test device based on the detection instruction; The test module infers an accuracy coefficient of the test device based on the plurality of sensor signals to replace the test device based on the accuracy coefficient.
[0010] In combination with the first aspect, an embodiment of the present application provides a fourth possible implementation of the first aspect, wherein the binding module is used to bind the test failed product with the barcode to be bound based on the binding instruction to obtain the test failed product with the barcode, and flow the test failed product with the barcode into the maintenance module according to the cause of the test failure, specifically including.
[0011] The binding module compares the test failure reasons of multiple test-failed products to determine whether the same test failure reason occurs continuously; If so, the binding module generates a replacement instruction to replace the test device in the test module based on the replacement instruction.
[0012] In combination with the first aspect, the embodiment of the present application provides a fifth possible implementation of the first aspect, wherein the maintenance module, when used to bind the maintenance number of the maintenance-passed product with the barcode so that the bound maintenance-passed product can flow back into the test module of the production line for testing, is specifically used to: The maintenance module tests the repaired test-failed product based on a preset test device to determine whether the repair is successful; If so, the maintenance module generates a maintenance binding instruction to bind the maintenance times of the maintenance-passed product with the barcode based on the binding instruction.
[0013] In combination with the first aspect, the embodiment of the present application provides a sixth possible implementation of the first aspect, wherein the intelligent digital production system further includes a monitoring module; The test module is used to test the electronic products to be tested on the production line through the test equipment to obtain the test failed products, specifically used to: The monitoring module monitors the single test time of the testing module when testing the electronic product to be tested, and counts the single test time of the electronic product to be tested to obtain a total time; The monitoring module determines, based on the total time, that a component of the electronic product to be tested needs to be replaced.
[0014] In a second aspect, an embodiment of the present application provides an intelligent digital production method, wherein the intelligent digital production system includes a testing module, a maintenance module, and a binding module, and the method includes: Testing the electronic products to be tested flowing on the production line through the testing equipment to obtain test-failed products, generating a binding instruction based on the test-failed products, and sending the binding instruction to the binding module; the binding instruction includes the test failure reason of the test-failed products; Binding the test-failed product with the barcode to be bound based on the binding instruction to obtain the test-failed product with the barcode, and flowing the test-failed product with the barcode into the maintenance module according to the test failure reason; Scan the test-failed product with the barcode to obtain a scanning result, repair the test-failed product with the barcode based on the scanning result to obtain a repaired product, and bind the repair number of the repaired product to the barcode, so that the bound repaired product can flow back into the test module of the production line for testing.
[0015] In a third aspect, an embodiment of the present application provides an electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor communicates with the memory through the bus, and the machine-readable instructions are executed by the processor to perform the steps of the intelligent digital production method.
[0016] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the intelligent digital production method are executed.
[0017] The present invention achieves the following beneficial effects: The embodiment of the present application provides an intelligent digital production system, which includes a testing module, a maintenance module, and a binding module; first, the testing module is used to test the electronic products to be tested flowing on the production line through the testing equipment to obtain test-failed products, so as to generate binding instructions based on the test-failed products, and send the binding instructions to the binding module; the binding instructions include the test failure reason of the test-failed products; then the binding module is used to bind the test-failed products with the barcode to be bound based on the binding instructions to obtain the test-failed products with barcodes, and flow the test-failed products with barcodes into the maintenance module according to the test failure reasons; finally, the maintenance module is used to The scanning result is obtained by scanning the test-failed product with the barcode, and the test-failed product with the barcode is repaired based on the scanning result to obtain a repaired product, and the repair number of the repaired product is bound to the barcode, so that the bound repaired product can flow back into the test module of the production line for testing. After binding the reason for the test failure of the electronic product to be tested, the test-failed product is repaired according to the reason for the test failure, and is placed in the test module for retesting, so that a test pass record is generated in the test module, thereby avoiding delaying the work progress of the next workstation, thereby ensuring and improving the production efficiency of the intelligent digital production system, and also ensuring the pass rate of electronic products. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a structural diagram of an intelligent digital production system provided by the present invention; Figure 2 is a schematic diagram of part of the circuit principle of the test module provided by the present invention; Figure 3 It is a flow chart of an intelligent digital production method provided by the present invention; Figure 4 It is a structural schematic diagram of an electronic device provided by the present invention. DETAILED DESCRIPTION
[0019] For the above and other technical contents, features and effects of the present invention, please refer to the following attached Figure 1-4 The detailed description of the embodiments will clearly show that the structural contents mentioned in the following embodiments are all based on the drawings in the specification.
[0020] Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.
[0021] Most of the current factories have adopted intelligent digital production systems. When testing products, if the products do not meet the production requirements, they will be placed in a defective workstation or a re-testing workstation for re-testing. However, if the specific reason for the product test failure is unclear, the re-testing operation will also slow down the production speed of the product, especially electronic products, which cannot be successfully retested by re-testing alone. Some factories have set up maintenance stations to repair electronic products, but directly enter the next station after maintenance. The next station does not have a test module test pass record, which delays the production speed of the next station, thereby negatively affecting the production efficiency of the intelligent digital production system, making the intelligent digital production system unable to reach the expected production level.
[0022] Based on this, the embodiments of the present application provide an intelligent digital production system, method, device and medium, which are described below through embodiments.
[0023] To facilitate understanding of this embodiment, firstly, an intelligent digital production system disclosed in the embodiment of this application is described in detail. Figure 1 The structure diagram of an intelligent digital production system shown in the figure, an intelligent digital production system provided by the present application, the intelligent digital production system includes a testing module, a maintenance module, and a binding module; The testing module is used to test the electronic products to be tested flowing on the production line through the testing equipment to obtain test-failed products, generate binding instructions based on the test-failed products, and send the binding instructions to the binding module; the binding instructions include the test failure reasons of the test-failed products; The binding module is used to bind the test-failed product with the barcode to be bound based on the binding instruction to obtain the test-failed product with the barcode, and flow the test-failed product with the barcode into the maintenance module according to the test failure reason; The maintenance module is used to scan the test-failed product with the barcode to obtain a scanning result, and to repair the test-failed product with the barcode based on the scanning result to obtain a repaired product, and to bind the repair number of the repaired product with the barcode, so that the bound repaired product can flow back into the test module of the production line for testing.
[0024] In the present application, the test module is a module or device that uses a test device to test the electronic product to be tested. The test module tests the electronic product to be tested based on the use environment of the electronic product. The use environment may include humidity, temperature, electromagnetic interference, insulation, etc., so the test device also provides a corresponding test environment to test the electronic product to be tested. The test device also tests based on the test line and the circuit board included, and after the test is completed, it is determined whether the electronic product to be tested has passed the test based on the test device, and a test result is generated. If the test result is passed, the test module generates a pass instruction based on the passed electronic product, and the pass instruction includes a test record and a passed test result, and sends the pass instruction to the binding module. The binding module is configured to bind the electronic product that has passed the test with the barcode to be bound and the test record and test result in the pass instruction to obtain a bound test-pass product, and the test-pass product includes a barcode. After the binding is completed, the binding module will flow the electronic product that has passed the test to the next workstation, so that the next workstation can obtain the corresponding test record and the corresponding test result by scanning the barcode, thereby ensuring the progress of the next workstation; if the test result is failure, the test module will generate a binding instruction for the test record and the corresponding test result, and the binding instruction also includes the test record and the test result of failure and sends the binding instruction to the binding module; unlike the pass instruction, the binding instruction also includes the test failure reason of the test failed product.
[0025] The binding module is used to bind the test-failed product with the barcode to be bound based on the binding instruction to obtain a test-failed product with a barcode, and the test failure reason of the test-failed product can be obtained through the barcode, wherein the barcode can be a barcode, a QR code, or other forms, which are not limited here. The binding module also judges the type corresponding to the test failure reason, and the types include repairable or maintainable and unrepairable and unrepairable. If the test failure reason is repairable or maintainable, such as a part in the electronic product is lost, the test-failed product with the barcode is flowed into the maintenance module according to the test failure reason; if the test failure reason is unrepairable or unrepairable, such as a circuit board in the electronic product is broken, the binding module directly flows the electronic product through the production line to the bad workstation, thereby reducing the need for the test module to retest, so as to avoid affecting the working efficiency of the test module and the intelligent digital production system.
[0026] The binding module is used to bind the test failed product with the barcode to be bound based on the binding instruction to obtain the test failed product with the barcode, and flow the test failed product with the barcode into the maintenance module according to the test failure reason, specifically including.
[0027] The binding module compares the test failure reasons of multiple test-failed products to determine whether the same test failure reason occurs continuously; If so, the binding module generates a replacement instruction to replace the test device in the test module based on the replacement instruction.
[0028] In this embodiment, after receiving the test failed product and the corresponding test failure reason generated by the test module, the binding module binds the test failure reason with the barcode to be bound, and stores the test failure reason with the corresponding barcode. After continuously storing the test failure reasons corresponding to multiple consecutive test failed products, the test failure reasons corresponding to the multiple test failed products are compared to determine whether the test failure reasons corresponding to the multiple test failed products are the same, where the multiple number can be greater than 3, and the specific setting can be based on actual conditions. If yes, that is, the test failure reasons corresponding to multiple consecutive test failed products are the same, then the binding module determines that the test equipment of the test module is faulty and needs to be replaced. At this time, the binding module generates a replacement instruction to send the replacement instruction to the intelligent digital production system. The intelligent digital production system responds to the replacement instruction and replaces the test equipment in the test module based on the replacement instruction. If no, that is, the test failure reasons corresponding to multiple consecutive test failed products are different, then the binding module cannot generate a replacement instruction, and the binding module still follows the existing working mode to continue binding.
[0029] The maintenance module is used to scan the test-failed product with a barcode to obtain a scanning result, wherein the scanning result includes the test record, test time, test failure reason of the test module, and the barcode bound by the binding module, binding time, etc., so as to repair the test-failed product with the barcode based on the scanning result to obtain a repaired product. The repaired product is a test-failed product that is tested in the maintenance module and the test result generated is a passed product. In order to ensure accuracy, the bound repaired product is re-flowed into the test module of the production line for testing to generate a test record of the passed test of the test module, and the repair times of the repaired product are bound to the barcode, that is, the repair times of the electronic product can be known through the barcode. If the repair times of the electronic product exceed the preset times, that is, the electronic product does not have the qualification at this time, the electronic product will directly flow into the defective workstation, thereby ensuring the quality of the electronic product, and also realizing that the test status of the electronic product can be mastered based on the barcode, thereby realizing the intelligence and digitization of the factory.
[0030] The maintenance module, when used to bind the maintenance times of the maintenance-passed product with the barcode so that the bound maintenance-passed product can flow back into the test module of the production line for testing, is specifically used to: The maintenance module tests the repaired test-failed product based on a preset test device to determine whether the repair is successful; If so, the maintenance module generates a maintenance binding instruction to bind the maintenance times of the maintenance-passed product with the barcode based on the binding instruction.
[0031] In this embodiment, after the maintenance module repairs the test-failed product, in order to ensure the maintenance effect, the preset test equipment is called to test the repaired test-failed product and generate a maintenance test result. The preset test equipment is consistent with the test equipment in the test module. The maintenance test result includes pass and fail. When the maintenance result is fail, the maintenance module determines that the test-failed product is a defective product. The maintenance module also generates a flow instruction based on the test-failed product that failed the repair, so as to flow the test-failed product that failed the repair into a defective workstation based on the flow instruction, and bind the maintenance record with the maintenance result and the barcode on the test-failed product, so that the intelligent digital production system can grasp the movement of the electronic product through the barcode of the electronic product, and the test-failed product that passed the repair is the repaired product. The maintenance number is also bound to the barcode, so that the bound repaired product can flow back into the test module of the production line for testing, so as to generate a test record of passing the test in the test module.
[0032] The intelligent digital production system also includes a monitoring module; The test module is used to test the electronic products to be tested on the production line through the test equipment to obtain the test failed products, specifically used to: The monitoring module monitors the single test time of the testing module when testing the electronic product to be tested, and counts the single test time of the electronic product to be tested to obtain a total time; The monitoring module determines, based on the total time, that a component of the electronic product to be tested needs to be replaced.
[0033] In this embodiment, the monitoring module monitors the single test time of the electronic product to be tested by the test module. The monitoring method can be specifically set according to actual conditions, such as obtaining the start test time and the end test time of the electronic product to be tested by the test module, and calculating the test time based on the start test time and the end test time. The API interface of the test device is also obtained, and the single test time of the electronic product to be tested is used to obtain the total time, that is, if the electronic product to be tested fails in the test module and flows back to the test module for testing after passing through the maintenance module, the secondary test time is generated, then the monitoring module determines the total time of each electronic product to be tested based on the barcode, and the monitoring module determines that the parts of the electronic product to be tested need to be replaced based on the total time. If the total time meets the preset qualified condition, the preset qualified condition is that the total time is greater than the preset threshold, and the preset threshold can be specifically set according to actual conditions, that is, the defective rate of the electronic product at this time is large, and it no longer has the qualified qualification, so it is necessary to flow the electronic product to be tested to the defective workstation through the production line, and there is no need to process the electronic product to be tested at the next workstation.
[0034] The test module is used to test the electronic products to be tested on the production line and obtain the test failed products before the test module is used to: The test module performs a secondary test on the repaired products with bar codes, and generates a test verification instruction after obtaining the products that failed the secondary test; the test verification instruction includes the reason for the failure of the secondary test; The test module performs equipment detection on the test equipment in the test module and the maintenance module based on the reason for the failure of the secondary test.
[0035] In this embodiment, in order to make the test pass record exist on the repair passed product with the barcode, the test module also needs to perform a secondary test on the electronic product to be tested. The repair passed products with barcodes and the electronic products to be tested without barcodes received through the production line are mixed together and cannot be distinguished. The test module also needs to first determine whether there is a barcode on the product to be tested. It can be done manually or by using a camera or an infrared camera to obtain whether there is a barcode at a specific position on the product to be tested. The specific position is the position where the barcode is placed on the electronic product set by the binding module. If there is a barcode, no binding instruction is generated after the secondary test result is generated, and the test record can be bound to the repair passed product. Binding is performed through the barcode on the product, otherwise a binding instruction is generated after the test of the electronic product to be tested is completed. Here, the test module performs a secondary test on the repair-passed product with the barcode to obtain a secondary test result, and the secondary test result includes a test pass and a test fail, and the repair-passed product corresponding to the test failure is a secondary test failed product. After obtaining the secondary test failed product, the test module generates a test verification instruction, and the test verification instruction includes the secondary test failure reason, and binds the secondary test record to the secondary test failed product. The test module makes a judgment based on the secondary test failure reason and the test failure reason, and performs equipment detection on the test equipment in the test module and the maintenance module.
[0036] When the test module performs equipment detection on the test module and the test equipment in the maintenance module based on the reason for the secondary test failure, the test module is specifically used to: The test module is based on whether the test failure reason and the secondary test failure reason meet the preset bad condition; If so, the test module generates a detection instruction to perform equipment detection on the test equipment in the test module and the maintenance module.
[0037] In this embodiment, the test module compares the test failure cause with the secondary test failure cause to obtain a comparison result, the preset bad condition is that the test failure cause is consistent with the secondary test failure cause, and the bad condition is set for the test module and the test equipment in the maintenance module. If the comparison result is consistent, that is, the test failure cause is the same as the secondary test failure cause, that is, at least one of the test equipment of both parties has a fault or abnormality, the test module generates a detection instruction, and based on the test instruction, performs equipment detection on the test module and the test equipment in the maintenance module. If the comparison result is inconsistent, it does not meet the preset bad condition, that is, the test failure cause is different from the secondary test failure cause at this time, then the test module, the binding module and the maintenance module repeat the corresponding functional effects to re-repair the repaired product for the corresponding test failure cause.
[0038] If yes, the test module generates a detection instruction to perform equipment detection on the test module and the test equipment in the maintenance module, specifically for: The test module calls the collected multiple sensor signals in the test device based on the detection instruction; The test module infers an accuracy coefficient of the test device based on the plurality of sensor signals to replace the test device based on the accuracy coefficient.
[0039] The test module obtains multiple sensor signals in the test equipment based on the detection instruction, and the sensor signals include humidity signals and current signals. As shown in the figure, the humidity signal is acquired based on the humidity sensor U1, and the current signal is acquired based on the current sensor U2. The humidity sensor U1 can be a humidity sensor of the HX71 series, and the current sensor U2 can be a current sensor of the AHKC-EKBA series. That is, the humidity of the use environment of some electronic products to be tested is relatively high. In order to simulate the environment, the humidity of the test equipment is also relatively high, which causes the humidity in the test equipment to rise. After being acquired by the humidity sensor U1, the humidity signal is transmitted through the resistor R3. The comparison signal is sent to the operational amplifier U2B and compared with the rated humidity signal provided by the power supply VCC through the resistor R1, and the comparison signal is output through the operational amplifier U2B. The comparison signal is the comparison result between the humidity signal and the rated humidity signal. The comparison signal is divided into two paths, one of which is output to the 2 pin of the multiplier V2, and the other is output to the relay K5. When the comparison signal cannot turn on the relay K5, it indicates that the amplitude of the humidity signal is smaller than the amplitude of the rated humidity signal. At this time, the humidity in the test equipment will not cause the test equipment to be abnormal. If the comparison signal cannot turn on the relay K5, it indicates that the amplitude of the humidity signal is larger than the amplitude of the rated humidity signal. At this time, the humidity in the test equipment will cause the test equipment to be abnormal, then the relay K5 closes the switch S5, and the current sensor U2 is powered on to start detecting the current signal of the test equipment. The current signal is output to the operational amplifier U1B through the resistor R6, and is subtracted from the rated current signal provided by the positive polarity power supply VCC through the resistor R5, and a difference signal between the current signal and the rated current signal is output, and the difference signal is output to the divider composed of the multiplier V1 and the operational amplifier U3A through the resistor R15, and is divided with the rated current signal provided by the resistor R7, wherein the rated current signal provided by the resistor R5 is the same as the rated current signal provided by the resistor R7, and the divider outputs a multiple signal. When the multiple signal turns on the diode D1, it indicates that the difference signal at this time is many times larger than the rated current signal, and at this time When a short circuit occurs in the test equipment due to excessive internal humidity, the multiple signal turns on the relay K3, and the relay K3 closes the switch S3. The multiple signal is output to the 1 pin of the multiplier V2 through the closed switch S3. When the multiplier V2 is turned on by multiplying the multiple signal with the comparison signal, the multiplier V2 outputs an operation signal. When the operation signal turns on the diode D3, it indicates that the humidity rise in the test equipment has caused a short circuit. The operation signal is output to the microprocessor of the test module. The microprocessor of the test module is a miniature processor, and the specific model is not limited. After receiving the operation signal, the microprocessor immediately starts relevant rescue measures to protect the test equipment.And based on the operation signal, it is inferred that the accuracy coefficient of the test equipment is lower than the preset accuracy threshold value, and the preset accuracy threshold value is specifically set according to the specific situation. In this case, the test equipment needs to be replaced. If the operation signal cannot turn on the diode D3 and turns on the diode D2 through the NOT gate U4A, then the humidity increase in the test equipment does not cause a short circuit phenomenon. Because the operation signal is at a low level, and the humidity signal controls the current signal, only the comparison signal corresponding to the humidity signal is at a high level and the multiple signal corresponding to the current signal is at a low level, that is, no short circuit phenomenon occurs at this time. At this time, the diode D2 turns on the relay K4, and the relay K4 closes the switch S4. At this time, the switch S4 transmits the humidity signal to the microprocessor of the test module, and at this time, the microprocessor forms a continuous monitoring of the humidity of the test equipment. ,
[0040] The test module includes a humidity sensor U1 and a current sensor U2. The out pin of the humidity sensor U1 is connected to one end of a resistor R3. The other end of the resistor R3 is respectively connected to one end of a switch S4 and the in-phase end of an op amp U2B. The reverse end of the op amp U2B is connected to one end of the resistor R1. The other end of the resistor R1 is respectively connected to one end of a resistor R7 and one end of a switch S5 and connected to a positive polarity power supply VCC and the vcc pin of the humidity sensor U1. The output end of the op amp U2B is respectively connected to the 2 The output end of the multiplier V2 is connected to the positive electrode of the diode D3 and the input end of the NOT gate U4A respectively. The negative electrode of the diode D3 is connected to the microprocessor and the other end of the switch S4 respectively. The output end of the NOT gate U4A is connected to the positive electrode of the diode D2. The negative electrode of the diode D2 is connected to one end of the relay K4. The 1 pin of the multiplier V2 is connected to one end of the switch S3. The other end of the switch S3 is connected to the negative electrode of the diode D1 and one end of the relay K3 respectively. The positive electrode of the diode D1 is connected to the operational amplifier U The output end of the op amp U3A is connected to the 2nd pin of the multiplier V1, the 1st pin of the multiplier V1 is connected to the other end of the resistor R7, the inverting end of the op amp U3A is connected to one end of the resistor R14 and one end of the resistor R15 respectively, the other end of the resistor R14 is connected to the output end of the multiplier V1, the output end of the op amp U3A is connected to one end of the resistor R16, the other end of the resistor R15 is connected to one end of the resistor R8 and the output end of the op amp U1B respectively, the inverting end of the op amp U1B is connected to the other end of the resistor R8 and one end of the resistor R5 respectively. The in-phase end of the operational amplifier U1B is connected to one end of the resistor R13 and one end of the resistor R6, and the other end of the resistor R6 is connected to the out pin of the current sensor U2. The out pin of the current sensor U2 is connected to the other end of the resistor R13, the other end of the resistor R16, the other end of the relay K4, the other end of the relay K3, the other end of the relay K5, the gnd pin of the humidity sensor U1 and the ground. Example
[0041] The present application also provides an intelligent digital production method. Figure 3 As shown, the intelligent digital production system includes a testing module, a maintenance module, and a binding module, and the method includes: S101, testing the electronic products to be tested flowing on the production line by means of a testing device to obtain test-failed products, generating a binding instruction based on the test-failed products, and sending the binding instruction to the binding module; the binding instruction includes the test failure reason of the test-failed products; S102, binding the test-failed product with the barcode to be bound based on the binding instruction to obtain the test-failed product with the barcode, and flowing the test-failed product with the barcode into the maintenance module according to the test failure reason; S103, scanning the test-failed product with the barcode to obtain a scanning result, repairing the test-failed product with the barcode based on the scanning result to obtain a repaired product, and binding the repair number of the repaired product with the barcode, so that the bound repaired product can flow back into the test module of the production line for testing.
[0042] The intelligent digital production method provided in the embodiment of the present application can achieve the same and all technical effects as the intelligent digital production system, and will not be elaborated here. Example
[0043] The present application also provides an electronic device, such as Figure 4 As shown, it includes: a processor 401, a memory 402 and a bus 403, the memory 402 stores machine-readable instructions executable by the processor 401, when the electronic device is running, the processor 401 communicates with the memory 402 through the bus 403, and the machine-readable instructions are executed by the processor 401 to perform the steps of the intelligent digital production method. Example
[0044] An embodiment of the present application also provides a computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the intelligent digital production method are executed.
[0045] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working process of the electronic device and the medium described above can refer to the corresponding process in the system embodiment, and will not be repeated in this application. In the several embodiments provided in this application, it should be understood that the disclosed system, electronic device and medium can be implemented in other ways. The system embodiments described above are merely schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation. For example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some communication interfaces, devices or modules, which can be electrical, mechanical or other forms.
[0046] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0047] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
[0048] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a platform server, or a network device, etc.) to execute all or part of the steps of each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.
[0049] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. An intelligent digital production system, characterized in that: The intelligent digital production system includes a testing module, a maintenance module, and a binding module; The testing module is used to test the electronic products to be tested flowing on the production line through the testing equipment to obtain test-failed products, generate binding instructions based on the test-failed products, and send the binding instructions to the binding module; the binding instructions include the test failure reasons of the test-failed products; The binding module is used to bind the test-failed product with the barcode to be bound based on the binding instruction to obtain the test-failed product with the barcode, and flow the test-failed product with the barcode into the maintenance module according to the test failure reason; The maintenance module is used to scan the test-failed product with the barcode to obtain a scanning result, and to repair the test-failed product with the barcode based on the scanning result to obtain a repaired product, and to bind the repair number of the repaired product with the barcode, so that the bound repaired product can flow back into the test module of the production line for testing.
2. The intelligent digital production system according to claim 1, characterized in that: The test module is used to test the electronic products to be tested on the production line and obtain the test failed products before the test module is used to: The test module performs a secondary test on the electronic product to be tested with the barcode, so as to generate a test verification instruction after obtaining a product that fails the secondary test; the test instruction includes the reason for the failure of the secondary test; The test module performs equipment detection on the test equipment in the test module and the maintenance module based on the reason for the failure of the secondary test.
3. The intelligent digital production system according to claim 2, characterized in that: When the test module performs equipment detection on the test module and the test equipment in the maintenance module based on the reason for the secondary test failure, the test module is specifically used to: The test module is based on whether the test failure reason and the secondary test failure reason meet the preset bad condition; If not, the test module generates a detection instruction to perform equipment detection on the test equipment in the test module and the maintenance module.
4. The intelligent digital production system according to claim 3, characterized in that: If no, the test module generates a detection instruction to perform equipment detection on the test module and the test equipment in the maintenance module, specifically for: The test module calls the collected multiple sensor signals in the test device based on the detection instruction; The test module infers an accuracy coefficient of the test device based on the plurality of sensor signals to replace the test device based on the accuracy coefficient.
5. The intelligent digital production system according to claim 1, characterized in that: The binding module is used to bind the test failed product with the barcode to be bound based on the binding instruction to obtain the test failed product with the barcode, and flow the test failed product with the barcode into the maintenance module according to the test failure reason, specifically including: The binding module compares the test failure reasons of multiple test-failed products to determine whether the same test failure reason occurs continuously; If so, the binding module generates a replacement instruction to replace the test device in the test module based on the replacement instruction.
6. The intelligent digital production system according to claim 1, characterized in that: The maintenance module, when used to bind the maintenance times of the maintenance-passed product with the barcode so that the bound maintenance-passed product can flow back into the test module of the production line for testing, is specifically used to: The maintenance module tests the repaired test-failed product based on a preset test device to determine whether the repair is successful; If so, the maintenance module generates a maintenance binding instruction to bind the maintenance times of the maintenance-passed product with the barcode based on the binding instruction.
7. The intelligent digital production system according to claim 1, characterized in that: The intelligent digital production system also includes a monitoring module; The test module is used to test the electronic products to be tested on the production line through the test equipment to obtain the test failed products, specifically used to: The monitoring module monitors the single test time of the testing module when testing the electronic product to be tested, and counts the single test time of the electronic product to be tested to obtain a total time; The monitoring module determines, based on the total time, that a component of the electronic product to be tested needs to be replaced.
8. An intelligent digital production system, characterized in that: The intelligent digital production system includes a testing module, a maintenance module, and a binding module, and the method includes: Testing the electronic products to be tested flowing on the production line through the testing equipment to obtain test-failed products, generating a binding instruction based on the test-failed products, and sending the binding instruction to the binding module; the binding instruction includes the test failure reason of the test-failed products; Binding the test-failed product with the barcode to be bound based on the binding instruction to obtain the test-failed product with the barcode, and flowing the test-failed product with the barcode into the maintenance module according to the test failure reason; Scan the test-failed product with the barcode to obtain a scanning result, repair the test-failed product with the barcode based on the scanning result to obtain a repaired product, and bind the repair number of the repaired product to the barcode, so that the bound repaired product can flow back into the test module of the production line for testing.
9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate via the bus, and when the machine-readable instructions are executed by the processor, the steps of an intelligent digital production system as described in claim 8 are performed.
10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the intelligent digital production system as claimed in claim 8 are executed.