Processing liquid supply apparatus, substrate processing apparatus, and processing liquid supply method

Abstract

The invention provides a processing liquid supply apparatus, a substrate processing apparatus, and a processing liquid supply method. The processing liquid supply device includes a first circulation device, a second circulation device, a mixture discharge unit, and a liquid supply unit. The first circulation device has a first circulation system connected to a first liquid supply source, and supplies a first liquid flowing through at least a part of the first circulation system to the mixing and leading-out unit. The second circulation device has a second circulation system connected to a second liquid supply source, and supplies a second liquid flowing through at least a portion of the second circulation system to the mixture discharge unit. The mixing and leading-out unit mixes the first liquid and the second liquid and leads the mixed liquid to a main storage tank provided in the liquid supply unit. The liquid supply unit supplies the mixed liquid stored in the main storage tank as a processing liquid to the substrate processing unit.

Description

Technical Field

[0001] The present invention relates to a processing liquid supply device for supplying processing liquid to one or more substrate processing parts, a substrate processing device and a processing liquid supply method. Background Art

[0002] A substrate processing apparatus is used to perform various processes on substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates of liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates.

[0003] As an example of a substrate processing device, Japanese Patent Publication No. 2020-198357 describes a substrate processing device that uses a processing liquid to process a substrate. The substrate processing device includes a substrate processing unit and a liquid medicine generating unit. The liquid medicine generating unit generates a processing liquid by diluting the liquid medicine. In the substrate processing unit, the substrate is subjected to a predetermined processing using the processing liquid generated by the liquid medicine generating unit. In the following description, for the sake of convenience, the liquid medicine generating unit described in Japanese Patent Publication No. 2020-198357 is referred to as a processing liquid supply device.

[0004] When the processing liquid is generated in the processing liquid supply device, the original liquid of the chemical liquid supplied from the chemical liquid supply source is transported to the mixing pipe. In addition, the dilution liquid supplied from the dilution liquid supply source is transported to the mixing pipe. The chemical liquid and the dilution liquid supplied to the mixing pipe are mixed with each other and stored in the mixing container as the processing liquid. The processing liquid stored in the mixing container is supplied to the substrate processing unit. Summary of the invention

[0005] When mixing the chemical liquid and the diluent liquid in the mixing pipe, if the flow rate of the chemical liquid supplied to the mixing pipe and the flow rate of the diluent liquid supplied to the mixing pipe are not accurately adjusted, the chemical liquid and the diluent liquid cannot be mixed at a predetermined ratio. In this case, the quality of the processing liquid stored in the mixing container is reduced, and high-quality processing liquid cannot be supplied to the substrate processing unit.

[0006] The flow rate of the liquid medicine supplied to the mixing pipe is adjusted by a flow rate adjustment mechanism such as an electric needle valve, and becomes unstable for a certain period of time from the time when the liquid medicine is supplied to the mixing pipe. In addition, the flow rate of the dilution liquid supplied to the mixing pipe is also adjusted by a flow rate adjustment mechanism, and becomes unstable for a certain period of time from the time when the dilution liquid is supplied to the mixing pipe. Therefore, it is impossible to generate a high-quality treatment liquid immediately after the treatment liquid is generated.

[0007] Therefore, in the treatment liquid supply device of Japanese Patent Publication No. 2020-198357, the mixed liquid mixed in the mixing pipe is discarded (pre-discharged) within a certain period from the start time of the treatment liquid generation. However, discarding the mixed liquid (low-quality treatment liquid) that is not generated under predetermined conditions as drainage (industrial waste) is the main reason for increasing the cost of consumables used to generate the treatment liquid.

[0008] An object of the present invention is to provide a processing liquid supply device, a substrate processing device, and a processing liquid supply method, which are capable of stably supplying a high-quality processing liquid to a substrate processing section without discarding a low-quality processing liquid.

[0009] A processing liquid supply device according to one aspect of the present invention is a processing liquid supply device that supplies a mixed liquid including a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, and comprises: a liquid supply part, which includes a main storage tank for storing the above-mentioned mixed liquid, and supplies the above-mentioned mixed liquid stored in the above-mentioned main storage tank as the above-mentioned processing liquid to the above-mentioned one or more substrate processing parts; a mixing outlet part, which guides the above-mentioned mixed liquid to the above-mentioned main storage tank; a first circulation device, which has a first circulation system connected to a first liquid supply source, and supplies the above-mentioned first liquid flowing in at least a part of the above-mentioned first circulation system to the above-mentioned mixing outlet part; and a second circulation device, which has a second circulation system connected to a second liquid supply source, and supplies the above-mentioned second liquid flowing in at least a part of the above-mentioned second circulation system to the above-mentioned mixing outlet part.

[0010] A processing liquid supply device according to another aspect of the present invention is a processing liquid supply device that supplies a mixed liquid including a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, and comprises: a liquid supply part, which includes a main storage tank for storing the above-mentioned mixed liquid, and supplies the above-mentioned mixed liquid stored in the above-mentioned main storage tank as the above-mentioned processing liquid to the above-mentioned one or more substrate processing parts; a mixing outlet part, which guides the above-mentioned mixed liquid to the above-mentioned main storage tank; a first auxiliary storage tank, which is connected to a first liquid supply source and stores the above-mentioned first liquid supplied from the above-mentioned first liquid supply source in a predetermined amount; a first supply device, which supplies the above-mentioned first liquid stored in the above-mentioned first auxiliary storage tank to the above-mentioned mixing outlet part; a second auxiliary storage tank, which is connected to a second liquid supply source, and stores the above-mentioned second liquid supplied from the above-mentioned second liquid supply source in a predetermined amount; and a second supply device, which supplies the above-mentioned second liquid stored in the above-mentioned second auxiliary storage tank to the above-mentioned mixing outlet part.

[0011] A substrate processing apparatus according to another aspect of the present invention includes the above-mentioned processing liquid supply apparatus and the above-mentioned one or more substrate processing units.

[0012] According to another aspect of the present invention, a processing liquid supply method is a processing liquid supply method for supplying a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, comprising: a step of using a first circulation device and a second circulation device to supply the first liquid and the second liquid to a mixing outlet; a step of mixing the first liquid and the second liquid supplied by the first circulation device and the second circulation device in the mixing outlet and guiding the mixed liquid to a main storage tank; and a step of supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing parts, the first circulation device having a first circulation system connected to a first liquid supply source, and the second circulation device having a second circulation system connected to a second liquid supply source.

[0013] A processing liquid supply method according to another embodiment of the present invention is a processing liquid supply method for supplying a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, comprising: a step of supplying the first liquid and the second liquid to a mixing outlet part from a first sub-reservoir connected to a first liquid supply source and storing a predetermined amount of the first liquid supplied from the first liquid supply source, and a second sub-reservoir connected to a second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source; a step of mixing the first liquid and the second liquid in the mixing outlet part and guiding the mixed liquid to a main reservoir; and a step of supplying the mixed liquid stored in the main reservoir as the processing liquid to the one or more substrate processing parts.

[0014] According to the present invention, a high-quality processing liquid generated under predetermined conditions can be stably supplied to one or more substrate processing units without discarding a low-quality processing liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of a substrate processing apparatus according to a first embodiment.

[0016] Figure 2 It is used to illustrate Figure 1 A timing chart showing an example of the operation of the substrate processing apparatus.

[0017] Figure 3 Yes means Figure 1 A block diagram of a structure of a control system of a substrate processing apparatus.

[0018] Figure 4 This is a flowchart of the processing liquid generation process performed by the control unit.

[0019] Figure 5 It is a schematic structural diagram of a substrate processing apparatus according to a second embodiment.

[0020] Figure 6 It is a schematic structural diagram of a substrate processing apparatus according to a third embodiment.

[0021] Figure 7 This is a block diagram showing a configuration example of a substrate processing apparatus according to another embodiment. DETAILED DESCRIPTION

[0022] Hereinafter, a processing liquid supply device, a substrate processing device, and a substrate processing method according to an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, the substrate refers to a FPD (Flat Panel Display) substrate, a semiconductor substrate, an optical disk substrate, a magnetic disk substrate, an optical magneto-optical disk substrate, a photomask substrate, a ceramic substrate, or a solar cell substrate, etc., used in a liquid crystal display device or an organic EL (ElectroLuminescence) display device.

[0023] 1. First Implementation Method

[0024] <1> Overview of the structure of the substrate processing apparatus

[0025] Figure 1 This is a schematic structural diagram of a substrate processing apparatus according to a first embodiment. The substrate processing apparatus 1 mainly includes a processing liquid supply device 2, a substrate processing unit 3, and a control unit 9, and is disposed in, for example, a factory. In the factory, a first liquid supply source 5 and a second liquid supply source 6 are provided as resource energy equipment used in the substrate processing apparatus 1. The second liquid supply source 6 is a supply source of a chemical liquid, and the chemical liquid of the second liquid supply source 6 in this embodiment is fluoric acid. In addition, the first liquid supply source 5 is a supply source of a diluting liquid for diluting the chemical liquid, and the diluting liquid of the first liquid supply source 5 in this embodiment is deionized water. In the following description, fluoric acid is expressed as HF, and deionized water is expressed as DIW.

[0026] In addition, the liquid of the second liquid supply source 6 may be replaced by HF and may be an aqueous solution such as buffered hydrofluoric acid (BHF), dilute hydrofluoric acid (DHF), hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid or ammonia water, or a mixed solution thereof. In addition, the diluent of the first liquid supply source 5 may be replaced by DIW and may be carbonated water, ozone water, magnetic water, functional water, ionized water or an organic solvent.

[0027] The processing liquid supply device 2 is connected to a first liquid supply source 5 and a second liquid supply source 6. The processing liquid supply device 2 mixes DIW supplied from the first liquid supply source 5 and HF supplied from the second liquid supply source 6 at a predetermined ratio. In the present embodiment, the predetermined mixing ratio between DIW and HF is 100:1. Thus, a mixed liquid (diluted liquid) in which HF is diluted by a large amount of DIW is generated. The generated mixed liquid is stored in a main storage tank 30 described later as a processing liquid. The processing liquid stored in the main storage tank 30 is supplied to the substrate processing unit 3.

[0028] The processing liquid supply device 2 of this embodiment has a plurality of structures for producing high-quality processing liquid without discarding low-quality processing liquid. The structure and operation of the processing liquid supply device 2 will be described in detail later.

[0029] The substrate processing section 3 includes a plurality of processing units 4. Each processing unit 4 is provided with a spin chuck 4a, a nozzle 4b, and a cup 4c. The spin chuck 4a is configured to hold a substrate W to be processed. In addition, the spin chuck 4a is rotationally driven by a driving device (e.g., an electric motor) not shown in the figure while holding the substrate W. As a result, the substrate W held by the spin chuck 4a rotates.

[0030] The nozzle 4b ejects the processing liquid supplied from the processing liquid supply device 2 to the substrate processing device 1 toward the substrate W held and rotated by the spin chuck 4a. As a result, the surface (in this example, the upper surface) of the substrate W is processed. The support cup 4c is configured to surround the substrate W held by the spin chuck 4a, and receive the processing liquid thrown out from the substrate W when the substrate W is processed. A portion of the processing liquid received by the support cup 4c is returned to the processing liquid supply device 2 through the recovery pipe p33 described later.

[0031] The control unit 9 controls the operation of each unit of the processing liquid supply device 2 and the substrate processing unit 3. The details of the control unit 9 will be described later.

[0032] <2> Configuration of the treatment liquid supply device 2

[0033] like Figure 1 As shown, the treatment liquid supply device 2 is mainly composed of a first circulation device 110, a second circulation device 120, a mixing outlet 130 and a liquid supply part 140. The first circulation device 110 includes a first auxiliary storage tank 10, a plurality of (three in this example) valves 11, 15, 16, a pump 12, a flow meter 13, a regulator 14, a supply source pipe p11, a pressure delivery pipe p12 and a circulation pipe p13.

[0034] The upstream end of the supply source pipe p11 is connected to the first liquid supply source 5. The downstream end of the supply source pipe p11 is disposed in the first sub-storage tank 10. The supply source pipe p11 is provided with a valve 11.

[0035] As described above, the first liquid supply source 5 is a resource energy device that holds DIW given a predetermined pressure. The valve 11 is opened and closed based on the control of the control unit 9. When the valve 11 is in a closed state, the flow of DIW in the supply source piping p11 is cut off. On the other hand, when the valve 11 is in an open state, DIW is supplied from the first liquid supply source 5 to the first auxiliary storage tank 10 through the supply source piping p11. The supplied DIW is stored in the first auxiliary storage tank 10.

[0036] The capacity of the first auxiliary storage tank 10 is smaller than that of the main storage tank 30 described later, and is, for example, about 20 l to 50 l. A liquid level sensor LS1 is mounted on the first auxiliary storage tank 10. The liquid level sensor LS1 detects the liquid level (liquid level height) of DIW stored in the first auxiliary storage tank 10.

[0037] The upstream end of the pressure-feeding pipe p12 is connected to the bottom of the first sub-storage tank 10. The pump 12, the flow meter 13, and the regulator 14 are arranged in this order on the pressure-feeding pipe p12 from the upstream end toward the downstream end.

[0038] The pump 12 sucks the DIW stored in the first sub-storage tank 10 and pressurizes and delivers the sucked DIW to the downstream end of the pressurized delivery pipe p12. The flow meter 13 detects the amount of DIW flowing in the pressurized delivery pipe p12 per unit time as a flow rate. The adjustment unit 14 includes a flow regulator such as a regulator or an electric needle valve, and adjusts the flow rate of DIW flowing in the pressurized delivery pipe p12 based on the detection result of the flow meter 13.

[0039] In addition, the flow rate regulator provided in the adjustment unit 14 is selected according to, for example, the flow rate level of DIW to be supplied to the mixing and derivation unit 130 when the processing liquid is generated and the required flow rate accuracy. In this example, when the processing liquid is generated, DIW needs to be supplied to the mixing and derivation unit 130 at a relatively large flow rate, and a regulator is used.

[0040] A circulation pipe p13 is provided in such a manner as to connect the first auxiliary storage tank 10 to the downstream end of the pressurized delivery pipe p12. A valve 15 is provided on the circulation pipe p13. In addition, the upstream end of the supply pipe p14 is further connected to the downstream end of the pressurized delivery pipe p12. The supply pipe p14 extends from the downstream end of the pressurized delivery pipe p12 to the mixing outlet 130. A valve 16 is provided on the supply pipe p14.

[0041] The valve 15 allows the circulation of DIW in the circulation pipe p13 when it is in an open state, and cuts off the circulation of DIW in the circulation pipe p13 when it is in a closed state. The valve 16 allows the circulation of DIW in the supply pipe p14 when it is in an open state, and cuts off the circulation of DIW in the supply pipe p14 when it is in a closed state.

[0042] In the first circulation device 110, for example, when a predetermined amount of DIW is stored in the first auxiliary storage tank 10, the valve 15 is set to an open state and the valve 16 is set to a closed state. Then, the pump 12 is operated, and the adjustment unit 14 adjusts the flow rate of DIW flowing in the pressurized delivery pipe p12. Thus, the DIW stored in the first auxiliary storage tank 10 is circulated through the pressurized delivery pipe p12 and the circulation pipe p13 (see Figure 1 The thick single-dot dash arrow A11).

[0043] As described above, in the first circulation device 110, the first auxiliary storage tank 10, the pressure delivery pipe p12, the pump 12, the flow meter 13, the adjustment unit 14, the circulation pipe p13 and the valve 15 form a first circulation system for circulating DIW. The operation mode of the first circulation device 110 at this time is referred to as the first liquid circulation mode.

[0044] In the first circulation device 110, for example, when a predetermined amount of DIW is stored in the first auxiliary storage tank 10, the valve 15 is closed and the valve 16 is opened. The pump 12 is operated, and the adjustment unit 14 adjusts the flow rate of DIW flowing in the pressurized delivery pipe p12. As a result, the DIW stored in the first auxiliary storage tank 10 is delivered to the mixing outlet 130 through the supply pipe p14 at the flow rate adjusted by the adjustment unit 14 (see Figure 1 The operation mode of the first circulation device 110 at this time is referred to as the first liquid supply mode.

[0045] The second circulation device 120 includes a second sub-storage tank 20 , a plurality of (three in this example) valves 21 , 25 , and 26 , a pump 22 , a flow meter 23 , a regulator 24 , a supply source pipe p21 , a pressurized delivery pipe p22 , and a circulation pipe p23 .

[0046] The upstream end of the supply source pipe p21 is connected to the second liquid supply source 6. The downstream end of the supply source pipe p21 is disposed in the second sub-storage tank 20. The supply source pipe p21 is provided with a valve 21.

[0047] As described above, the second liquid supply source 6 is a resource energy device that holds HF given a predetermined pressure. The valve 21 is opened and closed based on the control of the control unit 9. When the valve 21 is in a closed state, the flow of HF in the supply source piping p21 is cut off. On the other hand, when the valve 21 is in an open state, HF is supplied from the second liquid supply source 6 to the second auxiliary storage tank 20 through the supply source piping p21. The supplied HF is stored in the second auxiliary storage tank 20.

[0048] The capacity of the second auxiliary storage tank 20 is smaller than that of the main storage tank 30 described later, similarly to the capacity of the first auxiliary storage tank 10, and is, for example, about 5 l to 20 l. A liquid level sensor LS2 is mounted on the second auxiliary storage tank 20. The liquid level sensor LS2 detects the liquid level (liquid level height) of HF stored in the second auxiliary storage tank 20.

[0049] The upstream end of the pressure-feeding pipe p22 is connected to the bottom of the second sub-storage tank 20. On the pressure-feeding pipe p22, a pump 22, a flow meter 23, and a regulator 24 are arranged in this order from the upstream end toward the downstream end.

[0050] The pump 22 sucks the HF stored in the second sub-storage tank 20, and pressurizes and transports the sucked HF to the downstream end of the pressurized delivery pipe p22. The flow meter 23 detects the amount of HF flowing in the pressurized delivery pipe p22 per unit time as a flow rate. The adjustment unit 24 includes a flow rate adjuster such as an electric needle valve or a regulator, and adjusts the flow rate of HF flowing in the pressurized delivery pipe p22 based on the detection result of the flow meter 23.

[0051] In addition, the flow rate regulator provided in the adjustment section 24 is selected according to, for example, the flow rate level of HF to be supplied to the mixing outlet section 130 when the processing liquid is generated and the required flow rate accuracy. In this example, when the processing liquid is generated, it is necessary to supply HF to the mixing outlet section 130 at a relatively small flow rate and with high accuracy, and an electric needle valve is used.

[0052] A circulation pipe p23 is provided in such a manner as to connect the second secondary storage tank 20 to the downstream end of the pressurized delivery pipe p22. A valve 25 is provided on the circulation pipe p23. In addition, the upstream end of the supply pipe p24 is further connected to the downstream end of the pressurized delivery pipe p22. The supply pipe p24 extends from the downstream end of the pressurized delivery pipe p22 to the mixing outlet 130. A valve 26 is provided on the supply pipe p24.

[0053] The valve 25 allows the circulation of HF in the circulation pipe p23 when it is in an open state, and cuts off the circulation of HF in the circulation pipe p23 when it is in a closed state. The valve 26 allows the circulation of HF in the supply pipe p24 when it is in an open state, and cuts off the circulation of HF in the supply pipe p24 when it is in a closed state.

[0054] In the second circulation device 120, for example, when a predetermined amount of HF is stored in the second secondary storage tank 20, the valve 25 is set to an open state and the valve 26 is set to a closed state. Then, the pump 22 is operated, and the adjustment unit 24 adjusts the flow rate of HF flowing in the pressurized delivery pipe p22. Thus, the HF stored in the second secondary storage tank 20 is circulated through the pressurized delivery pipe p22 and the circulation pipe p23 (see Figure 1 The thick single-dot dash arrow A21).

[0055] In this way, in the second circulation device 120, the second sub-storage tank 20, the pressure delivery pipe p22, the pump 22, the flow meter 23, the adjustment unit 24, the circulation pipe p23 and the valve 25 form a second circulation system for circulating HF. The operation mode of the second circulation device 120 at this time is called the second liquid circulation mode.

[0056] In the second circulation device 120, for example, when a predetermined amount of HF is stored in the second auxiliary storage tank 20, the valve 25 is closed and the valve 26 is opened. The pump 22 is operated, and the adjustment unit 24 adjusts the flow rate of HF flowing in the pressurized delivery pipe p22. Thus, the HF stored in the second auxiliary storage tank 20 is delivered to the mixing outlet 130 through the supply pipe p24 at the flow rate adjusted by the adjustment unit 24 (see Figure 1 The operation mode of the second circulation device 120 at this time is referred to as the second liquid supply mode.

[0057] The mixing outlet section 130 includes a mixing pipe p31. The mixing pipe p31 of this example is a single pipe. At the upstream end of the mixing pipe p31, the downstream end of the supply pipe p14 of the first circulation device 110 and the downstream end of the supply pipe p24 of the second circulation device 120 are connected. The downstream end of the mixing pipe p31 is arranged in the main storage tank 30 described later of the liquid supply section 140. Thus, when the first circulation device 110 is in the first liquid supply mode and the second circulation device 120 is in the second liquid supply mode, DIW and HF are mixed in the mixing pipe p31 and guided to the main storage tank 30 of the liquid supply section 140.

[0058] At this time, in the mixing pipe p31, DIW and HF are mixed at a ratio of the flow rate of DIW supplied to the mixing pipe p31 to the flow rate of HF supplied to the mixing pipe p31. In addition, in order to more evenly mix the DIW and HF supplied from the first circulation device 110 and the second circulation device 120, a component for stirring the liquid flowing in the mixing pipe p31 may be provided inside the mixing pipe p31.

[0059] The liquid supply unit 140 includes a main storage tank 30, a pump 31, a heater 32, a filter 33, a supply pipe p32, and a recovery pipe p33. As described above, the downstream end of the mixing pipe p31 of the first sub-storage tank 10 is arranged in the main storage tank 30. Thus, the mixed liquid of DIW and HF flowing in the mixing pipe p31 is guided into the main storage tank 30 and stored as a processing liquid for processing the substrate W in the substrate processing unit 3. The capacity of the main storage tank 30 is, for example, about 20l to 100l. A liquid level sensor LS3 is installed in the main storage tank 30. The liquid level sensor LS3 detects the liquid level (liquid level height) of the processing liquid stored in the main storage tank 30.

[0060] The upstream end of the supply pipe p32 is connected to the bottom of the main storage tank 30. The supply pipe p32 is provided with a pump 31, a heater 32, and a filter 33 in this order from the upstream end to the downstream end. The downstream end of the supply pipe p32 is connected to the substrate processing unit 3.

[0061] The pump 31 sucks the processing liquid stored in the main storage tank 30, and pressurizes and delivers the sucked processing liquid to the downstream end of the supply pipe p32. The heater 32 heats the processing liquid flowing in the supply pipe p32 so that it approaches a predetermined temperature. The filter 33 removes impurities and precipitates from the processing liquid by filtering the processing liquid. Thus, the processing liquid stored in the main storage tank 30 is heated, filtered, and supplied to the substrate processing unit 3. In the substrate processing unit 3, the processing liquid supplied from the processing liquid supply device 2 is respectively delivered to the nozzles 4b of the plurality of processing units 4.

[0062] The upstream end of the recovery pipe p33 is connected to the substrate processing unit 3. The downstream end of the recovery pipe p33 is arranged in the main storage tank 30. In the substrate processing unit 3, a part of the processing liquid received by the cups 4c of each of the plurality of processing units 4 is guided to the upstream end of the recovery pipe p33. Thus, as described above, a part of the processing liquid used in the plurality of processing units 4 is recovered into the main storage tank 30 through the recovery pipe p33.

[0063] The remaining processing liquid that is not recovered in the main storage tank 30 of the processing liquid supplied from the main storage tank 30 to the substrate processing unit 3 is transported to a liquid discharge device (not shown). Therefore, if the state where new processing liquid is not supplied to the main storage tank 30 continues, the liquid level of the processing liquid stored in the main storage tank 30 drops every time a substrate is processed in each part of the substrate processing unit 3.

[0064] Therefore, in the present embodiment, whether or not to replenish the main storage tank 30 with new processing liquid is determined based on the liquid level of the processing liquid detected by the liquid level sensor LS3 and two liquid levels preset in the main storage tank 30 .

[0065] The two liquid level levels pre-set for the main storage tank 30 are the lower limit level L1 and the specified level L2. The lower limit level L1 is the liquid level corresponding to the amount of the processing liquid that is considered to be the minimum necessary for supplying the processing liquid to the substrate processing part 3. On the other hand, the specified level L2 is a liquid level higher than the lower limit level L1. More specifically, the specified level L2 is the liquid level corresponding to the amount of the processing liquid that is considered to be sufficient for supplying the processing liquid to the substrate processing part 3 and the amount of the processing liquid that is considered not to overflow from the main storage tank 30.

[0066] <3> Operation of substrate processing apparatus 1

[0067] Figure 2 It is used to illustrate Figure 1 Here, the operation of generating the processing liquid in the processing liquid supply device 2 and replenishing the processing liquid to the main storage tank 30 will be mainly described.

[0068] exist Figure 2 The left end of shows 11 items related to the status of each part of the substrate processing apparatus 1. The 11 items are "substrate processing", "main storage tank liquid level", "main storage tank liquid level", "DIW pump 12", "HF pump 22", "DIW flow rate", "HF flow rate", "DIW circulation side valve 15", "DIW supply side valve 16", "HF circulation side valve 25" and "HF supply side valve 26", and are arranged vertically from the uppermost layer (1st layer) toward the lowermost layer (11th layer) in this order.

[0069] To the right of the above 11 items, the changes in the states corresponding to these items are shown in chronological order using a common time axis. To the right of the first-level item "substrate processing" is shown whether the substrate processing unit 3 is in an operating state, that is, whether substrate processing is being performed in the substrate processing unit 3. To the right of the second-level item "main storage tank liquid level" is shown Figure 1 The liquid level detected by the liquid level sensor LS3 is higher than the lower limit level L1 or lower than the lower limit level L1. Figure 1 The liquid level detected by the liquid level sensor LS3 is above the specified level L2 or below the specified level L2.

[0070] On the right side of the item "DIW pump 12" on the 4th layer, it is shown Figure 1 The pump 12 is in operation or in stop state. To the right of the item "HF pump 22" on the fifth layer, it is shown Figure 1 The pump 22 is in an operating state or in a stopped state.

[0071] In the treatment liquid supply device 2 of the present embodiment, in order to mix DIW and HF at a predetermined ratio, the range of the ideal flow rate of DIW to flow in the first circulation system of the first circulation device 110 is determined as the first flow rate range. In addition, the range of the ideal flow rate of HF to flow in the second circulation system of the second circulation device 120 is determined as the second flow rate range.

[0072] On the right side of the item "DIW flow rate" on the sixth layer, it is shown whether the DIW flow rate detected by the flow meter 13 (the flow rate of DIW flowing in the first circulation system) is within the first flow rate range. On the right side of the item "HF flow rate" on the seventh layer, it is shown whether the HF flow rate detected by the flow meter 23 (the flow rate of HF flowing in the second circulation system) is within the second flow rate range.

[0073] On the right side of the "DIW circulation side valve 15" on the 8th layer, it is shown Figure 1 The valve 15 is open or closed. On the right side of the "DIW supply side valve 16" on the 9th layer, it is shown Figure 1 The valve 16 is open or closed. On the right side of the "HF circulation side valve 25" on the 10th layer, it is shown Figure 1 The valve 25 of HF is in the open state or in the closed state. On the right side of the "HF supply side valve 26" on the 11th layer, it is shown Figure 1 The valve 26 is in an open state or a closed state.

[0074] In this example, the valve 11 of the first circulation device 110 is set to switch between an open state and a closed state based on the detection result of the liquid level sensor LS1 so that a predetermined amount of DIW is always stored in the first sub-storage tank 10. In addition, the valve 21 of the second circulation device 120 is set to switch between an open state and a closed state based on the detection result of the liquid level sensor LS2 so that a predetermined amount of HF is always stored in the second sub-storage tank 20.

[0075] First, in the initial state (time point t0), the substrate processing unit 3 is in a stopped state. In addition, the liquid level of the processing liquid stored in the main storage tank 30 is higher than the lower limit level L1 and lower than the specified level L2. Figure 1 The pumps 12 and 22 are in a stopped state, the flow rate of DIW flowing in the first circulation system is outside the first flow rate range (specifically, 0), and the flow rate of HF flowing in the second circulation system is outside the second flow rate range (specifically, 0). Figure 1 Valves 15 and 25 are in the open state. Figure 1 Valves 16, 26 are in closed state.

[0076] At time t1, the substrate processing section 3 switches from the stop state to the operation state, and substrate processing starts in the plurality of processing units 4 of the substrate processing section 3. As a result, the processing liquid stored in the main storage tank 30 of the processing liquid supply device 2 is supplied to the substrate processing section 3. As the substrate W is continuously processed in the substrate processing section 3, the liquid level of the processing liquid in the main storage tank 30 decreases.

[0077] At time t2, the liquid level of the treatment liquid in the main storage tank 30 becomes lower than the lower limit level L1. Figure 1 The pumps 12 and 22 are switched from the stopped state to the operated state. At this time, in the first circulation device 110, the valve 15 is in the open state and the valve 16 is in the closed state. Thus, the DIW pumped by the pump 12 in the pressure delivery pipe p12 is returned to the first auxiliary storage tank 10 through the circulation pipe p13. That is, in the first circulation device 110, the DIW circulates in the first circulation system.

[0078] In the second circulation device 120, the valve 25 is in an open state and the valve 26 is in a closed state. Thus, HF pumped by the pump 22 in the pressure feeding pipe p22 is returned to the second sub-storage tank 20 through the circulation pipe p23. That is, in the second circulation device 120, HF circulates in the second circulation system.

[0079] Immediately after time t3, the operating states of the pumps 12 and 22 are unstable. In addition, the flow rate of DIW passing through the adjustment unit 14 in the first circulation system is also unstable. Furthermore, the flow rate of HF passing through the adjustment unit 24 in the second circulation system is also unstable.

[0080] At time point t4 after a certain time has passed from time point t3, the operation states of the pumps 12 and 22 are stabilized, and the flow rate of DIW passing through the adjustment unit 14 and the flow rate of HF passing through the adjustment unit 24 are stabilized. As a result, the flow rate of DIW flowing through the first circulation system becomes within the first flow rate range, and the flow rate of HF flowing through the second circulation system becomes within the second flow rate range.

[0081] Then, at time t5, the valve 15 of the first circulation device 110 is closed, and the valve 16 is opened. As a result, the DIW in the first sub-storage tank 10 is delivered to the mixing outlet 130 at a predetermined flow rate (a flow rate within the first flow rate range). In addition, the valve 25 of the second circulation device 120 is closed, and the valve 26 is opened. As a result, the HF in the second sub-storage tank 20 is delivered to the mixing outlet 130 at a predetermined flow rate (a flow rate within the second flow rate range).

[0082] In the mixed outlet 130, DIW and HF supplied from the first circulation device 110 and the second circulation device 120 are mixed, and the generated mixed liquid is guided as the treatment liquid to the main storage tank 30 of the liquid supply unit 140. In this way, new treatment liquid is sequentially added to the main storage tank 30. As a result, the liquid level of the treatment liquid in the main storage tank 30 rises and exceeds the lower limit level at time point t6.

[0083] At time t7, the substrate processing unit 3 is switched from the operating state to the stopping state while the new processing liquid is added to the main storage tank 30. Thus, the supply of the processing liquid from the main storage tank 30 of the processing liquid supply device 2 to the substrate processing unit 3 is stopped.

[0084] After that, by further adding new treatment liquid to the main storage tank 30, the liquid level of the treatment liquid in the main storage tank 30 reaches a specified level at time point t8. Therefore, in order to prevent the treatment liquid from leaking out of the main storage tank 30, at time point t9, the pumps 12 and 22 are switched from the operating state to the stop state. As a result, the supply of DIW and HF from the first circulation device 110 and the second circulation device 120 to the mixing outlet 130 is stopped. In addition, at time point t10, the flow rate of DIW flowing in the first circulation system becomes outside the first flow rate range (specifically, 0), and the flow rate of HF flowing in the second circulation system becomes outside the second flow rate range (specifically, 0). In this way, the replenishment of new treatment liquid to the main storage tank 30 is stopped.

[0085] Then, in preparation for replenishing the main storage tank 30 with new treatment liquid, at time t11, the valve 15 of the first circulation device 110 is opened and the valve 16 is closed. Also, the valve 25 of the second circulation device 120 is opened and the valve 26 is closed.

[0086] <4>Control system of substrate processing equipment

[0087] and Figure 1 The control system of the substrate processing apparatus 1 will be described together with the structure of the control unit 9. Figure 3 Yes means Figure 1 A block diagram of the structure of a control system of a substrate processing device 1. Figure 3 As shown, the control unit 9 includes a CPU (Central Processing Unit) 91 , a RAM (Random Access Memory) 92 , a ROM (Read Only Memory) 93 , and a storage device 94 .

[0088] The RAM 92 is used as a work area of ​​the CPU 91. The system program is stored in the ROM 93. The storage device 94 includes a storage medium such as a hard disk or a semiconductor memory, and stores a substrate processing program for performing substrate processing and a processing liquid generation program for generating a processing liquid. In addition, the storage device 94 stores the processing liquid conditions set in association with the generation of the processing liquid and the replenishment of the processing liquid to the main storage tank 30. The processing liquid conditions include the liquid generation conditions described later on the basis of the above-mentioned lower limit level L1, the specified level L2, the first flow range, and the second flow range.

[0089] In addition, the substrate processing program and the processing liquid generating program are provided in a state of being stored in a recording medium such as CD-ROM 95, and can also be installed in ROM 93 or storage device 94. Alternatively, the substrate processing program and the processing liquid generating program can also be sent from an external server of the substrate processing apparatus 1 via a communication network and installed in ROM 93 or storage device 94.

[0090] The CPU 91 executes the substrate processing program to supply a necessary amount of processing liquid from the processing liquid supply device 2 to the substrate processing section 3. The operation of each part of the substrate processing section 3 is controlled, and the plurality of processing units 4 perform substrate processing.

[0091] On the other hand, by executing the processing liquid generation program through the CPU 91, the operation of each part of the processing liquid supply device 2 in the substrate processing device 1 is mainly controlled. Specifically, the control unit 9 controls the opening and closing state of the valve 11 based on the detection result of the liquid level sensor LS1, so that a certain amount of DIW is retained in the first auxiliary retention tank 10. In addition, the control unit 9 determines the flow state of DIW in the first circulation system based on the detection result of the flow meter 13. In this embodiment, the flow state includes the size of the flow rate of DIW flowing in the first circulation system. At this time, the control unit 9 can also control the adjustment unit 14 based on the detection result of the flow meter 13.

[0092] In addition, when the control unit 9 circulates DIW in the first circulation device 110, the pump 12 is operated, the valve 15 is set to an open state, and the valve 16 is set to a closed state (first liquid circulation mode). In addition, when the control unit 9 supplies DIW from the first circulation device 110 to the mixing and derivation part 130, the pump 12 is operated, the valve 15 is set to a closed state, and the valve 16 is set to an open state (first liquid supply mode).

[0093] In addition, the control unit 9 controls the opening and closing state of the valve 21 based on the detection result of the liquid level sensor LS2 so that a certain amount of HF is stored in the second auxiliary storage tank 20. In addition, the control unit 9 determines the flow state of HF in the second circulation system based on the detection result of the flow meter 23. In this embodiment, the flow state includes the size of the flow rate of HF flowing in the second circulation system. At this time, the control unit 9 can also control the adjustment unit 24 based on the detection result of the flow meter 23.

[0094] In addition, when the controller 9 circulates HF in the second circulation device 120, the pump 22 is operated, the valve 25 is set to an open state, and the valve 26 is set to a closed state (second liquid circulation mode). In addition, when the controller 9 supplies HF from the second circulation device 120 to the mixing outlet 130, the pump 22 is operated, the valve 25 is set to a closed state, and the valve 26 is set to an open state (second liquid supply mode).

[0095] In addition, the control unit 9 determines the amount of the processing liquid stored in the main storage tank 30 based on the detection result of the liquid level sensor LS3. In addition, the control unit 9 controls the pump 31 to supply a necessary amount of processing liquid from the processing liquid supply device 2 to the substrate processing unit 3. Furthermore, the control unit 9 controls the heater 32 so that the processing liquid supplied to the substrate processing unit 3 is close to a temperature suitable for substrate processing.

[0096] <5> Treatment of treatment liquid generation

[0097] Figure 4 This is a flowchart of the process liquid production process performed by the control unit 9. The process liquid production process described below is performed by the CPU 91 of the control unit 9 executing a process liquid production program stored in the storage device 94 on the RAM 92.

[0098] The processing liquid generation process starts when the substrate processing apparatus 1 is powered on, and is repeated every predetermined time. When the processing liquid generation process starts, the CPU 91 determines whether the main storage tank 30 needs to be replenished with processing liquid based on the detection result of the liquid level sensor LS3 (step S11).

[0099] Specifically, when the liquid level detected by the liquid level sensor LS3 is below the lower limit level L1, the CPU 91 determines that the main storage tank 30 needs to be replenished with the treatment liquid. On the other hand, when the liquid level detected by the liquid level sensor LS3 is higher than the lower limit level L1, the CPU 91 determines that the main storage tank 30 does not need to be replenished with the treatment liquid. Figure 2 In the example of FIG. 1 , the CPU 91 determines at time point t2 that the main storage tank 30 needs to be replenished with the treatment liquid.

[0100] When the CPU 91 determines that it is not necessary to replenish the treatment liquid to the main storage tank 30, it repeats the process of step S11. On the other hand, when the CPU 91 determines that it is necessary to replenish the treatment liquid to the main storage tank 30, it starts the operation of the first circulation device 110 and the second circulation device 120 in the first liquid circulation mode and the second liquid circulation mode, respectively (step S12). Figure 2 In the example of FIG. 2 , the CPU 91 starts the operation of the first liquid circulation mode of the first circulation device 110 and starts the operation of the second liquid circulation mode of the second circulation device 120 at time point t3 .

[0101] Next, the CPU 91 determines whether a predetermined liquid generation condition is satisfied (step S13). Here, the liquid generation condition is a condition for determining whether the flow state of DIW circulating in the first circulation system in the first circulation device 110 and the flow state of HF circulating in the second circulation system in the second circulation device 120 are both stable.

[0102] In this embodiment, the liquid generation condition includes that the flow rate of DIW flowing in the first circulation system is within the first flow rate range, and the flow rate of HF flowing in the second circulation system is within the second flow rate range. In this case, the CPU 91 can determine whether the liquid generation condition is satisfied based on the detection results of the flow meters 13 and 23. Figure 2 In the example of FIG. 1 , the CPU 91 determines at time point t4 that the liquid generation condition is satisfied.

[0103] In addition, the liquid generation condition is not limited to the above example, and may also include a predetermined time (e.g., about 5 sec to 10 sec) from the start of the operation of the first circulation device 110 and the second circulation device 120 in the process of step S12. Figure 2 In the example of FIG. 1 , the CPU 91 determines that the liquid generation condition is satisfied at time point t3 when a certain time has passed since the start of the operation of the pumps 12 and 22.

[0104] When the CPU 91 determines that the liquid generation condition is not satisfied, it repeats the process of step S13. On the other hand, when the CPU 91 determines that the liquid generation condition is satisfied, it switches the operation modes of the first circulation device 110 and the second circulation device 120 to the first liquid supply mode and the second liquid supply mode (step S14). Figure 2 In the example of , the CPU 91 switches the operation mode of the first circulator 110 to the first liquid supply mode and switches the operation mode of the second circulator 120 to the second liquid supply mode at time point t5.

[0105] Next, the CPU 91 determines whether the liquid level of the treatment liquid in the main storage tank 30 is above the predetermined level L2 based on the detection result of the liquid level sensor LS3 (step S15). When the CPU 91 determines that the liquid level is not above the predetermined level L2, it repeats the processing of step S15. On the other hand, when the CPU 91 determines that the liquid level is above the predetermined level L2, it stops the operation of the first circulation device 110 and the second circulation device 120 (step S16).

[0106] exist Figure 2 In the example of FIG. 1 , the CPU 91 determines at time point t8 that the liquid level of the treatment liquid in the main storage tank 30 is above the predetermined level L2. In addition, at time point t9, the CPU 91 stops the operation of the first circulation device 110 and stops the operation of the second circulation device 120 by setting the pumps 12 and 22 to a stop state.

[0107] After that, the CPU 91 assumes that the main storage tank 30 is replenished with new treatment liquid again, and prepares for the operation in the first liquid circulation mode and the second liquid circulation mode (step S17). Figure 1 Set valve 15 to open state, Figure 1 The valve 16 is set to a closed state so that when the pump 12 starts to operate, DIW circulates in the first circulation system of the first circulation device 110. In addition, the CPU 91 Figure 1 The valve 25 is set to the open state, Figure 1 The valve 26 is set to a closed state so that when the pump 22 is operated, HF circulates in the second circulation system of the second circulation device 120. Figure 2 In the example of FIG. 1 , the CPU 91 switches the open and closed states of the valves 15, 16, 25, and 26 at time t11. Thus, the processing liquid generating process ends.

[0108] <6> Housing

[0109] In the above-mentioned substrate processing apparatus 1, the first circulation device 110, the second circulation device 120 and the liquid supply unit 140 are as follows: Figure 1 As shown by the single dotted line in the figure, they can be respectively accommodated in a separately formed housing. In this case, the mixing and derivation part 130 can be accommodated in one housing together with the liquid supply part 140. In this way, by accommodating the multiple components constituting the processing liquid supply device 2 in multiple housings, the degree of freedom of layout is improved when the processing liquid supply device 2 is installed in a factory.

[0110] In addition, the processing liquid supply device 2 may have a structure in which all components including the first circulation device 110 , the second circulation device 120 , the mixing and outlet portion 130 , and the liquid supply portion 140 are accommodated in a common housing.

[0111] <7>Effect

[0112] (a) In the above-mentioned treatment liquid supply device 2, when the liquid level of the treatment liquid stored in the main storage tank 30 becomes below the lower limit level L1, the treatment liquid is replenished with respect to the main storage tank 30. When the replenishment of the treatment liquid starts, the first circulation device 110 operates in the first liquid circulation mode, and the second circulation device 120 operates in the second liquid circulation mode. As a result, the DIW supplied from the first liquid supply source 5 and stored in the first auxiliary storage tank 10 flows in the first circulation system. In addition, the HF supplied from the second liquid supply source 6 and stored in the second auxiliary storage tank 20 flows in the second circulation system.

[0113] The first circulation system of the first circulation device 110 receives DIW supplied from the first liquid supply source 5 and functions as a buffer flow path for buffering fluctuations in the flow rate and pressure of the DIW. Thus, a large disturbance in the flow state of DIW in the first circulation system is suppressed.

[0114] The second circulation system of the second circulation device 120 receives HF supplied from the second liquid supply source 6 and functions as a buffer flow path for buffering fluctuations in the flow rate and pressure of the HF. This prevents the flow state of HF in the second circulation system from being greatly disturbed.

[0115] Then, when the liquid generation condition is satisfied, the operation mode of the first circulation device 110 is switched to the first liquid supply mode, and the operation mode of the second circulation device 120 is switched to the second liquid supply mode. Thus, in the mixing and derivation section 130, DIW and HF are properly mixed in a relatively stable state to generate a high-quality processing liquid.

[0116] In this case, since the generation of processing liquid under unstable conditions is suppressed, there is no need for processing for removing low-quality processing liquid such as pre-draining. As a result, high-quality processing liquid generated under predetermined conditions can be stably supplied to the substrate processing unit 3 without discarding low-quality processing liquid.

[0117] (b) As described above, the liquid generation condition includes that the flow rate of DIW flowing in the first circulation system is within the first flow rate range, and the flow rate of HF flowing in the second circulation system is within the second flow rate range. In this case, the flow rates of DIW and HF supplied to the mixing and derivation section 130 are adjusted with high precision. Therefore, DIW and HF constituting the treatment liquid can be mixed with high precision according to a predetermined mixing ratio.

[0118] (c) In the treatment liquid supply device 2 of the present embodiment, the first circulation device 110 and the second circulation device 120 are provided with adjustment units 14 and 24 for adjusting the flow rate of the treatment liquid flowing in each circulation system. Therefore, DIW and HF constituting the treatment liquid can be mixed with high precision according to a predetermined mixing ratio.

[0119] (d) In the processing liquid supply device 2 of the present embodiment, the first circulation device 110 and the second circulation device 120 are provided with flow meters 13 and 23 for detecting the flow rates of the processing liquids flowing in the respective circulation systems.

[0120] Thus, the flow rate of DIW flowing in the first circulation system can be adjusted based on the detection result of the flow meter 13. In addition, the flow rate of HF flowing in the second circulation system can be adjusted based on the detection result of the flow meter 23. In addition, the timing of supplying DIW and HF from the first circulation device 110 and the second circulation device 120 to the mixing outlet 130 can be appropriately determined based on the flow states of the liquids flowing in the first circulation system and the second circulation system, respectively.

[0121] (e) The first circulation device 110 and the second circulation device 120 are respectively provided with the first sub-reservoir 10 and the second sub-reservoir 20. In this case, the first sub-reservoir 10 functions as a buffer tank (buffer container) for buffering the fluctuation of the flow rate and pressure of the DIW supplied from the first liquid supply source 5 to the first circulation system. Thus, it is suppressed that the state of the DIW flowing in the first circulation system is greatly disturbed due to the supply of DIW from the first liquid supply source 5 to the first circulation system.

[0122] In addition, the second sub-storage tank 20 functions as a buffer tank (buffer container) for buffering fluctuations in the flow rate and pressure of HF supplied from the second liquid supply source 6 to the second circulation system. This prevents the state of HF flowing in the second circulation system from being greatly disturbed by the supply of HF from the second liquid supply source 6 to the second circulation system.

[0123] 2. Second Implementation Method

[0124] Regarding the substrate processing apparatus according to the second embodiment, differences from the substrate processing apparatus 1 according to the first embodiment will be described. Figure 5 It is a schematic structural diagram of a substrate processing apparatus according to a second embodiment.

[0125] like Figure 5As shown, in the first circulation device 110 of the present embodiment, a heater 17 and a filter 18 are provided on the pressure delivery pipe p12 in addition to the pump 12, the flow meter 13 and the regulator 14. Furthermore, a temperature sensor TS1 for detecting the temperature of DIW stored in the first sub-storage tank 10 is provided in the first sub-storage tank 10.

[0126] According to such a configuration, when the first circulation device 110 operates in the first liquid circulation mode, the temperature of the DIW flowing in the first circulation system can be adjusted to a desired temperature by controlling the heater 17 based on the detection result of the temperature sensor TS1 .

[0127] In the second circulation device 120 of the present embodiment, the pressure delivery pipe p22 is provided with a heater 27 and a filter 28 in addition to the pump 22, the flow meter 23 and the regulator 24. Furthermore, the second sub-storage tank 20 is provided with a temperature sensor TS2 for detecting the temperature of HF stored in the second sub-storage tank 20.

[0128] According to such a configuration, when the second circulation device 120 operates in the second liquid circulation mode, the heater 27 is controlled based on the detection result of the temperature sensor TS2, thereby adjusting the temperature of HF flowing in the second circulation system to a desired temperature.

[0129] In the present embodiment, the flow state includes the flow rate and temperature of DIW flowing in the first circulation system, and the flow rate and temperature of HF flowing in the second circulation system. In addition, in the present embodiment, the liquid generation condition includes that the flow rate of DIW flowing in the first circulation system is within the first flow rate range, the temperature of DIW flowing in the first circulation system is within the first temperature range, the flow rate of HF flowing in the second circulation system is within the second flow rate range, and the temperature of HF flowing in the second circulation system is within the second temperature range.

[0130] In this case, the CPU 91 can determine whether the liquid generation condition is satisfied based on the detection results of the flow meters 13 and 23 and the detection results of the temperature sensors TS1 and TS2. Specifically, the CPU 91 can determine whether the flow rate of the DIW flowing in the first circulation system is within the first flow rate range, and the flow rate of the HF flowing in the second circulation system is within the second flow rate range based on the detection results of the flow meters 13 and 23. In addition, the CPU 91 can determine whether the temperature of the DIW flowing in the first circulation system is within the first temperature range, and the temperature of the HF flowing in the second circulation system is within the second temperature range based on the detection results of the temperature sensors TS1 and TS2. Thus, in the mixed derivation unit 130, a treatment liquid having a desired temperature can be generated under stable temperature conditions.

[0131] 3. Third Implementation Method

[0132] Regarding the substrate processing apparatus according to the third embodiment, differences from the substrate processing apparatus 1 according to the first embodiment will be described. Figure 6 It is a schematic structural diagram of a substrate processing apparatus according to a third embodiment.

[0133] like Figure 6 As shown, the substrate processing device 1 of this embodiment replaces Figure 1 The first circulation device 110 and the second circulation device 120 are provided with a first supply device 150 and a second supply device 160 .

[0134] The first supply device 150 has a Figure 1 The structure of the circulation pipe p13 and valve 15 in the first circulation device 110. Therefore, Figure 6 The first supply device 150 does not include a first circulation system for circulating DIW.

[0135] The second supply device 160 has a Figure 1 The structure of the circulation pipe p23 and valve 25 in the second circulation device 120. Therefore, Figure 6 The second supply device 160 does not have a second circulation system for circulating HF.

[0136] In such a case as well, the first supply device 150 of the substrate processing apparatus 1 of the present embodiment includes the first auxiliary storage tank 10. In this case, the first auxiliary storage tank 10 functions as a buffer tank (buffer container) for buffering fluctuations in the flow rate and pressure of the DIW supplied from the first liquid supply source 5. Thus, compared with the case where DIW is directly supplied from the first liquid supply source 5 to the mixing outlet 130, a large disturbance in the state of the DIW transported to the mixing outlet 130 is suppressed.

[0137] In addition, the second supply device 160 of the substrate processing apparatus 1 of the present embodiment includes a second auxiliary storage tank 20. In this case, the second auxiliary storage tank 20 functions as a buffer tank (buffer container) for buffering fluctuations in the flow rate and pressure of HF supplied from the second liquid supply source 6. Thus, compared with the case where HF is directly supplied from the second liquid supply source 6 to the mixing outlet 130, a large disturbance in the state of HF transported to the mixing outlet 130 is suppressed.

[0138] As described above, in the present embodiment, the first auxiliary storage tank 10 is included in the DIW flow path connecting the first liquid supply source 5 and the mixing outlet 130. In addition, the second auxiliary storage tank 20 is included in the HF flow path connecting the second liquid supply source 6 and the mixing outlet 130. Thus, since the generation of the processing liquid under unstable conditions is suppressed, it is not necessary to perform a process such as pre-draining for removing the low-quality processing liquid. As a result, the high-quality processing liquid generated under predetermined conditions without the waste of the low-quality processing liquid can be stably supplied to one or more substrate processing units 3.

[0139] In addition, the first supply device 150 and the second supply device 160 are not configured as Figure 1 The present embodiment is capable of operating in a plurality of operation modes like the first circulation device 110 and the second circulation device 120. Therefore, in the present embodiment, the processing liquid is not generated based on the liquid generation condition like in the first and second embodiments.

[0140] 4. Other Implementation Methods

[0141] (a) Figure 7 FIG. 1 is a block diagram showing a structural example of a substrate processing apparatus 1 according to another embodiment. Figure 7 As shown, the substrate processing apparatus 1 may include a plurality of substrate processing units 3 . In this case, the processing liquid supply device 2 may supply the processing liquid to the plurality of substrate processing units 3 .

[0142] Furthermore, the processing liquid supply device 2 may be configured to supply the processing liquid to the substrate processing part 3 in the substrate processing apparatus 1 including the processing liquid supply device 2 and also to the substrate processing part 3 of another substrate processing apparatus 1 .

[0143] (b) In the substrate processing apparatus 1 of the first and second embodiments, the first auxiliary storage tank 10 may not be provided in the first circulation device 110. In this case as well, by forming the first circulation system in the first circulation device 110, the first circulation system functions as a buffer flow path for buffering the fluctuation of the flow rate and pressure from the first liquid supply source 5. Therefore, it is suppressed that the flow state of DIW in the first circulation system is greatly disturbed.

[0144] (c) In the substrate processing apparatus 1 of the first and second embodiments, the second auxiliary storage tank 20 may not be provided in the second circulation device 120. In this case as well, by forming the second circulation system in the second circulation device 120, the second circulation system functions as a buffer flow path for buffering the fluctuation of the flow rate and pressure from the second liquid supply source 6. Therefore, the flow state of HF in the second circulation system is suppressed from being greatly disturbed.

[0145] (d) In the substrate processing apparatus 1 of the first and second embodiments, the liquid generation condition may include only that the flow rate of DIW flowing in the first circulation system is within the first flow rate range, and the flow rate of HF flowing in the second circulation system is within the second flow rate range. Alternatively, the liquid generation condition may include only that the flow rate of DIW flowing in the first circulation system is within the first flow rate range. Figure 4 In the process of step S12, a predetermined time (for example, about 5 to 10 seconds) has passed since the operation of the first circulation device 110 and the second circulation device 120 started.

[0146] (e) In the substrate processing apparatus 1 of the first and second embodiments, the pumps 12 and 22 may be configured to adjust the flow rate of the liquid flowing therein to some extent. In this case, the control unit 9 may adjust the flow rate of each liquid flowing in the first circulation system and the second circulation system by adjusting the pumps 12 and 22.

[0147] (f) In the substrate processing apparatus 1 of the first and second embodiments, the pumps 12 and 22 are kept in a stopped state when the processing liquid is not generated, but the present invention is not limited thereto. The pumps 12 and 22 may be kept in an operating state while the substrate processing apparatus 1 is powered on.

[0148] In this case, when the power of the substrate processing apparatus 1 is turned on, DIW flows in the first circulation system. In addition, HF flows in the second circulation system. Therefore, when each circulation system has a heating unit such as a heater as in the second embodiment, a certain amount of DIW and HF whose temperature has been adjusted can be always stored in the auxiliary storage tank.

[0149] (g) In the substrate processing apparatuses 1 of the first to third embodiments, the substrate processing section 3 includes a plurality of processing units 4 , but the substrate processing section 3 may include only one processing unit 4 .

[0150] (h) In the substrate processing apparatus 1 of the above embodiment, the DIW stored in the first auxiliary storage tank 10 is sucked by the pump 12 and is pressurized and transported in the pressurized transport pipe p12, but the present invention is not limited to this. A pressurizing device that supplies an inert gas into the first auxiliary storage tank 10 may be installed in the first auxiliary storage tank 10. In this case, the pressure in the first auxiliary storage tank 10 is increased by the pressurizing device, so that the DIW in the first auxiliary storage tank 10 can flow in the pressurized transport pipe p12.

[0151] (i) In the substrate processing apparatus 1 of the above-mentioned embodiment, the HF stored in the second auxiliary storage tank 20 is sucked by the pump 22 and is pressurized and transported in the pressure transport pipe p22, but the present invention is not limited to this. A pressurizing device for supplying an inert gas into the second auxiliary storage tank 20 may be installed in the second auxiliary storage tank 20. In this case, the pressure in the second auxiliary storage tank 20 is increased by the pressurizing device, so that the HF in the second auxiliary storage tank 20 can flow in the pressure transport pipe p22.

[0152] (j) In the substrate processing apparatus 1 of the above embodiment, the processing liquid is generated by mixing two liquids (DIW and HF), but the present invention is not limited to this. The substrate processing apparatus 1 may also be configured to be able to mix three or more liquids. For example, the substrate processing apparatus 1 may also include three circulation devices or supply devices having a structure substantially the same as that of the first circulation device 110, and a mixing and derivation unit for mixing the three liquids flowing in the three circulation devices.

[0153] 5. Correspondence between the structural elements of the claims and the parts of the embodiments

[0154] Hereinafter, examples of correspondence between the components of the claims and the components of the embodiments will be described, but the present invention is not limited to the following examples. As the components of the claims, various other components having the structures or functions described in the claims can also be used.

[0155] In the above-mentioned embodiment, a dilution liquid such as DIW is an example of the first liquid, a chemical liquid such as HF is an example of the second liquid, the substrate processing unit 3 is an example of one or more substrate processing units, the processing liquid supply device 2 is an example of a processing liquid supply device, the main storage tank 30 is an example of a main storage tank, the liquid supply unit 140 is an example of a liquid supply unit, and the mixing outlet unit 130 is an example of a mixing outlet unit.

[0156] In addition, the first liquid supply source 5 is an example of a first liquid supply source, the first circulation device 110 is an example of a first circulation device, the second liquid supply source 6 is an example of a second liquid supply source, the second circulation device 120 is an example of a second circulation device, the pump 12, the adjustment unit 14, the heater 17 and the filter 18 are examples of a first state adjustment unit, the pump 22, the adjustment unit 24, the heater 27 and the filter 28 are examples of a second state adjustment unit, and the control unit 9 is an example of a control unit.

[0157] In addition, the flow rate of DIW flowing in the first circulation system is within the first flow rate range, a predetermined time has passed since the operation of the first circulation device 110 was started, and the temperature of DIW flowing in the first circulation system is within the first temperature range, which are examples of the first condition. The flow rate of HF flowing in the second circulation system is within the second flow rate range, a predetermined time has passed since the operation of the second circulation device 120 was started, and the temperature of HF flowing in the second circulation system is within the second temperature range, which are examples of the second condition.

[0158] Moreover, pump 12 is an example of a first pump, pump 22 is an example of a second pump, the regulator of the adjustment section 14 is an example of a first adjustment valve, the electric needle valve of the adjustment section 24 is an example of a second adjustment valve, the flowmeter 13 is an example of a first flowmeter, the flowmeter 23 is an example of a second flowmeter, the heater 17 is an example of a first heating section, and the heater 27 is an example of a second heating section.

[0159] In addition, the first auxiliary storage tank 10 is an example of a first auxiliary storage portion, the second auxiliary storage tank 20 is an example of a second auxiliary storage portion, the first supply device 150 is an example of a first supply device, the second supply device 160 is an example of a second supply device, and the substrate processing apparatus 1 is an example of a substrate processing apparatus.

[0160] 6. Summary of implementation methods

[0161] (Item 1) The processing liquid supply device of Item 1 is a processing liquid supply device that supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, and comprises:

[0162] A liquid supply unit including a main storage tank storing the mixed liquid, and supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units;

[0163] a mixed lead-out portion for guiding the mixed liquid to the main storage tank;

[0164] a first circulation device having a first circulation system connected to a first liquid supply source, and supplying the first liquid flowing in at least a portion of the first circulation system to the mixing and outlet portion; and

[0165] The second circulation device includes a second circulation system connected to a second liquid supply source, and supplies the second liquid flowing in at least a part of the second circulation system to the mixing and outlet portion.

[0166] In the processing liquid supply device, the first liquid supplied from the first liquid supply source circulates in the first circulation system. The second liquid supplied from the second liquid supply source circulates in the second circulation system. The first liquid circulated in the first circulation system and the second liquid circulated in the second circulation system are supplied to the mixing and leading-out portion. Thus, the first liquid and the second liquid are mixed in the mixing and leading-out portion.

[0167] A mixed liquid containing the first liquid and the second liquid is generated and stored in the main storage tank. The mixed liquid stored in the main storage tank is supplied to one or more substrate processing units as a processing liquid.

[0168] In the above structure, the first circulation system receives the first liquid supplied from the first liquid supply source, and functions as a buffer flow path for buffering the fluctuation of the flow rate and pressure of the first liquid. Thus, it is suppressed that a large disturbance occurs in the flow state of the first liquid flowing from the first circulation system to the mixed lead-out part. In addition, the second circulation system receives the second liquid supplied from the second liquid supply source, and functions as a buffer flow path for buffering the fluctuation of the flow rate and pressure of the second liquid. Thus, it is suppressed that a large disturbance occurs in the flow state of the second liquid flowing from the second circulation system to the mixed lead-out part.

[0169] In this case, in the mixing and derivation section, the first liquid and the second liquid can be mixed in a relatively stable state. Therefore, the processing liquid is generated with relatively high accuracy. In addition, since the generation of the processing liquid under unstable conditions is suppressed, there is no need for pre-draining or other treatments for removing low-quality processing liquid. As a result, high-quality processing liquid generated according to predetermined conditions without discarding low-quality processing liquid can be stably supplied to one or more substrate processing sections.

[0170] (Item 2) In the processing liquid supply device described in Item 1, it may be that:

[0171] The first circulation system includes a first state adjustment unit for adjusting the state of the first liquid flowing in the first circulation system.

[0172] The second circulation system includes a second state adjustment unit that adjusts a state of the second liquid flowing in the second circulation system.

[0173] In this case, the state of the first liquid flowing from the first circulation system to the mixing and derivation part can be adjusted to an appropriate state. In addition, the state of the second liquid flowing from the second circulation system to the mixing and derivation part can be adjusted to an appropriate state. Thus, the first liquid and the second liquid can be mixed with high precision according to a predetermined condition.

[0174] (Item 3) In the processing liquid supply device described in Item 2, it may also be that:

[0175] The first circulation device is configured to be operable in a first liquid circulation mode and a first liquid supply mode, wherein in the first liquid circulation mode, the first liquid is circulated in the first circulation system, and in the first liquid supply mode, the first liquid flowing in at least a portion of the first circulation system is supplied to the mixing and outlet portion.

[0176] The second circulation device is configured to be operable in a second liquid circulation mode and a second liquid supply mode, wherein in the second liquid circulation mode, the second liquid is circulated in the second circulation system, and in the second liquid supply mode, the second liquid flowing in at least a portion of the second circulation system is supplied to the mixing and outlet portion.

[0177] The above-mentioned processing liquid supply device also includes a control unit, which, when the above-mentioned first circulation device operates in the above-mentioned first liquid circulation mode and the above-mentioned second circulation device operates in the above-mentioned second liquid circulation mode, when the state of the above-mentioned first liquid flowing in the above-mentioned first circulation system satisfies a predetermined first condition and the state of the above-mentioned second liquid flowing in the above-mentioned second circulation system satisfies a predetermined second condition, switches the operation mode of the above-mentioned first circulation device from the above-mentioned first liquid circulation mode to the above-mentioned first liquid supply mode, and switches the operation mode of the above-mentioned second circulation device from the above-mentioned second liquid circulation mode to the above-mentioned second liquid supply mode.

[0178] In this case, in the first circulation device in the first liquid circulation mode, the state of the first liquid flowing in the first circulation system can be adjusted by the first state adjusting unit to satisfy the first condition. In the second circulation device in the second liquid circulation mode, the state of the second liquid flowing in the second circulation system can be adjusted by the second state adjusting unit to satisfy the second condition.

[0179] When the first condition is satisfied in the first circulation device in the first liquid circulation mode and the second condition is satisfied in the second circulation device in the second liquid circulation mode, the operation modes of the circulation devices are switched. Thus, the first liquid is supplied to the mixing and outlet section in a state where the first condition is satisfied, and the second liquid is supplied to the mixing and outlet section in a state where the second condition is satisfied. Therefore, the first liquid and the second liquid are properly mixed in the mixing and outlet section.

[0180] According to the above configuration, the first liquid and the second liquid are prevented from being mixed in an unintended state to generate the processing liquid. In addition, the first liquid and the second liquid can be mixed with high accuracy according to predetermined conditions.

[0181] (Item 4) In the processing liquid supply device described in Item 3, it may be that:

[0182] The first state adjustment unit includes a first pump that, when in the first liquid circulation mode, pressurizes and delivers the first liquid in the first circulation system, and, when in the first liquid supply mode, pressurizes and delivers the first liquid flowing in the first circulation system to the mixing and outlet unit.

[0183] The second state adjustment unit includes a second pump that, when in the second liquid circulation mode, pressurizes and delivers the second liquid in the second circulation system, and, when in the second liquid supply mode, pressurizes and delivers the second liquid flowing in the second circulation system to the mixing and outlet unit.

[0184] The first condition includes that the amount per unit time of the first liquid flowing in the first circulation system is within a predetermined first flow rate range,

[0185] The second condition includes that the amount per unit time of the second liquid flowing in the second circulation system is within a predetermined second flow rate range.

[0186] In this case, the flow rate of the first liquid flowing in the first circulation system can be adjusted with high accuracy. In addition, the flow rate of the second liquid flowing in the second circulation system can be adjusted with high accuracy. Thus, the flow rate of the first liquid and the flow rate of the second liquid supplied to the mixing and derivation section can be adjusted with high accuracy. As a result, the first liquid and the second liquid can be mixed with high accuracy in a predetermined ratio.

[0187] (Item 5) In the processing liquid supply device described in Item 4, it may also be that:

[0188] The first state adjustment unit further includes a first adjustment valve for adjusting the flow rate of the first liquid flowing in the first circulation system.

[0189] The second state adjustment unit further includes a second adjustment valve that adjusts a flow rate of the second liquid flowing in the second circulation system.

[0190] In this case, the flow rate of the first liquid flowing in the first circulation system can be adjusted with higher accuracy. In addition, the flow rate of the second liquid flowing in the second circulation system can be adjusted with higher accuracy. Thus, the flow rate of the first liquid and the flow rate of the second liquid supplied to the mixing and derivation section can be adjusted with higher accuracy. As a result, the first liquid and the second liquid can be mixed with higher accuracy according to a predetermined ratio.

[0191] (Item 6) In the processing liquid supply device described in any one of Items 1 to 5, it may be that:

[0192] The first circulation system includes a first flow meter for detecting a flow rate of the first liquid flowing in the first circulation system.

[0193] The second circulation system includes a second flow meter that detects a flow rate of the second liquid flowing in the second circulation system.

[0194] In this case, the state of the first liquid can be adjusted by controlling each part of the first circulation system based on the detection result of the first flow meter. In addition, the state of the second liquid can be adjusted by controlling each part of the second circulation system based on the detection result of the second flow meter.

[0195] Furthermore, it is also possible to determine whether the state of the first liquid satisfies the first condition and whether the state of the second liquid satisfies the second condition based on the detection result of the first flow meter and the detection result of the second flow meter.

[0196] (Item 7) In the processing liquid supply device described in any one of Items 3 to 5, it may be that:

[0197] The first state adjusting unit includes a first heating unit for heating the first liquid flowing in the first circulation system.

[0198] The second state adjusting unit includes a second heating unit for heating the second liquid flowing in the second circulation system.

[0199] The first condition includes that the temperature of the first liquid flowing in the first circulation system is within a predetermined first temperature range,

[0200] The second condition includes that the temperature of the second liquid flowing in the second circulation system is within a predetermined second temperature range.

[0201] In this case, the processing liquid is generated by mixing the first liquid in the first temperature range and the second liquid in the second temperature range. Thus, the mixed liquid can be generated under a stable temperature condition.

[0202] (Item 8) In the processing liquid supply device described in any one of Items 1 to 7, it may be that:

[0203] The first circulation system includes a first sub-storage tank storing a predetermined amount of the first liquid supplied from the first liquid supply source.

[0204] The second circulation system includes a second sub-storage tank storing a predetermined amount of the second liquid supplied from the second liquid supply source.

[0205] In this case, the first auxiliary storage tank functions as a buffer tank (buffer container) for buffering fluctuations in the flow rate and pressure of the first liquid supplied from the first liquid supply source to the first circulation system. Thus, a large disturbance in the state of the first liquid flowing in the first circulation system due to the supply of the first liquid from the first liquid supply source to the first circulation system is suppressed.

[0206] In addition, the second auxiliary storage tank functions as a buffer tank (buffer container) for buffering fluctuations in the flow rate and pressure of the second liquid supplied from the second liquid supply source to the second circulation system. Thus, a large disturbance in the state of the second liquid flowing in the second circulation system due to the supply of the second liquid from the second liquid supply source to the second circulation system is suppressed.

[0207] (Item 9) The processing liquid supply device of Item 9 is a processing liquid supply device that supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, and comprises:

[0208] A liquid supply unit including a main storage tank storing the mixed liquid, and supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units;

[0209] a mixed lead-out portion for guiding the mixed liquid to the main storage tank;

[0210] a first auxiliary storage tank connected to the first liquid supply source and storing the first liquid supplied from the first liquid supply source in a predetermined amount;

[0211] a first supply device for supplying the first liquid stored in the first auxiliary storage tank to the mixing and outlet portion;

[0212] a second auxiliary storage tank connected to the second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source; and

[0213] A second supply device supplies the second liquid stored in the second sub-storage tank to the mixing and outlet portion.

[0214] In the processing liquid supply device, the first liquid supplied from the first liquid supply source is stored in the first auxiliary storage tank. The second liquid supplied from the second liquid supply source is stored in the second auxiliary storage tank. The first liquid stored in the first auxiliary storage tank is supplied to the mixing and outlet portion, and the second liquid stored in the second auxiliary storage tank is supplied to the mixing and outlet portion. Thus, in the mixing and outlet portion, the first liquid and the second liquid are mixed.

[0215] A mixed liquid of the first liquid and the second liquid is generated and stored in the main storage tank. The mixed liquid stored in the main storage tank is supplied as a processing liquid to one or more substrate processing units.

[0216] In the above structure, the first auxiliary storage tank receives the first liquid supplied from the first liquid supply source and functions as a buffer tank (buffer container) for buffering the fluctuation of the flow rate and pressure of the first liquid. Thus, it is suppressed that the flow state of the first liquid flowing from the first auxiliary storage tank to the mixing outlet portion is greatly disturbed. In addition, the second auxiliary storage tank receives the second liquid supplied from the second liquid supply source and functions as a buffer tank (buffer container) for buffering the fluctuation of the flow rate and pressure of the second liquid. Thus, it is suppressed that the flow state of the second liquid flowing from the second auxiliary storage tank to the mixing outlet portion is greatly disturbed.

[0217] In this case, in the mixing and derivation section, the first liquid and the second liquid can be mixed in a relatively stable state. Therefore, the processing liquid is generated with relatively high accuracy. In addition, since the generation of the processing liquid under unstable conditions is suppressed, there is no need for pre-draining or other treatments for removing low-quality processing liquid. As a result, high-quality processing liquid generated according to predetermined conditions without discarding low-quality processing liquid can be stably supplied to one or more substrate processing sections.

[0218] (Item 10) The substrate processing apparatus of Item 10 comprises:

[0219] The processing liquid supply device described in any one of items 1 to 9; and

[0220] The one or more substrate processing units mentioned above.

[0221] The substrate processing apparatus includes the above-mentioned processing liquid supply device, so that the consumption of each liquid used in generating the processing liquid can be reduced, and the substrate processing can be performed using the high-quality processing liquid.

[0222] (Item 11) The processing liquid supply method of Item 11 is a processing liquid supply method for supplying a mixed liquid including a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, comprising:

[0223] The step of supplying the first liquid and the second liquid to the mixing outlet using a first circulation device and a second circulation device;

[0224] a step of mixing the first liquid and the second liquid supplied by the first circulation device and the second circulation device in the mixing and outlet section and guiding the mixed liquid to a main storage tank; and

[0225] supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units,

[0226] The first circulation device has a first circulation system connected to a first liquid supply source,

[0227] The second circulation device includes a second circulation system connected to a second liquid supply source.

[0228] In the treatment liquid supply method, the first liquid supplied from the first liquid supply source circulates in the first circulation system. The second liquid supplied from the second liquid supply source circulates in the second circulation system. The first liquid circulating in the first circulation system and the second liquid circulating in the second circulation system are supplied to the mixing and leading-out section. Thus, the first liquid and the second liquid are mixed in the mixing and leading-out section.

[0229] A mixed liquid containing the first liquid and the second liquid is generated and stored in the main storage tank. The mixed liquid stored in the main storage tank is supplied as a processing liquid to one or more substrate processing units.

[0230] In the above structure, the first circulation system receives the first liquid supplied from the first liquid supply source, and functions as a buffer flow path for buffering the fluctuation of the flow rate and pressure of the first liquid. Thus, it is suppressed that a large disturbance occurs in the flow state of the first liquid flowing from the first circulation system to the mixed lead-out part. In addition, the second circulation system receives the second liquid supplied from the second liquid supply source, and functions as a buffer flow path for buffering the fluctuation of the flow rate and pressure of the second liquid. Thus, it is suppressed that a large disturbance occurs in the flow state of the second liquid flowing from the second circulation system to the mixed lead-out part.

[0231] In this case, in the mixing and derivation section, the first liquid and the second liquid can be mixed in a relatively stable state. Therefore, the processing liquid is generated with relatively high accuracy. In addition, since the generation of the processing liquid under unstable conditions is suppressed, there is no need for pre-draining or other treatments for removing low-quality processing liquid. As a result, high-quality processing liquid generated according to predetermined conditions without discarding low-quality processing liquid can be stably supplied to one or more substrate processing sections.

[0232] (Item 12) The processing liquid supply method of Item 12 is a processing liquid supply method for supplying a mixed liquid including a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, comprising:

[0233] The step of supplying the first liquid and the second liquid to the mixing and discharging portion from a first sub-storage tank connected to a first liquid supply source and storing a predetermined amount of the first liquid supplied from the first liquid supply source, and a second sub-storage tank connected to a second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source;

[0234] a step of mixing the first liquid and the second liquid in the mixing and outlet section and guiding the mixed liquid to a main storage tank; and

[0235] The step of supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing parts.

[0236] In the treatment liquid supply method, the first liquid supplied from the first liquid supply source is stored in the first auxiliary storage tank. The second liquid supplied from the second liquid supply source is stored in the second auxiliary storage tank. The first liquid stored in the first auxiliary storage tank is supplied to the mixing and outlet portion, and the second liquid stored in the second auxiliary storage tank is supplied to the mixing and outlet portion. Thus, the first liquid and the second liquid are mixed in the mixing and outlet portion.

[0237] A mixed liquid of the first liquid and the second liquid is generated and stored in the main storage tank. The mixed liquid stored in the main storage tank is supplied as a processing liquid to one or more substrate processing units.

[0238] In the above structure, the first auxiliary storage tank receives the first liquid supplied from the first liquid supply source and functions as a buffer tank (buffer container) for buffering the fluctuation of the flow rate and pressure of the first liquid. Thus, it is suppressed that a large disturbance occurs in the flow state of the first liquid flowing from the first auxiliary storage tank to the mixing outlet. In addition, the second auxiliary storage tank receives the second liquid supplied from the second liquid supply source and functions as a buffer tank (buffer container) for buffering the fluctuation of the flow rate and pressure of the second liquid. Thus, it is suppressed that a large disturbance occurs in the flow state of the second liquid flowing from the second auxiliary storage tank to the mixing outlet.

[0239] In this case, in the mixing and derivation section, the first liquid and the second liquid can be mixed in a relatively stable state. Therefore, the processing liquid is generated with relatively high accuracy. In addition, since the generation of the processing liquid under unstable conditions is suppressed, there is no need for pre-draining or other treatments for removing low-quality processing liquid. As a result, high-quality processing liquid generated according to predetermined conditions without discarding low-quality processing liquid can be stably supplied to one or more substrate processing sections.

[0240] According to the processing liquid supply device, substrate processing device, and substrate processing method of the above-mentioned embodiment, unnecessary consumption of raw liquid for generating processing liquid is suppressed, thereby contributing to the reduction of global environmental pollution caused by the processing liquid.

Claims

1. A processing liquid supply device, which supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, characterized in that: have: a liquid supply unit including a main storage tank storing the mixed liquid, and supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units; a mixed lead-out portion for guiding the mixed liquid to the main storage tank; a first circulation device having a first circulation system connected to a first liquid supply source, and supplying the first liquid flowing in at least a portion of the first circulation system to the mixing and outlet portion; as well as The second circulation device includes a second circulation system connected to a second liquid supply source, and supplies the second liquid flowing in at least a part of the second circulation system to the mixing and outlet portion.

2. The processing liquid supply device according to claim 1, characterized in that: The first circulation system includes a first state adjustment unit that adjusts the state of the first liquid flowing in the first circulation system. The second circulation system includes a second state adjustment unit that adjusts a state of the second liquid flowing in the second circulation system.

3. The processing liquid supply device according to claim 2, characterized in that: The first circulation device is configured to be operable in a first liquid circulation mode and a first liquid supply mode, wherein in the first liquid circulation mode, the first liquid is circulated in the first circulation system, and in the first liquid supply mode, the first liquid flowing in at least a portion of the first circulation system is supplied to the mixing and outlet portion. The second circulation device is configured to be operable in a second liquid circulation mode and a second liquid supply mode, wherein in the second liquid circulation mode, the second liquid is circulated in the second circulation system, and in the second liquid supply mode, the second liquid flowing in at least a portion of the second circulation system is supplied to the mixing and derivation section. The processing liquid supply device also includes a control unit, which switches the operation mode of the first circulation device from the first liquid circulation mode to the first liquid supply mode, and switches the operation mode of the second circulation device from the second liquid circulation mode to the second liquid supply mode, when the state of the first liquid flowing in the first circulation system satisfies a predetermined first condition and the state of the second liquid flowing in the second circulation system satisfies a predetermined second condition, when the first circulation device operates in the first liquid circulation mode and the second circulation device operates in the second liquid circulation mode.

4. The processing liquid supply device according to claim 3, characterized in that: The first state adjustment unit includes a first pump that, when in the first liquid circulation mode, pressurizes and delivers the first liquid in the first circulation system, and, when in the first liquid supply mode, pressurizes and delivers the first liquid flowing in the first circulation system to the mixing and outlet unit. The second state adjustment unit includes a second pump that pressurizes and delivers the second liquid in the second circulation system when in the second liquid circulation mode, and pressurizes and delivers the second liquid flowing in the second circulation system to the mixing and outlet unit when in the second liquid supply mode. The first condition includes that the amount per unit time of the first liquid flowing in the first circulation system is within a predetermined first flow rate range, The second condition includes that the amount per unit time of the second liquid flowing in the second circulation system is within a predetermined second flow rate range.

5. The processing liquid supply device according to claim 4, characterized in that: The first state adjustment unit further includes a first adjustment valve for adjusting a flow rate of the first liquid flowing in the first circulation system. The second state adjustment unit further includes a second adjustment valve that adjusts a flow rate of the second liquid flowing in the second circulation system.

6. The processing liquid supply device according to any one of claims 1 to 5, characterized in that: The first circulation system includes a first flow meter for detecting a flow rate of the first liquid flowing in the first circulation system. The second circulation system includes a second flow meter that detects a flow rate of the second liquid flowing in the second circulation system.

7. The processing liquid supply device according to any one of claims 3 to 5, characterized in that: The first state adjusting unit includes a first heating unit that heats the first liquid flowing in the first circulation system. The second state adjusting unit includes a second heating unit for heating the second liquid flowing in the second circulation system. The first condition includes that the temperature of the first liquid flowing in the first circulation system is within a predetermined first temperature range. The second condition includes that the temperature of the second liquid flowing in the second circulation system is within a predetermined second temperature range.

8. The processing liquid supply device according to any one of claims 1 to 7, characterized in that: The first circulation system includes a first sub-storage tank storing a predetermined amount of the first liquid supplied from the first liquid supply source. The second circulation system includes a second sub-storage tank storing a predetermined amount of the second liquid supplied from the second liquid supply source.

9. A processing liquid supply device, which supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing parts, characterized in that: have: a liquid supply unit including a main storage tank storing the mixed liquid, and supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units; a mixed lead-out portion for guiding the mixed liquid to the main storage tank; a first auxiliary storage tank connected to a first liquid supply source and storing a predetermined amount of the first liquid supplied from the first liquid supply source; a first supply device for supplying the first liquid stored in the first auxiliary storage tank to the mixing and outlet portion; a second auxiliary storage tank connected to a second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source; and A second supply device supplies the second liquid stored in the second sub-storage tank to the mixing and discharge portion.

10. A substrate processing device, characterized in that: have: The treatment liquid supply device according to any one of claims 1 to 9; and The one or more substrate processing sections.

11. A method for supplying a processing liquid, wherein a mixed liquid containing a first liquid and a second liquid is supplied as a processing liquid to one or more substrate processing parts, wherein: include: A step of supplying the first liquid and the second liquid to a mixing outlet using a first circulation device and a second circulation device; A step of mixing the first liquid and the second liquid supplied by the first circulation device and the second circulation device in the mixing and outlet section and guiding the mixed liquid to a main storage tank; as well as supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units, The first circulation device has a first circulation system connected to a first liquid supply source. The second circulation device includes a second circulation system connected to a second liquid supply source.

12. A method for supplying a processing liquid, wherein a mixed liquid containing a first liquid and a second liquid is supplied as a processing liquid to one or more substrate processing parts, wherein: include: A step of supplying the first liquid and the second liquid to a mixing outlet portion from a first sub-reservoir connected to a first liquid supply source and storing a predetermined amount of the first liquid supplied from the first liquid supply source, and a second sub-reservoir connected to a second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source; a step of mixing the first liquid and the second liquid in the mixing and outlet section and guiding the mixed liquid to a main storage tank; as well as The step of supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing parts.

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