Wafer cooling device and method

Abstract

The invention discloses a wafer cooling device and method, and aims to overcome the defects that a cooling-water machine needs to be adopted for temperature control during wafer cooling, a large site is needed, and the use requirements of part of scenes cannot be met. The cooling plate comprises a cooling plate and a water cooling plate, a plurality of thermoelectric semiconductor coolers are installed between the cooling plate and the water cooling plate, the cold faces of the thermoelectric semiconductor coolers make contact with the cooling plate, the hot faces of the thermoelectric semiconductor coolers make contact with the water cooling plate, a heat dissipation flow channel is formed in the water cooling plate, and a heat dissipation medium is introduced into the heat dissipation flow channel to dissipate heat of the water cooling plate. The wafer cooling device provided by the invention is small in size, greatly reduces the requirement on a site, can control the precision of the temperature within + / -0.1 DEG C, and meets the use requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production, and more specifically, to a wafer cooling device and method. Background Art

[0002] At present, wafer processing requires high-temperature treatment. After high-temperature treatment, rapid cooling is required to avoid degradation or damage of material properties. In addition, high temperature uniformity is required. Industry standards basically require that the surface temperature of the cold plate be 23±0.1℃. Using a chiller to control the temperature requires a larger site, which cannot meet the usage requirements of some scenarios. Summary of the invention

[0003] In order to overcome the above-mentioned shortcomings, the present invention provides a wafer cooling device and method, which has a small size, greatly reduces the demand for space, and the temperature can be accurately controlled within ±0.1°C, meeting the use requirements.

[0004] In order to solve the above technical problems, the present invention adopts the following technical scheme: a wafer cooling device, including a cold plate and a water-cooled plate, a plurality of thermoelectric semiconductor refrigerators are installed between the cold plate and the water-cooled plate, the cold surface of the thermoelectric semiconductor refrigerator is in contact with the cold plate, the hot surface of the thermoelectric semiconductor refrigerator is in contact with the water-cooled plate, a heat dissipation channel is arranged on the water-cooled plate, and a heat dissipation medium is introduced into the heat dissipation channel to dissipate heat and cool the water-cooled plate.

[0005] After the thermoelectric semiconductor cooler is powered on, the temperature of the cold surface decreases, thereby cooling the cold plate. The heat generated by the hot surface of the thermoelectric semiconductor cooler is dissipated through the water-cooled plate, and the heat dissipation medium is introduced into the heat dissipation flow channel set on the water-cooled plate to dissipate heat and cool the water-cooled plate. By controlling the input power of the thermoelectric semiconductor cooler, the temperature of the cold surface of the thermoelectric semiconductor cooler is controlled, and then the temperature of the cold plate is precisely controlled. Several thermoelectric semiconductor coolers are arranged to ensure the uniformity of temperature at each position of the cold plate. The thermoelectric semiconductor cooler is small in size, so the size of the entire wafer cooling device can be made small, reducing the demand for space.

[0006] The wafer cooling device of this patent application is small in size, greatly reducing the need for space, and the temperature can be accurately controlled within ±0.1°C, meeting the use requirements.

[0007] Preferably, a heat dissipation pipe is installed on the water cooling plate, the flow in the heat dissipation pipe forms a heat dissipation channel, and the heat dissipation pipe is installed on the surface of the water cooling plate in contact with the thermoelectric semiconductor refrigerator.

[0008] The heat dissipation pipe is installed on the water-cooled plate to form a heat dissipation channel, which facilitates the layout of the heat dissipation channel. The heat dissipation pipe is installed on the surface of the water-cooled plate that contacts the thermoelectric semiconductor cooler, so that the heat dissipation pipe can directly contact the hot surface of the thermoelectric semiconductor cooler, which is beneficial to improve the heat dissipation effect.

[0009] Preferably, a heat insulator is filled between the cold plate and the water cooling plate.

[0010] The heat insulator is filled in the gap between the cold plate and the water-cooled plate to prevent heat transfer between the cold plate and the water-cooled plate through air, thereby ensuring the cooling effect of the cold plate.

[0011] Preferably, a sealant is provided at the edge between the cold plate and the water-cooling plate.

[0012] The sealant plays a sealing role, forming a closed space between the cold plate and the water-cooled plate.

[0013] Preferably, a temperature sensor is installed on the cold plate, and the temperature sensor and the thermoelectric semiconductor cooler are both electrically connected to the temperature controller.

[0014] The temperature sensor is installed on the cold plate to monitor the temperature of the cold plate in real time; the temperature controller connects the thermoelectric semiconductor cooler and the temperature sensor, monitors the temperature of the cold plate through the temperature sensor, and then controls the temperature of the cold plate by controlling the input power of the thermoelectric semiconductor cooler, thereby achieving precise control of the cold plate temperature.

[0015] Preferably, a sinking groove is arranged on the surface of the cold plate corresponding to the thermoelectric semiconductor refrigerator, and the thermoelectric semiconductor refrigerator is adaptably connected to the sinking groove.

[0016] The setting of the sinking groove facilitates the reliable installation of the thermoelectric semiconductor cooler and ensures the accuracy of the installation position.

[0017] Preferably, a fastening screw is connected between the cold plate and the water-cooling plate, and heat-insulating particles are mounted on the fastening screw, and the heat-insulating particles abut against the water-cooling plate.

[0018] The cold plate and the water cooling plate are connected by fastening screws, which are easy to assemble and disassemble and have reliable connection. The fastening screws are equipped with heat-insulating particles to play a role in heat insulation.

[0019] Preferably, a heat equalizing spiral tube is installed in the cold plate, and a circulating heat equalizing medium is contained in the heat equalizing spiral tube.

[0020] A heat-averaging spiral tube is installed in the cold plate, and the heat-averaging medium circulates in the heat-averaging spiral tube, which is beneficial to the uniformity of temperature at various positions of the cold plate.

[0021] Preferably, spiral heat dissipation tubes are installed on the surface of the water-cooling plate, and heat dissipation medium is passed through the heat dissipation tubes.

[0022] The heat dissipation tube is installed on the surface of the water cooling plate. The overlapping area between the heat dissipation tube and the hot surface of the thermoelectric semiconductor cooler is large, which improves the heat dissipation effect. Through the dual heat dissipation effect of the heat dissipation tube and the heat dissipation tube, the heat dissipation effect is greatly improved, which is conducive to extending the service life of the thermoelectric semiconductor cooler.

[0023] A wafer cooling method comprises the following steps: cooling the wafer by using a wafer cooling device, starting the wafer cooling device, placing the wafer after high temperature treatment on the cold plate after the surface temperature of the cold plate reaches the requirement; introducing a heat dissipation medium into a heat dissipation flow channel on a water-cooled plate to dissipate heat and cool the water-cooled plate; and detecting the temperature of the cold plate in real time. When the temperature exceeds a set range, adjusting the input power of a thermoelectric semiconductor refrigerator so that the temperature of the cold plate reaches the set range.

[0024] After the wafer cooling device is started, several thermoelectric semiconductor coolers work, the cold surface of the thermoelectric semiconductor cooler cools down, the temperature of the cold plate in contact with the cold surface decreases, and the heat generated by the hot surface of the thermoelectric semiconductor cooler is dissipated through the water cooling plate. After the temperature of the cold plate reaches the temperature required for wafer cooling, the wafer is placed on the surface of the cold plate for cooling. The temperature sensor monitors the temperature of the cold plate in real time, making it easy to control the temperature of the cold plate within a reasonable range, thereby ensuring the cooling effect on the wafer.

[0025] Compared with the prior art, the beneficial effects of the present invention are: (1) The wafer cooling device of the present patent application is small in size, which greatly reduces the demand for space, and the temperature can be accurately controlled within ±0.1°C, meeting the use requirements; (2) The temperature of the cold plate is monitored by a temperature sensor, and then the temperature of the cold plate is controlled by controlling the input power of the thermoelectric semiconductor cooler, thereby achieving precise control of the temperature of the cold plate; (3) A heat-averaging spiral tube is installed in the cold plate, and the heat-averaging medium in the heat-averaging spiral tube circulates, which is beneficial to the uniformity of temperature at various positions of the cold plate; (4) The water-cooled plate has a good heat dissipation effect on the hot surface of the thermoelectric semiconductor cooler, which is beneficial to extending the service life of the thermoelectric semiconductor cooler. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention.

[0027] Figure 2 It is an exploded view of the present invention.

[0028] Figure 3 It is a cross-sectional view of Example 1 of the present invention.

[0029] Figure 4 It is a cross-sectional view of Example 2 of the present invention.

[0030] Figure 5 It is a cold plate structure diagram of embodiment 3 of the present invention.

[0031] Figure 6It is a structural diagram of a water cooling plate according to Embodiment 4 of the present invention.

[0032] In the figure: 1. cold plate, 2. water-cooled plate, 3. thermoelectric semiconductor refrigerator, 4. heat dissipation pipe, 5. positioning groove, 6. thermal insulation pad, 7. recessed groove, 8. thermal insulation body, 9. sealant, 10. temperature sensor, 11. sinking groove, 12. fastening screw, 13. thermal insulation particles, 14. countersunk hole, 15. upper disk body, 16. middle disk body, 17. lower disk body, 18. driving gear, 19. gear ring, 20. heat-averaging spiral tube, 21. heat dissipation capillary tube. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings: Embodiment 1: A wafer cooling device (see Figure 1 , Figure 2 , Figure 3 ), including a cold plate 1 and a water-cooled plate 2, both of which are disc-shaped structures, and a number of thermoelectric semiconductor refrigerators 3 are installed between the cold plate 1 and the water-cooled plate 2. Nine thermoelectric semiconductor refrigerators 3 are evenly arranged in the circumferential direction, plus one in the center, and a total of ten thermoelectric semiconductor refrigerators 3 are arranged. After the thermoelectric semiconductor refrigerator 3 is powered on, the temperature of the cold surface decreases and the temperature of the hot surface increases. The cold surface of the thermoelectric semiconductor refrigerator 3 is in contact with the cold plate 1, and the hot surface of the thermoelectric semiconductor refrigerator 3 is in contact with the water-cooled plate 2. Thermal conductive silicone grease is applied to the cold surface and the hot surface of the thermoelectric semiconductor refrigerator 3 to improve the thermal conductivity. A heat dissipation channel is provided on the water-cooled plate 2, and a heat dissipation medium is introduced into the heat dissipation channel to dissipate and cool the water-cooled plate 2. After the thermoelectric semiconductor refrigerator 3 is powered on, the cold surface cools the cold plate 1, and the heat generated by the hot surface is dissipated through the water-cooled plate 2. The heat dissipation medium is introduced into the heat dissipation channel provided on the water-cooled plate 2 to take away the heat of the water-cooled plate 2 and the hot surface.

[0034] The cooling plate 2 is provided with a heat dissipation pipe 4, and the flow in the heat dissipation pipe 4 forms a heat dissipation channel. The heat dissipation pipe 4 is installed on the surface of the cooling plate 2 in contact with the thermoelectric semiconductor refrigerator 3. Positioning grooves 5 are provided on the surface of the cooling plate 2 corresponding to the heat dissipation pipe 4, and the heat dissipation pipe 4 is installed in the positioning grooves 5. Both ends of the heat dissipation pipe 4 extend to the periphery of the cooling plate 2, and both ends of the heat dissipation pipe 4 bend into the cooling plate 2 to form a three-circle structure, the innermost circle is a U-shaped structure, and the innermost circle is placed in the middle of the cooling plate 2. Both ends of the heat dissipation pipe 4 serve as a liquid inlet and a liquid outlet.

[0035] An insulation pad 6 is installed between the middle of the cold plate 1 and the middle of the water-cooled plate 2. The insulation pad 6 is clamped between the cold plate 1 and the water-cooled plate 2. A recessed groove 7 is provided on the surface of the cold plate 1 and corresponds to the insulation pad 6. The insulation pad 6 is adapted to be connected with the recessed groove 7. During the installation of the cold plate 1 and the water-cooled plate 2, the insulation pad 6 is placed between the cold plate 1 and the water-cooled plate 2 to maintain a certain gap between the cold plate 1 and the water-cooled plate 2 to prevent excessive compression force from damaging the thermoelectric semiconductor refrigerator 3. An insulation body 8 is filled between the cold plate 1 and the water-cooled plate 2. The insulation body 8 is filled in the gap between the cold plate 1 and the water-cooled plate 2 to avoid heat transfer between the cold plate 1 and the water-cooled plate 2 through air, thereby ensuring the cooling effect of the cold plate 1. A sealant 9 is provided at the edge between the cold plate 1 and the water-cooled plate 2. The sealant 9 plays a sealing role to form a closed space between the cold plate 1 and the water-cooled plate 2.

[0036] A temperature sensor 10 is installed on the cold plate 1, and the temperature sensor 10 and the thermoelectric semiconductor refrigerator 3 are both electrically connected to the temperature controller. The temperature measuring contact of the temperature sensor 10 is in contact with the cold plate 1, and the temperature sensor 10 extends toward the water-cooled plate 2 and extends out of the water-cooled plate 2. A sinking groove 11 is arranged on the surface of the cold plate 1 corresponding to the thermoelectric semiconductor refrigerator 3, and the thermoelectric semiconductor refrigerator 3 is adapted and connected to the sinking groove 11. The cold surface of the thermoelectric semiconductor refrigerator 3 is in contact with the bottom surface of the sinking groove 11, and the hot surface of the thermoelectric semiconductor refrigerator 3 is higher than the open end of the sinking groove 11. The setting of the sinking groove 11 facilitates the reliable installation of the thermoelectric semiconductor refrigerator 3 and ensures the accuracy of the installation position.

[0037] A fastening screw 12 is connected between the cold plate 1 and the water-cooled plate 2, and a heat-insulating particle 13 is mounted on the fastening screw 12. The nut end of the fastening screw 12 is placed on the water-cooled plate 2, and the heat-insulating particle 13 abuts against the water-cooled plate 2. A plurality of fastening screws 12 are installed at the middle and edge of the water-cooled plate 2. Countersunk holes 14 are provided on the outer surface of the water-cooled plate 2 corresponding to the fastening screws 12, and the nut end of the fastening screw 12 is installed in the countersunk hole 14.

[0038] A wafer cooling method uses a wafer cooling device to cool the wafer. First, the wafer cooling device is started. After the thermoelectric semiconductor refrigerator 3 is powered on, the temperature of the cold surface decreases and the temperature of the hot surface increases. The cold surface of the thermoelectric semiconductor refrigerator 3 contacts the cold plate 1 to cool the cold plate 1, and the hot surface of the thermoelectric semiconductor refrigerator 3 contacts the water-cooled plate 2 to dissipate heat. After the surface temperature of the cold plate 1 reaches the requirement, the wafer after high-temperature treatment is placed on the cold plate 1, and the wafer is cooled on the constant temperature cold plate 1. During the wafer cooling process, a heat dissipation medium is introduced into the heat dissipation flow channel on the water-cooled plate 2 to dissipate heat and cool the water-cooled plate 2; the heat dissipation medium flows from the liquid inlet into the heat dissipation pipe 4 and is discharged from the liquid outlet. Normal temperature factory water can be used for heat dissipation and cooling, and no water chiller is required. In this process, the temperature of the cold plate 1 is detected in real time. When the temperature exceeds the set range, the input power of the thermoelectric semiconductor refrigerator 3 is adjusted to make the temperature of the cold plate 1 reach the set range. The temperature control accuracy of the cold plate 1 can reach within ±0.1°C, which meets the use requirements.

[0039] Embodiment 2: A wafer cooling device (see Figure 1 , Figure 4 ), including a cold plate 1 and a water-cooled plate 2, both of which are disc-shaped structures, and a number of thermoelectric semiconductor refrigerators 3 are installed between the cold plate 1 and the water-cooled plate 2. Nine thermoelectric semiconductor refrigerators 3 are evenly arranged in the circumferential direction, plus one in the center, and a total of ten thermoelectric semiconductor refrigerators 3 are arranged. After the thermoelectric semiconductor refrigerator 3 is powered on, the temperature of the cold surface decreases and the temperature of the hot surface increases. The cold surface of the thermoelectric semiconductor refrigerator 3 is in contact with the cold plate 1, and the hot surface of the thermoelectric semiconductor refrigerator 3 is in contact with the water-cooled plate 2. Thermal conductive silicone grease is applied to the cold surface and the hot surface of the thermoelectric semiconductor refrigerator 3 to improve the thermal conductivity. A heat dissipation channel is provided on the water-cooled plate 2, and a heat dissipation medium is introduced into the heat dissipation channel to dissipate and cool the water-cooled plate 2. After the thermoelectric semiconductor refrigerator 3 is powered on, the cold surface cools the cold plate 1, and the heat generated by the hot surface is dissipated through the water-cooled plate 2. The heat dissipation medium is introduced into the heat dissipation channel provided on the water-cooled plate 2 to take away the heat of the water-cooled plate 2 and the hot surface.

[0040] The cooling plate 2 is provided with a heat dissipation pipe 4, and the flow in the heat dissipation pipe 4 forms a heat dissipation channel. The heat dissipation pipe 4 is installed on the surface of the cooling plate 2 in contact with the thermoelectric semiconductor refrigerator 3. Positioning grooves 5 are provided on the surface of the cooling plate 2 corresponding to the heat dissipation pipe 4, and the heat dissipation pipe 4 is installed in the positioning grooves 5. Both ends of the heat dissipation pipe 4 extend to the periphery of the cooling plate 2, and both ends of the heat dissipation pipe 4 bend into the cooling plate 2 to form a three-circle structure, the innermost circle is a U-shaped structure, and the innermost circle is placed in the middle of the cooling plate 2. Both ends of the heat dissipation pipe 4 serve as a liquid inlet and a liquid outlet.

[0041] An insulation pad 6 is installed between the middle of the cold plate 1 and the middle of the water-cooled plate 2. The insulation pad 6 is clamped between the cold plate 1 and the water-cooled plate 2. A recessed groove 7 is provided on the surface of the cold plate 1 and corresponds to the insulation pad 6. The insulation pad 6 is adapted to be connected with the recessed groove 7. During the installation of the cold plate 1 and the water-cooled plate 2, the insulation pad 6 is placed between the cold plate 1 and the water-cooled plate 2 to maintain a certain gap between the cold plate 1 and the water-cooled plate 2 to prevent excessive compression force from damaging the thermoelectric semiconductor refrigerator 3. An insulation body 8 is filled between the cold plate 1 and the water-cooled plate 2. The insulation body 8 is filled in the gap between the cold plate 1 and the water-cooled plate 2 to avoid heat transfer between the cold plate 1 and the water-cooled plate 2 through air, thereby ensuring the cooling effect of the cold plate 1. A sealant 9 is provided at the edge between the cold plate 1 and the water-cooled plate 2. The sealant 9 plays a sealing role to form a closed space between the cold plate 1 and the water-cooled plate 2.

[0042] A temperature sensor 10 is installed on the cold plate 1, and the temperature sensor 10 and the thermoelectric semiconductor refrigerator 3 are both electrically connected to the temperature controller. The temperature measuring contact of the temperature sensor 10 is in contact with the cold plate 1, and the temperature sensor 10 extends toward the water-cooled plate 2 and extends out of the water-cooled plate 2. A sinking groove 11 is arranged on the surface of the cold plate 1 corresponding to the thermoelectric semiconductor refrigerator 3, and the thermoelectric semiconductor refrigerator 3 is adapted and connected to the sinking groove 11. The cold surface of the thermoelectric semiconductor refrigerator 3 is in contact with the bottom surface of the sinking groove 11, and the hot surface of the thermoelectric semiconductor refrigerator 3 is higher than the open end of the sinking groove 11. The setting of the sinking groove 11 facilitates the reliable installation of the thermoelectric semiconductor refrigerator 3 and ensures the accuracy of the installation position.

[0043] A fastening screw 12 is connected between the cold plate 1 and the water-cooled plate 2, and a heat-insulating particle 13 is mounted on the fastening screw 12. The nut end of the fastening screw 12 is placed on the water-cooled plate 2, and the heat-insulating particle 13 abuts against the water-cooled plate 2. A plurality of fastening screws 12 are installed at the middle and edge of the water-cooled plate 2. Countersunk holes 14 are provided on the outer surface of the water-cooled plate 2 corresponding to the fastening screws 12, and the nut end of the fastening screw 12 is installed in the countersunk hole 14.

[0044] The cold plate 1 includes an upper plate body 15, a middle plate body 16 and a lower plate body 17. The middle plate body 16 is rotatably installed between the upper plate body 15 and the lower plate body 17. One side of the middle plate body 16 is in contact with the upper plate body 15, and the other side of the middle plate body 16 is in contact with the lower plate body 17. The thermoelectric semiconductor refrigerator 3 is installed on the lower plate body 17. The wafer is placed on the surface of the upper plate body 15 for cooling. The middle plate body 16 is driven to rotate by a motor, and the motor is installed on the water-cooled plate 2. The output shaft of the motor is connected to the driving gear 18. A ring gear 19 is provided on the outer edge of the middle plate body 16. The driving gear 18 is meshed with the ring gear 19 for transmission. During operation, the motor drives the middle plate body 16 to rotate, so that the heat conduction is more uniform, thereby making the temperature of each position on the surface of the upper plate body 15 more uniform, thereby improving the uniformity of temperature.

[0045] A wafer cooling method uses a wafer cooling device to cool the wafer. First, the wafer cooling device is started. After the thermoelectric semiconductor refrigerator 3 is powered on, the temperature of the cold surface decreases and the temperature of the hot surface increases. The cold surface of the thermoelectric semiconductor refrigerator 3 contacts the lower disk body 17 of the cold plate 1 to cool the cold plate 1, and the hot surface of the thermoelectric semiconductor refrigerator 3 contacts the water-cooled plate 2 to dissipate heat. After the surface temperature of the cold plate 1 reaches the requirement, the wafer treated at high temperature is placed on the upper disk body 15 of the cold plate 1. The wafer is cooled on the upper disk body 15 of the constant temperature cold plate 1, and the middle disk body 16 rotates. During the wafer cooling process, a heat dissipation medium is introduced into the heat dissipation flow channel on the water-cooled plate 2 to dissipate heat and cool the water-cooled plate 2; the heat dissipation medium flows from the liquid inlet into the heat dissipation pipe 4 and is discharged from the liquid outlet. Normal temperature factory water can be used for heat dissipation and cooling, without the need for a chiller. In this process, the temperature of the cold plate 1 is detected in real time. When the temperature exceeds the set range, the input power of the thermoelectric semiconductor refrigerator 3 is adjusted to make the temperature of the cold plate 1 reach the set range. The temperature control accuracy of the cold plate 1 can reach within ±0.1°C, which meets the use requirements.

[0046] Embodiment 3: A wafer cooling device (see Figure 1 , Figure 4 , Figure 5 ), including a cold plate 1 and a water-cooled plate 2, both of which are disc-shaped structures, and a number of thermoelectric semiconductor refrigerators 3 are installed between the cold plate 1 and the water-cooled plate 2. Nine thermoelectric semiconductor refrigerators 3 are evenly arranged in the circumferential direction, plus one in the center, and a total of ten thermoelectric semiconductor refrigerators 3 are arranged. After the thermoelectric semiconductor refrigerator 3 is powered on, the temperature of the cold surface decreases and the temperature of the hot surface increases. The cold surface of the thermoelectric semiconductor refrigerator 3 is in contact with the cold plate 1, and the hot surface of the thermoelectric semiconductor refrigerator 3 is in contact with the water-cooled plate 2. Thermal conductive silicone grease is applied to the cold surface and the hot surface of the thermoelectric semiconductor refrigerator 3 to improve the thermal conductivity. A heat dissipation channel is provided on the water-cooled plate 2, and a heat dissipation medium is introduced into the heat dissipation channel to dissipate and cool the water-cooled plate 2. After the thermoelectric semiconductor refrigerator 3 is powered on, the cold surface cools the cold plate 1, and the heat generated by the hot surface is dissipated through the water-cooled plate 2. The heat dissipation medium is introduced into the heat dissipation channel provided on the water-cooled plate 2 to take away the heat of the water-cooled plate 2 and the hot surface.

[0047] The cooling plate 2 is provided with a heat dissipation pipe 4, and the flow in the heat dissipation pipe 4 forms a heat dissipation channel. The heat dissipation pipe 4 is installed on the surface of the cooling plate 2 in contact with the thermoelectric semiconductor refrigerator 3. Positioning grooves 5 are provided on the surface of the cooling plate 2 corresponding to the heat dissipation pipe 4, and the heat dissipation pipe 4 is installed in the positioning grooves 5. Both ends of the heat dissipation pipe 4 extend to the periphery of the cooling plate 2, and both ends of the heat dissipation pipe 4 bend into the cooling plate 2 to form a three-circle structure, the innermost circle is a U-shaped structure, and the innermost circle is placed in the middle of the cooling plate 2. Both ends of the heat dissipation pipe 4 serve as a liquid inlet and a liquid outlet.

[0048] An insulation pad 6 is installed between the middle of the cold plate 1 and the middle of the water-cooled plate 2. The insulation pad 6 is clamped between the cold plate 1 and the water-cooled plate 2. A recessed groove 7 is provided on the surface of the cold plate 1 and corresponds to the insulation pad 6. The insulation pad 6 is adapted to be connected with the recessed groove 7. During the installation of the cold plate 1 and the water-cooled plate 2, the insulation pad 6 is placed between the cold plate 1 and the water-cooled plate 2 to maintain a certain gap between the cold plate 1 and the water-cooled plate 2 to prevent excessive compression force from damaging the thermoelectric semiconductor refrigerator 3. An insulation body 8 is filled between the cold plate 1 and the water-cooled plate 2. The insulation body 8 is filled in the gap between the cold plate 1 and the water-cooled plate 2 to avoid heat transfer between the cold plate 1 and the water-cooled plate 2 through air, thereby ensuring the cooling effect of the cold plate 1. A sealant 9 is provided at the edge between the cold plate 1 and the water-cooled plate 2. The sealant 9 plays a sealing role to form a closed space between the cold plate 1 and the water-cooled plate 2.

[0049] A temperature sensor 10 is installed on the cold plate 1, and the temperature sensor 10 and the thermoelectric semiconductor refrigerator 3 are both electrically connected to the temperature controller. The temperature measuring contact of the temperature sensor 10 is in contact with the cold plate 1, and the temperature sensor 10 extends toward the water-cooled plate 2 and extends out of the water-cooled plate 2. A sinking groove 11 is arranged on the surface of the cold plate 1 corresponding to the thermoelectric semiconductor refrigerator 3, and the thermoelectric semiconductor refrigerator 3 is adapted and connected to the sinking groove 11. The cold surface of the thermoelectric semiconductor refrigerator 3 is in contact with the bottom surface of the sinking groove 11, and the hot surface of the thermoelectric semiconductor refrigerator 3 is higher than the open end of the sinking groove 11. The setting of the sinking groove 11 facilitates the reliable installation of the thermoelectric semiconductor refrigerator 3 and ensures the accuracy of the installation position.

[0050] A fastening screw 12 is connected between the cold plate 1 and the water-cooled plate 2, and a heat-insulating particle 13 is mounted on the fastening screw 12. The nut end of the fastening screw 12 is placed on the water-cooled plate 2, and the heat-insulating particle 13 abuts against the water-cooled plate 2. A plurality of fastening screws 12 are installed at the middle and edge of the water-cooled plate 2. Countersunk holes 14 are provided on the outer surface of the water-cooled plate 2 corresponding to the fastening screws 12, and the nut end of the fastening screw 12 is installed in the countersunk hole 14.

[0051] The cold plate 1 includes an upper plate body 15, a middle plate body 16 and a lower plate body 17. The middle plate body 16 is rotatably installed between the upper plate body 15 and the lower plate body 17. One side of the middle plate body 16 is in contact with the upper plate body 15, and the other side of the middle plate body 16 is in contact with the lower plate body 17. The thermoelectric semiconductor refrigerator 3 is installed on the lower plate body 17. The wafer is placed on the surface of the upper plate body 15 for cooling. The middle plate body 16 is driven to rotate by a motor, and the motor is installed on the water-cooled plate 2. The output shaft of the motor is connected to the driving gear 18. A ring gear 19 is provided on the outer edge of the middle plate body 16. The driving gear 18 is meshed with the ring gear 19 for transmission. During operation, the motor drives the middle plate body 16 to rotate, so that the heat conduction is more uniform, thereby making the temperature of each position on the surface of the upper plate body 15 more uniform, thereby improving the uniformity of temperature.

[0052] A heat-equalizing spiral tube 20 is installed in the cold plate 1, and a circulating heat-equalizing medium is contained in the heat-equalizing spiral tube 20. The heat spiral tube avoids the fastening screw 12 to prevent interference. The two strands of the heat-equalizing spiral tube 20 are spirally installed in the cold plate 1. The two ends of the heat-equalizing spiral tube 20 extend to the periphery of the cold plate 1. The heat-equalizing spiral tube 20 is connected to a water pump, and the two ends of the heat-equalizing spiral tube 20 are respectively connected to the inlet and outlet of the heat-equalizing spiral tube 20. The operation of the water pump causes the heat-equalizing medium to circulate in the heat-equalizing spiral tube 20, which is beneficial to the uniformity of temperature at various positions of the cold plate 1. In this embodiment, the heat-equalizing spiral tube 20 is installed on the side of the lower plate body 17 opposite to the middle plate body 16.

[0053] A wafer cooling method uses a wafer cooling device to cool the wafer. First, the wafer cooling device is started. After the thermoelectric semiconductor refrigerator 3 is powered on, the temperature of the cold surface decreases and the temperature of the hot surface increases. The cold surface of the thermoelectric semiconductor refrigerator 3 contacts the lower disk body 17 of the cold plate 1 to cool the cold plate 1, and the hot surface of the thermoelectric semiconductor refrigerator 3 contacts the water-cooled plate 2 to dissipate heat. After the surface temperature of the cold plate 1 reaches the requirement, the wafer treated at high temperature is placed on the upper disk body 15 of the cold plate 1. The wafer is cooled on the upper disk body 15 of the constant temperature cold plate 1, and the middle disk body 16 rotates. During the wafer cooling process, a heat dissipation medium is introduced into the heat dissipation flow channel on the water-cooled plate 2 to dissipate heat and cool the water-cooled plate 2; the heat dissipation medium flows from the liquid inlet into the heat dissipation pipe 4 and is discharged from the liquid outlet. Normal temperature factory water can be used for heat dissipation and cooling, without the need for a chiller. In this process, the temperature of the cold plate 1 is detected in real time. When the temperature exceeds the set range, the input power of the thermoelectric semiconductor refrigerator 3 is adjusted to make the temperature of the cold plate 1 reach the set range. The temperature control accuracy of the cold plate 1 can reach within ±0.1°C, which meets the use requirements.

[0054] Embodiment 4: A wafer cooling device (see Figure 6 ), its structure is similar to any one of Examples 1 to 3, the main difference is that in this embodiment, a spiral heat dissipation tube 21 is installed on the surface of the water-cooled plate 2, and a heat dissipation medium is passed into the heat dissipation tube 21. The two strands of the heat dissipation tube 21 are spirally installed on the surface of the water-cooled plate 2. At the overlap between the heat dissipation tube 21 and the heat dissipation tube 4, the heat dissipation tube 21 is recessed to avoid interference. Both ends of the heat dissipation tube 21 extend to the periphery of the water-cooled plate 2, and a heat dissipation medium is passed into the heat dissipation tube 21 to achieve cooling and heat dissipation of the water-cooled plate 2. The overlapping area between the heat dissipation tube 21 and the hot surface of the thermoelectric semiconductor refrigerator 3 is large, which improves the heat dissipation effect. Through the dual heat dissipation effect of the heat dissipation tube 21 and the heat dissipation tube 4, the heat dissipation effect is greatly improved, which is beneficial to prolonging the service life of the thermoelectric semiconductor refrigerator 3. The other structures are the same as any one of Examples 1 to 3.

[0055] The above-described embodiments are only preferred solutions of the present invention and are not intended to limit the present invention in any form. Other variations and modifications are possible without exceeding the technical solutions described in the claims.

Claims

1. A wafer cooling device, characterized in that: It includes a cold plate and a water-cooled plate. Several thermoelectric semiconductor refrigerators are installed between the cold plate and the water-cooled plate. The cold surface of the thermoelectric semiconductor refrigerator is in contact with the cold plate, and the hot surface of the thermoelectric semiconductor refrigerator is in contact with the water-cooled plate. A heat dissipation channel is arranged on the water-cooled plate. Heat dissipation medium is introduced into the heat dissipation channel to dissipate heat and cool the water-cooled plate.

2. A wafer cooling device according to claim 1, characterized in that: A heat dissipation pipe is installed on the water-cooling plate, and the flow in the heat dissipation pipe forms a heat dissipation channel. The heat dissipation pipe is installed on the surface of the water-cooling plate that contacts the thermoelectric semiconductor refrigerator.

3. The wafer cooling device according to claim 1, characterized in that: The space between the cold plate and the water cooling plate is filled with an insulator.

4. The wafer cooling device according to claim 1, characterized in that: Sealant is provided at the edge between the cold plate and the water cooling plate.

5. The wafer cooling device according to claim 1, characterized in that: A temperature sensor is installed on the cold plate, and both the temperature sensor and the thermoelectric semiconductor refrigerator are electrically connected to the temperature controller.

6. The wafer cooling device according to claim 1, characterized in that: A sinking groove is arranged on the surface of the cold plate corresponding to the thermoelectric semiconductor refrigerator, and the thermoelectric semiconductor refrigerator is adaptably connected to the sinking groove.

7. The wafer cooling device according to claim 1, characterized in that: The cold plate and the water cooling plate are connected with fastening screws, and heat insulating particles are mounted on the fastening screws, and the heat insulating particles abut against the water cooling plate.

8. The wafer cooling device according to claim 1, characterized in that: A heat equalizing spiral tube is installed in the cold plate, and a circulating heat equalizing medium is contained in the heat equalizing spiral tube.

9. A wafer cooling device according to any one of claims 1 to 8, characterized in that: Spiral heat dissipation tubes are installed on the surface of the water cooling plate, and heat dissipation medium is passed into the heat dissipation tubes.

10. A wafer cooling method, characterized in that: Cooling is performed using the wafer cooling device described in any one of claims 1 to 9, the wafer cooling device is started, and the wafer after high-temperature treatment is placed on the cold plate after the surface temperature of the cold plate reaches the requirement; a heat dissipation medium is introduced into the heat dissipation flow channel on the water-cooled plate to dissipate heat and cool the water-cooled plate; the temperature of the cold plate is detected in real time, and when the temperature exceeds a set range, the input power of the thermoelectric semiconductor cooler is adjusted to make the temperature of the cold plate reach the set range.

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