Batch type aluminum nitride wafer cleaning device and using method

Abstract

The invention discloses a batch type aluminum nitride wafer cleaning device. The device comprises a cross-shaped supporting frame, a supporting rod and a nut. Through holes are formed in the left end and the right end of the supporting rod and assembled with the cross-shaped supporting frame, inner triangular opening grooves are evenly distributed in a rod body of the supporting rod and used for containing wafers, multiple wafers can be loaded at the same time, and batch cleaning is achieved. The supporting rod is pushed to enable the upper edge and the lower edge of the wafer to make contact with the right-angle side of the triangular opening groove in the supporting rod, the whole cleaning device only makes contact with the edges of the aluminum nitride wafer, cleaning blind areas are avoided, the cleaning cleanliness of the aluminum nitride wafer is greatly improved, and the yield is increased. The cross-shaped supporting frame is provided with threads matched with the nut, and the supporting rod is fixed by rotating the nut. The aluminum nitride wafer cleaning device can load aluminum nitride wafers with different diameters and different shapes, saves production cost, enables the whole cleaning process to be simpler and more efficient, and is suitable for batch cleaning of the aluminum nitride wafers.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor material cleaning, and in particular to a batch type aluminum nitride wafer cleaning device. Background Art

[0002] In the field of semiconductor materials, aluminum nitride (AlN) has attracted much attention due to its excellent physical and chemical properties. As an ultra-wide bandgap semiconductor material, aluminum nitride has a high bandgap width (6.2eV), high thermal conductivity (340W / (m·K)), high breakdown field strength (11.7MV / cm) and good UV transmittance, making it an ideal material for manufacturing optoelectronic devices such as deep ultraviolet LEDs, ultraviolet curing equipment, and ultraviolet detectors. With the development of science and technology, the demand for aluminum nitride wafers is growing, and the requirements for its processing and cleaning technology are also getting higher and higher.

[0003] In the processing of aluminum nitride wafers, cleaning is a crucial link. The cleaning quality directly affects the performance of the wafer and the quality of the final product. The traditional cleaning method usually uses ultrasonic cleaning technology, inserting the wafer vertically into the cleaning device, and then placing the cleaning device with the wafer in the cleaning tank for cleaning. However, the existing cleaning device has some shortcomings, which limits the improvement of cleaning efficiency and cleaning quality.

[0004] First, the side walls of existing cleaning devices are usually provided with slots for holding wafers. The shapes and diameters of these slots are fixed and cannot adapt to wafers of different diameters, resulting in poor versatility of the cleaning device. In order to adapt to wafers of different diameters, it is usually necessary to prepare multiple sets of cleaning devices of different specifications, which not only increases production costs, but also brings inconvenience to cleaning operations and other subsequent treatments.

[0005] Secondly, since the width of the slot is greater than the thickness of the wafer, the side surface of the wafer is in contact with the slot for a long time during the cleaning process, which can easily cause a blind spot in the cleaning process and affect the cleaning effect. In addition, the wafer may shake during the cleaning process due to the instability of the device, further affecting the cleaning quality. Summary of the invention

[0006] Based on the above problems in the prior art, the present invention aims to provide a batch aluminum nitride wafer cleaning device and a method of using the same, so as to achieve a batch cleaning effect of aluminum nitride wafers, solve the cleaning blind area problem, and improve the safety and efficiency of wafer cleaning.

[0007] To achieve the above-mentioned object of the invention, the present invention adopts the following technical scheme.

[0008] The present invention provides a batch type aluminum nitride wafer cleaning device, the device comprising:

[0009] Two cross support frames are placed opposite to each other; the cross support frames are formed by two cylindrical rods fixedly connected at the center of the two cylindrical rods, and the rod bodies of the cylindrical rods are provided with threads;

[0010] Four support rods; the two ends of each support rod are respectively connected to the corresponding positions of the upper and lower parts and the two sides of the cylindrical rods that constitute the two cross support frames; wherein each support rod has through holes at both ends, and the connection is achieved by inserting the cylindrical rod into the through holes at both ends of the support rods;

[0011] and a plurality of nuts, wherein the nuts match the threads on the rod body of the cylindrical rod constituting the cross support frame; the position where the rod body of the cylindrical rod of the cross support frame extends into the through hole of the support rod is fixed by rotating the nuts;

[0012] The inner triangular grooves are evenly distributed on the rod body of the support rod, and the wafer is placed vertically on the rod body of the support rod, so that the two edges of the edge of the wafer are respectively in contact with the two right-angled sides of the inner triangular groove of the support rod to form a contact point; the edge of each wafer forms a contact point with each support rod respectively, and the four contact points together constitute a clamp for the wafer, preventing the aluminum nitride wafer from tilting and shaking during the cleaning process. By moving the support rod and changing the position of the cylindrical rod body of the cross support frame extending into the through hole of the support rod, wafers of different diameters can be clamped.

[0013] Preferably, the inner triangular groove on the support rod body is an isosceles right triangle. The groove width of the inner triangular groove (i.e., the length of the hypotenuse of the isosceles right triangle) is 0.5-3 mm. If the groove width of the inner triangular groove is a, the groove depth of the inner triangular groove is a / 2, and the center spacing of adjacent inner triangular grooves is 2a, which can support the cleaning of wafers with a thickness range of 0.15a-0.85a.

[0014] Preferably, the aluminum nitride wafer cleaning device can load circular wafers, rectangular wafers, and some irregular-shaped wafers with a diameter or length of 10-150 mm and a thickness of 0.1-2.5 mm.

[0015] Preferably, the single loading capacity of the aluminum nitride wafer cleaning device is 5-50 wafers. Assuming the single loading capacity is b wafers, the length of the support rod is not less than (2b-1)*a+15mm.

[0016] Preferably, the width of the support rod is 2-15 mm and the thickness is 1-8 mm. The two ends of the support rod are semicircular with a diameter of 3-15 mm, and the diameter of the semicircle is consistent with the width of the support rod. The diameter of the through hole set at both ends of the support rod is 1.5-12 mm, the center of the through hole coincides with the center of the semicircle, and the aperture of the through hole is 0.05-0.2 mm larger than the diameter of the cylindrical rod of the cross support frame.

[0017] Preferably, the diameter of the cylindrical rod of the cross support frame is 1.5-12 mm and the length is 10-200 mm; the threads on the rod body of the cylindrical rod are distributed in the remaining parts other than 1-10 mm from the center of the rod body. This can achieve the universal effect of aluminum nitride wafers with a diameter of 10-150 mm, saving production costs.

[0018] Preferably, the aluminum nitride wafer cleaning device can be made of fluoroplastic (PTFE, PVDF, PFA) or polypropylene (PP), and the entire device can be composed of one or more materials.

[0019] The method for using the present invention comprises the following specific steps.

[0020] S1, select support rods with different slot widths according to the thickness of the required root cleaning wafer, select support rods with different lengths according to the number of wafers to be cleaned each time, and then determine the appropriate width and thickness of the support rod. Determine the diameter and length of the cross support frame and the size of the nut and the through hole size according to the size of the support rod.

[0021] S2, place the two cross support frames opposite to each other, screw nuts into the two ends of each cylindrical rod of the cross support frame, and insert the through holes at the two ends of the three support rods into the cylindrical rods of the two cross support frames respectively, so as to connect the bottom and both sides of the two cross support frames.

[0022] S3, pushing the support rod connecting the lower parts of the two cross support frames (i.e., the support rod connecting the lower parts of the cylindrical rods in the two cross support frames which are in a vertical position at this time) to a position where the distance from the center of the cross support frame is half the diameter (or length) of the wafer to be cleaned, screwing a nut onto the cylindrical rod, and clamping the support rod at this position using the inner and outer nuts;

[0023] S4, placing the wafer in the inner triangular slot of the lower support rod, so that two edges of the wafer edge are in contact with two vertical sides of the inner triangular slot respectively.

[0024] S5, push the support rods on both sides so that the edge of the wafer is stuck in the inner triangular grooves of the support rods on both sides, and the wafer is vertically connected to each support rod; and the support rods are clamped and fixed with nuts.

[0025] S6, and insert the through holes at both ends of the remaining support rod into the cylindrical rods of the two cross support frames respectively to connect the upper parts of the two cross support frames; push the support rod into the wafer to contact the inner triangular groove of the wafer, and clamp and fix the support rod with a nut.

[0026] The batch type aluminum nitride wafer cleaning device of the present invention not only improves the efficiency and effect of wafer cleaning, but also improves the yield rate, and is suitable for batch cleaning of aluminum nitride wafers. Compared with the prior art, its beneficial effects are specifically embodied in the following aspects.

[0027] 1) The present invention realizes a batch type aluminum nitride wafer cleaning device. By adjusting the nut to fix the support rod position, it can be compatible with aluminum nitride wafers of different diameters, and realize the loading and cleaning of standard and non-standard wafers.

[0028] It saves the use cost and makes the whole cleaning process simpler and more efficient.

[0029] 2) The invention realizes batch loading and cleaning of wafers through the multi-position slot design of the side bracket and the bottom bracket. At the same time, the support rod slot adopts the inner triangular slot design to eliminate the contact between the surface and edge of the wafer and the cleaning device to damage the smooth surface, while avoiding the cleaning blind area, improving the cleanliness,

[0030] And it can greatly improve the cleaning yield and efficiency of the wafer.

[0031] 3) The device can clamp and fix the aluminum nitride wafer, eliminating the wafer cracking or mechanical damage caused by shaking and collision during the cleaning process, thereby improving the cleaning yield and finished product rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a three-dimensional diagram showing the structure of a batch type aluminum nitride wafer cleaning device of the present invention.

[0033] Figure 2 The figure is a schematic top view of the structure of a batch type aluminum nitride wafer cleaning device of the present invention.

[0034] Figure 3 The invention discloses a cross support frame of a batch type aluminum nitride wafer cleaning device.

[0035] Figure 4 The invention discloses a support rod of a batch type aluminum nitride wafer cleaning device.

[0036] Figure 5 The invention discloses a nut for a batch type aluminum nitride wafer cleaning device.

[0037] In the figure: 1 is a chip, 2-a is an upper support rod, 2-b is a first side support rod, 2-c is a second side support rod, 2-d is a lower support rod, 3-a is a first cross support frame, 3-b is a second cross support frame, 4-a is a first nut, 4-b is a second nut, 4-c is a third nut, 4-d is a fourth nut, 4-e is a fifth nut, 4-f is a sixth nut, 4-g is a seventh nut, 4-h is an eighth nut, 4-i is a ninth nut, 4-j is a tenth nut, 4-k is an eleventh nut, 4-l is a twelfth nut, 4-m is a thirteenth nut, 4-n is a fourteenth nut, 4-o is a fifteenth nut, and 4-p is a sixteenth nut. DETAILED DESCRIPTION

[0038] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0039] like Figure 1 and Figure 2 The schematic diagram and top view of the structure of a batch type aluminum nitride wafer cleaning device used in each embodiment of the present invention are shown in the figure. As can be seen from the figure, the device is composed of two cross support frames (respectively a first cross support frame 3-a and a second cross support frame 3-b), four support rods (respectively a first side support rod 2-b, a second side support rod 2-c, a lower support rod 2-d and an upper support rod 2-a) and a plurality of nuts, and its assembly relationship is shown in the figure.

[0040] Among them, in the device of each embodiment, the cross support frame is as follows Figure 3 As shown, it is composed of two cylindrical rods fixedly connected at a vertical intersection in the center, and threads are evenly arranged on the cylindrical rod body at the remaining parts 1-10mm away from the center of the rod body.

[0041] Among them, in the device of each embodiment, the support rod is as follows Figure 4 As shown, inner triangular opening grooves are evenly arranged on the body of the support rod, and the inner triangle is an isosceles right triangle.

[0042] Figure 5 The structure diagram of several nuts used in the cleaning device in each embodiment is shown in the figure. The hexagonal nut is used in each embodiment of the present invention. The inscribed circle diameter of the nut is 3-18mm, and the center of the nut contains a through hole with a diameter of 1.5-12mm. Figure 5 The hole is penetrated by a thread, and the hole diameter is consistent with the cylindrical diameter of the cross support frame.

[0043] A more detailed description is given below in conjunction with the embodiments and drawings.

[0044] Embodiment 1

[0045] In this embodiment, the aluminum nitride wafers to be cleaned are 20 pieces of aluminum nitride wafers with a diameter of 10 mm and a thickness of 0.3 mm. Figure 1 The structure diagram of the cleaning device, the steps of using the device are as follows:

[0046] S1: Select a support rod with a slot width of 0.6mm, a length of 32mm, a shaft width of 5mm, a thickness of 2mm, and a through hole diameter of 3.5mm, a cross support frame with a diameter of 3.5mm and a length of 45mm, and a hexagonal nut with an inscribed circle diameter of 5mm and a through hole diameter of 3.5mm.

[0047] S2: Screw nuts 4-f, 4-i, 4-m, 4-b into the inner side of the first cross support frame 3-a, and screw nuts 4-h, 4-k, 4-o, 4-d into the inner side of the second cross support frame 3-b. Insert the first side support rod 2-b, the second side support rod 2-c, and the lower support rod 2-d into the first cross support frame 3-a and the second cross support frame 3-b, screw nuts 4-e, 4-j, 4-n into the outer side of the first cross support frame 3-a, and screw nuts 4-g, 4-l, 4-p into the outer side of the second cross support frame 3-b.

[0048] S3: Push the lower support rod 2-d to the 5mm position, and rotate the nuts 4-m, 4-n, 4-o, and 4-p to fix the lower support rod 2-d. Place the wafer 1 in the slot of the lower support rod 2-d, so that the upper and lower edge edges of the wafer 1 are in contact with the right angles of the inner triangular slot of the lower support rod 2-d. Push the first side support rod 2-b and the second side support rod 2-c to fit the wafer 1, so that the wafer 1 is placed in the inner triangular slot of the same horizontal plane of the lower support rod 2d, the first side support rod 2-b, and the second side support rod 2-c. Rotate the nuts 4-e, 4-f, 4-g, 4-h, 4-i, 4-j, 4-k, and 4-l to fix the first side support rod 2-b and the second side support rod 2-c.

[0049] S4: Insert the upper support rod 2-a into the first cross support frame 3-a and the second cross support frame 3-b to make it contact with the chip 1, screw the nuts 4-a and 4-c into the first cross support frame 3-a and the second cross support frame 3-b, rotate the nuts 4-a, 4-c, 4-b, and 4-d to make the inner and outer nuts fit with the upper support rod, and fix the upper support rod.

[0050] Embodiment 2

[0051] In this embodiment, the aluminum nitride wafers to be cleaned are 30 pieces of aluminum nitride wafers with a diameter of 80 mm and a thickness of 0.6 mm. Figure 1 The structure diagram of the cleaning device, the steps of using the device are as follows:

[0052] S1: Select a support rod with a slot width of 1.0mm, a length of 80mm, a shaft width of 6mm, a thickness of 4mm, and a through hole diameter of 4mm, a cross support frame with a diameter of 4mm and a length of 100mm, and a hexagonal nut with an inscribed circle diameter of 6mm and a through hole diameter of 4mm.

[0053] S2: Screw nuts 4-f, 4-i, 4-m, 4-b into the inner side of the first cross support frame 3-a, and screw nuts 4-h, 4-k, 4-o, 4-d into the inner side of the second cross support frame 3-b. Insert the first side support rod 2-b, the second side support rod 2-c, and the lower support rod 2-d into the first cross support frame 3-a and the second cross support frame 3-b, screw nuts 4-e, 4-j, 4-n into the outer side of the first cross support frame 3-a, and screw nuts 4-g, 4-l, 4-p into the outer side of the second cross support frame 3-b.

[0054] S3: Push the lower support rod 2-d to the 40mm position, and rotate the nuts 4-m, 4-n, 4-o, and 4-p to fix the lower support rod 2-d. Place the wafer 1 in the slot of the lower support rod 2-d, so that the upper and lower edge edges of the wafer 1 are in contact with the right angles of the inner triangular slot of the lower support rod 2-d. Push the first side support rod 2-b and the second side support rod 2-c to fit the wafer 1, so that the wafer 1 is placed in the inner triangular slot of the same horizontal plane of the lower support rod 2d, the first side support rod 2-b, and the second side support rod 2-c. Rotate the nuts 4-e, 4-f, 4-g, 4-h, 4-i, 4-j, 4-k, and 4-l to fix the first side support rod 2-b and the second side support rod 2-c.

[0055] S4: Insert the upper support rod 2-a into the first cross support frame 3-a and the second cross support frame 3-b to make it contact with the chip 1, screw the nuts 4-a and 4-c into the first cross support frame 3-a and the second cross support frame 3-b, rotate the nuts 4-a, 4-c, 4-b, and 4-d to make the inner and outer nuts fit with the upper support rod, and fix the upper support rod.

[0056] Embodiment 3

[0057] In this embodiment, the aluminum nitride wafers to be cleaned are 35 aluminum nitride wafers with a diameter of 150 mm and a thickness of 1 mm. Figure 1 The structure diagram of the cleaning device, the steps of using the device are as follows:

[0058] S1: Select a support rod with a slot width of 1.5mm, a length of 120mm, a shaft width of 8mm, a thickness of 5mm, and a through hole diameter of 6mm, a cross support frame with a diameter of 6mm and a length of 170mm, and a hexagonal nut with an inscribed circle diameter of 9mm and a through hole diameter of 6mm.

[0059] S2: Screw nuts 4-f, 4-i, 4-m, 4-b into the inner side of the first cross support frame 3-a, and screw nuts 4-h, 4-k, 4-o, 4-d into the inner side of the second cross support frame 3-b. Insert the first side support rod 2-b, the second side support rod 2-c, and the lower support rod 2-d into the first cross support frame 3-a and the second cross support frame 3-b, screw nuts 4-e, 4-j, 4-n into the outer side of the first cross support frame 3-a, and screw nuts 4-g, 4-l, 4-p into the outer side of the second cross support frame 3-b.

[0060] S3: Push the lower support rod 2-d to a position of about 75mm, and rotate nuts 4-m, 4-n, 4-o, and 4-p to fix the lower support rod 2-d. Place the chip 1 in the slot of the lower support rod 2-d, so that the upper and lower edge edges of the chip 1 are in contact with the right-angled sides of the inner triangular slot of the lower support rod 2-d. Push the first side support rod 2-b and the second side support rod 2-c to fit the chip 1, so that the chip 1 is placed in the inner triangular slot on the same horizontal plane as the lower support rod 2d, the first side support rod 2-b, and the second side support rod 2-c. Rotate nuts 4-e, 4-f, 4-g, 4-h, 4-i, 4-j, 4-k, and 4-l to fix the first side support rod 2-b and the second side support rod 2-c;

[0061] S4: Insert the upper support rod 2-a into the first cross support frame 3-a and the second cross support frame 3-b to make it contact with the chip 1, screw the nuts 4-a and 4-c into the first cross support frame 3-a and the second cross support frame 3-b, rotate the nuts 4-a, 4-c, 4-b, and 4-d to make the inner and outer nuts fit with the upper support rod, and fix the upper support rod.

[0062] The above embodiments are only used to help understand the method and core idea of ​​the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A batch type aluminum nitride wafer cleaning device, characterized in that: The device includes: Two cross support frames are placed opposite to each other; the cross support frames are formed by two cylindrical rods fixedly connected at the center of the two cylindrical rods, and the rod bodies of the cylindrical rods are provided with threads; Four support rods; the two ends of each support rod are respectively connected to the corresponding positions of the upper and lower parts and the two sides of the cylindrical rods of the two cross support frames; wherein each support rod has through holes at both ends, and the connection is made by inserting the cylindrical rod into the through holes at both ends of the support rod; and a plurality of nuts, wherein the nuts match the threads on the rod body of the cylindrical rod of the cross support frame; the position of the cylindrical rod body of the cross support frame extending into the through hole of the support rod is fixed by rotating the nuts; The inner triangular grooves are evenly distributed on the rod body of the support rod, and the chip is placed vertically on the rod body of the support rod, so that the two edges of the edge of the chip are respectively in contact with the two sides of the inner triangle of the inner triangular groove of the support rod to form a contact point; the edge of each chip forms a contact point with each support rod respectively, and the four contact points together constitute the clamping of the chip; and by moving the support rod and changing the position of the cylindrical rod body of the cross support frame extending into the through hole of the support rod, chips with different diameters can be clamped.

2. The batch type aluminum nitride wafer cleaning device according to claim 1, characterized in that: The inner triangular opening on the support rod body is grooved, and the inner triangle is an isosceles right triangle; the two edges of the edge of the chip are respectively in contact with the two right angle sides of the inner triangle of the inner triangular opening of the support rod to form a contact point.

3. The batch type aluminum nitride wafer cleaning device according to claim 2, characterized in that: The width of the inner triangular groove, that is, the length of the hypotenuse of the isosceles right triangle, is 0.5-3mm; assuming that the width of the inner triangular groove is a, the depth of the inner triangular groove is a / 2, and the center spacing between adjacent inner triangular grooves is 2a, which can support cleaning wafers with a thickness range of 0.15a-0.85a.

4. The batch type aluminum nitride wafer cleaning device according to claim 3, characterized in that: The aluminum nitride wafer is a circular wafer, a rectangular wafer, or an irregular wafer with a diameter or length of 10-150 mm and a thickness of 0.1-2.5 mm.

5. The batch type aluminum nitride wafer cleaning device according to claim 3, characterized in that: The single loading capacity of the aluminum nitride wafer cleaning device is 5-50 wafers. Assuming that the single loading capacity is b wafers, the length of the support rod is not less than (2b-1)*a+15mm.

6. The batch type aluminum nitride wafer cleaning device according to claim 1, characterized in that: The width of the support rod is 2-15mm and the thickness is 1-8mm; both ends of the support rod are semicircular with a diameter of 3-15mm, and the diameter of the semicircle is consistent with the width of the support rod.

7. The batch type aluminum nitride wafer cleaning device according to claim 6, characterized in that: The diameter of the through hole arranged at both ends of the support rod is 1.5-12 mm, the center of the through hole coincides with the center of the semicircle, and the aperture of the through hole is 0.05-0.2 mm larger than the diameter of the cylindrical rod of the cross support frame.

8. The batch type aluminum nitride wafer cleaning device according to claim 7, characterized in that: The diameter of the cylindrical rod of the cross support frame is 1.5-12 mm and the length is 10-200 mm; the threads on the rod body of the cylindrical rod are distributed in the remaining parts other than 1-10 mm away from the center of the rod body.

9. The batch type aluminum nitride wafer cleaning device according to claim 1, characterized in that: The aluminum nitride wafer cleaning device is made of one or more materials selected from fluoroplastics and polypropylene.

10. A method for using a batch type aluminum nitride wafer cleaning device according to any one of claims 1 to 9, characterized in that: The steps include: S1, select support rods with different slot widths according to the thickness of the required root cleaning wafer, select support rods with different lengths according to the number of wafers to be cleaned each time, and then determine the width and thickness of the support rods; determine the diameter and length of the cross support frame, the size of the nut and the size of the through hole according to the size of the support rod; S2, place the two cross support frames opposite to each other, screw nuts into the two ends of each cylindrical rod of the cross support frame, and insert the through holes at the two ends of the three support rods into the cylindrical rods of the two cross support frames respectively, so as to connect the bottom and both sides of the two cross support frames; S3, pushing the support rod connecting the lower parts of the two cross support frames, that is, the support rod connecting the lower parts of the cylindrical rods in the vertical position in the two cross support frames, so that the support rod is at a distance from the center of the cross support frame by half the diameter (or length) of the wafer to be cleaned, and then screwing a nut on the cylindrical rod, and clamping the support rod at this position with the inner and outer nuts; S4, placing the wafer in the inner triangular groove of the lower support rod, so that two edges of the wafer edge are in contact with two vertical edges of the inner triangular groove respectively; S5, push the support rods on both sides so that the edge of the wafer is inserted into the inner triangular grooves of the support rods on both sides, and the wafer is vertically connected to each support rod; and the support rods are clamped and fixed with nuts; S6, insert the through holes at both ends of the remaining support rod into the cylindrical rods of the two cross support frames respectively, and connect the upper parts of the two cross support frames; push the support rod into the wafer and contact the inner triangular groove of the wafer, and clamp and fix the support rod with a nut.

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