Satellite disc rotating speed measuring system and method of multi-sheet planetary MOCVD equipment

Abstract

The invention discloses a satellite disc rotating speed measuring method and system of multi-sheet planetary MOCVD equipment, and relates to the field of semiconductor manufacturing equipment. The method comprises the following steps: acquiring a rotation angle of a mother disc relative to an initial position; matching the rotation angle with a pre-stored identification angle; after matching succeeds, identity information of the current satellite disk under a distance measuring sensor is acquired; acquiring the height information of the current satellite disc under the distance measuring sensor; and matching the acquired height information of the satellite disc with pre-stored height information of the satellite disc, and acquiring the current rotating speed of the satellite disc after matching succeeds. The problem that only one representative value of the satellite disc can be obtained and the rotating speed of each satellite disc cannot be quickly and accurately obtained when the rotating speed of the satellite disc is measured at present is solved.

Description

[0001] This application is a divisional application. The application number of the original application is 202411210561.4, and the original application date is August 30, 2024. The invention name of the original application is a satellite disk rotation speed measurement system and method for a multi-plate planetary MOCVD device. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The invention relates to the field of semiconductor manufacturing equipment, and in particular to a satellite disk rotation speed measurement system and method for a multi-chip planetary MOCVD device. Background Art

[0003] The semiconductor thin film deposition reaction chamber is provided with a self-rotating graphite master disk and a planetary disk (satellite disk) that rotates around the central axis of the master disk and rotates with the master disk. The graphite master disk is driven by a mechanical motor, and the speed is controllable, generally around 20rpm. Multiple small graphite disks, namely satellite disks, are distributed on the graphite master disk, which are used to carry the wafer to grow epitaxial thin films. The satellite disk is suspended and rotated by blowing argon or hydrogen, and its specific rotation speed is unknown. In the semiconductor thin film deposition process, the rotation speed of the satellite disk has an important influence on the uniformity of the flow field, the uniformity of the temperature field, and the consistency of the film growth. Therefore, it is of great significance to measure the rotation speed of the satellite disk. The rotation speed measurement of the satellite disk in the semiconductor epitaxial growth process becomes very difficult due to the complex environment, such as the rotation of the master disk and the satellite disk, and the need to consider the calculation under the composite motion state, as well as the influence of high temperature and airflow.

[0004] Our company has conducted research in this area and can quickly determine the rotation speed of the satellite disk. However, subsequent research found that there are still some deficiencies in practical applications. For example, in theory, the rotation speed of one satellite disk can be used as the rotation speed of all satellite disks, but in practice it is found that the rotation speed of each satellite disk will vary due to factors such as size deviation and process wear. The simultaneous processing of multiple satellite disks can significantly improve processing efficiency, but the difference in rotation speed of different satellite disks leads to a decrease in the consistency of thin film growth in the same batch of wafers. How to accurately and quickly grasp the rotation speed of each satellite disk to prepare for the subsequent process of adjusting the uniformity of the thin film has become a problem that needs to be solved urgently. Summary of the invention

[0005] In order to solve the above problem that the rotation speed of each satellite disk on the master disk cannot be calculated, the first aspect of the present invention provides a method for measuring the rotation speed of a satellite disk of a multi-planetary MOCVD device, comprising the following steps:

[0006] Obtain the rotation angle of the master disk relative to the initial position;

[0007] Matching the rotation angle with a pre-stored recognition angle;

[0008] When the match is successful, the identity information of the current satellite dish under the ranging sensor is obtained according to the recognition angle and the pre-stored correspondence between the recognition angle and the satellite dish identity information;

[0009] Acquire the altitude information of the current satellite dish under the ranging sensor;

[0010] Matching the acquired height information of the satellite dish with the pre-stored height information of the satellite dish, and when the match is successful, obtaining the current rotation speed of the satellite dish according to the acquired height information of the satellite dish and the correspondence between the pre-stored height information of the satellite dish and the rotation speed;

[0011] When the master disk continues to rotate with the satellite disks, all the above steps are repeated to obtain the rotation speeds of all the satellite disks on the master disk.

[0012] In some embodiments of the invention, before step S100: obtaining the rotation angle of the master disk relative to the initial position, the following steps are also included:

[0013] Step S101: Rotate the mother disk to the initial position, at which time the first satellite disk is under the ranging sensor;

[0014] Step S102: Obtain n identification angles according to the pre-stored number n of satellite dishes and the pre-stored formula: identification angle θm=(360° / n)×m, where n and m are natural numbers, 1≤m≤n;

[0015] Step S103: The obtained n identification angles and the identity information of the n satellite dishes are stored in a one-to-one correspondence to obtain a correspondence between the identification angles and the identity information of the satellite dishes.

[0016] In some embodiments of the invention, after step S103: storing the obtained n identification angles and the identity information of the n satellite dishes in a one-to-one correspondence to obtain the corresponding relationship between the identification angles and the identity information of the satellite dishes, the method further includes:

[0017] Step S104: rotating the master disc according to the identification angle;

[0018] Step S105: After the mother disk is rotated to the recognition angle, it is detected whether the wafer on the satellite disk can be taken out. If it cannot be taken out, the mother disk is rotated to make corrections so that the wafer can be taken out and a corrected recognition angle is obtained, and the corrected recognition angle is used as the obtained recognition angle;

[0019] Step S106: Repeat the above steps S101-S105 until the mother disk rotates one circle and all satellite disks have been tested to see whether the wafers on the satellite disks can be taken out.

[0020] In some embodiments of the invention, before step S100: obtaining the rotation angle of the master disk relative to the initial position, the following steps are also included:

[0021] Step S201: rotating the mother disk to an initial position, at which time the first satellite disk is not under the ranging sensor;

[0022] Step S202: setting any radial direction of the master disc at the initial position to 0°;

[0023] Step S203: obtaining the corresponding angle α of the satellite dish under the ranging sensor;

[0024] Step S204: obtaining an angle β of a direction of a line connecting the center of the mother disk and the center of the first satellite disk;

[0025] Step S205: According to the formula: when α≥β, γ=α-β, when α<β, γ=360°+α-β, obtain the rotation angle γ when the first satellite dish rotates to under the ranging sensor, and γ is also used as one of the identification angles;

[0026] Step S206: According to the preset number n of satellite dishes and the formula: identification angle θ=γ+(360° / n)×(m-1), n ​​identification angles are obtained, and the obtained n identification angles are stored in a one-to-one correspondence with the identity information of the n satellite dishes to obtain a corresponding relationship between the identification angles and the identity information of the satellite dishes, wherein n and m are natural numbers, 1≤m≤n.

[0027] In some embodiments of the invention, the step of obtaining the current rotation speed of the satellite dish under the ranging sensor according to the acquired altitude information of the satellite dish and the pre-stored correspondence between the altitude information of the satellite dish and the rotation speed includes:

[0028] According to the identity information of the satellite dish, searching for a relationship corresponding to the current satellite dish from all pre-stored relationships corresponding to the satellite dishes, wherein the relationship corresponding to the satellite dishes includes a corresponding relationship between the height and the rotation speed of the satellite dish;

[0029] The current rotation speed of the satellite dish under the ranging sensor is obtained according to the height information of the satellite dish and the corresponding relationship of the satellite dish.

[0030] In some embodiments of the invention, when the master disk and the satellite disks are continuously rotating, all the above steps are repeated, and the step of obtaining the rotation speeds of all the satellite disks on the master disk includes:

[0031] When the mother disk rotates 0-360 degrees, each time a rotation speed of the satellite disk is obtained, the rotation speed corresponding to the satellite disk is stored in the controller;

[0032] When the mother disk rotates more than 360°, the corresponding rotation speed of the satellite disk stored in the controller is updated each time the rotation speed of one satellite disk is obtained.

[0033] In some embodiments of the invention, the acquired height information of the satellite disk is matched with the pre-stored height information of the satellite disk, and when the match is successful, the steps of acquiring the current rotation speed of the satellite disk according to the acquired height information of the satellite disk and the correspondence between the pre-stored height information of the satellite disk and the rotation speed include: Step S110: when not in the preset wafer processing process, when the mother disk is not rotating and the satellite disk is not floating, acquiring the vertical distance between the upper surface of the wafer placed on the satellite disk and the ranging sensor;

[0034] Step S120: introducing a predetermined air flow rate to make the satellite dish carrying the wafer float and rotate, and obtaining a vertical distance h2 between the upper surface of the wafer and the distance measuring sensor;

[0035] Step S130: Calculate the floating height of the satellite dish and / or the wafer according to the formula: floating height Δh = h1-h2, wherein h1 is the vertical distance between the upper surface of the wafer placed on the satellite dish and the ranging sensor when the satellite dish is not floating, and h2 is the vertical distance between the upper surface of the wafer and the ranging sensor obtained after a predetermined airflow is introduced to float and rotate the satellite dish carrying the wafer;

[0036] Step S140: obtaining the rotation speed of the satellite dish;

[0037] Step S150: The floating height and the rotation speed of the satellite disk are associated and stored to obtain the mapping relationship.

[0038] In some embodiments of the invention, the acquired height information of the satellite dish is matched with the pre-stored height information of the satellite dish, and when the match is successful, the step of acquiring the current rotation speed of the satellite dish according to the acquired height information of the satellite dish and the correspondence between the pre-stored height information of the satellite dish and the rotation speed includes:

[0039] Step S501: changing the amount of airflow introduced so as to change the floating height of the satellite dish;

[0040] Step S502: obtaining the changed floating height of the satellite disk and / or wafer;

[0041] Step S503: obtaining the rotation speed of the satellite dish;

[0042] Step S504: storing the changed floating height of the satellite disk and / or wafer in association with the rotation speed of the satellite disk, thereby obtaining the updated mapping relationship;

[0043] Step S505: repeating steps S501 to S504 until a preset condition is met and the process stops. The preset condition includes obtaining a mapping relationship of a preset amount, or the floating height exceeds or is equal to a preset value.

[0044] In some embodiments of the invention, after step S505, the following steps are included:

[0045] Step S506: Rotate the mother disk according to the identification angle so that the next satellite disk is under the ranging sensor;

[0046] Step S507: Repeat steps S505-S506 until the mapping relationship of each satellite dish is obtained.

[0047] A second aspect of the present invention provides a satellite disk rotation speed measurement system for a multi-chip planetary MOCVD device, using any satellite disk rotation speed measurement method for a multi-chip planetary MOCVD device described in the first aspect, comprising:

[0048] a master disk, the master disk being rotatable about a rotation center axis of the master disk,

[0049] A plurality of satellite disks are circumferentially distributed on the master disk and are used to carry wafers. The master disk can carry the satellite disks to revolve around the rotation center axis of the master disk, and the satellite disks can rotate around the rotation center axis of the satellite disk.

[0050] A rotating device, disposed below the master disc, capable of driving the master disc to rotate;

[0051] An angle sensor, used to obtain the rotation angle of the master disk relative to the initial position and transmit it to the controller;

[0052] A controller, used for controlling the rotating device to drive the mother disk to rotate, and also for matching the rotation angle with the identification angle. When the matching is successful, the identity information of the current satellite disk under the ranging sensor is obtained according to the identification angle and the pre-stored correspondence between the identification angle and the satellite disk identity information;

[0053] A ranging sensor, used to obtain the altitude information of the current satellite dish under the ranging sensor;

[0054] The controller is further used to obtain the current rotation speed of the satellite disk according to the height information of the satellite disk and the pre-stored correspondence between the height information of the satellite disk and the rotation speed; and is also used to obtain the rotation speed of each of the satellite disks on the mother disk.

[0055] Beneficial effects of the present invention: This application measures the floating height and rotation speed of the satellite disk and / or wafer when the mother disk is not rotating, and establishes a mapping relationship. When in the wafer processing process, the floating height of the satellite disk and / or wafer is directly measured and the satellite disk rotation speed can be obtained according to the pre-stored mapping relationship. This solves the problem that in the wafer processing process, the satellite disk always revolves around the mother disk, making it difficult to measure the satellite disk rotation speed. The measurement of the rotation speed under the complex movement of the satellite disk revolution and rotation in the wafer processing process is converted into the measurement of the floating height of the satellite disk and / or wafer, which simplifies the measurement method and improves the measurement efficiency. At the same time, it also solves the problem that when using this method to measure the rotation speed of the satellite disk, only a representative value of all satellite disks can be obtained, and the rotation speed of each satellite disk cannot be quickly and accurately known. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 This is one of the flow charts of the satellite dish rotation speed measurement method according to the implementation mode of the present application;

[0057] Figure 2 This is one of the structural schematic diagrams of the satellite dish rotation speed measurement system according to the implementation mode of the present application;

[0058] Figure 3 This is a schematic diagram of the structure of an MOCVD device according to an embodiment of the present application;

[0059] Figure 4 This is the second flow chart of the satellite dish rotation speed measurement method according to the implementation mode of the present application;

[0060] Figure 5 This is the third flow chart of the satellite dish rotation speed measurement method according to the implementation mode of the present application;

[0061] Figure 6 This is the fourth flow chart of the satellite dish rotation speed measurement method according to the implementation mode of the present application;

[0062] Figure 7 A graph showing the relationship between height and time measured by a distance measuring sensor according to an embodiment of the present application;

[0063] Figure 8 This is one of the partial structural schematic diagrams of the satellite dish rotation speed measurement system according to the implementation mode of the present application;

[0064] Fig. 9 This is a second schematic diagram of a partial structure of a satellite dish rotation speed measurement system according to an embodiment of the present application;

[0065] Fig.10 This is the fifth flow chart of the satellite dish rotation speed measurement method according to the implementation mode of the present application;

[0066] Fig.11 This is a schematic diagram of the structure of a master disk according to an embodiment of the present application;

[0067] Fig.12 A schematic diagram of a wafer structure according to an embodiment of the present application;

[0068] Fig.13 A schematic diagram of pulse signal data according to an embodiment of the present application;

[0069] Fig.14 This is the sixth flow chart of the satellite dish rotation speed measurement method according to the implementation mode of the present application;

[0070] Fig.15 This is the seventh flow chart of the satellite dish rotation speed measurement method according to the implementation mode of the present application;

[0071] Fig.16 This is the eighth flow chart of the satellite dish rotation speed measurement method according to the implementation mode of the present application;

[0072] Fig.17 This is the ninth flow chart of the satellite dish rotation speed measurement method according to the embodiment of the present application;

[0073] Fig.18 This is the tenth flow chart of the satellite dish rotation speed measurement method according to the implementation mode of the present application.

[0074] Wherein, the accompanying drawings are marked as follows:

[0075] 1. Mother disk; 11. Rotating device; 12. Central axis of mother disk; 2. Satellite disk; 21. Central axis of satellite disk; 31. Distance sensor; 32. Photoelectric sensor; 33. Measuring point; 4. Wafer; 41. Upper surface of wafer; 42. Positioning notch; 5. Controller; 14. Observation channel; 15. Observation window; 16. Angle sensor; 23. 1st satellite disk; 24. 2nd satellite disk; 25. 3rd satellite disk; 26. 4th satellite disk; 27. 5th satellite disk; 28. 6th satellite disk; 62. Robot; 61. Wafer transfer chamber; 63. Loading and unloading chamber; 64. Wafer carrier storage chamber; 65. Wafer storage chamber; 66. Cooling chamber; 67. Wafer edge-finding chamber; 68. Gate. DETAILED DESCRIPTION

[0076] In order to better understand the technical content of the present invention, specific embodiments are described below in conjunction with the accompanying drawings.

[0077] Various aspects of the present invention are described in this disclosure with reference to the accompanying drawings, in which many illustrative embodiments are shown. The embodiments of the present disclosure are not necessarily intended to include all aspects of the present invention. It should be understood that the various concepts and embodiments introduced above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed by the present invention are not limited to any implementation. In addition, some aspects disclosed by the present invention can be used alone or in any appropriate combination with other aspects disclosed by the present invention.

[0078] It should be noted that when an element is referred to as being "connected to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0079] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. The meaning of "plurality" is one or more, unless otherwise clearly and specifically defined.

[0080] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0081] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0082] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment," "in some embodiments," or "in some of these embodiments" appear in various places throughout the specification, not all references are to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0083] The "single-chip satellite disk 2" in this application means that each satellite disk 2 only holds one wafer 4, and the "multiple-chip satellite disks 2" means that each satellite disk 2 holds at least two wafers 4, such as 2, 3, 4, etc. One or more satellite disks 2 can be set on the mother disk 1, and all satellite disks 2 can rotate around the central axis of the mother disk 1. It can be understood that the mother disk 1 can be selected as a planetary mother disk 1. In the wafer processing process, the satellite disk 2 rotates around the central axis of the mother disk 1, and each satellite disk 2 rotates around its own central axis (satellite disk central axis 21) under the action of the fluid. It should be noted that the rotation speed of the mother disk 1 is usually low, for example, 10-30rpm, while the rotation speed of the satellite disk 2 is usually much greater than that of the mother disk 1. For example, the rotation speed of the satellite disk 2 is usually 300rpm-1000rpm. Therefore, when calculating the rotation speed of the satellite disk 2, the rotation speed of the mother disk 1 has a very small effect on it. In addition, the rotation speed of the mother disk 1 is usually fixed in the wafer processing process. When calculating the rotation speed of the satellite disk 2, the effect of the rotation speed of the mother disk 1 is ignored to obtain an approximate value, which will not affect the repeatability and consistency of the wafer 4 processing process.

[0084] See also Figure 1 In one embodiment of the present invention, a method for measuring the rotation speed of a satellite disk 2 of a multi-plate planetary MOCVD device is provided. The method specifically includes steps S100 to S600:

[0085] Step S100: obtaining the rotation angle of the master disk 1 relative to the initial position;

[0086] Please refer to Figure 2 , Figure 3, a multi-wafer planetary semiconductor epitaxial growth device, or a multi-wafer planetary MOCVD device includes a reaction chamber (not shown) and a processing chamber (not shown), the processing chamber includes a loading and unloading chamber 63, a wafer carrier storage chamber 64, a wafer storage chamber 65, a cooling chamber 66, a wafer edge-finding chamber 67, and a wafer transfer chamber 61. The mother disc 1 is placed in the reaction chamber of the thin film growth process. The reaction chamber and the processing chamber are each a closed space, which can be connected to each other by opening a gate 68, and closed by closing the gate 68. A robot 62 is provided in the transfer chamber, and the robot 62 can move the wafer 4 and / or the wafer carrier between the reaction chamber and the processing chamber, and / or move inside the processing chamber. There are multiple satellite disks 2 evenly placed along the circumference on the mother disk 1. When the wafer 4 needs to be taken or placed, the mother disk 1 is rotated so that the satellite disk 2 carrying the specified wafer 4 that needs to be taken or placed is rotated to the position of the gate 68, the gate 68 is opened, the wafer 4 is taken out by the robot 62 or the wafer 4 is placed on the satellite disk 2 by the robot 62, and then the gate 68 is closed. The placement positions of all satellite disks 2 are preset. The size of the central angle of each satellite disk 2 on the mother disk 1 and the spacing between the satellite disks 2 are all known. For example, the mother disk 1 is provided with 6 satellite disks 2 evenly distributed along the circumference in the counterclockwise direction, which are the first satellite disk 23, the second satellite disk 24, the third satellite disk 25, the fourth satellite disk 26, the fifth satellite disk 27, and the sixth satellite disk 28.

[0087] In order to clearly understand the status of each satellite disk 2 and its wafer 4, the order of taking and placing the wafer 4 is generally fixed. The robot 62 will take and place the wafer 4 in a fixed order. For example, the mother disk 1 is rotated in the first direction so that the first satellite disk 23 is located at the gate 68, and the wafer 4 on the first satellite disk 23 is first placed, and then the mother disk 1 is rotated in the first direction so that the second satellite disk 24 is located at the gate 68, and then the wafer 4 on the second satellite disk 24 is placed, and so on, the wafers 4 on all satellite disks 2 are placed. The initial position of the mother disk 1 generally refers to the position of the first satellite disk 23 at the gate 68. The first direction can refer to the clockwise direction or the counterclockwise direction.

[0088] See also Figure 2, the master disk 1 is provided with an angle sensor 16. In some embodiments, the angle sensor 16 is used to obtain the rotation angle of the master disk 1 relative to the initial position. In other embodiments, the angle sensor 16 is also used to obtain the absolute angle. In some implementations, the angle sensor 16 can be a combination of a motor encoder and a motor driver. After the motor encoder detects the rotation angle, the motor driver sends the rotation angle to the controller 5 in real time. In this embodiment, the angle sensor 16 can be arranged on the rotation center axis of the master disk 1, for example, on the shaft of a rotating device that can drive the master disk 1 to rotate. It can be understood that the angle sensor 16 can also be of other types, and is not limited.

[0089] In one possible implementation, see Figure 4 Before step S100: obtaining the rotation angle of the mother disk 1 relative to the initial position, the following steps are also included:

[0090] Step S101: rotating the mother disk 1 to the initial position, at which time the first satellite disk 23 is located under the distance measuring sensor 31;

[0091] Specifically, the controller 5 controls the rotating device 11 to drive the mother disk 1 to rotate to the initial position, and the ranging sensor 31 is arranged above the first satellite disk 23 when the mother disk 1 is in the initial position. At this time, the first satellite disk 23 is under the ranging sensor 31. It should be noted that being under the ranging sensor means that the measuring point 33 of the ranging sensor 31 or the vertical projection of the ranging sensor 31 falls on the first satellite disk 23, but the specific position of the first satellite disk 23 is not limited.

[0092] Step S102: According to the pre-stored number n of the satellite disks 2 and the pre-stored formula: identify the angle θ m =(360° / n)×m to obtain n identification angles, where n and m are natural numbers, 1≤m≤n.

[0093] Specifically, the controller pre-stores the number n of satellite dishes 2 and the pre-stored formula: identification angle θ m =(360° / n)×m, where n and m are natural numbers, 1≤m≤n, and n recognition angles are obtained by calculation, namely θ1, θ2, θ3, ... θ n It should be noted that the identification angle is used to determine how much each satellite dish 2 needs to rotate to be under the ranging sensor. For example, when the rotation angle of the mother dish 1 is θ1, the second satellite dish 24 rotates to under the ranging sensor 31. When the rotation angle of the mother dish 1 is θn, the first satellite dish 23 rotates to under the ranging sensor 31.

[0094] Step S103: Store the obtained n identification angles and the identity information of the n satellite dishes 2 in a one-to-one correspondence to obtain a corresponding relationship between the identification angles and the identity information of the satellite dishes 2.

[0095] Specifically, the controller 5 obtains the n recognition angles, namely θ1, θ2, θ3, ... θ n , when 2≤m≤n, the identity information of the m-th satellite dish 2 is stored corresponding to the m-1th identification angle, and when m=1, the identity information of the first satellite dish 23 is stored corresponding to the nth identification information. For example, when n=6, the identity information of the second satellite dish 24 is stored corresponding to the first identification angle θ1, the identity information of the third satellite dish 25 is stored corresponding to the second identification angle θ2, ... the identity information of the sixth satellite dish 28 is stored corresponding to the fifth identification angle θ5, and the identity information of the first satellite dish 23 is stored corresponding to the sixth identification angle θ6.

[0096] In a possible implementation, after step S103, the method further includes:

[0097] Step S104: rotating the master disc 1 according to the identification angle;

[0098] Specifically, the controller 5 controls the rotating device 11 to drive the master disk 1 to rotate to the identification angle, for example, 60°.

[0099] Step S105: After the master disk 1 is rotated to the recognition angle, it is detected whether the wafer 4 on the satellite disk 2 can be taken out. If it cannot be taken out, the master disk 1 is rotated to make corrections so that the wafer 4 can be taken out and a corrected recognition angle is obtained, and the corrected recognition angle is used as the obtained recognition angle;

[0100] It should be noted that the detection of whether the wafer 4 on the satellite disk 2 can be taken out refers to whether the robot 62 can take the satellite disk 2 from the initial position of the mother disk 1 in the reaction chamber after the gate 68 is opened. In some cases, the satellite disk 2 cannot be successfully taken out due to the angle deviation. At this time, the mother disk 1 needs to be rotated for adjustment. In some embodiments, it can be adjusted according to a preset angle, and in other embodiments, it can be adjusted by a random angle. For example, when the recognition angle is 60°, the preset angle is 1° clockwise rotation to successfully take out the wafer 4, and the corrected recognition angle is 61°.

[0101] Step S106: Repeat the above steps S101-S105 until the mother disk 1 rotates one circle and all satellite disks 2 have been tested to see whether the wafer 4 on the satellite disk 2 can be taken out.

[0102] Specifically, the mother disk 1 is rotated to the identification angle in sequence, and each satellite disk 2 is tested to see if it can be taken out. If it cannot be taken out, it is corrected and the corrected identification angle is obtained. After one rotation, all satellite disks 2 are tested once, so that the equipment will not make an error of being unable to perform process processing.

[0103] In one possible implementation, see Figure 5 Before step S100: obtaining the rotation angle of the mother disk 1 relative to the initial position, the following steps are also included:

[0104] Step S201: rotating the mother disk 1 to an initial position, at which time the first satellite disk 23 is not under the ranging sensor 31;

[0105] It can be understood that when the mother disk 1 is located at the initial position, although the first satellite disk 23 is not arranged under the ranging sensor, the ranging sensor 31 is also arranged on other satellite disks 2 except the first satellite disk 23, such as the second satellite disk 24 or the third satellite disk 25.

[0106] Step S202: setting any radial direction of the master disc 1 at the initial position to 0°;

[0107] In one embodiment, the angle sensor 16 sets any radial direction of the master disk 1 to 0°, such as the direction of the line connecting the center of the master disk 1 and the center of the first satellite disk 23, or the direction of the line connecting the center of the master disk 1 and the center of the second satellite disk 24, etc. It should be noted that the 0° direction will no longer change relative to the master disk 1 after being set. For example, after the master disk 1 rotates 60° clockwise, the 0° direction is still the original direction of the line connecting the center of the master disk 1 and the center of the first satellite disk 23, and the angle between the direction of the line connecting the center of the master disk 1 and the center of the first satellite disk 2 after rotation and the initial position is the rotation angle. The angle sensor 16 can detect the rotation angle of the master disk 1 relative to the initial position in real time, and the rotation angle can be 0-360°, and the detected rotation angle is sent to the controller 5 in real time.

[0108] Step S203: obtaining the corresponding angle α of the satellite dish 2 under the ranging sensor 31;

[0109] In one embodiment, when in the initial position, there is also a satellite dish 2 under the ranging sensor, and the angle sensor 16 measures the corresponding angle α of the satellite dish 2 under the ranging sensor 31 based on 0°. It should be noted that the corresponding angle of the satellite dish 2 under the ranging sensor 31 refers to the angle between the center of the satellite dish 2 and the center of the mother dish 1 and the 0° direction.

[0110] Step S204: obtaining an angle β between the center of the mother disk 1 and the center of the first satellite disk 23;

[0111] Step S205: According to the formula: when α≥β, γ=α-β, when α<β, γ=360°+α-β, obtain the rotation angle γ when the first satellite dish 23 rotates to under the ranging sensor, and γ is also used as one of the identification angles;

[0112] Step S206: According to the preset number n of the satellite dishes 2 and the formula: identification angle θ=γ+(360° / n)×(m-1), n ​​identification angles are obtained, and the obtained n identification angles are stored in a one-to-one correspondence with the identity information of the n satellite dishes 2 to obtain the corresponding relationship between the identification angles and the identity information of the satellite dishes 2, wherein n and m are natural numbers, 1≤m≤n.

[0113] It should be noted that when m=1, the identification angle γ corresponds to the identity information of the second satellite dish 24, when m=2, the identification angle γ corresponds to the identity information of the third satellite dish 25, and so on. When m=n, the identification angle γ corresponds to the identity information of the first satellite dish 23.

[0114] Step S200: matching the rotation angle with a pre-stored recognition angle;

[0115] Specifically, the controller 5 pre-stores the identification angle, and the identification angle is provided with multiple, for example, 6, respectively 60°, 120°, 180°, 240°, 300°, and 360°. The identification angle only needs to satisfy that the satellite disk 2 is exactly below the ranging sensor 31 at this identification angle. Being exactly below the ranging sensor 31 means that the measuring point 33 or the vertical projection of the ranging sensor falls on the satellite disk 2. When the satellite disk 2 is provided with a wafer 4, the measuring point 33 or the vertical projection of the ranging sensor 31 falls on the wafer 4, so that the ranging sensor 31 can detect the height information of the satellite disk 2 conveniently. It can be understood that being exactly below the ranging sensor 31 can be an angle range, and can be the angle when the measuring point 33 of the ranging sensor just falls on the satellite disk 2 as the mother disk 1 rotates, or can be the angle when the measuring point falls on any point on the satellite disk 2 as the mother disk 1 rotates. The controller 5 matches the received rotation angle with the pre-stored identification information.

[0116] Step S300: when the matching is successful, the identity information of the current satellite dish 2 under the ranging sensor is obtained according to the recognition angle and the pre-stored correspondence between the recognition angle and the identity information of the satellite dish 2;

[0117] The controller 5 also stores the correspondence between the identification angle and the identity information of the satellite dish 2. It should be noted that the identification angle is mainly related to the size, quantity and placement of the satellite dish 2, and is also related to the position of the measurement point at the initial position.

[0118] As an example, the mother disk 1 is provided with 6 satellite disks 2, and the recognition angle corresponds to the second satellite disk 24 when it is 60°, the recognition angle corresponds to the third satellite disk 25 when it is 120°, the recognition angle corresponds to the fourth satellite disk 26 when it is 180°, the recognition angle corresponds to the fifth satellite disk 27 when it is 240°, the recognition angle corresponds to the sixth satellite disk 28 when it is 300°, and the recognition angle corresponds to the first satellite disk 23 when it is 360°. When the rotation angle reaches the recognition angle, specifically, the controller 5 matches the received rotation angle with the pre-stored recognition angle, and when the match is successful, it means that the rotation angle reaches the recognition angle. The controller obtains the identity information of the current satellite disk 2 under the ranging sensor based on the recognition angle and the pre-stored correspondence between the recognition angle and the identity information of the satellite disk 2; for example, when the mother disk 1 rotates 60°, the controller matches the received rotation angle of 60° with the recognition angle. If the recognition angle is 60°, the match is successful. At this time, the correspondence between the recognition angle and the identity information of the satellite disk 2 is queried again, and it can be obtained that 60° corresponds to the second satellite disk 24. The identity information of the current satellite disk 2 under the ranging sensor is the second satellite disk 24.

[0119] Step S400: Acquire the current height information of the satellite dish 2 under the ranging sensor;

[0120] As an example, during the rotation of the master disk 1 with the satellite disk 2, the ranging sensor 31 measures the height information in real time. It can be understood that when in the preset wafer 4 processing process, as the master disk 1 rotates, the ranging sensor 31 measures and obtains two kinds of height information, one is the height information of the wafer 4, and the other is the height information of the upper surface of the master disk 1, and these two kinds of information appear alternately.

[0121] In a possible implementation, the step of obtaining the height information of the current satellite dish 2 under the ranging sensor also includes the following steps:

[0122] When in the preset wafer 4 processing process, height information is obtained when the mother disk 1 rotates and the satellite disk 2 floats and rotates. The height information includes the floating height of the satellite disk 2 and / or the wafer 4, or the vertical distance between the upper surface 41 of the wafer and the ranging sensor 31 after the satellite disk 2 floats.

[0123] As an implementation, see Figure 6 When in a preset wafer processing process, the step of obtaining the current height information of the satellite disk 2 under the ranging sensor while the mother disk 1 rotates and the satellite disk 2 floats and rotates includes:

[0124] Step S301, the satellite disk 2 drives the wafer 4 to float and rotate together;

[0125] In some embodiments, see Figure 4 , the satellite disk 2 rotation speed measurement system includes a fluid delivery system (not shown), which can control the fluid to be selectively delivered to the gas groove (not shown) of the mother disk 1. In some embodiments, the fluid delivery system includes one or more fluid sources, such as inert gases such as nitrogen, hydrogen, argon, and a fluid control device for controlling the delivery of the fluid source. The fluid control device controls the flow rate, speed and / or pressure of the fluid delivered to the gas groove according to the instructions issued by the controller 5. In some embodiments, the fluid control device is a conventional flow controller (MFC, Mass Flow Controller), which is connected to the controller 5. In another embodiment, the fluid control device is a fixed orifice to deliver a predetermined flow of fluid at a known pressure.

[0126] The satellite disk 2 provided in the embodiment of the present invention is arranged opposite to the air grooves, and can use the fluid introduced into the three or more air grooves of the mother disk 1 to float, support, position and / or rotate the satellite disk 2. In some embodiments, the back of the satellite disk 2 is provided with a flow channel for the flow of fluid. By controlling the fluid properties delivered from the three or more air grooves to the surface of the satellite disk 2, such as the air flow rate of the fluid from the three or more air grooves, the floating height of the satellite disk 2 can be changed. The floating, supporting, positioning and / or rotating satellite disk 2 is caused by the friction force and atomic kinetic energy transfer of the fluid flowing through the surface of the satellite disk 2. Under the action of the airflow, the satellite disk 2 drives the wafer 4 to float together and rotate around its own central axis.

[0127] Step S302 , obtaining height information, wherein the height information includes the floating height of the satellite disk 2 and / or the wafer 4 , or the vertical distance between the upper surface 41 of the wafer and the ranging sensor 31 after the satellite disk 2 floats.

[0128] Specifically, the vertical distance between the upper surface 41 of the wafer and the ranging sensor 31 after the satellite disk 2 floats is measured by the ranging sensor 31. The ranging sensor 31 measures multiple vertical distance values ​​in real time within a predetermined time. In some embodiments, the shortest vertical distance value is selected as the vertical distance from the upper surface 41 of the wafer to the ranging sensor 31, wherein the predetermined time can be selected as 1 second, 2 seconds or other time, and the multiple vertical distance values ​​can be selected as 1000-5000 vertical distance values. It is understandable that in other embodiments, a more accurate vertical distance from the upper surface 41 of the wafer to the ranging sensor 31 can be obtained by algorithmically processing the multiple vertical distance values. It is understandable that the surface heights of the areas where the satellite disk 2 and the areas where the satellite disk 2 are not set on the mother disk 1 are inconsistent, for example, the upper surface height of the satellite disk 2 is higher than the upper surface area of ​​the nearby mother disk 1. When the ranging sensor measures the height, the height changes periodically.

[0129] For further information, see Figure 2 , Figure 7 , the photoelectric sensor 32 and the distance sensor 31 can be fixedly installed just above the observation channel 14 of the upper cover (out) opposite to the mother disk 1, and an observation window 15 is provided between the observation channel 14 and the photoelectric sensor 32 and the distance sensor 31. The observation window 15 can be made of quartz material. On the one hand, the light beam can pass through the transparent quartz material, and on the other hand, the observation channel 14 is sealed through the observation window 15. When in the preset wafer processing process, when the mother disk 1 and the satellite disk 2 rotate, the distance sensor 31 measures multiple vertical distance values ​​in real time within a predetermined time, which presents two distance values ​​with periodic distribution, among which the shortest vertical distance value is the vertical distance H2 from the upper surface 41 of the wafer to the distance sensor 31, and the non-shortest vertical distance value is the vertical distance H1 from the upper surface of the mother disk 1 to the distance sensor 31. The predetermined time can be selected as 1 minute, 2 minutes or other time. The vertical distance H2 from the upper surface 41 of the same wafer to the distance measuring sensor 31 is measured at t0, and the vertical distance H1 from the upper surface of the master disc 1 between two wafers 4 to the distance measuring sensor 31 is measured at T0. It can be understood that in other embodiments, a more accurate vertical distance from the upper surface 41 of the wafer to the distance measuring sensor 31 can be obtained by algorithmically processing multiple vertical distance values.

[0130] Please note that Figure 8 , the floating height Δh of the satellite disk 2 and / or wafer 4 includes the vertical distance from the lower surface of the satellite disk 2 to the upper surface of the mother disk 1, or the vertical distance from the upper surface 41 of the wafer after floating to the upper surface 41 of the wafer before floating. The distance measuring sensor 31 includes an ultrasonic distance measuring sensor 31, a laser distance measuring sensor 31, an infrared distance measuring sensor 31, etc., but is not limited. The distance measuring sensor 31 is arranged directly above the satellite disk 2, and it can measure the height information of the satellite disk 2.

[0131] One possible implementation is to see Figure 8 , Fig. 9 The step of measuring the floating height of the satellite disk 2 by the ranging sensor 31 includes first measuring the distance h1 between the upper surface 41 of the wafer and the ranging sensor 31 when the satellite disk 2 is not floating. After the controller 5 controls the predetermined amount of fluid to be introduced into the air groove of the mother disk 1, the satellite disk 2 floats to a certain height and rotates. At this time, the distance h2 from the upper surface 41 of the wafer to the ranging sensor 31 is measured. The ranging sensor 31 transmits both h1 and h2 to the controller 5. The controller 5 calculates the floating height Δh according to the formula floating height Δh=h1-h2. The floating height is the vertical height of the satellite disk 2 from the mother disk 1 and is stored in the controller 5. In some embodiments, the floating height Δh is calculated autonomously by the ranging sensor 31 and transmitted to the controller 5. The calculation formula used by the ranging sensor 31 is still the formula: floating height Δh=h1-h2.

[0132] One possible implementation is to see Figure 8 , Fig. 9 First, the distance h1 from the upper surface 41 of the wafer to the ranging sensor 31 to the mother disk 1 is measured when the satellite disk 2 has not floated. The controller 5 controls the fluid delivery system to introduce a predetermined flow of gas into the gas groove of the mother disk 1. The satellite disk 2 floats to a certain height and rotates. At this time, the distance h2 from the upper surface of the satellite disk 2 to the ranging sensor 31 is measured. The ranging sensor 31 transmits both h1 and h2 to the controller 5. At this time, it is not necessary to calculate the difference between the two, but h1 and h2 are directly stored by the controller 5.

[0133] In some embodiments, see Figure 8 , Fig. 9 , the satellite disk 2 is suspended on the mother disk 1 by the airflow, and a gap is generated between the mother disk 1 and the satellite disk 2, and the gap is the floating height. In some embodiments, the gap "L" caused by the airflow is 100 micrometers (μm) to 2000μm, optionally, 200μm to 500μm. In some embodiments, the floating height of the satellite disk 2 is 500μm. In some embodiments, the floating height of the satellite disk 2 is 800μm.

[0134] In some embodiments, the controller 5 can adjust the gap "L", that is, adjust the floating height, by adjusting the flow rate delivered by one or more air slots.

[0135] Step S500: matching the acquired height information of the satellite dish 2 with the pre-stored height information, and when the match is successful, obtaining the current rotation speed of the satellite dish 2 according to the acquired height information of the satellite dish 2 and the pre-stored correspondence between the height information of the satellite dish 2 and the rotation speed;

[0136] See also Fig.10 In a possible implementation, the method for obtaining the pre-stored correspondence between the altitude information and the rotation speed of the satellite dish 2 includes the following steps S110-S150:

[0137] Step S110: when the preset wafer processing process is not in progress, when the mother disk 1 is not rotating and the satellite disk 2 is not floating, obtaining a vertical distance between the upper surface 41 of the wafer placed on the satellite disk 2 and the distance measuring sensor 31;

[0138] It should be noted that the preset wafer processing process includes a thin film deposition process, which is particularly suitable for a wafer 4 processing process using a tray. Further, including a chemical vapor deposition (CVD) process, a metal organic chemical vapor deposition (MOCVD) process, an atomic layer deposition (ALD) process, etc., the wafer 4 that can be processed by the process, equipment and system includes 200 mm (mm), 300 mm or larger single crystal silicon (Si), multi-crystalline silicon, polycrystalline silicon, germanium (Ge), silicon carbide (SiC), glass, gallium arsenide (GaAs), but not limited to this. Optionally, the wafer 4 is circular, but it can also be any desired shape. The thickness of the wafer 4 can be selected to be 200μm-500μm, for example 350μm. It should be noted that not being in the preset wafer processing process means that the satellite disk 2 is not ventilated through the mother disk 1 to float and rotate, and / or the mother disk 1 rotates. The preset wafer processing process refers to the satellite disk 2 floating and rotating through the ventilation of the master disk 1, and / or the master disk 1 rotating. It can be understood that the preset wafer processing process can be operated according to the process, such as introducing reaction gas, heating the master disk 1, etc.

[0139] See also Figure 2 Because multiple satellite disks 2 can be placed on the master disk 1, although the air flow rate passing into the satellite disk 2 is usually the same, each satellite disk 2 has some differences in structure during manufacturing, and is often worn during the thin film growth process, so the rotation speed of the satellite disk 2 on the same master disk 1 will be different. As the use time increases, the rotation speed difference of different satellite disks 2 on the same master disk 1 will become more obvious. Therefore, it is necessary to detect the rotation speed of each satellite disk 2 separately. When the master disk 1 and the satellite disk 2 are both in a stationary state, a distance sensor 31 is set at a certain height above the master disk 1. In one embodiment, the distance sensor 31 is set above the first satellite disk 23 when the master disk 1 is in the initial position. Further, the measurement point of the distance sensor 31 is set on the rotation path of the satellite disk 2 along the rotation center axis of the master disk 1. Further, the distance sensor 31 can be set above any satellite disk 2 when the master disk 1 is in the initial position, and the height can be selected to be 80-300mm. At this time, the distance sensor 31 can obtain the vertical distance between the upper surface 41 of the wafer placed on the satellite disk 2 and the distance sensor 31. The distance measuring sensor 31 is connected to the controller 5 and sends the collected information such as distance and height difference to the controller 5 .

[0140] As an implementation method, when the preset wafer processing process is not in progress, when the mother disk 1 is not rotating and the satellite disk 2 is not floating, after the step of obtaining the vertical distance between the upper surface 41 of the wafer placed on the satellite disk 2 and the distance measuring sensor 31, the method further includes:

[0141] Step S120: introducing a predetermined air flow rate to make the satellite dish 2 carrying the wafer 4 float and rotate, and obtaining a vertical distance h2 between the upper surface 41 of the wafer and the distance measuring sensor 31;

[0142] It should be noted that the step of introducing a predetermined air flow rate to make the satellite disk 2 carrying the wafer 4 float and rotate is the same as step S301, which will not be repeated. At this time, the rotation speed of the master disk 1 is set to 0, that is, the master disk 1 is completely in a stationary state. The step of obtaining the vertical distance h2 between the upper surface 41 of the wafer and the distance measuring sensor 31 is basically the same as step S302, which will not be repeated.

[0143] Step S130: Calculate the floating height of the satellite dish 2 and / or the wafer 4 according to the formula: floating height Δh = h1-h2, wherein h1 is the vertical distance between the upper surface 41 of the wafer placed on the satellite dish 2 and the ranging sensor 31 when the satellite dish 2 is not floating, and h2 is the vertical distance between the upper surface 41 of the wafer and the ranging sensor 31 obtained after a predetermined airflow is introduced to float and rotate the satellite dish 2 carrying the wafer 4;

[0144] It should be noted that the step of calculating the floating height of the satellite disk 2 and / or the wafer 4 according to the formula: floating height Δh = h1-h2 is basically the same as step S302, and will not be repeated. The calculated floating height is associated with the rotation speed of the satellite disk 2 and stored to obtain the mapping relationship. The floating height Δh calculated in this step is more easily associated with the air flow, so that it is convenient to change the floating height according to the adjustment of the air flow.

[0145] It should be noted that steps S120 and S130 can also be combined into one step, that is, the distance sensor 31 measures h2, and the distance sensor 31 can directly calculate the floating height according to the formula Δh=h1-h2. Steps S120 and S130 are distinguished and explained here for the purpose of more clearly explaining the method flow.

[0146] Step S140: obtaining the rotation speed of the satellite disk 2;

[0147] It should be noted that the rotation speed of the satellite dish 2 can be obtained by various measuring devices in combination with corresponding measuring methods, and is not limited. There are some existing measuring methods for measuring the rotation speed of a single rotating object, which will not be described in detail. The measuring device is used to measure the rotation speed of the satellite dish 2, such as an angular velocity sensor, a laser pulse sensor, etc.

[0148] The photoelectric sensor 32 includes a highly sensitive photoelectric detector or a displacement detector with intensity measurement. By analyzing the received signal intensity, it can distinguish whether the laser is irradiated on the wafer 4 or the satellite dish 2. A possible implementation of the "processed" is to obtain an average value based on the time intervals of several adjacent low-level or high-level pulses.

[0149] In one embodiment, see Figure 2 , Fig.11 , Fig.12 , Fig.13 The present application is a multi-wafer planetary MOCVD device, the photoelectric sensor 32 is arranged directly above the satellite disk 2 and at a certain height, for example, 50-300mm, and the measuring point 33 is arranged at the edge of the surface of one of the wafers 4 when the master disk 1 is in the initial position and the master disk 1 and the satellite disk 2 are both stationary. It should be noted that when the satellite disk 2 rotates, the route drawn by the measuring point 33 on the satellite disk 2 or the upper surface 41 of the wafer is the measuring path. The light beam irradiates the upper surface 41 of the wafer to obtain a pulse signal, and irradiates the master disk 1 to obtain another pulse signal, so that different pulse signals can be obtained when passing through the measuring point 33. The pulse signal of the light beam irradiating the upper surface of the wafer 4 and the master disk 1 is obtained by the photoelectric sensor 32, and the controller 5 collects the pulse signal and processes the time of different pulse signals, thereby obtaining the time T1 when the light beam irradiates the upper surface 41 of the wafer when the satellite disk 2 rotates and the time t1 when the light beam irradiates the satellite disk 2.

[0150] In one embodiment, see Fig.14 , the step of obtaining the rotation speed of the satellite disk 2 includes:

[0151] As an implementation method, the step of obtaining the rotation speed of the satellite disk 2 includes:

[0152] Step S401: obtaining the time when the light beam is irradiated on the positioning notch 42 of the wafer 4;

[0153] It should be noted that the outer diameter edge of the wafer 4 is usually uneven. Fig.12 A wafer 4 is depicted with a locating notch 42 or other feature. The locating notch 42 may be a semicircle with a diameter of about 1.5 mm to 2 mm. These locating notches 42 may also have other shapes, such as a triangular "V" shape or a square. Alternatively, a portion of its circumference may have a flat edge, such as a locating edge. The rotation speed of the wafer may be determined by monitoring the non-uniform feature, such as the locating notch 42.

[0154] Any point on the edge of the wafer 4 near the outer diameter of the wafer 4 is set as the measuring point 33, and the positioning notch 42 can pass through the measuring point 33 of the photoelectric sensor 32 when the wafer 4 rotates. Since the wafer 4 reflects the laser, and the satellite disk 2 is a graphite material or a transparent material that hardly reflects the laser, a pulse signal can be obtained when the light beam is irradiated on the upper surface 41 of the wafer, and another pulse signal is obtained when the light beam is irradiated on the positioning notch 42 and the satellite disk 2, so that different pulse signals can be obtained when the wafer 4 or the satellite disk 2 passes the measuring point 33. The pulse signal of the light beam irradiating the positioning notch 42 of the wafer 4 and the upper surface 41 of the wafer is obtained by the photoelectric sensor 32, and the controller 5 collects the pulse signal and obtains the time of different pulse signals through processing.

[0155] Furthermore, the photoelectric sensor 32 includes a highly sensitive photoelectric detector or a displacement detector with intensity measurement, and by analyzing the received signal intensity, it can be distinguished whether the laser is irradiated on the wafer 4 or the satellite dish 2. A possible implementation of the "processed" is to obtain an average value based on the time intervals of several adjacent low-level or high-level pulses.

[0156] For example, see Fig.12 , Fig.13 When the satellite disk 2 drives the wafer 4 to rotate, after being processed by the controller 5, the time when the light beam irradiates the positioning notch 42 for each rotation of the wafer 4 is t, and the time when the light beam irradiates the upper surface 41 of the wafer is T. In some embodiments, the time interval of the wafer 4 rotating multiple times is sampled, and then T and t in one cycle are randomly selected from multiple time intervals (cycles). Optionally, multiple adjacent high-level time intervals can be selected to calculate the average value to obtain T, or multiple low-level pulse time intervals can be selected to calculate the average value to obtain t.

[0157] Step S402: Calculate the rotation speed V of the satellite disk 2 according to the formula: rotation speed V = α / (360°*t), where α is the known central angle of the wafer 4 positioning notch 42 on the wafer 4, and t is the time that the acquired light beam is irradiated on the wafer 4 positioning notch 42.

[0158] Step S150: The floating height and the rotation speed of the satellite disk 2 are associated and stored to obtain the mapping relationship.

[0159] Specifically, step S110 obtains the vertical distance h1 between the upper surface 41 of the wafer placed on the satellite disk 2 and the ranging sensor 31 when the satellite disk 2 does not float up, and the floating height Δh calculated in step S130, and step S120 introduces a predetermined airflow to make the satellite disk 2 carrying the wafer 4 float and rotate, and obtains the vertical distance h2 between the upper surface 41 of the wafer and the ranging sensor 31, and the rotation speed of the satellite disk 2 obtained in step S140 are all associated and stored in the controller 5, wherein when the satellite disk 2 does not float up, the vertical distance h1 between the upper surface 41 of the wafer placed on the satellite disk 2 and the ranging sensor 31 and the floating height Δh are both used as the height information, and the pre-stored height information refers to the height information that has been pre-stored in the controller 5 before the preset wafer processing process.

[0160] As an example, the mapping relationship is h1 = 10.5 mm, the satellite disk 2 rotation speed is 0; and the floating height Δh = 500 μm, the satellite disk 2 rotation speed is 200 rpm, where h1 = 10.5 mm and the floating height Δh = 500 μm are height information.

[0161] Through the above steps, the height information can be obtained when the mother disk 1 rotates and the satellite disk 2 floats and rotates during the preset wafer processing process, and the rotation speed of the satellite disk 2 can be directly obtained through the mapping relationship, thereby avoiding the conventional complex calculation of the rotation speed of the satellite disk 2 in the compound motion of the mother disk 1 rotating and the satellite disk 2 rotating, simplifying the method and expanding the scope of application. Both a single satellite disk 2 and multiple satellite disks 2 can be used.

[0162] In one embodiment, see Fig.15 , after step S150, further comprising:

[0163] Step S501: changing the amount of airflow introduced so as to change the floating height of the satellite dish 2;

[0164] Specifically, the controller 5 controls the fluid control device to change the flow rate flowing into the gas groove of the mother disk 1, thereby changing the floating height of the satellite disk 2. For example, the gas flow rate is increased / decreased by 0.1 sccm each time. For example, the satellite disk 2 has a mass of 300 grams and a diameter of 150 mm. The original gas flow rate is 0.1 sccm, and the floating height is 100 μm. The gas flow rate is changed to 0.2 sccm, and the floating height is 200 μm.

[0165] Step S502: obtaining the changed floating height of the satellite disk 2 and / or the wafer 4;

[0166] Step S503: obtaining the rotation speed of the satellite disk 2;

[0167] Step S504: The changed floating height of the satellite disk 2 and / or the wafer 4 is associated and stored with the rotation speed of the satellite disk 2, so as to obtain the updated mapping relationship.

[0168] Step S505: repeating steps S501 to S504 until a preset condition is met and the process stops. The preset condition includes obtaining a mapping relationship of a preset amount, or the floating height exceeds or is equal to a preset value.

[0169] It can be understood that the mapping relationship of the preset amount means, for example, if the preset amount is 5, then 5 mapping relationships are obtained, which satisfies the preset condition. Or the floating height exceeds or is equal to the preset value, which means, for example, the upper limit of the floating height is 800μm. At this time, by introducing a sufficiently large flow of airflow, the floating height of the satellite disk 2 and / or the wafer 4 is 900μm, and steps S501 to S504 are no longer repeated. It can be understood that the preset amount can be selected as 2-2000. When the preset amount is larger, the more rotation speeds are measured, and the more it can meet the requirements.

[0170] As an example, the mapping relationship is:

[0171] The floating height of the satellite disk 2 and / or the wafer 4 is 500 μm, and the rotation speed of the satellite disk 2 is 200 rpm;

[0172] The floating height of the satellite disk 2 and / or the wafer 4 is 600 μm, and the rotation speed of the satellite disk 2 is 300 rpm;

[0173] The floating height of the satellite disk 2 and / or the wafer 4 is 700 μm, and the rotation speed of the satellite disk 2 is 400 rpm;

[0174] Assuming that the preset number of mapping relationships is 5, the above example meets the preset condition.

[0175] It is understandable that, in some embodiments, the step S504 may be replaced by associating and storing the vertical distance between the upper surface 41 of the wafer after the satellite dish 2 is floated and the ranging sensor 31 to obtain the updated mapping relationship.

[0176] In some possible implementations, step S505 further includes:

[0177] Step S506: Rotate the mother disk 1 according to the identification angle so that the next satellite disk 2 is under the ranging sensor;

[0178] Step S507: Repeat steps S505-S506 until the mapping relationship of each satellite disk 2 is obtained.

[0179] Specifically, the step of rotating the mother disk 1 according to the identification angle so that the next satellite disk 2 is under the ranging sensor refers to rotating the mother disk 1 to the identification angle so that the next satellite disk 2 is under the ranging sensor;

[0180] In this way, each satellite disk 2 can obtain an exclusive mapping relationship.

[0181] In one possible implementation, see Fig.16 Step S400: Match the acquired height information of the satellite dish 2 with the pre-stored height information. When the match is successful, the current rotation speed of the satellite dish 2 is obtained according to the acquired height information of the satellite dish 2 and the pre-stored correspondence between the height information of the satellite dish 2 and the rotation speed. The method further includes the following steps:

[0182] Step S601: matching the height information with pre-stored height information;

[0183] Specifically, the controller 5 matches the acquired height information with the pre-stored height information.

[0184] For example, the mapping relationship is that the floating height of the satellite disk 2 and / or the wafer 4 is 500 μm, and the rotation speed of the satellite disk 2 is 200 rpm; the floating height of the satellite disk 2 and / or the wafer 4 is 600 μm, and the rotation speed of the satellite disk 2 is 300 rpm; at this time, the height information obtained is that the floating height is 600 μm, and the pre-stored height information is that the floating height of the satellite disk 2 and / or the wafer 4 is 500 μm and 600 μm, then the height information is matched with 500 μm and 600 μm. At this time, it is easy to know that the match of 500 μm is unsuccessful, and the match of 600 μm is successful.

[0185] In one possible implementation, see Fig.17 , step S601 further includes:

[0186] Step S701: searching for a relationship corresponding to the current satellite disk 2 from all pre-stored relationships corresponding to the satellite disk 2 according to the identity information of the satellite disk 2, wherein the relationship corresponding to the satellite disk 2 includes a corresponding relationship between the height and the rotation speed of the satellite disk 2;

[0187] Step S702: Match the height information with the height information in the pre-stored relationship corresponding to the current satellite dish 2.

[0188] Step S602: When the match is successful, the rotation speed of the satellite disk 2 is determined according to a pre-stored mapping relationship, wherein the mapping relationship represents the relationship between the altitude information and the rotation speed of the satellite disk 2 .

[0189] Specifically, when the matching is successful, the controller 5 determines the rotation speed of the satellite dish 2 according to its pre-stored mapping relationship.

[0190] For example, in the above example, 600 μm is matched successfully. At this time, according to the pre-stored mapping relationship, the rotation speed of the satellite disk 2 is determined to be 300 rpm.

[0191] It is understandable that in some embodiments, the controller 5 can directly read the pre-stored height information from the pre-stored mapping relationship. In some other embodiments, the pre-stored height information and the pre-stored mapping relationship are stored separately, and the controller 5 first matches the height information with the pre-stored height information, and if the match is successful, then calls the mapping relationship matching the height information according to the pre-stored height information.

[0192] Step S600: When the master disk 1 and the satellite disks 2 continue to rotate, all the above steps S100-S500 are repeated until the rotation speeds of all the satellite disks 2 on the master disk 1 are obtained.

[0193] Specifically, this step is to measure the rotation speeds of all satellite disks 2 on the mother disk 1 .

[0194] See also Fig.18 , step S600 further includes the following steps:

[0195] Step S801: when the mother disk 1 rotates 0-360 degrees, each time the rotation speed of the satellite disk 2 is obtained, the rotation speed corresponding to the satellite disk 2 is stored in the controller 5;

[0196] That is to say, in this step, the rotation speed of each satellite disk 2 can be obtained once when the mother disk 1 rotates one circle.

[0197] Step S802: When the mother disk 1 rotates more than 360°, each time the rotation speed of the satellite disk 2 is obtained, the corresponding rotation speed of the satellite disk 2 stored in the controller 5 is updated.

[0198] Specifically, this step can continuously update the rotation speed of each satellite disk 2 during the continuous rotation when the mother disk 1 rotates more than one circle, so as to monitor the rotation speed of each satellite disk 2 at all times and make the measurement result more accurate and faster.

[0199] Figure 2 The satellite disk 2 rotation speed measurement system of a multi-chip planetary MOCVD device in one embodiment of the present application comprises:

[0200] A master disk 1 is a circular master disk 1, which is horizontally arranged, and satellite disks 2 are arranged along the circumference of the master disk 1. The satellite disks 2 are arranged in a circle, and one or more wafers 4 are arranged on the satellite disks 2; a rotating device 11 is arranged on the central axis 12 of the master disk, and the rotating device can drive the master disk 1 to rotate around the central axis 12 of the master disk 1. The rotating device is electrically connected to the controller 5, and can rotate at a predetermined speed, such as 10-30rpm, under the control of the controller 5.

[0201] The distance sensor 31 is used to obtain the vertical distance between the upper surface 41 of the wafer placed on the satellite disk 2 and the distance sensor 31 when the preset wafer processing process is not in progress, when the master disk 1 is not rotating and the satellite disk 2 is not floating; and is also used to obtain height information when the master disk 1 is rotating and the satellite disk 2 is floating and rotating in the preset process, the height information includes the floating height of the satellite disk 2 and / or the wafer 4, or the vertical distance between the upper surface 41 of the wafer after the satellite disk 2 is floating and the distance sensor 31. The distance sensor 31 is electrically connected to the controller 5, and the distance sensor 31 is used to transmit the detected height information to the controller 5.

[0202] The fluid delivery system is used to introduce a predetermined amount of gas to make the satellite dish 2 carrying the wafer 4 float and rotate.

[0203] The controller 5 is electrically connected to the ranging sensor 31, the rotating device, and the fluid delivery system, and is used to match the altitude information with the pre-stored altitude information; it is also used to determine the rotation speed of the satellite disk 2 according to a pre-stored mapping relationship when the match is successful, wherein the mapping relationship represents the relationship between the altitude information and the rotation speed of the satellite disk 2.

[0204] In one embodiment, a satellite dish 2 rotation speed measurement system includes:

[0205] A satellite disk 2 rotation speed measurement system for a multi-chip planetary MOCVD device, using the satellite disk 2 rotation speed measurement method for a multi-chip planetary MOCVD device in any of the above embodiments, comprising:

[0206] A master disc 1, wherein the master disc 1 can rotate around a rotation center axis of the master disc 1,

[0207] A plurality of satellite disks 2 are distributed in a circle on the mother disk 1 for carrying wafers 4. The mother disk 1 can carry the satellite disks 2 to revolve around the rotation center axis of the mother disk 1, and the satellite disks 2 can rotate around the rotation center axis of the satellite disk 2.

[0208] The rotating device 11 is disposed below the master disc 1 and can drive the master disc 1 to rotate.

[0209] The angle sensor 16 is used to obtain the rotation angle of the master disk 1 relative to the initial position and transmit it to the controller 5 .

[0210] The controller 5 is used to control the rotating device to drive the mother disk 1 to rotate, and is also used to match the rotation angle with the identification angle. When the match is successful, the identity information of the current satellite disk 2 under the ranging sensor is obtained according to the identification angle and the pre-stored correspondence between the identification angle and the identity information of the satellite disk 2.

[0211] The ranging sensor 31 is used to obtain the altitude information of the satellite dish 2 currently under the ranging sensor 31 .

[0212] Among them, the controller is also used to obtain the current rotation speed of the satellite disk 2 based on the height information of the satellite disk 2 and the pre-stored correspondence between the height information of the satellite disk 2 and the rotation speed; and is also used to obtain the rotation speed of each of the satellite disks 2 on the mother disk 1.

[0213] In some embodiments, the master disk 1 is made of graphite or other suitable materials, and the diameter can be selected to be 1000-2000 mm, and the satellite disk 2 is made of metal, ceramic, plastic, semiconductor or other materials. In some embodiments, the satellite disk 2 is made of graphite. In another embodiment, the satellite disk 2 is made of a ceramic material, such as quartz, sapphire, silicon carbide, aluminum oxide, zirconium oxide, aluminum nitride or boron nitride. In some embodiments, the satellite disk 2 has a mass of 100-1000 grams and a diameter of 100-300 mm.

[0214] The ranging sensor 31 is used to obtain the vertical distance h1 between the upper surface 41 of the wafer placed on the satellite disk 2 and the ranging sensor 31 when the satellite disk 2 is not floating when the mother disk 1 is in a non-rotating state when the preset wafer processing process is not in progress; it is also used to obtain the vertical distance h2 between the upper surface 41 of the wafer and the ranging sensor 31 when the mother disk 1 is rotating and the satellite disk 2 is floating and rotating when the preset wafer processing process is in progress; it is also used to calculate the floating height of the satellite disk 2 and / or the wafer 4 according to the formula: floating height Δh=h1-h2.

[0215] The fluid delivery system is used to introduce a predetermined amount of gas to make the satellite dish 2 carrying the wafer 4 float and rotate.

[0216] The photoelectric sensor 32 is used to obtain a pulse signal of the light beam irradiating the positioning notch 42 and / or the upper surface 41 of the wafer.

[0217] The controller 5 is electrically connected to the distance sensor 31, the photoelectric sensor 32, and the fluid delivery system, and is used to control the fluid delivery system to allow a predetermined amount of gas to be introduced so that the satellite disk 2 carrying the wafer 4 floats and rotates; it is also used to obtain the time when the light beam is irradiated on the positioning recess 42 and / or the upper surface 41 of the wafer when the satellite disk 2 rotates one circle according to the pulse signal; it is also used to control the distance sensor 31 to obtain height information; it is also electrically connected to the rotating device, and is used to control the mother disk 1 to rotate at a predetermined speed.

[0218] It is also used to store the floating height in association with the rotation speed of the satellite disk 2, so as to obtain the mapping relationship, wherein the mapping relationship represents the relationship between the height information and the rotation speed of the satellite disk 2.

[0219] It is also used to match the altitude information with pre-stored altitude information, the altitude information including the floating altitude; and is also used to determine the rotation speed of the satellite dish 2 according to the pre-stored mapping relationship when the match is successful.

[0220] In one embodiment, the satellite disk 2 rotation speed measurement system includes a mother disk 1 and a satellite disk 2 arranged along the circumference of the mother disk 1, the satellite disk 2 is arranged in a circle, and a wafer 4 is arranged on the satellite disk 2;

[0221] The photoelectric sensor 32 is used to obtain a pulse signal of the light beam irradiating the positioning notch 42 of the wafer 4;

[0222] The controller 5 is used to obtain the time when the light beam is irradiated on the positioning notch 42 of the wafer 4 according to the pulse signal of the light beam irradiating on the positioning notch 42 of the wafer 4, and is also used to store the formula: rotation speed V = Q / (360°*t), and according to the formula: rotation speed V = Q / (360°*t), the rotation speed V of the satellite disk 2 is calculated, wherein Q is the known central angle of the wafer 4 positioning notch 42 on the wafer 4, and t is the time when the light beam is irradiated on the positioning notch 42 of the wafer 4.

[0223] In one embodiment, the satellite disk 2 rotation speed measurement system includes a mother disk 1 and satellite disks 2 arranged circumferentially along the mother disk 1 , the satellite disks 2 are arranged in a circle, and at least two wafers 4 are provided on the satellite disk 2 .

[0224] The photoelectric sensor 32 is used to obtain the pulse signal of the light beam irradiating the upper surface 41 of the wafer or the satellite disk 2;

[0225] In one embodiment, the satellite disk 2 rotation speed measurement system also includes an alarm system, which is communicatively connected to the controller 5. The controller 5 has a preset standard threshold rotation speed of the satellite disk 2, such as 200rpm-300rpm. When the real-time rotation speed of the satellite disk 2 calculated by the satellite disk 2 rotation speed measurement system is less than or greater than the standard threshold rotation speed of the satellite disk 2, the satellite disk 2 rotation speed measurement system sends an alarm signal to the alarm system, and the alarm system issues an alarm prompt based on the received alarm signal.

[0226] The satellite dish 2 rotation speed measurement system also includes a display system (not shown) electrically connected to the controller, which can display the rotation speed information of each satellite dish 2 to the user.

[0227] The controller 5 is used to control various components that perform the wafer processing process. The controller 5 is generally used to assist in the control and automation of the entire processing chamber, and generally includes a central processing unit (CPU) (not shown), a memory (not shown), and support circuits (or I / O) (not shown). The CPU can be any type of computer processor that is used in an industrial setting to control various system functions, chamber processes and support hardware (such as sensors, robotic arms, motors, fluid sources, etc.), and monitor processes (such as satellite dish 2 temperature, power supply variables, chamber process time, I / O signals, etc.). The memory is connected to the CPU and can be one or more readily accessible memories, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or other local or remote digital storage. Software instructions and data can be encoded and stored in the memory to instruct the CPU. Support circuits are also connected to the CPU to support the processor in a conventional manner. Support circuits include cache memory, power supplies, clock circuits, input / output circuits, subsystems, etc. The program (or computer instructions) that the controller 5 can read determines the tasks performed on the wafer 4. Preferably, the program is software readable by the controller 5, which includes codes for monitoring related tasks, execution and control of wafer 4 movement, support, positioning and / or rotation, and various processing program tasks and chamber process method steps performed in the processing chamber. In some embodiments, the controller 5 uses a conventional PID control algorithm to control the fluid delivery to the gas tank to actively control the support, positioning and / or rotation of the wafer 4. In some embodiments, the controller 5 is a single chip microcomputer or a PLC.

[0228] Correspondingly, this embodiment also provides a computer device, including a processor and a memory, wherein the processor is suitable for implementing various instructions, and the memory is suitable for storing multiple instructions, wherein the instructions are suitable for being loaded by the processor and executing the satellite disk 2 rotation speed measurement method as described above.

[0229] Correspondingly, the present embodiment also provides a computer-readable storage medium, on which computer-executable instructions are stored, wherein when the computer-executable instructions are executed, the satellite dish 2 rotation speed measurement method as described above can be implemented.

[0230] The embodiment of the present application measures the floating height and rotation speed of the satellite disk 2 and / or wafer 4 when the mother disk 1 is not rotating, and establishes a mapping relationship. When in the wafer processing process, the floating height of the satellite disk 2 and / or wafer 4 is directly measured and the rotation speed of the satellite disk 2 can be obtained according to the pre-stored mapping relationship, which solves the problem that in the wafer processing process, the satellite disk 2 always revolves around the mother disk 1, making it difficult to measure the rotation speed of the satellite disk 2. The measurement of the rotation speed under the complex movement of the satellite disk 2 revolution and rotation in the wafer processing process is converted into the measurement of the floating height of the satellite disk 2 and / or wafer 4, which simplifies the measurement method and improves the measurement efficiency. At the same time, it also solves the problem that when using this method to measure the rotation speed of the satellite disk 2, only a representative value of all satellite disks 2 can be obtained, and the rotation speed of each satellite disk 2 cannot be quickly and accurately known.

[0231] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

[0232] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A method for measuring the satellite disk rotation speed of a multi-planetary MOCVD device, characterized in that: The steps include: Obtain the rotation angle of the master disk relative to the initial position; Matching the rotation angle with a pre-stored recognition angle; When the match is successful, the identity information of the current satellite dish under the ranging sensor is obtained according to the recognition angle and the pre-stored correspondence between the recognition angle and the identity information of the satellite dish; Acquire the altitude information of the current satellite dish under the ranging sensor; The acquired height information of the satellite dish is matched with the pre-stored height information of the satellite dish. When the match is successful, the current rotation speed of the satellite dish is obtained based on the acquired height information of the satellite dish and the correspondence between the pre-stored height information of the satellite dish and the rotation speed.

2. The method for measuring the satellite disk rotation speed of a multi-disc planetary MOCVD device according to claim 1, characterized in that: Before step S100: obtaining the rotation angle of the mother disk relative to the initial position, the following steps are also included: Step S101: Rotate the mother disk to the initial position, at which time the first satellite disk is under the ranging sensor; Step S102: Obtain n identification angles according to the pre-stored number n of satellite dishes and the pre-stored formula: identification angle θm=(360° / n)×m, where n and m are natural numbers, 1≤m≤n; Step S103: The obtained n identification angles and the identity information of the n satellite dishes are stored in a one-to-one correspondence to obtain a correspondence between the identification angles and the identity information of the satellite dishes.

3. The method for measuring the satellite disk rotation speed of a multi-disc planetary MOCVD device according to claim 2, characterized in that: In step S103, after the obtained n identification angles and the identity information of the n satellite dishes are stored in a one-to-one correspondence to obtain the corresponding relationship between the identification angles and the identity information of the satellite dishes, the following further includes: Step S104: rotating the master disc according to the identification angle; Step S105: After the mother disk is rotated to the recognition angle, it is detected whether the wafer on the satellite disk can be taken out. If it cannot be taken out, the mother disk is rotated to make corrections so that the wafer can be taken out and a corrected recognition angle is obtained, and the corrected recognition angle is used as the obtained recognition angle; Step S106: Repeat the above steps S101-S105 until the mother disk rotates one circle and all satellite disks have been tested to see whether the wafers on the satellite disks can be taken out.

4. The method for measuring the satellite disk rotation speed of a multi-disc planetary MOCVD device according to claim 1, characterized in that: Before step S100: obtaining the rotation angle of the mother disk relative to the initial position, the following steps are also included: Step S201: rotating the mother disk to an initial position, at which time the first satellite disk is not under the ranging sensor; Step S202: setting any radial direction of the master disc at the initial position to 0°; Step S203: obtaining the corresponding angle α of the satellite dish under the ranging sensor; Step S204: obtaining an angle β of a direction of a line connecting the center of the mother disk and the center of the first satellite disk; Step S205: According to the formula: when α≥β, γ=α-β, when α<β, γ=360°+α-β, obtain the rotation angle γ when the first satellite dish rotates to under the ranging sensor, and γ is also used as one of the identification angles; Step S206: According to the preset number n of satellite dishes and the formula: identification angle θ=γ+(360° / n)×(m-1), n ​​identification angles are obtained, and the obtained n identification angles are stored in a one-to-one correspondence with the identity information of the n satellite dishes to obtain a corresponding relationship between the identification angles and the identity information of the satellite dishes, wherein n and m are natural numbers, 1≤m≤n.

5. The method for measuring the satellite disk rotation speed of a multi-disc planetary MOCVD device according to claim 1, characterized in that: The step of obtaining the current rotation speed of the satellite dish under the ranging sensor according to the acquired height information of the satellite dish and the pre-stored correspondence between the height information of the satellite dish and the rotation speed includes: According to the identity information of the satellite dish, searching for a relationship corresponding to the current satellite dish from all pre-stored relationships corresponding to the satellite dishes, wherein the relationship corresponding to the satellite dishes includes a corresponding relationship between the height and the rotation speed of the satellite dish; The current rotation speed of the satellite dish under the ranging sensor is obtained according to the height information of the satellite dish and the corresponding relationship of the satellite dish.

6. The method for measuring the satellite disk rotation speed of a multi-disc planetary MOCVD device according to claim 1, characterized in that: When the master disk and the satellite disk continue to rotate, all the above steps are repeated, and the steps of obtaining the rotation speeds of all the satellite disks on the master disk include: When the mother disk rotates 0-360 degrees, each time a rotation speed of the satellite disk is obtained, the rotation speed corresponding to the satellite disk is stored in the controller; When the mother disk rotates more than 360°, the corresponding rotation speed of the satellite disk stored in the controller is updated each time the rotation speed of one satellite disk is obtained.

7. The method for measuring the satellite disk rotation speed of a multi-disc planetary MOCVD device according to claim 1, characterized in that: The acquired height information of the satellite dish is matched with the pre-stored height information of the satellite dish, and when the match is successful, the steps of acquiring the current rotation speed of the satellite dish according to the acquired height information of the satellite dish and the correspondence between the pre-stored height information of the satellite dish and the rotation speed include: Step S110: when the preset wafer processing process is not in progress, when the mother disk is not rotating and the satellite disk is not floating, obtaining a vertical distance between the upper surface of the wafer placed on the satellite disk and the distance measuring sensor; Step S120: introducing a predetermined air flow rate to make the satellite dish carrying the wafer float and rotate, and obtaining a vertical distance h2 between the upper surface of the wafer and the distance measuring sensor; Step S130: Calculate the floating height of the satellite dish and / or the wafer according to the formula: floating height Δh = h1-h2, wherein h1 is the vertical distance between the upper surface of the wafer placed on the satellite dish and the ranging sensor when the satellite dish is not floating, and h2 is the vertical distance between the upper surface of the wafer and the ranging sensor obtained after a predetermined airflow is introduced to float and rotate the satellite dish carrying the wafer; Step S140: obtaining the rotation speed of the satellite dish; Step S150: The floating height and the rotation speed of the satellite disk are associated and stored to obtain a mapping relationship.

8. The method for measuring the satellite disk rotation speed of a multi-disc planetary MOCVD device according to claim 7, characterized in that: The acquired height information of the satellite dish is matched with the pre-stored height information of the satellite dish, and when the match is successful, the steps of acquiring the current rotation speed of the satellite dish according to the acquired height information of the satellite dish and the correspondence between the pre-stored height information of the satellite dish and the rotation speed include: Step S501: changing the amount of airflow introduced so as to change the floating height of the satellite dish; Step S502: obtaining the changed floating height of the satellite disk and / or wafer; Step S503: obtaining the rotation speed of the satellite dish; Step S504: storing the changed floating height of the satellite disk and / or wafer in association with the rotation speed of the satellite disk, thereby obtaining the updated mapping relationship; Step S505: repeating steps S501 to S504 until a preset condition is met and the process stops. The preset condition includes obtaining the mapping relationship of a preset amount, or the floating height exceeds or is equal to a preset value.

9. The method for measuring the satellite disk rotation speed of a multi-disc planetary MOCVD device according to claim 8, characterized in that: After step S505, the following steps are included: Step S506: Rotate the mother disk according to the identification angle so that the next satellite disk is under the ranging sensor; Step S507: Repeat steps S505-S506 until the mapping relationship of each satellite dish is obtained.

10. A satellite disk rotation speed measurement system for a multi-chip planetary MOCVD device, using the satellite disk rotation speed measurement method for a multi-chip planetary MOCVD device according to any one of claims 1 to 4, comprising: a master disk, the master disk being rotatable about a rotation center axis of the master disk, A plurality of satellite disks are circumferentially distributed on the master disk and are used to carry wafers. The master disk can carry the satellite disks to revolve around the rotation center axis of the master disk, and the satellite disks can rotate around the rotation center axis of the satellite disk. A rotating device, disposed below the master disk, capable of driving the master disk to rotate; An angle sensor, used to obtain the rotation angle of the master disk relative to the initial position and transmit it to the controller; A controller, used for controlling the rotating device to drive the mother disk to rotate, and also for matching the rotation angle with the identification angle. When the matching is successful, the identity information of the current satellite disk under the ranging sensor is obtained according to the identification angle and the pre-stored correspondence between the identification angle and the satellite disk identity information; A ranging sensor, used to obtain the altitude information of the current satellite dish under the ranging sensor; The controller is further used to obtain the current rotation speed of the satellite disk according to the height information of the satellite disk and the pre-stored correspondence between the height information of the satellite disk and the rotation speed; and is also used to obtain the rotation speed of each of the satellite disks on the mother disk.

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