Movable material taking platform and die bonder

By designing separately arranged bases and drive plates in the solid crystal machine, the space movement of the material collection mechanism is realized, space occupation is reduced and inertia is reduced, and the working accuracy and efficiency of the solid crystal machine are improved.

CN119890094AActive Publication Date: 2025-04-25NODING INTELLIGENCE
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Patent Information

Application Number
CN202510091454.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-21
Publication Date
2025-04-25
Estimated Expiration
2045-01-21

AI Technical Summary

Technical Problem

Due to the large space occupied by the XYZ three-axis motion structure, existing solid crystal machines lack installation space for structures such as visual modules and transit platforms. At the same time, when the Y axis is moving, it produces huge inertia due to the weight of the Z axis and the material collection mechanism, which reduces positioning accuracy, response speed and service life.

Method used

A moving material picking platform is designed, by setting a base, a sliding part and a driving plate, the base and the driving plate are arranged separately, and the base slides in the second direction. The extension of the driving plate drives the sliding part to move in the third direction, thereby reducing space occupation and reducing the weight and moving inertia of the base.

Benefits of technology

This reduces the space occupied by mechanism stacking, improves positioning accuracy, response speed and service life, and thus improves the overall working accuracy of the solid crystal machine, and improves the working efficiency of the solid crystal machine during use.

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Abstract

The invention relates to the technical field of die bonders, and discloses a mobile material taking platform and a die bonder, the mobile material taking platform comprises a mounting seat, a driving mechanism and a material taking mechanism; according to the material taking mechanism, the base, the sliding part and the driving plate are arranged, and the base and the driving plate are separately arranged, so that the extending part of the driving plate can drive the sliding part to move in the third direction while the base slides in the second direction, and therefore the base and the driving plate are arranged on one mounting base, and movement of the material taking mechanism in the space can be completed; according to the utility model, space occupation caused by stacking of each mechanism is reduced, especially space occupation of the die bonder in the third direction, namely space occupation in the height direction, is reduced, enough installation space is left for other mechanisms, in addition, after the base and the driving plate are separately arranged, the weight borne by the base can be reduced, and the cost is reduced. Therefore, the movement inertia of the base in the second direction is reduced, and the overall working precision of the die bonder is improved.
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Description

Technical Field

[0001] The invention relates to the technical field of crystal bonding machines, and in particular to a mobile material taking platform and a crystal bonding machine. Background Art

[0002] At present, the existing die bonding machines usually adopt the traditional XYZ three-axis motion structure in conjunction with the material picking mechanism to realize the movement of the chip, that is, the X-axis drives the YZ-axis to move, the Y-axis drives the Z-axis to move, and finally the Z-axis drives the material picking mechanism to move, so as to realize the movement of the material picking mechanism in space. Although this traditional XYZ three-axis motion structure has a simple structure, when it is applied to the die bonding machine, it will take up a lot of space after the XYZ three-axis superimposed material picking mechanism, especially for the space in the height direction of the die bonding machine, which will lead to insufficient installation space for structures such as vision modules and transfer platforms. In addition, when the die bonding machine is working, the Y-axis with the highest movement frequency and the fastest speed will generate huge Y-axis inertia during movement due to the weight of the Z-axis and the material picking mechanism, thereby reducing the positioning accuracy, response speed and service life, and further reducing the overall working accuracy of the die bonding machine. Summary of the invention

[0003] The purpose of the present invention is to provide a mobile material taking platform and a crystal bonding machine, which can not only reduce the space occupied, but also improve the positioning accuracy, response speed and service life, and improve the overall working accuracy of the crystal bonding machine.

[0004] In order to achieve the above-mentioned purpose, the present invention provides a mobile material-grabbing platform, which has a first direction, a second direction and a third direction that intersect each other, and includes: a mounting seat, a driving mechanism and a material-grabbing mechanism; the mounting seat can slide along the first direction; the driving mechanism includes a base, a sliding portion and a driving plate, the base and the driving plate are arranged at intervals on one side of the mounting seat in the first direction along the second direction, the base can slide on the mounting seat along the second direction, the driving plate can slide on the mounting seat along the third direction, the base has a receiving groove on a side facing the driving plate, the base has a connecting groove on a side away from the mounting seat, the connecting groove extends along the third direction and is connected to the receiving groove, the sliding portion is located inside the receiving groove and is slidably connected to the connecting groove, the driving plate has an extension portion on a side facing the receiving groove, the extension portion extends along the second direction and is slidably connected to the sliding portion; the material-grabbing mechanism is located on a side of the base away from the mounting seat and is connected to the sliding portion through the connecting groove.

[0005] Optionally, the mounting base includes a base, a first rail and a second rail, the first rail and the second rail are spaced apart along the second direction on one side of the base in the first direction, the first rail extends along the second direction, the second rail extends along the third direction, the base is slidably connected to the first rail, and the drive plate is slidably connected to the second rail.

[0006] Optionally, the second rail is connected to the mounting seat at one end in the third direction and protrudes from the mounting seat at the other end. The driving plate also includes a driving part, which is slidably connected to the second rail, and the extension part is arranged on a side of the driving part facing the base.

[0007] Optionally, the sliding portion includes a first pulley and a second pulley, and the first pulley and the second pulley are arranged at intervals along the third direction on the side of the material picking mechanism facing the connecting groove, a sliding space is formed between the first pulley and the second pulley, and the extension portion is slidably connected to the sliding space.

[0008] Optionally, it further includes a third track extending along the first direction, and the mounting seat is slidably connected to the third track.

[0009] Optionally, a plurality of fourth tracks are provided on the side of the base facing away from the mounting seat, the fourth tracks extend along the third direction, the plurality of fourth tracks are spaced apart on both sides of the connecting groove along the second direction, and the material picking mechanism is slidably connected to the plurality of fourth tracks.

[0010] Optionally, the material picking mechanism includes a support plate, a rotating motor, a transmission belt and a suction nozzle, the support plate is connected to the sliding part, the rotating motor and the suction nozzle are arranged on the support plate at intervals along the first direction, and the suction nozzle is rotatably connected to the support plate, the output end of the rotating motor is transmission-connected to the suction nozzle through the transmission belt, and the top surface of the suction nozzle has an exhaust port, which is used to suck gas.

[0011] Optionally, the material taking mechanism further includes a force applying component, the force applying component includes a force control spring, a support plate and a force bearing plate, the support plate is arranged on the top surface of the support plate, and the force bearing plate is arranged on a side of the support plate facing the suction nozzle;

[0012] The suction nozzle comprises a sleeve, a shaft and a cap, the sleeve is rotatably connected to the support plate, and the output end of the rotating motor is transmission-connected to the sleeve through the transmission belt, the sleeve has a mounting hole penetrating along the third direction, the shaft is inserted into the mounting hole and both ends protrude from the sleeve, the mounting hole has a slide groove extending along the third direction, the outer peripheral side of the shaft has a slide bar adapted to the slide groove, the slide bar is slidably connected to the slide groove, the cap is sleeved on the top of the shaft, and the shaft is rotatably connected to the cap;

[0013] One end of the force control spring is connected to the bottom surface of the force-bearing plate, and the other end is connected to the cap body.

[0014] Optionally, a displacement sensor is further included, wherein the displacement sensor is arranged corresponding to the shaft body, and the displacement sensor is used to detect the distance that the shaft body moves relative to the sleeve body.

[0015] In order to achieve the same purpose, a crystal bonding machine is also provided, comprising the mobile material taking platform as described above.

[0016] Compared with the prior art, the mobile material picking platform and the crystal bonding machine of the embodiment of the present invention have the following beneficial effects: the present application sets a base, a sliding part and a driving plate, and the base and the driving plate are set separately, so that when the base slides along the second direction, the extension part of the driving plate can also drive the sliding part to move in the third direction, so that the base and the driving plate are set on a mounting seat to complete the movement of the material picking mechanism in the space, reducing the space occupied by the stacking of various mechanisms, especially the space occupied by the crystal bonding machine in the third direction, that is, the space occupied in the height direction, leaving sufficient installation space for other mechanisms. In addition, after the base and the driving plate are set separately, the weight borne by the base can also be reduced, thereby reducing the moving inertia of the base in the second direction, improving the positioning accuracy, response speed and service life of the base, and thus improving the overall working accuracy of the crystal bonding machine. The driving plate and the base can also move simultaneously during use, further improving the working efficiency of the crystal bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a structural schematic diagram of the mobile material taking platform according to an embodiment of the present invention;

[0018] Figure 2 is a top view of the mobile material taking platform according to an embodiment of the present invention;

[0019] Figure 3 The embodiment of the present invention Figure 2 Section view in the AA direction;

[0020] Figure 4is a schematic structural diagram of the base according to an embodiment of the present invention

[0021] Figure 5 is a schematic structural diagram of the mounting base and the third track in an embodiment of the present invention;

[0022] Figure 6 is a schematic structural diagram of the material taking mechanism and the displacement sensor in an embodiment of the present invention;

[0023] Figure 7 is a side view of the material taking mechanism and the displacement sensor according to an embodiment of the present invention;

[0024] Figure 8 is a structural schematic diagram of the force-applying assembly according to an embodiment of the present invention;

[0025] Fig. 9 is a schematic structural diagram of the force-applying assembly of an embodiment of the present invention when no force-controlling spring is provided;

[0026] Fig.10 is a schematic diagram of the relative positions of the holder and the force-bearing member in an embodiment of the present invention;

[0027] Fig.11 is a schematic structural diagram of the suction nozzle according to an embodiment of the present invention;

[0028] Fig.12 is a top view of the nozzle according to an embodiment of the present invention;

[0029] Fig.13 The embodiment of the present invention Fig.12 Cross-sectional view in the BB direction.

[0030] In the figure, 1, mounting seat; 11, base; 12, first track; 121, first base; 1211, first limiting groove; 122, first guide rod; 13, second track; 131, second base; 1311, second limiting groove; 132, second guide rod; 2, driving mechanism; 21, base; 211, containing groove; 212, connecting groove; 213, first sleeve part; 214, fourth track; 22, sliding part; 221, first pulley; 222, second pulley; 23, driving plate; 231, extension part; 232, driving part; 233, second sleeve part; 3, material taking mechanism; 31, third sleeve part; 32, supporting plate; 33, rotating motor; 34. Transmission belt; 35. Suction nozzle; 351. Air outlet; 352. Sleeve; 3521. Slide groove; 353. Axle; 3531. Slide bar; 354. Cap; 3541. Protrusion; 355. Adsorption part; 36. Force-applying component; 361. Force-control spring; 362. Support plate; 363. Force-bearing plate; 364. Fixing member; 3641. Flange; 365. Force-bearing member; 3651. First force-bearing part; 3652. Second force-bearing part; 3653. Guide column; 37. Card seat; 371. Slide groove; 4. Third track; 5. Displacement sensor; 51. Sensing part; 52. Displacement plate; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0031] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0033] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] like Figure 1-Figure 4 As shown, a mobile material-retrieving platform according to an embodiment of the present invention has a first direction X, a second direction Y and a third direction Z intersecting in pairs, and includes: a mounting seat 1, a driving mechanism 2 and a material-retrieving mechanism 3; the mounting seat 1 can slide along the first direction X; the driving mechanism 2 includes a base 21, a sliding portion 22 and a driving plate 23, the base 21 and the driving plate 23 are arranged at intervals on one side of the mounting seat 1 in the first direction X along the second direction Y, the base 21 can slide on the mounting seat 1 along the second direction Y, the driving plate 23 can slide on the mounting seat 1 along the third direction Z, and the base 21 A receiving groove 211 is provided on the side facing the driving plate 23, a connecting groove 212 is provided on the side of the base 21 away from the mounting seat 1, the connecting groove 212 extends along the third direction Z and is connected to the receiving groove 211, the sliding portion 22 is located inside the receiving groove 211 and is slidably connected to the connecting groove 212, and the driving plate 23 has an extension portion 231 on the side facing the receiving groove 211, the extension portion 231 extends along the second direction Y and is slidably connected to the sliding portion 22; the material picking mechanism 3 is located on the side of the base 21 away from the mounting seat 1 and is connected to the sliding portion 22 through the connecting groove 212.

[0036] Based on the above scheme, the present application sets a base 21, a sliding part 22 and a driving plate 23, and the base 21 and the driving plate 23 are set separately, so that when the base 21 slides along the second direction Y, the extension part 231 of the driving plate 23 can also drive the sliding part 22 to move in the third direction Z, so that the base 21 and the driving plate 23 are set on a mounting seat 1 to complete the movement of the material picking mechanism 3 in the space, reducing the space occupied by the stacking of various mechanisms, especially the space occupied by the crystal bonding machine in the third direction Z, leaving sufficient installation space for other mechanisms. In addition, after the base 21 and the driving plate 23 are set separately, the weight borne by the base 21 can also be reduced, thereby reducing the moving inertia of the base 21 in the second direction Y, improving the positioning accuracy, response speed and service life of the base 21, and thereby improving the overall working accuracy of the crystal bonding machine. The driving plate 23 and the base 21 can also move simultaneously during use, further improving the working efficiency of the crystal bonding machine.

[0037] like Figure 5As shown, in order to ensure the movement accuracy of the base 21 and the driving plate 23, the mounting base 1 includes a base 11, a first track 12 and a second track 13. The first track 12 and the second track 13 are arranged at intervals along the second direction Y on one side of the base 11 in the first direction X. The first track 12 extends along the second direction Y, and the second track 13 extends along the third direction Z. The base 21 is slidably connected to the first track 12, and the driving plate 23 is slidably connected to the second track 13. The movement routes of the base 21 and the driving plate 23 are ensured by setting the first track 12 and the second track 13.

[0038] like Figure 5 As shown, in order to ensure that the base 21 can move more stably, the first track 12 includes a first base 121 and a first guide rod 122. The first base 121 has a first limiting groove 1211 on the side away from the mounting base 1, and the first guide rod 122 is arranged in the first limiting groove 1211 and extends along the second direction Y. The base 21 has a first sleeve portion 213 on the side away from the material picking mechanism 3. The first sleeve portion 213 is sleeved on the first guide rod 122 and can slide in the first limiting groove 1211 along the first guide rod 122.

[0039] like Figure 5 As shown, in order to ensure that the sliding part 22 can move stably along the third direction Z, the second track 13 is connected to the mounting seat 1 at one end in the third direction Z, and the other end protrudes from the mounting seat 1. The driving plate 23 also includes a driving part 232, and the driving part 232 is slidably connected to the second track 13. The extension part 231 is arranged on the side of the driving part 232 facing the base 21. By extending the second track 13 and setting the driving part 232, the driving plate 23 can drive the sliding part 22 to move more stably and will not occupy more space in the third direction Z.

[0040] like Figure 5 As shown, in order to ensure that the driving plate 23 can move more stably, the second track 13 includes a second base 131 and a second guide rod 132, the second base 131 has a second limiting groove 1311 on the side away from the mounting seat 1, the second guide rod 132 is arranged in the second limiting groove 1311 and extends along the third direction Z, the driving plate 23 has a second sleeve portion 233 on the side away from the feeding mechanism 3, the second sleeve portion 233 is sleeved on the second guide rod 132, and can slide in the second limiting groove 1311 along the second guide rod 132.

[0041] like Figure 3As shown, in order to enable the extension portion 231 of the driving plate 23 to be smoothly connected along the sliding portion 22, the sliding portion 22 includes a first pulley 221 and a second pulley 222. The first pulley 221 and the second pulley 222 are spaced apart along the third direction Z on the side of the material taking mechanism 3 facing the connecting groove 212, and a sliding space is formed between the first pulley 221 and the second pulley 222, and the extension portion 231 is slidably connected to the sliding space.

[0042] like Figure 1 and Figure 5 As shown, in order to ensure the movement accuracy of the mounting seat 1 , a third track 4 extending along the first direction X is further included, and the mounting seat 1 is slidably connected to the third track 4 .

[0043] like Figure 4 As shown, in order to ensure the moving accuracy of the material picking mechanism 3 and avoid the misalignment of the material picking mechanism 3 due to the sliding of the extension part 231 on the sliding part 22, a plurality of fourth rails 214 are further provided on the side of the base 21 away from the mounting base 1, and the fourth rails 214 extend along the third direction Z. The plurality of fourth rails 214 are arranged at intervals on both sides of the connecting groove 212 along the second direction Y. The material picking mechanism 3 is slidably connected to the plurality of fourth rails 214. By setting a plurality of fourth rails 214, it is ensured that the material picking mechanism 3 can move along the third direction Z without deviation due to the sliding of the driving plate 23 relative to the sliding part 22.

[0044] like Figure 6 As shown, the material taking mechanism 3 further includes a plurality of third sleeve parts 31 , and the plurality of third sleeve parts 31 are sleeved on the plurality of fourth rails 214 one by one.

[0045] like Figure 6 and Figure 7 As shown, in order to reduce the occupation of the internal space of the crystal bonding machine in the third direction Z, the material picking mechanism 3 includes a support plate 32, a rotating motor 33, a transmission belt 34 and a suction nozzle 35. The support plate 32 is connected to the sliding part 22, and the rotating motor 33 and the suction nozzle 35 are arranged on the support plate 32 at intervals along the first direction X, and the suction nozzle 35 is rotatably connected to the support plate 32. The output end of the rotating motor 33 is transmission-connected to the suction nozzle 35 through the transmission belt 34, and the top surface of the suction nozzle 35 has an exhaust port 351, and the exhaust port 351 is used to extract gas. By setting the support plate 32, the rotating motor 33 and the suction nozzle 35 can be arranged at intervals along the first direction X, thereby reducing the occupation of the space in the third direction Z, and after the exhaust port 351 is set on the top surface of the suction nozzle 35, it can also provide space for gas path connection for the mechanism of the crystal bonding machine used to control adsorption.

[0046] like Figure 6-Figure 13As shown, in order to facilitate the control of the pressure applied by the suction nozzle 35 to the chip, the material picking mechanism 3 also includes a force-applying component 36, which includes a force-control spring 361, a support plate 362 and a force-bearing plate 363. The support plate 362 is arranged on the top surface of the support plate 32, and the force-bearing plate 363 is arranged on the side of the support plate 362 facing the suction nozzle 35; the suction nozzle 35 includes a sleeve 352, a shaft 353 and a cap 354, the sleeve 352 is rotatably connected to the support plate 32, and the output end of the rotating motor 33 is driven by a transmission The belt 34 is in transmission connection with the sleeve 352. The sleeve 352 has a mounting hole penetrating along the third direction Z. The shaft 353 is inserted into the mounting hole and both ends protrude from the sleeve 352. The mounting hole has a slide groove 3521 extending along the third direction Z. The outer peripheral side of the shaft 353 has a slide bar 3531 adapted to the slide groove 3521. The slide bar 3531 is slidably connected to the slide groove 3521. The cap 354 is sleeved on the top of the shaft 353, and the shaft 353 is rotatably connected to the cap 354.

[0047] One end of the force control spring 361 is connected to the bottom surface of the force plate 363, and the other end is connected to the cap body 354. By dividing the suction nozzle 35 into the sleeve body 352, the shaft body 353 and the cap body 354, the shaft body 353 of the suction nozzle 35 can rotate with the sleeve body 352 and slide along the third direction Z, thereby cooperating with the force control spring 361 to control the magnitude of the force applied to the chip.

[0048] like Figure 8 and Fig. 9 As shown, in order to facilitate the adjustment of the force control range of the material picking mechanism 3, the force-applying assembly 36 also includes a fixing member 364 and a force-bearing member 365. The fixing member 364 is detachably connected to the force-bearing plate 363. The force-bearing member 365 includes a first force-bearing portion 3651 and a second force-bearing portion 3652. The first force-bearing portion 3651 is arranged on the side of the cap body 354 facing the suction nozzle 35. One end of the second force-bearing portion 3652 is connected to the bottom end of the first force-bearing portion 3651, and the other end extends toward the support plate 362 and is arranged corresponding to the fixing member 364. The fixing member 364 The bottom periphery has a convex edge 3641, the top surface of the second force-bearing part 3652 has a guide column 3653, one end of the force control spring 361 is sleeved on the bottom of the fixing member 364 and abuts against the bottom surface of the convex edge 3641, and the other end is sleeved on the guide column 3653 and abuts against the top surface of the second force-bearing part 3652. By arranging the fixing member 364 and the force-bearing member 365, it is possible to ensure that the force control spring 361 applies a stable force while also being able to conveniently replace the force control spring 361, thereby realizing the adjustment of the force control range of the material picking mechanism 3.

[0049] like Figure 6 and Fig.10As shown, in order to facilitate the control of the force transmitted to the suction nozzle 35 by the force control spring 361 so that it can be transmitted to the chip along the third direction Z, the material picking mechanism 3 also includes a holder 37, and the holder 37 is arranged on the top surface of the support plate 32. The top surface of the holder 37 has a sliding groove 371, and the sliding groove 371 runs through the side of the holder 37 facing the suction nozzle 35. The side of the cap body 354 is provided with a protrusion 3541, and the protrusion 3541 is slidably connected to the sliding groove 371. Through the setting of the protrusion 3541 and the sliding groove 371, it is ensured that in the process of the force control spring 361 applying force, the shaft body 353 and the cap body 354 can move along the third direction Z, thereby ensuring that the force applied by the suction nozzle 35 to the chip can move along the third direction Z, and because the holder 37 is provided, the shaft body 353 and the cap body 354 can be prevented from falling off from the suction nozzle 35 after the force control spring 361 is disassembled.

[0050] like Fig.10 As shown, in order to facilitate the removal of the force control spring 361, the force-bearing member 365 and the protrusion 3541 are symmetrically arranged along the axial direction of the cap body 354, and as the protrusion 3541 slides into the sliding groove 371, the second force-bearing portion 3652 can abut against the top surface of the tray. When the force control spring 361 is removed, the suction nozzle 35 can be supported by the force-bearing member 365 and the bracket 37, thereby avoiding the position of the suction nozzle 35 from being offset.

[0051] like Figure 11-13 As shown, the suction nozzle 35 further includes a suction portion 355 , which is sleeved on the bottom end of the shaft 353 and is used to suction the chip.

[0052] like Figure 1 As shown, in order to facilitate the control of the pressure applied by the suction nozzle 35 to the chip, a displacement sensor 5 is also included. The displacement sensor 5 is arranged corresponding to the shaft 353 and is used to detect the distance moved by the shaft 353 relative to the sleeve 352.

[0053] like Figure 6 As shown, the displacement sensor 5 includes a sensing part 51 and a displacement plate 52. The displacement plate 52 is arranged on the side of the support plate 32, and the sensing part 51 is arranged on the side of the cap body 354 and is arranged corresponding to the displacement plate 52. The sensing part 51 is used to detect the moving distance of the displacement plate 52 relative to the suction nozzle 35, that is, the compression amount of the force control spring 361. The pressure applied by the force control spring 361 is calculated by calculating the compression amount of the force control spring 361, and due to the location of the displacement sensor 5, the disassembly of the force control spring 361 will not be affected.

[0054] An embodiment of the present invention further provides a crystal bonding machine, comprising the mobile material taking platform as described above.

[0055] In summary, the embodiment of the present invention provides a mobile material-taking platform and a crystal bonding machine, which are provided with a base 21, a sliding part 22 and a driving plate 23, and the base 21 and the driving plate 23 are separately provided, so that when the base 21 slides along the second direction Y, the extension part 231 of the driving plate 23 can also drive the sliding part 22 to move in the third direction Z, so that the base 21 and the driving plate 23 are provided on a mounting seat 1 to complete the movement of the material-taking mechanism 3 in the space, thereby reducing the space occupied by the stacking of various mechanisms, especially the space occupied by the crystal bonding machine in the third direction Z, leaving sufficient installation space for other mechanisms. In addition, after the base 21 and the driving plate 23 are separately provided, the weight borne by the base 21 can also be reduced, thereby reducing the moving inertia of the base 21 in the second direction Y, improving the positioning accuracy, response speed and service life of the base 21, and thereby improving the overall working accuracy of the crystal bonding machine. The driving plate 23 and the base 21 can also move simultaneously during use, further improving the working efficiency of the crystal bonding machine.

[0056] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A mobile material taking platform, having a first direction, a second direction and a third direction intersecting each other, characterized in that: include: Mounting seat, driving mechanism and material taking mechanism; The mounting seat is capable of sliding along the first direction; The driving mechanism comprises a base, a sliding part and a driving plate, the base and the driving plate are arranged at intervals on one side of the mounting seat in the first direction along the second direction, the base can slide on the mounting seat along the second direction, the driving plate can slide on the mounting seat along the third direction, the base has a receiving groove on a side facing the driving plate, the base has a connecting groove on a side facing away from the mounting seat, the connecting groove extends along the third direction and is connected with the receiving groove, the sliding part is located inside the receiving groove and is slidably connected to the connecting groove, the driving plate has an extending part on a side facing the receiving groove, the extending part extends along the second direction and is slidably connected to the sliding part; The material taking mechanism is located at a side of the base away from the mounting seat and is connected to the sliding part through the connecting groove.

2. The mobile material taking platform according to claim 1, characterized in that: The mounting base includes a base, a first track and a second track, the first track and the second track are arranged at a distance from each other on one side of the base in the first direction along the second direction, the first track extends along the second direction, and the second track extends along the third direction, the base is slidably connected to the first track, and the driving plate is slidably connected to the second track.

3. The mobile material taking platform according to claim 2, characterized in that: The second track is connected to the mounting seat at one end in the third direction and protrudes from the mounting seat at the other end. The driving plate also includes a driving part, which is slidably connected to the second track. The extension part is arranged on a side of the driving part facing the base.

4. The mobile material taking platform according to claim 1, characterized in that: The sliding part includes a first pulley and a second pulley, and the first pulley and the second pulley are arranged at intervals along the third direction on a side of the material taking mechanism facing the connecting groove, a sliding space is formed between the first pulley and the second pulley, and the extension part is slidably connected to the sliding space.

5. The mobile material taking platform according to claim 1, characterized in that: It also includes a third track extending along the first direction, and the mounting seat is slidably connected to the third track.

6. The mobile material taking platform according to claim 1, characterized in that: A plurality of fourth tracks are also provided on one side of the base away from the mounting seat, the fourth tracks extend along the third direction, the plurality of fourth tracks are spaced apart on both sides of the connecting groove along the second direction, and the material picking mechanism is slidably connected to the plurality of fourth tracks.

7. The mobile material taking platform according to claim 1, characterized in that: The material picking mechanism includes a support plate, a rotating motor, a transmission belt and a suction nozzle, the support plate is connected to the sliding part, the rotating motor and the suction nozzle are arranged on the support plate at intervals along the first direction, and the suction nozzle is rotatably connected to the support plate, the output end of the rotating motor is transmission-connected to the suction nozzle through the transmission belt, and the top surface of the suction nozzle has an exhaust port, which is used to suck gas.

8. The mobile material taking platform according to claim 7, characterized in that: The material taking mechanism further comprises a force applying component, the force applying component comprises a force control spring, a support plate and a force bearing plate, the support plate is arranged on the top surface of the support plate, and the force bearing plate is arranged on a side of the support plate facing the suction nozzle; The suction nozzle comprises a sleeve, a shaft and a cap, the sleeve is rotatably connected to the support plate, and the output end of the rotating motor is transmission-connected to the sleeve through the transmission belt, the sleeve has a mounting hole penetrating along the third direction, the shaft is inserted into the mounting hole and both ends protrude from the sleeve, the mounting hole has a slide groove extending along the third direction, the outer peripheral side of the shaft has a slide bar adapted to the slide groove, the slide bar is slidably connected to the slide groove, the cap is sleeved on the top of the shaft, and the shaft is rotatably connected to the cap; One end of the force control spring is connected to the bottom surface of the force-bearing plate, and the other end is connected to the cap body.

9. The mobile material taking platform according to claim 8, characterized in that: It also includes a displacement sensor, which is arranged corresponding to the shaft body and is used to detect the distance that the shaft body moves relative to the sleeve body.

10. A die bonding machine, characterized in that: It comprises a mobile material taking platform as described in any one of claims 1 to 9.

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