A plasma cleaning machine for semiconductor processing

Abstract

The application relates to the technical field of plasma cleaning machines, and discloses a plasma cleaning machine for semiconductor processing, which comprises a main body assembly, a main machine, a connecting sleeve fixed at the bottom of the main machine, an insulating sleeve arranged at the bottom of the connecting sleeve, an inner sleeve arranged outside the insulating sleeve, an outer sleeve arranged outside the inner sleeve, a spray head arranged at the bottom of the outer sleeve, a fixing assembly arranged in the outer sleeve, an extrusion ring fixed to the inner wall of the outer sleeve, an extrusion column arranged at the bottom of the inner sleeve, a mounting sleeve fixed in the outer sleeve, a clamping block arranged in the mounting sleeve, and a fixing sleeve fixed at the bottom of the main machine. The application has the beneficial effect that: through the arrangement of the fixing assembly, the dismounting or fixing of multiple components can be completed at one time when the gun head is dismounted and fixed, so that the maintenance time can be reduced, and the situation that a certain component is missed to be fixed can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of plasma cleaning machines, in particular to a plasma cleaning machine used for semiconductor processing. Background Art

[0002] Plasma cleaning machine is a high-tech equipment that uses plasma to treat the surface of samples to achieve the purpose of cleaning, modification, etc. In a vacuum chamber, a high-energy disordered plasma is generated by igniting a radio frequency power supply under a certain pressure. The "active" components such as ions, electrons, atoms, and active groups in the plasma bombard the surface of the product being cleaned, and react physically or chemically with the pollutants on the surface, thereby achieving the purpose of cleaning. During use, when the spray gun fails and needs maintenance, since the spray gun is composed of a gun head, an insulating sleeve, an inner liner sleeve, an outer liner sleeve, and a nozzle, etc., it is necessary to During the disassembly process of spray gun maintenance, the above-mentioned components need to be disassembled one by one, and during assembly, multiple components need to be fixed one by one. Disassembling and fixing multiple components one by one is a tedious and meticulous process, requiring operators to operate the gun head, insulating sleeve, inner liner sleeve, outer liner sleeve and nozzle and other components in turn, which will take a lot of time, resulting in extended equipment maintenance time and affecting production efficiency. In addition, due to the large number of components, if the fixation of a component is missed during the installation and fixation process, this may cause the spray gun to fail to work normally, and may even cause more serious failures when the equipment is running. Summary of the Invention

[0003] In view of the above-mentioned problems existing in the existing plasma cleaning machine used for semiconductor processing, the present invention is proposed.

[0004] Therefore, the problem to be solved by the present invention is that the operation of disassembling and repairing the plasma cleaning machine spray gun is too complicated.

[0005] To solve the above technical problems, the present invention provides the following technical solutions: A plasma cleaning machine for semiconductor processing, comprising: a main assembly, including a main unit, a connecting sleeve fixed to the bottom of the main unit, an insulating sleeve provided at the bottom of the connecting sleeve, an inner sleeve provided on the outer side of the insulating sleeve, an outer sleeve provided on the outer side of the inner sleeve, and a nozzle provided at the bottom of the outer sleeve;

[0006] A fixing assembly is arranged in the outer sleeve, including an extrusion ring fixed to the inner wall of the outer sleeve, an extrusion column is provided at the bottom of the inner sleeve, a mounting sleeve is fixed in the outer sleeve, a clamping block is provided in the mounting sleeve, a fixing sleeve is fixed at the bottom of the main unit, a positioning groove is provided on the fixing sleeve, and a positioning shaft is fixed on one side of the outer sleeve.

[0007] As a preferred solution of the plasma cleaning machine for semiconductor processing described in the present invention, the fixing assembly further comprises an extrusion member, the extrusion member comprises an extrusion plate located inside the mounting sleeve, a movable groove is provided on the outer sleeve, a movable column is movably connected in the movable groove, a guide groove is provided on the inner side of the fixing sleeve, the top end of the movable column slides in the guide groove, and the bottom end is fixed to the extrusion plate.

[0008] As a preferred solution of the plasma cleaning machine for semiconductor processing described in the present invention, it also includes a shielding assembly, which is arranged in the outer sleeve, including a support ring fixed inside the outer sleeve, a baffle is rotatably connected inside the support ring, and a guide ring is fixed on the top of the support ring.

[0009] As a preferred solution of the plasma cleaning machine for semiconductor processing described in the present invention, the shielding assembly also includes a pushing member, the pushing member includes a moving rod located below the support ring, an extrusion block is fixed to the bottom of the baffle, a force-bearing rod is fixed to one side of the moving column, and an extrusion rod is fixed to the end of the moving rod.

[0010] As a preferred solution of the plasma cleaning machine for semiconductor processing described in the present invention, the fixing assembly also includes a locking member, the locking member includes a support frame fixed to one side of the fixing sleeve, a movable plate is movably connected in the support frame, a limiting block is fixed at the bottom of the movable plate, and a first spring is fixed at the top of the movable plate.

[0011] As a preferred solution of the plasma cleaning machine for semiconductor processing described in the present invention, wherein: a support block is fixed at the bottom of the inner sleeve, the extrusion column is movably connected to the inside of the support block, a fixed block is fixed to the outside of the extrusion column, a second spring is fixed to one side of the fixed block, and the other end of the second spring is fixed to the support block.

[0012] As a preferred solution of the plasma cleaning machine for semiconductor processing described in the present invention, a stabilizing block is fixed at the bottom of the support ring, the movable rod is movably connected to the inside of the stabilizing block, a connecting block is fixed at the top of the movable rod, a third spring is fixed on one side of the connecting block, and the other end of the third spring is fixed to the stabilizing block.

[0013] As a preferred solution of the plasma cleaning machine for semiconductor processing described in the present invention, a mounting block is fixed to the bottom of the clamping block, and an elastic block is fixed to one side of the mounting block.

[0014] As a preferred solution of the plasma cleaning machine for semiconductor processing of the present invention, there are two limit blocks, which are respectively fixed on both sides of the bottom of the movable plate.

[0015] As a preferred solution of the plasma cleaning machine for semiconductor processing of the present invention, there are two baffles, which are respectively located on both sides of the interior of the support ring.

[0016] The beneficial effect of the present invention is that, by setting the fixing assembly, when disassembling and installing and fixing the gun head, multiple components can be disassembled or fixed at one time, thereby reducing maintenance time and avoiding the situation where the fixation of a certain component is missed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort. Among them:

[0018] Figure 1 This is an overall diagram of a plasma cleaning machine used in semiconductor processing.

[0019] Figure 2 This is a diagram of the main structure of a plasma cleaning machine used for semiconductor processing.

[0020] Figure 3 This is a partial cross-sectional structural diagram of the outer sleeve of a plasma cleaning machine used for semiconductor processing.

[0021] Figure 4 For plasma cleaning machines used in semiconductor processing Figure 3 A partial enlarged structural diagram of point A in the middle.

[0022] Figure 5 This is a cross-sectional structural diagram of the outer sleeve of a plasma cleaning machine used for semiconductor processing.

[0023] Figure 6 For plasma cleaning machines used in semiconductor processing Figure 5 A partial enlarged structural diagram of point B in the middle.

[0024] Figure 7 For plasma cleaning machines used in semiconductor processing Figure 5 A partial enlarged structural diagram at point C in the middle.

[0025] Figure 8 This is a structural diagram of the fixed sleeve of a plasma cleaning machine used in semiconductor processing.

[0026] Figure 9 A structural diagram of the shielding component of a plasma cleaning machine used in semiconductor processing.

[0027] Figure 10 This is a cross-sectional structural diagram of the installation sleeve of a plasma cleaning machine used in semiconductor processing.

[0028] In the figure: 100, main assembly; 107, machine body; 101, main machine; 102, connecting sleeve; 103, insulating sleeve; 108, inner electrode; 109, gun head; 110, electrode; 104, inner sleeve; 105, outer sleeve; 106, nozzle; 200, fixing assembly; 201, extrusion ring; 202, extrusion column; 203, mounting sleeve; 204, clamping block; 205, fixing sleeve; 205-1, positioning groove; 206, positioning shaft; 207, extrusion member; 207a, extrusion plate; 105-1, movable groove; 207b, movable column; 205-2, guide groove; 300, shielding assembly; 301, support ring; 302, baffle; 304, guide ring; 303, pusher; 303a, moving rod; 303b, extrusion block; 303c, force-bearing rod; 303d, extrusion rod; 208, locking member; 208a, support frame; 208b, movable plate; 208c, limit block; 208d, first spring; 202-1, support block; 202-2, fixed block; 202-3, second spring; 303e, stabilizing block; 303f, connecting block; 303g, third spring; 204-1, mounting block; 204-2, elastic block. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0030] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0031] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0032] Example 1

[0033] Reference Figure 1-Figure 5, which is the first embodiment of the present invention, provides a plasma cleaning machine for semiconductor processing. The plasma cleaning machine for semiconductor processing includes a main body component 100, including a body 107, a host 101 is arranged in the body 107 and can move inside the body 107, and a conveying track is provided inside the body 107 for conveying semiconductors to be cleaned, so that the host 101 can drive the spray gun to clean the semiconductors.

[0034] The main unit 101 has a connecting sleeve 102 fixed at the bottom, an insulating sleeve 103 is provided at the bottom of the connecting sleeve 102, an inner electrode 108 is fixed inside the insulating sleeve 103, a gun head 109 is fixed at the bottom of the inner electrode 108, and an electrode 110 is provided inside the body 107. During installation, the electrode 110 is inserted into the gun head 109 through the inner electrode 108 to complete the connection between the two.

[0035] An inner sleeve 104 is sleeved on the outside of the insulating sleeve 103, and the inner sleeve 104 is used to fix the insulating sleeve 103. An outer sleeve 105 is sleeved on the outside of the inner sleeve 104, and the outer sleeve 105 is used to fix the nozzle 106 and wrap the inner sleeve 104 inside. A nozzle 106 is set at the bottom of the outer sleeve 105.

[0036] The above are all existing technologies, and this solution will not be elaborated in detail. Those skilled in the art can clearly understand the working principle.

[0037] A slide groove is provided on one side of the insulating sleeve 103, and a slider is fixed to the inner wall of the inner sleeve 104. When installing the inner sleeve 104, the slider is inserted into the slide groove to lock the position of the inner sleeve 104 and the insulating sleeve 103 to avoid misalignment between the two after installation.

[0038] The fixing assembly 200 is arranged in the outer sleeve 105, and includes an extrusion ring 201 fixed to the inner wall of the outer sleeve 105. The inner side of the extrusion ring 201 is inclined, and the inner inclined surface squeezes the end of the extrusion column 202. The extrusion column 202 is provided at the bottom of the inner sleeve 104, and a socket is opened on the gun head 109. After the extrusion column 202 is squeezed, it will enter the socket and squeeze the electrode 110 head, so that the electrode 110 can be fixed to the gun head 109.

[0039] A mounting sleeve 203 is fixed inside the outer sleeve 105, and a clamping block 204 is provided inside the mounting sleeve 203. There are four clamping blocks 204, which are evenly distributed in a ring shape inside the mounting sleeve 203. A clamping groove begins to be provided on the nozzle 106, and the side of the clamping block 204 close to the clamping groove is inclined.

[0040] After the nozzle 106 is inserted into the outer sleeve 105, it will be tightly connected to the inside of the mounting sleeve 203 and will not fall off easily. When the block 204 moves into the slot, its inclined surface will squeeze the inner wall of the slot and push the nozzle 106 to move upward, thereby making the connection between the nozzle 106 and the outer sleeve 105 tighter. When the block 204 is engaged with the slot, the nozzle 106 can be fixed by the cooperation of the two.

[0041] A fixing sleeve 205 is fixed to the bottom of the host 101, and a positioning groove 205-1 is provided on the fixing sleeve 205. The positioning groove 205-1 consists of three shapes, namely vertical, upwardly inclined and horizontal. A positioning shaft 206 is fixed to one side of the outer sleeve 105. When the outer sleeve 105 is inserted into the fixing sleeve 205, the positioning shaft 206 will first move inside the vertical positioning groove 205-1. At this time, the outer sleeve 105 will move vertically upward, and then the positioning shaft 206 will enter the upwardly inclined positioning groove 205-1. At this time, the outer sleeve 105 will move upward in the direction of rotation. After the positioning shaft 206 enters the horizontal positioning groove 205-1, the outer sleeve 105 will be tightly fixed to the bottom of the host 101. Finally, the outer sleeve 105 can be rotated and locked.

[0042] Example 2

[0043] Reference Figures 6-10 , which is the second embodiment of the present invention, and is based on the previous embodiment.

[0044] Specifically, the fixing assembly 200 further includes an extrusion member 207 , which includes an extrusion plate 207 a located inside the mounting sleeve 203 . The extrusion plate 207 a is annular, the top of the clamping block 204 is inclined, and the bottom of the extrusion plate 207 a contacts the inclined surface of the top of the clamping block 204 .

[0045] A movable groove 105-1 is provided on the outer sleeve 105, and a movable column 207b is movably connected in the movable groove 105-1. There are two movable columns 207b and two movable grooves 105-1, which are respectively located on both sides of the inner side of the outer sleeve 105. The shape of the movable column 207b is adapted to the shape of the movable groove 105-1. The top and bottom ends of the movable column 207b are both L-shaped, and corresponding through holes are provided above and below the movable groove 105-1. The top and bottom ends of the movable column 207b extend to the outside through the two through holes respectively, and can move up and down in the through holes.

[0046] A guide groove 205-2 is provided on the inner side of the fixed sleeve 205. The top of the movable column 207b slides in the guide groove 205-2, and the bottom end is fixed to the extrusion plate 207a. The guide groove 205-2 consists of three shapes. The first two shapes are consistent with the positioning groove 205-1, and the last shape is tilted downward.

[0047] Therefore, when the outer sleeve 105 rotates, the top of the movable column 207b moves downward along the guide groove 205-2, and drives the extrusion plate 207a to move downward, so that the extrusion plate 207a presses the top inclined surface of the block 204, thereby moving the block 204 into the slot.

[0048] Specifically, it also includes a shielding component 300, which is arranged in the outer sleeve 105, including a support ring 301 fixed inside the outer sleeve 105. The outer side of the support ring 301 is annular and the inner side is rectangular. A baffle 302 is rotatably connected inside the support ring 301. There are two baffles 302, which are located on both sides of the support ring 301. The two support rings 301 are rotatably connected to the support ring 301 through a rotating shaft.

[0049] When the nozzle 106 stops working, the baffle 302 will be in a horizontal state and seal the inside of the outer sleeve 105 from the outside. This can prevent external dust or impurities from entering the inside of the outer sleeve 105 through the nozzle 106 during the shutdown process, which will cause the internal gun head 109 or electrode to be contaminated and affect its normal use.

[0050] When the nozzle 106 starts to work, the gas generated inside the outer sleeve 105 will open the baffle 302 downward, so it will not hinder the normal use of the nozzle 106.

[0051] A guide ring 304 is fixed on the top of the support ring 301 . The inner side of the guide ring 304 is inclined to guide the ejected material so that it can move downward to avoid impacting the top of the support ring 301 .

[0052] Specifically, the shielding assembly 300 also includes a pushing member 303, the number of which corresponds to the baffle 302, and the pushing member 303 includes a moving rod 303a located below the support ring 301, and an extrusion block 303b is fixed to the bottom of the baffle 302. The extrusion block 303b is semicircular and contacts the end of the moving rod 303a. A force-bearing rod 303c is fixed on one side of the moving column 207b, and a through groove is opened on one side of the movable groove 105-1. The force-bearing rod 303c can move up and down in the through groove, and one end of the force-bearing rod 303c is inclined. An extrusion rod 303d is fixed to the end of the moving rod 303a, and the bottom of the extrusion rod 303d is inclined.

[0053] When the moving column 207b drives the extrusion plate 207a to move downward, the inclined surface of the force-bearing rod 303c will contact the inclined surface of the extrusion rod 303d. When the baffle 302 rotates downward, the moving rod 303a will be pushed to move through the extrusion block 303b. The moving rod 303a drives the extrusion rod 303d to squeeze the inclined surface of the force-bearing rod 303c, so that the force-bearing rod 303c can drive the moving column 207b to move further downward, so that the extrusion plate 207a can squeeze the block 204 more tightly, thereby improving the fixing effect of the nozzle 106.

[0054] At the same time, when the movable column 207b moves downward, it will drive the outer sleeve 105 to rotate slightly with the cooperation of the guide groove 205-2, thereby further improving the fixing effect of the outer sleeve 105.

[0055] Specifically, the fixing assembly 200 also includes a locking member 208, which includes a support frame 208a fixed to one side of the fixing sleeve 205, and a movable plate 208b is movably connected inside the support frame 208a. One side of the movable plate 208b extends to the outside of the support frame 208a and can move up and down inside the support frame 208a. A limit block 208c is fixed at the bottom of the movable plate 208b. There are two limit blocks 208c, which are respectively fixed on both sides of the bottom of the movable plate 208b. One side of the two limit blocks 208c is inclined, and a first spring 208d is fixed to the top of the movable plate 208b.

[0056] When the positioning shaft 206 moves horizontally in the positioning groove 205-1, it will contact the inclined surface of the limit block 208c and push the limit block 208c to move upward. The two limit blocks 208c move upward in sequence. When the positioning shaft 206 moves to the deep end of the positioning groove 205-1, the positioning shaft 206 can be limited by the limit block 208c, so that it cannot move outward, and the outer sleeve 105 can be locked to prevent the outer sleeve 105 from loosening.

[0057] If only the nozzle 106 needs to be replaced, the movable plate 208b is pushed upward, and the limit block 208c is driven to move upward. At this time, the positioning shaft 206 is moved toward the outside of the positioning groove 205-1 and moved between the two limit blocks 208c. At the same time, the movable column 207b will move upward along the guide groove 205-2 and drive the extrusion plate 207a to move upward, so that it is separated from the block 204, so that the block 204 can be separated from the slot, thereby releasing the fixation of the nozzle 106, and then the nozzle 106 can be replaced separately.

[0058] Specifically, a support block 202 - 1 is fixed to the bottom of the inner sleeve 104 , and the extrusion column 202 is movably connected to the support block 202 - 1 . The support block 202 - 1 is used to support and position the extrusion column 202 .

[0059] A fixed block 202-2 is fixed to the outside of the extrusion column 202, and a second spring 202-3 is fixed to one side of the fixed block 202-2. The other end of the second spring 202-3 is fixed to the support block 202-1. When the outer sleeve 105 is removed downward and the extrusion ring 201 is separated from the extrusion column 202, the second spring 202-3 can push the fixed block 202-2 and the extrusion column 202 to move, thereby separating the extrusion column 202 from the socket.

[0060] Example 3

[0061] Reference Figures 1-10 , which is the third embodiment of the present invention, and is based on the first two embodiments.

[0062] Specifically, a stabilizing block 303e is fixed to the bottom of the support ring 301, and the moving rod 303a is movably connected to the stabilizing block 303e. The stabilizing block 303e is used to support and position the moving rod 303a.

[0063] A connecting block 303f is fixed to the top of the moving rod 303a, and a third spring 303g is fixed to one side of the connecting block 303f. The other end of the third spring 303g is fixed to the stabilizing block 303e. When the nozzle 106 stops working, the third spring 303g can pull the connecting block 303f and the moving rod 303a to move in the opposite direction, so that the moving rod 303a pushes the extrusion block 303b and the baffle 302 to rotate upward, and closes the baffle 302.

[0064] Specifically, a mounting block 204-1 is fixed to the bottom of the card block 204, and an elastic block 204-2 is fixed to one side of the mounting block 204-1. The mounting block 204-1 is used to fix the elastic block 204-2. When the extrusion plate 207a is separated from the card block 204, the elastic block 204-2 can push the mounting block 204-1 and the card block 204 to move, thereby separating the card block 204 from the card slot.

[0065] During installation, after the gun head 109 is fixed to the insulating sleeve 103, the insulating sleeve 103 is fitted with the bottom of the connecting sleeve 102, and the inner sleeve 104 is put on the outside of the insulating sleeve 103, and then the outer sleeve 105 is put on the outside of the inner sleeve 104. When the outer sleeve 105 moves, it will drive the extrusion ring 201 to squeeze the extrusion column 202. After the extrusion column 202 is squeezed, it will enter the socket and squeeze the electrode 110 head, so that the electrode 110 can be fixed to the gun head 109. At the same time, the extrusion ring 201 will contact the bottom of the inner sleeve 104 and squeeze the inner sleeve 104, thereby completing the fixation of the inner sleeve 104 and the insulating sleeve 103.

[0066] At the same time, when the outer sleeve 105 rotates, the top of the moving column 207b moves downward along the guide groove 205-2, and drives the extrusion plate 207a to move downward, so that the extrusion plate 207a squeezes the top inclined surface of the block 204, and the block 204 moves into the slot. When the block 204 moves into the slot, its inclined surface squeezes the inner wall of the slot and pushes the nozzle 106 to move upward, so that the connection between the nozzle 106 and the outer sleeve 105 can be tightened. 4 is engaged with the card slot, the nozzle 106 can be fixed by the cooperation of the two. When maintenance and disassembly are required, the outer sleeve 105 can be removed. Therefore, after the outer sleeve 105 is fixed and disassembled, the inner sleeve 104, the insulating sleeve 103, the electrode 110 and the gun head 109 and the nozzle 106 can be fixed and disassembled at the same time, thereby improving the disassembly and installation efficiency, thereby reducing the maintenance time, and in the process, it can also avoid the omission of fixing a certain component.

[0067] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A plasma cleaning machine for semiconductor processing, characterized in that: include, The main body component (100) comprises a main body (101), a connecting sleeve (102) is fixed at the bottom of the main body (101), an insulating sleeve (103) is provided at the bottom of the connecting sleeve (102), an inner sleeve (104) is provided on the outer side of the insulating sleeve (103), an outer sleeve (105) is provided on the outer side of the inner sleeve (104), and a nozzle (106) is provided at the bottom of the outer sleeve (105); A fixing assembly (200) is arranged in the outer sleeve (105), comprising an extrusion ring (201) fixed to the inner wall of the outer sleeve (105), an extrusion column (202) is provided at the bottom of the inner sleeve (104), a mounting sleeve (203) is fixed in the outer sleeve (105), a clamping block (204) is provided in the mounting sleeve (203), a fixing sleeve (205) is fixed at the bottom of the main machine (101), a positioning groove (205-1) is provided on the fixing sleeve (205), and a positioning shaft (206) is fixed on one side of the outer sleeve (105).

2. The plasma cleaning machine for semiconductor processing according to claim 1, wherein: The fixing assembly (200) further includes an extrusion member (207), the extrusion member (207) including an extrusion plate (207a) located inside the mounting sleeve (203), a movable groove (105-1) is provided on the outer sleeve (105), a movable column (207b) is movably connected in the movable groove (105-1), a guide groove (205-2) is provided on the inner side of the fixing sleeve (205), the top end of the movable column (207b) slides in the guide groove (205-2), and the bottom end is fixed to the extrusion plate (207a).

3. The plasma cleaning machine for semiconductor processing according to claim 2, wherein: It also includes a shielding assembly (300) which is arranged in the outer sleeve (105) and includes a support ring (301) fixed inside the outer sleeve (105), a baffle (302) rotatably connected inside the support ring (301), and a guide ring (304) fixed on the top of the support ring (301).

4. The plasma cleaning machine for semiconductor processing according to claim 3, wherein: The shielding assembly (300) further comprises a pushing member (303), the pushing member (303) comprising a moving rod (303a) located below the supporting ring (301), an extrusion block (303b) being fixed to the bottom of the baffle (302), a force-bearing rod (303c) being fixed to one side of the moving column (207b), and an extrusion rod (303d) being fixed to the end of the moving rod (303a).

5. The plasma cleaning machine for semiconductor processing according to claim 4, wherein: The fixing assembly (200) further includes a locking member (208), the locking member (208) including a support frame (208a) fixed to one side of the fixing sleeve (205), a movable plate (208b) movably connected within the support frame (208a), a limiting block (208c) fixed at the bottom of the movable plate (208b), and a first spring (208d) fixed at the top of the movable plate (208b).

6. The plasma cleaning machine for semiconductor processing according to claim 5, wherein: A support block (202-1) is fixed to the bottom of the inner sleeve (104); the extrusion column (202) is movably connected to the inside of the support block (202-1); a fixed block (202-2) is fixed to the outside of the extrusion column (202); a second spring (202-3) is fixed to one side of the fixed block (202-2); and the other end of the second spring (202-3) is fixed to the support block (202-1).

7. The plasma cleaning machine for semiconductor processing according to claim 5 or 6, characterized in that: A stabilizing block (303e) is fixed to the bottom of the support ring (301), the moving rod (303a) is movably connected to the inside of the stabilizing block (303e), a connecting block (303f) is fixed to the top of the moving rod (303a), a third spring (303g) is fixed to one side of the connecting block (303f), and the other end of the third spring (303g) is fixed to the stabilizing block (303e).

8. The plasma cleaning machine for semiconductor processing according to claim 7, wherein: A mounting block (204-1) is fixed to the bottom of the clamping block (204), and an elastic block (204-2) is fixed to one side of the mounting block (204-1).

9. The plasma cleaning machine for semiconductor processing according to claim 8, wherein: There are two limit blocks (208c), which are respectively fixed on both sides of the bottom of the movable plate (208b).

10. The plasma cleaning machine for semiconductor processing according to claim 8 or 9, characterized in that: There are two baffles (302), which are respectively located on both sides of the interior of the support ring (301).

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