Wafer anti-mixing baking method and wafer anti-mixing baking system

Abstract

The invention provides a wafer anti-mixing baking method and a wafer anti-mixing baking system, a source piece box and a metal piece box are used, a first identification code is arranged on the source piece box, and a second identification code is arranged on the metal piece box. The anti-mixing baking method comprises the following steps: providing a source wafer box bearing a wafer to be baked; identifying the first identification code of the source film box to obtain first information; identifying a second identification code of the metal sheet box to obtain second information; binding the first information and the second information; transferring the wafers in the source wafer box corresponding to the first information to a metal sheet box corresponding to the second information, and transferring the metal sheet box to a drying oven; after baking is finished, taking out the metal sheet box and cooling; scanning a second identification code of the metal sheet box to obtain second information, and matching the second information with the first information; and transferring the wafer in the metal sheet box corresponding to the second information to the source sheet box corresponding to the first information. According to the technical scheme, the identification codes are added to the source sheet box and the metal sheet box, and an identification and matching mechanism is introduced, so that the problem of material mixing of the wafers in the baking process is effectively solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer anti-mixing baking method and a wafer anti-mixing baking system. Background Art

[0002] In the field of semiconductor packaging, the application of ovens is a crucial link. In order to complete the baking process, factories generally use wafer transfer machines to transfer wafers between plastic cassettes and metal cassettes. The plastic cassette is equipped with an identification code to record the manufacturing information of the wafer it carries, ensuring the integrity and traceability of the information. However, after baking, the wafer must be accurately placed back in the original plastic cassette to maintain the consistency of the identification code and wafer information.

[0003] Despite this, existing technologies have obvious deficiencies in the wafer baking and transfer process. Since wafers need to be transferred multiple times, workers usually rely on memory to match the correspondence between wafers and plastic cassettes. After multiple metal cassettes carrying wafers enter the oven for baking at the same time, the inaccuracy of manual memory can easily lead to the wrong placement of wafers during the subsequent transfer of wafers from the metal cassettes back to the plastic cassettes, causing wafer mixing problems. This situation not only increases production costs, but may also lead to difficulties in information traceability, affecting the efficiency and accuracy of the entire semiconductor manufacturing process. Summary of the invention

[0004] The purpose of the present application is to provide a wafer anti-mixing baking method and a wafer anti-mixing baking system, which effectively solves the problem of wafer mixing during the baking process by adding identification codes to the source wafer cassette and the metal wafer cassette and introducing an identification and matching mechanism.

[0005] The present application provides a wafer mixing prevention baking method, which uses a source wafer cassette and a metal wafer cassette, wherein a first identification code is provided on the body of the source wafer cassette, and a second identification code is provided on the body of the metal wafer cassette; the wafer mixing prevention baking method comprises:

[0006] S0, providing a source cassette carrying wafers to be baked;

[0007] S1, identifying a first identification code of a source cassette to obtain first information;

[0008] S2, identifying the second identification code of the metal sheet box to obtain second information;

[0009] S3, binding the first information with the second information;

[0010] S4, transferring the wafers in the source wafer cassette corresponding to the first information to the metal wafer cassette corresponding to the second information, and then transferring the metal wafer cassette to the oven;

[0011] S5. After the oven operation is completed, take out the metal sheet box and wait for cooling;

[0012] S6. Scan the second identification code of the metal sheet box to obtain second information, and match the first information bound to the second information;

[0013] S7, transferring the wafers in the metal wafer cassette corresponding to the second information to the source wafer cassette corresponding to the first information.

[0014] In an practicable solution, after transferring the wafers in the metal wafer cassette corresponding to the second information to the source wafer cassette corresponding to the first information, the method further includes:

[0015] The second information of the current metal sheet box is unbound from the first information of the corresponding source sheet box.

[0016] In an implementable scheme, the first information obtained from the first identification code of the source sheet box includes at least the source sheet box number information, and the second information obtained from the second identification code of the metal sheet box includes at least the metal sheet box number information; the step of binding the first information with the second information includes: binding the source sheet box number information contained in the first information with the metal sheet box number information contained in the second information.

[0017] In an implementable solution, the step of identifying the first identification code of the source cassette to obtain the first information further includes: storing the source cassette number information in the obtained first information of all source cassettes in a source cassette number database.

[0018] In an implementable solution, the step of matching the first information bound to the second information includes:

[0019] Extracting the metal sheet box number information in the second information;

[0020] The source sheet cassette number database is traversed to find the source sheet cassette number information bound to the metal sheet cassette number information, thereby completing the matching of the second information with the first information.

[0021] In a second aspect, the present application also provides a wafer anti-mixing baking system, including a first material rack, a second material rack, an oven, a first robot, a second robot, a code scanning device and a main control device.

[0022] Among them, a source sheet cassette is placed on the first material rack, and a first identification code is set on the body of the source sheet cassette. The second material rack is used to place a metal sheet cassette, and a second identification code is set on the body of the metal sheet cassette. The oven is set on one side of the second material rack. The first manipulator is set between the first material rack and the second material rack, and is used to transfer wafers between the source sheet cassette and the metal sheet cassette. The second manipulator is set between the second material rack and the oven, and is used to transfer the metal sheet cassette between the second material rack and the oven. The code scanning device is used to scan the first identification code of the source sheet cassette to obtain first information, and is used to scan the second identification code of the metal sheet cassette to obtain second information. The main control device is communicatively connected with the code scanning device, the first manipulator and the second manipulator.

[0023] In an implementable solution, the first identification code of the source cassette is a bar code or a two-dimensional code, and the second identification code of the metal cassette is a bar code or a two-dimensional code.

[0024] In an implementable solution, the code scanning device is installed at the end of the first robot.

[0025] In an implementable solution, the code scanning device includes a first code scanning device and a second code scanning device; the first code scanning device is arranged next to the first material rack, and is used to scan the first identification code of the source sheet box; the second code scanning device is arranged next to the second material rack, and is used to scan the second identification code of the metal sheet box.

[0026] In an implementable scheme, the first material rack is provided with a first conveying mechanism and a first upper and lower material position arranged on the first conveying mechanism, and the first code scanning device is arranged at the first upper and lower material position; the second material rack is provided with a second conveying mechanism and a second upper and lower material position arranged on the second conveying mechanism, and the second code scanning device is arranged at the second upper and lower material position.

[0027] Compared with the prior art, the beneficial effects of this application include at least:

[0028] The wafer anti-mixing baking method and system of the present application effectively solves the problem of wafer mixing during the baking process by adding identification codes to the source wafer cassette and the metal wafer cassette and introducing an identification and matching mechanism. The core of the method is to use the first identification code on the source wafer cassette and the second identification code on the metal wafer cassette to bind and match each other. When the wafer is baked out of the oven and the source wafer cassette is transferred from the metal wafer cassette, it can ensure that the wafer is moved to the original source wafer cassette, thereby preventing the problem of mixing materials, and then ensuring the accurate matching and traceability of the wafer during the entire baking process. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a flow chart of a wafer anti-mixing baking method according to an embodiment of the present application;

[0031] Figure 2 It is a schematic diagram of the composition of a wafer mixing prevention baking system according to an embodiment of the present application;

[0032] Figure 3 The figure is a schematic diagram of the composition of another wafer anti-mixing baking system according to an embodiment of the present application.

[0033] In the figure: 1. First material rack; 11. Source sheet box; 12. First conveying mechanism; S1. First upper and lower material positions; 2. Second material rack; 21. Metal sheet box; 22. Second conveying mechanism; S2. Second upper and lower material positions; 3. Oven; 4. First manipulator; 5. Second manipulator; 6. Code scanning device; 61. First code scanning device; 62. Second code scanning device; 7. Main control device. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0036] The embodiment of the present application first provides a wafer mixing prevention baking method, which uses a source wafer cassette and a metal wafer cassette, and is characterized in that a first identification code is set on the body of the source wafer cassette, and a second identification code is set on the body of the metal wafer cassette.

[0037] like Figure 1 As shown, the wafer anti-mixing baking method includes:

[0038] S0, providing a source cassette carrying wafers to be baked;

[0039] S1, identifying a first identification code of a source cassette to obtain first information;

[0040] S2, identifying the second identification code of the metal sheet box to obtain second information;

[0041] S3, binding the first information with the second information;

[0042] S4, transferring the wafers in the source wafer cassette corresponding to the first information to the metal wafer cassette corresponding to the second information, and then transferring the metal wafer cassette to the oven;

[0043] S5. After the oven operation is completed, take out the metal sheet box and wait for cooling;

[0044] S6. Scan the second identification code of the metal sheet box to obtain second information, and match the first information bound to the second information;

[0045] S7, transferring the wafers in the metal wafer cassette corresponding to the second information to the source wafer cassette corresponding to the first information.

[0046] The wafer anti-mixing baking method of the present application effectively solves the problem of wafer mixing during the baking process by adding identification codes to the source wafer cassette and the metal wafer cassette and introducing a specific identification mechanism. The core of the method is to use the first identification code on the source wafer cassette and the second identification code on the metal wafer cassette to bind and match each other, thereby ensuring that the wafer is baked out of the oven, and when the source wafer cassette is transferred from the metal wafer cassette, it can ensure that the wafer is moved to the original source wafer cassette, thereby preventing the problem of mixing, and then ensuring the accurate matching and traceability of the wafer during the entire baking process.

[0047] Specifically, in step S0, a source cassette carrying the wafer to be baked is provided. Then, in steps S1 and S2, the identification codes on the source cassette and the metal cassette are respectively identified, and the first information and the second information corresponding thereto are obtained. The acquisition of these two information is the key to achieving the subsequent accurate transfer and matching of the wafer. In step S3, the first information is bound to the second information to establish a connection between the wafer and its original carrier. This step is the core link to prevent mixing of materials and ensures the identity identification of the wafer during the transfer process. Step S4 involves transferring the wafer from the source cassette to the metal cassette and baking it. Since the information has been bound, even if multiple metal cassettes are baked at the same time, the original information of the wafer carried by the metal cassette will not be lost. After baking is completed, the metal cassette is taken out in step S5 and waits for cooling. In step S6, the second information is obtained by scanning the second identification code of the metal cassette and matching the first information bound thereto. This step ensures that the baked wafer can accurately find the corresponding source cassette. In step S7, the wafer is transferred from the metal cassette back to the matching source cassette. This process completely solves the problem of incorrect placement caused by human memory bias and ensures the consistency of the wafer and plastic cassette identification code information.

[0048] The information binding and matching technology of the present application and the embodiments of the present application not only improve the accuracy and reliability of the wafer baking process, but also reduce the errors of manual operation, reduce production costs, and improve production efficiency. In addition, this method also enhances the traceability of wafer manufacturing information, providing strong technical support for the optimization and quality control of semiconductor packaging processes.

[0049] In one embodiment, in step S7, after transferring the wafers in the metal sheet tray corresponding to the second information to the source sheet tray corresponding to the first information, the process may further include: unbinding the second information of the current metal sheet tray from the first information of the corresponding source sheet tray. Thus, the metal sheet tray can carry other wafers again and perform the next baking operation.

[0050] In one embodiment, in step S1, the first information obtained from the first identification code of the source cassette includes at least the source cassette number information. In step S2, the second information obtained from the second identification code of the metal cassette includes at least the metal cassette number information. In step S3, the step of binding the first information with the second information includes: binding the source cassette number information included in the first information with the metal cassette number information included in the second information.

[0051] In one embodiment, in step S1 , the step of identifying the first identification code of the source cassette to obtain the first information further includes: storing the source cassette number information in the obtained first information of all source cassettes in a source cassette number database.

[0052] In one embodiment, in step S6, the step of matching the first information bound to the second information includes:

[0053] Extracting the metal sheet box number information in the second information;

[0054] The source sheet cassette number database is traversed to find the source sheet cassette number information bound to the metal sheet cassette number information, thereby completing the matching of the second information with the first information.

[0055] like Figure 2 As shown, an embodiment of the present application also provides a wafer anti-mixing baking system, including a first material rack 1, a second material rack 2, an oven 3, a first robot 4, a second robot 5, a code scanning device 6 and a main control device 7.

[0056] The first material rack 1 is provided with a source sheet tray 11, and a first identification code is set on the body of the source sheet tray 11. The second material rack 2 is used to place a metal sheet tray 21, and a second identification code is set on the body of the metal sheet tray 21. The oven 3 is set on one side of the second material rack 2.

[0057] The first robot 4 is disposed between the first material rack 1 and the second material rack 2, and is used to transfer wafers between the source wafer tray 11 and the metal wafer tray 21. The second robot 5 is disposed between the second material rack 2 and the oven 3, and is used to transfer the metal wafer tray 21 between the second material rack 2 and the oven 3.

[0058] The code scanning device 6 is used to scan the first identification code of the source sheet magazine 11 to obtain the first information, and is used to scan the second identification code of the metal sheet magazine 21 to obtain the second information. The main control device 7 is in communication connection with the code scanning device 6, the first manipulator 4 and the second manipulator 5.

[0059] In the wafer mixing prevention baking system of the present application, when working, the main control device 7 identifies the first identification code of the source sheet cassette 11 through the code scanning device 6 to obtain and store the first information. The main control device 7 identifies the second identification code of the metal sheet cassette 21 through the code scanning device 6 to obtain and store the second information. The main control device 8 binds the first information with the second information.

[0060] Furthermore, the main control device 7 controls the first robot 4 to move, transfer the wafers in the source tray 11 corresponding to the first information to the metal tray 21 corresponding to the second information, and then controls the second robot 5 to transfer the metal tray 21 to the oven 3 .

[0061] Furthermore, after the operation of the oven 3 is completed, the second manipulator 5 takes out the metal sheet tray 21 and waits for cooling. The main control device 7 scans the second identification code of the metal sheet tray 21 again through the code scanning device 6 to obtain the second information, and matches the first information bound to the second information. The main control device 7 controls the second manipulator 5 to transfer the wafers in the metal sheet tray 21 corresponding to the second information to the source sheet tray 11 corresponding to the first information, completing the entire baking operation process.

[0062] In summary, the wafer anti-mixing baking system of the present application adds identification codes to the source wafer cassette and the metal wafer cassette, and introduces a specific identification mechanism, using the first identification code on the source wafer cassette and the second identification code on the metal wafer cassette to bind and match each other, thereby ensuring that the wafer is baked out of the oven, and when the source wafer cassette is transferred from the metal wafer cassette, it can be ensured that the wafer is moved to the original source wafer cassette, thereby preventing the problem of mixing materials, and further ensuring the accurate matching and traceability of the wafer during the entire baking process.

[0063] In one embodiment, the first identification code of the source magazine 11 may be a barcode or a two-dimensional code, and the second identification code of the metal sheet magazine 21 may be a barcode or a two-dimensional code.

[0064] In one embodiment, if Figure 2 As shown, the code scanning device 6 can be installed at the end of the first manipulator 4. When identifying the first identification code of the source sheet cassette 11, the main control device 7 controls the end of the first manipulator 4 to approach the source sheet cassette 11, and the code scanning device 6 identifies the first identification code of the source sheet cassette 11 to obtain the first information. When identifying the second identification code of the metal sheet cassette 21, the main control device 7 controls the end of the first manipulator 4 to approach the metal sheet cassette 21, and the code scanning device 6 identifies the second identification code of the metal sheet cassette 21 to obtain the second information.

[0065] In one embodiment, if Figure 3 As shown, the code scanning device 6 may include a first code scanning device 61 and a second code scanning device 62. The first code scanning device 61 is disposed next to the first material rack 1 and is used to scan the first identification code of the source sheet cassette 11. The second code scanning device 62 is disposed next to the second material rack 2 and is used to scan the second identification code of the metal sheet cassette 21.

[0066] When identifying the first identification code of the source sheet tray 11, the source sheet tray 11 is placed at the first code scanning device 61 manually or by the first robot 4, and the first code scanning device 61 identifies the first identification code of the source sheet tray 11 to obtain the first information. When identifying the second identification code of the metal sheet tray 21, the metal sheet tray 21 is placed at the second code scanning device 62 manually or by the first robot 4, and the second code scanning device 62 identifies the second identification code of the metal sheet tray 21 to obtain the second information.

[0067] In addition, in one embodiment, the first material rack 1 may be provided with a first conveying mechanism 12 and a first upper and lower material position S1 provided on the first conveying mechanism 12, and the first code scanning device 61 is provided at the first upper and lower material position S1. The second material rack 2 may be provided with a second conveying mechanism 22 and a second upper and lower material position S2 provided on the second conveying mechanism 22, and the second code scanning device 62 is provided at the second upper and lower material position S2.

[0068] Thus, during operation, the wafer to be baked is carried by the source wafer cassette 11 and transported to the first loading and unloading position S1 by the first conveying mechanism 12, and the first code scanning device 61 at the first loading and unloading position S1 scans the first identification code of the source wafer cassette 11 to obtain the first information. For the wafer baked in the oven, the second robot 5 places the metal sheet cassette 21 on the second conveying mechanism 22, and transports it to the second loading and unloading position S2, and the second code scanning device 62 at the second loading and unloading position S2 scans the second identification code of the metal sheet cassette 21 to obtain the second information.

[0069] It should be noted that there may be multiple carrying positions on the second conveying mechanism 22 of the second material rack 2. Among them, after the metal sheet tray 21 taken out from the oven is scanned by the second barcode scanning device 62 at the second loading and unloading position S2, it can be transported to other carrying positions by the second conveying mechanism 22 to wait for the wafers therein to be taken away by the first manipulator 4. The empty metal sheet tray 21 can also be transported to the second loading and unloading position S2 again and scanned by the second barcode scanning device 62, and then the wafers in the source tray 11 are transferred by the first manipulator 4.

[0070] The above description is only a partial embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer mixing prevention baking method, using a source wafer cassette and a metal wafer cassette, characterized in that: The body of the source cassette is provided with a first identification code, and the body of the metal cassette is provided with a second identification code; the wafer mixing prevention baking method comprises: Providing a source cassette carrying wafers to be baked; Identify a first identification code of the source cassette to obtain first information; Identify the second identification code of the metal sheet cassette to obtain second information; Binding the first information to the second information; Transferring the wafers in the source wafer cassette corresponding to the first information to the metal wafer cassette corresponding to the second information, and then transferring the metal wafer cassette to the oven; After the oven operation is completed, take out the metal sheet box and wait for it to cool down; Scan the second identification code of the metal sheet box to obtain the second information, and match the first information bound to the second information; The wafers in the metal wafer cassette corresponding to the second information are transferred to the source wafer cassette corresponding to the first information.

2. The wafer anti-mixing baking method according to claim 1, characterized in that: After transferring the wafers in the metal sheet cassette corresponding to the second information to the source sheet cassette corresponding to the first information, the method further includes: The second information of the current metal sheet box is unbound from the first information of the corresponding source sheet box.

3. The wafer anti-mixing baking method according to claim 1, characterized in that: The first information obtained from the first identification code of the source sheet cassette includes at least source sheet cassette number information, and the second information obtained from the second identification code of the metal sheet cassette includes at least metal sheet cassette number information; The step of binding the first information with the second information includes: binding the source sheet cassette number information included in the first information with the metal sheet cassette number information included in the second information.

4. The wafer anti-mixing baking method according to claim 3, characterized in that: The step of identifying the first identification code of the source cassette to obtain the first information further includes: storing the source cassette number information in the obtained first information of all source cassettes in a source cassette number database.

5. The wafer anti-mixing baking method according to claim 4, characterized in that: The step of matching the first information bound to the second information comprises: Extracting the metal sheet box number information in the second information; The source sheet cassette number database is traversed to find the source sheet cassette number information bound to the metal sheet cassette number information, thereby completing the matching of the second information with the first information.

6. A wafer mixing prevention baking system, characterized in that: include: A first material rack (1), on which a source film tray (11) is placed, and a first identification code is provided on the body of the source film tray (11); A second material rack (2) for placing a metal sheet box (21) thereon, wherein a second identification code is provided on the body of the metal sheet box (21); A drying oven (3) is arranged on one side of the second material rack (2); A first robot (4) is arranged between the first material rack (1) and the second material rack (2), and is used for transferring wafers between the source wafer cassette (11) and the metal wafer cassette (21); A second manipulator (5) is disposed between the second material rack (2) and the oven (3) and is used to transfer the metal sheet cassette (21) between the second material rack (2) and the oven (3); A code scanning device (6) for scanning a first identification code of the source sheet cassette (11) to obtain first information, and for scanning a second identification code of the metal sheet cassette (21) to obtain second information; A main control device (7) is communicatively connected with the code scanning device (6), the first manipulator (4) and the second manipulator (5).

7. The wafer mixing prevention baking system according to claim 6, characterized in that: The first identification code of the source sheet magazine (11) is a bar code or a two-dimensional code, and the second identification code of the metal sheet magazine (21) is a bar code or a two-dimensional code.

8. The wafer mixing prevention baking system according to claim 6, characterized in that: The code scanning device (6) is installed at the end of the first robot (4).

9. The wafer mixing prevention baking system according to claim 6, characterized in that: The code scanning device (6) comprises a first code scanning device (61) and a second code scanning device (62); The first code scanning device (61) is arranged beside the first material rack (1) and is used for scanning the first identification code of the source cartridge (11); The second code scanning device (62) is arranged beside the second material rack (2) and is used for scanning the second identification code of the metal sheet box (21).

10. The wafer mixing prevention baking system according to claim 9, characterized in that: The first material rack (1) is provided with a first conveying mechanism (12) and a first upper and lower material position (S1) arranged on the first conveying mechanism (12), and the first code scanning device (61) is arranged at the first upper and lower material position (S1); The second material rack (2) is provided with a second conveying mechanism (22) and a second upper and lower material position (S2) arranged on the second conveying mechanism (22), and the second code scanning device (62) is arranged at the second upper and lower material position (S2).

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