Semiconductor process chamber and semiconductor process apparatus

Abstract

The application discloses a semiconductor process chamber and a semiconductor process equipment. The semiconductor process chamber comprises a chamber body, a movable inner liner, a fixed inner liner and a supporting device arranged in the chamber body. The chamber body is provided with a wafer transmission hole. The movable inner liner is arranged in the chamber body in a lifting manner to switch between a raised position and a lowered position. The movable inner liner and the fixed inner liner are arranged around the supporting device. The fixed inner liner and the chamber body enclose an exhaust hole or the fixed inner liner is provided with the exhaust hole. When the movable inner liner is in the lowered position, the wafer transmission hole is communicated with a space surrounded by the movable inner liner, so that a wafer is transmitted onto the supporting device through the wafer transmission hole or transmitted out of the supporting device through the wafer transmission hole. When the movable inner liner is in the raised position, the movable inner liner, the chamber body and the fixed inner liner enclose a process space. The supporting device is located in the process space. The process space is sealed and isolated from the wafer transmission hole. The process space is communicated with the exhaust hole.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor process equipment, and particularly relates to a semiconductor process chamber and a semiconductor process equipment. BACKGROUND

[0002] In a chemical vapor deposition or chemical vapor etching process, a wafer is processed in a semiconductor process chamber. In order to protect the chamber wall of the semiconductor process chamber, the related art involves that an inner liner is installed in the semiconductor process chamber. Considering the wafer in-out requirement, the inner liner is provided with a wafer transmission hole and a lifting door is configured for the wafer transmission hole, and the lifting door can be lifted to realize the opening and closing of the wafer transmission hole. Before or after the process, the lifting door is opened, and the wafer can pass into or out of the inner liner through the wafer transmission hole, so as to realize wafer transmission. However, in order to avoid friction between the lifting door and the inner liner in the lifting process and cause particle pollution, the related art involves that a gap is provided between the inner liner and the lifting door, so that the lifting door does not come into contact with the inner liner in the lifting process. Although this structure can avoid particle pollution caused by abrasion, it will cause the lifting door and the inner liner to be not tightly sealed, and finally cause the process gas to not only be discharged from the pre-set exhaust hole of the inner liner, but also be discharged from the gap between the lifting door and the inner liner in the process, and finally easily cause the exhaust to be disordered.

[0003] Obviously, this is not conducive to the uniform distribution of the process gas in the semiconductor process chamber, resulting in poor process effect. SUMMARY

[0004] The application discloses a semiconductor process chamber and a semiconductor process equipment to solve the problem of poor process effect caused by uneven distribution of process gas in the semiconductor process chamber involved in the related art.

[0005] In order to solve the above technical problems, the application provides the following technical solutions:

[0006] In a first aspect, the application discloses a semiconductor process chamber, which comprises a chamber body, a movable inner liner, a fixed inner liner and a bearing device arranged in the chamber body, the chamber body is provided with a wafer transmission hole, the movable inner liner is arranged in the chamber body in a liftable manner to switch between a raised position and a lowered position; the movable inner liner and the fixed inner liner are arranged around the bearing device, and the fixed inner liner and the chamber body enclose an exhaust hole or the fixed inner liner is provided with an exhaust hole;

[0007] When the movable inner liner is in the lowered position, the wafer transmission hole is in communication with the space surrounded by the movable inner liner, so as to pass the wafer into the bearing device through the wafer transmission hole or pass the wafer out of the bearing device through the wafer transmission hole;

[0008] When the movable liner is in the raised position, the movable liner, the chamber body and the fixed liner enclose a process space, the carrier device is located in the process space, the process space is sealed from the wafer transfer hole, and the process space is in communication with the exhaust hole.

[0009] In a second aspect, the embodiments of the present application disclose a semiconductor process equipment, and the disclosed semiconductor process equipment comprises a robot and the semiconductor process chamber of the first aspect, and the robot is used for transferring the wafer onto or out of the carrier device through the wafer transfer hole when the movable liner is in the landing position.

[0010] The semiconductor process chamber disclosed by the embodiments of the present application improves the related art, so that the semiconductor process chamber comprises a movable liner and a fixed liner which are arranged around the carrier device, the wafer is transferred onto or out of the semiconductor process chamber through the wafer transfer hole by landing of the movable liner, and the process space formed when the movable liner is raised is sealed from the wafer transfer hole, so that the wafer transfer hole does not need to be arranged on the liner and the lifting door matched with the wafer transfer hole does not need to be arranged, thereby the process gas can be exhausted through the exhaust hole in the process, and the exhaust stability can be improved, and the uniform distribution of the process gas in the process space can be improved, and the process effect can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is a structural schematic diagram of the semiconductor process chamber disclosed by the embodiments of the present application;

[0012] Figure 2 is a partial enlarged schematic diagram in Figure 1 ;

[0013] Figure 3 is a schematic diagram of an exhaust process in part of the structure of Figure 1 ; Figure 3 the black arrow in indicates the exhaust direction in ;

[0014] Figure 4 is a structural schematic diagram of a movable liner disclosed by the embodiments of the present application;

[0015] Figure 5 is a structural schematic diagram of another movable liner disclosed by the embodiments of the present application;

[0016] Figure 6 is a structural schematic diagram of a driving mechanism of the semiconductor process chamber disclosed by the embodiments of the present application;

[0017] Figure 7 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application;

[0018] Figure 8 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application; Figure 7 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application;

[0019] Figure 9 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application;

[0020] Figure 10 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application; Figure 9 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application;

[0021] Figure 11 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application;

[0022] Figure 12 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application; Figure 11 is a structural schematic diagram of the fixed inner liner disclosed by the embodiment of the present application.

[0023] Explanation of reference signs:

[0024] 10 - chamber body, 11 - chamber shell, 111 - process gas input hole, 12 - gas distribution disc, 121 - gas distribution hole,

[0025] 20 - movable inner liner, 21 - annular body, 211 - first flange,

[0026] 30 - fixed inner liner, 31 - exhaust hole, 311 - groove, 312 - second flange,

[0027] 40 - bearing device,

[0028] 51 - first sealing ring, 52 - second sealing ring, 521 - first sealing segment, 522 - second sealing segment,

[0029] 61 - electric heating element, 62 - power supply wire,

[0030] 70 - guiding mechanism, 71 - guiding rod, 711 - first rod segment, 712 - second rod segment, 72 - first guiding sleeve assembly, 721 - first sealing flange, 722 - first linear bearing, 723 - first bearing flange, 724 - first end cover, 73 - third sealing ring,

[0031] 80 - driving mechanism, 81 - power source, 82 - jacking rod, 83 - fourth sealing ring, 84 - second guiding sleeve assembly, 841 - second sealing flange, 842 - second linear bearing, 843 - second bearing flange, 844 - second end cover,

[0032] 01 - process space, 011 - annular gap, 02 - gas distribution cavity, 03 - wafer. DETAILED DESCRIPTION

[0033] In order to make the objects, technical solutions and advantages of the present application clearer, the following will clearly and completely describe the technical solutions of the present application with reference to the specific embodiments and corresponding drawings of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0034] The technical solutions disclosed by the various embodiments of the present application will be described in detail below with reference to the drawings.

[0035] Please refer to Figures 1 to 12 The embodiments of the present application disclose a semiconductor process chamber, applied to a semiconductor process equipment. The disclosed semiconductor process chamber comprises a chamber body 10, a movable inner liner 20, a fixed inner liner 30 and a bearing device 40.

[0036] The chamber body 10 is the main peripheral component of the semiconductor process chamber. The chamber body 10 can at least provide a mounting base for other components of the semiconductor process chamber. In the embodiments of the present application, the movable inner liner 20, the fixed inner liner 30 and the bearing device 40 are all arranged in the chamber body 10. In addition, the chamber body 10 is also used to form some functional structures. In the embodiments of the present application, the chamber body 10 is provided with a wafer transmission hole. The wafer transmission hole can pass the wafer 03, so as to realize the wafer 03 entering and leaving the chamber body 10, and finally achieve the purpose of the wafer 03 entering and leaving the semiconductor process chamber.

[0037] The movable inner liner 20 is an inner liner arranged in the chamber body 10 and movable. The movable inner liner 20 is arranged in the chamber body 10 in a lifting manner to switch between a raised position and a lowered position. The fixed inner liner 30 is an inner liner fixedly arranged in the chamber body 10. In the embodiments of the present application, the movable inner liner 20 and the fixed inner liner 30 are both arranged around the bearing device 40, so as to form a structure for protecting the inner wall of the chamber body 10.

[0038] The bearing device 40 is used to bear the wafer 03, so that the wafer 03 can be placed on the bearing device 40 for processing, such as etching process or deposition process. In the embodiments of the present application, the bearing device 40 can be an electrostatic chuck, a vacuum adsorption chuck or the like, and the embodiments of the present application do not limit the specific type of the bearing device 40.

[0039] In the embodiments of the present application, the fixed inner liner 30 and the chamber body 10 surround an exhaust hole 31, or the fixed inner liner 30 is provided with the exhaust hole 31. The exhaust hole 31 is used for the exhaust of waste gas in the process.

[0040] When the movable inner liner 20 is in the lowered position, the wafer transfer hole is in communication with the space surrounded by the movable inner liner 20 for the wafer 03 to be transferred into or out of the carrier device 40 through the wafer transfer hole. When the movable inner liner 20 is in the lowered position, it is substantially in the pre-process preparation stage or post-process stage of the semiconductor process chamber, and the movable inner liner 20 is lowered to substantially open the wafer transfer hole so that the wafer transfer hole is in communication with the space surrounded by the movable inner liner 20, thereby transferring the wafer 03 into the carrier device 40 through the wafer transfer hole for pre-process preparation or taking the wafer 03 on the carrier device 40 out of the semiconductor process chamber after the process.

[0041] When the movable inner liner 20 is in the raised position, the movable inner liner 20, the chamber body 10 and the fixed inner liner 30 surround the process space 01, and the carrier device 40 is located in the process space 01, so that the wafer 03 placed on the carrier device 40 can be processed in the process space 01. The process space 01 is sealed from the wafer transfer hole, and the process space 01 is in communication with the exhaust hole 31. During the process, the process gas in the process space 01 is exhausted through the exhaust hole 31 after participating in the process. The process gas after participating in the process forms the exhaust gas described above.

[0042] Therefore, the movable inner liner 20 not only plays a role in surrounding the process space 01 to protect the inner wall of the chamber body 10, but also can replace the lifting door in the background art to realize the opening and closing control of the wafer transfer hole.

[0043] The semiconductor process chamber disclosed in the embodiment of the present application improves the related art, so that the semiconductor process chamber comprises a movable inner liner 20 and a fixed inner liner 30 which are arranged around the carrier device 40. The wafer 03 is transferred into or out of the semiconductor process chamber through the wafer transfer hole by lowering the movable inner liner 20, and the process space 01 formed when the movable inner liner 20 is raised is sealed from the wafer transfer hole, so that the wafer transfer hole does not need to be opened on the inner liner and the lifting door matched with the wafer transfer hole does not need to be arranged. Finally, during the process, the process gas is exhausted through the exhaust hole, but not from other places, so as to improve the stability of the exhaust, which is beneficial to the uniform distribution of the process gas in the process space 01 and improves the process effect.

[0044] In the embodiment of the present application, the structure of the chamber body 10 can be various. In one embodiment, the chamber body 10 can include a chamber shell 11 and a gas distribution plate 12. The wafer transfer hole can be formed on the chamber shell 11. The gas distribution plate 12 is arranged in the chamber shell 11. The gas distribution plate 12 is in sealing cooperation with the chamber shell 11 and encloses a gas distribution cavity 02. The chamber shell 11 is provided with a process gas input hole 111 which is in communication with the gas distribution cavity 02, so as to input the process gas into the gas distribution cavity 02. The gas distribution plate 12 is provided with a plurality of gas distribution holes 121. The gas distribution holes 121 are essentially gas inlet holes. The process gas is temporarily stored in the gas distribution cavity 02 from the process gas input hole 111. The gas distribution cavity 02 is also conducive to the flow stability of the process gas during the temporary storage process. The process gas in the gas distribution cavity 02 flows out through the plurality of gas distribution holes 121. The plurality of gas distribution holes 121 can make the process gas flow out from the gas distribution cavity 02 more dispersedly, thereby improving the uniformity of the process gas flow.

[0045] When the movable inner liner 20 is in the raised position, the movable inner liner 20 is in sealing cooperation with the gas distribution plate 12. The movable inner liner 20, the gas distribution plate 12, the fixed inner liner 30 and the chamber shell 11 enclose a process space 01. The plurality of gas distribution holes 121 are in communication with the gas distribution cavity 02 and the process space 01. In this case, the plurality of gas distribution holes 121 can make the process gas flow out from the gas distribution cavity 02 more dispersedly into the process space 01, which is conducive to the uniform distribution of the process gas in the process space 01. It should be noted that in this case, the process space 01 enclosed by the movable inner liner 20, the chamber body 10 and the fixed inner liner 30 is essentially enclosed by the movable inner liner 20, the gas distribution plate 12, the fixed inner liner 30 and the chamber shell 11.

[0046] In one embodiment, the gas distribution plate 12 can be arranged above the carrier device 40, so as to uniformly distribute the gas towards the carrier device 40. Specifically, the gas distribution plate 12 can be arranged on the top of the chamber shell 11 and in sealing cooperation with the inner wall of the top of the chamber shell 11 to enclose the gas distribution cavity 02.

[0047] When the movable inner liner 20 is in the lowered position, the movable inner liner 20 is separated from the gas distribution plate 12, so that the wafer transfer hole is in communication with the space surrounded by the movable inner liner 20.

[0048] In order to make the process gas more uniformly enter the process space 01, in a further embodiment, the plurality of gas distribution holes 121 can be uniformly distributed on the gas distribution plate 12. The gas distribution holes 121 on the gas distribution plate 12 can be distributed in a relatively dense manner without affecting the strength of the gas distribution plate 12. Of course, the embodiment of the present application does not limit the specific number and distribution manner of the gas distribution holes 121.

[0049] In the embodiment of the present application, the structure of the movable liner 20 can be various. In one embodiment, the movable liner 20 can include one annular body 21, and the fixed liner 30 can be one, and the supporting device 40 can be one. The annular body 21, the fixed liner 30, the gas distribution plate 12 and the chamber shell 11 can enclose a process space 01, and the supporting device 40 can be arranged in the process space 01.

[0050] In another embodiment, the movable liner 20 can include a plurality of annular bodies 21, and the fixed liner 30 can be a plurality of fixed liners 30 corresponding to the plurality of annular bodies 21. The supporting device 40 can be a plurality of supporting devices 40. When the movable liner 20 is in the raised position, the plurality of annular bodies 21 are respectively in sealing cooperation with the gas distribution plate 12, and the plurality of annular bodies 21, the plurality of fixed liners 30, the gas distribution plate 12 and the chamber shell 11 respectively enclose a plurality of process spaces 01. The plurality of supporting devices 40 can be respectively arranged in the plurality of process spaces 01. This structure can form a plurality of process spaces 01, so that the plurality of supporting devices 40 can perform processes in the plurality of process spaces 01, which undoubtedly can improve the productivity of the semiconductor process chamber. The plurality of process spaces 01 can be sealed and isolated from each other, so as to avoid mutual interference during the process.

[0051] In order to facilitate the transmission of the wafer 03, a plurality of wafer transmission holes can be provided, and the plurality of wafer transmission holes can correspond to the plurality of process spaces 01 respectively, so as to facilitate the transmission of the wafer 03 to each process space 01. In order to avoid the wafer transmission hole from being opened too much to affect the strength of the chamber shell 11, in one embodiment, the wafer transmission hole can be one, and the plurality of process spaces 01 can share one wafer transmission hole.

[0052] In the embodiment in which the movable liner 20 includes a plurality of annular bodies 21, the plurality of annular bodies 21 can be fixedly connected, so as to realize synchronous lifting. In this case, the movable liner 20 can be driven by fewer driving mechanisms 80 to realize the lifting of the plurality of annular bodies 21. The plurality of annular bodies 21 can be a split structure, and then can be fixed by welding, bonding, connecting member connection and the like. In other embodiments, in further embodiments, the plurality of annular bodies 21 can be an integral structure in order to facilitate manufacturing. For example, the plurality of annular bodies 21 can be integrally formed by casting, cutting and the like, that is, the movable liner 20 can be an integral structure.

[0053] As described above, the gas distribution plate 12 and the chamber housing 11 enclose the gas distribution cavity 02. Specifically, the gas distribution plate 12 can enclose one or more gas distribution cavities 02 with the chamber housing 11, and the embodiments of the present application do not make any limitation. When the gas distribution cavity 02 is one, the gas distribution cavity 02 can uniformly distribute gas to multiple process spaces 01 at the same time. Considering the difference of processes in each process space 01 or the independence of processes in each process space 01, the gas distribution cavity 02 can be multiple and independent of each other. Based on this, in an embodiment, the gas distribution plate 12 can enclose multiple independent gas distribution cavities 02 with the chamber housing 11. The multiple gas distribution cavities 02 are in one-to-one correspondence with the multiple process spaces 01. The chamber housing 11 is provided with multiple process gas input holes 111, and the multiple process gas input holes 111 are in one-to-one correspondence with the multiple gas distribution cavities 02. This structure can realize independent gas input of the multiple process spaces 01, avoid mutual interference, and also realize corresponding gas distribution of the multiple gas distribution cavities 02 for the corresponding process spaces 01.

[0054] As described above, during the process, the exhaust gas formed after the process gas participates in the process can be discharged from the exhaust hole 31. Specifically, the exhaust hole 31 can be in communication with the bottom space of the process space 01, the gas distribution hole 121 can be in communication with the top space of the process space 01, and the exhaust hole 31 can be lower than the bearing surface of the bearing device 40 to reduce the airflow disturbance near the wafer 03 during the process. In order to realize uniform exhaust to make the distribution of the process gas in the process space 01 more uniform, in an embodiment, the exhaust hole 31 can be multiple. The multiple exhaust holes 31 can be uniformly distributed around the circumferential direction of the bearing device 40. The overall formed by the fixed inner liner 30 and the movable inner liner 20 forms an annular gap 011 with the bearing device 40, and the process space 01 includes the annular gap 011, which is in communication with the multiple exhaust holes 31. This structure can make the multiple exhaust holes 31 exhaust in multiple directions, which is conducive to the more dispersed exhaust of the airflow in the process space 01 and is conducive to maintaining the uniformity of the process gas in the process space 01.

[0055] In an embodiment, the bottom end of the fixed inner liner 30 can be provided with multiple grooves 311 distributed around the circumferential direction of the bearing device 40. The multiple grooves 311 enclose multiple exhaust holes 31 with the chamber body 10, respectively. This structure can utilize the fixed inner liner 30 and the chamber body 10 to enclose the exhaust holes 31, without the need to specially open complete exhaust holes 31 on the fixed inner liner 30. In other embodiments, the exhaust holes 31 can be completely opened on the fixed inner liner 30. Specifically, the multiple grooves 311 enclose multiple exhaust holes 31 between the bottom wall of the chamber housing 11.

[0056] The embodiments of the present application do not limit the size of the groove 311, and a person skilled in the art can reasonably design according to a specific process scene. In an embodiment, the ratio of the length of the notch of the groove 311 in the circumferential direction of the bearing device 40 to the interval length of the adjacent two grooves 311 in the circumferential direction can be greater than or equal to 0.5 and less than or equal to 1.5. The number of the grooves 311 can be greater than or equal to 3 and less than or equal to 14. It should be noted that the embodiments of the present application do not limit the number of the grooves 311.

[0057] In an embodiment, the depth of the groove 311 can be greater than or equal to 3 mm and less than or equal to 10 mm. The groove 311 can also have other depths, and the embodiments of the present application do not limit the depth.

[0058] In the embodiments of the present application, the movable inner liner 20 is a movable inner liner, the fixed inner liner 30 is a fixed inner liner, and the movable inner liner 20 is used at least to surround the process space 01 with the fixed inner liner 30 and the chamber body 10, and the movable inner liner 20 can also move relative to the fixed inner liner 30. There are various structures for realizing the above-mentioned cooperation between the movable inner liner 20 and the fixed inner liner 30, and the embodiments of the present application do not limit the cooperation. For example, the two ends of the movable inner liner 20 adjacent to the fixed inner liner 30 are connected through an elastic sealing sleeve, the lifting of the movable inner liner 20 can drive the elastic sealing sleeve to stretch and contract, the stretching and contracting of the elastic sealing sleeve can adapt to the lifting movement of the movable inner liner 20, and at the same time, the sealing butt joint of the movable inner liner 20 and the fixed inner liner 30 can be ensured to form the process space 01.

[0059] In other embodiments, the bottom end of the movable liner 20 that cooperates with the fixed liner 30 can include a first flange 211 that is folded inwardly toward the inside of the movable liner 20. The top end of the fixed liner 30 can include a second flange 312 that is folded outwardly toward the outside of the fixed liner 30. The bottom end of the fixed liner 30 can be surrounded by the chamber body 10 to form an exhaust hole 31 or the bottom end of the fixed liner 30 can be provided with the exhaust hole 31. The first flange 211 and the second flange 312 are annular flanges and a first seal ring 51 is provided between the first flange 211 and the second flange 312. The movable liner 20 is sleeved outside the fixed liner 30. When the movable liner 20 is in the raised position, the first flange 211 and the second flange 312 clamp the first seal ring 51, thereby ensuring the sealed abutment between the movable liner 20 and the fixed liner 30, and thus enabling the movable liner 20, the fixed liner 30 and the chamber body 10 to enclose the process space 01. In this structure, the first flange 211 gradually presses the first seal ring 51 during the raising of the movable liner 20, so that the first seal ring 51 is pressed between the first flange 211 and the second flange 312, thereby achieving the sealing between the first flange 211 and the second flange 312. At the same time, the second flange 312 can indirectly limit the excessive raising of the first flange 211 through the first seal ring 51, thereby achieving the purpose of limiting the excessive raising of the movable liner 20.

[0060] It should be noted that in other embodiments, the first flange 211 and the second flange 312 can also not be provided with the first seal ring 51, in which case the first flange 211 and the second flange 312 will contact as the movable liner 20 is raised. Compared with the first flange 211 and the second flange 312 being sealed by the first seal ring 51, the direct contact between the first flange 211 and the second flange 312 can have a weaker sealing phenomenon, but compared with the background art in which a gap is specially left between the lifting door and the liner, the direct cooperation between the first flange 211 and the second flange 312 will not have the problem of a large degree of sealing failure caused by a similar gap, so the semiconductor process chamber disclosed in the embodiment without the first seal ring 51 can still alleviate the technical problems described in the background art. Of course, the semiconductor process chamber including the first seal ring 51 can achieve better sealing between the first flange 211 and the second flange 312 and can better alleviate the technical problems described in the background art.

[0061] As described above, when the movable liner 20 is in the raised position, the movable liner 20, the chamber body 10 and the fixed liner 30 enclose the process space 01. In order to achieve the sealed abutment between the movable liner 20 and the chamber body 10, in further embodiments, the semiconductor process chamber disclosed in embodiments of the present application can further comprise a second sealing ring 52. The second sealing ring 52 is arranged at the top end of the chamber body 10 or the movable liner 20. For example, the second sealing ring 52 can be fixed at the top end of the chamber body 10 or the movable liner 20 by means of bonding, clamping or the like. When the movable liner 20 is in the raised position, the second sealing ring 52 is clamped between the top end of the movable liner 20 and the chamber body 10. In embodiments in which the chamber body 10 comprises the chamber housing 11 and the gas distribution plate 12 as described above, the second sealing ring 52 can be clamped between the top end of the movable liner 20 and the gas distribution plate 12, thereby achieving the sealed abutment between the top end of the movable liner 20 and the gas distribution plate 12.

[0062] It should be noted that in other embodiments, when the movable liner 20 is in the raised position, the top end of the movable liner 20 can directly contact the chamber body 10 without the second sealing ring 52. Similarly, the direct contact between the top end of the movable liner 20 and the chamber body 10 can result in a weak sealing phenomenon, but compared with the background art in which a gap is specially provided between the lifting door and the liner, the direct contact between the top end of the movable liner 20 and the chamber body 10 will not result in a large degree of sealing problem caused by the gap. Therefore, the semiconductor process chamber disclosed in embodiments without the second sealing ring 52 can still alleviate the technical problems described in the background art. Of course, the semiconductor process chamber comprising the second sealing ring 52 can achieve better sealing between the movable liner 20 and the chamber body 10, and can better alleviate the technical problems described in the background art.

[0063] In embodiments of the present application, the first sealing ring 51 and the second sealing ring 52 can have various shapes, for example, the first sealing ring 51 and the second sealing ring 52 are O-shaped sealing rings, Y-shaped sealing rings or the like, and embodiments of the present application do not limit the specific shape of the first sealing ring 51 and the second sealing ring 52. The shape of the first sealing ring 51 and the second sealing ring 52 can be the same or different, and embodiments of the present application do not limit the shape.

[0064] In one embodiment, the first sealing ring 51 and the second sealing ring 52 can include coaxially distributed first sealing ring pieces 521 and second sealing ring pieces 522, and the first sealing ring 51 and the second sealing ring 52 are of an integral structure. The second sealing ring pieces 522 are arranged obliquely relative to the first sealing ring pieces 521, and such a structure can make the first sealing ring 51 and the second sealing ring 52 have better elasticity, so that the first sealing ring pieces 521 and the second sealing ring pieces 522 can be better attached to the components in contact with them under the action of elastic restoring force when the first sealing ring 51 and the second sealing ring 52 are compressed, and finally the sealing effect can be improved. At the same time, such a structure is an elastic structure, and the first sealing ring 51 and the second sealing ring 52 are made of elastic material, so that the first sealing ring 51 can better prevent rigid collision between the first flange 211 and the second flange 312, and achieve good shock absorption effect. Similarly, the second sealing ring 52 can better prevent collision between the movable inner liner 20 and the chamber body 10, and achieve good shock absorption effect.

[0065] After the first sealing ring 51 and the second sealing ring 52 are compressed, the relative oblique angle e between the first sealing ring pieces 521 and the second sealing ring pieces 522 becomes 0° due to deformation.

[0066] As described above, the first sealing ring pieces 521 and the second sealing ring pieces 522 are obliquely relative to each other, and in one embodiment, the relative oblique angle e between the first sealing ring pieces 521 and the second sealing ring pieces 522 can be greater than or equal to 30° and less than or equal to 60°. In another embodiment, the thickness d of the first sealing ring pieces 521 can be greater than or equal to 0.5 mm and less than or equal to 3 mm. It should be noted that the present embodiment does not limit the specific oblique angle between the first sealing ring pieces 521 and the second sealing ring pieces 522. Similarly, the present embodiment also does not limit the thickness of the first sealing ring pieces 521 and the second sealing ring pieces 522.

[0067] In a specific process, the wafer 03 needs a corresponding temperature during the process in the process space 01. Based on this, the carrying device 40 can have a heating function. In order to ensure that the temperature in the process space 01 is more easily met, in one embodiment, the movable inner liner 20 can be embedded with an electric heating element 61, and the electric heating element 61 can be distributed around the carrying device 40. In a specific working process, the electric heating element 61 generates heat after being powered on, thereby providing a heat field around the carrying device 40, which is conducive to ensuring the required temperature during the process of the wafer 03. The electric heating element 61 can be an electric heating wire, and can also be other structures of electric heating devices.

[0068] As described above, the movable liner 20 is lifted in the chamber body 10, in order to improve the precision of the lifting of the movable liner 20, in one embodiment, the semiconductor processing chamber disclosed by the embodiment of the present application can further comprise a guiding mechanism 70.

[0069] The guiding mechanism 70 can comprise a guiding rod 71, a first guiding sleeve assembly 72 and a third sealing ring 73. The first end of the guiding rod 71 extends into the chamber body 10 and is connected with the movable liner 20. The first guiding sleeve assembly 72 is fixed outside the chamber body 10. The second end of the guiding rod 71 passes through the first guiding sleeve assembly 72 and is guided in the lifting direction of the movable liner 20 with the first guiding sleeve assembly 72. The third sealing ring 73 is used to seal between the guiding rod 71 and the first guiding sleeve assembly 72, so as to avoid leakage of the chamber body 10 at the guiding rod 71. The first end of the guiding rod 71 and the second end of the guiding rod 71 are respectively opposite ends of the guiding rod 71. In this structure, the movable liner 20 is connected with the guiding rod 71, so that the movable liner 20 drives the guiding rod 71 to lift during the lifting process of the movable liner 20. Since the guiding rod 71 is guided in the lifting direction with the first guiding sleeve assembly 72, the guiding rod 71 is limited by the first guiding sleeve assembly 72 to realize more accurate lifting, and finally the movable liner 20 is constrained to realize more accurate lifting. The third sealing ring 73 is sealed between the guiding rod 71 and the first guiding sleeve assembly 72, so as to avoid the chamber body 10 communicating with the external environment of the semiconductor processing chamber through the gap between the guiding rod 71 and the first guiding sleeve assembly 72, thereby facilitating to ensure the environment in the chamber body 10.

[0070] In the embodiment of the present application, the guiding mechanism 70 can be one or multiple, in order to improve the guiding effect, the guiding mechanism 70 can be multiple, and the multiple guiding mechanisms 70 can be distributed at intervals, so as to guide the movable liner 20 at multiple positions.

[0071] As described above in one embodiment, the movable liner 20 can be embedded with the electric heating element 61, and the electric heating element 61 needs to be connected with an external power supply. In one embodiment, the guiding rod 71 can be a hollow structure. The first end of the guiding rod 71 is sealingly connected with the movable liner 20, and the semiconductor processing chamber can further comprise a power supply wire 62. The first end of the power supply wire 62 passes through the rod cavity of the guiding rod 71 and is electrically connected with the electric heating element 61. In this structure, the power supply wire 62 is arranged in the guiding rod 71, so that it can be protected by the guiding rod 71, avoiding the corrosion of the high temperature and high pressure environment in the chamber body 10 on the power supply wire 62 and other adverse effects.

[0072] The first guide sleeve assembly 72 can have various structures. For example, the first guide sleeve assembly 72 can be a cylindrical structure with an integrated structure. The third sealing ring 73 can be sleeved on the guide rod 71 and positioned in the positioning groove of the guide rod 71. The third sealing ring 73 is compressed between the guide rod 71 and the first guide sleeve assembly 72 and can slide along the first guide sleeve assembly 72 under the driving of the guide rod 71. In the embodiment in which the first guide sleeve assembly 72 is a cylindrical structure with an integrated structure, the third sealing ring 73 can be in sliding fit with the inner wall of the cylinder cavity of the cylindrical structure. As shown in Figure 2 In other embodiments, the first guide sleeve assembly 72 can include a first sealing flange 721, a first linear bearing 722, a first bearing flange 723, and a first end cover 724. The first sealing flange 721 is fixed outside the chamber body 10. The first linear bearing 722 is sleeved inside the first bearing flange 723. The first bearing flange 723 is in sealing abutment with the first sealing flange 721. The first end cover 724 covers the end of the first bearing flange 723 away from the first sealing flange 721. The guide rod 71 extends into the chamber body 10 through the first end cover 724, the first linear bearing 722, the first sealing flange 721, and the chamber body 10. The first linear bearing 722 is in sliding fit with the guide rod 71, thereby facilitating the sliding of the guide rod 71.

[0073] Please refer again to Figure 2 In an embodiment, the guide rod 71 can include a first rod segment 711 and a second rod segment 712. One end of the first rod segment 711 is located inside the chamber body 10 and connected with the movable inner liner 20. The other end of the first rod segment 711 can extend outside the chamber body 10 and be fixedly connected with one end of the second rod segment 712. The other end of the second rod segment 712 extends out of the first guide sleeve assembly 72. In an embodiment, the second rod segment 712 can be in sliding fit with the first linear bearing 722. The first rod segment 711 can be in sliding fit with the first sealing flange 721 after the third sealing ring 73 is sleeved thereon. Such a structure can segmentally design the guide rod 71, thereby avoiding the situation that the guide rod 71 is too long and difficult to manufacture or has low manufacturing precision.

[0074] To facilitate the lifting of the movable inner liner 20, the semiconductor process chamber disclosed in the embodiments of the present application can further include a driving mechanism 80. The driving mechanism 80 is directly or indirectly connected with the movable inner liner 20, thereby driving the movable inner liner 20 to lift.

[0075] The structure of the driving mechanism 80 can be various, and the embodiments of the present application are not limited. In an embodiment, the driving mechanism 80 can include a power source 81, a top rod 82 and a fourth sealing ring 83. The power source 81 is fixed outside the chamber body 10. The first end of the top rod 82 extends into the chamber body 10 and is connected with the movable inner liner 20. The second end of the top rod 82 penetrates through the chamber body 10 and is connected with the power source 81. The fourth sealing ring 83 is sleeved on the top rod 82 and seals between the top rod 82 and the chamber body 10. The power source 81 can be an electric motor. In order to avoid the power source 81 from being adversely affected by the environment in the chamber body 10, the power source 81 can be located outside the chamber body 10.

[0076] Please refer to Figure 6 In order to improve the moving precision of the top rod 82, the driving mechanism 80 disclosed by the embodiments of the present application can further include a second guide sleeve assembly 84. The second guide sleeve assembly 84 is fixed outside the chamber body 10. The second end of the top rod 82 penetrates through the second guide sleeve assembly 84 and is connected with the power source 81 located outside the chamber body 10. The second guide sleeve assembly 84 can guide the top rod 82 in the lifting direction of the top rod. In the embodiments of the present application, the lifting direction of the top rod 82 is parallel to the sliding direction of the guide rod 71. The fourth sealing ring 83 can be sealingly arranged between the top rod 82 and the second guide sleeve assembly 84, which substantially indirectly achieves the purpose of sealing between the top rod 82 and the chamber body 10, thereby sealing the top rod 82 to avoid leakage of the chamber body 10. Similarly, the fourth sealing ring 83 can be sleeved on the top rod 82 and positioned in the positioning groove of the top rod 82, thereby being capable of sliding with the top rod 82 relative to the second guide sleeve assembly 84 and achieving sliding sealing.

[0077] In the embodiments of the present application, the structure of the second guide sleeve assembly 84 can be various. For example, in an embodiment, the second guide sleeve assembly 84 can be a cylindrical structure with an integrated structure. In other embodiments, the second guide sleeve assembly 84 can include a second sealing flange 841, a second linear bearing 842, a second bearing flange 843 and a second end cover 844. The second sealing flange 841 is fixed outside the chamber body 10. The second linear bearing 842 is sleeved in the second bearing flange 843. The second bearing flange 843 sealingly abuts against the second sealing flange 841. The second end cover 844 covers the end of the second bearing flange 843 away from the second sealing flange 841. The top rod 82 penetrates through the second end cover 844, the second linear bearing 842, the second sealing flange 841 and the chamber body 10 in sequence and extends into the chamber body 10. The second linear bearing 842 slidingly cooperates with the top rod 82, thereby facilitating the sliding of the top rod 82.

[0078] The embodiments of the present application do not limit the specific number and distribution of the guide mechanism 70 and the driving mechanism 80. Please refer to Figure 5In one embodiment, the movable liner 20 may include an annular body 21, and the semiconductor process chamber may include a drive mechanism 80 and a guide mechanism 70. More specifically, the connection between the push rod 82 of the drive mechanism 80 and the annular body 21 is the first connection point, and the connection between the guide rod 71 of the guide mechanism 70 and the annular body 21 is the second connection point. The straight line m connecting the first and second connection points passes through the center of the annular body 21. In this case, the portions of the annular body 21 located on both sides of the straight line m are symmetrically distributed with the straight line m as the axis of symmetry. This method can more evenly drive and guide the movable liner 20.

[0079] like Figure 4 As shown, in another embodiment, the movable liner 20 may include two annular bodies 21, and the semiconductor process chamber may include a drive mechanism 80 and two guide mechanisms 70. The guide rods 71 ​​of the two guide mechanisms 70 can be connected to the two annular bodies 21 respectively. The two annular bodies 21 are symmetrically distributed about the central axis n of the movable liner 20, that is, the two annular bodies 21 are symmetrically distributed on both sides of the central axis n. The connection point between the push rod 82 of the drive mechanism 80 and the movable liner 20 is located on the central axis n. The guide rods 71 ​​of the two guide mechanisms 70 are connected to the two annular bodies 21 respectively, and the connection points between the guide rods 71 ​​of the two guide mechanisms 70 and the two annular bodies 21 are also symmetrically distributed on both sides of the central axis n. It should be noted that the central axis n is perpendicular to the lifting direction of the movable liner 20.

[0080] Based on the semiconductor process chamber disclosed in the embodiments of the present invention, the present invention discloses a semiconductor process apparatus, which includes a robotic arm and the semiconductor process chamber described in the above embodiments. When the movable inner liner 20 is in the descending position, the robotic arm is used to transfer the wafer 03 through the wafer transfer hole to the carrier device 40 or to transfer it from the carrier device 40 through the wafer transfer hole.

[0081] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different features of the various embodiments are not contradictory, they can be combined to form more specific embodiments. For the sake of brevity, they will not be described in detail here.

[0082] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A semiconductor process chamber, comprising: The chamber body (10) is provided with a wafer transmission hole, the movable inner liner (20) is arranged in the chamber body (10) in a lifting manner to switch between a raised position and a lowered position; the movable inner liner (20) and the fixed inner liner (30) are arranged around the bearing device (40), and the fixed inner liner (30) and the chamber body (10) surround an exhaust hole (31) or the fixed inner liner (30) is provided with the exhaust hole (31); When the movable inner liner (20) is in the lowered position, the wafer transmission hole is in communication with a space surrounded by the movable inner liner (20) to allow a wafer (03) to be transmitted onto the bearing device (40) through the wafer transmission hole or transmitted out of the bearing device (40) through the wafer transmission hole; When the movable inner liner (20) is in the raised position, the movable inner liner (20), the chamber body (10) and the fixed inner liner (30) surround a process space (01), the bearing device (40) is located in the process space (01), the process space (01) is sealed and isolated from the wafer transmission hole, the process space (01) is in communication with the exhaust hole (31), the chamber body (10) comprises a chamber shell (11) and a gas distribution disc (12), the gas distribution disc (12) is arranged in the chamber shell (11), the gas distribution disc (12) is in sealed cooperation with the chamber shell (11) and surrounds a gas distribution cavity (02), the chamber shell (11) is provided with a process gas input hole (111), the process gas input hole (111) is in communication with the gas distribution cavity (02), and the gas distribution disc (12) is provided with a plurality of gas distribution holes (121). When the movable inner liner (20) is in the raised position, the movable inner liner (20) is in sealed cooperation with the gas distribution disc (12), and the movable inner liner (20), the gas distribution disc (12), the fixed inner liner (30) and the chamber shell (11) surround the process space (01), and the gas distribution holes (121) are in communication between the gas distribution cavity (02) and the process space (01).

2. The semiconductor process chamber of claim 1, wherein, The movable inner liner (20) comprises a plurality of annular bodies (21), the fixed inner liner (30) is a plurality of, the plurality of fixed inner liners (30) are in one-to-one cooperation with the plurality of annular bodies (21), and the bearing device (40) is a plurality of; when the movable inner liner (20) is in the raised position, the plurality of annular bodies (21) are in sealed cooperation with the gas distribution disc (12) respectively, and the plurality of annular bodies (21), the plurality of fixed inner liners (30), the gas distribution disc (12) and the chamber shell (11) surround a plurality of process spaces (01), and the plurality of bearing devices (40) are arranged in the plurality of process spaces (01) in one-to-one correspondence.

3. The semiconductor process chamber of claim 2, wherein, The plurality of annular bodies (21) are in an integral structure.

4. The semiconductor process chamber of claim 2, wherein, The gas distribution plate (12) and the chamber shell (11) form a plurality of mutually isolated gas distribution cavities (02), a plurality of the gas distribution cavities (02) and a plurality of the process spaces (01) are in one-to-one correspondence, the chamber shell (11) is provided with a plurality of process gas input holes (111), and the plurality of process gas input holes (111) and the plurality of gas distribution cavities (02) are in one-to-one correspondence.

5. The semiconductor process chamber of claim 1, wherein, The exhaust holes (31) are a plurality of exhaust holes (31) uniformly distributed in the circumferential direction around the bearing device (40), and the overall formed by the fixed inner liner (30) and the movable inner liner (20) and the bearing device (40) form an annular gap (011), the process space (01) includes the annular gap (011), and the annular gap (011) is communicated with a plurality of exhaust holes (31).

6. The semiconductor process chamber of claim 5, wherein, The bottom end of the fixed inner liner (30) is provided with a plurality of recesses (311) distributed in the circumferential direction around the bearing device (40), and the plurality of recesses (311) respectively form a plurality of exhaust holes (31) with the chamber body (10).

7. The semiconductor process chamber of claim 6, wherein, The ratio of the length of the groove (311) notch in the circumferential direction to the interval length of the groove (311) in the circumferential direction is greater than or equal to 0.5 and less than or equal to 1.5; and / or, the number of the groove (311) is greater than or equal to 3 and less than or equal to 14; and / or, the depth of the groove (311) is greater than or equal to 3mm and less than or equal to 10mm.

8. The semiconductor process chamber of claim 1, wherein, The bottom end of the movable inner liner (20) matched with the fixed inner liner (30) includes a first flange (211) folded inwardly of the movable inner liner (20), the top end of the fixed inner liner (30) includes a second flange (312) folded outwardly of the fixed inner liner (30), the bottom end of the fixed inner liner (30) forms the exhaust hole (31) with the chamber body (10) or the bottom end of the fixed inner liner (30) is provided with the exhaust hole (31); the first flange (211) and the second flange (312) are annular flanges and a first sealing ring (51) is arranged therebetween, the movable inner liner (20) is sleeved outside the fixed inner liner (30), and when the movable inner liner (20) is in the raised position, the first flange (211) and the second flange (312) clamp the first sealing ring (51).

9. The semiconductor process chamber of claim 8, wherein, The semiconductor process chamber further comprises a second sealing ring (52) arranged at the top end of the chamber body (10) or the movable inner liner (20), and when the movable inner liner (20) is in the raised position, the second sealing ring (52) is clamped between the top end of the movable inner liner (20) and the chamber body (10).

10. The semiconductor process chamber of claim 9, wherein, The first sealing ring (51) and the second sealing ring (52) each comprise coaxially distributed first sealing ring pieces (521) and second sealing ring pieces (522), the first sealing ring pieces (521) and the second sealing ring pieces (522) are of an integral structure; the second sealing ring pieces (522) are arranged obliquely relative to the first sealing ring pieces (521).

11. The semiconductor process chamber of claim 10, wherein, An included angle between the first sealing ring pieces (521) and the second sealing ring pieces (522) is greater than or equal to 30° and less than or equal to 60°; and / or, a thickness of the first sealing ring pieces (521) is greater than or equal to 0.5mm and less than or equal to 3mm.

12. The semiconductor process chamber of claim 1, wherein, The movable inner liner (20) is embedded with an electric heating element (61), the electric heating element (61) is distributed around the bearing device (40).

13. The semiconductor process chamber of claim 12, wherein, The semiconductor process chamber further comprises a guide mechanism (70), the guide mechanism (70) comprises a guide rod (71), a first guide sleeve assembly (72) and a third sealing ring (73), a first end of the guide rod (71) extends into the chamber body (10) and is connected with the movable inner liner (20), the first guide sleeve assembly (72) is fixed outside the chamber body (10), a second end of the guide rod (71) passes through the first guide sleeve assembly (72) and is guided and matched with the first guide sleeve assembly (72) in the lifting direction of the movable inner liner (20), the third sealing ring (73) is used for sealing between the guide rod (71) and the first guide sleeve assembly (72).

14. The semiconductor process chamber of claim 13, wherein, The guide rod (71) is of a hollow structure, the first end of the guide rod (71) is sealingly connected with the movable inner liner (20), the semiconductor process chamber further comprises a power supply wire (62), a first end of the power supply wire (62) passes through a rod cavity of the guide rod (71) and is electrically connected with the electric heating element (61).

15. The semiconductor process chamber of claim 1, wherein, The semiconductor process chamber further comprises a driving mechanism (80), the driving mechanism (80) comprises a power source (81), a top rod (82) and a fourth sealing ring (83), the power source (81) is fixed outside the chamber body (10), a first end of the top rod (82) extends into the chamber body (10) and is connected with the movable inner liner (20), a second end of the top rod (82) passes through the chamber body (10) and is connected with the power source (81), the fourth sealing ring (83) is sleeved on the top rod (82) and seals between the top rod (82) and the chamber body (10).

16. A semiconductor process apparatus characterized by comprising: A mechanical hand and the semiconductor process chamber of any one of claims 1-15, when the movable inner liner (20) is in the landing position, the mechanical hand is used for transferring the wafer (03) onto or out of the bearing device (40) through the wafer transmission hole.

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