Method for solving cavity layering of 8006NS brush coating product

Abstract

The invention discloses a method for solving cavity layering of an 8006NS glue brushing product, which realizes reliable separation of a glue layer and a blue film of the 8006NS glue brushing product, improves the stability of a technological process and ensures the quality and reliability of the product. The ejector pin module is suitable for a product of which the back surface is brushed with 8006NS glue after a chip is thinned, comprises an ejector pin cap and an ejector pin located at the center position, and is characterized in that a blue film is preset on a glue layer on the back surface of the chip, the ejector pin cap fixes the blue film through vacuum adsorption in advance, and the ejector pin is arranged at the center position of the ejector pin cap; when a suction nozzle at the bottom of the bonding head does not make contact with the surface of the chip, the ejector pin cap and the ejector pin drive the product to be jacked to the preset height at the same time, then the ejector pin cap descends while the ejector pin is jacked, the ejector pin drives the blue film, the glue layer and the chip at the center position to ascend, and the ejector pin cap drives the blue film on the periphery of the center area to descend. The rest of the blue film and the adhesive layer are separated, and then the chip is in flexible contact with a suction nozzle at the bottom of the bonding head.

Description

Technical Field

[0001] The invention relates to the technical field of core mounting methods, and in particular to a method for solving the problem of void delamination in 8006NS glue-brushing products. Background Art

[0002] Due to the instability and scrap rate of the glue-based product operation process in the current industry, some customers choose to use the more stable glue-brushing process. However, the small chip is matched with the 8006NS glue-brushing product, which is to apply glue on the back of the silicon wafer after thinning and bake and solidify. This type of product often has debonding problems during the core operation. When the adhesive joint grabs the chip, due to the short grabbing time, it is impossible to completely separate the glue layer from the bottom blue film, resulting in voids in some parts of the glue layer or delamination of the glue layer. The product cannot meet the customer's design requirements and is scrapped. Therefore, it is necessary to develop a new core operation method to solve the debonding and delamination problems of 8006NS glue-brushing products. Summary of the invention

[0003] In view of the above problems, the present invention provides a method for solving the void stratification problem of 8006NS glue-brushed products, which realizes the reliable separation of the glue layer and the blue film of 8006NS glue-brushed products, improves the stability of the process, and ensures the quality and reliability of the product.

[0004] A method for solving the problem of void stratification of 8006NS glue-brushed products, which is suitable for products in which 8006NS glue is brushed on the back of a chip after thinning. A ejector pin module comprises an ejector pin cap and an ejector pin located at a center position, and is characterized in that: a blue film is preset on the back glue layer of the chip, the ejector pin cap fixes the blue film in advance by vacuum adsorption, and an ejector pin is arranged at the center position of the ejector pin cap. When the bottom suction nozzle of the bonding head does not contact the chip surface, the ejector pin cap and the ejector pin simultaneously drive the product to be lifted to a predetermined height, and then the ejector pin cap descends while the ejector pin is lifted, and the ejector pin drives the blue film, the glue layer, and the chip at the center position to rise, and the ejector pin cap drives the blue film at the periphery of the center area to descend, so that except for the blue film at the ejector pin position, the remaining blue films and the glue layer are completely separated, and then the chip and the bottom suction nozzle of the bonding head are flexibly contacted, the bottom suction nozzle is started, and the bottom suction nozzle holds the chip, and at the same time, the chip drives the glue layer to be separated from the blue film still in a bonding state at the center position, and the bonding head adsorbs the combined product of the chip and the glue layer through the bottom suction nozzle.

[0005] It is further characterized in that it comprises the following steps:

[0006] S1. When operating 8006NS glue products, after the ejector cap absorbs the bottom blue film of the product, the ejector module rises, driving the product to the predetermined height;

[0007] S2, when the ejector module reaches a predetermined height, the bonding arm and the ejector module move synchronously, wherein the bonding arm descends to the set bonding height, and at the same time, the ejector of the ejector module rises and the ejector cap descends;

[0008] S3, the ejector module completes the action in advance. When the bottom nozzle of the bonding arm drops to the height of picking up the chip, the ejector cap has dropped to a certain height. When the bonding arm grabs the chip, the bottom nozzle flexibly contacts the chip. There is no instant impact force, and the glue layer between the chip and the blue film will not be damaged. The bottom nozzle completely absorbs the chip and peels off the back glue layer from the center of the blue film.

[0009] S4, then the ejector pin and ejector cap of the ejector pin module are reset to the initial position of the product, the adsorption force is released, and the blue film is removed. At the same time, the bonding arm drives the product to be transferred to the next station and then reset to transfer the next group of products.

[0010] It is further characterized by:

[0011] The bottom of the ejector pin passes through the ejector pin cap and is connected to an independent lifting mechanism to ensure the independent lifting operation of the ejector pin;

[0012] In step S2, the descending speed of the ejector cap is the same as the ascending speed of the ejector pin, and the descending stroke of the ejector cap is the same as the ascending stroke of the ejector pin, the descending stroke of the bonding arm ends later than the stroke of the ejector pin, and the stroke of the bonding arm ends when the bottom suction nozzle flexibly contacts the upper surface of the chip;

[0013] The upper part of the bottom suction nozzle is connected to the bonding arm through an elastic connecting piece, and the suction end of the bottom suction nozzle is a flexible suction head, which ensures that no hard impact is caused to the surface of the chip.

[0014] After adopting the structure of the present invention, the blue film and the glue layer are separated in most areas in advance through the opposite movements between the ejector pin and the ejector pin cap, and then reliable adsorption is formed after the flexible contact between the bottom suction nozzle and the chip. Since the bonding adhesion between the chip and the glue layer is much greater than the bonding adhesion of the blue film corresponding to the central area of ​​the glue layer at this time, the chip and the glue layer are synchronously lifted and separated from the blue film, and the bottom periphery of the blue film is still adsorbed by the airflow in the ejector pin cap, so that the blue film and the glue layer are reliably separated, which realizes the reliable separation of the glue layer and the blue film of the 8006NS brush glue product, improves the stability of the process, and ensures the quality and reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the operation of the present invention;

[0016] The names corresponding to the serial numbers in the figure are as follows:

[0017] Ejector cap 1, ejector 2, chip 3, adhesive layer 4, blue film 5, suction nozzle 6. DETAILED DESCRIPTION

[0018] A method for solving the problem of void delamination in 8006NS glue-brushing products, see Figure 1 :It is suitable for products where 8006NS glue is applied to the back of the chip after thinning. The ejector pin module includes an ejector pin cap 1 and an ejector pin 2 located at the center. The back adhesive layer 4 of the chip 3 is preset with a blue film 5. The ejector pin cap 1 fixes the blue film 5 in advance by vacuum adsorption. An ejector pin 2 is arranged at the center of the ejector pin cap 1. When the suction nozzle 6 at the bottom of the adhesive joint does not contact the surface of the chip 3, the ejector pin cap 1 and the ejector pin 2 simultaneously drive the product to be ejected to a predetermined height. After that, the ejector pin 2 is lifted while the ejector pin cap 1 is lowered. The ejector pin 2 drives the blue film 5 at the center to be fixed. The film 5, the glue layer 4 and the chip 3 rise, and the ejector cap 1 drives the blue film 5 on the periphery of the central area to descend, so that except for the blue film 5 at the position of the ejector pin 2, the remaining blue film 5 and the glue layer 4 are separated, and the blue film 5 has deformation tension and will not break. Then the chip 3 and the bottom suction nozzle 6 of the bonding head are in flexible contact, the bottom suction nozzle 6 is started, and the bottom suction nozzle 6 holds the chip 3. At the same time, the chip 3 drives the glue layer 4 to separate from the blue film 5 which is still in a bonding state at the center position, and the bonding head absorbs the combination product of the chip 3 and the glue layer 4 through the bottom suction nozzle 6.

[0019] When implemented specifically, it includes the following steps:

[0020] S1. When operating 8006NS glue products, after the ejector cap 1 absorbs the bottom blue film 5 of the product, the ejector module rises, driving the product to rise to a predetermined height;

[0021] S2, the bottom of the ejector pin 2 passes through the ejector cap 1 and is connected to the independent lifting mechanism to ensure the independent lifting operation of the ejector pin; when the ejector pin module reaches a predetermined height, the bonding arm and the ejector pin module move synchronously, wherein the bonding arm descends to the set bonding height, and at the same time, the ejector pin 2 of the ejector pin module rises, while the ejector cap 1 descends; the descending speed of the ejector cap 1 is the same as the ascending speed of the ejector pin 2, and the descending stroke of the ejector cap 1 is the same as the ascending stroke of the ejector pin 2, the descending stroke of the bonding arm ends later than the stroke of the ejector pin 2, and the stroke of the bonding arm ends when the bottom suction nozzle 6 flexibly contacts the upper surface of the chip 3;

[0022] S3, the ejector module moves to complete the action in advance. When the bottom suction nozzle 6 of the bonding arm drops to the height of picking up the chip 3, the ejector cap 1 has dropped to a certain height. When the bonding arm grabs the chip, the bottom suction nozzle 6 flexibly contacts the chip 3. There is no instant impact force, and the adhesive layer 4 between the chip 3 and the blue film 5 will not be damaged. The bottom suction nozzle 6 completely absorbs the chip 3 and peels off the back adhesive layer 4 from the center of the blue film 5.

[0023] The upper part of the bottom suction nozzle 6 is connected to the bonding arm through an elastic connector, and the suction end of the bottom suction nozzle 6 is a flexible suction head to ensure that no hard impact is caused to the surface of the chip 3.

[0024] S4, then the ejector pin 2 and the ejector cap 1 of the ejector pin module are reset to the initial position of the product, the adsorption force is released, and the blue film 5 is removed. At the same time, the bonding arm drives the product to be transferred to the next station and then reset to transfer the next group of products.

[0025] Its working principle is as follows: through the opposite movements between the ejector pin and the ejector cap and the deformation property of the blue film, the blue film and the glue layer are gradually separated in most areas in advance, and then the bottom suction nozzle and the chip are flexibly contacted to form reliable adsorption. Since the bonding adhesion between the chip and the glue layer is much greater than the bonding adhesion of the blue film in the center area of ​​the glue layer at this time, the chip and the glue layer are simultaneously lifted and separated from the blue film, and the bottom periphery of the blue film is still adsorbed by the airflow in the ejector cap, so that the blue film and the glue layer are reliably separated, which realizes the reliable separation of the glue layer and the blue film of the 8006NS brush glue product, improves the stability of the process, and ensures the quality and reliability of the product.

[0026] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0027] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A method for solving the problem of void delamination of 8006NS glue-brushed products, which is suitable for products where 8006NS glue is brushed on the back of the chip after thinning. The ejector pin module includes an ejector pin cap and an ejector pin located at the center, and is characterized in that: The back glue layer of the chip is preset with a blue film, and the ejector cap fixes the blue film in advance by vacuum adsorption, and an ejector pin is arranged at the center of the ejector cap. When the bottom suction nozzle of the bonding head does not touch the chip surface, the ejector cap and the ejector pin simultaneously drive the product to a predetermined height, and then the ejector cap descends while the ejector pin ascends, and the ejector pin drives the blue film, glue layer and chip at the center position to rise, and the ejector cap drives the blue film around the center area to descend, so that except for the blue film at the ejector pin position, the remaining blue films and glue layers are separated, and then the chip and the bottom suction nozzle of the bonding head are flexibly contacted, the bottom suction nozzle is started, and the bottom suction nozzle holds the chip, and at the same time the chip drives the glue layer to separate from the blue film which is still in a bonding state at the center position, and the bonding head adsorbs the combination product of the chip and the glue layer through the bottom suction nozzle.

2. A method for solving the void stratification of 8006NS glue-brushing products according to claim 1, characterized in that: It includes the following steps: S1. When operating 8006NS glue products, after the ejector cap absorbs the bottom blue film of the product, the ejector module rises, driving the product to the predetermined height; S2, when the ejector module reaches a predetermined height, the bonding arm and the ejector module move synchronously, wherein the bonding arm descends to the set bonding height, and at the same time, the ejector of the ejector module rises and the ejector cap descends; S3, the ejector module completes the action in advance. When the bottom nozzle of the bonding arm drops to the height of picking up the chip, the ejector cap has dropped to a certain height. When the bonding arm grabs the chip, the bottom nozzle flexibly contacts the chip. There is no instant impact force, and the glue layer between the chip and the blue film will not be damaged. The bottom nozzle completely absorbs the chip and peels off the back glue layer from the center of the blue film. S4, then the ejector pin and ejector cap of the ejector pin module are reset to the initial position of the product, the adsorption force is released, and the blue film is removed. At the same time, the bonding arm drives the product to be transferred to the next station and then reset to transfer the next group of products.

3. A method for solving the void stratification of 8006NS glue-brushing products according to claim 2, characterized in that: The bottom of the ejector pin passes through the ejector pin cap and is connected to an independent lifting mechanism.

4. A method for solving the problem of void stratification of 8006NS adhesive products according to claim 3, characterized in that: In step S2, the descending speed of the ejector cap is the same as the ascending speed of the ejector pin, and the descending stroke of the ejector cap is the same as the ascending stroke of the ejector pin. The descending stroke of the bonding arm ends later than the stroke of the ejector pin. The stroke of the bonding arm ends when the bottom suction nozzle flexibly contacts the upper surface of the chip.

5. The method for solving the void stratification of 8006NS glue-brushing products according to claim 2 is characterized in that: The upper part of the bottom suction nozzle is connected to the bonding arm through an elastic connecting piece, and the suction end of the bottom suction nozzle is a flexible suction head.

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