A high-precision chip picking mechanism and eutectic welding device

Abstract

The present invention discloses a high-precision chip pickup mechanism and eutectic welding device, comprising a chip pickup mechanism, a visual mechanism, a chip feeder mechanism, and a chip packaging platform. The chip feeder mechanism is mounted on a frame, the chip pickup mechanism and the visual mechanism are positioned above the chip feeder mechanism, and the chip packaging platform is positioned to one side of the chip feeder mechanism. The chip packaging platform is used to clamp a copper wire, allowing the chip pickup mechanism to pick up the chip from the chip feeder mechanism and place it on the copper wire of the chip packaging platform. The present invention uses a mechanical method to separate the chip from the nozzle, improving chip placement stability and processing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of flip chip packaging, and in particular to a high-precision chip picking mechanism and a eutectic welding device. Background Art

[0002] Currently, laser welding is not suitable for flip-chip LEDs soldered to copper-core enameled wire due to the small size and fragility of the chips. Instead, eutectic encapsulation is used to achieve chip encapsulation. The copper-core enameled wire is ground down at the location where the chip is to be mounted, creating a pair of appropriately sized grinding pits. A copper-tin alloy is then placed over the grinding pits to form a soft copper-tin alloy support. Chip pick-up and placement is performed using a nozzle to pick up the chip from the chip supply area and place it in the chip encapsulation area.

[0003] During the chip packaging process, the copper-tin alloy soft support is in a molten state, and the LED chip is placed on the molten alloy surface to complete the eutectic package. During the processing, achieving stable chip placement is crucial, and the quality of chip placement directly affects the quality of the product.

[0004] The current chip placement method uses a method of changing air pressure to separate the chip and the nozzle, but this method has the following problems:

[0005] 1) Affecting processing efficiency. When picking up the chip, the nozzle part provides negative pressure to suck the chip. When placing the chip, the negative pressure of the nozzle part needs to be changed to positive pressure to make the chip separate from the nozzle. The change of air pressure takes a certain amount of time, which reduces the efficiency of the process.

[0006] 2) The placement effect is unstable. When changing the air pressure, the control accuracy of the air pressure is not high and it is difficult to control. Too little air pressure may cause the chip to not be completely separated from the nozzle, or too much air pressure may cause the chip to be blown out of the processing area directly.

[0007] In addition, there are existing mechanical methods to replace the traditional method of changing air pressure to pick up and place chips, such as the Chinese utility model patent publication number CN202332813U, which is suitable for a lifting and placing nozzle for light and thin components. Although this method can reduce the chips from being blown out of the processing area due to excessive air pressure, the structure uses the piston to move downward under its own gravity to drive the flexible push pin to push the chip on the nozzle. The force generated by its own weight is not stable, which can easily reduce the placement accuracy. In addition, the nozzle of this structure is blocked and cannot be used for traditional alignment methods. Summary of the Invention

[0008] The technical problem to be solved by the embodiments of the present invention is to provide a high-precision chip picking mechanism and eutectic welding device, which use a mechanical method to separate the chip and the suction nozzle, avoiding the disadvantages of using the air pressure control method to achieve chip separation and improving the stability of chip placement.

[0009] To achieve the above-mentioned purpose, the present invention discloses a high-precision chip picking mechanism, including a vacuum suction nozzle, a pressure pin, and a connecting seat. The connecting seat can be lifted and lowered above a frame, and the vacuum suction nozzle is fixedly arranged at the bottom of the connecting seat and is connected to an air source. The vacuum suction nozzle is driven to rise and fall by a lifting drive device to pick up the chip on the ejector pin, and the vacuum suction nozzle is driven to move horizontally by a linear sliding module. The pressure pin can be lifted and slidably inserted into the vacuum suction nozzle, and the pressure pin is driven to press down by a pressure pin driving device so that the chip is separated from the vacuum suction nozzle under the action of the pressure pin, so that the chip on the vacuum suction nozzle completes the placement action, thereby mechanically placing the chip on the copper wire. Compared with the traditional method of controlling air pressure to place the chip, there is no need to wait for the vacuum suction nozzle to change the negative pressure to positive pressure to separate the chip, thereby greatly improving the stability of chip placement and processing efficiency.

[0010] Furthermore, it also includes a calibration nozzle, which is fixedly arranged on one side of the vacuum nozzle. A visual mechanism is provided above the ejector pin. The coordinate information of the calibration nozzle is obtained by the visual mechanism, and the vacuum nozzle is driven to move a set distance in the horizontal direction by the linear sliding module to make the coordinate information of the vacuum nozzle coincide with that of the calibration nozzle, thereby ensuring that the center of the vacuum nozzle coincides with the center of the ejector pin and the copper wire placement area, thereby greatly improving the processing accuracy.

[0011] The present invention also discloses a eutectic welding device, including a chip picking mechanism, a visual mechanism, a chip feeding mechanism, and a chip packaging platform. The chip feeding mechanism is arranged on a frame, the chip picking mechanism and the visual mechanism are arranged above the chip feeding mechanism, and the chip packaging platform is arranged on one side of the chip feeding mechanism. The chip packaging platform is used to clamp the copper wire so that the chip picking mechanism picks up the chip on the chip feeding mechanism and places it on the copper wire of the chip packaging platform.

[0012] Furthermore, the chip picking mechanism includes a vacuum suction nozzle, a pressure pin, and a connecting seat. A linear sliding module is fixedly installed on the frame, a mounting plate is slidably provided on the linear sliding module, and the connecting seat is slidably provided on the mounting plate. The vacuum suction nozzle is fixedly provided at the bottom of the connecting seat and is connected to an air source. The vacuum suction nozzle is driven to rise and fall by a lifting drive device to suck up the chip on the chip feeding mechanism, and then the vacuum suction nozzle is driven to move horizontally by the linear sliding module to move the chip to the chip packaging platform. The pressure pin can be lifted and slidably inserted into the vacuum suction nozzle, and the pressure pin is driven to be pressed down by a pressure pin driving device so that the chip is separated from the vacuum suction nozzle under the action of the pressure pin, thereby placing the chip on the copper wire of the chip packaging platform.

[0013] Furthermore, the chip picking mechanism further includes a calibration nozzle, and the calibration nozzle is fixedly arranged on one side of the vacuum nozzle.

[0014] Furthermore, the visual mechanism includes several visual inspection modules and a visual mounting frame. The visual mounting frame is mounted above the frame. The several visual inspection modules are respectively arranged above the chip feeding mechanism and the chip packaging platform, and are respectively fixedly mounted on the visual mounting frame.

[0015] Furthermore, the chip feeding mechanism includes a chip placement tray, an XY screw slider module, and a pin mechanism. The XY screw slider module is arranged on the frame, the chip placement tray is arranged on the XY screw slider module, and the pin mechanism is arranged below the chip placement tray and fixedly installed on the frame. The chip on the chip placement tray is driven to move along the X and Y axis directions by the XY screw slider module, so that the pin mechanism lifts the chip.

[0016] Furthermore, the chip packaging platform includes a clamping carrier, a clamping claw, and a second fine-tuning component. The second fine-tuning component is arranged on a frame, and the clamping carrier is arranged above the second fine-tuning component. The clamping claw can be raised and lowered on the clamping carrier. The clamping carrier supports the copper wire and drives the clamping claw to clamp the copper wire through a clamping drive device to prevent the copper wire from being displaced and affecting the placement of the chip.

[0017] Furthermore, a heating module is provided on the clamping carrier to heat the solder paste on the copper wire, so that the chip can be attached to the solder paste on the copper wire, thereby completing the packaging of the chip and the copper wire.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] (1) The present invention uses a vacuum nozzle to pick up the chip, and uses a pressure needle to press down to separate the chip from the vacuum nozzle. Compared with the traditional method of using air pressure control to achieve chip separation, the present invention uses a mechanical method to greatly improve the stability of chip placement and processing efficiency, avoiding the problem of low air pressure control accuracy when changing air pressure, which may cause the chip to fail to separate from the nozzle, or excessive air pressure to directly blow the chip out of the processing area. (2) Since the upper part of the vacuum nozzle in the present invention is blocked, the coordinate information of the calibration nozzle is obtained by a visual mechanism to adjust the position of the vacuum nozzle to ensure that the center of the vacuum nozzle can coincide with the center of the placement area on the ejector pin or copper wire, so that the vacuum nozzle can accurately pick up the chip and accurately place the chip on the copper wire, effectively improving the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the overall structure of the chip picking mechanism;

[0022] Figure 3 Schematic diagram of the overall structure of the ejector mechanism;

[0023] Figure 4 Schematic diagram of the overall structure of the chip packaging platform. DETAILED DESCRIPTION

[0024] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be described in further detail below with reference to the accompanying drawings.

[0025] Reference Figure 1 As shown, a high-precision chip picking mechanism and eutectic welding device include a chip picking mechanism 1, a visual mechanism 2, a chip feeding mechanism 3, a chip packaging platform 4, and a frame. The chip feeding mechanism 3 is arranged on the frame, the chip picking mechanism 1 and the visual mechanism 2 are arranged above the chip feeding mechanism 3, and the chip packaging platform 4 is a pair and is arranged on one side of the chip feeding mechanism 3.

[0026] Reference Figure 1 、 Figure 3As shown, the chip feeding mechanism 3 includes a chip placement tray 31, an XY screw slider module 32, and an ejector mechanism 33. The XY screw slider module 32 is arranged on the frame, and the chip placement tray 31 is arranged on the XY screw slider module 32. A blue film is placed on the chip placement tray 31, and there are several chips on the blue film. The ejector mechanism 33 is arranged below the chip placement tray 31 and fixedly installed on the frame. In this embodiment, the XY screw slider module 32 is composed of two sets of ball screws, and the ball screw is a well-known technology and will not be repeated here. The chips on the chip placement tray 31 are driven to move along the X and Y axis directions by the XY screw slider module 32 to ensure that each chip on the blue film on the chip placement tray 31 is continuously moved to the top of the ejector mechanism 33, so that the ejector mechanism 33 lifts the chip on the blue film, thereby completing the chip peeling.

[0027] Furthermore, the ejector mechanism 33 includes an ejector 331, a first fine-tuning component 332 is fixedly mounted on the frame, an ejector mounting plate 333 is provided on the first fine-tuning component 332, the ejector 331 is liftably arranged on the ejector mounting plate 333, and an ejector driving device 334 is fixedly mounted on the ejector mounting plate 333. In this embodiment, the ejector driving device 334 preferably adopts a servo motor, and a cam 335 is fixedly provided on its output shaft. The outer periphery of the cam 335 contacts and cooperates with the lower end of the ejector 331, and the cam 335 is driven to rotate by the ejector driving device 334, thereby pushing the ejector 331 to move up and down, thereby lifting the chip on the blue film.

[0028] In this embodiment, the first fine-tuning component 332 includes a fixed base and an X-axis slide. The fixed base is fixedly mounted on the frame, the X-axis slide is slidably arranged on the fixed base, and the ejector mounting plate 333 is slidably arranged on the X-axis slide. A first fine-tuning screw rotatably connected to the X-axis slide is rotatably arranged on the fixed base, and a second fine-tuning screw rotatably connected to the ejector mounting plate 333 is rotatably arranged on the X-axis slide. The first fine-tuning screw and the second fine-tuning screw are thereby used to achieve fine-tuning of the X- and Y-axis directions of the ejector 331, so that the ejector 331 can be located at the center of the chip when the ejector mechanism peels off the chip 33, thereby ensuring that the ejector 331 and the chip to be peeled off can be accurately aligned.

[0029] Reference Figure 1 、 Figure 2As shown, the chip picking mechanism 1 includes a vacuum suction nozzle 11, a pressing needle 12, and a connecting seat 13. A linear sliding module 17 is fixedly installed on the frame. In this embodiment, the linear sliding module 17 is composed of a servo motor and a ball screw, which will not be repeated here. A mounting plate 171 is slidingly provided on the linear sliding module 17, and the connecting seat 13 is slidingly provided on the mounting plate 171 of the linear sliding module 17. The vacuum suction nozzle 11 is fixedly provided at the bottom of the connecting seat 13 and is connected to a negative pressure source. In this embodiment, the negative pressure source preferably adopts a vacuum generator, and a lifting drive device 15 is fixedly installed on the mounting plate 171. In this embodiment, the lifting drive device 15 preferably adopts a voice coil motor, and its output end is fixedly connected to the connecting seat 13, so that the vacuum suction nozzle 11 is driven to rise and fall by the lifting drive device 15 to suck up the chip peeled off the ejector pin 331, and then driven by the linear sliding module 17 The vacuum suction nozzle 11 moves horizontally to move the chip onto the chip packaging platform 4, and the pressing needle 12 can be slidably inserted into the vacuum suction nozzle 11, and a pressing needle driving device 16 is fixedly installed on the connecting seat 13. In this embodiment, the pressing needle driving device 16 preferably adopts a piezoelectric motor, and a pin clamp is fixedly provided at its output end so that the pressing needle 12 can be clamped by the pin clamp. When the vacuum suction nozzle 11 delivers the chip to the chip packaging platform 4, the lifting driving device drives the vacuum suction nozzle 11 to descend and place the chip on the copper wire. After the chip reaches the chip packaging platform, the pressing needle driving device 16 drives the pressing needle 12 to press down so that the chip is separated from the vacuum suction nozzle 11 under the action of the pressing needle 12. In this embodiment, the distance that the lower end of the pressing needle 12 extends from the vacuum suction nozzle 11 is at least 10 μm, so that the chip is more stably placed on the copper wire of the chip packaging platform 4.

[0030] Through the above arrangement, this embodiment uses a mechanical method to separate the chip and the suction nozzle, avoiding the disadvantages of using a method of controlling air pressure to achieve chip separation, improving the stability of chip placement, and eliminating the need to wait for the vacuum suction nozzle to change negative pressure to positive pressure to separate the chip, thereby greatly improving processing efficiency. At the same time, it can also prevent the chip from being directly blown out of the processing area due to excessive air pressure.

[0031] Reference Figure 1 、 Figure 4As shown, further, the chip packaging platform 4 includes a clamping carrier 41, a clamping claw 42, and a second fine-tuning component 43. The second fine-tuning component 43 is arranged on the frame. In this embodiment, the structure of the second fine-tuning component 43 is the same as that of the first fine-tuning component 332, and no repetitive description is made here. The clamping carrier 41 is arranged above the second fine-tuning component 43, and in this embodiment, the clamping carrier 41 is a pair and is respectively arranged on one side of the chip feeding mechanism 3. The clamping claw 42 is arranged on the clamping carrier 41 in a liftable manner, and a clamping drive is fixedly installed on one side of the clamping carrier 41. Device 44, in this embodiment, the clamping drive device 44 is preferably a pneumatic finger, which supports the copper wire through the clamping carrier 41, and the clamping drive device 44 drives the clamping claw 42 to clamp the copper wire on the clamping carrier 41, so as to avoid the copper wire from shaking and affecting the packaging effect of the chip, and a heating module 45 is provided on the clamping carrier 41. In this embodiment, the heating module 45 is preferably an electric heating plate, so that the heating module 45 heats the solder paste on the copper wire, so that the chip can be adhered to the solder paste on the copper wire, thereby completing the packaging of the chip and the copper wire.

[0032] Reference Figure 1-Figure 4 As shown, the specific working process is as follows:

[0033] By placing the copper wire on the clamping carrier 41, the clamping drive device 44 drives the clamping claw 42 to clamp the copper wire on the clamping carrier 41, and the solder paste on the copper wire is heated by the heating module 45, and then the linear sliding module 17 drives the vacuum suction nozzle 11 to move above the ejector pin 331, so that the ejector pin drive device 334 drives the ejector pin 331 to rise and lift the chip on the blue film, and the lifting drive device 15 drives the vacuum suction nozzle 11 to descend and suck the lifted chip, and the linear sliding module 17 drives the vacuum suction nozzle 11 to move to the top of the ejector pin 331. Group 17 drives the vacuum nozzle 11 to move the chip above the copper wire, and drives the vacuum nozzle 11 through the lifting drive device 15 to drive the chip down to a position about 5μm above the placement area of the copper wire. Then the pressure needle drive device 16 drives the pressure needle 12 to descend. When the lower end of the pressure needle 12 contacts the chip, it will give the chip a downward force. The chip will be separated from the vacuum nozzle 11 by the force of the pressure needle 12, thereby mounting the chip on the solder paste of the copper wire to achieve chip packaging.

[0034] Reference Figure 1 、 Figure 3 As shown, the visual mechanism 2 in this embodiment includes several visual inspection modules and a visual mounting frame. The visual mounting frame is mounted above the frame, and several visual inspection modules are fixedly mounted on the visual mounting frame. In this embodiment, three visual inspection modules are preferably used, one of which is arranged above the ejector pin 331 of the chip feeding mechanism 3, and the other two visual inspection modules are respectively arranged above the clamping carrier 41 of the chip packaging platform. The visual inspection module preferably uses an industrial camera.

[0035] The traditional alignment method of changing the air pressure is to directly use visual observation to see whether the centers of the suction nozzle and the ejector pin coincide with each other. However, in this embodiment, the traditional method of changing the air pressure is abandoned, and a mechanical method is used to achieve the placement of the vacuum suction nozzle. However, the vacuum suction nozzle 11 is blocked by the pressure needle drive device 16, resulting in the visual inspection module being unable to obtain an image of the vacuum suction nozzle, and thus unable to identify whether the centers of the vacuum suction nozzle and the ejector pin coincide with each other.

[0036] Combine Figure 3 As shown, in order to solve the above problems, the chip picking mechanism 1 in this embodiment further includes a calibration nozzle 14, which is fixedly arranged on one side of the vacuum nozzle 11. In this embodiment, the distance between the center of the vacuum nozzle 11 and the center of the calibration nozzle 14 is L, and the distance L between the center of the vacuum nozzle 11 and the calibration nozzle 14 has been determined during assembly. Since a pressure needle driving device is provided above the vacuum nozzle 11 in this embodiment, the vacuum nozzle 11 is blocked by the pressure needle driving device 16, resulting in the visual inspection module being unable to obtain image information of the vacuum nozzle. Before the linear sliding module drives the vacuum nozzle 11 to move above the ejector pin 331, the image information of the calibration nozzle 14 is first obtained by the visual inspection module, so as to obtain the coordinate information of the calibration nozzle 14 based on the image information. , and determines whether the center of the calibration nozzle 14 coincides with the center of the ejector pin 331 based on the coordinate information. If the center of the calibration nozzle 14 coincides with the center of the ejector pin 331, the linear sliding module drives the vacuum nozzle 11 to move the set distance L in the horizontal direction, thereby adjusting the position of the vacuum nozzle 11 with the help of the calibration nozzle 14, thereby ensuring that the center of the vacuum nozzle 11 coincides with the center of the ejector pin 331 (for example, if the center distance between the vacuum nozzle 11 and the calibration nozzle 14 is 5 cm, then when the center of the calibration nozzle coincides with the center of the ejector pin 331, the linear sliding drive device 17 drives the vacuum nozzle 11 to move 5 cm in the horizontal direction, thereby ensuring that the center of the vacuum nozzle 11 coincides with the center of the ejector pin 331), so that the vacuum nozzle 11 can better pick up the chip on the ejector pin 331.

[0037] When the linear sliding module 17 drives the vacuum suction nozzle 11 to move toward the clamping carrier 41, the visual inspection module above the clamping carrier 41 is used to obtain image information and determine whether the center of the calibration suction nozzle 14 coincides with the center of the copper wire placement area based on the image information. If the center of the calibration suction nozzle 14 coincides with the center of the placement area, the linear sliding module drives the vacuum suction nozzle 11 to move a set distance L in the horizontal direction (with the same working principle as above), so that the center of the vacuum suction nozzle 11 coincides with the center of the placement area, thereby greatly improving the packaging accuracy of the chip and the copper wire.

[0038] Of course, the above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly. They cannot be used to limit the scope of protection of the present invention. Any modifications made based on the spirit of the main technical solution of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-precision chip picking mechanism, characterized in that: The invention comprises a vacuum suction nozzle (11), a pressing needle (12), a connecting seat (13), and a calibration suction nozzle (14), wherein the connecting seat (13) is arranged above the frame in a liftable manner, the vacuum suction nozzle (11) is fixedly arranged at the bottom of the connecting seat (13) and is connected to a negative pressure source, and the vacuum suction nozzle (11) is driven to rise and fall by a lifting drive device (15) to pick up the chip on the ejector pin (331), the calibration suction nozzle (14) is fixedly arranged on one side of the vacuum suction nozzle (11), and a visual mechanism (2) is arranged above the ejector pin (331). (2) Obtaining the coordinate information of the calibration nozzle (14), and driving the vacuum nozzle (11) to move horizontally by a set distance through a linear sliding module (17) so that the coordinate information of the vacuum nozzle (11) and the calibration nozzle (14) coincide with each other, the pressing needle (12) can be slidably inserted into the vacuum nozzle (11) in a lifting manner, and the pressing needle (12) is driven downward by a pressing needle driving device (16) so that the chip is separated from the vacuum nozzle (11) under the action of the pressing needle (12), so that the chip on the vacuum nozzle (11) completes the placement action.

2. A eutectic welding device, characterized in that: The chip picking mechanism (1), the visual mechanism (2), the chip feeding mechanism (3), and the chip packaging platform (4) as claimed in claim 1, wherein the chip feeding mechanism (3) is arranged on a frame, the chip picking mechanism (1) and the visual mechanism (2) are arranged above the chip feeding mechanism (3), the chip packaging platform (4) is arranged on one side of the chip feeding mechanism (3), and the chip packaging platform (4) is used to clamp the copper wire so that the chip picking mechanism (1) picks up the chip on the chip feeding mechanism (3) and places it on the copper wire of the chip packaging platform (4).

3. The eutectic welding device according to claim 2, characterized in that: The visual mechanism (2) comprises a plurality of visual inspection modules and a visual mounting frame. The visual mounting frame is mounted above the frame. The plurality of visual inspection modules are respectively arranged above the chip feeding mechanism (3) and the chip packaging platform (4), and are respectively fixedly mounted on the visual mounting frame.

4. The eutectic welding device according to claim 2, characterized in that: The chip feeding mechanism (3) comprises a chip placement tray (31), an XY screw slider module (32), and an ejector mechanism (33); the XY screw slider module (32) is arranged on the frame; the chip placement tray (31) is arranged on the XY screw slider module (32); the ejector mechanism (33) is arranged below the chip placement tray (31) and fixedly mounted on the frame; the chip on the chip placement tray (31) is driven to move along the X and Y axis directions by the XY screw slider module (32), so that the ejector mechanism (33) lifts the chip.

5. The eutectic welding device according to claim 2, characterized in that: The chip packaging platform (4) includes a clamping carrier (41), a clamping claw (42), and a second fine-tuning component (43). The second fine-tuning component (43) is arranged on a frame, the clamping carrier (41) is arranged above the second fine-tuning component (43), and the clamping claw (42) is arranged on the clamping carrier (41) in a liftable manner. The clamping carrier (41) holds the copper wire and drives the clamping claw (42) to clamp the copper wire through a clamping drive device (44).

6. The eutectic welding device according to claim 5, characterized in that: A heating module (45) is provided on the clamping carrier (41), so that the heating module (45) heats the solder paste on the copper wire.

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