Limiting structure, wafer drying device and wafer drying method

Abstract

The application provides a limiting structure, a wafer drying device and a wafer drying method. The limiting structure comprises a support, a first clamping tooth group, a second clamping tooth group and a first driving assembly. The support comprises a main beam, a first supporting beam and a second supporting beam connected to the two ends of the main beam respectively. The first clamping tooth group and the second clamping tooth group are arranged on the opposite sides of the main beam. The first driving assembly is connected with the first supporting beam and / or the second supporting beam, and is used for driving the main beam to rotate through the first supporting beam and / or the second supporting beam. When the main beam rotates to a first target position, the first clamping tooth group restricts the top of a plurality of wafers arranged side by side. When the main beam rotates to a second target position, the second clamping tooth group restricts the side of the plurality of wafers arranged side by side. The application can avoid the wafer damage problem caused by the wafer stacking in the cleaning and drying process, and ensure the production capacity.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to a limiting structure, a wafer drying apparatus, and a wafer drying method. Background Technology

[0002] There are two main methods in the industry for drying wafers: rotary drying, which involves rotating the wafer at high speed to remove dirty water from the wafer surface; and Marangoni drying, which is based on isopropanol.

[0003] Currently, the Marangoni drying process is widely used in the industry. Its principle is as follows: the wafer is transferred to a tank filled with deionized water, the tank is sealed, and isopropanol gas fills the cavity formed by the tank cover and the tank body through an outlet pipe on the cover. Then, the wafer is slowly raised until the top of the wafer is tangential to the water surface and the entire wafer is completely drained of water. During this stage, because the surface tension of isopropanol is much lower than that of water (at 25°C, the surface tension of isopropanol is 20.9 x 10⁻³ N / m), Water has a surface tension of 72.8 x 10⁻³ N / m, so a surface tension gradient will form on the surface of the sloping water flow, generating Marangoni convection. At this time, the water is drawn back to the surface, thus achieving the purpose of drying. Then, the wafer is raised into the tank cover to expel isopropanol gas and dirty water, and the wafer is purged to dry the wafer surface. Finally, the wafer is lowered to a predetermined position, such as the point of interaction with the PRT (process robot), the tank cover is opened, and the PRT removes the wafer from the tank.

[0004] To improve production efficiency, the industry typically places up to 50 wafers side-by-side into the tank simultaneously for the aforementioned Marangoni drying process. Due to the small gap between adjacent wafers and the large diameter of each wafer (usually 300mm), during the period from the initial stage of wafer removal to complete removal from the water, adjacent wafers are attracted to each other due to the surface tension of the water, resulting in wafer stacking. This not only easily damages the wafers but also affects subsequent transport, thus impacting production capacity. Summary of the Invention

[0005] In view of this, this application provides a limiting structure, a wafer drying apparatus, and a wafer drying method, which can improve the problems of wafer stacking and the resulting easy damage to wafers and impact on production capacity.

[0006] This application provides a limiting structure for limiting multiple wafers arranged side by side, the limiting structure comprising:

[0007] The support includes a main beam and a first support beam and a second support beam respectively connected to both ends of the main beam;

[0008] The first and second clasping tooth groups are located on opposite sides of the main beam;

[0009] A first drive assembly, connected to the first support beam and / or the second support beam, is used to drive the main beam to rotate via the first support beam and / or the second support beam. When the main beam rotates to a first target position, the first set of cleats constrains and positions the top of the plurality of wafers arranged side by side. When the main beam rotates to a second target position, the second set of cleats constrains and positions the sides of the plurality of wafers arranged side by side.

[0010] Optionally, the bracket further includes a first shaft, a first bushing, a second shaft, and a second bushing. The first shaft is fixed to one end of the first support beam, the first bushing is sleeved on the first shaft and used to fix it to one inner side of the groove cover, the second shaft is fixed to one end of the second support beam, and the second bushing is sleeved on the second shaft and used to fix it to the other inner side of the groove cover.

[0011] The first drive assembly includes a coupling and a drive source for driving the coupling, the coupling being connected to the second shaft for driving the second shaft.

[0012] Optionally, the other end of the first support beam is provided with two longitudinally opposite first branches;

[0013] The other end of the second support beam is provided with two longitudinally opposite second branches;

[0014] One end of the main beam extends between the two first branches and is fixed to the first branch, and the other end extends between the two second branches and is fixed to the second branch.

[0015] Optionally, the first branch and the second branch are parallel to the extension direction of the main beam.

[0016] Optionally, the first branch and the second branch are respectively provided with elongated holes, which are transversely extending through holes; the two ends of the main beam are provided with mounting holes for adjusting the longitudinal overlap position with the elongated holes, so as to adjust the position of the first locking tooth group and the second locking tooth group between the first support beam and the second support beam.

[0017] Optionally, the teeth in the first and second tooth groups are aligned one-to-one.

[0018] This application provides a wafer drying apparatus, comprising:

[0019] The tank is used to hold multiple wafers side by side and cleaning solution;

[0020] A groove cover, used to seal the groove body;

[0021] And, as described in any of the preceding claims, the bracket of the limiting structure is disposed inside the slot cover, and the first driving assembly is disposed outside the slot cover.

[0022] Optionally, the wafer drying apparatus further includes:

[0023] The second drive assembly is used to drive the plurality of wafers to perform lifting and lowering movements, and when driving the plurality of wafers to rise to a third target position in the tank, to cause the first drive assembly to drive the support to rotate to the first target position, and when driving the plurality of wafers to rise to a fourth target position in the tank cover, to cause the first drive assembly to drive the support to rotate to the second target position.

[0024] Optionally, the wafer drying apparatus further includes:

[0025] The third set of locking teeth is arranged laterally opposite to the limiting structure inside the slot cover. The third set of locking teeth is arranged in the slot cover and is used to constrain and position the two sides of the plurality of wafers respectively with the second set of locking teeth when the bracket is rotated to the second target position.

[0026] Optionally, the teeth in the third tooth group and the second tooth group are aligned one-to-one.

[0027] This application provides a wafer drying method, based on the limiting structure or wafer drying apparatus described in any of the preceding claims, the wafer drying method comprising:

[0028] Multiple wafers are placed side by side in a tank containing cleaning solution, and the tank is sealed with a lid. Isopropanol gas is then introduced into the tank.

[0029] Drive the support to rotate to the first target position so that the first set of chuck teeth constrains and positions the top of the plurality of wafers;

[0030] The cleaning solution in the tank is drained, and the multiple wafers are subjected to Magolani drying during the draining process.

[0031] Drive the bracket to rotate to the second target position;

[0032] The isopropanol gas and cleaning liquid in the tank are vented, and the plurality of wafers are raised into the tank cover, and the sides of the plurality of wafers are constrained and positioned by the second set of chucks that have been rotated to the second target position.

[0033] The plurality of wafers are purged to dry their surfaces.

[0034] As described above, in the stage from when multiple wafers side by side just begin to emerge from the surface of the cleaning solution to when they are fully exposed, the first drive assembly drives the main beam to rotate to the first target position via the first support beam and / or the second support beam. The first chuck group constrains and positions the top of the multiple wafers, which can avoid the stacking problem caused by the mutual adsorption between adjacent wafers due to the surface tension of the cleaning solution. This not only helps to avoid damage caused by scratching between adjacent wafers, but also facilitates subsequent transfer and can ensure production capacity.

[0035] Furthermore, after the multiple wafers have been dried using the Magolani method, the first drive assembly drives the main beam to rotate to the second target position via the first support beam and / or the second support beam. The second chuck group constrains and positions the sides of the multiple wafers, which can constrain and position the multiple wafers within the slot cover. This also helps to avoid wafer stacking problems and prevents damage caused by scratching between adjacent wafers during the purging and drying process. Attached Figure Description

[0036] Figure 1 This is a three-dimensional structural schematic diagram of a wafer drying apparatus provided in an embodiment of this application;

[0037] Figure 2 A side view of the wafer drying apparatus provided in an embodiment of this application;

[0038] Figure 3 This is a schematic diagram showing the fit between the tank cover and the tank body of the wafer drying apparatus provided in an embodiment of this application;

[0039] Figure 4 This is a schematic diagram of a limiting structure provided in an embodiment of this application;

[0040] Figure 5 for Figure 4 The diagram shown is an exploded view of the limiting structure.

[0041] Figure 6 This is a schematic diagram illustrating the structural fit between the limiting structure and the slot cover provided in the embodiments of this application;

[0042] Figure 7 and Figure 8 A schematic diagram of two perspectives when the first drive component drives the bracket to rotate to the first target position;

[0043] Figures 9 to 11 A schematic diagram of three perspectives when the first drive component drives the bracket to rotate from the first target position to the second target position;

[0044] Figure 12 This is a schematic diagram illustrating the process of placing multiple wafers into a tank and immersing them in a cleaning solution, as described in this application.

[0045] Figures 13 to 15This is a schematic diagram illustrating the positioning of the tops of multiple wafers using a limiting structure, as described in this application.

[0046] Figure 16 This is a schematic diagram illustrating how the limiting structure constrains and positions the tops of multiple wafers during the continuous discharge of cleaning fluid, as described in this application.

[0047] Figure 17 This application presents a schematic diagram of the first drive assembly driving the bracket to rotate to the second target position after the cleaning fluid and isopropanol gas have been emptied.

[0048] Figure 18 A schematic diagram of the second driving component of this application driving multiple wafers to rise to the fourth target position;

[0049] Figure 19 and Figure 20 A schematic diagram showing how the limiting structure constrains and positions multiple wafers by means of the second and third locating tooth groups when the first driving component drives the support to rotate to the second target position;

[0050] Figure 21 This is a schematic diagram of the slot cover opening slot body of this application;

[0051] Figure 22 This is a schematic diagram of the second driving component of this application driving multiple wafers to rise outside the tank;

[0052] Figure 23 This is a schematic flowchart of a wafer drying method provided in an embodiment of this application. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only a part of the embodiments of this application, and not all of them. Unless otherwise specified, the following embodiments and their technical features can be combined with each other, and also belong to the technical solutions of this application.

[0054] In the description of the embodiments of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the technical solutions of the corresponding embodiments, and are not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limitations on this application.

[0055] Please refer to the following: Figures 1 to 22This is a schematic diagram of a wafer drying apparatus provided in an embodiment of this application. The wafer drying apparatus includes a tank body 1, a tank cover 2, and a limiting structure 3.

[0056] exist Figure 2 , Figure 6 , Figures 12 to 22 In this application, perspective drawing is used to show structural elements including the tank body 1 and the tank cover 2, so as to show other structural elements located inside them.

[0057] To facilitate the description and understanding of the present application's solution, the following example uses a scenario of cleaning and drying multiple wafers 6. The direction of gravity is referred to as the second direction y. During the cleaning and drying process, the multiple wafers 6 move up and down along the direction of gravity. A three-dimensional Cartesian coordinate system is established using this second direction y as one of its coordinate axes. The positive directions of the other two coordinate axes of this three-dimensional Cartesian coordinate system are referred to as the first direction x and the third direction z, respectively, and the first direction x, the second direction y, and the third direction z are all perpendicular to each other. It should be understood that the term "perpendicular" throughout this application does not require the angle between the two directions to be 90°, but rather allows for deviations such as ±10°. That is, "perpendicular" can be understood as the angle between any two directions being 80° to 100°. Similarly, the term "parallel" throughout this application does not require the angle between the two directions to be 0° or 180°, but rather allows for deviations such as ±10°. That is, "parallel" can be understood as the angle between any two directions being 0° to 10° or 170° to 190°.

[0058] Tank 1 is used to hold multiple wafers 6 arranged side by side and cleaning solution, such as... Figure 3 As shown, the cover 2 can move relative to the tank body 1 to open or close the tank body 1.

[0059] The limiting structure 3 includes a bracket 31, a first locking tooth assembly 321, a second locking tooth assembly 322, and a first driving assembly 33. The bracket 31 is disposed within the slot cover 2 and includes a main beam 311 and a first support beam 312 and a second support beam 313 respectively connected to both ends of the main beam 311. The first locking tooth assembly 321 and the second locking tooth assembly 322 are located on opposite sides of the main beam 311. For example, in... Figure 4 and Figure 5 In the scenario shown, the main beam 311 is a long, strip-shaped plate structure, with the first locking tooth group 321 and the second locking tooth group 322 respectively located on the two large surfaces of the main beam 311. The first drive assembly 33 is located outside the slot cover 2 and is connected to the second support beam 313 to drive the main beam 311 to rotate.

[0060] In one example, combined Figure 4 and Figure 5 As shown, the bracket 31 also includes a first shaft 314, a first bushing 315, a second shaft 316, and a second bushing 317.

[0061] The first bushing 315 is sleeved on the first shaft 314 and fixed to one inner side of the groove cover 2. For example, the groove cover 2 has an opening on one inner side, and the first bushing 315 is embedded and fixed in the opening. One end of the first support beam 312 has two branches, each branch extending along the length of the first support beam 312 and the two branches are arranged opposite to each other, making one end of the first support beam 312 U-shaped. The part of the first bushing 315 that is not embedded in the opening of the groove cover 2 is located between the first support beam 312 and one inner side of the groove cover 2. The part of the first shaft 314 that is outside the first bushing 315 is accommodated between the two branches of the first support beam 312. The first shaft 314 is fixed to one end of the first support beam 312 by two protruding posts that are arranged vertically and vertically and pass through the mounting holes respectively provided in the two branches.

[0062] The second bushing 317 is fitted onto the second shaft 316 and can be fixed inside the groove cover 2 by being embedded in the opening on the other inner side of the groove cover 2. One end of the second support beam 313 also has two branches, each extending along the length of the second support beam 313, and these two branches are arranged opposite to each other, making one end of the second support beam 313 U-shaped. The portion of the second shaft 316 not embedded in the opening of the groove cover 2 is located between the second support beam 313 and the other inner side of the groove cover 2. The portion of the second shaft 316 outside the second bushing 317 is accommodated between the two branches of the second support beam 313, and is fixed to one end of the second support beam 313 by two protruding posts passing through the mounting holes respectively provided on the two branches.

[0063] The first drive assembly 33 includes a coupling 331 and a drive source 332, which can be a DC motor. The drive source 332 is connected to the coupling 331 to drive the coupling 331, which is connected to a second shaft 316. Optionally, the two are fixed together by a set screw 318. Figure 1 and Figure 6 As shown, a protruding platform 21 is provided on the outer side of the slot cover 2. The bottom of the drive source 332 can be fixed to the platform 21, and the side of the drive source 332 can be fixed to the outside of the slot cover 2 by screws 319. The number of screws 319 includes, but is not limited to, those mentioned above. Figure 5 The four shown.

[0064] The drive source 332 drives the coupling 331 to rotate, thereby driving the second shaft 316 to rotate (e.g., synchronously). The second shaft 316 drives the second support beam 313 to drive the main beam 311 to rotate. The second shaft 316 rotates relative to the second bushing 317, while the second bushing 317 does not rotate relative to the groove cover 2. The main beam 311 drives the first support beam 312 to drive the first shaft 314 to rotate relative to the first bushing 315, while the first bushing 315 is fixed inside the groove cover 2 and does not rotate.

[0065] The first drive assembly 33 drives the bracket 31 to rotate, including at least two situations:

[0066] Scenario 1, please refer to the following as well. Figure 7 and Figure 8 As shown, the first drive assembly 33 drives the bracket 31 to rotate to the first target position. At the first target position, the first support beam 312 and the second support beam 313 are both in a vertical state, extending out of the bottom of the groove cover 2 and into the groove 1. The two large surfaces of the main beam 311 are both horizontally arranged, that is, perpendicular to the second direction y. The teeth of the first tooth group 321 face upward, and the teeth of the second tooth group 322 face downward. The entire main beam 311 and the first tooth group 321 and the second tooth group 322 arranged on it are all located in the groove 1.

[0067] Scenario 2, please refer to the following as well. Figure 9 and Figure 10 As shown, the first drive assembly 33 drives the bracket 31 to rotate from the first target position to the second target position. At the second target position, the first support beam 312 and the second support beam 313 are in a horizontal state, the two large surfaces of the main beam 311 are both vertically arranged, that is, parallel to the second direction y, and the entire bracket 31 (including the first locking tooth group 321 and the second locking tooth group 322 disposed on the bracket 31) is located inside the slot cover 2.

[0068] In other words, the first drive component 33 can drive the bracket 31 to rotate in order to switch between the first target position and the second target position.

[0069] In other examples, the first drive assembly 33 can be connected to the first support beam 312. The first support beam 312 adopts the same structural design as the second support beam 313 and the slot cover 2. The second support beam 313 adopts the same structural design as the first support beam 312 and the slot cover 2. The drive source 332 drives the coupling 331 to rotate, thereby driving the first shaft 314 to rotate. The first shaft 314 drives the first support beam 312 to drive the main beam 311 to rotate. The main beam 311 drives the second support beam 313 to rotate.

[0070] Alternatively, the first drive assembly 33 may include two drive sources 332 and two couplings 331, with the two couplings 331 respectively connected to the first support beam 312 and the second support beam 313, and both the first support beam 312 and the second support beam 313 employing the following... Figure 5 The second support beam 313 is designed to fit the groove cover 2. Each drive source 332 drives the corresponding coupling 331 to rotate, thereby driving the first support beam 312 and the second support beam 313 to rotate, so as to jointly drive the main beam 311 to rotate.

[0071] Please refer to the following: Figures 1 to 22 The wafer drying apparatus also includes a second drive assembly 4 and a third clamping tooth assembly 5. The second drive assembly 4 extends into the tank 1 and is used to drive the support assembly and multiple wafers 6 placed on the support assembly to move up and down. The third clamping tooth assembly 5 is laterally opposite to the limiting structure within the tank cover 2. Optionally, such as... Figure 5 As shown, the third tooth group 5 is fixed inside the slot cover 2 by screw fastening.

[0072] The working principle and process of the wafer drying equipment are described below:

[0073] First, refer to Figure 12 As shown, multiple wafers 6 are placed side-by-side in a tank 1 containing a cleaning solution (e.g., deionized water), submerging the tops of the wafers 6. The tank 1 is then sealed with a tank cover 2. Isopropanol gas (represented by circular dots in the figure) is introduced into the tank 1 through a pipe on the tank cover 2, filling the space formed by the tank cover 2 and the tank 1 with isopropanol gas. In this state, the first drive assembly 33 drives the support 31 to rotate to a second target position. At this second target position, the first support beam 312 and the second support beam 313 are horizontal, both large surfaces of the main beam 311 are parallel to the second direction y, and the entire support 31 is located inside the tank cover 2 and does not extend beyond the bottom of the tank cover 2. The third locking tooth group 5 is opposite to and oriented towards the second locking tooth group 322.

[0074] Then, refer to together Figures 13 to 16 As shown, the first drive assembly 33 drives the bracket 31 to rotate to the first target position, so that the first cleat group 321 constrains and positions the tops of multiple wafers 6. At the first target position, the first support beam 312 and the second support beam 313 are both in a vertical state, extending out of the bottom of the tank cover 2 and into the tank body 1. The two large surfaces of the main beam 311 are perpendicular to the second direction y, and the entire main beam 311 is located inside the tank body 1. The cleats of the first cleat group 321 are immersed in the cleaning fluid and constrain and position the tops of multiple wafers 6.

[0075] Alternatively, in other examples, the first drive assembly 33 drives the support 31 to rotate to the first target position only when the second drive assembly 4 drives the plurality of wafers 6 to rise to the third target position within the slot cover 2. At the third target position, the maximum length of the first locating tooth group 321 extending into the slot body 1 allows the locating teeth of the first locating tooth group 321 to constrain and position the tops of the plurality of wafers 6.

[0076] Next, please refer to Figure 16 As shown, the cleaning solution in the tank 1 can be drained by opening the drain valve 10 located at the bottom of the tank 1. During the draining process, multiple wafers 6 are subjected to Magolani drying. The purpose of Magolani drying is to remove contaminants from the surface of the wafers 6 using the cleaning solution. The specific principle can be found in the existing description and will not be repeated here.

[0077] During the process of draining the cleaning fluid, such as Figure 16 As shown, the level of the cleaning fluid continues to drop, and this application can continuously introduce isopropanol gas into the tank 1.

[0078] See also Figures 17 to 20 As shown, after the isopropanol gas and cleaning fluid in the tank 1 are emptied, the second drive assembly 4 drives multiple wafers 6 to rise. When they rise to the fourth target position inside the tank cover 2, the first drive assembly 33 drives the support 31 to rotate to the second target position. At the fourth target position, the teeth of the third clamping tooth group 5 and the second clamping tooth group 322 clamping the same wafer 6 are located on the diameter of the wafer 6. At the second target position, the third clamping tooth group 5 and the second clamping tooth group 322 respectively constrain and position the two sides of the multiple wafers 6. Optionally, the teeth in the third clamping tooth group 5 and the second clamping tooth group 322 are aligned one by one, thereby aligning and clamping each wafer 6 one by one, avoiding damage caused by the wafer 6 being deflected due to misalignment of the two sides of the clamping teeth. The teeth in the first clamping tooth group 321 and the second clamping tooth group 322 can also be aligned one by one, so that when the support 31 switches between the first target position and the second target position, it can align and clamp each wafer 6 one by one without changing the position of the multiple wafers 6.

[0079] Alternatively, in other examples, when the cleaning fluid is discharged below the top of the plurality of wafers 6, the first drive assembly 33 can drive the support 31 to rotate to the second target position; then the second drive assembly 4 drives the plurality of wafers 6 to rise to the fourth target position, and then vents the isopropanol gas and cleaning fluid in the tank 1.

[0080] Please see Figure 18 As shown, after the second driving component 4 drives multiple wafers 6 to rise to the fourth target position, the multiple wafers 6 are purged, for example, by introducing nitrogen or inert gas into the tank 1 through the pipe on the tank cover 2, so as to dry the surface of the multiple wafers 6. Figure 21As shown, wafer 6 is finally lowered to a predetermined position within tank 1, such as the point where it interacts with the process robot, and then tank cover 2 is opened, as shown. Figure 22 As shown, the second driving component 4 drives multiple wafers 6 to rise outside the tank 1, and finally removes the wafers 6 from the tank 1.

[0081] As described above, in the stage from when the multiple wafers 6 side by side just begin to emerge from the surface of the cleaning solution to when they are fully exposed, the first driving component 33 drives the support 31 to rotate to the first target position, and the first clamping tooth group 321 constrains and positions the top of the multiple wafers 6. This can avoid the stacking problem caused by the mutual adsorption between adjacent wafers 6 due to the surface tension of the cleaning solution. This not only helps to avoid damage caused by scratching between adjacent wafers 6, but also facilitates subsequent transfer and can ensure production capacity.

[0082] After the multiple wafers 6 have been dried using the Magolani method, the first drive assembly 33 drives the support 31 to rotate to the second target position. The second chuck assembly 322 constrains and positions the sides of the multiple wafers 6, which can constrain and position the multiple wafers 6 within the slot cover 2. This also helps to avoid wafer 6 stacking problems and can also help to avoid damage caused by scratching between adjacent wafers 6 during the purging and drying process.

[0083] Please continue reading. Figure 4 and Figure 5 As shown, the other end of the first support beam 312 is provided with two longitudinally opposite first branches 318, each of which can be parallel to the extension direction of the main beam 311; the other end of the second support beam 313 is provided with two longitudinally opposite second branches 319, each of which can be parallel to the extension direction of the main beam 311; one end of the main beam 311 extends between the two first branches 318 and is fixed to the first branch 318, for example, by screws, and the other end extends between the two second branches 319 and is fixed to the second branch 319, for example, by screws. This arrangement allows for the provision of locking teeth at both the end of the main beam 311 extending into the two first branches 318 and the other end extending into the two second branches 319, resulting in a larger number of locking teeth in the first locking tooth group 321 and the second locking tooth group 322, which is beneficial for constraining and positioning a large number of wafers 6.

[0084] The first branch 318 and the second branch 319 may each be provided with elongated holes, which are transversely extending through holes. The main beam 311 has mounting holes (not shown in the figure) at both ends. By adjusting the longitudinal alignment of the mounting holes with the corresponding elongated holes, the positions of the first locking tooth group 321 and the second locking tooth group 322 between the first support beam 312 and the second support beam 313 can be adjusted, thereby achieving adjustment of the locking teeth on both sides of the main beam 311.

[0085] It should be understood that the wafer drying apparatus provided in this application is a complete device, which also has other necessary structures known to wafer drying apparatuses, and may also have other non-essential structures. Here, only the components involved in cleaning and drying are described, and other components are not described in detail.

[0086] In any of the aforementioned wafer drying apparatuses, the limiting structure 3 can be manufactured, assembled, transported, and sold as a separate device. Accordingly, this application also provides a limiting structure, which includes at least a support, a first set of retaining teeth, a second set of retaining teeth, and a first driving assembly.

[0087] The support structure includes a main beam and a first support beam and a second support beam connected to both ends of the main beam, respectively.

[0088] The first and second clasp groups are located on opposite sides of the main beam;

[0089] The first drive assembly is connected to the first support beam and / or the second support beam, and is used to drive the main beam to rotate through the first support beam and / or the second support beam. When the main beam rotates to the first target position, the first set of cleats constrains and positions the top of multiple wafers arranged side by side. When the main beam rotates to the second target position, the second set of cleats constrains and positions the sides of multiple wafers arranged side by side.

[0090] The components of the limiting structure can have the same structural design and the same beneficial effects as the components with the same name in any of the aforementioned examples of the limiting structure, and will not be described in detail here.

[0091] This application also provides a wafer drying method, based on the wafer drying apparatus or the limiting structure of any of the foregoing examples, such as... Figure 23 As shown, the wafer drying method includes the following steps:

[0092] S1: Place multiple wafers side by side in a tank containing cleaning solution, seal the tank with the tank cover, and introduce isopropanol gas into the tank.

[0093] S2: Drive the support to rotate to the first target position so that the first set of chuck teeth constrains and positions the top of multiple wafers.

[0094] S3: Drain the cleaning solution from the tank and perform Magolani drying on multiple wafers during the cleaning solution draining process.

[0095] S4: Drive the bracket to rotate to the second target position.

[0096] S5: Empty the isopropanol gas and cleaning fluid from the tank, and raise multiple wafers into the tank cover. The sides of the multiple wafers are then constrained and positioned by the second set of chucks that have been rotated to the second target position.

[0097] S6: Blow up multiple wafers to dry the surface of multiple wafers.

[0098] The limiting structure, wafer drying apparatus, and wafer drying method provided in this application are based on the same concept, and the principles for solving the problem are basically the same or similar. The implementation methods of each protection subject can be referred to each other. For example, the various steps of the wafer drying method can be referred to the working principle and process of the aforementioned wafer drying apparatus. The repetitions in the implementation methods of each protection subject will not be repeated.

[0099] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. For those skilled in the art, any equivalent structural transformations made using the content of this specification and drawings are similarly included within the patent protection scope of this application.

[0100] Although this document uses terms such as "first," "second," etc., to describe various types of information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. Furthermore, the singular forms "a," "an," and "the" are intended to also include the plural forms. The terms "or" and "and / or" are interpreted as inclusive, or meaning either one or any combination thereof. Exceptions to this definition only arise when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

Claims

1. A limiting structure for limiting the position of multiple wafers arranged side by side, characterized in that, The limiting structure includes: The support includes a main beam and a first support beam and a second support beam respectively connected to both ends of the main beam; The first and second clasping tooth groups are located on opposite sides of the main beam; A first drive assembly is provided, wherein the first support beam and / or the second support beam are axially connected to the first drive assembly. The first drive assembly is used to drive the first support beam and / or the second support beam to rotate around the axis connected to the axis, thereby driving the main beam to rotate. When the main beam rotates to a first target position, the plurality of wafers arranged side by side are moved to the bottom of the first clasp group, and the first clasp group constrains and positions the top of the plurality of wafers arranged side by side. When the main beam rotates to a second target position, the plurality of wafers arranged side by side are moved to the side of the second clasp group, and the second clasp group constrains and positions the side of the plurality of wafers arranged side by side.

2. The limiting structure according to claim 1, characterized in that, The bracket further includes a first shaft, a first bushing, a second shaft, and a second bushing. The first shaft is fixed to one end of the first support beam. The first bushing is sleeved on the first shaft and used to fix it to one inner side of the groove cover. The second shaft is fixed to one end of the second support beam. The second bushing is sleeved on the second shaft and used to fix it to the other inner side of the groove cover. The first drive assembly includes a coupling and a drive source for driving the coupling, the coupling being connected to the second shaft for driving the second shaft.

3. The limiting structure according to claim 2, characterized in that, The other end of the first support beam is provided with two longitudinally opposite first branches; The other end of the second support beam is provided with two longitudinally opposite second branches; One end of the main beam extends between the two first branches and is fixed to the first branch, and the other end extends between the two second branches and is fixed to the second branch.

4. The limiting structure according to claim 3, characterized in that, The first branch and the second branch are parallel to the extension direction of the main beam.

5. The limiting structure according to claim 3, characterized in that, The first branch and the second branch are each provided with an elongated hole, which is a through hole extending laterally; The main beam has mounting holes at both ends for adjusting the longitudinal overlap with the elongated hole, thereby adjusting the position of the first and second locking tooth groups between the first and second support beams.

6. The limiting structure according to any one of claims 1 to 5, characterized in that, The teeth in the first and second tooth groups are aligned one by one.

7. A wafer drying apparatus, characterized in that, include: The tank is used to hold multiple wafers side by side and cleaning solution; A groove cover, used to seal the groove body; And, in any one of claims 1 to 6, the limiting structure, wherein the bracket of the limiting structure is disposed inside the groove cover, and the first driving component is disposed outside the groove cover.

8. The wafer drying apparatus according to claim 7, characterized in that, Also includes: The second drive assembly is used to drive the plurality of wafers to perform lifting and lowering movements, and when driving the plurality of wafers to rise to a third target position in the tank, to cause the first drive assembly to drive the support to rotate to the first target position, and when driving the plurality of wafers to rise to a fourth target position in the tank cover, to cause the first drive assembly to drive the support to rotate to the second target position.

9. The wafer drying apparatus according to claim 7 or 8, characterized in that, Also includes: The third set of locking teeth is arranged laterally opposite to the limiting structure inside the slot cover. The third set of locking teeth is arranged in the slot cover and is used to constrain and position the two sides of the plurality of wafers respectively with the second set of locking teeth when the bracket is rotated to the second target position.

10. The wafer drying apparatus according to claim 9, characterized in that, The teeth in the third tooth group and the second tooth group are aligned one by one.

11. A wafer drying method, characterized in that, Based on the limiting structure according to any one of claims 1 to 6 or the wafer drying apparatus according to any one of claims 7 to 9 The wafer drying method includes: Multiple wafers are placed side by side in a tank containing cleaning solution, and the tank is sealed with a lid. Isopropanol gas is then introduced into the tank. Drive the support to rotate to the first target position so that the first set of chuck teeth constrains and positions the top of the plurality of wafers; The cleaning solution in the tank is drained, and the multiple wafers are subjected to Magolani drying during the draining process. Drive the bracket to rotate to the second target position; The isopropanol gas and cleaning liquid in the tank are vented, and the plurality of wafers are raised into the tank cover, and the sides of the plurality of wafers are constrained and positioned by the second set of chucks that have been rotated to the second target position. The plurality of wafers are purged to dry their surfaces.

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