Inclined guide pillar type automatic pressing clamp

Abstract

The invention provides an inclined guide column type automatic pressing clamp, and relates to the technical field of pressing clamps, the inclined guide column type automatic pressing clamp comprises a hot-pressing upper pressing plate and a hot-pressing placing table, the hot-pressing upper pressing plate is located above the hot-pressing placing table, and a pressing mechanism facilitating pressing is arranged on the hot-pressing placing table; the pressing mechanism comprises an inclined guide pillar pressing block, an elastic pressing block, an adapter plate and a bonding chip body, a chip placing groove is formed in the hot-pressing placing table, the inclined guide pillar pressing block is located on the inner side wall of the chip placing groove, the elastic pressing block is located at the upper end of the hot-pressing placing table, the adapter plate is located at the upper end of the hot-pressing placing table, and the bonding chip body is arranged on the chip placing groove. And an up-and-down movement mechanism is fixedly mounted at the upper end part of the hot-pressing upper pressing plate. According to the device, a rectangular plate, a pushing spring and an elastic pressing block which can be used for fixing and pushing the bonding chip body when the bonding chip body is pressed are arranged, so that the possibility that the bonding chip body is possibly adhered to a hot-pressing upper pressing plate after pressing can be effectively avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of clamping fixtures, and more specifically, particularly relates to an inclined guide column type automatic clamping fixture. Background Art

[0002] In the manufacturing process of bonded chips, the bonding step is crucial. Specifically, during the bonding operation, the bonded chip needs to be placed on a specific pressure device and pressed continuously for a specific period of time under certain pressure conditions.

[0003] The existing chips have the following disadvantages during thermal bonding:

[0004] 1. When the existing chip is hot pressed, after the hot pressing is completed, the chip may be adhered to the upper pressing plate, and there is a certain risk when manually approaching the pressing plate to take the chip;

[0005] 2. To ensure that the chip does not adhere to the upper pressing plate, the existing technology usually uses a manual clamp to fix the chip. Fixing the chip by clamp operation is labor-intensive, and manual chip fixation also has certain risks during hot pressing.

[0006] Therefore, in view of this, the existing structure and defects are studied and improved, and an inclined guide column type automatic clamping fixture is provided, in order to achieve a more practical purpose. Summary of the invention

[0007] In order to solve the above technical problems, the present invention provides an inclined guide column type automatic clamping fixture to solve the above problems.

[0008] The inclined guide column type automatic pressing fixture comprises a hot pressing upper pressing plate and a hot pressing placement table, wherein the hot pressing upper pressing plate is located above the hot pressing placement table, and a pressing mechanism is provided on the hot pressing placement table for facilitating pressing, wherein the pressing mechanism comprises an inclined guide column pressing block, an elastic pressing block, an adapter plate and a bonding chip body, and a chip placement groove is provided on the hot pressing placement table, wherein the inclined guide column pressing block is located on the inner side wall of the chip placement groove, the elastic pressing block is located on the upper end of the hot pressing placement table, and the adapter plate is located on the upper end of the hot pressing placement table, and an up-and-down movement mechanism is fixedly installed on the upper end of the hot pressing upper pressing plate, and the hot pressing upper pressing plate is fixedly installed on the frame through the up-and-down movement mechanism. The upper end portion of the hot pressing placement table is provided with two horizontal positioning grooves, and the upper end portion of the hot pressing placement table is also provided with an inclined guide column mounting groove, the inclined guide column pressing block is located at the inner side wall of the inclined guide column mounting groove, a reset spring is fixedly installed between the inclined guide column pressing block and the inclined guide column mounting groove, the upper end portion of the inclined guide column pressing block is provided with an embedded groove, the inner side wall of the embedded groove is provided with a pressure-bearing steel column, a limiting slide groove is provided above the adapter plate, the inclined guide column pressing block is located at the inner side wall of the limiting slide groove, the elastic pressing block is located on one side of the inclined guide column pressing block, and a pushing spring is provided on one side of the elastic pressing block, and the pushing spring is attached to the side end portion of the bonding chip body.

[0009] Preferably, an elastic U-shaped piece is fixedly installed between the push spring and the elastic pressing block.

[0010] Preferably, a pushing spring is fixedly installed between the elastic pressing block and the pushing rectangular plate.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] In the present invention, by setting up a pushing rectangular plate and a pushing spring to cooperate with each other, the bonded chip body can be initially clamped when the bonded chip body is hot pressed. The bonded chip body needs to be accurately aligned and positioned during hot pressing. The initial clamping can ensure that the bonded chip body always remains in the correct position during the entire hot pressing process, avoiding displacement of the bonded chip body due to external interference, equipment vibration and other factors. This is crucial to achieving high-quality bonding, and can ensure that each connection point is accurately aligned, thereby improving the success rate and reliability of bonding.

[0013] In the present invention, the bonded chip body is initially fixed during hot pressing. Through initial clamping, the bonded chip body can withstand pressure evenly during the hot pressing process. If there is no clamping, the bonded chip body may be subjected to excessive or insufficient local force under the action of pressure, resulting in uneven hot pressing effect. Uniform force helps to achieve a close bond between the bonded chip body and the substrate or other components, ensures consistent connection strength after hot pressing, and reduces defects and unstable performance caused by uneven force.

[0014] In the present invention, by providing a rectangular plate, a pushing spring and an elastic pressing block that can fix the bonding chip body when the bonding chip body is pressed, the possibility that the bonding chip body may stick to the hot pressing upper platen after pressing can be effectively avoided, and the dangerous situation that may occur when humans approach the hot pressing upper platen can be avoided.

[0015] In the present invention, by setting up a clamping device for the bonded chip body, there is no need for manual fixation of the bonded chip body, and the bonded chip body can be clamped and picked up quickly and accurately. The speed is much higher than manual operation, and no additional manual operation is required to fix the bonded chip body, which shortens the production cycle and the automated system can operate continuously.

[0016] In the present invention, a clamping device that can automatically reset is provided, and the equipment can be reset by the cooperation of a reset spring and a push spring. There is no need for manual operation to disassemble the clamp. The automatic release of the clamp can complete the preparation work for disassembling the bonded chip body in a very short time. There is no need to manually disassemble the clamp one by one, which greatly saves operation time. The automated clamp release process can be closely coordinated with other links of the production line to achieve continuous operation. Automatic release of the clamp ensures the continuity of production and increases the output per unit time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the hot pressing upper pressing plate of the present invention;

[0018] Figure 2 It is a schematic diagram of the structure of the hot pressing placement table of the present invention;

[0019] Figure 3 The present invention Figure 2 Schematic diagram of the cross-sectional structure at AA;

[0020] Figure 4 It is a schematic diagram of the structure of the bonding chip body of the present invention;

[0021] Figure 5 It is a schematic diagram of the structure of the inclined guide column pressing block of the present invention.

[0022] In the figure, the correspondence between the component names and the figure numbers is: 1. Hot pressing upper pressure plate; 11. Up and down movement mechanism; 2. Hot pressing placement table; 21. Horizontal positioning groove; 22. Chip placement groove; 23. Oblique guide column installation groove; 3. Oblique guide column pressure block; 31. Reset spring; 32. Embedded groove; 33. Pressure-bearing steel column; 4. Elastic clamping block; 41. Push spring; 42. Push rectangular plate; 43. Elastic U-shaped part; 5. Adapter plate; 51. Limiting slide groove; 6. Bonding chip body. DETAILED DESCRIPTION

[0023] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0024] See also Figure 1-Figure 5 The present invention provides an inclined guide column type automatic pressing fixture, comprising a hot pressing upper pressing plate 1 and a hot pressing placing table 2, wherein the hot pressing upper pressing plate 1 is located above the hot pressing placing table 2, and a pressing mechanism for facilitating pressing is provided on the hot pressing placing table 2, wherein the pressing mechanism comprises an inclined guide column pressing block 3, an elastic pressing block 4, an adapter plate 5 and a bonding chip body 6, and a chip placing groove 22 is provided on the hot pressing placing table 2, wherein the inclined guide column pressing block 3 is located on the inner side wall of the chip placing groove 22, the elastic pressing block 4 is located on the upper end of the hot pressing placing table 2, and the adapter plate 5 is located on the upper end of the hot pressing placing table 2, and the bonding chip body 6 is provided on the bonding chip body 6. In the manufacturing process of the chip body 6, the bonding process is very important. Specifically, when the bonded chip body 6 is being bonded, it needs to be placed on a specific pressure device and continuously pressed for a specific period of time under certain pressure conditions. However, after the pressing operation is completed, when the hot pressing upper platen 1 of the pressure device is lifted, the bonded chip body 6 often sticks to the hot pressing upper platen 1. This phenomenon is relatively common in the manufacturing of the bonded chip body 6 and may have a certain impact on the production efficiency and product quality. Therefore, the bonded chip body 6 needs to be fixed;

[0025] The upper end of the hot pressing upper pressing plate 1 is fixedly installed with an up-and-down moving mechanism 11, and the hot pressing upper pressing plate 1 is fixedly installed on the frame through the up-and-down moving mechanism 11. When operating the bonded chip body 6, the bonded chip body 6 with the sealing film preliminarily attached can be placed in the chip placement groove 22 on the hot pressing placement table 2. At this time, the push spring 41 will rebound, and the push spring 41 rebounds to push the push rectangular plate 42 close to the bonded chip body 6 and press the bonded chip body 6, so as to give the bonded chip body 6 an initial pressure;

[0026] The device is provided with a push rectangular plate 42 and a push spring 41 to cooperate with each other. When the bonded chip body 6 is hot pressed, the bonded chip body 6 can be initially clamped. When the bonded chip body 6 is hot pressed, it needs to be accurately aligned and positioned. The initial clamping can ensure that the bonded chip body 6 is always kept in the correct position during the entire hot pressing process, avoiding displacement of the bonded chip body 6 due to external interference, equipment vibration and other factors. This is very important for achieving high-quality bonding, and can ensure that each connection point is accurately aligned, thereby improving the success rate and reliability of bonding.

[0027] Two transverse positioning grooves 21 are provided at the upper end of the hot pressing placement table 2, and an inclined guide column mounting groove 23 is also provided at the upper end of the hot pressing placement table 2. The inclined guide column pressing block 3 is located at the inner side wall of the inclined guide column mounting groove 23. A reset spring 31 is fixedly installed between the inclined guide column pressing block 3 and the inclined guide column mounting groove 23. An embedded groove 32 is provided at the upper end of the inclined guide column pressing block 3, and a pressure-bearing steel column 33 is provided on the inner side wall of the embedded groove 32. After the bonding chip body 6 is fixed, the user can start the up and down movement mechanism 11 and the hot pressing upper pressing plate 1. The start of the up and down movement mechanism 11 will drive the hot pressing upper pressing plate 1 to move downward. When the hot pressing upper pressing plate 1 is pressed down to contact with the pressure-bearing steel column 33, the hot pressing upper pressing plate 1 will generate pressure on the pressure-bearing steel column 33. The pressure-bearing steel column 33 will be subjected to pressure and will drive the inclined guide column pressing block 3 to move downward through the embedded groove 32. The upper end of the inclined guide column pressing block 3 is inclined;

[0028] A limited slot 51 is provided above the adapter plate 5, the inclined guide column pressing block 3 is located on the inner side wall of the limited slot 51, the elastic pressing block 4 is located on one side of the inclined guide column pressing block 3, and a push spring 41 is provided on one side of the elastic pressing block 4. The reset spring 31 and the push spring 41 can be used to reset the device, and the clamp can be disassembled without manual operation. The automatic release of the clamp can complete the preparation work for disassembly of the bonded chip body 6 in a very short time, and there is no need to manually disassemble the clamp one by one, which greatly saves the operation time. The automated clamp release process can be closely coordinated with other links of the production line to realize continuous operation. Automatic release of the clamp ensures the continuity of production and improves the output per unit time.

[0029] The pushing spring 41 is attached to the side end of the bonding chip body 6, and an elastic U-shaped piece 43 is fixedly installed between the pushing spring 41 and the elastic pressing block 4, and a pushing spring 41 is fixedly installed between the elastic pressing block 4 and the pushing rectangular plate 42. When the inclined guide column pressing block 3 moves downward, it will push the elastic pressing block 4 to move, and the movement of the elastic pressing block 4 will generate a driving force. The movement of the elastic pressing block 4 will further squeeze the pushing spring 41, and the pushing spring 41 will be further pushed by the force to push the pushing rectangular plate 42, and the pushing rectangular plate 42 will further push and press the bonding chip body 6. After the hot pressing upper pressing plate 1 presses the sealing film, the up and down moving mechanism 11 can be started to drive the hot pressing upper pressing plate 1 to move upward. At the moment when the hot pressing upper pressing plate 1 leaves the bonding chip body 6, the bonding chip body 6 is in a compressed state, so that the bonding chip body 6 will not be stuck to the hot pressing upper pressing plate 1;

[0030] After the pressing of the bonding chip body 6 is completed, the up and down movement mechanism 11 will drive the hot pressing upper pressing plate 1 to move upward. At this time, the hot pressing upper pressing plate 1 no longer applies pressure to the pressure-bearing steel column 33. At this time, the reset spring 31 will rebound. The rebound of the reset spring 31 will drive the pressure-bearing steel column 33 to move upward. The pressure-bearing steel column 33 no longer limits the elastic clamping block 4. At this time, the pushing spring 41 will rebound. Under the action of the pushing spring 41, the elastic clamping block 4 will reset, and at the same time, the pushing rectangular plate 42 will no longer clamp the bonding chip body 6, so that the clamping pressure on the bonding chip body 6 can be reduced, and the user can disassemble the bonding chip body 6;

[0031] The device prevents the bonding chip body 6 from sticking to the hot pressing upper platen 1. The bonding chip body 6 is a highly precise electronic component. If it sticks to the hot pressing upper platen 1 and is forcibly removed, it may cause physical damage to the bonding chip body 6, such as cracks, scratches, etc. The clamping device can avoid this situation and ensure the integrity of the bonding chip body 6, thereby ensuring product quality. With the clamping device, the pressing process can be carried out more smoothly, and production will not be frequently interrupted due to the adhesion problem of the bonding chip body 6, which helps to achieve continuous production and improve the overall output capacity of the production line;

[0032] The device is provided with a clamping device for the bonded chip body 6, and there is no need for manual fixing and clamping of the bonded chip body 6. The bonded chip body 6 can be clamped and taken quickly and accurately, and there is no need for additional manual operation to fix the bonded chip body 6, which shortens the production cycle, and the automated system can operate continuously;

[0033] The device is provided with a rectangular plate 42, a push spring 41 and an elastic pressing block 4 that can push the bonding chip body 6 when the bonding chip body 6 is pressed, so that the bonding chip body 6 can be effectively prevented from sticking to the hot pressing upper pressing plate 1 after pressing, and at the same time, the dangerous situation that may occur when a person approaches the hot pressing upper pressing plate 1 can be avoided;

[0034] This device adopts automatic clamping means. Compared with manual operation, automatic clamping can better control the clamping force and position, avoid loose fixation or excessive extrusion caused by human factors, thereby ensuring the stability and accuracy of the bonded chip body 6 in the subsequent processing process. The operation mode and force of the automatic clamping system are basically the same each time, which can ensure that the fixing effect of the bonded chip body 6 is the same in different production batches, which helps to improve the consistency and reliability of product quality, reduce defective products caused by fixation differences, reduce damage to the bonded chip body 6, and ensure the cleanliness of the bonded chip body 6.

[0035] Working principle:

[0036] The first step is that in the manufacturing process of the bonded chip body 6, the bonding process is crucial. Specifically, when the bonded chip body 6 is being bonded, it needs to be placed on a specific pressure device and continuously pressed for a specific period of time under certain pressure conditions. However, after the pressing operation is completed, when the hot pressing upper platen 1 of the pressure device is lifted, the bonded chip body 6 often sticks to the hot pressing upper platen 1. This phenomenon is relatively common in the manufacturing of the bonded chip body 6 and may have a certain impact on the production efficiency and product quality. Therefore, the bonded chip body 6 needs to be fixed;

[0037] In the second step, when operating the bonded chip body 6, the bonded chip body 6 with the sealing film preliminarily attached can be placed in the chip placement groove 22 on the hot pressing placement table 2, and the push spring 41 will rebound at this time, and the push spring 41 will push the push rectangular plate 42 close to the bonded chip body 6 and press the bonded chip body 6, so as to give the bonded chip body 6 an initial pressure;

[0038] The device is provided with a push rectangular plate 42 and a push spring 41 to cooperate with each other. When the bonded chip body 6 is hot pressed, the bonded chip body 6 can be initially clamped. When the bonded chip body 6 is hot pressed, it needs to be accurately aligned and positioned. The initial clamping can ensure that the bonded chip body 6 is always kept in the correct position during the entire hot pressing process, avoiding displacement of the bonded chip body 6 due to external interference, equipment vibration and other factors. This is very important for achieving high-quality bonding, and can ensure that each connection point is accurately aligned, thereby improving the success rate and reliability of bonding.

[0039] With the preliminary clamping of the device, the position stability and uniform force of the bonded chip body 6 during the hot pressing process can reduce the time wasted due to position adjustment and repeated hot pressing, which helps to improve production efficiency and reduce production costs. In addition, the clamping device can quickly fix and release the chip, which is convenient for operation and further improves the smoothness of production. The clamping mechanism in the device can be adjusted according to chips of different sizes and has a certain degree of versatility. This makes it possible to process chips of various sizes on the same production line, improves the flexibility and adaptability of the production line, and meets the needs of different customers;

[0040] The present device performs preliminary fixing of the bonded chip body 6 during hot pressing. Through preliminary clamping, the bonded chip body 6 can evenly withstand pressure during the hot pressing process. If there is no clamping, the bonded chip body 6 may be subjected to excessive or insufficient force locally under the pressure, resulting in uneven hot pressing effect. Uniform force helps to achieve a tight combination between the bonded chip body 6 and the substrate or other components, ensures consistent connection strength after hot pressing, and reduces defects and unstable performance caused by uneven force.

[0041] In the third step, after the bonding chip body 6 is fixed, the user can start the up-down movement mechanism 11 and the hot pressing upper platen 1. The up-down movement mechanism 11 will drive the hot pressing upper platen 1 to move downward. When the hot pressing upper platen 1 is pressed down to contact with the pressure-bearing steel column 33, the hot pressing upper platen 1 will generate pressure on the pressure-bearing steel column 33. The pressure on the pressure-bearing steel column 33 will drive the inclined guide column pressing block 3 to move downward through the embedded groove 32. The upper end of the inclined guide column pressing block 3 is inclined. When the inclined guide column pressing block 3 moves downward, it will push the elastic pressing block 4 to move. The movement of the elastic pressing block 4 will generate a driving force, and the movement of the elastic pressing block 4 will further squeeze the pushing spring 41. The pushing spring 41 is further pushed by the force to push the pushing rectangular plate 42, and the pushing rectangular plate 42 will further push and press the bonding chip body 6. After the hot pressing upper pressing plate 1 presses the sealing film, the up and down movement mechanism 11 can be started to drive the hot pressing upper pressing plate 1 to move upward. At the moment when the hot pressing upper pressing plate 1 leaves the bonding chip body 6, the bonding chip body 6 is in a compressed state. In this way, the bonding chip body 6 will not be stuck to the hot pressing upper pressing plate 1;

[0042] The device is provided with a rectangular plate 42, a push spring 41 and an elastic pressing block 4 that can push the bonding chip body 6 when the bonding chip body 6 is pressed, so that the bonding chip body 6 can be effectively prevented from sticking to the hot pressing upper pressing plate 1 after pressing, and at the same time, the dangerous situation that may occur when a person approaches the hot pressing upper pressing plate 1 can be avoided;

[0043] The device prevents the bonding chip body 6 from sticking to the hot pressing upper platen 1. The bonding chip body 6 is a highly precise electronic component. If it sticks to the hot pressing upper platen 1 and is forcibly removed, it may cause physical damage to the bonding chip body 6, such as cracks, scratches, etc. The clamping device can avoid this situation and ensure the integrity of the bonding chip body 6, thereby ensuring product quality. With the clamping device, the pressing process can be carried out more smoothly, and production will not be frequently interrupted due to the adhesion problem of the bonding chip body 6, which helps to achieve continuous production and improve the overall output capacity of the production line;

[0044] The device is provided with a clamping device for the bonded chip body 6, and there is no need for manual fixing and clamping of the bonded chip body 6. The bonded chip body 6 can be clamped and taken quickly and accurately, and there is no need for additional manual operation to fix the bonded chip body 6, which shortens the production cycle, and the automated system can operate continuously;

[0045] The fourth step is that after the pressing of the bonding chip body 6 is completed, the up and down movement mechanism 11 will drive the hot pressing upper platen 1 to move upward. At this time, the hot pressing upper platen 1 no longer applies pressure to the pressure-bearing steel column 33. At this time, the reset spring 31 will rebound. The rebound of the reset spring 31 will drive the pressure-bearing steel column 33 to move upward. The pressure-bearing steel column 33 no longer limits the elastic clamping block 4. At this time, the pushing spring 41 will rebound. Under the action of the pushing spring 41, the elastic clamping block 4 will reset, and at the same time, the pushing rectangular plate 42 will no longer clamp the bonding chip body 6, which can reduce the clamping pressure on the bonding chip body 6, and the user can disassemble the bonding chip body 6;

[0046] The device is provided with a clamping device that can be automatically reset. The reset spring 31 and the push spring 41 can cooperate to reset the equipment. There is no need for manual operation to disassemble the clamp. The automatic release of the clamp can complete the preparation work for disassembly of the bonded chip body 6 in a very short time. There is no need to manually disassemble the clamp one by one, which greatly saves operation time. The automated clamp release process can be closely coordinated with other links of the production line to achieve continuous operation. Automatic release of the clamp ensures production continuity and increases output per unit time.

[0047] The device is provided with a clamp that can be automatically reset. When the clamp is manually removed, the bonded chip body 6 may be damaged due to improper operation, uneven force, etc., such as scratches, collisions, etc. Automatically releasing the clamp can avoid the risks caused by these human factors and ensure the integrity and performance stability of the chip during the removal process. Manual removal of the clamp may involve some potential safety risks, such as being injured by the clamp and contacting dangerous areas. Automatically releasing the clamp can avoid the operator from directly contacting the clamp, reducing the probability of safety accidents.

[0048] This device adopts automatic clamping. Compared with manual operation, automatic clamping can better control the clamping force and position, avoid loose fixation or excessive squeezing caused by human factors, thereby ensuring the stability and accuracy of the chip in the subsequent processing. The operation mode and force of the automatic clamping system are basically the same each time, which can ensure that the fixing effect of the chip in different production batches is the same, which helps to improve the consistency and reliability of product quality, reduce defective products caused by fixation differences, reduce damage to the chip, and ensure the cleanliness of the chip.

[0049] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An inclined guide column type automatic clamping fixture, comprising a hot pressing upper platen (1) and a hot pressing placing table (2), wherein the hot pressing upper platen (1) is located above the hot pressing placing table (2), and is characterized in that: The hot pressing placement table (2) is provided with a pressing mechanism for facilitating pressing; The clamping mechanism comprises an inclined guide column clamping block (3), an elastic clamping block (4), an adapter plate (5) and a bonding chip body (6); a chip placement groove (22) is provided on the hot pressing placement platform (2); the inclined guide column clamping block (3) is located on the inner side wall of the chip placement groove (22); the elastic clamping block (4) is located at the upper end of the hot pressing placement platform (2); and the adapter plate (5) is located at the upper end of the hot pressing placement platform (2).

2. The inclined guide column type automatic clamping fixture as claimed in claim 1, characterized in that: An up-and-down moving mechanism (11) is fixedly mounted on the upper end of the hot pressing upper pressing plate (1), and the hot pressing upper pressing plate (1) is fixedly mounted on the frame via the up-and-down moving mechanism (11).

3. The inclined guide column type automatic clamping fixture as claimed in claim 2, characterized in that: The upper end of the hot pressing placement table (2) is provided with two transverse positioning grooves (21), and the upper end of the hot pressing placement table (2) is also provided with an inclined guide column installation groove (23).

4. The inclined guide column type automatic clamping fixture as claimed in claim 3, characterized in that: The inclined guide column pressing block (3) is located on the inner side wall of the inclined guide column mounting groove (23), and a return spring (31) is fixedly installed between the inclined guide column pressing block (3) and the inclined guide column mounting groove (23).

5. The inclined guide column type automatic clamping fixture as claimed in claim 4, characterized in that: An embedded groove (32) is provided at the upper end of the inclined guide column pressing block (3), and a pressure-bearing steel column (33) is provided on the inner side wall of the embedded groove (32).

6. The inclined guide column type automatic clamping fixture as claimed in claim 5, characterized in that: A limiting sliding groove (51) is provided above the adapter plate (5), and the inclined guide column pressing block (3) is located on the inner side wall of the limiting sliding groove (51).

7. The inclined guide column type automatic clamping fixture as claimed in claim 6, characterized in that: The elastic pressing block (4) is located on one side of the inclined guide column pressing block (3), and a pushing spring (41) is provided on one side of the elastic pressing block (4).

8. The inclined guide column type automatic clamping fixture as claimed in claim 7, characterized in that: The push spring (41) is attached to the side end of the bonding chip body (6).

9. The inclined guide column type automatic clamping fixture as claimed in claim 8, characterized in that: An elastic U-shaped piece (43) is fixedly installed between the push spring (41) and the elastic pressing block (4).

10. The inclined guide column type automatic clamping fixture as claimed in claim 9, characterized in that: A pushing spring (41) is fixedly installed between the elastic pressing block (4) and the pushing rectangular plate (42).

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