Tool and method for packaging anti-vibration crystal oscillator

Abstract

The invention relates to the technical field of anti-seismic crystal oscillator packaging, and discloses a tool and a method for packaging an anti-seismic crystal oscillator. The tool comprises a positioning mechanism, a shell and a filling mechanism, the positioning mechanism is used for lifting a crystal oscillator and placing the crystal oscillator in the center of the interior of the shell; the pouring mechanism is used for pouring a damping material into a gap between the crystal oscillator and the shell; the positioning mechanism and the filling mechanism are both located above the shell, and the filling mechanism is located above the gap. According to the invention, the resonance effect caused by mechanical vibration can be reduced, and the vibration suppression effects of the crystal oscillator in all directions are the same, so that the anti-interference capability and the frequency stability of the crystal oscillator are improved, and the crystal oscillator can maintain the working frequency required by the design for a long time.

Description

Technical Field

[0001] The present invention relates to the technical field of shock-resistant crystal oscillator packaging, and in particular to a tool and method for packaging shock-resistant crystal oscillators. Background Art

[0002] Existing anti-vibration crystal oscillators are usually not packaged as a whole, but are locally damped by means of a card-stacked rubber pad on the periphery. On the one hand, since the vibration direction to which the anti-vibration crystal oscillator is subjected in vehicle-mounted, airborne, and missile-mounted installation environments is not a single direction, but there are situations where there are dynamic changes in multiple directions, the packaging method using local damping cannot simultaneously guarantee that the anti-vibration crystal oscillator is subjected to consistent damping suppression effects in the X-axis, Y-axis, and Z-axis directions. It is possible that the anti-vibration crystal oscillator is subjected to good damping suppression effects in a certain vibration direction, but poor damping suppression effects in other vibration directions. On the other hand, in the production process of anti-vibration crystal oscillators, since the packaging method of local damping is to install damping mechanisms such as card-stacked rubber pads on the periphery of the anti-vibration crystal oscillator, the installation accuracy of the damping mechanism is low, resulting in poor stability of the damping suppression effect of the anti-vibration crystal oscillator and poor production consistency of the anti-vibration crystal oscillator.

[0003] In view of this, this application is hereby filed. Summary of the invention

[0004] The technical problem to be solved by the present invention is that the local shock-absorbing packaging method cannot ensure that the shock-resistant crystal oscillator obtains the same, uniform and stable shock-absorbing and suppressing effect in every direction.

[0005] In order to solve the above technical problems, the present invention is implemented by the following technical solutions: A tool for packaging a shock-resistant crystal oscillator is provided, comprising: a positioning mechanism, a shell and a pouring mechanism; the positioning mechanism is used to lift the crystal oscillator and place the crystal oscillator in the exact center position inside the shell; the pouring mechanism is used to pour shock-absorbing material into the gap between the crystal oscillator and the shell; the positioning mechanism and the pouring mechanism are both located above the shell, and the pouring mechanism is located above the gap.

[0006] Furthermore, the tool for packaging shock-resistant crystal oscillators also includes: a base, a supporting mechanism and a guiding mechanism; the shell is placed on the upper surface of the base; the guiding mechanism is located above the base and the shell; one end of the supporting mechanism is fixedly connected to the guiding mechanism, and the other end of the supporting mechanism is in contact with the upper surface of the base; the supporting mechanism is retractable; and the positioning mechanism and the infusion mechanism are both fixedly connected to the guiding mechanism.

[0007] Furthermore, the upper surface of the base includes: a first positioning mark; the first positioning mark is located at the center of the upper surface of the base, and the shell is located in the first positioning mark.

[0008] Furthermore, the base also includes: a plurality of second positioning marks; the second positioning marks are located at the edge of the upper surface of the base; the other end of the support mechanism is located within the second positioning mark, and the support mechanism corresponds one-to-one with the second positioning mark; the guide mechanism includes: a first guide hole and a plurality of second guide holes; in a top view, the first guide hole is close to any side wall of the shell, and the perfusion mechanism passes through the first guide hole; a plurality of the second guide holes are located in the middle position of the guide mechanism, the positioning mechanism passes through the second guide hole, and the positioning mechanism corresponds one-to-one with the second guide holes.

[0009] Furthermore, the tool for packaging shock-resistant crystal oscillators also includes: a packaging cover plate; the packaging cover plate includes: a first filling hole and a second filling hole; the first filling hole and the second filling hole are close to the edge of the packaging cover plate; when the packaging cover plate is connected to the shell, the first filling hole or the second filling hole is located directly below the filling mechanism.

[0010] Furthermore, the package cover plate further includes: a plurality of through holes; the through holes are close to the pins of the crystal oscillator.

[0011] Furthermore, a suction nozzle is provided at one end of the positioning mechanism close to the shell.

[0012] Furthermore, the width of the gap is 10 mm.

[0013] Furthermore, the potting material is organic silica gel; the material of the shell and the material of the packaging cover are both glass fiber.

[0014] In a second aspect, a method for packaging a shock-resistant crystal oscillator is provided, and the following steps are performed based on a packaging cover plate of a shock-resistant crystal oscillator described in the first aspect: lift the crystal oscillator by using the positioning mechanism, and place the crystal oscillator in the exact center position inside the shell; continuously pour shock-absorbing material into the gap between the crystal oscillator and the shell by using the pouring mechanism, and stop pouring after the liquid level of the shock-absorbing material rises to a specified height; remove the positioning mechanism after the shock-absorbing material is solidified; hot-melt seal the packaging cover plate and the top of the shell; continuously pour shock-absorbing material into the gap between the crystal oscillator and the shell through the first pouring hole or the second pouring hole by using the pouring mechanism, and stop pouring after the shock-absorbing material overflows the first pouring hole and the second pouring hole; and wait for the shock-absorbing material to solidify.

[0015] Compared with the prior art, the present invention has the following advantages and beneficial effects: 1. The crystal oscillator is easily disturbed by mechanical vibration in a vibrating environment, resulting in frequency deviation or increased phase fluctuation of the crystal oscillator. The positioning mechanism places the crystal oscillator in the center of the shell (the distance from the crystal oscillator to the inner wall of the shell in the x-axis direction, y-axis direction and z-axis direction are equal), and a gap is reserved for injecting shock-absorbing materials. The vibration-absorbing layer formed after the shock-absorbing material is cured has the same thickness in the x-axis direction, y-axis direction and z-axis direction, which can evenly absorb mechanical vibrations from the x-axis direction, y-axis direction and z-axis direction, reduce the resonance effect and resonance effect caused by mechanical vibration, and make the vibration suppression effect of the crystal oscillator in each direction the same, thereby improving the anti-interference ability and frequency stability of the crystal oscillator, so that the crystal oscillator can maintain the designed operating frequency for a long time.

[0016] 2. The shock-absorbing layer is made of organic silicone material. On the one hand, organic silicone material has the characteristic of being a fluid before curing, which is convenient for uniform infusion, thereby ensuring the uniformity of vibration reduction of the crystal oscillator in each axis; on the other hand, compared with the existing shock-absorbing materials used for anti-vibration crystal oscillators, high-damping organic silicone has better vibration absorption capacity, which can provide a more effective vibration suppression effect for the crystal oscillator and reduce the impact of vibration interference on the crystal oscillator; on the other hand, organic silicone material has high and low temperature resistance and electrical insulation properties.

[0017] 3. The shell and packaging cover are made of glass fiber, which has the characteristics of high strength, high rigidity, light weight and high thermal conductivity. It can provide high-strength structural support for the packaging of anti-vibration crystal oscillator, while also having light weight and good thermal conductivity.

[0018] 4. Compared with the packaging method using local shock absorption, this packaging method is simpler. It only requires pouring shock-absorbing material between the shell and the crystal oscillator. There is no need to consider the installation accuracy of the shock-absorbing module. It can improve the production consistency and stability of the shock-resistant crystal oscillator, thereby improving the reliability and yield rate of the shock-resistant crystal oscillator products.

[0019] 5. By pouring the flowing high-damping vibration-damping material twice, the vibration-damping material is evenly distributed and wraps the entire crystal oscillator. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1A schematic structural diagram of a tool for packaging a shock-resistant crystal oscillator provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure and positional relationship of a crystal oscillator, a housing, and a packaging cover provided in an embodiment of the present invention; Figure 3 A schematic diagram of the external structure of the shock-resistant crystal oscillator after packaging provided by an embodiment of the present invention.

[0022] Marks and corresponding parts names in the attached drawings: 1-positioning mechanism, 2-crystal oscillator, 3-housing, 4-pouring mechanism, 5-base, 6-support mechanism, 7-guiding mechanism, 8-packaging cover, 9-first pouring hole, 10-second pouring hole, 11-pin. DETAILED DESCRIPTION

[0023] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0024] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is apparent to one of ordinary skill in the art that these specific details are not necessarily employed to practice the present invention. In other embodiments, in order to avoid obscuring the present invention, well-known structures, circuits, materials, or methods are not specifically described.

[0025] Throughout the specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "one embodiment," "an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. In addition, it will be appreciated by those of ordinary skill in the art that the figures provided herein are for illustrative purposes and that the figures are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] In the description of the present invention, the directions or positional relationships indicated by terms such as “front”, “rear”, “left”, “right”, “up”, “down”, “vertical”, “horizontal”, “high”, “low”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the scope of protection of the present invention.

[0027] Embodiment 1: A tool for packaging a shock-resistant crystal oscillator 2 provided in the first aspect. Figure 1 As shown, the tool for packaging the anti-seismic crystal oscillator 2 includes: a positioning mechanism 1, a shell 3, a pouring mechanism 4, a base 5, a supporting mechanism 6 and a guiding mechanism 7. From the bottom up, the base 5 is located at the bottom, and the shell 3 is placed on the base 5. The supporting mechanism 6 includes 4 vertically arranged supporting columns, and each supporting column can be retracted. The top of the supporting column is fixedly connected to the guiding mechanism 7 by screws. Continue to refer to Figure 1 , a first guide hole and four second guide holes are arranged on the guide mechanism 7. The filling mechanism 4 is a filling tube, which passes through the first guide hole vertically and is connected to the guide mechanism 7, and the overflow port of the filling tube faces downward and is higher than the top of the shell 3. The positioning mechanism 1 corresponds to the second guide hole one by one, and the positioning mechanism 1 is a columnar structure, which passes through the second guide hole vertically and is connected to the guide mechanism 7; a suction nozzle is arranged at one end of the positioning mechanism 1 close to the shell 3, and the suction nozzle lifts the crystal oscillator 2 by adsorption, and the bottom of the lifted crystal oscillator 2 is higher than the top of the shell 3. It should be noted that the filling mechanism 4 and the positioning mechanism 1 are both threadedly connected to the guide mechanism 7, which is convenient for installation and disassembly. The relative positions of the positioning mechanism 1, the filling mechanism 4, the guide mechanism 7 and the support mechanism 6 are fixed, and the bottom end of the support mechanism 6 only contacts with the upper surface of the base 5, but is not fixedly connected to the upper surface of the base 5. Therefore, by moving the support mechanism 6 on the upper surface of the base 5, the guide mechanism 7, the positioning mechanism 1 and the injection mechanism 4 can be driven to move freely above the shell 3, thereby achieving positioning. Specifically, when the positioning mechanism 1 advances the crystal oscillator 2, the crystal oscillator 2 can be placed in the center position above the shell 3 by moving the support mechanism 6, and the injection mechanism 4 can be placed above the gap between the crystal oscillator 2 and the shell 3, and then the support mechanism 6 can be controlled to extend and retract, so that the crystal oscillator 2 finally falls downward into the center position inside the shell 3. It should be supplemented that in order to ensure that the support mechanism 6 can move freely on the upper surface of the base 5, the area of ​​the base 5 should be larger than the area of ​​the shape surrounded by the bottom ends of the four supports.

[0028] Furthermore, as shown in Figure 2, the tool for packaging the anti-vibration crystal oscillator 2 also includes a packaging cover plate 8. The packaging cover plate 8 is provided with a first injection hole 9 and a second injection hole 10, and the first injection hole 9 and the second injection hole 10 are both located at the edge of the packaging cover plate 8. By moving the support mechanism 6, when the crystal oscillator 2 falls downward into the center of the shell 3, the first injection hole 9 or the second injection hole 10 is located directly below the injection mechanism 4. In addition, Figure 2 The package cover plate 8 shown is also provided with four through holes, which are close to the pins 11 of the crystal oscillator 2 and can allow the pins 11 to pass through.

[0029] In addition, in this embodiment, the width of the gap between the crystal oscillator 2 and the housing 3 is 10 mm. The potting material is organic silica gel; the material of the housing 3 and the material of the packaging cover 8 are both glass fiber.

[0030] like Figure 1 and Figure 2 As shown, when using the above tool for packaging, the method steps are: Step 1: Place the shell 3 and the supporting mechanism 6 on the base 5.

[0031] Step 2: Place the crystal oscillator 2 under the four positioning mechanisms 1, and use the suction nozzle of the positioning mechanism 1 to adsorb and lift the crystal oscillator 2.

[0032] Step 3: Move the supporting mechanism 6 so that the crystal oscillator 2 is located above the shell 3, and at the same time, fine-tune the position of the supporting mechanism 6 so that the crystal oscillator 2 is in the center position above the shell 3, press the supporting mechanism 6 downward to make the crystal oscillator 2 fall into the shell 3, and at the same time, fine-tune the telescopic state of the supporting mechanism 6 so that the crystal oscillator 2 is in the exact center position inside the shell 3.

[0033] Step 4: Use the filling mechanism 4 to continuously fill the shock-absorbing material into the gap between the crystal oscillator 2 and the housing 3 until the liquid level of the shock-absorbing material rises to a specified height and then stop filling.

[0034] Step 5: Wait for the shock-absorbing material to solidify before removing the positioning mechanism 1.

[0035] Step 6: Hot-melt seal the packaging cover plate 8 and the top of the shell 3.

[0036] Step 7: Use the injection mechanism 4 to continuously inject the shock-absorbing material into the gap between the crystal oscillator 2 and the housing 3 through the first injection hole 9 or the second injection hole 10 until the shock-absorbing material overflows the first injection hole 9 and the second injection hole 10 and then stop injecting.

[0037] Step 8: Wait for the shock-absorbing material to solidify, remove the tools, and complete the packaging. Figure 3 shown.

[0038] Embodiment 2: The tool for packaging the anti-vibration crystal oscillator 2 provided in this embodiment is a further optimization based on Embodiment 1, and aims to reduce the number of times the support mechanism 6 is moved, thereby simplifying the packaging process. Specifically, Figure 1 As shown, the base 5 of this embodiment is a rectangular plate structure, and a first positioning mark ( Figure 1 The first positioning mark is not shown in the figure, and its function is to provide a position reference for placing the housing 3. The shape and size of the first positioning mark are the same as the shape and size of the cross section of the housing 3. When placing, the bottom edge of the housing 3 is made to coincide with the edge of the first positioning mark, and the housing 3 can be positioned at the center of the base 5. Figure 1 , the guide mechanism 7 is also a rectangular plate structure and the area of ​​the guide mechanism 7 is equal to the area of ​​the base 5. It should be noted that the rectangular plate structure of the base 5 and the guide mechanism 7 is only one of the preferred structures provided in this embodiment. Of course, the base 5 and the guide mechanism 7 can also choose other shapes, such as a disc structure. Further, the top of the support column is fixedly connected to the top corner position of the guide mechanism 7, and each top corner position on the upper surface of the base 5 also has a second positioning mark ( Figure 1 Not shown), its function is to provide a position reference for placing the support. The shape and size of the second positioning mark are the same as the shape and size of the cross section of the shell 3, and the position of the second positioning mark relative to the top corner of the base 5 is the same as the position of the top of the support relative to the top corner of the guide mechanism 7. When placed, the bottom edges of the four supports are overlapped with the edges of the four second positioning marks respectively, which can ensure that when the support mechanism 6 contacts the base 5 according to the second positioning marks, the guide mechanism 7 is just above the base 5. Furthermore, the four second positioning holes of the guide mechanism 7 are located at the center of the guide mechanism 7, and the four second positioning holes constitute the four top corners of the rectangle, so that when the crystal oscillator 2 is lifted, the crystal oscillator 2 is closer to the center position of the top of the shell 3, and the crystal oscillator 2 can be placed in the center position above the shell 3 by only a few small-range fine-tuning of the support mechanism 6.

[0039] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A tool for packaging a shock-resistant crystal oscillator, characterized in that: include: A positioning mechanism (1), a shell (3) and a pouring mechanism (4); the positioning mechanism (1) is used to lift a crystal oscillator (2) and place the crystal oscillator (2) at the exact center of the shell (3); the pouring mechanism (4) is used to pour shock-absorbing material into the gap between the crystal oscillator (2) and the shell (3); the positioning mechanism (1) and the pouring mechanism (4) are both located above the shell (3), and the pouring mechanism (4) is located above the gap.

2. A tool for packaging a shock-resistant crystal oscillator according to claim 1, characterized in that: Also includes: A base (5), a supporting mechanism (6) and a guiding mechanism (7); the shell (3) is placed on the upper surface of the base (5); the guiding mechanism (7) is located above the base (5) and the shell (3); one end of the supporting mechanism (6) is fixedly connected to the guiding mechanism (7), and the other end of the supporting mechanism (6) is in contact with the upper surface of the base (5); the supporting mechanism (6) is retractable; the positioning mechanism (1) and the perfusion mechanism (4) are both fixedly connected to the guiding mechanism (7).

3. A tool for packaging a shock-resistant crystal oscillator according to claim 2, characterized in that: The upper surface of the base (5) comprises: a first positioning mark; the first positioning mark is located at the center of the upper surface of the base (5), and the shell (3) is located within the first positioning mark.

4. A tool for packaging a shock-resistant crystal oscillator according to claim 3, characterized in that: The base (5) further comprises: a plurality of second positioning marks; the second positioning marks are located at the edge of the upper surface of the base (5); the other end of the support mechanism (6) is located within the second positioning mark, and the support mechanism (6) corresponds one-to-one with the second positioning mark; the guide mechanism (7) comprises: a first guide hole and a plurality of second guide holes; in a top view, the first guide hole is close to any side wall of the shell (3); the perfusion mechanism (4) passes through the first guide hole; the plurality of second guide holes are located in the middle of the guide mechanism (7), the positioning mechanism (1) passes through the second guide hole, and the positioning mechanism (1) corresponds one-to-one with the second guide hole.

5. A tool for packaging a shock-resistant crystal oscillator according to claim 4, characterized in that: Also includes: A packaging cover plate (8); the packaging cover plate (8) comprises: a first injection hole (9) and a second injection hole (10); The first injection hole (9) and the second injection hole (10) are located close to the edge of the packaging cover plate (8); when the packaging cover plate (8) is connected to the shell (3), the first injection hole (9) or the second injection hole (10) is located directly below the injection mechanism (4).

6. A tool for packaging a shock-resistant crystal oscillator according to claim 5, characterized in that: The packaging cover plate (8) further comprises: a plurality of through holes; the through holes are close to the pins (11) of the crystal oscillator (2).

7. A tool for packaging a shock-resistant crystal oscillator according to any one of claims 1 to 6, characterized in that: A suction nozzle is provided at one end of the positioning mechanism (1) close to the housing (3).

8. A tool for packaging a shock-resistant crystal oscillator according to any one of claims 1 to 6, characterized in that: The width of the gap is 10 mm.

9. A tool for packaging a shock-resistant crystal oscillator according to any one of claims 1 to 6, characterized in that: The potting material is organic silica gel; the material of the shell (3) and the material of the packaging cover plate (8) are both glass fiber.

10. A shock-resistant crystal oscillator packaging method, characterized in that: The following steps are performed based on a tool for packaging a shock-resistant crystal oscillator according to any one of claims 6 or 9: Using the positioning mechanism (1) to lift the crystal oscillator (2), the crystal oscillator (2) is placed at the exact center of the housing (3); Utilizing the pouring mechanism (4) to continuously pour the damping material into the gap between the crystal oscillator (2) and the housing (3), and then stopping the pouring after the liquid level of the damping material rises to a specified height; Waiting for the shock-absorbing material to solidify before removing the positioning mechanism (1); Hot-melt-sealing the packaging cover plate (8) and the top of the shell (3); Using the pouring mechanism (4) to continuously pour the shock absorbing material into the gap between the crystal oscillator (2) and the housing (3) through the first pouring hole (9) or the second pouring hole (10), until the shock absorbing material overflows the first pouring hole (9) and the second pouring hole (10), and then stopping the pouring; Wait for the shock absorbing material to cure.

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