Cooling structure based on inverter device circuit

Abstract

The invention relates to a cooling structure based on an inverter device circuit, which belongs to the technical field of inverter circuit cooling and comprises an inverter device shell, a plurality of circuit components are fixedly mounted on the inner side of the inverter device shell, and mounting blocks are fixed on the front inner side wall and the rear inner side wall of the inverter device shell. Flow guide cooling fans are fixed to the opposite sides of the two mounting blocks, a mounting frame is fixed to the inner bottom wall of the inverter device shell, an inverter device circuit board is detachably connected to the top of the mounting frame, and a point-to-point cooling assembly for cooling the bottom of the inverter device circuit board is mounted on the inner side of the mounting frame. The top of the inverter device circuit board is provided with a cooling assembly. According to the cooling structure based on the inverter device circuit, heating points of the circuit can be cooled in a more targeted mode, heat dissipation can be well restrained, and the overall cooling effect and efficiency are effectively improved.

Description

Technical Field

[0001] The invention relates to the technical field of inverter circuit cooling, and in particular to a cooling structure based on an inverter device circuit. Background Art

[0002] An inverter is a converter that converts DC power, such as batteries, storage bottles, etc., into constant frequency and voltage or AC power (such as the commonly used 220V AC power). It is mainly composed of an inverter bridge, control logic and filter circuit, and is widely used in various electrical equipment that require AC power.

[0003] When the inverter is working, the circuit board is used to transmit and transfer electrical signals. As an important device for power conversion, the operating stability of the inverter is of vital importance. The inverter will generate a large amount of heat energy during operation. In order to ensure the normal operation of the inverter, a heat dissipation tower is usually installed on the main control chip, such as the CPU, so that it can work stably for a long time, while other parts are cooled by a larger range of air blowing and heat dissipation. However, the heating points of different components on different circuit boards in different inverters are different. The traditional method of directly blowing and cooling the circuit board will cause the cooling air to be more dispersed, and it is impossible to concentrate on the key heating points for cooling, resulting in low actual cooling efficiency. Based on this, the present invention provides a cooling structure based on the inverter device circuit to solve the above problems. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the shortcomings of the prior art, the present invention provides a cooling structure based on the inverter device circuit, which has the advantages of being able to cool the hot spots in the circuit more specifically, thereby effectively improving the overall cooling effect and efficiency. It solves the problem that the cooling structure of the existing inverter device circuit has too large a cooling range and lacks specificity during actual use, resulting in a certain room for improvement in the actual cooling effect and efficiency.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purpose of being able to cool the hot spots of the circuit more specifically, so that the overall cooling effect and efficiency are effectively improved, the present invention provides the following technical solutions: a cooling structure based on the circuit of an inverter device, comprising an inverter device housing, a plurality of circuit components are fixedly installed on the inner side of the inverter device housing, the front and rear inner walls of the inverter device housing are fixed with mounting blocks, and the two opposite sides of the two mounting blocks are fixed with diversion cooling fans, the inner bottom wall of the inverter device housing is fixed with a mounting frame, the top of the mounting frame is detachably connected with an inverter device circuit board, a point cooling component for cooling the bottom of the inverter device circuit board is installed on the inner side of the mounting frame, and a cooling component is installed on the top of the inverter device circuit board.

[0008] Furthermore, the point cooling assembly comprises a fixed frame fixed to the inner side of the mounting frame and a conveying water bucket located outside the inverter device housing, two fixed rods are fixed between the front and rear inner side walls of the fixed frame, a plurality of adjusting rods are slidably connected between the outer sides of the two fixed rods, a plurality of movable blocks are slidably connected to the outer sides of the adjusting rods, a movable plate is fitted and slidably provided on the top of the movable block, two trapezoidal sliding blocks are fixed to the bottom of the movable plate, two trapezoidal sliding grooves are provided on the front side of the movable block for the two corresponding trapezoidal sliding blocks to be plugged and slid respectively, two vertical rods are fixed on the top of the movable plate, a fitting heat conducting plate is fixed between the top ends of the two corresponding vertical rods, a spiral guide cavity is provided inside the fitting heat conducting plate, and a liquid inlet pipe and a liquid outlet pipe connected to the inside of the spiral guide cavity and the inside of the conveying water bucket are fixed to the bottom of the fitting heat conducting plate;

[0009] Two first locking bolts are passed through and threadedly connected to the bottom of the adjusting rod, second locking bolts are passed through and threadedly connected to the front and back of the movable block, two symmetrical plates are fixed to the bottom of the movable plate, and third locking bolts are passed through and threadedly connected to the side of the symmetrical plate away from the corresponding movable block, a plurality of connecting openings are provided on the front and back of the inverter device housing, and a connecting hole for the movement of the heat conducting plate is provided on the top of the mounting frame.

[0010] Furthermore, the water delivery bucket includes a storage bucket located outside the inverter device housing, a discharge pipe and a return pipe are passed through and fixedly installed on the top of the storage bucket, a first water pump connected to the interior of the discharge pipe is fixedly installed on the discharge pipe, a first collecting pipe fixedly connected to an end of the liquid inlet pipe near the storage bucket is fixed at the top of the discharge pipe, and a second collecting pipe fixedly connected to an end of the liquid outlet pipe near the storage bucket is fixed at the top of the return pipe.

[0011] Furthermore, the cooling component includes a plurality of lifting blocks fixed to the top of the inverter device circuit board, the tops of the lifting blocks are detachably connected with a mounting frame, the top of the mounting frame is fixed with a support frame with openings on the left and right sides and the bottom, the top of the mounting frame is fixed with a heat-conducting plate, the inside of the heat-conducting plate is provided with a circulation cavity, the outside of the heat-conducting plate is fixed with an input pipe and an output pipe connected to the inside of the circulation cavity, the inside of the support frame is fixed with a plurality of first cooling fans, and the inside of the support frame is fixed with a plurality of first cooling fans. A diversion grid plate is fixedly installed, a plurality of heat pipes are fixed on the top of the abutting heat conducting plate, a plurality of corrugated heat sinks are passed through and fixedly connected between the outer sides of the heat pipes, a plurality of rectangular grooves with openings on the left and right sides are provided on the outer sides of the corrugated heat sinks, a protective mesh plate is detachably connected to the right side of the support frame, a water tank is fixed on the top of the support frame, a top frame is fixed on the top of the water tank, a plurality of second heat dissipation fans are fixedly installed on the inner side of the top frame, and a second water pump connected to the interior of the input pipe is fixedly installed on the input pipe.

[0012] Furthermore, the back ends of the input pipe and the output pipe penetrate the back side of the support frame and the outside of the water tank and are connected to the inside of the water tank. The diversion grid plate is located between the first cooling fan and the opposite side of the corrugated heat sink.

[0013] Furthermore, the top end of the heat pipe passes through the top of the support frame and the bottom and top of the water tank and extends to the inner top wall of the top frame. The outer side of the heat pipe is fixedly connected to the outer side of the water tank. The wavy heat sink is distributed inside the support frame and inside the top frame.

[0014] Furthermore, the bottom end of the discharge pipe extends to the inner bottom wall of the storage barrel, and the bottom end of the return pipe extends to the upper part of the storage barrel.

[0015] Furthermore, the top of the heat-conducting plate is bonded to the bottom of the inverter device circuit board, and the top ends of the liquid inlet pipe and the liquid outlet pipe are respectively located at the outer circle and the inner circle of the corresponding spiral guide cavity.

[0016] Furthermore, the end of the first locking bolt may abut against the outer side of the corresponding fixing rod, and the end of the second locking bolt may abut against the outer side of the corresponding adjusting rod.

[0017] Furthermore, the end of the third locking bolt can abut against the outer side of the corresponding movable block, and the communicating opening is provided for the liquid inlet pipe and the liquid outlet pipe to pass through.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the present invention provides a cooling structure based on the inverter device circuit, which has the following beneficial effects:

[0020] 1. The cooling structure based on the inverter device circuit can adjust the point position of the cooling structure according to the positions of different circuit boards in different inverters and electronic components on different circuit boards through the use of point cooling components at the bottom of the inverter device circuit board, so that it can meet the use and coordination requirements of different heating points of different circuit boards, and then can perform targeted cooling on key heating points, so that the cooling effect can become more reliable and effective, and can well suppress the dissipation of heat, thereby improving the cooling effect.

[0021] 2. The cooling structure based on the inverter device circuit can achieve a more efficient cooling effect on the key overall control chip, such as the CPU, through the cooling component on the top of the inverter device circuit board. By increasing the heat dissipation area and the shape of the cooling structure, the cooling efficiency can be significantly improved, which is conducive to keeping the chip within the normal working range, so that it can work stably for a long time to meet the working requirements of the inverter and facilitate user use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of a cooling structure based on an inverter device circuit proposed by the present invention;

[0023] Figure 2 A cooling structure based on an inverter device circuit proposed by the present invention Figure 1 A partial enlarged schematic diagram of the middle A part;

[0024] Figure 3 A cooling structure based on an inverter device circuit proposed by the present invention Figure 1 A top view cross-sectional schematic diagram of the middle fixed frame connection structure;

[0025] Figure 4 A cooling structure based on an inverter device circuit proposed by the present invention Figure 2 A three-dimensional cross-sectional schematic diagram of a heat conducting plate laminated in the middle;

[0026] Figure 5 A cooling structure based on an inverter device circuit proposed by the present invention Figure 1 A schematic cross-sectional view of the water delivery bucket;

[0027] Figure 6 A cooling structure based on an inverter device circuit proposed by the present invention Figure 1 A schematic cross-sectional view of a cooling assembly;

[0028] Figure 7 A cooling structure based on an inverter device circuit proposed by the present invention Figure 6 A three-dimensional schematic diagram of the heat pipe connection structure;

[0029] Figure 8 A cooling structure based on an inverter device circuit proposed by the present invention Figure 6 Schematic diagram of a three-dimensional cross-section of the connection structure of the abutting heat conducting plate.

[0030] In the figure: 1 inverter device housing, 2 circuit components, 3 mounting block, 4 diversion cooling fan, 5 mounting frame, 6 inverter device circuit board, 700 point cooling assembly, 701 fixing frame, 702 fixing rod, 703 adjusting rod, 704 movable block, 705 moving plate, 706 trapezoidal slider, 707 trapezoidal slide, 708 vertical rod, 709 fitting heat conduction plate, 710 spiral diversion cavity, 711 liquid inlet pipe, 712 liquid outlet pipe, 713 water delivery bucket, 7131 storage bucket, 7132 discharge pipe, 7133 first water pump, 7134 first concentration pipe, 7135 return pipe, 713 6 second concentrating pipe, 714 first locking bolt, 715 second locking bolt, 716 symmetrical plate, 717 third locking bolt, 718 connecting opening, 719 connecting hole, 800 cooling component, 801 lifting block, 802 mounting frame, 803 supporting frame, 804 abutting heat conducting plate, 805 circulation cavity, 806 input pipe, 807 output pipe, 808 first heat dissipation fan, 809 diversion grid plate, 810 heat pipe, 811 wavy heat sink, 812 rectangular groove, 813 protective mesh plate, 814 water tank, 815 top frame, 816 second heat dissipation fan, 817 second water pump. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figures 1 to 8 The present invention provides a technical solution: a cooling structure based on an inverter device circuit, comprising an inverter device housing 1, a plurality of circuit components 2 are fixedly installed on the inner side of the inverter device housing 1, mounting blocks 3 are fixed to the front and rear inner side walls of the inverter device housing 1, and a guide cooling fan 4 is fixed to the opposite sides of the two mounting blocks 3, a mounting frame 5 is fixed to the inner bottom wall of the inverter device housing 1, an inverter device circuit board 6 is detachably connected to the top of the mounting frame 5, a point cooling component 700 for cooling the bottom of the inverter device circuit board 6 is installed on the inner side of the mounting frame 5, and a cooling component 800 is installed on the top of the inverter device circuit board 6;

[0033] In the above-mentioned embodiment, by using the point cooling component 700 at the bottom of the inverter device circuit board 6, the point position of the cooling structure can be adjusted according to the positions of different circuit boards in different inverters and the electronic components on different circuit boards, so that it can meet the use and coordination requirements of different heating points of different circuit boards, and then the key heating points can be cooled in a targeted manner, so that the cooling effect can become more reliable and effective, and the heat dissipation can be well suppressed. Through the cooling component 800 at the top of the inverter device circuit board 6, a more efficient cooling effect can be achieved for the key overall control chip, such as the CPU, and the cooling efficiency can be significantly improved by increasing the heat dissipation area and the shape of the cooling structure.

[0034] In this embodiment, the point cooling component 700 is a structure for directly cooling a heat point.

[0035] like Figure 1 , Figure 2 and Figure 3 As shown, the point cooling assembly 700 includes a fixed frame 701 fixed to the inner side of the mounting frame 5 and a water delivery bucket 713 located on the outer side of the inverter device housing 1. Two fixed rods 702 are fixed between the front and rear inner walls of the fixed frame 701. A plurality of adjustment rods 703 are slidably connected between the outer sides of the two fixed rods 702. A plurality of movable blocks 704 are slidably connected to the outer sides of the adjustment rods 703. A movable plate 705 is slidably attached to the top of the movable block 704. Two trapezoidal sliders are fixed to the bottom of the movable plate 705. 706, two trapezoidal slide grooves 707 are provided on the front of the movable block 704 for the two corresponding trapezoidal sliders 706 to be inserted and slide respectively, two vertical rods 708 are fixed on the top of the movable plate 705, a fitting heat conducting plate 709 is fixed between the tops of the two corresponding vertical rods 708, a spiral flow guiding cavity 710 is provided inside the fitting heat conducting plate 709, and a liquid inlet pipe 711 and a liquid outlet pipe 712 connected to the inside of the spiral flow guiding cavity 710 and the inside of the conveying bucket 713 are fixed at the bottom of the fitting heat conducting plate 709;

[0036] Two first locking bolts 714 are penetrated and threadedly connected at the bottom of the adjusting rod 703, and second locking bolts 715 are penetrated and threadedly connected at the front and back of the movable block 704, and two symmetrical plates 716 are fixed at the bottom of the movable plate 705, and a third locking bolt 717 is penetrated and threadedly connected at the side of the symmetrical plate 716 away from the corresponding movable block 704, and a plurality of connecting openings 718 are opened at the front and back of the inverter device housing 1, and a connecting hole 719 for the movement of the heat conducting plate 709 is opened at the top of the mounting frame 5;

[0037] The water delivery bucket 713 includes a storage bucket 7131 located outside the inverter device housing 1, a discharge pipe 7132 and a return pipe 7135 are passed through and fixedly installed on the top of the storage bucket 7131, a first water pump 7133 connected to the interior of the discharge pipe 7132 is fixedly installed, a first collecting pipe 7134 fixedly connected to the end of the liquid inlet pipe 711 close to the storage bucket 7131 is fixedly provided at the top of the discharge pipe 7132, and a second collecting pipe 7136 fixedly connected to the end of the liquid outlet pipe 712 close to the storage bucket 7131 is fixedly provided at the top of the return pipe 7135.

[0038] It should be noted that if Figure 5 As shown, the bottom end of the discharge pipe 7132 extends to the inner bottom wall of the storage barrel 7131, and the bottom end of the return pipe 7135 extends to the top of the interior of the storage barrel 7131, so that the discharge pipe 7132 can draw out the coolant in the storage barrel 7131 and complete the circulation through the return pipe 7135.

[0039] In addition, if Figure 4 As shown, the spiral guide cavity 710 is a planar spiral structure, and the top of the heat-conducting plate 709 is fitted with the bottom of the inverter device circuit board 6. The fitting portion can be coated with thermal grease to fill the tolerance at the gap, so that the heat-conducting plate 709 can fit the bottom of the inverter device circuit board 6 for heat exchange. The top ends of the liquid inlet pipe 711 and the liquid outlet pipe 712 are respectively located at the outer circle and inner circle of the corresponding spiral guide cavity 710. Specifically, the top ends of the liquid inlet pipe 711 and the liquid outlet pipe 712 are respectively located at the end of the outer circle and the tail end of the inner circle of the spiral guide cavity 710, so that the coolant in the liquid inlet pipe 711 can enter the spiral guide cavity 710 for heat exchange, and then be discharged through the liquid outlet pipe 712.

[0040] At the same time, the end of the first locking bolt 714 can abut against the outer side of the corresponding fixed rod 702, the end of the second locking bolt 715 can abut against the outer side of the corresponding adjusting rod 703, and the end of the third locking bolt 717 can abut against the outer side of the corresponding movable block 704. The connecting opening 718 is provided for the liquid inlet pipe 711 and the liquid outlet pipe 712 to pass through, so that the adjusting rod 703 can be positioned by the first locking bolt 714, the movable block 704 can be positioned by the second locking bolt 715, and the movable plate 705 can be positioned by the third locking bolt 717.

[0041] In this embodiment, the cooling component 800 is a structure for efficiently cooling the CPU.

[0042] like Figure 6 , Figure 7 and Figure 8As shown, the cooling assembly 800 includes a plurality of lifting blocks 801 fixed to the top of the inverter device circuit board 6, the tops of the lifting blocks 801 are detachably connected with a mounting frame 802, the top of the mounting frame 802 is fixed with a support frame 803 with openings on both sides and the bottom, the top of the mounting frame 802 is fixed with a heat-conducting plate 804, the inside of the heat-conducting plate 804 is provided with a flow cavity 805, the outside of the heat-conducting plate 804 is fixed with an input pipe 806 and an output pipe 807 both connected to the inside of the flow cavity 805, the inside of the support frame 803 is fixed with a plurality of first heat dissipation fans 808, and the inside of the support frame 803 is fixed with a plurality of first heat dissipation fans 808. A diversion grid plate 809 is fixedly installed, and a plurality of heat pipes 810 are fixed on the top of the heat conducting plate 804. A plurality of wavy heat sinks 811 are passed through and fixedly connected between the outer sides of the heat pipes 810. The outer sides of the wavy heat sinks 811 are provided with a plurality of rectangular grooves 812 which are open on both sides. A protective mesh plate 813 is detachably connected to the right side of the support frame 803. A water tank 814 is fixed on the top of the support frame 803. A top frame 815 is fixed on the top of the water tank 814. A plurality of second heat dissipation fans 816 are fixedly installed on the inner side of the top frame 815. A second water pump 817 which is connected to the interior of the inlet pipe 806 is fixedly installed.

[0043] It should be noted that the bottom of the abutting heat conducting plate 804 abuts the top of the main control chip on the top of the inverter device circuit board 6, such as the CPU, and the connection can be coated with thermal conductive silicone grease to fill the gap tolerance. The back ends of the input pipe 806 and the output pipe 807 both penetrate the back side of the support frame 803 and the outside of the water tank 814, and are connected to the interior of the water tank 814, so that the coolant in the water tank 814 can be transported to the inside of the circulation cavity 805 through the input pipe 806 under the action of the second water pump 817 for heat conduction circulation, and then transported back to the water tank 814 through the output pipe 807 for replenishment, completing the circulation of the coolant.

[0044] In addition, the diversion grid plate 809 is located between the first cooling fan 808 and the opposite side of the wavy heat sink 811, so that the wind blown out by the first cooling fan 808 can be diverted, thereby improving the uniformity of air blowing and heat dissipation. The top end of the heat pipe 810 passes through the top of the support frame 803 and the bottom and top of the water tank 814 and extends to the inner top wall of the top frame 815. The outside of the heat pipe 810 and the outside of the water tank 814 are fixedly connected. The wavy heat sink 811 is distributed inside the support frame 803 and inside the top frame 815, so that the top part of the heat pipe 810 can be immersed in the water tank 814 for heat conduction. The top wavy heat sink 811 can cooperate with the second cooling fan 816 to cool the top end of the heat pipe 810.

[0045] The working principle of the above embodiment is:

[0046] (1) Before installation, the position of the movable block 704 is adjusted according to the different positions of the inverter device circuit board 6 and the electronic components fixed on its top. The sliding adjustment rod 703 can realize the front and rear adjustment action of the movable block 704. The sliding movable block 704 moves on the outside of the adjustment rod 703 to realize the left and right adjustment action. After the adjustment is completed, the first locking bolt 714 and the second locking bolt 715 are tightened to complete the positioning. According to the actual position of the electronic components, the position of the heat conducting plate 709 is fine-tuned so that it slides back and forth under the cooperation between the trapezoidal slider 706 and the trapezoidal slide groove 707 to complete the position adjustment. After the adjustment is completed, the third locking bolt 717 is tightened to complete the positioning. The position of the cooling structure can be adjusted and arranged in a targeted manner according to the different positions of the heat generating points.

[0047] (2) When the inverter is working, the various circuit components 2 in the inverter device housing 1 and the inverter device circuit board 6 are working, and the first water pump 7133 is started, so that the coolant in the storage barrel 7131 is extracted through the discharge pipe 7132, and is transported to the inside of each liquid inlet pipe 711 through the first central pipe 7134, so that the coolant in the liquid inlet pipe 711 is transported to the spiral guide cavity 710 to flow, and take away the heat on the bonded heat conduction plate 709 to achieve heat transfer. The coolant after heat conduction enters the inside of the second central pipe 7136 through the liquid outlet pipe 712, and is finally transported back to the storage barrel 7131 through the return pipe 7135 to complete the cycle, thereby achieving a targeted cooling effect on the key heating point at the bottom of the inverter device circuit board 6.

[0048] (3) Start the second water pump 817 so that the coolant in the water tank 814 is transported to the circulation cavity 805 through the input pipe 806 for circulating heat conduction cooling, and then transported back to the inside of the water tank 814 through the output pipe 807 to complete the cycle. Start the first heat dissipation fan 808 so that the transported wind is diverted by the diversion grid plate 809 and then blown to the outside of the corrugated heat sink 811 to take away the heat on the surface. At the same time, the top of the heat pipe 810 is continuously immersed in the inside of the water tank 814. The coolant inside the water tank 814 can cool the top of the heat pipe 810, so that the heat can be offset to a certain extent. Start the second heat dissipation fan 816, so that the top of the heat pipe 810 can be cooled through the topmost corrugated heat sink 811, and the coolant inside the water tank 814 can be cooled through the cooled heat pipe 810, thereby achieving a complementary effect and effectively improving the overall cooling efficiency and effect.

[0049] Compared with the prior art, the cooling structure based on the inverter device circuit can adjust the point position of the cooling structure according to the positions of different circuit boards in different inverters and the electronic components on different circuit boards through the use of the point cooling component 700 at the bottom of the inverter device circuit board 6, so that it can meet the use and coordination requirements of different heating points of different circuit boards, and then the key heating points can be targeted for cooling, so that the cooling effect can become more reliable and effective, and the heat dissipation can be well suppressed, thereby improving the cooling effect. Through the cooling component 800 at the top of the inverter device circuit board 6, a more efficient cooling effect can be achieved for the key total control chip, such as the CPU. By increasing the heat dissipation area and the shape of the cooling structure, the cooling efficiency can be significantly improved, which is conducive to keeping the chip within the normal working range, so that it can work stably for a long time to meet the working requirements of the inverter and facilitate user use. It solves the problem that the cooling range of the existing inverter device circuit is too large and lacks pertinence during actual use, resulting in a certain room for improvement in the actual cooling effect and efficiency.

[0050] The electrical components appearing in the article are all electrically connected to the main controller and the power supply. The provision of power supply is common knowledge in the field. The main controller can be a conventional known device for control such as a computer, which can be realized through simple programming by technicians in the field. They are all existing public power connection technologies and will not be described in detail in the article.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling structure based on an inverter device circuit, comprising an inverter device housing (1), characterized in that: A plurality of circuit components (2) are fixedly mounted on the inner side of the inverter device housing (1); mounting blocks (3) are fixedly mounted on both the front and rear inner side walls of the inverter device housing (1); a guide cooling fan (4) is fixedly mounted on the opposite sides of the two mounting blocks (3); a mounting frame (5) is fixedly mounted on the inner bottom wall of the inverter device housing (1); an inverter device circuit board (6) is detachably connected to the top of the mounting frame (5); a point cooling assembly (700) for cooling the bottom of the inverter device circuit board (6) is mounted on the inner side of the mounting frame (5); and a cooling assembly (800) is mounted on the top of the inverter device circuit board (6).

2. A cooling structure based on an inverter device circuit according to claim 1, characterized in that: The point cooling assembly (700) comprises a fixing frame (701) fixed to the inner side of the mounting frame (5) and a water delivery bucket (713) located on the outer side of the inverter device housing (1); two fixing rods (702) are fixed between the front and rear inner side walls of the fixing frame (701); a plurality of adjustment rods (703) are slidably connected between the outer sides of the two fixing rods (702); a plurality of movable blocks (704) are slidably connected to the outer sides of the adjustment rods (703); a movable plate (705) is slidably fitted on the top of the movable block (704); two trapezoidal sliders (705) are fixed to the bottom of the movable plate (705). 06), the front of the movable block (704) is provided with two trapezoidal slide grooves (707) for the corresponding two trapezoidal sliders (706) to be inserted and slide respectively, the top of the movable plate (705) is fixed with two vertical rods (708), a fitting heat conduction plate (709) is fixed between the tops of the two corresponding vertical rods (708), a spiral flow guide cavity (710) is provided inside the fitting heat conduction plate (709), and a liquid inlet pipe (711) and a liquid outlet pipe (712) connected to the inside of the spiral flow guide cavity (710) and the inside of the conveying bucket (713) are fixed to the bottom of the fitting heat conduction plate (709); Two first locking bolts (714) are penetrated and threadedly connected at the bottom of the adjusting rod (703), second locking bolts (715) are penetrated and threadedly connected at the front and back of the movable block (704), two symmetrical plates (716) are fixed at the bottom of the movable plate (705), and third locking bolts (717) are penetrated and threadedly connected at the side of the symmetrical plates (716) away from the corresponding movable block (704), a plurality of connecting openings (718) are provided at the front and back of the inverter device housing (1), and a connecting hole (719) is provided at the top of the mounting frame (5) for the movement of the heat conducting plate (709) in contact.

3. A cooling structure based on an inverter device circuit according to claim 2, characterized in that: The water delivery bucket (713) comprises a storage bucket (7131) located outside the inverter device housing (1); a discharge pipe (7132) and a return pipe (7135) are provided on the top of the storage bucket (7131) and fixedly installed; a first water pump (7133) connected to the inside of the discharge pipe (7132) is fixedly installed; a first centralizing pipe (7134) fixedly connected to one end of the liquid inlet pipe (711) close to the storage bucket (7131) is fixedly installed on the top of the discharge pipe (7132); and a second centralizing pipe (7136) fixedly connected to one end of the liquid outlet pipe (712) close to the storage bucket (7131) is fixedly installed on the top of the return pipe (7135).

4. The cooling structure based on the inverter device circuit according to claim 1, characterized in that: The cooling component (800) comprises a plurality of lifting blocks (801) fixed to the top of the inverter device circuit board (6); a mounting frame (802) is detachably connected between the tops of the lifting blocks (801); a support frame (803) with openings on the left and right sides and the bottom is fixed to the top of the mounting frame (802); a heat-conducting plate (804) is fixed to the top of the mounting frame (802); a circulation cavity (805) is provided inside the heat-conducting plate (804); an input pipe (806) and an output pipe (807) both connected to the inside of the circulation cavity (805) are fixed to the outside of the heat-conducting plate (804); a plurality of first heat-dissipating fans (808) are fixedly installed on the inside of the support frame (803); and a plurality of first heat-dissipating fans (808) are fixedly installed on the inside of the support frame (803). A diversion grid plate (809) is fixedly installed, a plurality of heat pipes (810) are fixed on the top of the abutting heat conducting plate (804), a plurality of corrugated heat sinks (811) are passed through and fixedly connected between the outer sides of the heat pipes (810), a plurality of rectangular grooves (812) with openings on both the left and right sides are opened on the outer sides of the corrugated heat sinks (811), a protective mesh plate (813) is detachably connected to the right side of the support frame (803), a water tank (814) is fixed on the top of the support frame (803), a top frame (815) is fixed on the top of the water tank (814), a plurality of second heat dissipation fans (816) are fixedly installed on the inner side of the top frame (815), and a second water pump (817) connected to the interior of the input pipe (806) is fixedly installed on the input pipe (806).

5. The cooling structure based on the inverter device circuit according to claim 4, characterized in that: The back ends of the input pipe (806) and the output pipe (807) penetrate the back side of the support frame (803) and the outside of the water tank (814), and are connected to the inside of the water tank (814). The diversion grid plate (809) is located between the first heat dissipation fan (808) and the opposite side of the corrugated heat sink (811).

6. The cooling structure based on the inverter device circuit according to claim 4, characterized in that: The top end of the heat pipe (810) passes through the top of the support frame (803) and the bottom and top of the water tank (814) and extends to the inner top wall of the top frame (815); the outer side of the heat pipe (810) and the outer side of the water tank (814) are fixedly connected; and the wavy heat sink (811) is distributed inside the support frame (803) and inside the top frame (815).

7. The cooling structure based on the inverter device circuit according to claim 3, characterized in that: The bottom end of the discharge pipe (7132) extends to the inner bottom wall of the storage barrel (7131), and the bottom end of the return pipe (7135) extends to the top of the interior of the storage barrel (7131).

8. The cooling structure based on the inverter device circuit according to claim 2, characterized in that: The top of the bonded heat conducting plate (709) is bonded to the bottom of the inverter device circuit board (6), and the top ends of the liquid inlet pipe (711) and the liquid outlet pipe (712) are respectively located at the outer circle and inner circle of the corresponding spiral flow guide cavity (710).

9. The cooling structure based on the inverter device circuit according to claim 2, characterized in that: The end of the first locking bolt (714) can abut against the outer side of the corresponding fixing rod (702), and the end of the second locking bolt (715) can abut against the outer side of the corresponding adjusting rod (703).

10. The cooling structure based on the inverter device circuit according to claim 2, characterized in that: The end of the third locking bolt (717) can abut against the outer side of the corresponding movable block (704), and the communicating opening (718) is provided for the liquid inlet pipe (711) and the liquid outlet pipe (712) to pass through and be arranged.

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