Component holder with temperature control function

Abstract

The invention relates to a component holder (1) for treating a component, comprising a carrier (100), a component holding tool (300) having a component contact surface (350), and a temperature control device (200) for thermally shielding one or more regions of the component contact surface (350) of the component holding tool (300) from the carrier (100) at a predetermined process temperature.

Description

Technical Field

[0001] The invention relates to a component holder with a temperature control function according to the features of claim 1 and to its use according to the features of claim 22 . Background Art

[0002] Component holders are known from the prior art for a wide range of applications and for mounting components of various shapes. Component holders are generally used in the field of manufacturing electronic components or subassemblies when mounting semiconductor chips on substrates. The use of component holders in thermal assembly processes such as welding or bonding is problematic. Due to the two different masses of the component holder and the component to be held, strong temperature gradients result, which have a negative impact on the assembly process.

[0003] It is also known from the prior art that electrical structural elements made of materials with a positive temperature coefficient, so-called PTC elements, are often used in protective circuits, especially as fuses. Their resistance increases when the ambient temperature rises. Due to this effect, they are often used as fuse elements for limiting current, because PTC elements heat up when the current increases. As a result of the heating, the resistance of the element increases and the current is limited. When the current is unexpectedly high or increases uncontrollably in a very short time, the heat generated melts the PTC element and destroys the PTC element in this way to interrupt the current.

[0004] Various solutions for component holders with their advantages and disadvantages are also proposed and discussed in detail in the patent literature, for example in DD 2 70 180 A10, JP 5 675 138 82, US 11 631 597 82, US 2003 / 0 075 537 A1, US 2005 / 0 257 160 A1 or US 2014 / 0 184 312 A1. Summary of the invention

[0005] The object of the present invention is to provide a component holder for holding components, such as electronic components or semiconductor chips, during component assembly, which component holder, despite a massive design, has temperature characteristics that are adapted to and maintained at the temperature of the direct process environment of the component, even at high process cycles.

[0006] This object is achieved by the subject matter according to independent claim 1 and its application according to claim 22. Technically advantageous embodiments are described in the dependent claims, the description and the drawings.

[0007] According to one aspect of the present invention, a component holder for processing components includes a carrier as an integral part, a component holding tool having a component contact surface, and a temperature control device, which is used to thermally shield one or more areas of the component contact surface of the component holding tool relative to the carrier at a predetermined process temperature.

[0008] According to another aspect of the present invention, a component holder for processing components includes a carrier as components, a component holding tool having a component contact surface and a temperature control device, wherein the temperature control device is arranged between the carrier and the component holding tool so that one or more areas of the component contact surface of the component holding tool can be temperature-controlled relative to the carrier at a predetermined process temperature, so that one or more areas of the component contact surface of the component holding tool are thermally shielded or can be thermally shielded from the carrier when processing the component.

[0009] In both aspects, the heat shielding is achieved in particular by compensating for thermal energy differences that occur between the individual components.

[0010] In both aspects, the component holder and / or at least one of its components is preferably of a large and heavy design in order to be able to compensate for process-induced vibrations / fluctuations by means of inertia. A large and heavy design is indeed accompanied by a slow heating and / or cooling behavior, whereby the thermal energy input and / or output can only exert its effect in a time-delayed manner in the form of heat radiation or cold radiation to one or more regions of the component contact surface. However, this disadvantage can be optimized by materials that are thermally matched to one another, so that due to matching thermal conductivity and material thickness in the direction of heat flow, the total heat conduction capacity is optimal, so that inertia is compensated in at least one way for the heat energy supplied and / or discharged in a very short time.

[0011] In both aspects, thermal energy from at least one heat source and / or heat sink can be supplied to the component holder and / or at least one of its components and / or discharged from the component holder and / or at least one of its components. Preferably, the heat source and / or heat sink is buried in the component holder and / or at least one of its components. Preferably, in both aspects, the heat source and / or heat sink is arranged to extend in the spatial volume of the component holder and / or at least one of its components and / or is arranged to extend in the layer plane of the component holder and / or at least one of its components.

[0012] In both aspects, the spatial volume and / or the layer plane is preferably divided into a plurality of temperature zones. This has the advantage that, by means of predetermined temperature values ​​adapted to the process to be experienced by the component to be treated, the thermal energy to be supplied and / or discharged can be optimally adjusted and setpoint deviations can be continuously reduced by means of control circuits. In particular, the influence of the external environment can thus be reduced to a greater extent, thereby achieving a more stable process.

[0013] In an embodiment of the component holder, the component holder and / or one or more, preferably all of its components (in particular carrier, component holding means and temperature control device) each comprise at least one media line section extending in a spatial volume within a temperature zone.

[0014] Preferably, the media line sections are each arranged such that, in the case of a non-positive and / or positive connection of the carrier to the temperature control device and a non-positive and / or positive connection of the temperature control device to the component holding means, a continuous media line is formed from at least two media line sections, through which at least a portion of the positive and / or negative thermal energy for temperature control of the temperature zones can be supplied to and / or discharged from the at least one temperature zone in a first manner within a few seconds by means of at least one medium, preferably a medium for treating the component. In this case, in the case of one media line, it is equally possible to supply and / or discharge thermal energy alternately within the temperature zones via the same media line, as in the case of two or more media lines.

[0015] In particular, technical gases, which are in particular subjected to high pressure, are suitable as media, so that temperature control (ie temperature control) can be carried out within a few seconds, preferably within a few milliseconds.

[0016] In an embodiment of the component holder, the component holder and / or one or more (preferably all) of its components comprise one or more heating elements in order to provide at least a portion of the positive thermal energy for temperature regulation in the temperature zone in a second manner.

[0017] Preferably, the previously mentioned embodiments of the component holder include a heat source and / or a cold source which is arranged to extend in the spatial volume of the component holder and / or at least one of its components and / or is arranged to extend in the layer plane of the component holder and / or at least one of its components in order to provide at least a portion of the positive thermal energy or negative thermal energy for temperature control in the two ways previously described.

[0018] In the context of the present disclosure, the thermal energy that can be input and / or discharged in a very short time is used to control the temperature of temperature zones that are spatially arranged in a volume or in a layer plane, and ultimately to bring one or more regions of a component contact surface to a defined temperature and to maintain this temperature during the processing of the component. Preferably, for this purpose, the thermal conductivity of the materials of the individual components is adjusted to one another in order to optimize the overall thermal conductivity.

[0019] In an embodiment of the component holder with a plurality of heating elements, at least one heating element is a PTC thermistor heating element.

[0020] In an embodiment of the component holder having a plurality of heating elements, the heating elements are electrically connected in series with one another, particularly preferably in parallel.

[0021] In such an embodiment of the component holder having one or more heating elements, the one or more heating elements are arranged in one or more temperature zones.

[0022] Compared with the series connection, in the case of a temperature difference between two regions of the component contact surface or two temperature zones of the temperature control device, the parallel connection of the heating element has the following advantages: in the region or temperature zone with a higher temperature, the resistance of the PTC thermistor heating element buried therein increases. According to the law of the parallel circuit, the same voltage exists on each resistor. However, when the resistance in a circuit branch is higher, the current is smaller. This means that the high resistance generated in an area or a temperature zone due to the higher temperature leads to a low current in the branch and thus leads to a smaller heating power in the area or the temperature zone. The result is a temperature reduction, whereby the resistance in the area or in the temperature zone is also reduced. The negative feedback loop thus achieved makes it possible to realize an adaptive control system for temperature control. As a result, although the process temperature and / or ambient temperature fluctuates or acts unevenly, the temperature distribution on the component contact surface is uniform.

[0023] Furthermore, manufacturing tolerances (or smaller defects) of the PTC thermistor are compensated, which leads to a higher yield during the processing of the heating device and thus to lower production costs.

[0024] The design also has the potential to reduce costs because its automatic adaptability reduces the number of heaters required, as each heating unit would otherwise require its own controller and its own thermocouple.

[0025] In the case of a series circuit that can be used in the same manner, the temperature increase in a region or in a temperature zone in the same previously described situation leads to a higher resistance of the PTC thermistor heating element buried therein. According to the series circuit law, the same current is present on each resistor. The higher the resistance, the higher the voltage. This means that a high resistance in the region or in the temperature zone leads to a high voltage in the zone and therefore a higher heating power. The temperature rises in a region or in a temperature zone. The resistance rises in the region or in the temperature zone. This is a positive feedback loop and a self-amplification system is obtained. The result is a hot spot on the heating element.

[0026] In an embodiment of the component holder, the heating elements of each temperature zone are electrically connected to a respective power source, wherein each of the power sources is arranged such that a predetermined and / or controlled supply of electrical energy is provided to the heating elements of the temperature zones. Preferably, the number of power sources thus corresponds to the number of temperature zones, so that each temperature zone has a power source.

[0027] In an embodiment of the component holder, preferably at least one of the temperature zones is arranged in an inner central region of the component contact surface, wherein at least one other temperature zone is located in one or more outer regions of the component contact surface peripheral to the inner central region.

[0028] In the embodiment of the component holder, one or more heating elements or one or more PTC thermistor heating elements are preferably produced in thin-film technology or in thick-film technology for particularly powerful heating elements and are thus embedded in the temperature control layer. Thermal expansion usually leads to a change in the length / thickness of the temperature control layer or a bending of the temperature control layer.

[0029] Furthermore, in thin-film technology or thick-film technology, the temperature control device is designed as a layer composite of multiple temperature control layers, which have a summable heat energy supply or a summable heat energy discharge, and supply and / or discharge heat energy simultaneously or alternately, which can improve the temperature control or temperature control for heat shielding.

[0030] By using a material layer for compensating the temperature course for the temperature control layer of the temperature control device for all embodiments of the component holder, the material layers preferably being a sequence of material layers arranged alternately in pairs and having mutually coordinated thermal expansion coefficients which compensate one another as layer pairs, or by using a particularly mechanically rigid material (e.g. ceramic, sintered ceramic, technical glass, sapphire or semiconductor material) for the general temperature control layer, thermally induced bending of the layer composite of the temperature control device can be reduced in an advantageous manner.

[0031] In the embodiment of the component holder, the component contact surface preferably has a polygonal shape. Preferably, the polygonal shape is a triangle, square, trapezoid, polygon, quadrilateral, rectangle, polygon, circle, ellipse, ring, arc shape or any combination thereof.

[0032] In an embodiment of the component holder, preferably, one or more temperature zones have a polygonal shape. Preferably, the polygonal shape is a triangle, square, trapezoid, polygon, quadrilateral, rectangle, polygon, circle, ellipse, line, ring, arc shape or any combination thereof.

[0033] In an embodiment of the component retainer, in the case of multiple temperature zones, the first temperature zone is arranged in the central area of ​​the component contact surface, the second temperature zone is arranged adjacent to the first edge of the first temperature zone and is located at the periphery of the first edge, the first PTC thermistor heating element of the third temperature zone is arranged adjacent to the second edge of the first temperature zone and is located at the periphery of the second edge, the fourth temperature zone is arranged adjacent to the third edge of the first temperature zone and is located at the periphery of the third edge, and the second PTC thermistor heating element of the third temperature zone is arranged adjacent to the fourth edge of the first temperature zone and is located at the periphery of the fourth edge, and the first temperature zone includes a plurality of PTC thermistor heating elements connected in parallel.

[0034] In an embodiment of the component retainer, the fifth temperature zone is arranged adjacent to the first edge of the first PTC thermistor heating element of the third temperature zone and is located at the periphery of the first edge, and the sixth temperature zone is arranged adjacent to the first edge of the second heating element of the third temperature zone and is located at the periphery of the first edge.

[0035] In an embodiment of the component holder, the first temperature zone has a square shape, and the second temperature zone, the first PTC thermistor heating element of the third temperature zone, the fourth temperature zone and the second PTC thermistor heating element of the third temperature zone have a trapezoidal shape.

[0036] In an embodiment of the component retainer, the first PTC thermistor heating element in the first temperature zone is arranged in the inner central area of ​​the component contact surface, the second PTC thermistor heating element in the first temperature zone is arranged adjacent to the first edge of the first PTC thermistor heating element in the first temperature zone and is located at the periphery of the first edge, the third PTC thermistor heating element in the first temperature zone is arranged adjacent to the second edge of the first PTC thermistor heating element in the first temperature zone and is located at the periphery of the second edge, the fourth PTC thermistor heating element in the first temperature zone is arranged adjacent to the third edge of the first PTC thermistor heating element in the first temperature zone and is located at the periphery of the third edge, the fifth heating element in the first temperature zone is arranged adjacent to the fourth edge of the first PTC thermistor heating element in the first temperature zone and is located at the periphery of the fourth edge, and the first temperature zone includes a plurality of PTC heating elements connected in parallel.

[0037] In an embodiment of the component holder, the first PTC thermistor heating element of the first temperature zone has a square shape, wherein the second PTC thermistor heating element of the first temperature zone, the third PTC thermistor heating element of the first temperature zone, the third PTC thermistor heating element of the first temperature zone, the fourth PTC thermistor heating element of the first temperature zone, and the fifth PTC thermistor heating element of the first temperature zone each have a polygonal shape. Preferably, as described above, the polygonal shape is a triangle, square, trapezoid, polygon, quadrilateral, rectangle, polygon, circle, ellipse, line, ring, arc shape, or any combination of these shapes.

[0038] In an embodiment of the component retainer, the first PTC thermistor heating element in the second temperature zone is arranged adjacent to (or adjacent to the first edge) and around the first edge of the second PTC thermistor heating element in the first temperature zone, the second PTC thermistor heating element in the second temperature zone is arranged adjacent to and around the first edge of the third PTC thermistor heating element in the first temperature zone, the third PTC thermistor heating element in the second temperature zone is arranged adjacent to and around the first edge of the fifth PTC thermistor heating element in the first temperature zone, and the fourth PTC thermistor heating element in the second temperature zone is arranged adjacent to and around the first edge of the fourth PTC thermistor heating element in the first temperature zone, and the second temperature zone includes a plurality of PTC thermistor heating elements connected in parallel.

[0039] In an embodiment of the component retainer, the first PTC thermistor heating element of the third temperature zone is arranged adjacent to and around the first edge of the second PTC thermistor heating element of the second temperature zone, and the second PTC thermistor heating element of the third temperature zone is arranged adjacent to and around the first edge of the first PTC thermistor heating element of the third temperature zone, and the third temperature zone includes a plurality of PTC thermistor heating elements connected in parallel.

[0040] In an embodiment of the component retainer, the first PTC thermistor heating element of the fourth temperature zone is arranged adjacent to and around the first edge of the first PTC thermistor heating element of the second temperature zone, and the second PTC thermistor heating element of the fourth temperature zone is arranged adjacent to and around the first edge of the first PTC thermistor heating element of the fourth temperature zone, and the fourth temperature zone includes a plurality of PTC thermistor heating elements connected in parallel.

[0041] In an embodiment of the component retainer, the first PTC thermistor heating element of the fifth temperature zone is arranged adjacent to and around the first edge of the third PTC thermistor heating element of the second temperature zone, and the second PTC thermistor heating element of the fifth temperature zone is arranged adjacent to and around the first edge of the first PTC thermistor heating element of the fifth temperature zone, and the fifth temperature zone includes a plurality of PTC thermistor heating elements connected in parallel.

[0042] In an embodiment of the component retainer, the first PTC thermistor heating element in the sixth temperature zone is arranged adjacent to and around the first edge of the fourth PTC thermistor heating element in the second temperature zone, and the second PTC thermistor heating element in the sixth temperature zone is arranged adjacent to and around the first edge of the first PTC thermistor heating element in the sixth temperature zone, and the sixth temperature zone includes a plurality of PTC thermistor heating elements connected in parallel.

[0043] In an embodiment of the component holder, the component holder and / or its components, preferably the carrier and / or particularly preferably the temperature control device and / or the component holding means, further comprise one or more temperature sensors.

[0044] The temperature sensor can also be arranged as a layer in the temperature control device and cover a similar area as the heating element, preferably the PTC thermistor heating element. The integration of the electric heating element and the temperature sensor can have a relatively small effect on the temperature uniformity.

[0045] In an embodiment of the component holder, in particular in the case of a produced layer composite of a temperature control device, "heating elements are preferably combined in parallel to form temperature zones which act not only in the layer plane but also in the spatial volume" has proven to be particularly advantageous for temperature control based on the requirements for the temperature distribution caused by the process, so that one or more areas of the component contact surface of the component holding tool can be thermally shielded from the carrier when processing the component.

[0046] Embodiments of the component holder may be arranged on a bond head such that the component holder is capable of receiving and securely holding any type of component, such as a semiconductor wafer, semiconductor package, chip, flip chip, integrated circuit, or optical, electronic, electro-optical component, or a combination thereof.

[0047] Embodiments of the component holder may be arranged at a bonding location of a bonder such that the component holder is capable of receiving and securely holding any type of component, such as a semiconductor wafer, a semiconductor package, a chip, a flip chip, an integrated circuit, or an optical component, an electronic component, an electro-optical component, a substrate, a chip, or a combination thereof.

[0048] The above-described arrangement of heating elements and / or PTC thermistor heating elements is described in each case depending on the type of component, wherein the geometric dimensions define the number of heating elements and / or PTC thermistor heating elements and the area to be geometrically occupied and thereby directly achieve a temperature control effect during handling of the component by thermally shielding the component from a carrier of the component holder.

[0049] Another aspect of the present invention relates to a method for using a component holder according to one of the aforementioned embodiments for controlling the temperature of one or more areas of a component contact surface of a component holding tool, the method comprising controlling the relative temperature difference between one or more temperature zones and / or the relative temperature difference between one or more PTC thermistor heating elements in a temperature zone during a process step using the component holder.

[0050] In a preferred method, the method of using the component holder includes controlling the relative temperature difference between one or more temperature zones and / or the relative temperature difference between one or more PTC thermistor heating elements in a temperature zone to achieve a uniform distribution of temperature at the component contact surface.

[0051] The embodiments EA1 to EA12 described below are suitable not only for applications associated with holding components, but also for applications associated with fixing any components during processing, associated with other and / or additional processes, and associated with other and / or additional processing machines. These embodiments are:

[0052] EA1: A thermostatic device comprising two or more heating elements, each heating element being configured and arranged so that the heating element increases the temperature of an adjacent area when the flow of electrons through the heating element increases due to an electric current or voltage that may be applied to the heating element; at least two of the two or more heating elements being electrically connected in parallel; and each heating element being configured and arranged so that its resistance increases non-linearly when the temperature of the adjacent area increases.

[0053] EA2: The temperature control device according to EA1, wherein each of the parallel-connected heating elements comprises one or more PTC thermistors.

[0054] EA3: Temperature-controlled heating device according to EA1 or according to EA2, wherein the increase in the electron current is achieved by increasing the voltage while keeping the current constant or by increasing the current while keeping the voltage constant.

[0055] EA4: Temperature control device according to EA1, according to EA2 or according to EA3, wherein each heating element comprises one or more electrically conductive thin layers produced using thin-film technology.

[0056] EA5: A component holder having a component contact surface and a temperature control device according to EA1, according to EA2, according to EA3 or according to EA4, the temperature control device being configured and arranged such that it increases the temperature of one or more regions of the component contact surface during operation.

[0057] EA6: Component holder according to EA5, wherein the component contact surface has low electrical conductivity, preferably electrical insulation, in one or more regions near the one or more heating elements.

[0058] EA7: Component holder according to EA5 or according to EA6, wherein the temperature of the component contact surface, preferably a temperature which is uniformly distributed over the component contact surface, can be increased during operation.

[0059] EA8: An arrangement of heating elements that are symmetrical to one another, wherein the symmetry comprises a concentric arrangement comprising parallel zones that are arranged at the same distance from a center, wherein a temperature control layer having a non-square surface implements the edge regions as separate zones.

[0060] EA9: A temperature zone arrangement preferably having a rectangular design for rectangular components or a square or circular design for heat shields of square or circular components.

[0061] EA10: A temperature control device which can be arranged and / or fixed on a carrier plate.

[0062] EA11: A carrier plate which is replaceably connected to a component holder.

[0063] EA12: Interface for conducting or transmitting process media and / or electrical signals between temperature control device and component holder.

[0064] EA13: A controllable passage for a process medium in a temperature control device.

[0065] Furthermore, the following embodiments EA-P1 to EA-P23 have proven to be particularly suitable in practice:

[0066] EA-P1: A component holder (1) for processing components, the component holder (1) comprising a carrier (100) as a component, a component holding tool (300) having a component contact surface (350) and a temperature control device (200), wherein the temperature control device (200) is arranged on the carrier (100) so that at a predetermined process temperature for processing the component, one or more regions of the component contact surface (350) of the component holding tool (300) can be temperature-controlled relative to the carrier (100) by means of positive thermal energy or negative thermal energy, so that in order to process the component, one or more regions of the component contact surface (350) of the component holding tool (300) are thermally shielded from the carrier (100).

[0067] EA-P2: A component holder (1) according to EA-P1, wherein the carrier (100) and the temperature control device (200) respectively have at least one medium pipeline (130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141), and the medium pipelines are respectively arranged so that the carrier (100) and the temperature control device (200) and the temperature control device (200) and the component holding tool (300) are respectively connected to each other in a force-locked and / or form-locked manner, so that at least a portion of the positive thermal energy or negative thermal energy used for temperature control can be supplied or discharged with the aid of at least one medium, preferably a medium for processing the component.

[0068] EA-P3: According to the component holder (1) of EA-P1 or EA-P2, the temperature control device (200) includes one or more temperature zones (301, 302, 303, 304, 305, 306), and the temperature zones provide positive thermal energy to the one or more areas of the component contact surface (350).

[0069] EA-P4: A component holder (1) according to EA-P3, wherein each temperature zone (301, 302, 303, 304, 305, 306) comprises one or more electrical heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b).

[0070] EA-P5: A component holder (1) according to EA-P3, wherein one or more of the temperature zones (301, 302, 303, 304, 305, 306) comprises two or more PTC thermistor heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) electrically connected in parallel.

[0071] EA-P6: A component holder (1) according to EA-P4 or EA-P5, wherein each of the one or more temperature zones (301, 302, 303, 304, 305, 306) is arranged to be electrically connected to one of n power supplies, and each of the power supplies is arranged to provide a predetermined and / or controlled supply of electrical energy to one of the temperature zones (301, 302, 303, 304, 305, 306).

[0072] EA-P7: A component holder (1) according to any one of claims 3 to 6, wherein at least one of the n temperature zones (301) is arranged in an inner central area of ​​the component contact surface (350); and at least one additional temperature zone (302, 303, 304, 305, 306) is arranged in one or more outer areas of the component contact surface (350) periphery of the inner central area.

[0073] EA-P8: Component holder (1) according to EA-P4 or EA-P5, wherein one or more heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) or one or more PTC thermistor heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) are applied as a film.

[0074] EA-P9: A component retainer (1) according to any of the preceding embodiments, wherein the component contact surface (350) comprises a triangle, square, trapezoid, polygon, quadrilateral, rectangle, polygon, circle, ellipse, ring, arc shape or any combination of these shapes.

[0075] EA-P10: A component retainer (1) according to any one of embodiments EA-P3 to EA-P9, wherein one or more of the temperature zones (301, 302, 303, 304, 305, 306) include a triangle, square, trapezoid, polygon, quadrilateral, rectangle, polygon, circle, ellipse, line, ring, arc shape or any combination of these shapes.

[0076] EA-P11: A component holder (1) according to any one of claims 3 to 9, wherein, in the case of multiple temperature zones, a first temperature zone (301) is arranged in a central area of ​​the component contact surface (350), a second temperature zone (302) is arranged adjacent to and around a first edge of the first temperature zone (301), a first PTC thermistor heating element (303a) of a third temperature zone (303) is arranged adjacent to and around a second edge of the first temperature zone (301), a fourth temperature zone (304) is arranged adjacent to and around a third edge of the first temperature zone (301); and a second PTC thermistor heating element (303b) of the third temperature zone (303) is arranged adjacent to and around a fourth edge of the first temperature zone (301); the first temperature zone (301) includes a plurality of PTC thermistor heating elements (301a, 301b, 301c, 301d, 301e) connected in parallel.

[0077] EA-P12: A component holder (1) according to embodiment EA-P11, wherein the fifth temperature zone (305) is arranged adjacent to and located at the periphery of the first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303), and the sixth temperature zone (306) is arranged adjacent to and located at the periphery of the first edge of the second heating element (303b) of the third temperature zone (303).

[0078] EA-P13: A component holder (1) according to embodiment EA-P11 or embodiment EA-P12, wherein the first temperature zone (301) has a square shape, and the second temperature zone (302), the first PTC thermistor heating element (303a) of the third temperature zone (303), the fourth temperature zone (304) and the second PTC thermistor heating element (303b) of the third temperature zone (303) have a trapezoidal shape.

[0079] EA-P14: A component holder (1) according to any of the preceding claims, wherein the first PTC thermistor heating element (301a) of the first temperature zone (301) is arranged in an inner central area of ​​the component contact surface (350), the second PTC thermistor heating element (301b) of the first temperature zone (301) is arranged adjacent to a first edge of the first PTC thermistor heating element (301a) of the first temperature zone (301) and is located at the periphery of the first edge, and the third PTC thermistor heating element (301c) of the first temperature zone (301) is adjacent to the first PTC thermistor heating element (301a) of the first temperature zone (301) The first temperature zone (301) is arranged at a second edge of the first PTC thermistor heating element (301a) and is located at the periphery of the second edge, the fourth PTC thermistor heating element (301d) of the first temperature zone (301) is arranged adjacent to the third edge of the first PTC thermistor heating element (301a) of the first temperature zone (301) and is located at the periphery of the third edge, the fifth heating element (301e) of the first temperature zone (301) is arranged adjacent to the fourth edge of the first PTC thermistor heating element (301a) of the first temperature zone (301) and is located at the periphery of the fourth edge, and the first temperature zone (301) comprises a plurality of PTC heating elements (301a, 301b, 301c, 301d, 301e) connected in parallel.

[0080] EA-P15: A component retainer (1) according to embodiment EA-P14, wherein the first PTC thermistor heating element (301a) of the first temperature zone (301) comprises a square or rectangular shape; and the second PTC thermistor heating element (301b) of the first temperature zone (301), the third PTC thermistor heating element (301c) of the first temperature zone (301), the fourth PTC thermistor heating element (301d) of the first temperature zone (301) and the fifth PTC thermistor heating element (301d) of the first temperature zone (301) comprise a polygonal shape.

[0081] EA-P16: A component holder (1) according to embodiment EA-P14 or embodiment EA-P15, wherein the first PTC thermistor heating element (302a) of the second temperature zone (302) is arranged adjacent to (or arranged adjacent to) and outside the first edge of the second PTC thermistor heating element (301b) of the first temperature zone (301), and the second PTC thermistor heating element (302b) of the second temperature zone (302) is arranged adjacent to and outside the first edge of the third PTC thermistor heating element (301c) of the first temperature zone (301). The third PTC thermistor heating element (302c) of the second temperature zone (302) is arranged adjacent to and around the first edge of the fifth PTC thermistor heating element (301e) of the first temperature zone (301), and the fourth PTC thermistor heating element (302d) of the second temperature zone (302) is arranged adjacent to and around the first edge of the fourth PTC thermistor heating element (301d) of the first temperature zone (301), and the second temperature zone (302) includes a plurality of PTC thermistor heating elements (302a, 302b, 302c, 302d) connected in parallel.

[0082] EA-P17: A component retainer (1) according to embodiment EA-P10, wherein the first PTC thermistor heating element (303a) of the third temperature zone (303) is arranged adjacent to and around the first edge of the second PTC thermistor heating element (302b) of the second temperature zone (302), and the second PTC thermistor heating element (303b) of the third temperature zone (303) is arranged adjacent to and around the first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303), and the third temperature zone (303) includes a plurality of PTC thermistor heating elements (303a, 303b) connected in parallel.

[0083] EA-P18: A component holder (1) according to embodiment EA-P10 or embodiment EA-P11, wherein the first PTC thermistor heating element (304a) of the fourth temperature zone (304) is arranged adjacent to and around the first edge of the first PTC thermistor heating element (302a) of the second temperature zone (302), and the second PTC thermistor heating element (304b) of the fourth temperature zone (304) is arranged adjacent to and around the first edge of the first PTC thermistor heating element (304a) of the fourth temperature zone (304), and the fourth temperature zone (304) includes a plurality of PTC thermistor heating elements (304a, 304b) connected in parallel.

[0084] EA-P19: A component holder (1) according to any one of claims 10 to 12, wherein the first PTC thermistor heating element (305a) of the fifth temperature zone (305) is arranged adjacent to and around the first edge of the third PTC thermistor heating element (302c) of the second temperature zone (302), and the second PTC thermistor heating element (305b) of the fifth temperature zone (305) is arranged adjacent to and around the first edge of the first PTC thermistor heating element (305a) of the fifth temperature zone (305), and the fifth temperature zone (305) includes a plurality of PTC thermistor heating elements (305a, 305b) connected in parallel.

[0085] EA-P20: A component holder (1) according to any one of claims 10 to 13, wherein the first PTC thermistor heating element (306a) of the sixth temperature zone (306) is arranged adjacent to and around the first edge of the fourth PTC thermistor heating element (302d) of the second temperature zone (302), and the second PTC thermistor heating element (306b) of the sixth temperature zone (306) is arranged adjacent to and around the first edge of the first PTC thermistor heating element (306a) of the sixth temperature zone (306), and the sixth temperature zone (306) includes a plurality of PTC thermistor heating elements (306a, 306b) connected in parallel.

[0086] EA-P21: The component holder (1) according to any of the preceding claims, wherein the component holder (1) further comprises one or more temperature sensors (400).

[0087] EA-P22: A method for using a component holder (1) according to any one of claims 1 to 21 for controlling the temperature of one or more areas of a component contact surface (350), the method comprising controlling the relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements in a temperature zone during a process step.

[0088] EA-P23: A method of using a component holder (1) according to embodiment EA-P22, the method comprising controlling the relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements in a temperature zone to achieve a uniform distribution of the temperature of the component contact surface (350).

[0089] All embodiments of the component holder therefore ensure a uniform temperature distribution or a constant process temperature with a temperature profile that is constant over time in the direct surroundings of the component in operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0090] Other advantages and features of the present invention are apparent from the following drawings, namely:

[0091] Figure 1 shows a perspective view of a component holder including a carrier, a component holding tool and a temperature regulating device;

[0092] Figure 2 shows a top view of a component holder with a carrier, a component holding tool and a temperature control device;

[0093] Figure 3 shows a side view of a component holder with a carrier, a component holding tool and a temperature control device;

[0094] Figure 4 shows a sectional view of a component holder comprising a component holding tool and a temperature control device with a feedthrough for a process medium;

[0095] Figure 5 The upper side of the temperature control device for the component holder is shown;

[0096] Figure 6 The underside of a temperature control device for a component holder is shown;

[0097] Figure 7a An embodiment of an arrangement of heating elements for a temperature control layer of a temperature control device is shown;

[0098] Figure 7b Show Figure 7a An embodiment of the temperature zone division of the heating element arrangement;

[0099] Figure 8 An embodiment of a further temperature control layer for a temperature control device having a heating element arrangement is shown;

[0100] Fig. 9 An embodiment of a temperature control device is shown, wherein the heating elements are arranged into square temperature zones;

[0101] Fig.10 An embodiment of a further temperature control layer for a temperature control device is shown, which has an arrangement of heating elements and their temperature zones;

[0102] Fig.11 An embodiment of a temperature control device is shown;

[0103] Fig.12 A carrier, a component holding tool and Fig.11 Side view of a component holder of a thermostat. DETAILED DESCRIPTION

[0104] Figure 1A perspective view of a component holder 1 is shown, which includes a carrier 100, a temperature control device 200 and a component holding tool 300, which has a component contact surface 350 for receiving and holding any type of component not shown (such as a semiconductor wafer, a semiconductor package, a chip, a flip chip, an integrated circuit, a substrate, an optical component, an electronic component, an electro-optical component or a combination thereof).

[0105] The component contact surface 350 is suitable for various shapes of components (not shown) to be held. The various shapes shown include, for example, triangle, square, trapezoid, polygon, quadrilateral, rectangle, polygon, circle, ellipse, ring, arc shape or any combination of these shapes.

[0106] In order to firmly hold the components (not shown) resting on the component contact surface 350 during operation, a vacuum is usually used, which is provided on the surface as a process medium by means of the openings (not shown) of the medium lines 130, 131, 132, 133 and 134. Preferably, the process medium can also be distributed on additional depressions, which are embedded in the surface of the component contact surface 350 and are preferably designed as half channels extending orthogonally to each other. Due to the additional half-channel-shaped depressions, the suction surface for the component is increased, thereby generating a higher pressure suction force and thus a higher thermal gradient between the component contact surface 350 and the component contact surface and the resting component to be sucked.

[0107] The component holder 1 can be arranged as desired on a bonding head (not shown), a bonding point (not shown) or on a device for processing components.

[0108] The component holder 1 can be used in any type of apparatus or in any type of process step in which an improved, preferably temperature-course-compensated, temperature behavior of the component holder is required in order to ensure a uniform temperature distribution or a constant process temperature with a time-constant temperature profile in the immediate surroundings of the components placed against them during operation. This is especially true in the case of mechanically very stable, large and heavy component holders which, due to their mass, have a high thermal capacity and thermal inertia. For example, in TCB (thermocompression bonding), in heated bonding inserts or in heated chucks, as well as in other assembly processes for semiconductor chips and in the holding tools required therefor.

[0109] The carrier 100 has a recess 101, into which the temperature control device 200 is introduced in a force-locking and / or form-locking manner. The temperature control device 200 has a large number of electrical contacts 160, 161 arranged on two opposite sides, which are marked with dotted lines. The electrical contacts 160, 161 are used to electrically connect and control a covered temperature zone (not shown) with an embedded electrical heating element (not shown), which is preferably a PTC thermistor heating element, which is particularly preferably operated in parallel, and / or the electrical contacts are used for electrical connection and reading of a temperature sensor not shown. The plurality of electrical contacts 160, 161 can be provided, for example, by means of spring contact pins, so as to facilitate rapid replacement. The use of more than one contact pin per contact position can avoid overloading of the contact pins. Electrical connection can also be achieved by rigid electrical connection, for example in the form of pins or surface contacts.

[0110] Also not visible are openings 142 and 143 built into the bottom side 51 , which also serve in greater numbers for supplying and / or discharging at least one medium in order to supply and / or dissipate at least a portion of the positive or negative thermal energy for temperature control.

[0111] The carrier 100 comprises eight holding clips 110 , 111 , 112 , 113 , 114 , 115 , 116 and 117 for fastening the temperature control device 200 , which are each arranged in pairs opposite each other.

[0112] Furthermore, one holding device 120 of two holding devices 120 , 121 which are arranged opposite each other during operation for fixing component holding tool 300 is shown.

[0113] Preferably, the component holder 350 is arranged centered and aligned with the temperature control device 200. It can be advantageous to additionally and auxiliary fix the component holding tool 300 by taking into account the thermal expansion during fixing and correspondingly taking into account the mechanical play of the holding devices 120, 121 and by means of additional fixing by means of the vacuum already provided for holding the component.

[0114] Figure 2 Show Figure 1 Component holder 1 with further details shown. Component holder 1 has carrier 100, component holding tool 300 and temperature control device 200 in recess 101, wherein temperature control device 200 is fixed in the recess during operation by two holding devices 120, 121 shown together with fixing by means of vacuum.

[0115] In particular, the recess 101 serves as a guide aid to facilitate handling during rapid tool changes, wherein an embodiment without the recess 101 is also possible.

[0116] The two holding devices 120, 121 are located on holding clips 112, 115 and 116, 117, which are arranged in pairs and are indicated by dashed lines. The holding clips 110, 111 and 114, 115 are not covered.

[0117] Between the shown openings of the media line sections 130, 131, 132, 133 and 134, a U-shaped cross-running recess in the form of a half-channel can be seen for firmly holding the component resting on the component contact surface 350 during operation. As already explained, due to the additional half-channel-shaped recess, the suction surface for the component is increased, so that a higher pressing suction force and thus a higher thermal gradient are generated between the component contact surface 350 and the component contact surface and the resting suctioned component.

[0118] Figure 3 A side view of a component holder 1 is shown, which has a carrier 100, a component holding tool 300 and a temperature control device 200 and a holding device 120 resting on holding clamps 117, 116. In the side view, the possible positions of embedded temperature control layers 201, 202, 203, 204 and associated elements for electrical or fluid operation of the temperature control device 200 are partially shown in dashed lines. The media line sections 140 and 141 are also shown in dashed lines, respectively, which extend through the non-positive and / or positive connection of the underside 251 of the temperature control device 200 to the recess 101 of the carrier 100. Preferably, during operation, a vacuum can be applied via the two media lines 140 and 141 in order to additionally hold the temperature control device 200 in the recess 101.

[0119] In the temperature control device 200, the medium line section 140 and the medium line section 141 are used not only to hold the temperature control device 200 in the recess 101 during operation, but also to supply and / or discharge at least a portion of the positive or negative thermal energy via the medium line section 139 for temperature control via at least one medium (preferably for the process components), such as compressed air, nitrogen, vacuum or another process gas, through the temperature control layer 204. The supply and / or discharge is achieved by means of openings 142 and 143 (not shown) in the surface of the bottom side 251, between which the medium line section 139 extends.

[0120] To illustrate, Figure 3 The side view of Figure 4 is shown as a cross-sectional view.

[0121] Figure 4The sectional view of the component holder 1 is shown, which has a component holding means 300 and a temperature control device 200 held in a recess 101 of a carrier 100 by means of holding devices 110, 115. During operation, the component holding means 300 can additionally be fixed to the upper side 250 of the temperature control device 200 by means of a vacuum. In this case, the vacuum can be applied during operation by means of the medium line sections 138 and 136, which are formed by passages in the carrier 100 and the temperature control device 200.

[0122] The carrier 100 comprises media line sections 140 and 141, media line sections 131, 133 and a lead-through for the process medium in the form of the media line section 140, the media line section 139 extending buried in the temperature control device 200, and the media line section 141. During operation, a vacuum can be provided via the media line sections 131, 133 and 130 in order to hold the component on the component contact surface 350.

[0123] The medium line section 139 embedded in the temperature control layer 204 extends parallel to the temperature control layers 201, 202, 203 as shown, and preferably extends in a meandering manner around at least a part of the medium line sections 131, 130 in the XY plane shown as shown. The medium line section 139 is used to supply and / or conduct at least one provided medium to the temperature control layer 204 in order to supply and / or conduct at least a part of the positive or negative thermal energy for temperature control. In particularly fast successive or short heating or cooling cycles, it has proven to be advantageous to embed a plurality of medium line sections, preferably extending parallel to each other, in the temperature control layer 204 instead of one medium line section 139. In addition, it has proven to be advantageous to divide the medium line section at least partially into a plurality of individual channels extending parallel to each other in a channel-shaped manner, the extension and geometry of which are adapted to the available spatial volume and the required temperature profile. It has been found in practice that a channel-shaped division of the medium line sections improves the static properties of the temperature control device while increasing the number of medium line sections, thereby achieving an increased input and / or output of thermal energy over the same area.

[0124] Temperature control layers 201 , 202 and 203 are interconnected with one another by means of electrical through-contacts 150 and can be electrically contacted by means of electrical contacts 160 and 161 , for example by means of spring contact pins (not shown) in recesses 101 of carrier 100 .

[0125] Figure 5Shown is an upper side 250 of a temperature control device 200 for a component holder 1 having a centrally arranged medium line section 130 and medium line sections 131 , 132 , 133 , 134 , 135 , 136 , 137 and 138 arranged cross-shaped therearound and each opening into the upper side 250 .

[0126] Figure 6 The lower side 251 of the temperature control device 200 for the component holder 1 is shown, which has a centrally arranged medium line section 130. The medium line sections 131, 132, 133, 134, 135, 136, 137 and 138 are arranged in a cross shape around the centrally arranged medium line section 130. In addition, in this embodiment, the two openings 142 and 143 of the lower side 251 are also visible. The medium line section 139 extends between the two openings 142 and 143 to supply and / or discharge at least a part of the positive thermal energy or the negative thermal energy.

[0127] Figure 7a and Figure 7b The same embodiment of the arrangement of heating elements 301a, 302a, 303b, 304a, 305a, 306a of temperature control layers 201, 202, 203 of a rectangular temperature control device 200 (not shown) is shown, wherein for the sake of clarity, the reference numerals and temperature zones are assigned to two Figure 7a and Figure 7b On, so that the temperature zone is only Figure 7b Winning bid. Figure 7aThe arrangement of heating elements 301a, 302a, 303b, 304a, 305a, 306a for temperature control layers 201, 202, 203 of a rectangular temperature control device 200 (not shown) is shown, as it is suitable, for example, for a component with a rectangular base area. The heating elements 301a, 302a, 303b, 304a, 305a, 306a embedded in the temperature control device 200 each have an electrical through-hole 150 and through-going electrical contacts 160 for electrical connection at both ends, of which only three are indicated for the sake of clarity. In addition, in this embodiment of the temperature control layer 201, 202, 203, the medium line sections 130, 131, 132, 133, 134, 135 and 137 (here represented by a circular cross section) are visible in the corresponding recesses when the heating elements 301a, 302a, 303b, 304a and 305a meander. The specific design of the cross section of the medium line sections 130, 131, 132, 133, 134, 135 and 137 in this embodiment can also be arbitrary, preferably with a channel-shaped division, and should not be limited by the schematic diagram for maintaining an overview in the sense of the present disclosure. In particular, depending on the requirements for the temperature zones, the embodiment of the temperature control layer can also have more or fewer medium line sections than the medium line sections schematically shown in FIG. 7.

[0128] In this embodiment, the heating elements 301a, 302a, 303b, 304a, 305a, 306a are divided into the following groups by means of electrical connections (not shown) of the heating elements 301a, 302a, 304a, 305a and 306a. Figure 7b The temperature zones 301, 302, 304, 305 and 306 are shown in FIG. Two heating elements 303a, 303b are connected in parallel to each other and form a further temperature zone 303.

[0129] Figure 8 An embodiment of a temperature control layer 201, 202, 203 for a temperature control device 200 is shown, which has an example of an arrangement of heating elements for a component with a rectangular base, which temperature control layer can be arranged together with another temperature control layer in the temperature control device 200. The arrangement of the heating elements 31a, 32a, 33b, 34a, 35a, 36a corresponds to the arrangement of the heating elements 301a, 302a, 303b, 304a, 305a, 306a shown in FIG. 7. Even though their respective meandering geometries differ from one another, in the case of the superimposed arrangement of the two temperature control layers, the corresponding electrical through-holes 150 coincide with one another, so that FIG. 7 and FIG. Figure 8The heating elements of the two temperature control layers can be electrically connected to each other by means of electrical connecting wires (not shown) in the temperature control device 200 to form the temperature zones of the temperature control device 200. In particular, the heating elements 301a, 302a, 303b, 304a, 305a, 306a of FIG. 7 can be connected to Figure 8 The heating elements 31a, 302a, 33b, 34a, 35a, 36a are connected in parallel with one another, so that the heating elements 301a and 31a form a first temperature zone 31 in the resulting spatial volume of the layer composite of the temperature control device 200. The heating elements 302a and 32a form a second temperature zone 32 in the resulting spatial volume of the layer composite of the temperature control device 200. The heating elements 304a and 34a, 305a and 35a as well as 306a and 36a, when connected in parallel accordingly, also form corresponding temperature zones 304, 305 and 306 in the resulting spatial volume of the layer composite of the temperature control device 200. The heating elements 303a and 303b as well as 33a and 33b, which are already connected in parallel with one another in the layer plane of the temperature control layers 201, 202, 203 shown, thus form in the layer composite respectively divided temperature zones 303 and 33 which act not only in the layer plane but also in the spatial volume.

[0130] The electrical wiring of the heating elements is not shown for reasons of clarity. In particular, in the case of a produced layer composite of a temperature control device, the "combination of heating elements into temperature zones which act not only in the layer plane but also in the spatial volume" is particularly advantageously suitable for temperature control, depending on the requirements of the temperature profile caused by the process, so that for processing the component, one or more regions of the component contact surface of the component holding tool are thermally shielded from the carrier.

[0131] Fig. 9 An embodiment of the temperature control layer 201, 202, 203 of the temperature control device 200 is shown. The temperature control layer 201, 202, 203 has a temperature zone 301 in the shape of a square, which has a first heating element 301a in the center and four other heating elements 301b, 301c, 301d and 301e evenly arranged around the heating element 301a. As shown, the temperature zone 301 is preferably arranged in the center (preferably symmetrically) relative to the outer edge of the temperature control layer 201, 202, 203. The electrical circuit of the heating element is not shown for reasons of overview. The heating elements are preferably all configured as PTC thermistor heating elements, and depending on the requirements for the temperature curve, the outer heating elements 301b, 301c, 301d and 301e can be connected in pairs as parallel or opposite pairs.

[0132] Fig.10An embodiment of a rectangular temperature control layer 201, 202, 203 for a temperature control device 200 (not shown) is shown, with an advantageous arrangement of temperature zones 301, 302, 303, 304, 305 and 306 for one or more components (not shown) having a square or rectangular base. The temperature control layer 201, 202, 203 has a first temperature zone 301 in the shape of a square, which has a first heating element 301a in the center and four further heating elements 301b, 301c, 301d and 301e arranged uniformly around the heating element 301a. The temperature zones 301 are preferably arranged centrally (preferably symmetrically) relative to the outer edges of the temperature control layers 201, 202, 203. The second heating element 301b of the temperature zone 301, the third heating element 301c of the temperature zone 301, the fourth heating element 301d of the temperature zone 301 and the fifth heating element 301d of the first temperature zone 301 respectively have a polygonal shape so as to be able to surround the first heating element 301a in a uniform manner in the XY plane. In this embodiment, the polygonal shape is angular or L-shaped. In addition, the first heating element 301a of the first temperature zone 301 has a meandering geometric recess at the center, and the medium pipeline section 130 extends through the recess perpendicular to the drawing plane XY. The heating elements are preferably all constructed as PTC thermistor heating elements. The first temperature zone 301 is surrounded by the concentrically arranged temperature zone 302. The temperature zone 302 also includes 4 uniformly arranged polygons, each of which is angular or L-shaped, which surrounds the 5 heating elements of the first temperature zone in the XY plane (i.e., in the layer plane of the layer composite of the temperature control device 200 not shown).

[0133] Fig.11An embodiment of a temperature control device 200 with a layer composite body including temperature control layers 201, 202, 203 and 204 is shown, wherein for the sake of clarity, only the temperature control layer 204 is marked in the layer composite body. The temperature control device 200 transparently shown in a perspective view and observed toward the lower side 251 can achieve a good understanding of the layer composite body. The temperature control layer 204 includes a medium pipeline section 139 extending in a winding manner inside the layer composite body and a medium pipeline section 1390 extending in a winding manner inside the layer composite body. In this embodiment, the two medium pipeline sections are arranged in a mirror-opposite manner to each other, so that their winding shapes are interlaced in a comb-like manner. In addition, the two medium pipeline sections 139 and 1390 are respectively divided into individual channels 144a, 144b, 144c, 144d extending parallel to each other in a channel-like manner at least on a section or partially, wherein the direction and geometry of these individual channels are matched to the available spatial volume and the required temperature curve. On the lower side 251, a number of embedded openings 142 and 143 can be clearly seen, which are also used in a relatively large number for feeding at least one medium into the medium line segments 139, 1390 and / or discharging from the medium line segments 139, 1390 in order to supply and / or discharge at least a portion of the positive or negative thermal energy for temperature control. The channel-shaped partitions 144 can be clearly seen in the corresponding openings 142 of the medium line segment 139 based on the perspective illustration. In practice, it has been shown that the channel-shaped partitions 144 of the medium line segments generally improve the static performance of the temperature control device 200 while increasing the number of medium line segments, so that an increased input and / or output of thermal energy is achieved on the same area of ​​the temperature control layer 204. Furthermore, in this embodiment of the temperature control layer 204 , the medium line sections 130 , 132 , 134 , 136 , 137 and 138 are partially visible in corresponding recesses in the medium line sections 139 and 1390 .

[0134] Fig.12 A cross-sectional view of a component holder 1 is shown, which has a carrier 100 (not shown in its entirety) which is held by means of holding clips 110 and 115 and further holding clips (not shown). Fig.11Temperature control device. A component holding tool 300 having a component contact surface 350 rests on the upper side of the temperature control device 200. The contacts 160 and 161 of the temperature control device 200 for electrically connecting the corresponding temperature control layers 201, 202, 203 in the layer composite of the temperature control device 200 are electrically connected by contact spring pins 1600, and thus establish an electrical connection to its power supply and control unit (not shown). The contact spring pins 1600 are embedded in the carrier 100 and the component holder 1. In addition, the carrier 100 and the component holder 1 have a plurality of medium pipeline sections 136, 138, 140, 141 for conveying thermal energy to the temperature control device 200 and / or discharging thermal energy from the temperature control device 200 by means of a medium as an energy carrier, preferably a liquid or gaseous process medium. The cross-sectional view also shows an advantageous arrangement and design of the channel-shaped division 144 of the two medium-conducting sections 139 and 1390, which divides the medium-conducting sections into individual channels 144a, 144b, 144c, 144d extending parallel to one another in the form of channels at least in sections or in parts within the layer composite of the temperature control device 200. Furthermore, the medium line (without reference numerals) formed by the medium line sections 130, 130a, 131a, 136, 138, 140 and 141 can be seen by the non-positive and / or positive connection of the carrier 100 to the temperature control device 200 and the non-positive and / or positive connection of the temperature control device 200 to the component holding tool 300. These formed media lines (without reference numerals) also serve to supply at least one medium into and / or remove it from the media line section in order to supply and / or remove at least a portion of the positive or negative thermal energy for temperature control.

[0135] Reference numerals list

[0136] Serial number name 1 Component retainer 100 Carrier 101 concavity 110 Retaining clip 111 Retaining clip 112 Retaining clip 113 Retaining clip 114 Retaining clip 115 Retaining clip 116 Retaining clip 117 Retaining clip 120 Holding device 121 Holding device 130 Medium pipeline section 131 Medium pipeline section 131a Medium pipeline section 132 Medium pipeline section 133 Medium pipeline section 133a Medium pipeline section 134 Medium pipeline section 135 Medium pipeline section 136 Medium pipeline section 137 Medium pipeline section 138 Medium pipeline section 139 Medium pipeline section 1390 Medium pipeline section 140 Medium pipeline section 141 Medium pipeline section 142 Opening 143 Opening 144 Channel-shaped partition 144a Single channel 144b Single channel 144c Single channel 144d Single channel 150 Plated Through Hole 160 Electrical contacts 161 Electrical contacts 1600 Contact spring pin 200 Temperature control device 201 Temperature Control Layer 202 Temperature Control Layer 203 Temperature Control Layer 204 Temperature Control Layer 250 Upper side of the temperature control device 251 Underside of the temperature adjustment device 300 Component Holding Tool 301 Temperature Zone 301a Heater / PTC thermistor heating element 301b Heater / PTC thermistor heating element 301c Heater / PTC thermistor heating element 301d Heater / PTC thermistor heating element 301e Heater / PTC thermistor heating element 302 Temperature Zone 302a Heater / PTC thermistor heating element 302b Heater / PTC thermistor heating element 303 Temperature Zone 303a Heater / PTC thermistor heating element 303b Heater / PTC thermistor heating element 304 Temperature Zone 304a Heater / PTC thermistor heating element 304b Heater / PTC thermistor heating element 305 Temperature Zone 305a Heater / PTC thermistor heating element 305b Heater / PTC thermistor heating element 306 Temperature Zone 306a Heater / PTC thermistor heating element 306b Heater / PTC thermistor heating element 350 Component contact surface 400 Temperature Sensor 31a Heater / PTC thermistor heating element 32a Heater / PTC thermistor heating element 33a Heater / PTC thermistor heating element 33b Heater / PTC thermistor heating element 34a Heater / PTC thermistor heating element 35a Heater / PTC thermistor heating element 36a Heater / PTC thermistor heating element

Claims

1. A component holder (1) for handling components, the component holder (1) comprising as components a carrier (100), a component holding tool (300) having a component contact surface (350) and a temperature control device (200), wherein: The temperature control device (200) is arranged on the carrier (100) so that one or more regions of the component contact surface (350) of the component holding tool (300) can be temperature-controlled relative to the carrier (100) by means of positive thermal energy or negative thermal energy at a predetermined process temperature for processing the component, so that in order to process the component, one or more regions of the component contact surface (350) of the component holding tool (300) are thermally shielded from the carrier (100).

2. The component holder (1) according to claim 1, wherein: The carrier (100) and the temperature control device (200) each have at least one medium pipeline (130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141), and the medium pipelines are arranged so that the carrier (100) and the temperature control device (200) and the temperature control device (200) and the component holding tool (300) are respectively connected to each other in a force-locking and / or form-locking manner, so that at least a part of the positive thermal energy or negative thermal energy used for temperature control can be supplied or discharged by means of at least one medium, preferably a medium for processing the component.

3. The component holder (1) according to claim 1 or 2, wherein: The temperature control device (200) comprises one or more temperature zones (301, 302, 303, 304, 305, 306), wherein the temperature zones provide positive thermal energy to the one or more regions of the component contact surface (350).

4. The component holder (1) according to claim 3, wherein: Each temperature zone (301, 302, 303, 304, 305, 306) includes one or more electrical heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b).

5. The component holder (1) according to claim 3, wherein: One or more of the temperature zones (301, 302, 303, 304, 305, 306) include two or more PTC thermistor heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) electrically connected in parallel.

6. The component holder (1) according to claim 4 or 5, wherein: Each of the one or more temperature zones (301, 302, 303, 304, 305, 306) is arranged to be electrically connected to one of the n power supplies, and each of the power supplies is arranged to provide a predetermined and / or controlled supply of electrical energy to one of the temperature zones (301, 302, 303, 304, 305, 306).

7. The component holder (1) according to any one of claims 3 to 6, wherein: At least one of the n temperature zones (301) is arranged in an inner central region of the component contact surface (350); and at least one other temperature zone (302, 303, 304, 305, 306) is arranged in one or more outer regions of the component contact surface (350) outside the inner central region.

8. The component holder (1) according to claim 4 or 5, wherein: One or more heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) or one or more PTC thermistor heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) are applied as a film.

9. The component holder (1) according to any one of the preceding claims, wherein: The component contact surface (350) includes a triangle, square, trapezoid, polygon, quadrilateral, rectangle, polygon, circle, ellipse, ring, arc shape or any combination of these shapes.

10. The component holder (1) according to any one of claims 3 to 9, wherein: The one or more temperature zones in the temperature zones (301, 302, 303, 304, 305, 306) include a triangle, square, trapezoid, polygon, quadrilateral, rectangle, polygon, circle, ellipse, line, ring, arc shape or any combination of these shapes.

11. The component holder (1) according to any one of claims 3 to 9, wherein: In the case of multiple temperature zones, the first temperature zone (301) is arranged in the central area of ​​the component contact surface (350), the second temperature zone (302) is arranged adjacent to and around the first edge of the first temperature zone (301), the first PTC thermistor heating element (303a) of the third temperature zone (303) is arranged adjacent to and around the second edge of the first temperature zone (301), and the fourth temperature zone (304) is arranged adjacent to and around the third edge of the first temperature zone (301); and the second PTC thermistor heating element (303b) of the third temperature zone (303) is arranged adjacent to and around the fourth edge of the first temperature zone (301); the first temperature zone (301) includes a plurality of PTC thermistor heating elements (301a, 301b, 301c, 301d, 301e) connected in parallel.

12. The component holder (1) according to claim 10, wherein: The first PTC thermistor heating element (303a) of the third temperature zone (303) is arranged adjacent to and around the first edge of the second PTC thermistor heating element (302b) of the second temperature zone (302), and the second PTC thermistor heating element (303b) of the third temperature zone (303) is arranged adjacent to and around the first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303); the third temperature zone (303) comprises a plurality of PTC thermistor heating elements (303a, 303b) connected in parallel.

13. The component holder (1) according to any one of the preceding claims, wherein The component holder (1) also includes one or more temperature sensors (400).

14. A method for using a component holder (1) according to any one of claims 1 to 13, for controlling the temperature of one or more regions of a component contact surface (350), the method comprising: The relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements in a temperature zone is controlled during a process step.

15. A method for using a component holder (1) according to claim 14, comprising controlling the relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements in a temperature zone to achieve a uniform distribution of the temperature of the component contact surface (350).

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