Processing method of boss circuit board

Abstract

The invention discloses a processing method of a boss circuit board, which comprises the following steps of: S1, taking a first core board, milling the first core board to change the shape of the first core board, and taking the milled first core board as a boss board for later use; s2, taking a PP plate, milling the PP plate into a shape which is the same as the size of the boss plate, and taking the PP plate as a connecting layer; s3, a second core plate is taken, and the connecting layer is arranged at the position where the boss plate is installed; s4, a base plate is taken, a window is milled in the preset position of the base plate, the window is configured to contain the boss plate and the connecting layer, and the height of the base plate is the same as that of the boss plate; s5, a base plate is laid on the second core plate, then the connecting layer and the boss plate are sequentially put into the window, and curing is conducted through pressing; and S6, the base plate is taken off, the step position is exposed, and the boss plate is arranged on the second core plate in a protruding mode. The method solves the problem that a boss is milled out through machining to damage a circuit, and also solves the problem that a base material is burnt through laser machining.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a processing method of a boss circuit board. Background Art

[0002] As a special printed circuit board, the boss circuit board plays an important role in certain specific electronic devices.

[0003] At present, the processing methods of boss circuit boards mainly include mechanical processing and laser processing. The mechanical processing method mainly uses mechanical processing to process the boss structure on the printed circuit board, but the processing efficiency of the mechanical processing method is low, the cost is high, and it is easy to damage the circuit on the printed circuit board; the laser processing method mainly uses laser processing to process the boss structure on the circuit board. The equipment cost of the laser processing method is high, and the technical requirements for the operator are also relatively high. When there is a substrate position inside the boss, it cannot be made by laser processing. The laser will cause the substrate to burn, resulting in a short circuit and cannot be used. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for processing a boss circuit board.

[0005] A method for processing a boss circuit board according to an embodiment of the present invention comprises the following steps: S1, taking a first core plate, milling the first core plate to change the shape of the first core plate, and using the milled first core plate as a boss plate for standby use; S2, taking a PP plate, milling the PP plate into a shape having the same size as the boss plate, and using the PP plate as a connecting layer; S3, taking a second core board, setting a mounting position on the second core board, wherein the mounting position is configured as a mounting boss board, and placing the connection layer at the mounting position; S4, taking a backing plate, milling a window at a predetermined position of the backing plate, wherein the window is configured to accommodate the boss plate and the connecting layer, and the height of the backing plate is the same as that of the boss plate; S5, firstly laying the pad on the second core board, then sequentially placing the connection layer and the boss board into the opening, and curing the second core board and the boss board by pressing to obtain a boss circuit board; S6, removing the pad to expose the step position, so that the boss plate is protruding on the second core plate.

[0006] The invention has at least the following beneficial effects: the method of laminating the two layers of the first core board and the second core board solves the problem of defects caused by mechanical milling of the boss and laser milling of the boss; the method has fewer steps, is easy to operate, improves production efficiency, and reduces production costs; a PP layer is used as a connecting layer between the first core board and the second core board, which solves the problem of delamination of the boss position of the printed circuit board after lamination; and the pad provided can play a restraining and guiding role, so that the lamination process will not be misplaced or offset; at the same time, it also solves the problem of damage to the circuit caused by the boss milled out by mechanical processing, and also solves the problem of burns to the substrate caused by laser processing.

[0007] According to some embodiments of the present invention, the first core board and the second core board are browned after milling. The browned first core board and the second core board have a stronger bonding ability with the PP board, so that they can be more stably cured together during pressing, avoiding delamination of the circuit board.

[0008] According to some embodiments of the present invention, in the S3 step, the connection layer is bonded to the installation position on the second core board with insulating glue, and the connection layer is first fixed so that the position of the connection layer is fixed to provide guidance and positioning functions.

[0009] According to some embodiments of the present invention, in the S5 step, the PI tape is first affixed to the step position outside the boss plate, and then the pad is laid. After the S6 step, the PI tape is removed to expose the circuit in the step position. The PI tape is affixed so that the pad is not pressed together with the second core board, thereby facilitating the subsequent separation of the pad.

[0010] According to some embodiments of the present invention, when picking out the PI tape, first blow cold air on the surface of the PI tape, the temperature of the cold air is lower than 10°C, and then blow hot air on the PI tape, the temperature of the hot air is higher than 25°C, use a picking needle to pick up a corner of the PI tape, and then use tweezers to clamp the PI tape and tear it off. This operation makes it easier to remove the PI tape.

[0011] According to some embodiments of the present invention, a post-process is also included, which includes solder mask, nickel-gold plating, edge milling, inspection and packaging steps. After the PI tape is picked out, the circuit board is coated with solder mask ink, leaving a pre-made window, and the pad and gold finger are subjected to nickel-gold plating. Then, the edges of the entire circuit board are milled and trimmed, and the circuit board is packaged after inspection.

[0012] According to some embodiments of the present invention, in the step S6, the entirety of the pressed-together boss circuit board and the pad is first baked and then the pad is removed.

[0013] According to some embodiments of the present invention, the first core plate and the second core plate have the same size specifications.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 It is a schematic diagram of the structure of the boss circuit board before being pressed together according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the embodiment of the present invention in which the PI tape is not removed after the boss circuit board is pressed; Figure 3 It is a structural schematic diagram of removing the PI tape after the boss circuit board is pressed in an embodiment of the present invention.

[0016] Reference numerals: first core board 100 , PP board 200 , second core board 300 , backing board 400 , window 410 , PI tape 500 . DETAILED DESCRIPTION

[0017] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0018] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0019] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0020] It should be noted that the boss circuit board is a circuit board with bosses, wherein the bosses are also a part of the circuit board, which is different from the ordinary multi-layer board. The bosses are also made of core boards, which is equivalent to pressing two core boards of different sizes together, and the relatively smaller core board serves as the boss of the relatively larger core board. The so-called core board is actually an ordinary single-layer circuit board, which has a base layer in the middle, and a copper layer is attached to the cold surface of the base layer. The first core board 100 and the second core board 300 in this application must be manufactured in advance, and the manufacturing process is a conventional process.

[0021] Reference Figures 1 to 3 The present invention discloses a method for processing a boss circuit board, comprising the following steps: S1, take the first core board 100, mill the first core board 100 to change the shape of the first core board 100, and use the milled first core board 100 as a boss board for standby use. It can be understood that after the first core board 100 is milled, its plane size reaches the required size of the boss, that is, the first core board 100 is actually the boss on the boss circuit board; S2, take the PP board 200, mill the PP board 200 into a shape with the same size as the boss board, and use the PP board 200 as a connecting layer; it can be understood that the PP board 200 is a common board in the circuit board manufacturing process, and mainly plays a bonding role in the lamination process. The so-called connecting layer is actually slightly smaller than the size of the boss board, so as to avoid overflow of glue outside the boss board during lamination. The size of the PP board 200 can be adjusted as needed, which belongs to conventional adjustment means; S3, taking the second core board 300, setting a mounting position on the second core board 300, the mounting position being configured as a mounting boss plate, and placing the connection layer at the mounting position; it can be understood that the connection layer can be directly placed at the mounting position, and the so-called mounting position is the position where the boss plate is mounted; S4, taking the backing plate 400, milling a window 410 at a predetermined position of the backing plate 400, wherein the window 410 is configured to accommodate the boss plate and the connection layer, and the height of the backing plate 400 is the same as that of the boss plate; S5, firstly lay the pad 400 on the second core board 300, then sequentially place the connection layer and the boss board into the opening 410, and solidify the second core board 300 and the boss board by pressing to obtain the boss circuit board; it can be understood that no matter whether the pad 400 or the connection layer is placed first, the connection layer is at the lower end of the boss board; S6, remove the pad 400 to expose the step position, so that the boss plate is protruding on the second core plate 300.

[0022] It should be understood that the method of laminating the two layers of the first core board 100 and the second core board 300 solves the problems caused by mechanical milling of the boss and laser milling of the boss. The method has fewer steps, is easy to operate, improves production efficiency, and reduces production costs. The PP layer is used as a connecting layer between the first core board 100 and the second core board 300 to solve the problem of delamination after lamination of the boss position of the printed circuit board, and the provided pad 400 can play a restraining and guiding role, so that the lamination process will not be misplaced or offset. At the same time, it also solves the problem of damage to the circuit caused by the boss milled out by mechanical processing, and also solves the problem of laser processing burning the substrate.

[0023] It should be noted that the production process of the first core board 100 is: cutting → copper reduction → drilling → copper plating / board plating → resin plugging → solder mask baking → ceramic grinding → copper reduction → ceramic grinding → tool matching → internal light imaging → inner layer etching inspection → punching → milling → matching center → browning.

[0024] The manufacturing process of the second core board 300 is: cutting → copper reduction → drilling → copper deposition / board plating → resin plugging → solder mask baking → ceramic grinding → copper reduction → ceramic grinding → tool matching → internal light imaging → inner layer etching inspection → punching → soft gold plating → wire picking → matching center → browning.

[0025] The production process of PP board 200 is: cutting → auxiliary material matching → milling → auxiliary material matching.

[0026] The manufacturing process of the pad 400 is: cutting → auxiliary material matching → milling → auxiliary material matching.

[0027] It is understandable that the above individual steps are conventional practices in circuit board manufacturing.

[0028] It is understandable that this method can realize the processing of metallized holes and patterns on the second core board 300 and the boss board, solve the problem that the boss circuit board is difficult to manufacture and realize, and improve the production yield by optimizing the design and process.

[0029] In some embodiments, the first core board 100 and the second core board 300 are browned after milling. The browned first core board 100 and the second core board 300 have a stronger bonding ability with the PP board, so that they can be more stably cured together during pressing, avoiding delamination of the circuit board.

[0030] It should be noted that in step S5, the circuit board with the bosses formed after lamination needs to be etched to form the required circuit board.

[0031] In some embodiments, in step S3, the connection layer is bonded to the installation position on the second core board 300 with insulating glue, and the connection layer is first fixed so that the position of the connection layer is fixed to provide guidance and positioning functions.

[0032] It should be noted that in step S5, PI tape 500 is first affixed to the step position outside the boss plate, and then the pad 400 is laid. After step S6, the PI tape 500 is removed to expose the circuit in the step position. The PI tape 500 is affixed so that the pad 400 will not be pressed together with the second core board 300, which facilitates the subsequent separation of the pad 400. It can be understood that PI tape 500 is a tape commonly used in the circuit board manufacturing process.

[0033] In some embodiments, when picking out the PI tape 500, first blow cold air on the surface of the PI tape 500, the cold air temperature is lower than 10°C, and then blow hot air on the PI tape 500, the hot air temperature is higher than 25°C, use a picking needle to pick up a corner of the PI tape 500, and then use tweezers to clamp the PI tape 500 and tear it off. This operation makes it easier to remove the PI tape 500.

[0034] In some embodiments, in step S6, the entirety of the pressed-together bump circuit board and the pad 400 is first baked and then the pad 400 is removed.

[0035] It should be understood that the post-process is also included, and the post-process includes solder mask, nickel-gold plating, edge milling, inspection and packaging steps. After the PI tape 500 is picked out, the circuit board is coated with solder mask ink, leaving a prefabricated window 410, and the pad and gold finger are nickel-gold-plated. Then, the edges of the entire circuit board are milled and trimmed, and it is packaged after inspection.

[0036] In some embodiments, the first core plate 100 and the second core plate 300 have the same size.

[0037] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0038] Of course, the present invention is not limited to the above-mentioned embodiments, and those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A method for processing a boss circuit board, characterized in that: The following steps are involved: S1, taking a first core plate (100), milling the first core plate (100) to change the shape of the first core plate (100), and using the milled first core plate (100) as a boss plate for standby use; S2, taking a PP plate (200), milling the PP plate (200) into a shape having the same size as the boss plate, and using the PP plate (200) as a connecting layer; S3, taking a second core board (300), setting a mounting position on the second core board (300), wherein the mounting position is configured as a mounting boss plate, and placing the connection layer at the mounting position; S4, taking a backing plate (400), milling a window (410) at a predetermined position of the backing plate (400), wherein the window (410) is configured to accommodate the boss plate and the connection layer, and the height of the backing plate (400) is the same as the height of the boss plate; S5, first laying the pad (400) on the second core board (300), then sequentially placing the connection layer and the boss board into the opening (410), and curing the second core board (300) and the boss board by pressing to obtain a boss circuit board; S6, removing the pad (400) to expose the step position, so that the boss plate is protruding on the second core plate (300).

2. A method for processing a boss circuit board according to claim 1, characterized in that: The first core plate (100) and the second core plate (300) are subjected to browning treatment after milling.

3. The method for processing a boss circuit board according to claim 1, characterized in that: In the step S3, the connection layer is bonded to the installation position on the second core board (300) using an insulating adhesive.

4. The method for processing a boss circuit board according to claim 1, characterized in that: In the step S5, the PI tape (500) is firstly pasted on the step position outside the boss plate, and then the pad (400) is laid. After the step S6, the PI tape (500) is removed to expose the circuit in the step position.

5. A method for processing a boss circuit board according to claim 4, characterized in that: When picking up the PI tape (500), first blow cold air on the surface of the PI tape (500), the temperature of the cold air is lower than 10°C, and then blow hot air on the PI tape (500), the temperature of the hot air is higher than 25°C, use a picking needle to pick up a corner of the PI tape (500), and then use tweezers to clamp the PI tape (500) and tear it off.

6. A method for processing a boss circuit board according to claim 4, characterized in that: The process also includes solder mask, nickel-gold plating, edge milling, inspection and packaging steps. After the PI tape (500) is picked out, the circuit board is coated with solder mask ink, leaving a prefabricated window (410), the pad and the gold finger are nickel-gold-plated, and then the edges of the entire circuit board are milled and trimmed, and then packaged after inspection.

7. The method for processing a boss circuit board according to claim 1, characterized in that: In the step S6, the entirety of the boss circuit board and the pad (400) obtained after the pressing is first baked, and then the pad (400) is removed.

8. The method for processing a boss circuit board according to claim 1, characterized in that: The first core plate (100) and the second core plate (300) have the same size specifications.

Images