Water cooling device

Abstract

The invention provides a water cooling device which is provided with a shell, two flow guide covers and two pump assemblies. A water inlet, a water outlet and two pump spaces are formed in the shell. Each pump space is communicated with the water inlet and the water outlet. The two flow guide covers are respectively arranged in the two pump spaces, so that each pump space is divided into a water inlet chamber and a water outlet chamber; the water inlet chamber is communicated with the water inlet. The water outlet chamber is communicated with the water inlet chamber and the water outlet. The pump assemblies are arranged in the water outlet cavities of the two pump spaces respectively. Therefore, two parallel circulation paths are formed in the water cooling device, and the two pump assemblies are arranged in the two circulation paths respectively, so that the flow speed and flow of the working fluid can be effectively increased, and better heat exchange efficiency can be achieved.

Description

Technical Field

[0001] The invention relates to a heat dissipation device, in particular to a water-cooled heat dissipation device. Background Art

[0002] As the performance of electronic components increases, the heat generation power is also getting higher and higher. In order to keep the temperature of electronic components low during normal operation, it is obviously not enough to install fans alone. Therefore, many electronic devices are equipped with water cooling systems to dissipate the heat of the electronic components. Generally speaking, the water cooling system includes a pump, a heat absorbing unit, and a heat releasing unit. The heat absorbing unit is attached to the electronic components to directly absorb the heat from the electronic components, and then the pump circulates the working fluid between the heat absorbing unit and the heat releasing unit to dissipate the heat. However, as the heat generation power of existing electronic components is getting higher and higher, the heat dissipation power achieved by the flow rate provided by a single pump is insufficient.

[0003] In view of this, proposing a better improvement plan is an urgent problem to be solved in the industry. Summary of the invention

[0004] The main purpose of the present invention is to provide a water cooling device having two pumps to increase the overall flow rate and flow velocity to obtain a higher heat dissipation efficiency.

[0005] To achieve the above object, a water cooling device proposed by the present invention has:

[0006] A housing is formed with:

[0007] A water inlet;

[0008] an outlet; and

[0009] Two pump spaces, each of which is connected to the water inlet and the water outlet;

[0010] Two guide covers are respectively arranged in the two pump spaces, whereby each pump space is divided into:

[0011] a water inlet chamber connected to the water inlet; and

[0012] a water outlet chamber connected to the water inlet chamber and the water outlet; and

[0013] Two pump components are respectively arranged in the water outlet chamber of the two pump spaces.

[0014] Therefore, the advantage of the present invention is that by forming two parallel flow paths in the water cooling device and respectively arranging two pump components in the two flow paths, the flow rate and flow rate of the working fluid can be effectively increased to achieve better heat exchange efficiency.

[0015] The water cooling device as described above has:

[0016] Two circuit boards are fixedly mounted on the housing, and the two pump spaces are respectively formed between the two circuit boards and the housing; and

[0017] Two fans are connected to the two circuit boards respectively.

[0018] In the water cooling device as described above, each of the guide covers has:

[0019] a bottom portion, which separates the water inlet chamber and the water outlet chamber, and the bottom portion is formed with a through hole, the through hole communicating with the water inlet chamber and the water outlet chamber; and

[0020] An edge portion extends around the edge of the bottom portion, and two ends of the edge portion are connected to the periphery of the water outlet and separate the water inlet chamber and the water outlet chamber.

[0021] In the water cooling device as described above:

[0022] The housing has two first openings and a second opening, the two first openings are respectively communicated with the water outlet chambers of the two pump spaces, and the second openings are respectively communicated with the water outlets; and

[0023] The water cooling device also has:

[0024] a heat absorbing element, which is fixed to the housing, and a side surface of the heat absorbing element is used to contact a heat source; and

[0025] A heat absorption chamber is formed between the heat absorption component and the shell and is connected to the first opening and the two second openings.

[0026] The water cooling device as described above also has:

[0027] A guide plate is arranged in the heat absorption chamber and has two first slits. The two first slits penetrate the guide plate and are respectively communicated with the first opening of the shell.

[0028] In the water cooling device as mentioned above, the guide plate has a second slit, the second slit is penetrated through the guide plate, and one end of the second slit surrounds the second opening, whereby the second slit is communicated with the second opening.

[0029] In the water cooling device as described above, the second slit has:

[0030] an opening portion surrounding the second opening; and

[0031] A gradually opening portion is in the shape of a long strip and has a first end and a second end. The first end is connected to the opening portion, the width of the first end is smaller than the width of the opening portion, and the width of the first end is smaller than the width of the second end.

[0032] In the water cooling device as described above:

[0033] The housing has a heat dissipation chamber which is connected to the water inlet chamber of the second pump space; and the water cooling device also has a heat exchange element, which has:

[0034] A sealing portion, which is fixed to the housing and seals the heat dissipation chamber;

[0035] a first fin portion, which is fixed to the sealing portion and located in the heat dissipation chamber; and

[0036] A second fin portion is fixed to the sealing portion and is located outside the housing.

[0037] In the water cooling device as described above:

[0038] The water cooling device also has a heat exchange element, which has:

[0039] A sealing portion, which is fixed to the housing and seals the heat dissipation chamber;

[0040] a first fin portion, which is fixed to the sealing portion and located in the heat dissipation chamber;

[0041] a cooling chip, which is fixed to the sealing portion and located outside the heat dissipation chamber; and

[0042] A second fin portion is fixed to the cooling chip and is located outside the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 is a three-dimensional schematic diagram of a first embodiment of the present invention;

[0044] Figure 2 is another three-dimensional schematic diagram of the first embodiment of the present invention from another angle;

[0045] Figure 3 is a cross-sectional schematic diagram of a first embodiment of the present invention;

[0046] Figure 4 It is an exploded schematic diagram of a first embodiment of the present invention;

[0047] Figure 5 is a cross-sectional schematic diagram of another angle of the first embodiment of the present invention;

[0048] Figure 6 It is an exploded schematic diagram of a first embodiment of the present invention;

[0049] Figure 7 It is an exploded schematic diagram of another angle of the first embodiment of the present invention;

[0050] Figure 8 is a perspective schematic diagram of a second embodiment of the present invention;

[0051] Fig. 9 is an exploded schematic diagram of a second embodiment of the present invention;

[0052] Fig.10 It is an exploded schematic diagram of another angle of the second embodiment of the present invention;

[0053] Fig.11 is a cross-sectional schematic diagram of a second embodiment of the present invention;

[0054] Fig.12 is a front schematic diagram of a third embodiment of the present invention;

[0055] Fig.13 It is a schematic diagram of an exploded view of the third embodiment of the present invention.

[0056]

Explanation of symbols

[0057] 10,10A,10B: Shell

[0058] 11: Water inlet

[0059] 12: Water outlet

[0060] 13: Pump space

[0061] 131: Water inlet chamber

[0062] 132: Water outlet chamber

[0063] 14: First Opening

[0064] 15: Second opening

[0065] 16: Gap

[0066] 17: Circuit Board

[0067] 18A, 18B: Heat dissipation chamber

[0068] 20: deflector cover

[0069] 21: Bottom

[0070] 210: Perforation

[0071] 22: Edge

[0072] 30: Pump assembly

[0073] 40:Heat absorbing parts

[0074] 41: Heat absorption chamber

[0075] 42: Fins

[0076] 50: First guide plate

[0077] 51: The First Slit

[0078] 52: Second Slit

[0079] 521: opening

[0080] 522: Involute

[0081] 60: Second guide plate

[0082] 70A, 70B: Heat exchanger

[0083] 71A, 71B: Sealing part

[0084] 72A, 72B: first fin portion

[0085] 73A, 73B: Second fin portion

[0086] 74B: Cooling chip DETAILED DESCRIPTION

[0087] The present invention provides a water cooling device having two pumps, thereby increasing the flow rate and flow velocity to obtain a higher heat dissipation efficiency.

[0088] First, please refer to Figure 1 , 2 , and 6. In the first embodiment of the present invention, the water cooling device has a housing 10 , two guide covers 20 , two pump assemblies 30 , and can selectively have a heat absorbing member 40 , a first guide plate 50 , and a second guide plate 60 .

[0089] Please refer to Figure 3 , 4 , and 7. In the present embodiment, the shell 10 is formed with a water inlet 11, a water outlet 12, and two pump spaces 13, and may optionally have two first openings 14 and a second opening 15. A working fluid can enter the water cooling device of the present invention from the water inlet 11, and then flow out from the water outlet 12. In the present embodiment, the water inlet 11 and the water outlet 12 are respectively arranged on two opposite sides of the shell 10, the two pump spaces 13 are respectively arranged on the other two opposite sides of the shell 10, and the first opening 14 and the second opening 15 are formed on the bottom surface of the shell 10. However, the relative positions of the aforementioned openings and chambers or spaces are not limited thereto, and the aforementioned top-bottom relationship or up-and-down relationship is only for exemplary purposes.

[0090] Each pump space 13 is connected to the water inlet 11 and the water outlet 12. In this embodiment, the pump spaces 13 are two recessed portions formed on the housing 10, and a partition portion is provided in the middle of the housing 10 to separate the two pump spaces 13. However, a notch 16 is formed in the partition portion, and the notch 16 is directly opposite to the water inlet 11. Therefore, the two pump spaces 13 are connected to the water inlet 11.

[0091] Please refer to Figure 5 . The two guide covers 20 are respectively arranged in the two pump spaces 13, whereby each pump space 13 is divided into a water inlet chamber 131 and a water outlet chamber 132. The water inlet chamber 131 is connected to the water inlet 11, and the water outlet chamber 132 is connected to the water outlet 12, and the water inlet chamber 131 and the water outlet chamber 132 are connected to each other. In this embodiment, each guide cover 20 has a bottom 21 and an edge portion 22. The bottom 21 and the edge portion 22 are used to separate the water inlet chamber 131 and the water outlet chamber 132. However, a through hole 210 is formed in the bottom 21, and the water inlet chamber 131 and the water outlet chamber 132 are connected through the through hole 210. The edge portion 22 extends around the edge of the bottom 21, and the two ends of the edge portion 22 are connected to the periphery of the water outlet 12.

[0092] In this embodiment, the two pump spaces 13 are recessed portions on two opposite sides of the housing 10, so the pump components 30 are respectively disposed in the water outlet chambers 132 of the two pump spaces 13. Specifically, the rotor of the pump component 30 is located in the water chamber 132, and a seal seals the rotor in the water outlet chamber 132, while the stator of the pump component 30 is located on the other side of the seal and drives the rotor. In this embodiment, there are also two circuit boards 17, which are fixedly disposed on both sides of the housing 10, and the two pump spaces 13 are respectively formed between the two circuit boards 17 and the housing 10.

[0093] In this embodiment, two fans may be provided on the housing 10 or the two circuit boards 17. The two fans may be connected to the two circuit boards 17 and may blow air to the external environment, for example, to the external motherboard, etc. to dissipate heat. In other implementations, air may also be blown to the circuit boards 17 to dissipate heat to the two circuit boards 17.

[0094] Please refer to Figure 6 and 7. In this embodiment, the shell 10 has the aforementioned first opening 14 and second opening 15, and the water cooling device has a heat absorbing member 40. Specifically, the two first openings 14 are respectively connected to the water outlet chambers 132 of the two pump spaces 13, and the second opening 15 is connected to the water outlet 12. The heat absorbing member 40 is fixed to the shell 10 and shields the first opening 14 and the second opening 15. One side of the heat absorbing member 40 is used to contact a heat source, and a heat absorbing chamber 41 is formed between the other side and the shell 10. In this embodiment, the heat absorbing member 40 also has fins 42 on the side facing the shell 10. In other words, the fins 42 of the heat absorbing member 40 are located in the heat absorbing chamber 41. The first opening 14 and the two second openings 15 are connected through the heat absorbing chamber 41.

[0095] In this embodiment, the first guide plate 50 and the second guide plate 60 are disposed in the heat absorption chamber 41. Specifically, the first guide plate 50 has two first slits 51 and a second slit 52. The first slit 51 and the second slit 52 are both penetrated through the first guide plate 50. The two first slits 51 are respectively connected to the two first openings 14 of the housing 10. The two ends of each first slit 51 are narrower and the middle is wider, and the wider part is opposite to one of the first openings 14.

[0096] One end of the second slit 52 surrounds the second opening 15, whereby the second slit 52 is connected to the second opening 15. Specifically, the second slit 52 has an opening portion 521 and a gradually opening portion 522. The opening portion 521 surrounds the second opening 15. In other words, the opening portion 521 is aligned with the second opening 15 and is connected to the second opening 15. The gradually opening portion 522 is in the shape of an elongated strip and has a first end and a second end. The first end of the gradually opening portion 522 is connected to the opening portion 521, and the width of the first end is smaller than the width of the opening portion 521, and the width of the first end is smaller than the width of the second end. In the present embodiment, the widths of the first end and the second end vary continuously. In other words, the gradually opening portion 522 may be a trapezoidal hole.

[0097] The second guide plate 60 is similar in shape to the first guide plate 50 and also has two first slits and one second slit, and the first slit of the second guide plate 60 is aligned with the first slit 51 of the first guide plate 50, and the second slit of the second guide plate 60 is aligned with the second slit 52 of the first guide plate 50. The first guide plate 50 and the second guide plate 60 are overlapped and the first guide plate 50 is located between the second guide plate 60 and the housing 10. One difference between the first guide plate 50 and the second guide plate 60 is that the material of the first guide plate 50 is a good conductor of heat (such as metal materials such as copper and aluminum), while the second guide plate 60 is a soft material (such as rubber, silicone or other plastic materials). Another difference is that the second slit of the second guide plate 60 may only have an involute portion without an opening portion.

[0098] Please refer to Figures 8 to 11. In the second embodiment of the present invention, the water cooling device is similar to the first embodiment, so the technical features can be mutually referenced. The difference between the second embodiment and the first embodiment is that the housing 10A of the water cooling device in the second embodiment further has a heat dissipation chamber 18A, and the heat dissipation chamber 18A is located on the side of the housing 10A relative to the first opening and the second opening. For example, if the first opening and the second opening are located on the bottom surface of the housing 10A, the heat dissipation chamber 18A is located on the top surface of the housing 10A. The heat dissipation chamber 18A is connected to the water inlet chamber 131 of the second pump space.

[0099] In the second embodiment, the water cooling device further comprises a heat exchange member 70A and a fan. The heat exchange member 70A comprises a sealing portion 71A, a first fin portion 72A, and a second fin portion 73A. The sealing portion 71A is fixed to the housing 10 and seals the heat dissipation chamber 18A. The first fin portion 72A is fixed to the sealing portion 71A and is located in the heat dissipation chamber 18A. The second fin portion 73A is fixed to the sealing portion 71A and is located outside the housing 10, and the fan is used to supply air to the second fin portion 73A.

[0100] Please refer to Fig.12 and Fig.13 . In the third embodiment of the present invention, the water cooling device is similar to the second embodiment, so the technical features can be referenced to each other. The difference between the third embodiment and the second embodiment is that the structure of the heat exchange element 70B is different. Specifically, the heat exchange element 70B in the third embodiment has a sealing portion 71B, a first fin portion 72B, and a second fin portion 73B, and also has a cooling chip 74B. The sealing portion 71B is fixed to the shell 10B and seals the heat dissipation chamber 18B, and the first fin portion 72B is fixed to the sealing portion 71B and is located in the heat dissipation chamber 18B. The cooling chip 74B is fixed to the sealing portion 71B and is located outside the heat dissipation chamber 18B. The second fin portion 73B is fixed to the cooling chip 74B and is located outside the shell 10. Thereby, the heat energy received by the first fin portion 72B is transferred to the second fin portion 73B through the cooling chip 74B, and a fan can be used to send air to the second fin portion 73B to remove the heat energy on the second fin portion 73B.

[0101] Through the above structure, when the present invention is in operation, the working fluid can flow into the shell 10 from the water inlet 11 of the shell 10, and flow into the water inlet chamber 131 of the two pump spaces 13 through the notch 16 of the partition part, and then flow through the through hole 210 of the guide cover 20 to the water outlet chamber 132, and driven by the pump to accelerate to flow toward the two first openings 14. In other words, at this time, the working fluid flows to two different flow channels respectively. After flowing out of the first opening 14, it passes through the first slit 51 of the first guide plate 50 and the second guide plate 60 and flows into the heat absorption chamber 41 to exchange heat with the heat absorption element 40. Subsequently, the working fluid with heat energy enters the second opening 15 of the shell 10 through the second slit 52 of the first guide plate 50 and the second guide plate 60, and finally flows out from the water outlet 12, and can flow to the heat dissipation device (such as a condenser, etc.) at the rear end to release heat.

[0102] In the second and third embodiments of the present invention, when the working fluid flows into the water inlet chamber 131, since the water inlet chamber 131 is connected to the heat dissipation chamber 18A / 18B, the working fluid in the water inlet chamber 131 can contact the first fin portion 72A / 72B, so the working fluid can be cooled again, so that it can have better heat exchange efficiency when it contacts the heat absorption element 40 later.

[0103] In other embodiments, the water cooling device has a shell 10, two guide covers 20, and two pump assemblies 30, whereby the working fluid can be introduced into the water inlet 11, flow into the water inlet chamber 131 and the water outlet chamber 132, and finally flow out from the water outlet 12.

[0104] In summary, the present invention forms two parallel flow paths in the water cooling device and respectively sets two pump components 30 in the two flow paths, which can effectively increase the flow rate and flow rate of the working fluid to achieve better heat exchange efficiency. In addition, the present invention greatly reduces the manufacturing difficulty by setting the additional guide cover 20 in the pump space 13 of the shell 10 instead of directly forming an integral flow channel space on the shell 10. The second slit 52 has an opening portion 521 surrounding the second opening 15 and a gradually opening portion 522 with a variable width, which can reduce the flow resistance and make the flow rate more uniform and stable, which has a positive effect on the flow rate and flow rate of the working fluid.

Claims

1. A water cooling device, characterized in that: It has: A housing is formed with: A water inlet; an outlet; and Two pump spaces, each of which is connected to the water inlet and the water outlet; Two guide covers are respectively arranged in the two pump spaces, whereby each pump space is divided into: a water inlet chamber connected to the water inlet; and a water outlet chamber connected to the water inlet chamber and the water outlet; and Two pump components are respectively arranged in the water outlet chamber of the two pump spaces.

2. The water cooling device according to claim 1, characterized in that: It has: Two circuit boards are fixedly mounted on the housing, and the two pump spaces are respectively formed between the two circuit boards and the housing; and Two fans are connected to the two circuit boards respectively.

3. The water cooling device according to claim 1, characterized in that: Each of the guide covers has: a bottom portion, which separates the water inlet chamber and the water outlet chamber, and the bottom portion is formed with a through hole, the through hole communicating with the water inlet chamber and the water outlet chamber; and An edge portion extends around the edge of the bottom portion, and two ends of the edge portion are connected to the periphery of the water outlet and separate the water inlet chamber and the water outlet chamber.

4. The water cooling device according to claim 1, characterized in that: in: The housing has two first openings and a second opening, the two first openings are respectively communicated with the water outlet chambers of the two pump spaces, and the second openings are respectively communicated with the water outlets; and The water cooling device also has: a heat absorbing element, which is fixed to the housing, and a side surface of the heat absorbing element is used to contact a heat source; and A heat absorption chamber is formed between the heat absorption component and the shell and is connected to the first opening and the two second openings.

5. The water cooling device according to claim 4, characterized in that: It also has: A guide plate is arranged in the heat absorption chamber and has two first slits. The two first slits penetrate the guide plate and are respectively communicated with the first opening of the shell.

6. The water cooling device according to claim 5, characterized in that: The guide plate has a second slit, which is penetrated through the guide plate, and one end of the second slit surrounds the second opening, whereby the second slit is communicated with the second opening.

7. The water cooling device according to claim 6, characterized in that: The second slit has: an opening portion surrounding the second opening; and A gradually opening portion is in the shape of a long strip and has a first end and a second end. The first end is connected to the opening portion, the width of the first end is smaller than the width of the opening portion, and the width of the first end is smaller than the width of the second end.

8. The water cooling device according to any one of claims 1 to 7, characterized in that: in: The housing has a heat dissipation chamber which is connected to the water inlet chamber of the second pump space; and The water cooling device also has a heat exchange element, which has: A sealing portion, which is fixed to the housing and seals the heat dissipation chamber; a first fin portion, which is fixed to the sealing portion and located in the heat dissipation chamber; and A second fin portion is fixed to the sealing portion and is located outside the housing.

9. The water cooling device according to any one of claims 1 to 7, characterized in that: in: The housing has a heat dissipation chamber which is connected to the water inlet chamber of the second pump space; and The water cooling device also has a heat exchange element, which has: A sealing portion, which is fixed to the housing and seals the heat dissipation chamber; a first fin portion, which is fixed to the sealing portion and located in the heat dissipation chamber; a cooling chip, which is fixed to the sealing portion and located outside the heat dissipation chamber; and A second fin portion is fixed to the cooling chip and is located outside the housing.

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