Device thermal management method and device, equipment and storage medium

Abstract

The invention discloses a device thermal management method and device, equipment and a storage medium. The device thermal management method comprises the steps of obtaining a time temperature curve of a device; determining the slope of the time-temperature curve at the current moment and the temperature value of the time-temperature curve at the current moment; controlling the heat dissipation power of a heat dissipation module according to the slope and / or controlling the operation power of the device according to the temperature value; according to the heat dissipation device, the problem that in a traditional technical scheme, the heat dissipation efficiency of a heat dissipation element cannot be adjusted in time according to a fixed mapping relation table and the detection temperature of the device is solved, and the operation safety of the device is improved.

Description

Technical Field

[0001] The present invention relates to the field of temperature detection technology, and in particular to a device thermal management method, device, equipment and storage medium. Background Art

[0002] Due to the development of portable devices and integrated devices, the use of integrated devices such as chips is increasing. With the high-frequency use or long-term operation of the equipment, integrated devices such as chips will generate severe heat after long-term operation.

[0003] The device will generate a lot of heat when it is running, so it is necessary to configure a heat dissipation element in the device to effectively cool and dissipate the heat of the heat-generating components to prevent the device from being overheated and burning out. When the operating state of the device suddenly changes, the temperature of the device may change rapidly. In the prior art, since the acquisition module itself is large in size and far away from the device, it is not possible to accurately detect the temperature change of the device in a timely manner. Therefore, the fixed mapping relationship table may not be applicable to the working conditions after the operating state suddenly changes. That is, it is impossible to adjust the heat dissipation efficiency of the heat dissipation element in time according to the fixed mapping relationship table and the detected temperature of the device, which affects the operating safety of heat dissipation devices such as chips. Summary of the invention

[0004] The present invention provides a device thermal management method, apparatus, equipment and storage medium to solve the problem in traditional technical solutions that the heat dissipation efficiency of the heat dissipation element cannot be adjusted in time according to a fixed mapping relationship table and the detected temperature of the device, thereby improving the operating safety of the device.

[0005] According to one aspect of the present invention, the present invention provides a device thermal management method, comprising:

[0006] Obtain the time-temperature curve of the device;

[0007] Determine the slope of the time-temperature curve at the current moment and the temperature value at the current moment;

[0008] The heat dissipation power of the heat dissipation module is controlled according to the slope and / or the operating power of the device is controlled according to the temperature value; wherein the heat dissipation module is used to dissipate heat for the device.

[0009] Optionally, controlling the heat dissipation power of the heat dissipation module and / or the operating power of the control device according to the slope and the temperature value includes:

[0010] If the slope is greater than or equal to the first preset value and less than the second preset value, the heat dissipation module is controlled to operate at the first heat dissipation power;

[0011] If the slope is greater than or equal to a second preset value, controlling the heat dissipation module to operate at a second heat dissipation power;

[0012] The second preset value is greater than the first preset value, and the second heat dissipation power is greater than the first heat dissipation power.

[0013] Optionally, controlling the heat dissipation power of the heat dissipation module according to the slope and / or controlling the operating power of the device according to the temperature value includes:

[0014] If the temperature value at the current moment is less than the first preset temperature value, the control device operates at the first operating power;

[0015] If the temperature value at the current moment is greater than or equal to the first preset temperature value and less than the second preset temperature value, the control device operates at the second operating power;

[0016] If the temperature value at the current moment is greater than or equal to the second preset temperature value, the control device stops running;

[0017] The second preset temperature value is greater than the first preset temperature value, and the second operating power is less than the first operating power.

[0018] According to another aspect of the present invention, an embodiment of the present invention provides a device thermal management apparatus, including:

[0019] A first acquisition module, the first acquisition module is used to acquire a time-temperature curve of a device;

[0020] A slope and temperature value determination module, the slope and temperature value determination module is used to determine the slope of the time-temperature curve at the current moment and the temperature value at the current moment;

[0021] The power control module is used to control the heat dissipation power of the heat dissipation module according to the slope and / or control the operating power of the device according to the temperature value.

[0022] Optionally, the power control module includes a first operating power control unit and a second operating power control unit;

[0023] The first operating power control unit is used to control the heat dissipation module to operate at a first heat dissipation power if the slope is greater than or equal to a first preset value and less than a second preset value;

[0024] The second operating power control unit is used for controlling the heat dissipation module to operate at a second heat dissipation power if the slope is greater than or equal to a second preset value.

[0025] Optionally, the power control module further includes a first heat dissipation power control unit, a second heat dissipation power control unit and a third heat dissipation power control unit;

[0026] The first heat dissipation power control unit is used to control the device to operate at a first operating power if the temperature value at the current moment is less than the first preset temperature value;

[0027] The second heat dissipation power control unit is used to control the device to operate at a second operating power if the temperature value at the current moment is greater than or equal to the first preset temperature value and less than the second preset temperature value;

[0028] The third heat dissipation power control unit is used to control the device to stop running if the current temperature value is greater than the second preset temperature value.

[0029] Optionally, the device thermal management device further includes:

[0030] A second acquisition module and a heat dissipation module; the second acquisition module is used to obtain the first preset value, the second preset value, the first preset temperature value and the second preset temperature value; the heat dissipation module is used to dissipate heat for the device.

[0031] Optionally, the first acquisition module includes a thermistor, and a thickness of the thermistor is greater than or equal to 5 nm and less than or equal to 5 μm.

[0032] The device includes at least one of a chip, a battery, a memory, a power transistor, an insulated gate bipolar transistor, a graphics processor, a regulator, a radio frequency amplifier, a capacitor, an inductor and a sensor.

[0033] According to another aspect of the present invention, an embodiment of the present invention further provides an electronic device, including:

[0034] A processor and a memory, the memory is used to store a computer program, and the processor is used to call and run the computer program stored in the memory to execute the device thermal management method of any embodiment of the present invention.

[0035] According to another aspect of the present invention, an embodiment of the present invention further provides a computer-readable storage medium for storing a computer program, wherein the computer program enables a computer to execute the device thermal management method according to any embodiment of the present invention.

[0036] In an embodiment of the present invention, a time-temperature curve of a device is obtained, and the slope of the time-temperature curve at the current moment and the temperature value at the current moment are determined. The slope at the current moment is used to reflect the rate of change of the temperature of the device, and the temperature value at the current moment is used to reflect the temperature value of the device. The heat dissipation power of the heat dissipation module is controlled according to the slope and / or the operating power of the device is controlled according to the temperature value, so that the heat dissipation power of the heat dissipation module and / or the operating power of the device can be adjusted in time according to the slope and temperature value at the current moment, which solves the problem that the heat dissipation efficiency of the heat dissipation element cannot be adjusted in time according to the fixed mapping relationship table and the detected temperature of the device in the traditional technical solution, and improves the operating safety of the device. Among them, the slope at the current moment is the slope at the end point of the time-temperature curve that is not included; the slope at the current moment can also be the slope of a moment extremely close to the current moment, and the smaller the time span, the better.

[0037] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 is a flow chart of a device thermal management method provided by an embodiment of the present invention;

[0040] Figure 2 is a flow chart of another device thermal management method provided by an embodiment of the present invention;

[0041] Figure 3 is a flow chart of another device thermal management method provided by an embodiment of the present invention;

[0042] Figure 4 is a schematic structural diagram of a device thermal management apparatus provided by an embodiment of the present invention;

[0043] Figure 5 is a structural schematic diagram of another device thermal management apparatus provided by an embodiment of the present invention;

[0044] Figure 6 is a structural schematic diagram of another device thermal management apparatus provided by an embodiment of the present invention;

[0045] Figure 7 It is a structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0046] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0047] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, any variation of the terms "including" and "having" is intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0048] Figure 1 is a flow chart of a device thermal management method provided by an embodiment of the present invention, see Figure 1 , the device thermal management method includes:

[0049] S110, obtaining a time-temperature curve of the device.

[0050] Among them, the real-time temperature of the device is obtained through a thermistor, and the time-temperature curve is a time-temperature curve formed by obtaining the real-time temperature of the device by the thermistor in chronological order. The device includes at least one of a chip, a battery, a storage device, a power transistor, an insulated gate bipolar transistor, a graphics processor, a regulator, a radio frequency amplifier, a capacitor, an inductor and a sensor.

[0051] S120: Determine the slope of the time-temperature curve at the current moment and the temperature value at the current moment.

[0052] Among them, the current slope is used to reflect the rate of change of the device temperature when the device operating state suddenly changes, and the current temperature value is used to reflect the temperature value of the device when the device operating state suddenly changes; the steeper the slope, the faster the device temperature changes in a short time, and the gentler the slope, the slower the device temperature changes in a short time.

[0053] S130, controlling the heat dissipation power of the heat dissipation module according to the slope and / or controlling the operating power of the device according to the temperature value; wherein the heat dissipation module is used to dissipate heat for the device.

[0054] Specifically, the heat dissipation power of the heat dissipation module is controlled according to the slope. For example, when the slope is steeper, the heat dissipation power of the heat dissipation module is enhanced, and when the slope is gentle, the heat dissipation power of the heat dissipation module is reduced; or the operating power of the device is controlled according to the temperature value. For example, when the temperature value is high, the device is controlled to reduce the operating power, or the operating power of the device is stopped, and when the temperature value is low, the device is controlled to operate at a high operating power, or the heat dissipation power of the heat dissipation module is controlled according to the slope and the operating power of the device is controlled according to the temperature value.

[0055] In an embodiment of the present invention, a time-temperature curve of a device is obtained, and a slope of the time-temperature curve at a current moment and a temperature value at a current moment are determined. The slope at the current moment is used to reflect the rate of change of the temperature of the device, and the temperature value at the current moment is used to reflect the temperature value of the device. The heat dissipation power of the heat dissipation module is controlled according to the slope and / or the operating power of the device is controlled according to the temperature value, so that the heat dissipation power of the heat dissipation module and / or the operating power of the device can be adjusted in time according to the slope and the temperature value at the current moment, thereby solving the problem in the traditional technical solution that the heat dissipation efficiency of the heat dissipation element cannot be adjusted in time according to a fixed mapping relationship table and the detected temperature of the device, and improving the operating safety of the device.

[0056] Figure 2 is a flow chart of another device thermal management method provided by an embodiment of the present invention; Figure 1 Based on the device thermal management method shown, the heat dissipation power of the heat dissipation module is controlled according to the slope, the first preset value and the second preset value, such as Figure 2 As shown, the specific steps of the device thermal management method are as follows:

[0057] S110, obtaining a time-temperature curve of the device.

[0058] S120: Determine the slope of the time-temperature curve at the current moment and the temperature value at the current moment.

[0059] S1301: If the slope is greater than or equal to a first preset value and less than a second preset value, control the heat dissipation module to operate at a first heat dissipation power.

[0060] S1302: If the slope is greater than or equal to a second preset value, control the heat dissipation module to operate at a second heat dissipation power.

[0061] Wherein, the second preset value is greater than the first preset value, and the second heat dissipation power is greater than the first heat dissipation power.

[0062] In an embodiment of the present invention, if the slope is greater than or equal to the first preset value and less than the second preset value, the heat dissipation module is controlled to operate at the first heat dissipation power; if the slope is greater than or equal to the second preset value, the heat dissipation module is controlled to operate at the second heat dissipation power, that is, when the slope increases, the heat dissipation power of the heat dissipation module is increased, thereby avoiding damage to the device due to excessive temperature and improving the operating safety of the device.

[0063] Figure 3 is a flow chart of another device thermal management method provided by an embodiment of the present invention; Figure 1 Based on the device thermal management method shown, the operating power of the device is controlled according to the temperature value, the first preset temperature value and the second preset temperature value, such as Figure 3 As shown, the specific steps of the device thermal management method are as follows:

[0064] S210 , obtaining a time-temperature curve of the device.

[0065] S220: Determine the slope of the time-temperature curve at the current moment and the temperature value at the current moment.

[0066] The thermal management process and effects of S210-220 refer to S110-S120 and will not be repeated here.

[0067] S230: If the temperature value at the current moment is less than the first preset temperature value, the control device operates at the first operating power.

[0068] S240: If the temperature value at the current moment is greater than or equal to the first preset temperature value and less than the second preset temperature value, the control device operates at the second operating power.

[0069] S250: If the temperature value at the current moment is greater than or equal to the second preset temperature value, the control device stops running.

[0070] The second preset temperature value is greater than the first preset temperature value, and the second operating power is less than the first operating power.

[0071] In the embodiment of the present invention, the operating power of the device is controlled by the current temperature value, the first preset temperature value and the second preset temperature value, thereby avoiding damage to the device due to excessive temperature and improving the operating safety of the device.

[0072] As mentioned in the background technology, a large amount of heat is generated when the device is running. Due to the thermal resistance problem between the traditional temperature detection element and the device, there is a certain lag in the temperature detection element detecting the actual temperature of the device. When the operating state of the device suddenly changes, the temperature detection element cannot quickly reflect the actual temperature of the chip in real time.

[0073] Figure 4 is a schematic diagram of the structure of a device thermal management device provided by an embodiment of the present invention, such as Figure 4 As shown, the device thermal management apparatus includes: a first acquisition module 10, the first acquisition module 10 is used to acquire the time-temperature curve of the device; a slope and temperature value determination module 20, the slope and temperature value determination module 20 is used to determine the slope of the time-temperature curve at a current moment and the temperature value at a current moment; a power control module 30, the power control module 30 is used to control the heat dissipation power of the heat dissipation module according to the slope and / or control the operating power of the device according to the temperature value.

[0074] Among them, the first acquisition module 10 is a thermistor, the thickness of the first acquisition module 10 is greater than or equal to 5nm and less than or equal to 5μm, the first acquisition module 10 can be attached to the surface of the device, or the first acquisition module 10 is directly embedded in the device substrate, or the first acquisition module 10 is directly embedded in the circuit board.

[0075] In an embodiment of the present invention, the first acquisition module 10 is used to acquire the time-temperature curve of the device; the first acquisition module 10 can be attached to the surface of the device, or the first acquisition module 10 can be directly embedded in the device carrier, or the first acquisition module 10 can be directly embedded in the circuit board, and can directly detect the temperature of the device surface with high temperature detection accuracy. The time-temperature acquisition module is thin, has high temperature sensitivity, and has no hysteresis, so that even if the temperature of the device changes suddenly, the temperature can be fed back in time to avoid overheating of the device.

[0076] Figure 5 is a schematic diagram of the structure of another device thermal management device provided by an embodiment of the present invention, see Figure 5 Optionally, based on the above embodiment, the power control module 30 includes a first operating power control unit 301 and a second operating power control unit 302; the first operating power control unit 301 is used to control the heat dissipation module to operate at a first heat dissipation power if the slope is greater than or equal to a first preset value and less than a second preset value; the second operating power control unit 302 is used to control the heat dissipation module to operate at a second heat dissipation power if the slope is greater than or equal to a second preset value.

[0077] In the embodiment of the present invention, the first operating power control unit 301 controls the heat dissipation module to operate at a first heat dissipation power, and the second operating power control unit 302 controls the heat dissipation module to operate at a second heat dissipation power. This arrangement avoids damage to the device due to excessive device temperature and improves the operating safety of the device.

[0078] See also Figure 5 Optionally, based on the above embodiment, the power control module 30 also includes a first heat dissipation power control unit 303, a second heat dissipation power control unit 304 and a third heat dissipation power control unit 305; the first heat dissipation power control unit 303 is used to control the device to operate at a first operating power if the temperature value at the current moment is less than the first preset temperature value; the second heat dissipation power control unit 304 is used to control the device to operate at a second operating power if the temperature value at the current moment is greater than or equal to the first preset temperature value and less than the second preset temperature value; the third heat dissipation power control unit 305 is used to control the device to stop operating if the temperature value at the current moment is greater than the second preset temperature value.

[0079] Figure 6 is a schematic diagram of the structure of another device thermal management device provided by an embodiment of the present invention, see Figure 6 Optionally, based on the above embodiments, the device thermal management apparatus further includes: a second acquisition module 40 and a heat dissipation module; the second acquisition module 40 is used to obtain a first preset value, a second preset value, a first preset temperature value, a second preset temperature value, a first heat dissipation power, a second heat dissipation power, a first operating power, and a second operating power; the heat dissipation module 50 is used to dissipate heat for the device.

[0080] See also Figure 4 or Figure 5 Optionally, based on the above embodiment, the first acquisition module 10 includes a thermistor, and the thickness of the thermistor is greater than or equal to 5nm and less than or equal to 5μm. For example, the thickness can be 5nm, 15nm, 35nm, 50nm, 60nm, 80nm, 120nm, 200nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, 1μm, 1.2μm, 1.4μm, 1.6μm, 1.8μm, 2μm, 2.2μm, 2.6μm, 2.8μm, 3μm, 3.4μm, 3.8μm, 4.2μm, 4.6μm, 4.8μm, 5μm or an interval consisting of any two values, which is not specifically limited in this embodiment. Among them, the thermistor is mainly divided into NTC type or PTC type.

[0081] Specifically, if the thickness of the thermistor is too large, the volume of the thermistor is large, which is not conducive to the thermistor being attached to the surface of the device or buried in the corresponding circuit board or carrier board, and affects the detection accuracy and sensitivity of the device temperature. When the thickness of the thermistor is too small, it will affect the square resistance of the thermistor, making the square resistance of the thermistor uneven. Therefore, the thickness of the thermistor is set to be greater than or equal to 5nm and less than or equal to 5μm, so that the thermistor is easy to attach to the surface of the device or buried in the corresponding circuit board or carrier board, further shortening the physical space distance between the thermistor and the device, improving the detection accuracy of the device temperature, and making the square resistance of the thermistor uniform. In the present invention, the thermistor has a smaller volume than conventional thermistors such as traditional thick film thermistors, thick sheet thermistors, and thin sheet thermistors, which is conducive to the miniaturization of the overall structure and the faster and more accurate response to temperature. The thermistor of the present invention is used as an acquisition module in combination with the thermal management method of the present invention, which has a more accurate temperature response and higher thermal management efficiency.

[0082] It should be noted that the device includes at least one of a chip, a battery, a storage device, a power transistor, an insulated gate bipolar transistor, a graphics processor, a regulator, a radio frequency amplifier, a capacitor, an inductor and a sensor.

[0083] Figure 7is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention, see Figure 7 The electronic device includes: a processor and a memory, the memory is used to store a computer program, and the processor is used to call and run the computer program stored in the memory to execute the device thermal management method of any embodiment of the present invention.

[0084] Electronic devices are intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframes, and other suitable computers. Electronic devices may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the invention described and / or claimed herein.

[0085] like Figure 7 As shown, the electronic device 200 includes at least one processor 21, and a memory connected to the at least one processor 21, such as a read-only memory (ROM) 22, a random access memory (RAM) 23, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 21 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 22 or the computer program loaded from the storage unit 28 to the random access memory (RAM) 23. In RAM23, various programs and data required for the operation of the electronic device 200 can also be stored. The processor 21, ROM22 and RAM23 are connected to each other through a bus 24. An input / output (I / O) interface 25 is also connected to the bus 24.

[0086] A number of components in the electronic device 200 are connected to the I / O interface 25, including: an input unit 26, such as a keyboard, a mouse, etc.; an output unit 27, such as various types of displays, speakers, etc.; a storage unit 28, such as a disk, an optical disk, etc.; and a communication unit 29, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 29 allows the electronic device 200 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0087] The processor 21 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 21 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 21 performs the various methods and processes described above, such as a device thermal management method.

[0088] An embodiment of the present invention further provides a computer-readable storage medium for storing a computer program, wherein the computer program enables a computer to execute the device thermal management method according to any embodiment of the present invention.

[0089] In some embodiments, the device thermal management method may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 28. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 200 via the ROM 22 and / or the communication unit 29. When the computer program is loaded into the RAM 23 and executed by the processor 21, one or more steps of the device thermal management method described above may be performed. Alternatively, in other embodiments, the processor 21 may be configured to execute the device thermal management method in any other appropriate manner (e.g., by means of firmware).

[0090] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0091] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0092] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0093] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A device thermal management method, characterized in that: include: Obtain the time-temperature curve of the device; Determine the slope of the time-temperature curve at the current moment and the temperature value at the current moment; The heat dissipation power of the heat dissipation module is controlled according to the slope and / or the operating power of the device is controlled according to the temperature value; wherein the heat dissipation module is used to dissipate heat for the device.

2. The device thermal management method according to claim 1, characterized in that: Controlling the heat dissipation power of the heat dissipation module according to the slope and / or controlling the operating power of the device according to the temperature value includes: If the slope is greater than or equal to a first preset value and less than a second preset value, controlling the heat dissipation module to operate at a first heat dissipation power; If the slope is greater than or equal to a second preset value, controlling the heat dissipation module to operate at a second heat dissipation power; Among them, the second preset value is greater than the first preset value, and the second heat dissipation power is greater than the first heat dissipation power.

3. The device thermal management method according to claim 1 or 2, characterized in that: Controlling the heat dissipation power of the heat dissipation module according to the slope and / or controlling the operating power of the device according to the temperature value includes: If the temperature value at the current moment is less than a first preset temperature value, controlling the device to operate at a first operating power; If the temperature value at the current moment is greater than or equal to the first preset temperature value and less than the second preset temperature value, controlling the device to operate at a second operating power; If the temperature value at the current moment is greater than or equal to a second preset temperature value, controlling the device to stop running; The second preset temperature value is greater than the first preset temperature value, and the second operating power is less than the first operating power.

4. A device thermal management device, characterized in that: include: A first acquisition module, the first acquisition module is used to acquire a time-temperature curve of a device; A slope and temperature value determination module, wherein the slope and temperature value determination module is used to determine the slope of the time-temperature curve at a current moment and the temperature value at a current moment; A power control module is used to control the heat dissipation power of the heat dissipation module according to the slope and / or control the operating power of the device according to the temperature value.

5. The device thermal management apparatus according to claim 4, characterized in that: The power control module includes a first operating power control unit and a second operating power control unit; The first operating power control unit is used to control the heat dissipation module to operate at a first heat dissipation power if the slope is greater than or equal to a first preset value and less than a second preset value; The second operating power control unit is used to control the heat dissipation module to operate at a second heat dissipation power if the slope is greater than or equal to a second preset value.

6. The device thermal management device according to claim 4 or 5, characterized in that: The power control module also includes a first heat dissipation power control unit, a second heat dissipation power control unit and a third heat dissipation power control unit; The first heat dissipation power control unit is used to control the device to operate at a first operating power if the temperature value at the current moment is less than a first preset temperature value; The second heat dissipation power control unit is used to control the device to operate at a second operating power if the temperature value at the current moment is greater than or equal to the first preset temperature value and less than the second preset temperature value; The third heat dissipation power control unit is used to control the device to stop running if the current temperature value is greater than the second preset temperature value.

7. The device thermal management apparatus according to claim 6, characterized in that: Also includes: A second acquisition module and a heat dissipation module; the second acquisition module is used to obtain a first preset value, a second preset value, a first preset temperature value, a second preset temperature value, a first heat dissipation power, a second heat dissipation power, a first operating power and a second operating power; the heat dissipation module is used to dissipate heat for the device.

8. The device thermal management apparatus according to claim 4, characterized in that: The first acquisition module includes a thermistor, and the thickness of the thermistor is greater than or equal to 5 nm and less than or equal to 5 μm; The device includes at least one of a chip, a battery, a memory, a power transistor, an insulated gate bipolar transistor, a graphics processor, a regulator, a radio frequency amplifier, a capacitor, an inductor and a sensor.

9. An electronic device, characterized in that: include: A processor and a memory, wherein the memory is used to store a computer program, and the processor is used to call and run the computer program stored in the memory to execute the device thermal management method according to any one of claims 1 to 3.

10. A computer-readable storage medium, characterized in that: Used to store a computer program, wherein the computer program enables a computer to execute the device thermal management method according to any one of claims 1 to 3.

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