Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus, which can suppress the size of the apparatus and increase the number of arranged single-chip chambers so as to improve the processing capacity. According to the present invention, since the monolithic chambers can be stacked in the vertical direction, it is possible to provide a substrate processing apparatus in which more monolithic chambers can be mounted even if the ground surface area is the same as that of conventional apparatuses. Furthermore, if a mechanism for carrying the substrate W into the monolithic chamber (drying chamber 37) and a mechanism for carrying the substrate W out of the drying chamber 37 are independently arranged, the substrate at the periphery of the drying chamber 37 can be smoothly carried. According to the present invention, it is possible to provide a substrate processing apparatus (1) having a small size and a high processing capacity.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for performing prescribed processing on various substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates such as liquid crystal display or organic EL (electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. Background Art

[0002] In the past, as such an apparatus, there is an apparatus having a batch module and a monolithic module (for example, refer to Patent Document 1). The batch module performs a prescribed process on a plurality of substrates at once. The monolithic module performs a prescribed process on substrates one by one. The batch module and the monolithic module each have their own advantages. For example, the particle performance in the drying process of the monolithic module is higher than that of the batch module. Therefore, as an apparatus having a batch module and a monolithic module, the following structure can be considered: after liquid processing is performed in the batch module, drying processing is performed in the monolithic module.

[0003] In the device described in Patent Document 1, the single-chip chambers for drying are arranged in a row in the horizontal direction. Drying treatment is performed on the substrates after batch processing in any of the single-chip chambers provided with a plurality of single-chip chambers. That is, the substrates after batch processing are transported by a transport mechanism that can move in the arrangement direction of the single-chip chambers, and are introduced into the single-chip chamber that can receive the substrates. When the batch processing is completed, the plurality of substrates are put into a state of waiting for drying treatment. The single-chip chamber can only perform drying treatment on substrates one by one. Therefore, the device described in Patent Document 1 carries a plurality of single-chip chambers on the device for the purpose of increasing the processing capacity, and performs drying treatment on different substrates at the same time. In the device described in Patent Document 1, in order to quickly complete the drying treatment of a plurality of substrates, it is sufficient to arrange as many single-chip chambers as possible in a row in the horizontal direction.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application No. 2016-502275 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, the conventional device having such a structure has the following problems.

[0009] That is, in the previous device, if a single-chip chamber is added, the number of added chambers will lead to a larger device. According to the previous structure, when adding a single-chip chamber, since the single-chip chambers are only arranged in a row in the horizontal direction, the number of single-chip chambers will cause the length of the substrate processing device to extend. There is a limit to the length that can be allowed in the substrate processing device. Due to this limit, according to the previous structure, only the number of single-chip chambers can be limited. According to this device, the processing speed of the single-chip chamber will become the bottleneck of the processing speed of the entire device, and the overall processing throughput is low.

[0010] The present invention has been proposed in view of such a situation, and provides a substrate processing apparatus that reduces the size of the apparatus and increases the number of arranged single-wafer chambers, thereby improving the processing throughput.

[0011] Means for solving problems

[0012] In order to achieve the above object, the present invention adopts the following structure.

[0013] (1) A substrate processing device for continuously performing batch processing of processing a plurality of substrates at a time and single-wafer processing of processing substrates one by one, characterized in that the substrate processing device comprises: a supply block for supplying a plurality of substrates; a transfer block adjacent to the supply block; and a processing block adjacent to the transfer block; the supply block comprises a collective transport mechanism, the collective transport mechanism carries out a plurality of substrates in a horizontal posture and arranged at a specified interval in the vertical direction from a carrier and sends them to a forward substrate delivery position in the transfer block, and takes a plurality of substrates in a horizontal posture and arranged at the specified interval in the vertical direction from a return substrate delivery position in the transfer block. The substrate is accommodated in the carrier; the transfer block has: a first posture conversion mechanism, which holds a plurality of substrates waiting at the outgoing substrate transfer position together, and converts the postures of the plurality of substrates from a horizontal posture to a vertical posture; and a vertical substrate support member, which makes the plurality of substrates in a vertical posture wait at the vertical substrate transfer position in the transfer block; the processing block has: a batch processing area, one end of which is adjacent to the transfer block and the other end of which extends in a direction away from the transfer block; a single-chip processing area, one end of which is adjacent to the transfer block and the other end of which extends in a direction away from the transfer block; a single-chip substrate conveying area, which is sandwiched between the batch processing area and The single-wafer processing area is adjacent to the transfer block at one end and extends in a direction away from the transfer block at the other end; and a batch substrate conveying area is arranged along the batch processing area, adjacent to the transfer block at one end and extends in a direction away from the transfer block at the other end; the batch processing area in the processing block has a plurality of batch processing tanks for simultaneously immersing and processing a plurality of substrates arranged in the direction in which the batch processing area extends, and has, at the position farthest from the transfer block: a second posture conversion mechanism for converting the posture of the plurality of substrates from a vertical posture to a horizontal posture; and a horizontal substrate supporting member for allowing the plurality of substrates in a horizontal posture to be immersed in the horizontal posture. The substrate is on standby at a horizontal substrate handover position in the batch processing area; the single-chip processing area in the processing block has a plurality of drying chambers arranged in a vertical direction for performing substrate drying processing, and the single-chip processing area in the processing block has a substrate carrying mechanism for carrying the substrate before drying processing into the drying chamber; the single-chip substrate conveying area in the processing block has: a single-chip substrate handover mechanism for receiving a substrate in a horizontal posture from the horizontal substrate handover position and transferring the substrate to the single-chip processing area; and a substrate carrying mechanism for carrying the substrate after drying processing out of the drying chamber to the return substrate handover position in the transfer block;The batch substrate transfer area in the processing block has a batch substrate transfer mechanism, and the batch substrate transfer mechanism transfers a plurality of substrates at a time between the vertical substrate transfer position set in the transfer block, each batch processing tank, and the second posture conversion mechanism. ;

[0014] [Effect] According to the invention of (1) above, substrates are taken out from a carrier that accommodates a plurality of substrates in a horizontal posture, and the postures of the substrates are converted from a horizontal posture to a vertical posture by a first posture conversion mechanism. Then, while maintaining the vertical posture, the plurality of substrates are batch processed in the batch processing area. After the batch processing is implemented, the postures of the substrates are converted from a vertical posture to a horizontal posture by a second posture conversion mechanism. Thereafter, while maintaining the horizontal posture, the substrates are single-chip processed in the single-chip processing area. Specifically, the single-chip processing includes substrate drying processing. The single-chip processing area of ​​the present invention has a substrate loading mechanism for transporting a wet substrate to be dried to a drying chamber, and has a substrate unloading mechanism for transporting a dry substrate after drying processing from the drying chamber. With this structure, since the substrate can be loaded into and unloaded from the drying chamber by different mechanisms, the transportation of the substrate will not stagnate around the drying chamber. According to the present invention, since the drying chambers are stacked in the vertical direction and are configured so that substrates around the drying chambers can be smoothly conveyed, it is possible to provide a substrate processing apparatus that can accommodate more drying chambers on the same floor area as a conventional apparatus.

[0015] The present invention also has the following features.

[0016] (2) In the substrate processing apparatus described in (1), the substrate carrying mechanism receives the substrate from the single-substrate delivering mechanism.

[0017] [Effect] According to the invention of (2) above, the substrate carrying mechanism for carrying the substrate into the drying chamber receives the substrate from the single-substrate delivery mechanism located in the batch processing area. According to this structure, the substrate carrying mechanism can be arranged at a position away from the batch processing area. Therefore, according to the invention of (2), a stack of a plurality of drying chambers can be arranged around the substrate carrying mechanism, thereby providing a substrate processing device with a high processing capacity.

[0018] (3) In the substrate processing device described in (1), it is characterized in that the single-chip processing area has a substrate drying pre-processing chamber for performing pre-drying treatment; the single-chip substrate transfer mechanism sends the substrate to the substrate drying pre-processing chamber; and the substrate carrying-in mechanism receives the substrate from the substrate drying pre-processing chamber.

[0019] [Effect] According to the invention of (3) above, the single-chip substrate delivery mechanism delivers the substrate to the substrate pre-drying processing chamber; the substrate carrying-in mechanism receives the substrate from the substrate pre-drying processing chamber. According to this structure, since there is no need to carry out the delivery of the substrate between the substrate carrying-in mechanism and the single-chip substrate delivery mechanism, a substrate processing device that can more reliably transport the substrate and reliably perform the pre-processing of the substrate to be dried can be provided.

[0020] (4) In the substrate processing device described in (2), it is characterized in that the single-chip substrate transfer mechanism is composed of a robot arm that also serves as the substrate carry-out mechanism; the single-chip substrate transfer mechanism has a transfer arm that supports the substrate before drying treatment; the substrate carry-out mechanism has a carry-out arm that supports the substrate after drying treatment; and the carry-out arm is arranged on the upper part of the transfer arm.

[0021] [Effect] According to the invention of (4) above, the single-chip substrate delivery mechanism is composed of a robot arm that also serves as a substrate carrying-out mechanism; the carrying-out arm that supports the substrate after drying is arranged on the upper part of the delivery arm that supports the substrate before drying. According to this structure, liquid will not drip from the delivery arm used to carry the wet substrate to the carrying-out arm used to carry the dried substrate and cause adverse effects on the substrate.

[0022] (5) In the substrate processing apparatus described in (1), the drying chamber dries the substrate using a supercritical fluid.

[0023] [Effect] According to the invention of (5) above, since the substrate is dried in a state where the surface tension is zero, the pattern collapse of the circuit provided on the surface of the substrate does not occur.

[0024] (6) In the substrate processing apparatus described in (3), the substrate pre-drying processing chamber is characterized in that the substrate is pre-dried using isopropyl alcohol.

[0025] [Effect] According to the invention of (6) above, the pre-treatment of substrate drying can be reliably performed using isopropyl alcohol.

[0026] (7) In the substrate processing apparatus described in (1), in the single wafer processing area in the processing block, a stack of the drying chambers is provided on both sides of the substrate carrying mechanism.

[0027] [Effect] According to the invention of (7) above, in the single-wafer processing area, a stack of drying chambers is provided on both sides of the substrate carrying mechanism. According to this structure, the number of drying processing chambers facing the substrate carrying mechanism can be increased, so that more substrates can be dried in parallel. According to this structure, a substrate processing device with a high processing capacity can be provided.

[0028] (8) The substrate processing device described in (1) is characterized in that the batch substrate conveying area in the processing block has: a first substrate unloading mechanism for conveying substrates from the upper layer of the stacked body in the drying chamber; and a second substrate unloading mechanism for conveying substrates from the lower layer of the stacked body in the drying chamber; a first return substrate transfer position for conveying substrates from the first substrate conveying mechanism is set in the transfer block, and a second return substrate transfer position for conveying substrates from the second substrate conveying mechanism is set.

[0029] [Effect] According to the invention of (8) above, there are multiple paths for returning the substrates that have been dried to the carrier. Moreover, the first substrate carrying mechanism and the second substrate carrying mechanism correspond to different paths, respectively, and the substrates related to the first path are carried out by the first substrate carrying mechanism, and the substrates related to the second path are carried out by the second substrate carrying mechanism. According to this structure, a substrate processing device with a high processing capacity can be provided.

[0030] Effects of the Invention

[0031] According to the present invention, a substrate processing device can be provided, which suppresses the size of the device and increases the number of configured monolithic chambers, thereby improving the processing capacity. In the previous structure, when it is desired to add a monolithic chamber, since the monolithic chambers are only arranged in a row in the horizontal direction, the number of monolithic chambers will cause the length of the substrate processing device to extend. In contrast, according to the present invention, since the monolithic chambers can be stacked in the vertical direction, a substrate processing device can be provided, which can carry more monolithic chambers even if the floor area is the same as that of the previous device. Moreover, if a mechanism for carrying a substrate into a monolithic chamber (substrate drying processing chamber) and a mechanism for carrying a substrate out of the substrate drying processing chamber are independently provided, it can be configured so that the substrate transportation around the drying chamber becomes smooth. According to the present invention, a small-sized substrate processing device with a high processing capacity can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a top view for explaining the overall structure of the substrate processing apparatus of Example 1.

[0033] Figure 2 This is a functional block diagram for explaining the structure of the collective transport mechanism of the first embodiment.

[0034] Figure 3 It is a perspective view for explaining the structure of the hand holding together according to the first embodiment.

[0035] Figure 4 This is a functional block diagram for explaining the structure of the first posture conversion mechanism of the first embodiment.

[0036] Figure 5 It is a functional block diagram for explaining the structure of the substrate pickup mechanism of Example 1.

[0037] Figure 6 It is a schematic diagram for explaining the conveyance of substrates in the transfer block of Example 1.

[0038] Figure 7 It is a schematic diagram for explaining the conveyance of substrates in the transfer block of Example 1.

[0039] Figure 8 It is a schematic diagram for explaining the conveyance of substrates in the transfer block of Example 1.

[0040] Fig. 9 It is a schematic diagram for explaining the conveyance of substrates in the transfer block of Example 1.

[0041] Fig.10 It is a schematic diagram for explaining the conveyance of substrates in the transfer block of Example 1.

[0042] Fig.11 It is a schematic diagram for explaining the operation of the substrate pickup mechanism in the transfer block of the first embodiment.

[0043] Fig.12 It is a perspective view for explaining the operation of the substrate pickup mechanism in the transfer block of the first embodiment.

[0044] Fig.13 It is a schematic diagram for explaining the operation of the substrate pickup mechanism in the transfer block of the first embodiment.

[0045] Fig.14 It is a schematic diagram for explaining the conveyance of substrates in the transfer block of Example 1.

[0046] Fig.15 It is a schematic diagram for explaining the operation of the substrate pickup mechanism in the transfer block of the first embodiment.

[0047] Fig.16 It is a schematic diagram for explaining the operation of the pusher mechanism in the transfer block of Example 1.

[0048] Fig.17 It is a perspective view for explaining the structure of the second posture conversion mechanism of the first embodiment.

[0049] Fig.18 Schematic diagram for explaining the operation of the second posture conversion mechanism of the first embodiment.

[0050] Fig.19 It is a side view for explaining the structure of the single-wafer processing area of ​​Example 1.

[0051] Fig. 20 It is a top view for explaining the structure of the drying chamber of Example 1.

[0052] Fig.21 This is a functional block diagram for explaining the structure of the wet transfer mechanism of the first embodiment.

[0053] Fig. 22 This is a functional block diagram for explaining the structure of the single-chip substrate transfer area of ​​Example 1.

[0054] Fig.23 It is a top view for explaining the structure of the substrate carrying-in mechanism of Example 1.

[0055] Fig.24 It is a top view for explaining the connection of the substrates of Example 1.

[0056] Fig.25 It is a flowchart for explaining the operation of substrate processing in Example 1.

[0057] Fig.26 It is a top view for explaining the flow of the substrate in Example 1.

[0058] Fig. 27 It is a top view for explaining the flow of the substrate in Example 1.

[0059] Fig.28 It is a top view for explaining the flow of the substrate in Example 1.

[0060] Fig.29 It is a top view for explaining the overall structure of the substrate processing apparatus of Example 2.

[0061] Fig.30 It is a side view for explaining the structure of the single-wafer processing area of ​​Example 2.

[0062] Fig.31 It is a side view for explaining the structure of the single-chip substrate conveying area of ​​Example 2.

[0063] Fig.32 It is a flowchart for explaining the actions of substrate processing in Example 2.

[0064] Fig.33 It is a top view for explaining the flow of the substrate in Example 2.

[0065] Fig.34 It is a top view for explaining the flow of the substrate in Example 2.

[0066] Fig.35 It is a top view for explaining the flow of the substrate in Example 2. DETAILED DESCRIPTION

[0067] Embodiments of the present invention will be described below with reference to the accompanying drawings. The substrate processing apparatus of the present invention is an apparatus that performs a batch process for processing a plurality of substrates W at once and then performs a single-wafer process for processing substrates W one by one.

[0068] Example 1

[0069] <1. Overall structure>

[0070] like Figure 1 As shown, the substrate processing apparatus 1 has blocks divided by partitions. That is, the substrate processing apparatus 1 has: a loading and unloading block 3 on which a carrier is placed, the carrier being used to accommodate a substrate; a supply block 5 adjacent to the loading and unloading block 3; a transfer block 7 adjacent to the supply block 5; and a processing block 9 adjacent to the transfer block 7. The supply block 5 is equivalent to the supply block of the present invention, and the transfer block 7 is equivalent to the transfer block 7 of the present invention. The processing block 9 is equivalent to the processing block of the present invention.

[0071] The substrate processing apparatus 1 performs various predetermined processes such as chemical liquid processing, cleaning processing, and drying processing on the substrate W. The substrate processing apparatus 1 adopts a processing method (so-called hybrid method) that combines a batch processing method for processing a plurality of substrates W at once and a single-wafer processing method for processing substrates W one by one. The batch processing method is a processing method for processing a plurality of substrates W arranged in a vertical posture at once. The single-wafer processing method is a processing method for processing substrates W in a horizontal posture one by one.

[0072] For the sake of convenience in this specification, the direction in which the loading and unloading block 3, the supply block 5, the transfer block 7, and the processing block 9 are arranged is referred to as the "front-to-back direction X". The front-to-back direction X extends horizontally. The direction from the supply block 5 toward the loading and unloading block 3 in the front-to-back direction X is referred to as the "front". The direction on the opposite side to the front is referred to as the "rear". The direction orthogonal to the front-to-back direction X is referred to as the "width direction Y". The width direction Y extends horizontally. One direction of the "width direction Y" is appropriately referred to as the "right", and the direction on the opposite side is referred to as the "left". The direction (height direction) orthogonal to the front-to-back direction X and the width direction Y is referred to as the "vertical direction Z". In each figure, the front, back, left, right, top, and bottom are appropriately shown for reference.

[0073] <2. Moving in and out of blocks>

[0074] The loading and unloading block 3 has a carrier holding portion 11, which holds a carrier C, and the carrier C accommodates a plurality of substrates W arranged in a horizontal posture at a predetermined interval in the vertical direction. The carrier holding portion 11 is provided on the outer wall of the loading and unloading block 3 extending in the width direction (Y direction). When viewed from the center of the width direction (Y direction) of the substrate processing device 1, the carrier holding portion 11 includes a carrier holding portion 11 provided on the right and a carrier holding portion 11 provided on the left. The two carrier holding portions 11 are collectively referred to as a loadport.

[0075] A plurality of substrates W (for example, twenty-five) are stacked and accommodated in a carrier C in a horizontal posture at constant intervals. The carrier C accommodating the substrates W to be processed and to be carried into the substrate processing device 1 is first placed on any one of the carrier holding parts 11. The carrier holding part 11 has, for example, two loading tables 15, on which the carrier C is placed. The carrier C is formed with a plurality of grooves (not shown) extending in the horizontal direction, and the plurality of grooves (not shown) are used to accommodate the substrates W in a state where the surfaces of the substrates W are separated from each other. The plurality of grooves are separately arranged in a manner that forms a comb-like shape as a whole. The substrates W are inserted into each groove one by one. As the carrier C, for example, there is a closed FOUP (Front Opening Unify Pod; front-opening wafer transfer box). In the present invention, an open container can also be used as the carrier C.

[0076] <3. Supply Block>

[0077] The supply block 5 has a function of supplying a plurality of substrates W to the subsequent transfer block 7. That is, the transfer block 5 is set at a position sandwiched between the loading and unloading block 3 and the transfer block 7. The supply block 5 has a collective transport mechanism 19, which collectively takes out a plurality of substrates W from the carrier C held by the carrier holding portion 11 in the loading and unloading block 3, and transfers the plurality of substrates W to the transfer block 7. The support 81 extending in the vertical direction Z of the collective transport mechanism 19 is set at a central position in the supply block 5, that is, at a central position in both the X direction and the Y direction, and the collective transport hand 71 moves in the up-down direction, the left-right direction, and the front-back direction with the support 81 as a reference. The supply block 5 has a space of sufficient size so as not to hinder the movement of the collective transport hand 71.

[0078] The collective transport mechanism 19 has the following two functions: collectively taking out a plurality of substrates W from the carrier C held by the carrier holding portion 11 in the loading / unloading block 3 and placing them at the outgoing substrate delivery position P1 of the transfer block 7; and collectively taking in a plurality of substrates W from the return substrate delivery position P4 of the transfer block 7 and returning them to the carrier C held by the carrier holding portion 11 in the loading / unloading block 3. The collective transport mechanism 19 transports the plurality of substrates W from the carrier C to the outgoing substrate delivery position P1 while maintaining the respective positional relationship among the plurality of substrates W accommodated in the carrier C. Similarly, the collective transport mechanism 19 transports the plurality of substrates W from the return substrate delivery position P4 to the carrier C while maintaining the respective positional relationship among the plurality of substrates W arranged at the return substrate delivery position P4. Through the transport of the collective transport mechanism 19, the substrate W to be processed, which is contained in the carrier C, is subjected to various processes by the substrate processing device 1 and then returned to the original carrier C. The collective transport mechanism 19 does not necessarily need to have a mechanism for converting the posture of the plurality of substrates W. The collective transport mechanism 19 in this example transports the plurality of substrates W from the carrier C to the outbound substrate delivery position P1 while maintaining the posture and arrangement pitch of the plurality of substrates W. Therefore, the plurality of substrates W are transported by the collective transport mechanism 19 while being arranged in a horizontal posture at full pitch. This situation is also the same in the substrate transport from the return substrate delivery position P4 to the carrier C performed by the collective transport mechanism 19.

[0079] Reference Figure 2 The structure of the collective transport mechanism 19 will be described. Figure 2 1 is a functional block diagram for explaining the structure of the combined transport mechanism 19. Figure 2 As shown, the transport mechanism 19 includes a support 81 extending in the vertical direction (Z direction) to support each mechanism. The transport mechanism 19 also includes a lifting mechanism 82 that can move up and down. The lifting mechanism 82 is supported by the support 81 so that it can be freely lifted and lowered. The lifting mechanism 82 supports the rotating member 83 so that it can rotate freely. The rotating member 83 can rotate around the rotation axis AX3 parallel to the extension direction (Z direction) of the support 81 when supported by the lifting mechanism 82. The rotation axis AX3 is an imaginary straight line located at the center of the support 81.

[0080] The rotating member 83 supports a freely retractable arm 85a. The arm 85a includes a first arm 84 connected to the rotating member 83 and a second arm 85 connected to the first arm 84. The connecting portion of the first arm 84 in the rotating member 83 is a protrusion extending in a direction away from the rotation center of the rotating member 83, and the first arm 84 is a structure extending in a manner extending the protrusion. The second arm 85 is a structure extending in a manner extending the first arm 84. The rotating member 83 supports the first arm 84 in a manner that the first arm 84 is freely movable in the extension direction of the first arm 84, and the first arm 84 supports the second arm 85 in a manner that the second arm 85 is freely movable in the extension direction of the second arm 85. Therefore, the arm 85a is freely retractable in the extension directions of the first arm 84 and the second arm 85.

[0081] A freely rotatable direction conversion member 86 is provided at the top end of the second arm 85. The direction conversion member 86 supports a track 87 extending in the horizontal direction. Therefore, the collective transport mechanism 19 is configured to change the extension direction of the track 87 by rotating the direction conversion. The direction rotation member 86 rotates around an imaginary line located at the center of the direction conversion member 86 and extending in the vertical direction (Z direction). By this rotation, the collective transport hand 71 can be directed not only toward the loading and unloading block 3 side, but also toward the transfer block 7 side.

[0082] The rail 87 supports the collective transport hand 71 holding a plurality of substrates W at a time so that it can move in the extension direction of the rail 87. Therefore, the collective transport hand 71 can move forward and backward along the rail 87. The position of the rail 87 in the up-down direction can be changed by the lifting mechanism 82. The position on the horizontal plane of the rail 87 can be changed by the arm and the rotating member 83. Therefore, the collective transport hand 71 can move freely in the space within the supply block 5. Moreover, the direction of the rail 87 can be changed by the direction conversion member 86. Therefore, the collective transport hand 71 can move in the front-back direction (X direction) at any position in the space within the supply block 5. Therefore, the collective transport hand 71 can move to the carrier C held by the carrier holding part 11 in the loading and unloading block 3, and can move forward on the rail 87, thereby, the collective transport hand 71 can move to the inside of the carrier C. Moreover, the collective transport hand 71 moves backward on the rail 87, so that the held plurality of substrates W can be taken out from the carrier C. If these actions are performed in reverse order, the collective transport hand 71 can return the held plurality of substrates W to the carrier C. Although the above example is directed to the carrier C, the collective transport hand 71 can also take out or deliver a plurality of substrates W by the same action even at the substrate delivery position.

[0083] The following describes various mechanisms of the combined transport mechanism 19 and a control unit for controlling these mechanisms. The lifting control unit 82a is a structure for controlling the lifting mechanism 82. The rotating mechanism 83a is a mechanism for rotating the rotating member 83 relative to the lifting mechanism 82, and the rotating control unit 83b is a structure for controlling the rotating mechanism 83a. The telescopic mechanism 84a is a mechanism for telescoping the arm 85a in the extension direction, and the telescopic control unit 84b is a structure for controlling the telescopic mechanism 84a. The direction conversion mechanism 86a is a mechanism for rotating the direction conversion member 86 relative to the second arm 85, and the direction conversion control unit 86b is a structure for controlling the direction conversion mechanism 86a. The shifting mechanism 87a is a mechanism for moving the combined transport hand 71 forward and backward relative to the track 87, and the shifting control unit 87b is a structure for controlling the shifting mechanism 87a. The hand driving mechanism 71c is a mechanism for driving the collective transport hand 71 so that the collective transport hand 71 grips a plurality of substrates W or releases the gripped plurality of substrates W. The hand control unit 71d is a configuration for controlling the hand driving mechanism 71c.

[0084] Figure 3 The structure of the collective transport hand 71 is described below. The collective transport hand 71 is configured such that a pair of hand pieces 71a are arranged in the vertical direction (Z direction). The pair of hand pieces 71a are respectively connected to the hand base 71e. The hand base 71e is a structure that can move forward and backward on the rail 87. The number of pairs of hand pieces 71a provided in the collective transport hand 71 is the same as the number of substrates W accommodated in the carrier C. Therefore, twenty-five sets of pairs of hand pieces 71a are provided in the collective transport hand 71. This point is Figure 3 In order to facilitate drawing, the hand piece 71a is reduced.

[0085] <4. Transfer Block>

[0086] The transfer block 7 is arranged adjacent to the rear of the supply block 5. A forward substrate delivery position P1 for placing the substrate W to be processed is set in the transfer block 7, and a plurality of substrates W are moved from the supply block 5 to the forward substrate delivery position P1. The transfer block 7 has: a first posture conversion mechanism PCR, which can access the forward substrate delivery position P1; a substrate pickup mechanism WDB, which receives the substrate W in a vertical posture from the first posture conversion mechanism PCR and arranges the substrate W in a half pitch; and a pusher mechanism 22, which receives the plurality of substrates W from the substrate pickup mechanism WDB and transports the plurality of substrates W to the vertical substrate delivery position P2.

[0087] Figure 4 The structure of the first posture conversion mechanism PCR in this example is described below. Figure 4As shown, the first posture conversion mechanism PCR has a batch hand composed of a pair of clamping hands 69 for clamping the substrate W. Since the clamping hands 69 are structured to clamp the substrate W from both ends of the substrate W, multiple substrates W will not slip off the batch hand even if the batch hand is rotated. The batch hand is constructed by a pair of clamping hands 69 arranged in the vertical direction (Z direction). The pair of clamping hands 69 are respectively connected to a hand base 69a. The hand base 69a can rotate -90° and 90° so that the posture of multiple substrates W in a horizontal posture is changed to a vertical posture. A pair of clamping hands 69 is provided in the batch hand according to the number of substrates W accommodated in the carrier C. Therefore, twenty-five groups of a pair of clamping hands 69 are provided in the batch hand. This point is Figure 4 In order to facilitate drawing, the clamping hand 69 is reduced.

[0088] In addition, the first posture conversion mechanism PCR can also move in the width direction (Y direction). That is, the first posture conversion mechanism PCR can change the posture of the substrate W that can maintain a horizontal posture ( Figure 4 The forward path substrate transfer position P1 is accessed in the posture of the left side of the substrate W, and the posture of the substrate W that can maintain the vertical posture ( Figure 4 The substrate picking mechanism WDB is accessed in the posture on the right side of the device.

[0089] Afterwards, various mechanisms of the first posture conversion mechanism PCR and the control unit for controlling these mechanisms are described. The batch hand driving mechanism 79a is a mechanism for causing each clamping hand 69 to move together, so that the state of the clamping hand 69 changes between a clamping state of clamping a plurality of substrates W and a release state of releasing the clamping of a plurality of substrates W. The batch hand control unit 79b is a structure for controlling the batch hand driving mechanism 79a. The hand base rotation mechanism 79c is a mechanism for rotationally driving the hand base 69a. The posture of the plurality of substrates W is converted from a horizontal posture to a vertical posture by this mechanism. The hand base rotation control unit 79d is a structure for controlling the hand base rotation mechanism 79c.

[0090] Figure 5 The substrate picking mechanism WDB in this example is described. Figure 5 As shown, the substrate pickup mechanism WDB has two support rods 70 extending in the width direction (Y direction). Fifty grooves 70c are provided on each of the support rods 70, and the periphery of the substrate W is embedded in these fifty grooves 70c. The arrangement pitch of the grooves 70c is half pitch. Half pitch refers to the pitch of half the arrangement pitch (full pitch) of the substrates W in the plurality of substrates W accommodated in the carrier C. Figure 5In the figure, one groove 70c in each of the two support rods 70 is emphasized. The groove 70c in the support rod 70 corresponds to the groove 70c in the pair of support rods 70, so that a pair of grooves 70c clamp a single substrate W. The surface and back of the clamped substrate W are orthogonal to the width direction (Y direction). Therefore, the distance from the groove 70c in which one end of the substrate W is embedded to the support body 70a for supporting the support rod 70 is equal to the distance from the groove 70c in which the other end of the substrate W is embedded to the support body 70a. In addition, the pair of support rods 70 can be extended and retracted by a distance equivalent to half the pitch without changing the direction of the clamped substrate W. In addition, the support body 70a itself can move up and down. The pair of support rods 70 and the substrate W clamped by the support rods 70 move up and down as the support body 70a moves up and down.

[0091] Next, various mechanisms of the substrate pickup mechanism WDB and the control unit for controlling these mechanisms are described. The support body lifting mechanism 90a is a mechanism for moving and lifting the support body 70a in the Z direction. The support body lifting control unit 90b is a structure for controlling the support body lifting mechanism 90a. The support rod extension mechanism 90c is a structure for extending and retracting the support rod 70. The support rod extension control unit 90d is a structure for controlling the support rod extension mechanism 90c.

[0092] based on Figures 6 to 16 A case where a plurality of substrates W are transferred in the transfer block 7 will be described. Figure 6 FIG. 1 shows a situation where a plurality of substrates W are held by the collective transport hand 71 of the collective transport mechanism 19 in the supply block 5. The arrangement pitch of the substrates W at this time is the full pitch. This arrangement pitch is the same as the arrangement pitch when the plurality of substrates W are accommodated in the carrier C. Figure 7 As shown, the collective transport mechanism 19 transports the held plurality of substrates W to the outgoing substrate delivery position P1 in the transfer block 7. A path capable of holding twenty-five substrates W collectively is provided at the outgoing substrate delivery position P1. Figure 8 The state where a plurality of substrates W are transferred to the outward substrate taking-over position P1 by the collective transport mechanism 19 is shown.

[0093] Fig. 9 The first posture conversion mechanism PCR is shown to receive a plurality of substrates W from the path in the outward substrate delivery position P1. Fig.10 The first posture conversion mechanism PCR is shown from Fig. 9In this way, as long as the first posture conversion mechanism PCR can leave the outgoing substrate delivery position P1 while holding the plurality of substrates W, the hand base 69a of the first posture conversion mechanism PCR can rotate 90°.

[0094] When the hand base 69a is rotated 90°, as Fig.11 As shown in (a) in the figure, the batch hand and the plurality of substrates W are rotated 90 degrees. As a result, the plurality of substrates W that were in a horizontal posture are changed to a vertical posture. At this time, the support rod 70 of the substrate pickup mechanism WDB is located below the batch hand of the first posture conversion mechanism PCR.

[0095] Fig.11 (b) shows the situation when the support body 70a in the substrate pickup mechanism WDB rises. Fig.11 When the state (a) in FIG. 1 rises, the pair of support rods 70 also rise accordingly. The separation distance in the front-to-back direction (X direction) of the support rod 70 is set to be sufficiently larger than the width of the clamping hand 69 possessed by the first posture conversion mechanism PCR. Therefore, the clamping hand 69 passes through the gap between the pair of support rods 70 without colliding with the support rod 70. However, the separation distance in the front-to-back direction (X direction) of the support rod 70 is set to be sufficiently smaller than the diameter of the substrate W. Therefore, the pair of support rods 70 through which the clamping hand 69 has passed respectively abut against different ends of a plurality of substrates W. At this time, the periphery of the substrate W is embedded in the groove 70c provided on the support rod 70.

[0096] Fig.12 The figure shows a situation where a plurality of substrates W supported by the clamping hand 69 of the first posture conversion mechanism PCR and in a vertical posture abut against a pair of support rods 70. At this time, when the state of the clamping hand 69 in the clamping state is set to the released state, the plurality of substrates W are transferred from the first posture conversion mechanism PCR to the substrate pickup mechanism WDB.

[0097] Fig.13 (a) shows the support body 70a in the substrate pickup mechanism WDB from Fig.12 When the state further rises. When the first posture conversion mechanism PCR transfers the plurality of substrates W arranged at a full pitch to the substrate pickup mechanism WDB, the plurality of substrates W are arranged at a full pitch on a pair of support bars 70. Since fifty grooves 70c are provided at a half pitch on the pair of support bars 70 in the substrate pickup mechanism WDB, the grooves 70c in which the substrates W are embedded and the empty grooves 70c without the substrates W are alternately arranged on the pair of support bars 70.

[0098] Fig.13 (b) in the figure shows Fig.13 In the state (a) in FIG. 1 , a pair of support rods 70 are extended by a distance corresponding to half the pitch relative to the support body 70a in the substrate pickup mechanism WDB. By performing this action, the groove 70c provided in the pair of support rods 70 and the clamping hand 69 of the first posture conversion mechanism PCR deviate by a distance corresponding to half the pitch. In this state, the clamping hand 69 of the first posture conversion mechanism PCR moves in the width direction (Y direction) and rotates 90°, thereby returning to Figure 6 Next, the support body 70a in the substrate pickup mechanism WDB returns to the position in which the plurality of substrates W are supported in a vertical position. Figure 6 Next, the collective transport mechanism 19 takes out a plurality of substrates W from another carrier C different from the carrier C accommodating the plurality of substrates W supported by the substrate pickup mechanism WDB, and transports the plurality of substrates W to the outward substrate delivery position P1. Fig.14 The figure shows a state in which the gripping hand 69 included in the first posture changing mechanism PCR supports a plurality of substrates W located at the forward substrate taking-over position P1.

[0099] when Fig.14 The hand base 69a in the state of Fig.11 When the batch hand and the plurality of substrates W are rotated 90° in the direction opposite to the rotation direction described in (a), the batch hand and the plurality of substrates W are rotated -90°. Therefore, the plurality of substrates W that were in a horizontal posture are changed to a vertical posture. At this time, the support rod 70 of the substrate pickup mechanism WDB is located below the batch hand of the first posture conversion mechanism PCR while holding the plurality of substrates W.

[0100] In this state, when the support body 70a of the substrate pickup mechanism WDB rises, Fig.15 As shown in (a) in FIG. 1 , the plurality of substrates W clamped by the clamping hand 69 of the first posture conversion mechanism PCR are respectively accommodated in the empty grooves 70c of the support rod 70 located in the substrate pickup mechanism WDB. This is because the support body 70a of the substrate pickup mechanism WDB is offset from the clamping hand 69 of the first posture conversion mechanism PCR by a distance equivalent to half the pitch. At this time, when the state of the clamping hand 69 that is in the clamping state is set to the release state, the plurality of substrates W are transferred from the first posture conversion mechanism PCR to the substrate pickup mechanism WDB.

[0101] Fig.15 (b) in the figure shows Fig.15In the state (a) of FIG. 1 , the gripping hand 69 of the first posture conversion mechanism PCR moves upward and leaves the substrate pickup mechanism WDB. Fig.15 As can be seen from (b) in the figure, a plurality of substrates W are arranged at half pitch on the substrate picking mechanism WDB. Two carriers' worth of substrates W (fifty substrates W) are arranged on the substrate picking mechanism WDB. Such an arrangement operation of substrates W is called a batch group. At this time, the substrates W are arranged in a face-to-back manner, in which the device surface on which the circuit is formed in the substrate W and the back surface of the adjacent substrate W (the back surface of the adjacent substrate W opposite to the device surface) are opposite to each other. Afterwards, the clamping hand 69 of the first posture conversion mechanism PCR retreats from the upper part of the substrate picking mechanism WDB and returns to the position where the device surface is formed. Figure 6 The original position shown.

[0102] Fig.16 (a) in the figure shows that Figure 6 The substrate pickup mechanism WDB shown has a pusher mechanism 22 at a lower portion of the support body 70a. The pusher mechanism 22 has a pusher, and parallel grooves arranged at half pitch are provided on the upper surface of the pusher, and the pusher can move up and down. Fig.16 (b) shows the situation when the pusher in the pusher mechanism 22 is raised. Fig.16 When the state (a) in FIG. 1 is raised, the pusher approaches the support rod 70. The separation distance in the front-to-back direction (X direction) of the support rod 70 possessed by the substrate pickup mechanism WDB is set to be sufficiently larger than the width of the pusher possessed by the pusher mechanism 22. Therefore, the pusher passes through the gap between a pair of support rods 70 without colliding with the support rods 70. When the pusher rises further, the plurality of substrates W accommodated in the grooves 70c in the support rod 70 are embedded in the plurality of grooves engraved on the pusher, and move away from the substrate pickup mechanism WDB together with the pusher. Then, the pusher rises further to transport the plurality of substrates W to the vertical substrate handover position P2 set in the transfer block 7. The pusher mechanism 22 is equivalent to the vertical substrate support member of the present invention. In this example, although the pusher mechanism 22 is a structure for moving the pusher up and down, in addition to moving the pusher in the up and down direction (Z direction), the pusher can also be moved in the front-to-back direction (X direction), and the vertical substrate intersection position P2 can also be set at a position different from the substrate picking mechanism WDB in the front-to-back direction (X direction).

[0103] <5. Processing Block>

[0104] The processing block 9 performs various processes on a plurality of substrates W. The processing block 9 is divided into a batch processing area R1, a single-wafer processing area R2, a single-wafer substrate conveying area R3, and a batch substrate conveying area R4, which extend in the front-back direction (X direction). Specifically, the batch processing area R1 is arranged on the left side of the processing block 9. The single-wafer processing area R2 is arranged on the right side of the processing block 9. The single-wafer substrate conveying area R3 is arranged at a position sandwiched between the batch processing area R1 and the single-wafer processing area R2, that is, arranged in the center of the processing block 9. The batch substrate conveying area R4 is arranged at the leftmost side of the processing block 9.

[0105] <5.1 Batch Processing Area>

[0106] The batch processing area R1 in the processing block 9 is a rectangular area extending in the front-rear direction (X direction). One end side (front side) of the batch processing area R1 is adjacent to the transfer block 7. The other end side of the batch processing area R1 extends in a direction away from the transfer block 7 (rear side).

[0107] The batch processing area R1 mainly has a batch processing section for performing batch processing. Specifically, the batch processing area R1 has a plurality of batch processing units BPU1 to BPU3 arranged in the direction in which the batch processing area R1 extends for immersion processing of a plurality of substrates W at a time. The first batch processing unit BPU1 is adjacent to the transfer block 7 from the rear. The second batch processing unit BPU2 is adjacent to the first batch processing unit BPU1 from the rear. The third batch processing unit BPU3 is adjacent to the second batch processing unit BPU2 from the rear. Moreover, a posture conversion unit VHU is provided at a position farther from the transfer block 7 than the batch processing units BPU1 to BPU3, and the posture conversion unit VHU is used to convert the postures of the plurality of substrates W that are in a vertical posture into a horizontal posture at a time. In this way, the first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3 and the posture conversion unit VHU are arranged in sequence in the extension direction (X direction) of the batch processing area R1.

[0108] Specifically, the first batch processing unit BPU1 includes: a batch chemical liquid processing tank CHB1, which performs chemical liquid processing on a lot (a group of fifty substrates W arranged at half pitch) at a time; and a lifter LF1, which raises and lowers the lot. The batch chemical liquid processing tank CHB1 performs an acid treatment on the lot. Specifically, the acid treatment may be a phosphoric acid treatment, but it may also be a treatment using other acids. The phosphoric acid treatment applies an etching treatment to the plurality of substrates W constituting the lot. The etching treatment, for example, chemically etches the nitride film on the surface of the substrate W.

[0109] The first batch chemical liquid processing tank CHB1 contains chemical liquid such as phosphoric acid solution. The batch chemical liquid processing tank CHB1 supplies chemical liquid from the bottom to the top and convects in the tank, for example. The lift LF1 can be lifted and lowered in the vertical direction (Z direction). Specifically, the lift LF1 is lifted and lowered between a processing position and a handover position, the processing position being a position located inside the batch chemical liquid processing tank CHB1, and the handover position being a position located above the batch chemical liquid processing tank CHB1. The lift LF1 holds a batch consisting of substrates W in the vertical direction. The lift LF1 hands over the batch between the lift LF1 and the transport mechanism WTR at the handover position. When the lift LF1 descends from the handover position to the processing position while holding the batch, the entire area of ​​the substrate W is located below the liquid surface of the chemical liquid. When the lift LF1 rises from the processing position to the handover position while holding the batch, the entire area of ​​the substrate W is located below the liquid surface of the chemical liquid.

[0110] Specifically, the second batch processing unit BPU2 has a batch chemical liquid treatment tank CHB2 and a lift LF2 for lifting the batch. The batch chemical liquid treatment tank CHB2 has the same structure as the above-mentioned batch chemical liquid treatment tank CHB1. That is, the batch chemical liquid treatment tank CHB2 contains the above-mentioned chemical liquid and is provided with a lift LF2 that lifts and lowers between the processing position and the handover position. The batch chemical liquid treatment tank CHB2 performs the same treatment on the batch as the batch chemical liquid treatment tank CHB1. The substrate processing device 1 of this example has a plurality of treatment tanks that can perform the same chemical liquid treatment. The reason for this is that phosphoric acid treatment requires more time than other treatments. Phosphoric acid treatment requires a long time (for example, 60 minutes). Therefore, the device of this example can perform acid treatment in parallel through a plurality of batch chemical liquid treatment tanks. Therefore, the batch of the processing target is subjected to acid treatment in either the batch chemical liquid treatment tank CHB1 or the batch chemical liquid treatment tank CHB2. According to this structure, the processing capacity of the device can be increased.

[0111] Specifically, the third batch processing unit BPU3 includes: a batch rinse processing tank ONB for containing rinse liquid; and an elevator LF3 for lifting and lowering the batch. The batch rinse processing tank ONB has the same structure as the batch chemical liquid processing tank CHB1 described above. That is, the batch rinse processing tank ONB contains rinse liquid and is equipped with an elevator LF3. The batch rinse processing tank ONB is different from other processing tanks in that it is provided to contain pure water and clean the chemical liquid attached to the plurality of substrates W. In the batch rinse processing tank ONB, when the resistivity of the pure water in the tank rises to a specified value, the chemical liquid processing is terminated.

[0112] Thus, the batch chemical liquid processing tank CHB1 and the batch chemical liquid processing tank CHB2 in Example 1 are closer to the transfer block 7 than the batch rinse processing tank ONB.

[0113] The posture conversion unit VHU comprises: a VHU pusher mechanism 23 that receives a batch of substrates W in a vertical posture from a transport mechanism WTR; and a second posture conversion mechanism 20 that receives a batch from the VHU pusher mechanism 23 and converts the posture of a plurality of substrates W from a vertical posture to a horizontal posture.

[0114] The VHU pusher mechanism 23 has the same structure as the pusher mechanism 22 described above, and has a pusher that moves up and down. The pusher has fifty grooves arranged in parallel at half pitch. The transport mechanism WTR can insert the substrates W one by one into the grooves provided on the pusher.

[0115] Fig.17 The second posture conversion mechanism 20 of this example is described. The second posture conversion mechanism 20 has: a pair of horizontal holding parts 20B extending in the longitudinal direction (Z direction); and a pair of vertical holding parts 20C extending in the same direction. The support table 20A has a support surface, which extends in the XY plane and is used to support the horizontal holding part 20B and the vertical holding part 20C. The rotation drive mechanism 20D is a structure for rotating the support table 20A by 90°. Along with the rotation of the support table 20A, the horizontal holding part 20B and the vertical holding part 20C are also rotated by 90° to become components extending in the horizontal direction. Fig.18 2 is a schematic diagram for explaining the operation of the second posture conversion mechanism 20. Fig.17 as well as Fig.18 Describe the structure of each part.

[0116] The horizontal holding part 20B supports the plurality of substrates W in a horizontal posture from the bottom. That is, the horizontal holding part 20B has a comb-shaped structure having a plurality of recesses corresponding to the substrates W to be supported. The recesses are parallel to each other and have an elongated structure for placing the peripheral edge of the substrate W. In addition, the recesses are arranged at half pitch.

[0117] The vertical holding portion 20C supports a plurality of substrates W in a vertical posture. That is, the vertical holding portion 20C has a comb-shaped structure having a plurality of V-grooves corresponding to the substrates W to be supported. The V-grooves are parallel to each other and form an elongated structure for the peripheral portion of the substrate W to be embedded. In addition, the V-grooves are arranged at half pitch.

[0118] A pair of horizontal holding parts 20B and a pair of vertical holding parts 20C extending in the longitudinal direction (Z direction) are arranged along an imaginary circle corresponding to the substrate W in a horizontal posture in a manner of surrounding the substrate W to be held. The pair of horizontal holding parts 20B are separated by the diameter of the substrate W, and hold one end of the substrate W and the other end farthest from the one end. In this way, the pair of horizontal holding parts 20B support the substrate W in a horizontal posture. On the other hand, the pair of vertical holding parts 20C are separated by a distance shorter than the diameter of the substrate W, and support a specified part of the substrate W and a specific part located near the specified part. In this way, the pair of vertical holding parts 20C support the substrate W in a vertical posture. The pair of horizontal holding parts 20B are located at the same position in the left-right direction (Y direction), and the pair of vertical holding parts 20C are also located at the same position in the left-right direction (Y direction). The pair of vertical holding parts 20C are arranged on the side closer to the direction (left direction) in which the support table 20A rotates and falls than the pair of horizontal holding parts 20B.

[0119] The rotation drive mechanism 20D supports the support table 20A so that the support table 20A can be rotated at least 90° around the horizontal axis AX2 extending in the front-back direction (X direction). When the support table 20A in the vertical state is rotated 90°, the support table 20A becomes horizontal, and the posture of the plurality of substrates W located on the support table 20A is converted from the vertical posture to the horizontal posture.

[0120] Reference Fig.18 The operations of the second posture conversion mechanism 20 and the VHU pusher mechanism 23 will be described. Fig.18 (a) in the figure shows the state in which the transport mechanism WTR transfers the batch to the VHU pusher mechanism 23. At this time, the vertical support table 20A in the second posture conversion mechanism 20 has a horizontally extending vertical holding portion 20C, and the horizontal holding portion 20B and the vertical holding portion 20C are located below the pusher of the VHU pusher mechanism 23. In this state, when the pusher of the VHU pusher mechanism 23 descends, each substrate W in a vertical posture held on the pusher is embedded in each V groove of the vertical holding portion 20C. In this way, a plurality of substrates W are transferred to the second posture conversion mechanism 20 by the VHU pusher mechanism 23. Fig.18 (b) in FIG. 1 shows a state where a plurality of substrates W are supported by the vertical holding portion 20C in the second posture conversion mechanism 20 .

[0121] When the support table 20A is Fig.18 When the state (b) is rotated 90°, the support table 20A becomes horizontal, and the vertical holding portion 20C becomes extended in the vertical direction. In this way, each substrate W embedded in each V groove of the vertical holding portion 20C is rotated 90° while maintaining the positional relationship with each other. Fig.18(c) in FIG. 1 shows a situation where a plurality of substrates W are supported by a pair of horizontal holding portions 20B arranged on a support table 20A in a horizontal state. Fig.18 (c) shows a state where the second posture conversion mechanism 20 makes a plurality of substrates W stand by at the horizontal substrate taking-over position P3. The horizontal substrate taking-over position P3 is a position where the first robot CR1 described later receives the substrates W in the horizontal posture.

[0122] <5.2 Single chip processing area>

[0123] The single-wafer processing region R2 in the processing block 9 is a rectangular block extending in the front-to-back direction (X direction). One end side (front side) of the single-wafer processing region R2 is adjacent to the transfer block 7. The other end side of the single-wafer processing region R2 extends in a direction away from the transfer block 7 (rear side).

[0124] The single-wafer processing region R2 in the processing block 9 includes a drying chamber 37 for mainly performing a drying process and a wet transport mechanism WR for transporting a substrate W (in a horizontal position) before the drying process to each drying chamber 37. Figure 1 The positional relationship between the wet transfer mechanism WR and the drying chamber 37 will be described. Figure 1 It can be seen that in the single-wafer processing region R2, the drying chamber 37 is provided at a position adjacent to the transfer block 7, and the wet transfer mechanism WR is provided at a position adjacent to the rear of the drying chamber 37. In addition, another drying chamber 37 is provided in the single-wafer processing region R2. The drying chamber 37 is provided at a position adjacent to the rear of the wet transfer mechanism WR. Therefore, the wet transfer mechanism WR is arranged at a position sandwiched by the two drying chambers 37. The wet transfer mechanism WR can access these drying chambers 37.

[0125] The drying chamber 37 is described. The drying chamber 37 is a supercritical fluid chamber, and specifically, the substrate W is dried by carbon dioxide that becomes a supercritical fluid. Substances other than carbon dioxide can also be used as supercritical fluids. The supercritical state can be obtained by placing carbon dioxide under a specific critical pressure and critical temperature. The specific pressure is 7.38 MPa and the temperature is 31°C. In the supercritical state, since the surface tension of the fluid becomes zero, the influence of the gas-liquid interface on the circuit pattern on the surface of the substrate will not be generated. Therefore, as long as the substrate W can be dried by a supercritical fluid, the circuit pattern on the substrate can be prevented from collapsing, that is, the so-called pattern collapse can be prevented.

[0126] The structure of the drying chamber 37 is further described. Figure 1As shown, the drying chamber 37 has: an inlet 37a for carrying the substrate W into the chamber; and an outlet 37b for taking the substrate W out of the chamber. The inlet 37a is provided at a side wall of the drying chamber 37 opposite to the wet transport mechanism WR. The outlet 37b is provided at a side wall of the drying chamber 37 opposite to the single-piece substrate transport region R3. A shutter capable of closing the passage of the substrate W is provided at either the inlet 37a or the outlet 37b. During the drying process of the substrate W, each shutter closes the corresponding passage.

[0127] The drying chamber 37 has a circular support member 37c inside, and supports the substrate W via pins 37d abutted by the substrate W. The support member 37c is provided with three pins 37d, and these pins 37d abut against three different positions in the peripheral portion of the substrate W introduced into the drying chamber 37. In this way, the substrate W is supported at three points in the drying chamber 37. When the drying chamber 37 dries the substrate W, a supercritical fluid is generated inside the chamber. The drying chamber 37 has a structure with sufficient pressure resistance to make the inside of the chamber reach the critical pressure.

[0128] Fig.19 1 is a side view of the single-wafer processing region R2 viewed from the single-wafer substrate transfer region R3. The single-wafer processing region R2 is provided with two stacked bodies, and the stacked bodies are composed of three stacked drying chambers 37. The wet transfer mechanism WR is provided at a position sandwiched between the two stacked bodies, and can carry the substrate W into each drying chamber 37 constituting each stacked body. At this time, the substrate W is carried in through the carrying port 37a of the drying chamber 37.

[0129] A wet substrate transport region is provided between the two stacked bodies to ensure a movable range of the wet transport mechanism WR. The wet transport mechanism WR is movable within the wet substrate transport region.

[0130] Fig. 20 (a) in FIG. 3 shows a situation in which the wet transport mechanism WR carries the substrate W to be dried into the drying chamber 37. Fig. 20 As shown, the wet transport mechanism WR includes a pair of wet arms 74 for holding the substrate W before drying. The wet arms 74 are capable of entering the chamber through the carrying-in port 37a in the drying chamber 37 while holding the substrate W and transferring the substrate W to the supporting member 37c. The wet arm base 74a is a structure for supporting the pair of wet arms 74.

[0131] Reference Fig. 20 As can be seen from (a) in FIG. 1 , the pin 37d of the supporting member 37c is provided at a position away from the wet arm 74. Therefore, the pin 37d does not collide with the wet arm 74 that transfers the substrate W inside the chamber.

[0132] In addition, the purpose of providing the wet transport mechanism WR associated with the wet arm 74 is to carry the substrate W before the drying process into the drying chamber 37. Therefore, the substrate processing device 1 of this example has a mechanism different from the wet transport mechanism WR, and its purpose is to carry the substrate W after the drying process out of the drying chamber 37. Since the position of the pin 37d in the support member 37c is most suitable for the wet arm 74 to carry the substrate W, when the substrate W after the drying process is carried out of the chamber, the arm holding the substrate W may collide with the pin 37d. Fig. 20 As shown in (b) of FIG. 1 , in order to reliably carry the substrate W out of the chamber, the apparatus of this example includes: a support member rotating mechanism 36a that rotates the support member 37c; and a support member rotation control unit 36b that controls the support member rotating mechanism 36a. When the support member 37c is rotated by the support member rotating mechanism 36a, the pin 37d on the support member 37c moves around the center of the circular support member 37c. Therefore, when the substrate W is carried out of the chamber, the pin 37d can be moved to a position that does not hinder the carrying out of the substrate W.

[0133] Fig.21 1 is a functional block diagram for explaining the structure of the wet transport mechanism WR. The wet transport mechanism WR is a mechanism that receives the substrate W before drying from the single-chip substrate transport region R3 described later and transfers it to the drying chamber 37. Fig.21 As shown, the wet transport mechanism WR has a WR support 101 that supports each mechanism and extends in the vertical direction (Z direction). In addition, the wet transport mechanism WR also has a WR lifting mechanism 102 that can move up and down. The WR lifting mechanism 102 is supported by the WR support 101 so that it can be freely raised and lowered. The WR lifting mechanism 102 supports the WR rotating member 183 so that it can rotate freely. The WR rotating member 183 can rotate around the rotation axis AX4 parallel to the extension direction (Z direction) of the WR support 101 while being supported by the WR lifting mechanism 102. The rotation axis AX4 is an imaginary straight line located at the center of the WR support 101.

[0134] The wet transport mechanism WR supports a freely retractable WR arm 185a. The WR arm 185a includes: a first arm 184 connected to the WR rotating member 183; and a base (second arm) 74a connected to the first arm 184. The connecting portion of the first arm 184 in the WR rotating member 183 is a protrusion extending in a direction away from the rotation center of the WR rotating member 183, and the first arm 184 is a structure extending in a manner extending the protrusion. The wet arm base 74a is a structure extending in a manner extending the first arm 184. The WR rotating member 183 supports the first arm 184 in a manner that the first arm 184 can move freely in the extension direction of the first arm 184, and the first arm 184 supports the wet arm base 74a in a manner that the wet arm base 74a can move freely in the extension direction of the wet arm base 74a. Therefore, the WR arm 185a can freely retract and retract in the extension direction of the first arm 184 and the wet arm base 74a.

[0135] The following describes the various mechanisms of the wet transport mechanism WR and the control unit for controlling these mechanisms. The WR lifting control unit 182a is a structure for controlling the WR lifting mechanism 102. The WR rotating mechanism 183a is a mechanism for rotating the WR rotating member 183 relative to the WR lifting mechanism 102, and the WR rotation control unit 183b is a structure for controlling the WR rotating mechanism 183a. The telescopic mechanism 184a is a structure for telescoping the WR arm 185a in the extension direction, and the telescopic control unit 184b is a structure for controlling the telescopic mechanism 184a. The WR hand drive mechanism 171c is a mechanism that drives the wet arm 74 to hold only one substrate W in a horizontal position or release the grip of the substrate W. The hand control unit 171d is a structure for controlling the WR hand drive mechanism 171c.

[0136] Thus, the wet conveying mechanism WR of this example simplifies the above-mentioned collective conveying mechanism 19 and is configured without the rail 87, the direction changing member 86, and various mechanisms and control units related to the operation. The present invention is not limited to this, and may be configured with these members or various mechanisms and control units related to these members.

[0137] The wet transfer mechanism WR is configured to access any of the six drying chambers 37 constituting the chamber stack provided on the left and right sides of the wet transfer mechanism WR, and to carry the substrate W to be dried into any of the drying chambers 37 .

[0138] <5.3 Single-chip substrate handling area>

[0139] The single-wafer substrate transfer area R3 in the processing block 9 is a rectangular area extending in the front-to-back direction (X direction). The single-wafer substrate transfer area R3 is sandwiched between the batch processing area R1 and the single-wafer processing area R2, with one end adjacent to the transfer block 7 and the other end extending in a direction away from the transfer block 7.

[0140] like Fig. 22 As shown, the single-piece substrate transfer region R3 includes: a first robot CR1 capable of accessing a second posture conversion mechanism 20 located at a horizontal substrate delivery position P3 provided in the batch processing region R1; and a second robot CR2 provided above the first robot CR1.

[0141] The single-chip substrate conveying area R3 is divided into an upper and lower structure by a partition wall. The first robot CR1 is set in the lower area, and the second robot CR2 is set in the upper area. In this way, since the first robot CR1 and the second robot CR2 are set in different areas, the robot on one side will not hinder the substrate conveying of the robot on the other side.

[0142] The structure of the lower partition in the single-piece substrate transfer area R3 is described. This partition faces the second posture conversion mechanism 20 located at the horizontal substrate delivery position P3 in the batch processing area R1, faces the bottommost drying chamber 37 (more specifically, the chamber's unloading port 37b) of the drying chamber 37 constituting the stack, faces the wet transfer mechanism WR, and faces the return substrate delivery position (more precisely, the first return substrate delivery position P4a). The first robot CR1 transports the substrate W between the second posture conversion mechanism 20 located at the horizontal substrate delivery position P3, the bottommost drying chamber 37, the wet transfer mechanism WR, and the first return substrate delivery position P4a in the transfer block 7. Similar to the outgoing substrate delivery position P1, the first return substrate delivery position P4a is a path that can hold a plurality of substrates W at full pitch. The first return substrate delivery position P4a is located below the outgoing substrate delivery position P1.

[0143] The first robot CR1 has: a CR wet arm 72 that supports the substrate W before the drying process (horizontal posture); and a dry arm 73a that holds the substrate W after the drying process (horizontal posture). The CR wet arm 72 and the dry arm 73a are mounted on a single robot, and the CR wet arm 72 is always located below the dry arm 73a. With this structure, the CR wet arm 72 that supports the wet substrate W will not drip liquid toward the dry arm 73a, so that the dry state of the dry arm 73a can be reliably maintained. The first robot CR1 uses the CR wet arm 72 when transporting the substrate W from the second posture conversion mechanism 20 located at the horizontal substrate transfer position P3 to the wet transport mechanism WR. The first robot CR1 uses the dry arm 73a when transporting the substrate W from the bottom drying chamber 37 to the first return substrate transfer position P4a.

[0144] A robot guide rail 97a capable of guiding the first robot CR1 is provided on the floor of the lower section of the substrate transfer region R3. Since the robot guide rail 97a extends in the front-to-back direction (X direction), the first robot CR1 can also move in the front-to-back direction (X direction) along the robot guide rail 97a.

[0145] The following describes the various mechanisms and control units related to the first robot CR1. The dry arm drive mechanism 92a is a mechanism for driving the dry arm 73a, and the dry arm drive control unit 92b controls the dry arm drive mechanism 92a. The CR wet arm drive mechanism 93a is a mechanism for driving the CR wet arm 72, and the CR wet arm drive control unit 93b controls the CR wet arm drive mechanism 93a. The sliding mechanism 94a is a mechanism for moving the first robot CR1 along the robot guide rail 97a, and the sliding control unit 94b controls the sliding mechanism 94a.

[0146] The structure of the upper partition in the single-piece substrate conveying area R3 is described. This partition faces the topmost and middle-layer drying chambers 37 (more specifically, the chamber's unloading port 37b) of the drying chambers 37 constituting the stack, and faces the return substrate handover position (more precisely, the second return substrate handover position P4b). The second robot CR2 conveys the substrate W between the topmost or middle-layer drying chamber 37 and the second return substrate handover position P4b in the transfer block 7. Similar to the outgoing substrate handover position P1, the second return substrate handover position P4b is a path that can hold a plurality of substrates W at full pitch. The second return substrate handover position P4b is located on the upper side of the outgoing substrate handover position P1.

[0147] The second robot CR2 has a dry arm 73b that holds the substrate W after drying (in a horizontal position). A robot guide rail 97b that can guide the second robot CR2 is provided on the floor of the upper section in the single-piece substrate transfer area R3. Since the robot guide rail 97b extends in the front-to-back direction (X direction), the second robot CR2 can also move in the front-to-back direction (X direction) along the robot guide rail 97b.

[0148] The following describes the various mechanisms and control units related to the second robot CR2. The dry arm drive mechanism 95a is a mechanism for driving the dry arm 73b, and the dry arm drive control unit 95b controls the dry arm drive mechanism 95a. The sliding mechanism 96a is a mechanism for moving the second robot CR2 along the robot guide rail 97b, and the sliding control unit 96b controls the sliding mechanism 96a.

[0149] Fig.23 The first robot CR1 is shown unloading a substrate W after drying from the lowermost drying chamber 37. The dry arm 73a is configured to enter the drying chamber 37 through the unloading port 37b and take the substrate W from the supporting member 37c. The base 73m is a structure for supporting a pair of dry arms 73a.

[0150] Reference Fig.23 It can be seen that the pin 37d in the supporting member 37c is disposed at a position away from the dry arm 73a. Therefore, the pin 37d does not collide with the dry arm 73a that comes to take in the substrate W in the chamber. In addition, since the pin 73d can be rotated and moved by the supporting member rotating mechanism 36a, when the pin 37d is located at a position where it will collide with the dry arm 73a, the position of the pin 37d can be appropriately changed before the dry arm 73a is introduced into the unloading port 37b, so that the pin 37d does not collide with the dry arm 73a.

[0151] exist Fig.23 The CR wet arm 72 provided in the first robot CR1 is also described. The CR wet arm 72 can be rotated and moved relative to the dry arm 73a by the CR wet arm driving mechanism 93a. Fig.23 In the figure, the CR wet arm 72 is rotated 90 degrees relative to the dry arm 73a so as not to hinder the dry arm 73a from conveying the substrate W.

[0152] Fig.24 (a) in the figure shows a case where the CR wet arm 72 provided in the first robot CR1 is located at a position overlapping with the dry arm 73a. The dry arm 73a is a structure for holding both ends of the substrate W, while the CR wet arm 72 is a single plate-shaped structure. Therefore, the substrate W is transported while being placed on the CR wet arm 72.

[0153] Fig.24 (b) in the figure illustrates the situation when the first robot CR1 transfers the substrate W to be dried and processed to the wet transport mechanism WR. The CR wet arm 72 is provided with tabs 72a at three locations of the plate-like component. The tabs 72a are structures for temporarily fixing the peripheral edge of the substrate W when the CR wet arm 72 transports the substrate W. When the substrate W is transferred from the first robot CR1 to the wet transport mechanism WR, the CR wet arm 72 holding the substrate W is arranged in a space surrounded by a pair of wet arms 74. In this state, the substrate W is gripped by the wet transport mechanism WR, thereby releasing the CR wet arm 72 from holding the substrate W. In this way, the substrate W is transferred from the first robot CR1 to the wet transport mechanism WR.

[0154] Fig.24 (b) in FIG. 1 also illustrates the dry arm 73a provided in the first robot CR1. The dry arm 73a can be rotated and moved relative to the CR wet arm 72 by the dry arm driving mechanism 92a. Fig.24 In (b), the dry arm 73 a is rotated 90 degrees relative to the CR wet arm 72 , so that the CR wet arm 72 does not hinder the conveyance of the substrate W.

[0155] Fig.23 1 is a diagram for explaining the first robot CR1, and therefore, the first robot CR1 is a structure having a CR wet arm 72. When the second robot CR2 carries out the substrate W after the drying process from the drying chamber 37 of the uppermost layer or the middle layer, the second robot CR2 which does not have the CR wet arm 72 uses the dry arm 73b to carry out the substrate W after the drying process from the drying chamber 37. That is, the second robot CR2 is different from the first robot CR1 in that it does not have the CR wet arm 72, but the movement of the dry arm 73b in the second robot CR2 is the same as the dry arm 73a in the first robot CR1. In addition, the situation that the pin 37d in the drying chamber 37 of the uppermost layer or the middle layer rotates and avoids the dry arm 73b is also the same as the drying chamber 37 of the lowermost layer.

[0156] <5.4 Batch substrate handling area>

[0157] The batch substrate transfer area R4 in the processing block 9 is a rectangular area extending in the front-rear direction (X direction). The batch substrate transfer area R4 is set along the outer edge of the batch processing area R1, one end side extends to the transfer block 7, and the other end side extends in a direction away from the transfer block 7.

[0158] A transport mechanism WTR for transporting a plurality of substrates W (vertical posture) at a time is provided in the batch substrate transport area R4. The transport mechanism WTR transports a plurality of substrates W (batches) arranged at half pitch between the vertical substrate handover position P2 set in the transfer block 7, each batch processing unit BPU1 to BPU3, and the posture conversion unit VHU. The transport mechanism WTR is configured to be able to reciprocate in the front-to-back direction (X direction) throughout the transfer block 7 and the processing block 9. That is, the transport mechanism WTR can move not only to the processing block 9, but also to the vertical substrate handover position P2 in the transfer block 7. The transport mechanism WTR is equivalent to the batch substrate transport mechanism of the present invention.

[0159] The transport mechanism WTR has a pair of hands 23 for holding the batch. The pair of hands 23 has a rotation axis, for example, facing the width direction (Y direction), and swings around the rotation axis. The pair of hands 23 clamps both ends of a plurality of substrates W constituting the batch. The transport mechanism WTR delivers the batch between the vertical substrate delivery position P2 in the transfer block 7, the lifts LF1 to LF3 belonging to the batch processing units BPU1 to BPU3, and the VHU pusher 23a in the posture conversion unit VHU.

[0160] The substrate processing device 1 of this example has: a CPU (Central Processing Unit) 89a, which controls the above-mentioned various parts, various mechanisms and various processing parts; and a storage unit 89b, which stores various upper parts required for the processing process such as programs and set values. In addition, the specific structure of the CPU is not particularly limited. There can be one CPU in the entire device, or one or more CPUs in each block. The same is true for the storage unit 89b. The control performed by the CPU is, for example, control related to the actions of the collective transport mechanism 19, the first posture conversion mechanism PCR, the substrate picking mechanism WDB, the batch processing units BPU1 to BPU3, the posture conversion unit VHU, the wet transport mechanism WR, the first robot CR1, the second robot CR2 and the transport mechanism WTR.

[0161] <Substrate Processing Flow>

[0162] Fig.25 1 is a flowchart for explaining the process of substrate processing in this example. The substrate processing in this example performs various processes related to surface etching of a substrate W in a semiconductor device manufacturing process, for example. The process of substrate processing will be specifically explained below along this flowchart.

[0163] Step S11: The carrier C accommodating the substrate W to be processed is set in the carrier holding portion 11. The plurality of substrates W are taken out from the carrier C by the collective transport mechanism 19 and transported to the outward substrate delivery position P1.

[0164] Step S12: The plurality of substrates W are transferred to the first posture conversion mechanism PCR. The first posture conversion mechanism PCR converts the posture of the substrate W from the horizontal posture to the vertical posture.

[0165] Step S13: The plurality of substrates W whose postures are converted to the vertical posture are transferred to the pusher mechanism 22. The pusher mechanism 22 cooperates with the substrate pickup mechanism WDB to change the arrangement pitch of the full-pitch substrates W to a half-pitch, thereby performing batch grouping.

[0166] Step S14: The plurality of substrates W conveyed to the vertical substrate taking-over position P2 are conveyed to the batch processing region R1 by the substrate conveying mechanism WTR. The plurality of substrates W are subjected to various liquid processes in a state of constituting a batch.

[0167] Step S15: The plurality of substrates W conveyed to the posture conversion unit VHU by the substrate conveying mechanism WTR are transferred to the second posture conversion mechanism 20. The second posture conversion mechanism 20 converts the posture of the substrate W from the vertical posture to the horizontal posture, and makes the plurality of substrates W stand by at the horizontal substrate transfer position P3.

[0168] Fig.26 The substrate transport from step S11 to step S15 is described. Fig.26 In each of the processes shown, a plurality of substrates W are transported together.

[0169] Step S16: The first robot CR1 in the single-wafer processing area R3 uses the CR wet arm 72 to receive a substrate W from the second posture conversion mechanism 20, and transfers the substrate W to the wet transfer mechanism WR in the single-wafer processing area R2 (see Fig.24 (b) in the figure.

[0170] Step S17: The wet transport mechanism WR carries the substrate W to be dried into any of the empty drying chambers 37 (drying chambers 37 not being dried) located at the top, middle, or bottom. The drying chamber 37 performs drying on the carried substrate W.

[0171] Step S18: The substrate W after drying is carried out of the chamber by the first robot CR1 or the second robot CR2. Specifically, the substrate W in the drying chamber 37 at the bottom is carried to the first return substrate delivery position P4a by the dry arm 73a of the first robot CR1. In addition, the substrate W in the drying chamber 37 at the top and middle layers is carried to the second return substrate delivery position P4b by the second robot CR2.

[0172] Fig. 27 The substrate transport from step S16 to step S18 is described. Fig. 27 In each process shown, the substrate W is transported one by one. Fig. 27 The case where the substrate W in the lowermost drying chamber 37 is conveyed to the first return substrate taking-over position P4 a is illustrated.

[0173] Step S19: Repeat the above steps S16 to S18 several times. When a specified number of substrates W are filled into the path arranged at the first return substrate transfer position P4a or the second return substrate transfer position P4b, the substrates W in the path are grasped by the transport mechanism 19 and returned to the original carrier C.

[0174] Fig.28 FIG. 2 shows a situation where a plurality of substrates W are transported together in step S19. Fig.28 The following is an example in which a plurality of substrates W are conveyed from the first return substrate taking-over position P4a. In this way, the substrate processing performed by the substrate processing apparatus 1 of this example is completed.

[0175] As described above, according to this example, substrates W are taken out from the carrier C that accommodates a plurality of substrates W in a horizontal posture, and the postures of the substrates W are collectively converted from the horizontal posture to the vertical posture by the first posture conversion mechanism PCR. Then, the plurality of substrates W are batch processed by the batch processing area R1 while maintaining the vertical posture, and the postures of the substrates W are collectively converted from the vertical posture to the horizontal posture by the second posture conversion mechanism 20. Thereafter, the substrates W are processed individually by the single-piece processing area R2 while maintaining the horizontal posture. Specifically, the single-piece processing is substrate drying processing. The single-piece processing area R2 of the present invention has: a wet transport mechanism WR that transports the wet substrate W to be dried to the drying chamber 37; and a first robot CR1 and a second robot CR2 that transport the dry substrate W after the drying processing to the drying chamber 37. With this configuration, since the substrates W can be carried in and out of the drying chamber 37 by different mechanisms, the transport of the substrates W will not stagnate around the drying chamber 37. According to the present invention, since the drying chambers 37 are stacked in the vertical direction and are configured so that substrates around the drying chambers 37 can be smoothly conveyed, a substrate processing apparatus can be provided that can accommodate more drying chambers on the same floor area as conventional apparatuses.

[0176] Example 2

[0177] Next, the substrate processing apparatus 2 of the second embodiment is described. The difference from the apparatus of the first embodiment is that the substrate processing apparatus 2 of this example is provided with a third robot CR3 and a fourth robot CR4 in the lower area of ​​the single-piece substrate transfer region R3. The specific apparatus structure will be described later.

[0178] Fig.29 The overall structure of the substrate processing apparatus 2 is described. The loading and unloading block 3, the supply block 5, and the transfer block 7 in the substrate processing apparatus 2 are the same as those of the apparatus in Example 1. In addition, the batch processing area R1 and the batch substrate transfer area R4 in the processing block 9 of this example are also the same as those of Example 1.

[0179] <Single chip processing area>

[0180] Fig.30 1 is a side view of the single-wafer processing area R2 for explaining the present example. The single-wafer processing area R2 of the present example has six single-wafer type substrate processing chambers 6. The present example is similar to the first embodiment in that three substrate processing chambers are stacked to form a stacked body; there are two stacked bodies; and a wet transfer mechanism WR is provided at a position sandwiched between the two stacked bodies.

[0181] Unlike Example 1, a stack located in the single-chip processing area R2 of this example and located away from the transfer block 7 is provided with a substrate drying pre-processing chamber 38 for performing a pre-processing before drying. The substrate drying pre-processing chamber 38 supplies IPA (isopropyl alcohol) to the surface of the substrate to be dried and performs a preparatory process for drying. The supplied liquid is not limited to IPA, but may also be a mixture of IPA and water. The substrate drying pre-processing chamber 38 is provided at the bottom layer of the stack. Fig.29 The top view of FIG. 1 shows the single-wafer processing chamber at the bottom of the stack in the single-wafer processing region R2. Fig.29 The wet transfer mechanism WR is located between the drying chamber 37 provided on the transfer block 7 side and the substrate drying pre-processing chamber 38 provided at a position away from the transfer block 7 .

[0182] The substrate drying pre-processing chamber 38 is located at the same position as the second posture conversion mechanism 20 in the front-rear direction (X direction).

[0183] The substrate pre-drying treatment chamber 38 has a carrying inlet 38a and a carrying outlet 38b, each having a shutter door, similar to the drying chamber 37. In the pre-drying treatment, the shutter doors of the carrying inlet 38a and the carrying outlet 38b are closed to prevent the IPA in the chamber from scattering outside the chamber. Unlike the drying chamber 37, the substrate pre-drying treatment chamber 38 does not necessarily need to be pressure-resistant.

[0184] The substrate drying pre-processing chamber 38 includes a rotating processing unit 33 that rotates the substrate W in a horizontal position, and a nozzle 35 that supplies a processing liquid (IPA) toward the substrate W. The rotating processing unit 33 rotates the substrate W in the XY plane (horizontal plane). The nozzle 35 can rotate between a standby position separated from the rotating processing unit 33 and a supply position located above the rotating processing unit 33.

[0185] <Single substrate transport area>

[0186] Fig.31 1 is a side view of the single-chip substrate transport region R3 for explaining the present example. The single-chip substrate transport region R3 of the present example is provided with an upper partition and a lower partition formed by a partition wall, and the upper partition is the same as the structure of the first embodiment. That is, the upper partition is provided with a second robot CR2, which receives the substrate W after drying processing from the drying chamber 37 located at the top and middle layers in the stack of chambers provided in the single-chip processing region R2 and transfers it to the second return substrate handover position P4b. The second robot CR2 can move in the front-back direction (X direction) and has a dry arm 73b for holding the substrate W after drying processing.

[0187] Two robots are provided in the lower area of ​​the single-piece substrate transport area R3 of this example. That is, the lower area includes: a third robot CR3 for transporting the substrate W after the drying process; and a fourth robot CR4 for transporting the wet substrate W to be subjected to the drying process. The third robot CR3 is provided with a dry arm 73c similar to the dry arm 73b of the second robot CR2, and the fourth robot CR4 is provided with a CR wet arm 75 similar to the CR wet arm 72 of the first robot CR1 of the first embodiment.

[0188] The third robot CR3 is arranged closer to the transfer block 7 than the fourth robot CR4, and carries the substrate W (horizontally) after drying from the drying chamber 37 adjacent to the transfer block 7 in the single-wafer processing area R2 to the first return substrate handover position P4a. Although there are one drying chamber 37 adjacent to the transfer block 7 at the top, middle, and bottom, respectively, the third robot CR3 can also access the drying chamber 37 at the bottom of these drying chambers 37. At the first return substrate handover position P4a, the substrates W are arranged at intervals of full pitch in the vertical direction (Z direction). Therefore, the dry arm 73c of the third robot CR3 can be lifted and lowered, so that the substrates W can be stacked at the first return substrate handover position P4a.

[0189] The fourth robot CR4 is disposed at a position farther from the transfer block 7 than the third robot CR3. The fourth robot CR4 can receive the substrate W (horizontally) from the horizontal substrate delivery position P3 in the batch processing area R1, and carry the substrate W (horizontally) into the substrate drying pre-processing chamber 38 from the carrying-in port 38a of the substrate drying pre-processing chamber 38 in the single wafer processing area R2. At the horizontal substrate delivery position P3, the substrates W are arranged at intervals of half the pitch in the vertical direction (Z direction). Therefore, the CR wet arm 75 of the fourth robot CR4 can be lifted and lowered, so that the substrates W stacked at the horizontal substrate delivery position P3 can be obtained.

[0190] The fourth robot CR4 is located at the same position as the substrate drying pre-processing chamber 38 and the second posture conversion mechanism 20 in the front-back direction (X direction). Therefore, the fourth robot CR4 is opposite to the substrate drying pre-processing chamber 38 and also opposite to the second posture conversion mechanism 20. In this way, the fourth robot CR4 is arranged at a position suitable for carrying the substrate W between the second posture conversion mechanism 20 and the substrate drying pre-processing chamber 38.

[0191] The third robot CR3, the wet transfer mechanism WR, and the fourth robot CR4 are located at different positions from each other in the front-rear direction (X direction).

[0192] The third robot CR3 only needs to be able to access one of the five drying chambers 37 provided in the single-wafer processing area R2, and does not necessarily need to move in the front-to-back direction (X direction). Therefore, the device of this example can be made into a structure in which the mechanism and control unit for horizontally moving the third robot CR3 are omitted. Similarly, the fourth robot CR4 only needs to be able to access one substrate drying pre-processing chamber 38 provided in the single-wafer processing area R2, and does not necessarily need to move in the front-to-back direction (X direction). Therefore, the device of this example can be made into a structure in which the mechanism and control unit for horizontally moving the fourth robot CR4 are omitted.

[0193] In addition to the functions of the CPU 89a in the first embodiment, the CPU in the second embodiment also implements the control unit related to the third robot CR3 and the fourth robot CR4. In addition to the functions of the first embodiment, the storage unit 89b in the second embodiment also stores information related to the control of the third robot CR3 and the fourth robot CR4. In addition, as in the first embodiment, the specific structure of the CPU is not particularly limited. The entire device may have one CPU, or each block may have one or more CPUs. The same applies to the storage unit 89b.

[0194] <Substrate Processing Flow>

[0195] Fig.321 is a flowchart for explaining the process of substrate processing in this example. As in Example 1, the substrate processing in this example performs various processes related to, for example, surface etching of a substrate W in a semiconductor device manufacturing process. The process of substrate processing will be specifically explained below along this flowchart.

[0196] Step S21: Similar to step S11 of embodiment 1, a carrier C accommodating substrates W to be processed is set in the carrier holding portion 11. The plurality of substrates W are taken out from the carrier C by the collective transport mechanism 19 and transported to the outward substrate delivery position P1.

[0197] Step S22: The plurality of substrates W are transferred to the first posture conversion mechanism PCR in the same manner as step S12 of embodiment 1. The first posture conversion mechanism PCR converts the posture of the substrates W from the horizontal posture to the vertical posture.

[0198] Step S23: Similar to step S13 of embodiment 1, the plurality of substrates W whose postures are converted to the vertical posture are transferred to the pusher mechanism 22. The pusher mechanism 22 cooperates with the substrate pickup mechanism WDB to change the arrangement pitch of the full-pitch substrates W to a half-pitch.

[0199] Step S24: The plurality of substrates W conveyed to the vertical substrate taking-over position P2 are conveyed to the batch processing region R1 by the substrate conveying mechanism WTR similarly to step S14 of Example 1. The plurality of substrates W are subjected to various liquid processes in a state of constituting a batch.

[0200] Step S25: As in step S15 of the first embodiment, the plurality of substrates W transported to the posture conversion unit VHU by the substrate transport mechanism WTR are transferred to the second posture conversion mechanism 20. The second posture conversion mechanism 20 converts the posture of the substrate W from the vertical posture to the horizontal posture, and makes the plurality of substrates W standby at the horizontal substrate transfer position P3.

[0201] Fig.33 The substrate transport from step S21 to step S25 is described. Fig.33 In each of the processes shown, a plurality of substrates W are transported together.

[0202] Step S26: The plurality of substrates W waiting at the horizontal substrate transfer position P3 are transported one by one by the fourth robot CR4 to the substrate pre-drying processing chamber 38. That is, the substrates W at the horizontal substrate transfer position P3 are held by the CR wet arm 75 of the fourth robot CR4 and transported to the empty substrate pre-drying processing chamber 38 (the substrate pre-drying processing chamber 38 not in the pre-drying processing). When the substrate pre-drying processing chamber 38 is in the pre-drying processing, the fourth robot CR4 waits without holding the substrate W until the substrate pre-drying processing chamber 38 becomes empty, and obtains a substrate W from the horizontal substrate transfer position P3 when the substrate pre-drying processing chamber 38 becomes empty, and transports the substrate W to the substrate pre-drying processing chamber 38.

[0203] Step S27: When the substrate W is loaded into the substrate pre-drying processing chamber 38, the shutters of the loading port 38a and the unloading port 38b are closed, and the pre-drying processing is performed inside the chamber.

[0204] Step S28: As in step S17 of the first embodiment, the wet transport mechanism WR carries the substrate W to be dried into any of the empty drying chambers 37 (drying chambers 37 not being dried) located at the top, middle, or bottom. The drying chamber 37 carries out drying on the carried substrate W.

[0205] Step S29: As in step S18 of embodiment 1, the substrate W after drying is carried out of the chamber by the second robot CR2 or the third robot CR3. Specifically, the substrate W in the drying chamber 37 located at the bottom is carried to the first return substrate delivery position P4a by the dry arm 73c of the third robot CR3. In addition, the substrate W in the drying chamber 37 located at the top and middle layers is carried to the second return substrate delivery position P4b by the second robot CR2.

[0206] Fig.34 The substrate transport from step S26 to step S29 is described. Fig.34 In each of the processes shown, substrates W in a horizontal position are transported one by one. Fig.34 The following describes an example in which the substrate W in the lowermost drying chamber 37 is transferred to the first return substrate taking-over position P4a by the third robot CR3.

[0207] Step S30: Repeat the above steps S26 to S29 several times, and when a predetermined number of substrates W are filled into the path arranged at the first return path substrate delivery position P4a or the second return path substrate delivery position P4b, the substrates W in the path are held by the collective transport mechanism 19 and returned to the original carrier C. This step is the same as step S19 of embodiment 1.

[0208] Fig.35 FIG. 2 shows a situation where a plurality of substrates W are transported together in step S30. Fig.35 The following example shows a case where a plurality of substrates W are conveyed from the first return substrate taking-over position P4a. In this way, the substrate processing performed by the substrate processing apparatus 2 of this example is completed.

[0209] As described above, according to this example, the same effects as those of the first embodiment and the following effects can be achieved. That is, the fourth robot CR4 of this example delivers the substrate W to the substrate pre-drying processing chamber 38, and the wet transport mechanism WR receives the substrate W from the substrate pre-drying processing chamber 38. According to this structure, since there is no need to transfer the substrate W between the wet transport mechanism WR and the fourth robot CR4, it is possible to provide a substrate processing apparatus 2 that can more reliably transport the substrate W and reliably perform pre-processing of the substrate W to be dried.

[0210] The present invention is not limited to the above-mentioned structure, and can be implemented in the following modified forms.

[0211] <Variation 1>

[0212] Although the drying chamber 37 is a supercritical fluid chamber, the present invention is not limited to this structure. The drying chamber 37 may be a chamber capable of performing a spin drying process.

[0213] <Variation 2>

[0214] Although three drying chambers 37 in the above-mentioned single wafer processing region R2 are stacked in the vertical direction (Z direction) to form a stacked body, the present invention is not limited thereto, and the number of drying chambers 37 constituting the stacked body can be appropriately increased or decreased.

[0215] <Variation 3>

[0216] Although a plurality of stacked bodies formed by stacking a predetermined number of drying chambers 37 in the vertical direction (Z direction) are provided in the above-mentioned single-wafer processing area R2, the present invention is not limited to such a structure and can also be applied to an apparatus having a single stacked body. Fig.19 The structure of the stacked body on the right or left side of the wet transfer mechanism WR.

[0217] <Variation 4>

[0218] Although the above-mentioned single-chip substrate conveying area R3 is divided into upper and lower areas and has a structure with independent robots in the upper area and the lower area, the present invention is not limited to this. However, it can also be a structure as follows: the single-chip substrate conveying area R3 is not divided by a partition wall, but a single robot is used to replace the first robot CR1 and the second robot CR2, and the single robot performs the conveying performed by each robot at the same time.

[0219] <Variation 5>

[0220] Although the first robot CR1 of the single-wafer substrate transport region R3 can access the bottom chamber in the single-wafer processing region R2, and the second robot CR2 can access the top and middle chambers in the single-wafer processing region R2, the present invention is not limited to this structure. The first robot CR1 can also be made to be able to access the middle and bottom chambers in the single-wafer processing region R2, and in coordination therewith, the second robot CR2 can also be made to be able to access the bottom chamber in the single-wafer processing region R2.

[0221] Description of reference numerals:

[0222] 5 Supply Blocks

[0223] 7Move Block

[0224] 9 Processing Blocks

[0225] 19. Transporting Mechanism Together

[0226] 20 Second posture conversion mechanism

[0227] 20B horizontal holding portion (horizontal substrate supporting member)

[0228] 22 Pusher mechanism (vertical base plate support member)

[0229] 37 Drying chamber

[0230] 38 Substrate drying pre-treatment chamber

[0231] 72CR wet arm (interchange arm)

[0232] 73a Dry arm (carry-out arm)

[0233] C Carrier

[0234] CR1 first robot (single substrate transfer position, substrate removal mechanism, first substrate removal mechanism)

[0235] CR2 Second robot (second substrate removal mechanism)

[0236] P1 Outward path substrate connection position

[0237] P2 Vertical substrate junction position

[0238] P3 horizontal substrate junction position

[0239] P4 Return circuit board transfer position

[0240] P4a First return path substrate transfer position

[0241] P4b Second return path substrate transfer position

[0242] PCR first posture conversion mechanism

[0243] R1 Batch Processing Area

[0244] R2 Monolithic Processing Area

[0245] R3 Single substrate handling area

[0246] R4 Batch substrate handling area

[0247] W substrate

[0248] WR wet handling mechanism (substrate carrying mechanism)

[0249] WTR substrate transport mechanism (batch substrate transport mechanism)

Claims

1. A substrate processing device for continuously performing batch processing of processing a plurality of substrates at once and single processing of processing substrates one by one, characterized in that: The substrate processing device comprises: A supply block supplies a plurality of substrates; a transfer block, adjacent to the supply block; and a processing block, adjacent to the transfer block; The supply block has a collective transport mechanism, which carries out a plurality of substrates in a horizontal posture and arranged at a predetermined interval in the vertical direction from the carrier and sends them to the outgoing substrate delivery position in the transfer block, and receives a plurality of substrates in a horizontal posture and arranged at the predetermined interval in the vertical direction from the return substrate delivery position in the transfer block and stores them in the carrier; The transfer block has: A first posture conversion mechanism that collectively holds the plurality of substrates waiting at the forward substrate transfer position and converts the postures of the plurality of substrates from a horizontal posture to a vertical posture; as well as A vertical substrate supporting member for allowing a plurality of substrates in a vertical posture to stand by at a vertical substrate transfer position in the transfer block; The processing block has: A batch processing area, one end of which is adjacent to the transfer block and the other end of which extends away from the transfer block; A single-wafer processing area, one end of which is adjacent to the transfer block and the other end of which extends away from the transfer block; A single-wafer substrate conveying area is sandwiched between the batch processing area and the single-wafer processing area, one end of which is adjacent to the transfer block and the other end of which extends in a direction away from the transfer block; as well as A batch substrate transport area is arranged along the batch processing area, one end of which is adjacent to the transfer block and the other end of which extends away from the transfer block; In the batch processing area in the processing block, a plurality of batch processing tanks for simultaneously immersing and processing a plurality of substrates are arranged in the direction in which the batch processing area extends, and a second posture conversion mechanism is provided at a position farthest from the transfer block for converting the postures of the plurality of substrates from a vertical posture to a horizontal posture; and a horizontal substrate supporting member for allowing a plurality of substrates in a horizontal posture to stand by at a horizontal substrate transfer position in the batch processing area; In the single-wafer processing area in the processing block, a plurality of drying chambers for performing drying processing of substrates are arranged in a vertical direction, and the single-wafer processing area in the processing block has a substrate carrying mechanism for carrying substrates before drying processing into the drying chambers; The single-chip substrate transport area in the processing block has: A single-chip substrate handover mechanism receives a substrate in a horizontal position from the horizontal substrate handover position and transfers the substrate to the single-chip processing area; as well as A substrate carrying mechanism is used to carry out the substrate after drying from the drying chamber to the return substrate delivery position in the transfer block; The batch substrate transfer area in the processing block has a batch substrate transfer mechanism that transfers a plurality of substrates at a time between the vertical substrate transfer position set in the transfer block, each batch processing tank, and the second posture conversion mechanism.

2. The substrate processing apparatus according to claim 1, wherein: The substrate carrying mechanism receives a substrate from the single-substrate delivering mechanism.

3. The substrate processing apparatus according to claim 1, wherein: A substrate drying pre-processing chamber for performing pre-processing of drying treatment is provided in the single-wafer processing area; The single-chip substrate delivery mechanism delivers the substrate to the substrate pre-drying processing chamber; The substrate carrying mechanism receives a substrate from the substrate pre-drying processing chamber.

4. The substrate processing apparatus according to claim 2, wherein: The single-chip substrate delivery mechanism is composed of a robot that also serves as the substrate carrying-out mechanism; The single-chip substrate handover mechanism comprises a handover arm for supporting the substrate before drying treatment; The substrate carrying-out mechanism comprises a carrying-out arm for supporting the substrate after the drying process; The carrying-out arm is arranged on the upper part of the transfer arm.

5. The substrate processing apparatus according to claim 1, wherein: The drying chamber dries the substrate by means of a supercritical fluid.

6. The substrate processing apparatus according to claim 3, wherein: The substrate pre-drying treatment chamber pre-dries the substrate using isopropyl alcohol.

7. The substrate processing apparatus according to claim 1, wherein: In the single wafer processing area in the processing block, a stack of the drying chambers is provided on both sides of the substrate carrying-in mechanism.

8. The substrate processing apparatus according to claim 1, wherein: The batch substrate handling area in the processing block has: a first substrate carrying-out mechanism for carrying out a substrate from an upper layer of the stack in the drying chamber; as well as a second substrate carrying-out mechanism for carrying out a substrate from a lower layer of the stack in the drying chamber; The transfer block is provided with a first return substrate receiving position where the first substrate transport mechanism carries out a substrate, and a second return substrate receiving position where the second substrate transport mechanism carries out a substrate.

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