Method for manufacturing printed wiring board and system for manufacturing printed wiring board

Abstract

A method for manufacturing a printed wiring board according to one embodiment of the present disclosure is a method for manufacturing a printed wiring board using a printed wiring board sheet having a plurality of printed wiring board pieces, the method comprising: a determination step for determining whether each of the plurality of printed wiring board pieces is a good product or a defective product by electrical inspection; a cutting step in which, after the determination step, the non-defective product is selectively cut from the printed wiring board sheet; and an appearance inspection step for inspecting the appearance of the non-defective product cut in the cutting step, and further provided with a transfer step for transferring data relating to the non-defective product or the defective product in the determination step to the cutting step, and transferring the data relating to the non-defective product or the defective product in the determination step to the cutting step. And cutting the good product in the cutting process based on the data transmitted in the transmitting process.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a printed wiring board and a system for manufacturing a printed wiring board.

[0002] This application claims the benefit of priority based on Japanese Application No. 2022-147170 filed on September 15, 2022, and all the contents described in the above Japanese Application are incorporated herein by reference. Background Art

[0003] As an efficient method for producing a printed wiring board, there is known a method of preparing a large-sized printed wiring board sheet and cutting a plurality of printed wiring board pieces from the printed wiring board sheet (see Patent Document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2006-319067 Summary of the invention

[0007] A method for manufacturing a printed wiring board involved in one embodiment of the present invention is a method for manufacturing a printed wiring board using a printed wiring board sheet having a plurality of printed wiring board single pieces, and comprises: a determination step of determining whether the plurality of printed wiring board single pieces are good or defective by electrical inspection; a cutting step of selectively cutting the good products from the printed wiring board sheet after the determination step; and an appearance inspection step of performing an appearance inspection on the good products cut in the cutting step, and further comprising a transfer step of transferring data on good or defective products in the determination step to the cutting step, and cutting the good products in the cutting step based on the data transferred in the transfer step. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a flowchart showing a method for manufacturing a printed wiring board according to one embodiment of the present disclosure.

[0009] Figure 2 It is shown Figure 1 A schematic diagram of a determination step in a method for manufacturing a printed wiring board.

[0010] Figure 3 It is shown in Figure 2 A schematic top view of a state in which a printed wiring board sheet is held by a first clamp in a determination step.

[0011] Figure 4 It is shown Figure 2 The state after the determination in the determination process, and Figure 3Corresponding schematic top view.

[0012] Figure 5 It is shown Figure 1 Schematic diagram of a cutting step in a method for manufacturing a printed wiring board.

[0013] Figure 6 It is shown in Figure 5 A schematic partially enlarged cross-sectional view of the state in which good products are cut out in the cutting process.

[0014] Figure 7 It is shown Figure 1 A schematic diagram of an appearance inspection step in a method for manufacturing a printed wiring board.

[0015] Figure 8 is shown with Figure 1 A flowchart of a method for manufacturing a printed wiring board according to a different embodiment of the method for manufacturing a printed wiring board. DETAILED DESCRIPTION

[0016] [Technical Problems to be Solved by the Present Disclosure]

[0017] Patent Document 1 describes a method for manufacturing a printed wiring board using a workpiece having a plurality of individualized board portions. Patent Document 1 describes that after the workpiece is subjected to a continuity test, individualized board portions are punched out from the workpiece.

[0018] According to the method for manufacturing a printed wiring board described in Patent Document 1, a singulated substrate portion determined as a good product by a continuity test and a singulated substrate portion determined as a defective product by a continuity test are punched out together. Therefore, according to the structure described in Patent Document 1, defective products may be mixed with good products due to the punching out of defective products. In addition, according to the structure described in Patent Document 1, it may not be possible to fully improve the manufacturing efficiency.

[0019] The present disclosure has been made based on the above circumstances, and an object of the present disclosure is to provide a method for manufacturing a printed wiring board that can improve the manufacturing efficiency of the printed wiring board while suppressing the mixing of defective products into good products.

[0020] [Effects of the present disclosure]

[0021] A method for manufacturing a printed wiring board according to one aspect of the present disclosure can improve the manufacturing efficiency of the printed wiring board while suppressing the mixing of defective products into good products.

[0022] [Description of Embodiments of the Present Disclosure]

[0023] First, embodiments of the present disclosure will be listed and described.

[0024] (1) A method for manufacturing a printed wiring board according to one aspect of the present disclosure is a method for manufacturing a printed wiring board using a printed wiring board sheet having a plurality of printed wiring board single pieces, and comprises: a determination step of determining whether the plurality of printed wiring board single pieces are good or defective by electrical inspection; a cutting step of selectively cutting the good products from the printed wiring board sheet after the determination step; and an appearance inspection step of performing an appearance inspection on the good products cut in the cutting step, and further comprising a transfer step of transferring data on good or defective products in the determination step to the cutting step, and cutting the good products in the cutting step based on the data transferred in the transfer step.

[0025] The method for manufacturing a printed wiring board includes a step of transferring data on good products or defective products in the determination step to the cutting step. In the cutting step, the good products are selectively cut out from the printed wiring board sheet based on the data transferred in the transfer step. The method for manufacturing a printed wiring board can suppress the defective products from being mixed with the good products by not cutting out the defective products from the printed wiring board sheet. In addition, the method for manufacturing a printed wiring board can improve the manufacturing efficiency of the printed wiring board because only the good products cut out in the cutting step can be inspected in the appearance inspection step.

[0026] (2) In the above (1), in the determination step, an identification mark may be given to the defective product. In this way, in the determination step, by giving the defective product an identification mark, it is possible to more reliably prevent the defective product from being mixed with the good product.

[0027] (3) In the above (2), the identification mark may be imparted by a first laser in the determination step, and the good product may be cut out by a second laser having a strength greater than that of the first laser in the cutting step. In this way, by imparting the identification mark by a first laser in the determination step, and cutting out the good product by a second laser having a strength greater than that of the first laser in the cutting step, the identification mark can be imparted and the good product can be cut out easily and reliably.

[0028] (4) In any of the above (1) to (3), in the determination process, the printed wiring board sheet is held by a first fixture, and a non-contact tag capable of storing the quality determination data in the determination process is disposed on the first fixture. In this way, in the determination process, by holding the printed wiring board sheet by a first fixture, and by disposing a non-contact tag capable of storing the quality determination data in the determination process on the first fixture, the defective product can be more reliably prevented from being mixed with the good product.

[0029] (5) In any one of the above (1) to (4), in the above-mentioned cutting step, the above-mentioned printed wiring board sheet is held by a second jig, and the above-mentioned second jig has a receiving portion for receiving the above-mentioned good products cut from the above-mentioned printed wiring board sheet. In this way, in the above-mentioned cutting step, by holding the above-mentioned printed wiring board sheet by the second jig, and the above-mentioned second jig having a receiving portion for receiving the above-mentioned good products cut from the above-mentioned printed wiring board sheet, the above-mentioned good products can be easily and reliably separated from the above-mentioned printed wiring board sheet in a state where the above-mentioned defective products are mounted.

[0030] (6) In any of the above (1) to (5), in order to reduce the number of defective products, a feedback process may be further provided, wherein the feedback process feeds back the data on defective products in the above determination process to a process prior to the above determination process. In this way, in order to reduce the number of defective products, by further providing a process for feeding back the data on defective products in the above determination process to a process prior to the above determination process, it is easy to suppress the generation of defective products. As a result, the manufacturing efficiency of the printed wiring board can be further improved.

[0031] (7) Another embodiment of the present invention relates to a printed wiring board manufacturing system that uses a printed wiring board sheet having a plurality of printed wiring board single pieces, and comprises: a determination device that determines whether the plurality of printed wiring board single pieces are good or defective by electrical inspection; a cutting device that selectively cuts the good products from the printed wiring board sheet; and an appearance inspection device that performs an appearance inspection on the good products cut by the cutting device, and further comprises a data control device that transmits data on good or defective products in the determination device to the cutting device, and cuts the good products in the cutting device based on the data transmitted from the data control device.

[0032] According to the manufacturing system of the printed wiring board, the cutting device can selectively cut the good products from the printed wiring board sheet based on the data transmitted from the data control device. The manufacturing system of the printed wiring board can suppress the bad products from being mixed with the good products by not cutting the bad products from the printed wiring board sheet. In addition, according to the manufacturing system of the printed wiring board, since the appearance inspection device can only inspect the good products cut by the cutting device, the manufacturing efficiency of the printed wiring board can be improved.

[0033] [Details of the embodiments of the present disclosure]

[0034] Hereinafter, preferred embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be noted that each of the drawings is schematic and sometimes does not correspond to the actual shape, size, ratio, etc. In addition, in the present disclosure, the descriptions such as "first" and "second" do not indicate a priority order.

[0035] [First embodiment]

[0036] <Method for Manufacturing Printed Wiring Board>

[0037] A method for producing a printed wiring board according to one aspect of the present disclosure is a method for producing a printed wiring board using a printed wiring board sheet having a plurality of printed wiring board pieces. In this method for producing a printed wiring board, a plurality of printed wiring boards are produced from a single large-sized printed wiring board sheet.

[0038] like Figure 1 As shown, the method for manufacturing a printed wiring board comprises: a determination step S1, which determines whether the plurality of printed wiring board sheets are good or bad products by electrical inspection; a cutting step S3, which selectively cuts the good products from the printed wiring board sheet after the determination step S1; and an appearance inspection step S4, which performs an appearance inspection on the good products cut in the cutting step S3. In addition, the method for manufacturing a printed wiring board comprises a transfer step S2, which transfers the data on good or bad products in the determination step S1 to the cutting step S3. The method for manufacturing a printed wiring board performs cutting of the good products in the cutting step S3 based on the data transferred in the transfer step S2.

[0039] The manufacturing method of the printed wiring board includes a transfer step S2 for transferring data on good products or defective products in the determination step S1 to a cutting step S3. In the cutting step S3, the good products are selectively cut out from the printed wiring board sheet based on the data transferred in the transfer step S2. The manufacturing method of the printed wiring board can suppress the defective products from being mixed into the good products by not cutting out the defective products from the printed wiring board sheet. In addition, by configuring in this way, the loss of processing the defective products can be reduced. Furthermore, the manufacturing method of the printed wiring board can improve the manufacturing efficiency of the printed wiring board because only the good products cut out in the cutting step S3 can be inspected in the appearance inspection step S4.

[0040] In the manufacturing method of the printed wiring board, the above-mentioned printed wiring board single piece determined as a good product in the appearance inspection step S4 is manufactured as a printed wiring board after undergoing other steps as needed. On the above-mentioned printed wiring board sheet, for example, the above-mentioned plurality of printed wiring board single pieces are regularly arranged. As the lower limit of the number of the above-mentioned printed wiring board single pieces arranged on the above-mentioned printed wiring board sheet, for example, it can be 10, it can also be 30, and it can also be 50. In addition, as the upper limit of the number of the above-mentioned printed wiring board single pieces arranged on the above-mentioned printed wiring board sheet, for example, it can be 500, it can also be 300, and it can also be 100.

[0041] The above-mentioned printed wiring board monolithic chip has a substrate with insulation properties and a conductive pattern arranged on the substrate. The above-mentioned substrate can be a rigid substrate, a flexible substrate with flexibility, or a composite substrate in which a rigid substrate and a flexible substrate are integrated. The above-mentioned conductive pattern has one or more wiring parts. The above-mentioned conductive pattern can be arranged on only one side of the above-mentioned substrate, or on both sides of the above-mentioned substrate. The main component of the above-mentioned conductive pattern is not particularly limited, and for example, copper can be cited.

[0042] Hereinafter, each step in the method for producing the printed wiring board will be described in detail.

[0043] (Judgment process)

[0044] like Figure 2 and Figure 3 As shown, in the determination step S1, the electrical inspection device 10 is used to perform electrical inspection on the plurality of printed wiring board pieces 110 of the printed wiring board sheet 100. The specific structure of the electrical inspection device 10 is not particularly limited, and for example, it can be a structure having a plurality of probes. The electrical inspection device 10, for example, uses a plurality of probes to inspect whether the conductive pattern 120 is short-circuited.

[0045] like Figure 3 As shown, the printed wiring board sheet 100 has an array portion 100a in which a plurality of printed wiring board single pieces 110 are arranged in a matrix shape, and an annular peripheral portion 100b arranged around the array portion 100a. The printed wiring board sheet 100 has a lattice-shaped connection portion in the array portion 100a. The connection portion extends from the inner periphery of the peripheral portion 100b. A plurality of printed wiring board single pieces 110 are connected to the connection portion. That is, adjacent printed wiring board single pieces 110 in the array portion 100a are connected to each other through the connection portion. In addition, the printed wiring board single piece 110 located at the outermost periphery in the array portion 100a is connected to the peripheral portion 100b through the connection portion. A plurality of printed wiring board single pieces 110 are arranged at intervals separated by the connection portion.

[0046] In the determination step S1, the conductive pattern 120 of each of the plurality of printed wiring board chips 110 of the printed wiring board sheet 100 is electrically inspected. In the determination step S1, each printed wiring board chip 110 may be electrically inspected once or multiple times. In the case where each printed wiring board chip 110 is electrically inspected multiple times in the determination step S1, the wiring portion that becomes the inspection object in each electrical inspection may be the same or different. It should be noted that in the method for manufacturing the printed wiring board, a step for performing the electrical inspection of the conductive pattern 120 may not be provided after the determination step S1. The method for manufacturing the printed wiring board can manufacture the printed wiring board more efficiently by ending the electrical inspection of the conductive pattern 120 in the determination step S1.

[0047] like Figure 3 As shown, in the determination step S1, the electrical inspection is performed while the printed wiring board sheet 100 is held by the first jig 20. The first jig 20 is, for example, a plate member capable of supporting the printed wiring board sheet 100. The first jig 20 may include a positioning portion for determining the arrangement of the printed wiring board sheet 100 relative to the first jig 20 and the arrangement of the first jig 20 relative to the electrical inspection device 10.

[0048] A non-contact tag 21 capable of storing the quality determination data in the determination step S1 is disposed on the first fixture 20. As the non-contact tag 21, for example, an RFID (Radio Frequency Identification) tag can be cited. By disposing the non-contact tag 21 on the first fixture 20, it is possible to more reliably prevent the defective products from being mixed with the good products in the subsequent steps.

[0049] The non-contact tag 21 stores the quality determination data in units of the printed wiring board single piece 110. Alternatively, the non-contact tag 21 stores the quality determination data as the above-mentioned quality determination data, indicating at which part the printed wiring board single piece 110 is determined to be a defective product in a printed wiring board sheet 100. That is, the non-contact tag 21 may store the configuration data of the defective products in the printed wiring board sheet 100 as the above-mentioned quality determination data.

[0050] When multiple electrical inspections are performed on each printed wiring board piece 110 in the determination step S1, the electrical inspection results of each electrical inspection are stored in the non-contact tag 21. In addition, the electrical inspection result may be rewritten for each electrical inspection in the non-contact tag 21. By using the non-contact tag 21 in the determination step S1, it is possible to easily track whether there is a possibility that defective products are mixed in the printed wiring board pieces 110 cut in the cutting step S3 described below.

[0051] like Figure 4 As shown, in the determination step S1, an identification mark may be given to the defective product 140. According to this configuration, it is possible to more reliably suppress the defective product 140 from being mixed with the good product 130.

[0052] When the identification mark is given to the defective product 140 in the determination step S1, the identification mark may be given by the first laser in the determination step S1. Figure 4 In the determination step S1, the identification mark is provided by irradiating the conductive pattern 120 of the defective product 140 with the first laser and burning a part or all of the conductive pattern 120. That is, in the determination step S1, the identification mark is provided to the printed wiring board single piece 110 itself determined as the defective product 140. With such a configuration, the good product 130 and the defective product 140 based on the electrical inspection can be easily distinguished from each other in appearance.

[0053] (Transfer process)

[0054] As described above, in the transfer step S2, the data on the good product 130 or the defective product 140 in the determination step S1 is transferred to the cutting step S3. The transfer step S2 can be performed by Figure 2 The data control device 30 shown is performed.

[0055] The data control device 30 is configured to transmit data on the printed wiring board single piece 110 determined as a good product 130 or a defective product 140 through the electrical inspection of the electrical inspection device 10 to the cutting process S3. The data control device 30 has a receiving unit that receives data on the electrical inspection result of the electrical inspection device 10, and a transmitting unit that transmits the data received by the receiving unit to the cutting process S3. It should be noted that the data control device 30 can be configured so that the data received by the receiving unit is transmitted as it is by the transmitting unit, or it can be configured so that the data received by the receiving unit is processed as needed and then transmitted by the transmitting unit.

[0056] In the transfer process S2, only the data about the printed wiring board single chip 110 judged as a good product 130 in the above-mentioned electrical inspection may be transferred, or only the data about the printed wiring board single chip 110 judged as a defective product 140 in the above-mentioned electrical inspection may be transferred, or both the data about the printed wiring board single chip 110 judged as a good product 130 and the data about the printed wiring board single chip 110 judged as a defective product 140 may be transferred.

[0057] When each printed wiring board piece 110 is subjected to multiple electrical inspections in the determination step S1, in the transfer step S2, a printed wiring board piece 110 determined to be unqualified in at least one of all the electrical inspections is treated as a defective product 140. With this configuration, printed wiring boards can be manufactured more efficiently.

[0058] The data transmitted in the transmission process S2 may be different from the above-mentioned good / failure determination data stored in the non-contact tag 21, for example, but may also be the same. In the transmission process S2, for example, the determination results in each electrical inspection may be transmitted to the cutting process S3, and the final determination result in the determination process S1 may be transmitted to the cutting process S3. In the transmission process S2, the above-mentioned data may be transmitted to the cutting process S3 without passing through the non-contact tag 21 (that is, regardless of the non-contact tag 21). On the other hand, in the case where the data transmitted in the transmission process S2 is the same as the above-mentioned good / failure determination data, the above-mentioned good / failure determination data stored in the non-contact tag 21 may also be used in the transmission process S2.

[0059] (Cutting process)

[0060] like Figure 5 and Figure 6 As shown, in the cutting process S3, all the printed wiring board single pieces 110 determined as defective products 140 in the determination process S1 are left on the printed wiring board sheet 100, and all the printed wiring board single pieces 110 determined as good products 130 in the determination process S1 are cut from the printed wiring board sheet 100. In the cutting process S3, the good products 130 are cut along their outer edges. It should be noted that in the manufacturing method of the printed wiring board, for example, before the determination process S1, a part of the outer edge of all the printed wiring board single pieces 110 may be pre-cut. That is, each printed wiring board single piece 110 may be provided to be connected to the above-mentioned connection portion through a seam. In this case, in the cutting process S3, it is sufficient to cut the seam provided on the outer edge of the good product 130.

[0061] In the cutting step S3, the good products 130 are cut out by the cutting device 40. The cutting device 40 includes a cutting unit that cuts out the good products 130, and a receiving unit that receives data on the good products 130 or the defective products 140 transmitted from the data control device 30. The cutting device 40 selectively cuts out all the printed wiring board pieces 110 determined as good products 130 by the electrical inspection device 10 from the printed wiring board sheet 100 based on the data on the good products 130 or the defective products 140 received from the data control device 30.

[0062] The specific structure of the cutting unit is not particularly limited, and may include, for example, a die for supporting the printed wiring board sheet 100 and a punch for punching out good products 130 from the printed wiring board sheet 100 supported by the die. Figure 5 As shown, a structure in which a good product 130 is cut out by using a laser can also be adopted. In this case, the cutting unit has, for example, a laser head 41 capable of irradiating a laser, and a scanning unit (not shown) capable of scanning the laser irradiated from the laser head 41. By using a laser, it is easy to selectively cut out only the good product 130. It should be noted that the cutting device 40 may also have a camera capable of recognizing the arrangement of the printed wiring board single piece 110. By configuring in this way, it is easy to selectively cut out only the good product 130.

[0063] In the case where the good product 130 is cut out by laser in the cutting step S3, the good product 130 may be cut out by a second laser having a greater intensity than the above-mentioned first laser in the cutting step S3. With such a configuration, the above-mentioned identification mark can be easily and reliably assigned and the good product 130 can be cut. That is, by assigning the above-mentioned identification mark by using the above-mentioned first laser, it is possible to suppress damage to the printed wiring board sheet 100 and the first clamp 20, and to assign the above-mentioned identification mark easily and reliably at a low cost. In addition, by using the above-mentioned second laser to cut the good product 130, it is possible to easily and reliably cut the good product 130 along its outer edge. It should be noted that the "intensity" of the laser refers to the result of dividing the pulse energy (J) by the pulse width (S) and the irradiation area (cm 2 ) is the value obtained by multiplying

[0064] As the second laser used in the cutting step S3, for example, a YAG laser and a fiber laser can be mentioned. In addition, as the above-mentioned YAG laser, for example, a UV-YAG laser can be mentioned.

[0065] The lower limit of the wavelength of the second laser light may be, for example, 280 nm or 320 nm. On the other hand, the upper limit of the wavelength may be, for example, 500 nm or 400 nm. In addition, the wavelength of the second laser light may be fixed.

[0066] In the cutting process S3, the second jig 50 is used to hold the printed wiring board sheet 100. In other words, in the cutting process S3, the second jig 50 different from the first jig 20 used in the determination process S1 is used to hold the printed wiring board sheet 100. By configuring in this way, both the electrical inspection in the determination process S1 and the cutting of the good product 130 in the cutting process S3 can be easily and reliably performed. It should be noted that the second jig 50 may also have a positioning portion for determining the configuration of the printed wiring board sheet 100 relative to the second jig 50 and the configuration of the second jig 50 relative to the cutting device 40. In addition, the above-mentioned non-contact tag 21 may not be configured on the second jig 50.

[0067] The second jig 50 has a receiving portion 51 for receiving a good product 130 cut out from the printed wiring board sheet 100. Figure 6 As shown, good products 130 can be easily and reliably separated from the printed wiring board sheet 100 in a state where the defective products 140 have not been cut out.

[0068] The second jig 50 is a plate member having recesses corresponding to the plurality of printed wiring board sheets 110. As a main component of the second jig 50, for example, a metal such as aluminum can be cited. The recesses are configured as receiving portions 51. In the cutting step S3, the printed wiring board sheet 100 may be sucked toward the second jig 50 when the good product 130 is cut out.

[0069] The above-mentioned recessed portion is recessed from the board surface (the surface of the portion where the recessed portion is not formed) of the second jig 50. The above-mentioned recessed portion is set to a depth such that the surface of the good product 130 cut from the printed wiring board sheet 100 protrudes from the board surface. By configuring in this way, it is sometimes possible to easily move the good product 130 supported by the receiving portion 51 to the next process. For example, in a state where the printed wiring board sheet 100 is held by the second jig 50 and a plurality of good products 130 are supported by the receiving portion 51, these good products 130 can be easily sucked from the normal direction of the board surface. As a result, only the plurality of good products 130 cut by the cutting process S3 can be easily and reliably moved to the next process. From such a viewpoint, the method for manufacturing a printed wiring board may also include a suction process for sucking the good products 130 cut in the cutting process S3. It should be noted that the above-mentioned suction process can be performed, for example, using a robot hand that can approach the plurality of good products 130 from the normal direction of the board surface.

[0070] (Appearance inspection process)

[0071] like Figure 7As shown, in the appearance inspection step S4, the plurality of good products 130 cut in the cutting step S3 and separated from the printed wiring board sheet 100 are appearance inspected. That is, in the appearance inspection step S4, only the plurality of good products 130 separated from the printed wiring board sheet 100 are appearance inspected.

[0072] <Printed wiring board manufacturing system>

[0073] A printed wiring board manufacturing system according to one embodiment of the present disclosure is a printed wiring board manufacturing system using a printed wiring board sheet having a plurality of printed wiring board sheets. The printed wiring board manufacturing system is capable of executing the above-mentioned method for manufacturing the printed wiring board. The printed wiring board manufacturing system is configured to manufacture a printed wiring board from the above-mentioned printed wiring board sheet 100.

[0074] The manufacturing system of the printed wiring board comprises: a determination device for determining whether the plurality of printed wiring board sheets are good or bad products by electrical inspection; a cutting device for selectively cutting the good products from the printed wiring board sheet; and an appearance inspection device for performing appearance inspection on the good products cut by the cutting device. In addition, the manufacturing system of the printed wiring board comprises a data control device for transmitting data on good or bad products in the determination device to the cutting device. The manufacturing system of the printed wiring board performs cutting of the good products in the cutting device based on the data transmitted from the data control device.

[0075] According to the manufacturing system of the printed wiring board, the cutting device can selectively cut out the good products from the printed wiring board sheet based on the data transmitted from the data control device. The manufacturing system of the printed wiring board can suppress the bad products from being mixed into the good products by not cutting out the bad products from the printed wiring board sheet. In addition, by such a configuration, the loss of processing the bad products can be reduced. Furthermore, according to the manufacturing system of the printed wiring board, since the appearance inspection device can only inspect the good products cut by the cutting device, the manufacturing efficiency of the printed wiring board can be improved.

[0076] (Judgment device)

[0077] The determination device is configured to be able to implement the determination step S1. The determination device is configured to include the electrical inspection device 10. The determination device is configured to perform electrical inspection in a state where the printed wiring board sheet 100 is held by the first fixture 20. A non-contact tag 21 is arranged on the first fixture 20. The determination device may also be configured to give an identification mark to the defective product 140. In this case, the determination device may also be configured to give the identification mark using the first laser.

[0078] (Data Control Device)

[0079] The data control device is configured to implement the transfer step S2. Figure 2 The data control device 30 is provided.

[0080] (Cutting device)

[0081] The cutting device is configured to be able to implement the cutting step S3. Figure 5 The cutting device 40 is configured to cut out good products 130 while the printed wiring board sheet 100 is held by the second jig 50 .

[0082] (Appearance inspection device)

[0083] The appearance inspection device is configured to be able to perform the appearance inspection step S4. The specific configuration of the appearance inspection device is not particularly limited, and a known configuration can be employed.

[0084] [Second Embodiment]

[0085] <Method for Manufacturing Printed Wiring Board>

[0086] Figure 8 The method for manufacturing a printed wiring board shown is a method for manufacturing a printed wiring board using a printed wiring board sheet having a plurality of printed wiring board pieces. In this method for manufacturing a printed wiring board, a plurality of printed wiring boards are manufactured from a single large-sized printed wiring board sheet.

[0087] The method for manufacturing a printed wiring board comprises: a forming step S10 of forming conductive patterns on a plurality of printed wiring board sheets; a judging step S11 of judging whether the plurality of printed wiring board sheets are good or bad by conducting an electrical inspection of the conductive patterns; a cutting step S13 of selectively cutting the good products from the printed wiring board sheet after the judging step S11; and an appearance inspection step S14 of performing an appearance inspection on the good products cut in the cutting step S13. In addition, the method for manufacturing a printed wiring board comprises: a transmitting step S12 of transmitting data on good or bad products in the judging step S11 to the cutting step S13; and a feedback step S15 of feeding back the data on bad products in the judging step S11 to a step preceding the judging step S11 in order to reduce the number of bad products. The method for manufacturing a printed wiring board performs cutting of the good products in the cutting step S13 based on the data transmitted in the transmitting step S12.

[0088] The manufacturing method of the printed wiring board can suppress the mixing of the above-mentioned defective products into the above-mentioned good products, similarly to the manufacturing method of the printed wiring board in the first embodiment. Furthermore, since the manufacturing method of the printed wiring board includes the feedback step S15, it is easy to suppress the generation of the above-mentioned defective products. As a result, the manufacturing efficiency of the printed wiring board can be further improved.

[0089] The determination step S11, transfer step S12, cutting step S13 and appearance inspection step S14 in the method for manufacturing the printed wiring board can be performed in the same steps as the method for manufacturing the printed wiring board in the first embodiment. Therefore, only the forming step S10 and the feedback step S15 will be described below.

[0090] (Formation process)

[0091] In the forming step S10, a conductive pattern is formed, for example, by a semi-additive method or a subtractive method. In the semi-additive method, for example, a conductive base layer is formed on a substrate, a resist pattern is formed on the conductive base layer, a plating layer is formed in the opening of the resist pattern, and after removing the resist pattern, the non-laminated area of ​​the plating layer in the conductive base layer is etched using the plating layer as a mask, thereby forming a conductive pattern. In the subtractive method, for example, a conductive base layer is formed on a substrate, a plating layer is formed on the conductive base layer, a resist pattern is formed on the plating layer, and after etching the plating layer and the conductive base layer using the resist pattern as a mask, the conductive pattern is formed by removing the resist pattern.

[0092] (Feedback process)

[0093] In the feedback process S15, the data on the defective products in the determination process S11 are fed back to the formation process S10. In the feedback process S15, for example, the configuration data of the defective products in the printed wiring board sheet is fed back to the formation process S10. More specifically, in the feedback process S15, the configuration data of the defective products in the printed wiring board sheet is stored in a server, etc., and fed back to the formation process S10, so that the generation of defective products can be suppressed in the manufacture of other printed wiring boards. In the manufacturing method of the printed wiring board, when the frequency of the defective products at the same position of the printed wiring board sheet is high, sometimes the cause is the optical processing method and the plating method in the formation process S10. In this case, if the same optical processing method and the same plating method are continued to be used, the possibility of continuing to generate the defective products at the same position of the printed wiring board sheet becomes high. In contrast, in the feedback process S15, by feeding back the configuration data of the defective products in the printed wiring board sheet to the formation process S10, the defects of the optical processing method and the plating method can be discovered as early as possible. As a result, the occurrence of the above-mentioned defective products can be suppressed.

[0094] When electrical inspections are performed multiple times on each printed wiring board in the determination step S11, the electrical inspection results of each time may be fed back to the formation step S10 in the feedback step S15. With this configuration, the cause of the defect in the formation step S10 can be easily identified.

[0095] <Printed wiring board manufacturing system>

[0096] The manufacturing system of the printed wiring board in the present embodiment is a manufacturing system of the printed wiring board using a printed wiring board sheet having a plurality of printed wiring board single pieces. The manufacturing system of the printed wiring board comprises: a conductive pattern forming device for forming conductive patterns on a plurality of printed wiring board single pieces respectively; a judging device for judging whether the plurality of printed wiring board single pieces are good or bad products respectively by electrical inspection of the conductive patterns; a cutting device for selectively cutting the good products from the printed wiring board sheet; and an appearance inspection device for performing appearance inspection on the good products cut by the cutting device. In addition, the manufacturing system of the printed wiring board comprises: a data control device for transmitting data on good or bad products in the judging device to the cutting device; and a feedback device for feeding back data on bad products in the judging device to the conductive pattern forming device in order to reduce the number of bad products. The manufacturing system of the printed wiring board performs cutting of the good products in the cutting device based on the data transmitted from the data control device.

[0097] This printed wiring board manufacturing system can be configured similarly to the printed wiring board manufacturing system in the first embodiment, except that it includes the conductive pattern forming device and the feedback device.

[0098] The manufacturing system of the printed wiring board can suppress the mixing of the defective products into the good products, similarly to the manufacturing system of the printed wiring board in the first embodiment. Furthermore, the manufacturing system of the printed wiring board is provided with the feedback device capable of feeding back the data on the defective products in the determination device to the conductive pattern forming device, so that the generation of the defective products can be suppressed. As a result, the manufacturing efficiency of the printed wiring board can be further improved.

[0099] [Other embodiments]

[0100] The embodiments disclosed herein are illustrative in all respects and should not be construed as restrictive. The scope of the present invention is not limited to the configuration of the above-described embodiments, but is indicated by the patent claims, and is intended to include all modifications within the meaning and scope equivalent to the patent claims.

[0101] The specific structure and configuration of the plurality of printed wiring board sheets in the printed wiring board sheet are not limited to the structure described in the above embodiment. For example, the printed wiring board sheet may be obtained by configuring the substrate into multiple layers. In addition, the conductive pattern forming step, the electrical inspection step, the printed wiring board sheet cutting step, the appearance inspection step, etc. can be set according to the quality required of the printed wiring board.

[0102] In the above embodiment, the structure of giving the identification mark to the printed wiring board single piece in the above determination process is described. Among them, in the above determination process, the above identification mark can also be given to the part other than the above printed wiring board single piece in the above printed wiring board sheet. In addition, the above identification mark can also be given by a method other than laser. Furthermore, in the above determination process, the above identification mark can also not be given.

[0103] In the above-mentioned embodiment, the structure of using the above-mentioned first clamp in the above-mentioned determination process and using the above-mentioned second clamp in the above-mentioned cutting process is described. Among them, the specific structure of the clamp used in the above-mentioned determination process and the above-mentioned cutting process is not limited. For example, it is also possible that the above-mentioned non-contact label is not arranged on the clamp used in the above-mentioned determination process. In addition, it is also possible that the same clamp is used to hold the above-mentioned printed wiring board sheet in the above-mentioned determination process and the above-mentioned cutting process. At this time, it is also possible to use a clamp having the above-mentioned receiving part for receiving the good product cut from the above-mentioned printed wiring board sheet.

[0104] Description of Reference Numerals

[0105] 10 Electrical inspection equipment

[0106] 20 First fixture

[0107] 21. Contactless Tags

[0108] 30 Data control device

[0109] 40 Cutting device

[0110] 41 Laser Head

[0111] 50 Second clamp

[0112] 51 Receiving Department

[0113] 100 Printed wiring board sheets

[0114] 100a Array unit

[0115] 100b Peripheral

[0116] 110 Printed wiring board single chip

[0117] 120 Conductive pattern

[0118] 130 good products

[0119] 140 Defective products.

Claims

1. A method for manufacturing a printed wiring board using a printed wiring board sheet having a plurality of printed wiring board sheets, the method comprising: A determination step of determining whether the plurality of printed wiring board chips are good or bad products by electrical inspection; a cutting step of selectively cutting the good products from the printed wiring board sheet after the determination step; and an appearance inspection step, performing an appearance inspection on the good product cut out in the cutting step, The manufacturing method further comprises a transfer step of transferring data on good or bad products in the determination step to the cutting step, The non-defective products are cut in the cutting step based on the data transferred in the transferring step.

2. The method for manufacturing a printed wiring board according to claim 1, wherein: In the determination step, an identification mark is given to the defective product.

3. The method for manufacturing a printed wiring board according to claim 2, wherein: In the determination step, the identification mark is provided by using a first laser. In the cutting step, the good product is cut out using a second laser beam having a greater intensity than the first laser beam.

4. The method for manufacturing a printed wiring board according to any one of claims 1 to 3, wherein: In the determination step, the printed wiring board sheet is held by a first fixture, A non-contact tag capable of storing quality determination data in the determination step is disposed on the first jig.

5. The method for manufacturing a printed wiring board according to any one of claims 1 to 4, wherein: In the cutting step, the printed wiring board sheet is held by a second jig. The second jig has a receiving portion that receives the good product cut out from the printed wiring board sheet.

6. The method for manufacturing a printed wiring board according to any one of claims 1 to 5, wherein: In order to reduce the number of defective products, the manufacturing method further includes a feedback step of feeding back data on defective products in the determination step to a step preceding the determination step.

7. A printed wiring board manufacturing system using a printed wiring board sheet having a plurality of printed wiring board sheets, the manufacturing system comprising: A determination device for determining whether each of the plurality of printed wiring board chips is a good product or a defective product by electrical inspection; a cutting device for selectively cutting the good products from the printed wiring board sheet; as well as an appearance inspection device for performing appearance inspection on the good product cut by the cutting device, The manufacturing system further comprises a data control device, which transmits data on good or bad products in the determination device to the cutting device. The cutting of the good products in the cutting device is performed based on the data transmitted from the data control device.

Images