Cooking adjusting device and method, detection circuit and control system

Abstract

The embodiment of the invention provides cooking adjustment equipment, a cooking adjustment method, a detection circuit and a control system. The equipment comprises an equipment body, a heating container detection piece and a temperature sensor which are arranged in the equipment body, and a controller electrically connected with the heating container detection piece and the temperature sensor, the at least two heating layers are respectively provided with corresponding support pieces for supporting the heating container, and at least two support pieces are provided with heating container detection pieces; the at least two heating container detection pieces are used for detecting the heating layer where the heating container is located; the temperature sensor is used for detecting the temperature of the heating container in the equipment body; the controller is used for adjusting the heating temperature of the heating container according to the set heating compensation threshold value corresponding to the heating layer where the heating container is located. The heating layer where the heating container is located can be automatically detected, the heating temperature of the heating container is adjusted according to the different heating layers, the cooking effect on food materials is guaranteed, and the user experience is good.

Description

Technical Field

[0001] The present application relates to the field of cooking equipment, and in particular to a cooking adjustment device, method, detection circuit and control system. Background Art

[0002] With the continuous improvement of living standards, ovens have been widely used in people's daily lives. At present, the interior of an oven is generally divided into three heating layers, namely an upper heating layer, a middle heating layer and a lower heating layer.

[0003] Taking the electronic temperature-controlled oven as an example, since the middle heating layer is the most commonly used and has the best heating effect, its temperature compensation value is determined according to the temperature of the middle heating layer. For example, assuming that the temperature detected by the temperature sensor corresponding to the middle heating layer is 100°C, and the actual temperature of the baking tray on the middle heating layer is 110°C, then the temperature compensation value is 10°C (the difference between the two). In actual application, no matter which heating layer the baking tray is placed on, in order to make it reach the actual required temperature, the temperature compensation value of the middle heating layer will be added to the value detected by the temperature sensor. This will cause a problem: the food in the oven often has a better cooking effect in the middle layer, while the cooking effect of the upper and lower layers is poor, affecting the user experience. Summary of the invention

[0004] Multiple aspects of the present application provide a cooking adjustment device, method, detection circuit and control system to ensure the cooking effect of ingredients and improve user experience.

[0005] The embodiment of the present application provides a cooking adjustment device, the cooking adjustment device comprising: a device body, a heating container detection member and a temperature sensor disposed in the device body, and a controller electrically connected to the heating container detection member and the temperature sensor;

[0006] At least two heating layers distributed along the height are arranged in the body of the device, corresponding support members for supporting the heating container are arranged on the at least two heating layers respectively, and the heating container detection member is arranged on at least two of the support members;

[0007] At least two of the heating container detection members are used to detect the heating layer where the heating container is located;

[0008] The temperature sensor is used to detect the temperature of the heating container in the device body;

[0009] The controller is used to adjust the heating temperature of the heating container according to a set heating compensation threshold corresponding to the heating layer where the heating container is located.

[0010] In an optional embodiment, the cooking adjustment device further comprises: a heat insulating member;

[0011] The support member is provided with a groove, and the heating container detection member and the heat insulating member are arranged in the groove, wherein the heat insulating member is arranged between the heating container detection member and the inner cavity of the device body.

[0012] In an optional embodiment, the support member is two symmetrical protruding structures, and the two protruding structures are respectively located on both sides of the heating layer;

[0013] The heating container detection component includes: an infrared emitting component and an infrared receiving component, and the infrared emitting component and the infrared receiving component are respectively arranged in the two protruding structures. The controller is used to determine the heating layer where the heating container is located according to the reception status of the infrared receiving component of the infrared light emitted by the infrared emitting component.

[0014] In an optional embodiment, an upper heating layer, a middle heating layer and a lower heating layer are arranged in the body of the device, the number of the heating container detection members is two, and the two heating container detection members are respectively arranged on the support members corresponding to the middle heating layer and the lower heating layer; wherein,

[0015] If the infrared receiving elements of the middle heating layer and the lower heating layer both receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the support element of the upper heating layer;

[0016] If the infrared receiving element of the lower heating layer receives the infrared light emitted by the corresponding infrared emitting element, and the infrared receiving element of the middle heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the middle heating layer;

[0017] If the infrared receiving element of the middle heating layer receives the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving element of the lower heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the lower heating layer.

[0018] In an optional embodiment, if the infrared receiving elements of the middle heating layer and the lower heating layer do not receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the support element of the lower heating layer.

[0019] In an optional embodiment, a first infrared emitting element is disposed at a first end of the support member corresponding to the middle heating layer, and an infrared receiving element corresponding to the first infrared emitting element is disposed at a second end;

[0020] A second infrared receiving element is disposed at the first end of the support member corresponding to the lower heating layer, and an infrared emitting element corresponding to the second infrared receiving element is disposed at the second end.

[0021] In an optional embodiment, an upper heating layer, a middle heating layer and a lower heating layer are provided in the device body, and the number of the heating container detection members is three, which are respectively provided on the support members corresponding to the upper heating layer, the middle heating layer and the lower heating layer;

[0022] If the infrared receiving element of the upper heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, and the infrared receiving elements of the middle heating layer and the lower heating layer receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the upper heating layer;

[0023] If the infrared receiving element of the middle heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving elements of the upper heating layer and the lower heating layer receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the middle heating layer;

[0024] If the infrared receiving element of the lower heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving elements of the upper heating layer and the middle heating layer receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the support member of the lower heating layer.

[0025] In an optional embodiment, the cooking adjustment device further includes: an infrared transmitting circuit and an infrared receiving circuit;

[0026] The infrared emitting circuit is electrically connected to the controller and the infrared emitting element respectively, and is used to control the infrared emitting element to emit an infrared signal, and input a first output value to the controller, wherein the first output value is used to reflect the signal emission intensity of the infrared emitting element;

[0027] The infrared receiving circuit is electrically connected to the controller and the infrared receiving element, respectively, and is used to control the infrared receiving element to receive the infrared signal sent by the infrared emitting element, and output a second output value to the controller, so as to determine the position of the heating container through the controller, and adjust the first output value.

[0028] In an optional embodiment, the infrared emitting circuit comprises: a first switch simulation circuit and a constant current source circuit, and the controller, the switch simulation circuit, the constant current source circuit and the infrared emitting element are electrically connected in sequence;

[0029] The first switch simulation circuit is used to simulate the switching action of the circuit;

[0030] The constant current source circuit is used to stabilize the signal emission intensity of the infrared emitting element.

[0031] In an optional embodiment, the infrared receiving circuit includes an amplitude conditioning subcircuit, and the amplitude conditioning subcircuit is used to adjust the second output value to within a set range.

[0032] In an optional embodiment, the infrared receiving circuit further includes: a transimpedance amplifier circuit electrically connected to the infrared receiving element, for converting a current signal into a voltage signal and controlling an output voltage of the infrared receiving element within a set range.

[0033] In an optional embodiment, the infrared receiving circuit further includes: a second switch simulation circuit and a differential amplifier circuit, the output end of the controller is electrically connected to the second switch simulation circuit and the differential amplifier circuit in sequence, and the input end of the controller is electrically connected in sequence;

[0034] The second switch simulation circuit is used to simulate the switching action of the circuit;

[0035] The differential amplifier circuit is used to amplify the electrical signal output by the infrared receiving element.

[0036] The embodiment of the present application also provides a detection circuit, including: an infrared transmitting circuit and an infrared receiving circuit;

[0037] The infrared emitting circuit is electrically connected to the controller and the infrared emitting element respectively, and is used to control the infrared emitting element to emit an infrared signal, and input a first output value to the controller, wherein the first output value is used to reflect the signal emission intensity of the infrared emitting element;

[0038] The infrared receiving circuit is electrically connected to the controller and the infrared receiving element, respectively, and is used to control the infrared receiving element to receive the infrared signal sent by the infrared emitting element, and output a second output value to the controller, so as to determine the position of the heating container through the controller, and adjust the first output value.

[0039] The present application also provides a cooking adjustment method, including:

[0040] Obtaining the temperature of a heating container in a device body, wherein at least two heating layers distributed along the height are arranged in the device body, corresponding support members for supporting the heating container are arranged on the at least two heating layers, and the heating container detection member is arranged on at least two of the support members;

[0041] Determine the heating layer where the heating container is located by at least two of the heating container detection components;

[0042] The heating temperature of the heating container is adjusted according to the set heating compensation threshold corresponding to the heating layer where the heating container is located.

[0043] In an optional embodiment, the heating container detection element includes: an infrared emitting element and an infrared receiving element, and the device body is provided with an upper heating layer, a middle heating layer and a lower heating layer; the heating layer where the heating container is located is determined by at least two of the heating container detection elements, including:

[0044] If the infrared receiving elements of the middle heating layer and the lower heating layer do not receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the supporting element of the lower heating layer.

[0045] The present application also provides a cooking control system, comprising: a device body, wherein the device body is provided with one or more processors and one or more memories storing computer programs; the processor is used to:

[0046] Obtaining the temperature of the heating container in the device body, wherein at least two heating layers distributed along the height are arranged in the device body, corresponding support members for supporting the heating container are respectively arranged on the at least two heating layers, and the heating container detection member is arranged on at least two of the support members;

[0047] Determine the heating layer where the heating container is located by at least two of the heating container detection components;

[0048] The heating temperature of the heating container is adjusted according to the set heating compensation threshold corresponding to the heating layer where the heating container is located.

[0049] In the embodiment of the present application, corresponding support members are respectively provided on at least two heating layers in the device body, so that the support and fixation of the heating container can be achieved. By providing a heating container detection member on at least two support members, the heating layer where the heating container is located can be determined, and then combined with the temperature of the heating container detected by the temperature sensor, the temperature of the heating layer where the heating container is located can be adjusted, and then the heating temperature of the heating container can be adjusted. That is, the present application can automatically detect the heating layer where the heating container is located, and complete the heating temperature adjustment of the heating container for different heating layers, thereby ensuring the cooking effect of the food and providing a better user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0051] Figure 1 A schematic diagram of the structure of a cooking adjustment device provided by an exemplary embodiment of the present application;

[0052] Figure 2A schematic structural diagram of a heat insulation member provided for an exemplary embodiment of the present application;

[0053] Figure 3 A schematic diagram of the structure of a cooking adjustment device provided by an exemplary embodiment of the present application;

[0054] Figure 4 A schematic diagram of the structure of an infrared transmitting circuit provided by an exemplary embodiment of the present application;

[0055] Figure 5 A schematic diagram of the structure of an infrared receiving circuit provided by an exemplary embodiment of the present application;

[0056] Figure 6a A circuit waveform diagram of a controller output pin provided by an exemplary embodiment of the present application;

[0057] Figure 6b A circuit waveform diagram of an output end of an infrared transmitting circuit provided by an exemplary embodiment of the present application;

[0058] Figure 6c A circuit waveform diagram of an output end of an infrared receiving circuit provided by an exemplary embodiment of the present application;

[0059] Figure 6d A circuit waveform diagram of an infrared transmitting circuit and an infrared receiving circuit output terminal combined according to an exemplary embodiment of the present application;

[0060] Figure 6e A circuit waveform diagram when the output terminal of an infrared receiving circuit provided by an exemplary embodiment of the present application is zero;

[0061] Figure 7 A flowchart of a cooking adjustment method provided by an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0062] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0063] With the continuous improvement of living standards, ovens have been widely used in people's daily lives. The interior of the current oven is generally divided into three heating layers, namely the upper heating layer, the middle heating layer and the lower heating layer. Taking the electronic temperature-controlled oven as an example, since the middle heating layer is the most commonly used and has a good heating effect, its temperature compensation value is determined according to the temperature of the middle heating layer. For example, assuming that the temperature detected by the temperature sensor corresponding to the middle heating layer is 100°C, and the actual temperature of the baking tray on the middle heating layer is 110°C, then the temperature compensation value is 10°C (the difference between the two). In actual application, no matter which heating layer the baking tray is placed on, in order to make it reach the actual required temperature, the temperature compensation value of the middle heating layer will be added to the value detected by the temperature sensor. This will cause a problem: the food in the oven often has a better cooking effect in the middle layer, while the cooking effects of the upper and lower layers are poor, affecting the user experience. In view of this, an embodiment of the present application provides a cooking adjustment device.

[0064] Figure 1 A schematic diagram of the structure of a cooking adjustment device provided in an embodiment of the present application, such as Figure 1 As shown, the device includes: a device body 10, a heating container detection member 11 and a temperature sensor (not shown in the figure) arranged in the device body 10, and a controller (not shown in the figure) electrically connected to the heating container detection member 11 and the temperature sensor. An upper heating layer, a middle heating layer and a lower heating layer are arranged in the device body 10, and the upper heating layer, the middle heating layer and the lower heating layer are respectively provided with corresponding support members 12 for supporting the heating container, and at least two of the support members are provided with a heating container detection member 11. Among them, at least two heating container detection members 11 are used to detect the heating layer where the heating container is located; the temperature sensor is used to detect the temperature of the heating container in the device body 10; and the controller is used to adjust the heating temperature of the heating container according to the set heating compensation threshold corresponding to the heating layer where the heating container is located.

[0065] It should be understood that in actual applications, different equipment bodies 10 have different locations of internal heat sources, some in the upper part, some in the middle part, and some in the lower part. Therefore, the temperature value detected by the temperature sensor set in the equipment body 10 will deviate from the temperature value we ultimately need. In view of this, this application will pre-set the heating compensation thresholds corresponding to the upper heating layer, the middle heating layer, and the lower heating layer according to the actual situation of the equipment body 10, and then adjust the heating temperature of the heating container based on the heating compensation threshold.

[0066] Specifically, assuming that the heating container is placed on the lower heating layer, after the cooking adjustment device turns on the heating cooking, at least two heating container detection components will cooperate with each other to detect the heating layer where the heating container is located, and at the same time, the temperature sensor will detect the temperature of the heating container. After determining the temperature of the heating container, the heating temperature of the heating container is adjusted based on the heating compensation threshold corresponding to the lower heating layer on the basis of the temperature. In simple terms, the final adjusted temperature value is equal to the temperature of the heating container detected by the temperature sensor plus the pre-set heating compensation threshold corresponding to the lower heating layer. For example, the heating container is located on the upper heating layer, and the temperature of the heating container detected by the temperature sensor is 90°C. Then, the target temperature we finally want to obtain is 90°C plus the pre-set heating compensation threshold corresponding to the upper heating layer. The heating temperature of the heating container can be adjusted to the target temperature.

[0067] As a way to achieve this, Figure 1 As shown, the cooking adjustment device can be a baking oven, and the device body 10 is the oven body of the baking oven, and the oven body is provided with an air outlet 101 and an openable oven door 102, and the heating container can be a baking tray. In order to ensure the sealing between the oven body and the oven door 102, a sealing ring 103 can be provided on the oven door 102 along the circumferential direction, and in order to enable the user to clearly observe the condition of the oven body, a plurality of oven lights 104 can be provided in the oven body to illuminate the interior of the oven body. As a preferred embodiment, the plurality of oven lights 104 can be provided near the upper heating layer.

[0068] The temperature sensor in the furnace body may be an NTC temperature sensor, and the controller may be a microcontroller unit (MCU). The specific structures of the heating container detection member 11 and the support member 12 can be seen in the following embodiments, and will not be described in detail here.

[0069] The cooking adjustment device provided in the embodiment of the present application can realize the support and fixation of the heating container by respectively providing corresponding support members 12 on at least two heating layers in the device body 10. The heating container detection member 11 is provided on at least two support members, so that the heating layer where the heating container is located can be determined, and then combined with the temperature of the heating container detected by the temperature sensor, the temperature of the heating layer where the heating container is located can be adjusted, and then the heating temperature of the heating container can be adjusted. That is, the present application can automatically detect the heating layer where the heating container is located, and complete the heating temperature adjustment of the heating container for different heating layers, thereby ensuring the cooking effect of the food and providing a better user experience.

[0070] In the embodiments of the present application, Figure 2As shown, the cooking adjustment device further includes: a heat insulating member 13. A groove is provided on the support member 12, and the heating container detection member 11 and the heat insulating member 13 are arranged in the groove, wherein the heat insulating member 13 is arranged between the heating container detection member 11 and the inner cavity of the device body 10.

[0071] It should be understood that after the cooking adjustment device starts heating, the temperature inside the device body 10 will rise rapidly. By providing the heat insulating member 13, damage to the heating container detection member 11 can be avoided, and the service life of the heating container detection member 11 can be extended. The heat insulating member 13 can be heat insulating glass, but it is not limited thereto, as long as it can achieve the heat insulating effect and does not affect the normal use of the heating container detection member 11.

[0072] Furthermore, if Figure 3 As shown, the support member 12 is two symmetrical protrusion structures, and the two protrusion structures are respectively located on both sides of the heating layer. The heating container detection member 11 includes: an infrared emitting member 111 and an infrared receiving member 112, and the infrared emitting member 111 and the infrared receiving member 112 are respectively arranged in the two protrusion structures. The controller is used to determine the heating layer where the heating container is located according to the reception of the infrared light emitted by the infrared emitting member 111 by the infrared receiving member 112.

[0073] In practical applications, the infrared emitting element 111 of a certain heating layer (upper heating layer, or middle heating layer, or lower heating layer) emits infrared light (i.e., infrared signal). If the corresponding infrared receiving element 112 receives the infrared signal, it means that there is no obstacle between the two, that is, there is no heating container. On the contrary, if the infrared receiving element 112 corresponding to the infrared emitting element 111 does not receive the infrared signal, it means that there is a heating container between the two, and the heating container absorbs the infrared light. Among them, the infrared emitting element 111 can be an infrared emitting tube, and the infrared receiving element 112 can be an infrared receiving tube compatible with it.

[0074] In order to facilitate the placement, movement, or removal of the heating container, the raised structure may be a raised slide rail structure, and the two raised slide rail structures are symmetrically distributed on both sides of the heating layer.

[0075] The number of the heating container detection components may be two or three, specifically:

[0076] As an implementation method, the number of heating container detection members is two, and the two heating container detection members are respectively arranged on the support members corresponding to the middle heating layer and the lower heating layer;

[0077] If the infrared receiving elements of the middle heating layer and the lower heating layer both receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the upper heating layer. It should be understood that because the heating container has been placed in the device body for cooking and heating, if the infrared receiving elements of the middle heating layer and the lower heating layer both receive the infrared light emitted by the corresponding infrared emitting element, it means that there is no heating container in the middle heating layer and the lower heating layer, and it can be determined that the heating container is on the support element corresponding to the upper heating layer.

[0078] If the infrared receiving element of the lower heating layer receives the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving element of the middle heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the middle heating layer.

[0079] If the infrared receiving element of the middle heating layer receives the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving element of the lower heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the lower heating layer.

[0080] It should be understood that in actual applications, since the infrared light emitted by the infrared emitting element is not necessarily completely blocked by the heating container, in order to reduce interference, the infrared emitting elements and infrared receiving elements of the middle heating layer and the lower heating layer can be arranged relative to each other. Specifically, the first end of the support element corresponding to the middle heating layer is provided with a first infrared emitting element, and the second end is provided with an infrared receiving element corresponding to the first infrared emitting element; the first end of the support element corresponding to the lower heating layer is provided with a second infrared receiving element, and the second end is provided with an infrared emitting element corresponding to the second infrared receiving element. The specific placement positions can be found in Figure 3 .

[0081] Similarly, the two heating container detection components can also be respectively arranged on the support components corresponding to the upper heating layer and the middle heating layer, or respectively arranged on the support components corresponding to the upper heating layer and the lower heating layer. The detection principle and the setting method of the infrared transmitting component and the infrared receiving component are the same as above and will not be repeated here.

[0082] As another implementation, there are three heating container detection members, which are respectively arranged on the support members corresponding to the upper heating layer, the middle heating layer and the lower heating layer.

[0083] Among them, if the infrared receiving element of the upper heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving elements of the middle heating layer and the lower heating layer receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the support element of the upper heating layer.

[0084] If the infrared receiving element of the middle heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving elements of the upper heating layer and the lower heating layer receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the middle heating layer.

[0085] If the infrared receiving element of the lower heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving elements of the upper heating layer and the middle heating layer receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the support element of the lower heating layer.

[0086] The principle of heating container position detection in this implementation is the same as the above example, but by providing heating container detection components on the support components corresponding to the upper heating layer, the middle heating layer and the lower heating layer, the detection accuracy can be improved.

[0087] Arranging the heating container detection parts in the height direction like this can avoid interference of the heating container detection parts by the food with height on the container. Usually, the food is placed on the container at a certain height, which will block or reflect the infrared light. Therefore, if there are multiple layers of infrared receiving parts that do not receive the infrared light, it can be judged that the heating container is located in the lowest layer that does not receive the infrared light. In the embodiment of the present application, when the two heating container detection parts are respectively arranged on the support parts corresponding to the middle heating layer and the lower heating layer, if the infrared receiving part of the lower heating layer does not receive the infrared light emitted by the corresponding infrared emitting part, and the infrared receiving part of the middle heating layer does not receive the infrared light emitted by the corresponding infrared emitting part, it can be judged that the heating container is located on the support part of the lower heating layer, and the height of the food in the container reaches the position of the middle heating layer, blocking the infrared light of the middle heating layer.

[0088] In addition, in the embodiment of the present application, the cooking adjustment device further includes: an infrared emission circuit (see Figure 4 ) and infrared receiving circuit (see Figure 5 ). The infrared transmitting circuit is electrically connected to the controller and the infrared transmitting element respectively, and is used to control the infrared transmitting element to transmit infrared signals, and input a first output value to the controller, and the first output value is used to reflect the signal transmission intensity of the infrared transmitting element. The infrared receiving circuit is electrically connected to the controller and the infrared receiving element respectively, and is used to control the infrared receiving element to receive the infrared signal sent by the infrared transmitting element, and output a second output value to the controller, so as to determine the position of the heating container through the controller, and adjust the first output value.

[0089] In practical applications, the infrared transmitting circuit can be used to control the infrared transmitting element to transmit an infrared signal, and the infrared receiving circuit can be used to control the infrared receiving element to receive the infrared signal sent by the infrared transmitting element, that is, the second output value. If the second output value is 0, or there is no second output value, it means that it has not received the infrared signal sent by the infrared transmitting element, and the heating container is located in the heating layer where the infrared transmitting element and the infrared receiving element are located. If the second output value is less than the set threshold, it means that the infrared light signal received by the infrared receiving element is weak and needs to be enhanced. In this case, the first output value of the infrared transmitting element can be increased, that is, the signal emission intensity of the infrared transmitting element can be increased. Among them, the infrared receiving circuit includes an amplitude conditioning subcircuit, which is used to adjust the second output value to within a set range to avoid the second output value being too large and burning the controller.

[0090] In the embodiment of the present application, the infrared emitting circuit includes: a first switch simulation circuit and a constant current source circuit, and the controller, the switch simulation circuit, the constant current source circuit and the infrared emitting element are electrically connected in sequence. The first switch simulation circuit is used to simulate the switching action of the circuit, and the constant current source circuit is used to stabilize the signal emission strength of the infrared emitting element.

[0091] By setting the first switch simulation circuit, the switching times of the circuit can be simulated according to actual needs to improve the operation effect, and by setting the constant current source circuit, the intensity of the infrared light emitted by the infrared emitting element can be made more stable.

[0092] The first switch simulation circuit may include Figure 4 The controller output terminals PA4 and PA6, and the analog switch U2, and the constant current source circuit may include Figure 4 The operational amplifier U6.2 and the transistor Q2 in the infrared transmitting circuit, the specific working process of the first switch analog circuit and the constant current source circuit in the infrared transmitting circuit can be found in the subsequent examples and will not be introduced here.

[0093] In an embodiment of the present application, the infrared receiving circuit further includes: a transimpedance amplifier circuit, electrically connected to the infrared receiving element, for converting a current signal into a voltage signal, and controlling the output voltage of the infrared receiving element within a set range. In addition, the infrared receiving circuit further includes: a second switch simulation circuit and a differential amplifier circuit, wherein the output end of the controller is electrically connected to the second switch simulation circuit and the differential amplifier circuit in sequence, and the input end of the controller is electrically connected in sequence. The second switch simulation circuit is used to simulate the switching action of the circuit, and the differential amplifier circuit is used to amplify the electrical signal output by the infrared receiving element.

[0094] By setting up a second switch simulation circuit, the number of switching times of the circuit can be simulated according to actual needs to improve the operating effect, and by setting up a differential amplifier circuit, the electrical signal output by the infrared receiving element can be amplified to improve the use effect of the infrared receiving circuit.

[0095] Among them, the transimpedance amplifier circuit may include Figure 5 The resistor R1 and the operational amplifier U12.2 in the second switch simulation circuit may include Figure 5 The output pin PB9 of the controller, and the analog switch U8. The differential amplifier circuit may include Figure 5 The resistor R5 and the operational amplifier U11.2 in the infrared receiving circuit, the specific working process of the transimpedance amplifier circuit, the second switch analog circuit and the differential amplifier circuit in the infrared receiving circuit can be found in the subsequent examples and will not be introduced here.

[0096] The infrared transmitting circuit and the infrared receiving circuit are described in detail below:

[0097] like Figure 4 As shown in FIG. 1 , in the infrared emission circuit, PA4 and PA6 are both connected to the output pin of the controller. In practical applications, when the first output value of the infrared emission element needs to be increased, the signal value of PA4 is increased through the controller. When PA6 is at a high level, the voltage value of PA4 after being divided by resistors R17 and R18 is output through the output terminal COM of the analog switch U2. The circuit waveform of the PA6 pin can be seen in FIG. Figure 6a .

[0098] When PA6 is at a low level, the output terminal COM of the analog switch U2 outputs a low level, that is, the output is 0. In simple terms, when the analog switch U2 is turned on, it is at a high level, and when the analog switch U2 is turned off, it is at a low level. The value of the analog switch U2 is predetermined by the controller, for example, the switch action is performed continuously 100 times per second.

[0099] Following the above, the voltage divided by resistors R17 and R18 continues to flow to the operational amplifier U6.2. The same-direction input terminal (pin 5) and the reverse input terminal (pin 6) of the operational amplifier U6.2 constitute a differential amplifier. In addition, the operational amplifier U6.2 and the transistor Q2 form a constant current source, making the intensity of the infrared light emitted by the infrared emitting element more stable.

[0100] Subsequently, the voltage value amplified by U6.2 is converted into a current signal through resistor R25. At this time, the current output to the infrared emitter is increased, and the infrared light output intensity is also enhanced. The enhanced current value will be output to PC0 through voltage follower U6.1. Among them, voltage follower U6.1 is used to prevent the sampling result of the previous stage from affecting the sampling result of the next stage. The circuit waveform output by PC0 can be seen in Figure 6b .

[0101] like Figure 5As shown in the figure, in the infrared receiving circuit, the greater the infrared light intensity received by the infrared receiving element, the greater the output current. In practical applications, the output current of the infrared receiving element is converted into voltage through resistor R1. The resistor R1 and the operational amplifier U12.2 form a transimpedance amplifier circuit, and its output voltage can swing within the range of 2.5V to 5.0V.

[0102] Subsequently, the output current of the infrared receiver is converted into voltage through resistor R1 and flows to the analog switch U8. PB9 in the figure is connected to the output pin of the controller. When PB9 is high, the output port COM of the analog switch U8 outputs the transimpedance amplified voltage of the infrared receiver tube. When PB9 is low, the analog switch COM outputs a low level.

[0103] After the infrared receiving tube transimpedance amplified voltage is outputted at the output port COM of the analog switch U8, its output is outputted to the inverting input terminal (pin 6) of the operational amplifier U11.2 through the voltage follower circuit composed of the operational amplifier U10.2. The 2.5V voltage passes through the voltage follower circuit composed of the operational amplifier U10.1 and then through the resistor R4 and the voltage division of the resistor R5 and is inputted to the non-inverting input terminal (pin 5) of the operational amplifier U11.2. The non-inverting input and the inverting input form a differential amplifier circuit with the operational amplifier U11.2. The output VO of the differential amplifier circuit = the input of the inverting input terminal - 2.5V.

[0104] Then, the output of the differential amplifier circuit passes through the amplitude conditioning subcircuit composed of operational amplifier U11.1, resistor R9, resistor R8, resistor R10, and resistor R11, limiting the output voltage amplitude to 0V to 3V, and then the voltage value is sampled through the controller PC3 port. If the value received by PC3 is less than the set threshold, the controller increases the Figure 4 If the value of PC3 is 0, it means that the heating container is in the heating layer where the infrared transmitter and the infrared receiver are located. The circuit waveform output by PC3 can be found in Figure 6c , and the circuit waveform after the output of PC0 and PC3 is combined can be seen in Figure 6d The circuit waveform when the PC3 output is 0 can be seen in Figure 6e .

[0105] By using an infrared transmitting circuit and an infrared receiving circuit to continuously adjust the intensity of infrared light, it is possible to avoid the infrared light intensity being too high or too low, and effectively eliminate the interference caused by ambient light.

[0106] The embodiments of the present application are described in detail below in conjunction with application scenarios.

[0107] Application scenario example 1:

[0108] Assume that the cooking adjustment device can be an oven, the device body is the oven body, an openable and closable oven door is provided on the oven body, and the heating container can be a baking tray; the number of heating container detection parts is two, and the two heating container detection parts are respectively arranged on the support parts corresponding to the middle heating layer and the lower heating layer; the heating container detection part includes corresponding infrared emitting tubes and infrared receiving tubes; the support part is a convex rail.

[0109] In specific implementation, the oven door is opened, and the baking tray is placed on the raised rail of the upper heating layer. At this time, the oven light is turned on.

[0110] The furnace door is closed, the furnace light is turned off, and the infrared receiving elements of the middle heating layer and the lower heating layer receive the infrared light emitted by the corresponding infrared emitting elements, and it is determined that the heating container is located on the convex track of the upper heating layer. Specifically, the controller can determine the position of the heating container according to the circuit waveform diagram output by the infrared receiving circuit.

[0111] At this time, the temperature of the heating container detected by the temperature sensor is 90°C, and the pre-set heating compensation threshold for the upper heating layer of the oven is 10°C. The controller will control the heating source to continue heating the baking tray until it is heated to 100°C.

[0112] Application scenario example 2:

[0113] Assume that the cooking adjustment device can be an oven, the device body is the oven body, an openable and closable oven door is provided on the oven body, and the heating container can be a baking tray; there are three heating container detection parts, which are respectively arranged on the support parts corresponding to the upper heating layer, the middle heating layer and the lower heating layer; the heating container detection parts include corresponding infrared emitting tubes and infrared receiving tubes; the support parts are convex rails.

[0114] In specific implementation, the oven door is opened, and the baking tray is placed on the raised rail of the lower heating layer. At this time, the oven light is turned on.

[0115] When the furnace door is closed and the furnace light is turned off, the infrared receiving elements of the upper heating layer and the middle heating layer both receive the infrared light emitted by the corresponding infrared emitting elements, while the infrared receiving element of the lower heating layer does not receive the infrared light emitted by the corresponding infrared emitting element. At this time, it is determined that the heating container is located on the convex track of the lower heating layer. Specifically, the controller can determine the position of the heating container according to the circuit waveform diagram output by the infrared receiving circuit.

[0116] At this time, the temperature of the heating container detected by the temperature sensor is 90°C, and for the lower heating layer of the oven, the pre-set heating compensation threshold is 20°C. The controller will control the heating source to continue heating the baking tray until it is heated to 110°C.

[0117] The embodiment of the present application also provides a detection circuit, which includes: an infrared transmitting circuit and an infrared receiving circuit. The infrared transmitting circuit is electrically connected to the controller and the infrared transmitting element, respectively, and is used to control the infrared transmitting element to transmit an infrared signal, and input a first output value to the controller, and the first output value is used to reflect the signal transmission intensity of the infrared transmitting element; the infrared receiving circuit is electrically connected to the controller and the infrared receiving element, respectively, and is used to control the infrared receiving element to receive the infrared signal sent by the infrared transmitting element, and output a second output value to the controller, so as to determine the position of the heating container through the controller, and adjust the first output value.

[0118] Figure 7 A flowchart of a cooking adjustment method provided in an embodiment of the present application is shown in FIG. Figure 7 As shown, the method includes:

[0119] Step 701, obtaining the temperature of the heating container in the device body, wherein an upper heating layer, a middle heating layer and a lower heating layer are arranged in the device body, and the upper heating layer, the middle heating layer and the lower heating layer are respectively provided with corresponding support members for supporting the heating container, and at least two of the support members are provided with a heating container detection member.

[0120] Step 702: Determine the heating layer where the heating container is located by at least two heating container detection components.

[0121] Step 703: adjust the heating temperature of the heating container according to the set heating compensation threshold corresponding to the heating layer where the heating container is located.

[0122] Figure 7 The method shown can execute the working process of the cooking and regulating device in the aforementioned embodiment. For detailed execution process and technical effects, please refer to the description in the aforementioned embodiment and will not be repeated here.

[0123] In the embodiment of the present application, the heating container detection component includes: an infrared emitting component and an infrared receiving component, and the device body is provided with an upper heating layer, a middle heating layer and a lower heating layer; the heating layer where the heating container is located is determined by at least two of the heating container detection components, including:

[0124] If the infrared receiving elements of the middle heating layer and the lower heating layer do not receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the supporting element of the lower heating layer.

[0125] The present application also provides a cooking control system, which includes: a device body, on which one or more processors and one or more memories storing computer programs are disposed; the processor is used to:

[0126] Obtaining the temperature of a heating container in a device body, wherein an upper heating layer, a middle heating layer and a lower heating layer are provided in the device body, and the upper heating layer, the middle heating layer and the lower heating layer are respectively provided with corresponding support members for supporting the heating container, and at least two of the support members are provided with a heating container detection member;

[0127] Determine the heating layer where the heating container is located by at least two heating container detection components;

[0128] The heating temperature of the heating container is adjusted according to the set heating compensation threshold corresponding to the heating layer where the heating container is located.

[0129] The system can execute the working process of the cooking adjustment equipment in the aforementioned embodiment. The detailed execution process and technical effects can be found in the description of the aforementioned embodiment and will not be repeated here.

[0130] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0131] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0132] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0133] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0134] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0135] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0136] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0137] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0138] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.

Claims

1. A cooking adjustment device, characterized in that: include: An equipment body, a heating container detection member and a temperature sensor disposed in the equipment body, and a controller electrically connected to the heating container detection member and the temperature sensor; At least two heating layers distributed along the height are arranged in the body of the device, corresponding support members for supporting the heating container are arranged on the at least two heating layers respectively, and the heating container detection member is arranged on at least two of the support members; At least two of the heating container detection members are used to detect the heating layer where the heating container is located; The temperature sensor is used to detect the temperature of the heating container in the device body; The controller is used to adjust the heating temperature of the heating container according to a set heating compensation threshold corresponding to the heating layer where the heating container is located.

2. The device according to claim 1, characterized in that Also includes: Thermal insulation; The support member is provided with a groove, and the heating container detection member and the heat insulating member are arranged in the groove, wherein the heat insulating member is arranged between the heating container detection member and the inner cavity of the device body.

3. The device according to claim 1, characterized in that The support member is two symmetrical protruding structures, and the two protruding structures are respectively located on both sides of the heating layer; The heating container detection component includes: an infrared emitting component and an infrared receiving component, and the infrared emitting component and the infrared receiving component are respectively arranged in the two protruding structures. The controller is used to determine the heating layer where the heating container is located according to the reception status of the infrared receiving component of the infrared light emitted by the infrared emitting component.

4. The device according to claim 3, characterized in that The device body is provided with an upper heating layer, a middle heating layer and a lower heating layer, the number of the heating container detection members is two, and the two heating container detection members are respectively provided on the support members corresponding to the middle heating layer and the lower heating layer; wherein, If the infrared receiving elements of the middle heating layer and the lower heating layer both receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the support element of the upper heating layer; If the infrared receiving element of the lower heating layer receives the infrared light emitted by the corresponding infrared emitting element, and the infrared receiving element of the middle heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the middle heating layer; If the infrared receiving element of the middle heating layer receives the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving element of the lower heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the lower heating layer.

5. The device according to claim 4, characterized in that If the infrared receiving elements of the middle heating layer and the lower heating layer do not receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the supporting element of the lower heating layer.

6. The device according to claim 4, characterized in that A first infrared emitting element is disposed at the first end of the support member corresponding to the middle heating layer, and an infrared receiving element corresponding to the first infrared emitting element is disposed at the second end; A second infrared receiving element is disposed at the first end of the support member corresponding to the lower heating layer, and an infrared emitting element corresponding to the second infrared receiving element is disposed at the second end.

7. The device according to claim 3, characterized in that The device body is provided with an upper heating layer, a middle heating layer and a lower heating layer, and the number of the heating container detection members is three, which are respectively provided on the support members corresponding to the upper heating layer, the middle heating layer and the lower heating layer; If the infrared receiving element of the upper heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, and the infrared receiving elements of the middle heating layer and the lower heating layer receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the upper heating layer; If the infrared receiving element of the middle heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving elements of the upper heating layer and the lower heating layer receive the infrared light emitted by the corresponding infrared emitting element, it is determined that the heating container is located on the support element of the middle heating layer; If the infrared receiving element of the lower heating layer does not receive the infrared light emitted by the corresponding infrared emitting element, while the infrared receiving elements of the upper heating layer and the middle heating layer receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the support member of the lower heating layer.

8. The device according to claim 1, characterized in that Also includes: Infrared transmitting circuit and infrared receiving circuit; The infrared emitting circuit is electrically connected to the controller and the infrared emitting element respectively, and is used to control the infrared emitting element to emit an infrared signal, and input a first output value to the controller, wherein the first output value is used to reflect the signal emission intensity of the infrared emitting element; The infrared receiving circuit is electrically connected to the controller and the infrared receiving element, respectively, and is used to control the infrared receiving element to receive the infrared signal sent by the infrared emitting element, and output a second output value to the controller, so as to determine the position of the heating container through the controller, and adjust the first output value.

9. The device according to claim 8, characterized in that The infrared emitting circuit comprises: a first switch simulation circuit and a constant current source circuit, wherein the controller, the switch simulation circuit, the constant current source circuit and the infrared emitting element are electrically connected in sequence; The first switch simulation circuit is used to simulate the switching action of the circuit; The constant current source circuit is used to stabilize the signal emission intensity of the infrared emitting element.

10. The device according to claim 8, characterized in that The infrared receiving circuit comprises an amplitude adjustment subcircuit, and the amplitude adjustment subcircuit is used to adjust the second output value to within a set range.

11. The device according to claim 8, characterized in that The infrared receiving circuit also includes: a transimpedance amplifier circuit, which is electrically connected to the infrared receiving element and is used to convert a current signal into a voltage signal and control the output voltage of the infrared receiving element within a set range.

12. The device according to claim 8, characterized in that The infrared receiving circuit further comprises: a second switch simulation circuit and a differential amplifier circuit, the output end of the controller is electrically connected to the second switch simulation circuit and the differential amplifier circuit in sequence, and the input end of the controller is electrically connected in sequence; The second switch simulation circuit is used to simulate the switching action of the circuit; The differential amplifier circuit is used to amplify the electrical signal output by the infrared receiving element.

13. A detection circuit, characterized in that: include: Infrared transmitting circuit and infrared receiving circuit; The infrared emitting circuit is electrically connected to the controller and the infrared emitting element respectively, and is used to control the infrared emitting element to emit an infrared signal, and input a first output value to the controller, wherein the first output value is used to reflect the signal emission intensity of the infrared emitting element; The infrared receiving circuit is electrically connected to the controller and the infrared receiving element respectively, and is used to control the infrared receiving element to receive the infrared signal sent by the infrared emitting element, and output a second output value to the controller, so as to determine the position of the heating container through the controller, and adjust the first output value.

14. A cooking adjustment method, characterized in that: include: Obtaining the temperature of a heating container in a device body, wherein at least two heating layers distributed along the height are arranged in the device body, corresponding support members for supporting the heating container are arranged on the at least two heating layers, and at least two of the support members are provided with a heating container detection member; Determine the heating layer where the heating container is located by at least two of the heating container detection components; The heating temperature of the heating container is adjusted according to the set heating compensation threshold corresponding to the heating layer where the heating container is located.

15. The method according to claim 14, characterized in that The heating container detection element includes: an infrared emitting element and an infrared receiving element. The device body is provided with an upper heating layer, a middle heating layer and a lower heating layer. The heating layer where the heating container is located is determined by at least two of the heating container detection elements, including: If the infrared receiving elements of the middle heating layer and the lower heating layer do not receive the infrared light emitted by the corresponding infrared emitting elements, it is determined that the heating container is located on the supporting element of the lower heating layer.

16. A cooking control system, characterized in that: include: A device body, wherein the device body is provided with one or more processors and one or more memories storing a computer program; the processor is used to: Obtaining the temperature of the heating container in the device body, wherein at least two heating layers distributed along the height are arranged in the device body, the at least two heating layers are respectively provided with corresponding support members for supporting the heating container, and at least two of the support members are provided with the heating container detection member; Determine the heating layer where the heating container is located by at least two of the heating container detection components; The heating temperature of the heating container is adjusted according to the set heating compensation threshold corresponding to the heating layer where the heating container is located.

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