Retention type tin wire welding equipment for welding
By introducing the circuit board cooling protection mechanism and the circuit board coating protection mechanism during welding into the tin wire welding equipment, the problems of low soldering efficiency and easy circuit board damage are solved, and efficient soldering and long-life protection of the circuit board is achieved.
Patent Information
- Application Number
- CN202510222464.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2025-04-29
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing tin wire welding equipment needs to remove the tin wire and welding torch after the welding is completed, resulting in inefficient welding efficiency, and the high temperature of the welding torch may damage the circuit board, and the circuit board is prone to corrosion in humid environments, affecting its service life.
A tin wire welding equipment for retained welding is designed, using a circuit board cooling protection mechanism and a circuit board coating protection mechanism during welding. The cooling protection mechanism uses a cylindrical water storage tank and a U-shaped water-cooled pipe to achieve rapid cooling of the circuit board to prevent high-temperature damage; the coating protection mechanism forms a protective layer through nanocoatings and resin coatings, improving the insulation and corrosion resistance of the circuit board.
Improves soldering efficiency, protects the circuit board from high temperature damage, and extends the service life of the circuit board in humid environments.
Smart Images

Figure CN119897544A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of welding, in particular to a tin wire welding device for retention type welding. Background Art
[0002] Tin wire is a kind of wire made of tin, which is mainly used for soldering circuit boards. It is mainly used for soldering electronic devices, such as computers, mobile phones, televisions and other consumer electronic products, as well as the connection of various industrial instruments and equipment.
[0003] When tin wire is needed, the welding head on the welding gun is heated first. When the welding gun head is heated to the degree that can melt the tin wire, the tin wire is sent to the soldering point on the circuit board and made to contact with the welding gun head. The welding gun head can melt the tin wire in contact with it to produce tin liquid. The tin liquid produced by the melting of the tin wire will drip onto the soldering point under the action of gravity. When the tin liquid is cold and solidified, an electrical connection can be formed, so that the components on the circuit board can be conductive to each other with the pads, thereby realizing circuit connectivity. The welding gun that uses tin wire for welding can be called a tin wire welding equipment.
[0004] However, after the solder joints at a certain position are processed by this equipment, the tin wire needs to be removed first and then the welding gun to prevent the tin wire from sticking to the pad. However, this also makes it impossible to quickly connect the two solder joints to each other, and its efficiency is poor. Moreover, when the solder joints on the circuit board are tinned by the tin wire and the welding gun, the temperature of the welding gun itself will also be transferred to the circuit board. If the number of solder joints is large, the components on this circuit board may be damaged due to long-term high temperature. Moreover, when the circuit board produced by this welding equipment is used in a relatively humid environment for a long time, this circuit board may be aged faster due to corrosion from the external environment, thereby affecting its service life. Therefore, it does not meet the existing needs, and we have proposed a tin wire welding equipment for retained welding. Summary of the invention
[0005] The purpose of the present invention is to provide a tin wire welding device for retained welding, so as to solve the problem proposed in the above background technology that after the solder joint at a certain position is processed by this device, the tin wire needs to be removed first and then the welding gun, in order to prevent the tin wire from sticking to the soldering pad, but this also makes it impossible to quickly connect the two solder joints to each other, and its efficiency is poor. When the solder joints on the circuit board are tinned by the tin wire and the welding gun, the temperature of the welding gun itself will also be transferred to the circuit board. If the number of solder joints is large, the components on this circuit board may be damaged due to long-term high temperature. When the circuit board produced by this welding equipment is used in a relatively humid environment for a long time, this circuit board may be aged rapidly due to corrosion from the external environment, thereby affecting its service life.
[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a tin wire welding device for retention welding, comprising a tin wire welding table, a circuit board is placed in the middle position of the upper end surface of the tin wire welding table, a circuit board cooling protection mechanism during welding is provided below the circuit board, the circuit board cooling protection mechanism during welding comprises a cylindrical water storage tank, a fixing ring, a water bag film, cooling water, two U-shaped water cooling pipes, two adsorption fixing heads, two piston plates and a synchronous transmission mechanism, the two U-shaped water cooling pipes are respectively fixedly installed on both sides of the inner wall of the cylindrical water storage tank, the cooling water is located inside the U-shaped water cooling pipe, the fixing ring is fixed to the upper end surface of the cylindrical water storage tank, the water bag film is fixed to the inner side of the fixing ring, and the lower end surface of the water bag film is in contact with the cooling water;
[0007] The two piston plates are respectively located inside the two U-shaped water-cooling tubes, and the synchronous transmission mechanism can synchronously drive the columnar water storage tank, the fixing ring, the water bag membrane, the cooling water and the U-shaped water-cooling tube to move upward while driving the two piston plates to move downward.
[0008] Preferably, a welding gun placement platform is provided on one side of the upper end surface of the tin wire welding platform, and a welding gun is placed on the upper end surface of the welding gun placement platform.
[0009] Preferably, the synchronous transmission mechanism includes a single-bar cylinder, a piston rod of the single-bar cylinder is connected to a tooth row, the tooth row is meshed with a first gear, the axis of the first gear is connected to a first square rotating shaft, a first threaded lifting rod connected to a tin wire welding table through a threaded structure is provided on the outer side of the top end of the first square rotating shaft, a first square slot is provided in the middle position of the lower end surface of the first threaded lifting rod, and the first square rotating shaft is inserted into the first square slot.
[0010] Preferably, a second gear is provided on the upper fixed sleeve of the outer surface of the first square shaft, and a third gear is meshed on both sides of the outer surface of the second gear. The axis of the third gear is connected to a transmission shaft, and a second square shaft is fixedly connected to the middle position of the upper end surface of the transmission shaft, and a second threaded lifting rod is provided on the outer side of the second square shaft, which is connected to the adsorption fixed head through a threaded structure, and a second square slot is provided in the middle position of the lower end surface of the second threaded lifting rod, the second square shaft is inserted into the second square slot, and the two second threaded lifting rods are respectively fixed between the two piston plates.
[0011] Preferably, the inner wall cross-sections of the second threaded lifting rod and the first square slot are both square, the outer surfaces of the second square rotating shaft and the first square rotating shaft are respectively fitted with the inner walls of the second threaded lifting rod and the first square slot, and the second square rotating shaft and the first square rotating shaft are respectively slidably connected with the second threaded lifting rod and the first square slot.
[0012] Preferably, a circuit board coating protection mechanism is provided on one side of the circuit board, and the circuit board coating protection mechanism includes a columnar lifting platform, an electric position adjustment head, a nano coating bracket, two material tank mounting platforms, a resin coating bracket, a resin coating tank, a nano coating tank, two electric rotating heads, two circular external threaded plates, two circular brushes, two small glue pumps and four spray heads, the electric position adjustment head is installed on the upper end surface of the columnar lifting platform, the surfaces of the nano coating bracket and the resin coating bracket facing the electric position adjustment head are fixed to the electric position adjustment head, the two material tank mounting platforms are respectively fixed to the nano coating bracket and the resin coating bracket, and the resin coating tank and the nano coating tank are respectively installed on the upper end surfaces of the two material tank mounting platforms through threaded structures, and the resin coating tank and the nano coating tank contain resin coating and nano coating respectively;
[0013] The two small glue pumps are fixedly installed inside the two material tank mounting platforms, and the two small glue pumps are communicated with the inside of the resin coating tank and the nano coating tank respectively;
[0014] The two electric rotating heads are respectively fixedly mounted on the lower end surfaces of the two material tank mounting platforms, the two circular external thread plates are respectively fixedly mounted on the lower end surfaces of the two electric rotating heads, the two circular brushes are respectively fixedly mounted on the lower end surfaces of the two circular external thread plates, the four spray heads are respectively located on both sides of the two circular brushes, and the spray heads are connected to the nearest small glue pump through a delivery pipe;
[0015] The circuit board coating protection mechanism also includes two roller bearing rings, the upper end surfaces of the two roller bearing rings are respectively fixed to the lower end surfaces of the two material tank mounting platforms, the four spray heads are respectively fixedly installed on both sides of the lower end surfaces of the two roller bearing rings, and a protective cover is provided below the roller bearing ring, which is installed on the outer surface of the circular external threaded plate through a threaded structure.
[0016] Preferably, a drying lamp is provided in front of the two protective covers, the upper end surface of the drying lamp is fixedly connected with a drying lamp mounting bracket, and the surface of the drying lamp mounting bracket facing the electric azimuth adjustment head is fixed to the electric azimuth adjustment head.
[0017] Preferably, a support base fixed to the lower end surface of the cylindrical lifting platform is provided below the drying lamp mounting bracket, a movable motor is provided in front of the support base, the output shaft of the movable motor is connected to a movable threaded rod through a coupling, and the movable threaded rod transversely penetrates the support base and is connected to the support base through a threaded structure.
[0018] Preferably, a guide rod is provided on both sides of the movable threaded rod, and the guide rod is movable transversely and penetrates the supporting base.
[0019] Preferably, a protective cover plate located at the lower end surface of the tin wire welding platform is provided below the horizontal bar cylinder, and the tin wire welding platform and the protective cover plate are fixed by screws.
[0020] Compared with the prior art, the present invention has the following beneficial effects:
[0021] 1. The circuit board cooling protection mechanism of the present invention can push the columnar water storage tank, the fixing ring, the water bag film, the cooling water and the U-shaped water cooling pipe upwards while fixing the circuit board during welding. The cooling water can be cooled by the U-shaped water cooling pipe. As the water bag film rises, the upper end surface of the water bag film will be closely attached to the lower end surface of the circuit board. When the soldering point on the circuit board is welded by the welding gun and the tin wire, the heat transferred from the welding gun to the circuit board can be quickly consumed by the cooling water, so as to prevent the circuit board from being in a high temperature state for a long time when the soldering point on the circuit board is welded. The rising technical solution can protect the circuit board during welding.
[0022] 2. The present invention can first apply a layer of nano-coating and then a layer of resin coating on the outer surface of the circuit board through the circuit board coating protection mechanism. The applied nano-coating and resin coating can respectively form two thin film protection layers, thereby improving the circuit board's own insulation, moisture-proof, anti-leakage, shock-proof, dust-proof, anti-corrosion, anti-aging and corona resistance properties. The above technical solution increases the service life of the circuit board in harsh environments. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0024] Figure 2 It is a side view of the back structure of the present invention as a whole;
[0025] Figure 3 For the present invention Figure 1 Schematic diagram of the internal structure at A in the middle;
[0026] Figure 4 This is a front view of the internal structure of the present invention;
[0027] Figure 5 For the present invention Figure 4 A magnified view of the structure at B in the middle;
[0028] Figure 6 For the present invention Figure 5 Enlarged view of the structure at point C in the middle.
[0029] In the figure: 1. Tin wire welding table; 2. Circuit board coating protection mechanism; 201. Column lifting platform; 202. Electric azimuth adjustment head; 203. Drying lamp mounting bracket; 204. Drying lamp; 205. Nano coating bracket; 206. Material tank mounting table; 207. Resin coating bracket; 208. Resin coating tank; 209. Nano coating tank; 210. Electric rotating head; 211. Circular external thread plate; 212. Circular brush; 213. Small glue pump; 214. Spraying head; 215. Delivery pipe; 216. Mobile motor; 217. Mobile threaded rod; 218. Guide rod; 219, support base; 220, roller bearing ring; 221, protective cover; 3, circuit board; 4, horizontal bar cylinder; 5, gear row; 6, first gear; 7, first square shaft; 8, second gear; 9, first threaded lifting rod; 10, first square slot; 11, cylindrical water storage tank; 12, fixing ring; 13, water bag membrane; 14, cooling water; 15, U-shaped water cooling pipe; 16, third gear; 17, transmission shaft; 18, second square shaft; 19, adsorption fixing head; 20, piston plate; 21, second threaded lifting rod; 22, second square slot; 23, welding gun. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0031] See also Figures 1 to 6 , an embodiment provided by the present invention: a tin wire welding device for retention welding, comprising a tin wire welding platform 1, a circuit board 3 is placed in the middle position of the upper end surface of the tin wire welding platform 1, a circuit board cooling protection mechanism during welding is provided below the circuit board 3, the circuit board cooling protection mechanism during welding comprises a cylindrical water storage tank 11, a fixing ring 12, a water bag film 13, a cooling water 14, two U-shaped water cooling pipes 15, two adsorption fixing heads 19, two piston plates 20 and a synchronous transmission mechanism, the two U-shaped water cooling pipes 15 are respectively fixedly installed on both sides of the inner wall of the cylindrical water storage tank 11, the cooling water 14 is located inside the U-shaped water cooling pipe 15, the fixing ring 12 is fixed to the upper end surface of the cylindrical water storage tank 11, the water bag film 13 is fixed to the inner side of the fixing ring 12, and the lower end surface of the water bag film 13 is in contact with the cooling water 14;
[0032] The two piston plates 20 are respectively located inside the two U-shaped water-cooling tubes 15. The synchronous transmission mechanism can synchronously drive the columnar water storage tank 11, the fixing ring 12, the water bag membrane 13, the cooling water 14 and the U-shaped water-cooling tube 15 to move upward while driving the two piston plates 20 to move downward.
[0033] A welding gun placement platform is provided on one side of the upper end surface of the tin wire welding platform 1, and a welding gun 23 is placed on the upper end surface of the welding gun placement platform; when it is necessary to perform welding processing on the soldering point position on the circuit board 3, the welding gun 23 is first heated, and when the welding gun 23 is heated to a degree that can melt the tin wire, the tin wire is picked up and sent to the soldering point on the circuit board 3, and is brought into contact with the welding gun 23. The welding gun 23 can melt the tin wire in contact with it, thereby generating tin liquid, and the tin liquid generated by the melting of the tin wire will drip onto the soldering point under the action of gravity. Due to the wettability of the tin liquid, the tin liquid dripping onto the circuit board 3 will automatically shrink to the soldering point position. At this time, do not remove the tin wire. Press the tin wire against the circuit board 3 and heat it with the welding gun 23 to continuously produce tin liquid. In this process, move the tin wire toward another soldering point position until the tin liquids on the soldering points on both sides are connected. When the tin liquids on the soldering points on both sides are connected, immediately remove the welding gun 23. This technology can quickly tin the soldering points on both sides by retaining the tin wire on the circuit board 3, thereby shortening the wiring and welding time.
[0034] The synchronous transmission mechanism includes a horizontal bar cylinder 4, a piston rod of which is connected to a tooth row 5, the tooth row 5 is meshed with a first gear 6, the axis of the first gear 6 is connected to a first square rotating shaft 7, a first threaded lifting rod 9 connected to the tin wire welding platform 1 through a threaded structure is provided on the outer side of the top end of the first square rotating shaft 7, a first square slot 10 is provided in the middle position of the lower end surface of the first threaded lifting rod 9, and the first square rotating shaft 7 is inserted into the first square slot 10; before the circuit board 3 is tinned, the horizontal bar cylinder 4 can be started first, and the tooth row 5 connected thereto can be pushed to move by the horizontal bar cylinder 4, and the first gear 6 meshed therewith will rotate along with the movement of the tooth row 5, and the rotating first gear 6 can drive the first square rotating shaft 7 connected thereto to rotate;
[0035] The inner wall cross-sections of the second threaded lifting rod 21 and the first square slot 10 are both square, and the outer surfaces of the second square rotating shaft 18 and the first square rotating shaft 7 are respectively fitted with the inner walls of the second threaded lifting rod 21 and the first square slot 10, and the second square rotating shaft 18 and the first square rotating shaft 7 are respectively slidably connected between the second threaded lifting rod 21 and the first square slot 10; since the outer surface of the first square rotating shaft 7 is fitted with the inner wall of the first square slot 10 located at the lower end surface of the first threaded lifting rod 9, as the first square rotating shaft 7 rotates, the first threaded lifting rod 9 will rotate therewith, and under the transmission of the thread structure, the rotating first threaded lifting rod 9 can move up and down, and at this time, the first threaded lifting rod 9 is moved upward, and as the first threaded lifting rod 9 rises, the columnar storage connected to it is The water tank 11, the fixing ring 12, the water bag membrane 13, the cooling water 14 and the U-shaped water cooling tube 15 will move upward together. As the water bag membrane 13 rises, the upper end surface of the water bag membrane 13 will fit with the lower end surface of the circuit board 3. When the two fit together, start the U-shaped water cooling tube 15 to cool the cooling water 14. The temperature of the cooling water 14 itself will be transferred to the circuit board 3 through the water bag membrane 13. When the soldering points on the circuit board 3 are welded by the welding gun 23 and the tin wire, the low-temperature cooling water 14 can quickly consume the heat transferred from the welding gun 23 to the circuit board 3, so as to prevent the circuit board 3 from being in a high temperature state for a long time when the soldering points on the circuit board 3 are welded. The rising technical solution can protect the circuit board 3 during the welding process.
[0036] A second gear 8 is fixedly sleeved on the upper side of the outer surface of the first square shaft 7, and a third gear 16 is meshed on both sides of the outer surface of the second gear 8. A transmission shaft 17 is connected to the axis of the third gear 16, and a second square shaft 18 is fixedly connected to the middle position of the upper end surface of the transmission shaft 17. A second threaded lifting rod 21 connected to the adsorption fixing head 19 through a threaded structure is provided on the outer side of the second square shaft 18, and a second square slot 22 is provided in the middle position of the lower end surface of the second threaded lifting rod 21. The second square shaft 18 is inserted into the second square slot 22, and the two second threaded lifting rods 21 are respectively fixed between the two piston plates 20; during the rotation of the first square shaft 7, the second gear 8 fixedly sleeved on the outer surface of the first square shaft 7 and the two third gears 16 meshed with the second gear 8 will rotate together, and the rotating third gear 16 can drive the transmission shaft 17 connected to the axis of the third gear 16 and the second square shaft 18 fixed on the upper end surface of the transmission shaft 17 to rotate. The inner wall of the second square slot 22 on the lower end face of the lifting rod 21 fits together. When the second square rotating shaft 18 rotates, the second threaded lifting rod 21 will rotate together with it. Under the transmission of the threaded structure, the rotating second threaded lifting rod 21 can move up and down. When the cylindrical water storage tank 11 is moved upward by the first square rotating shaft 7, the second threaded lifting rod 21 will move downward under the transmission of this threaded structure. As the second threaded lifting rod 21 descends, the piston plate 20 fixed to the lower end face of the second threaded lifting rod 21 will move downward together with it. As the piston plate 20 descends, a suction force will be generated to fix the circuit board 3 at the current position. By fixing the circuit board 3, the circuit board 3 can be prevented from being pushed by the water bag film 13 moving upward. Since the water bag film 13 is in contact with the circuit board 3, the circuit board 3 is in a fixed state. Therefore, the shape of the upper end face of the water bag film 13 that fits the lower end face of the circuit board 3 can be changed according to the shape of the lower end face of the circuit board 3, so that it can fit more closely with the lower end face of the circuit board 3, thereby improving the cooling effect.
[0037] The synchronous pushing and fixing structure has only one power source, the horizontal cylinder 4, so when a failure occurs in the structure, it can be quickly checked and the fault location can be found;
[0038] After the tin damage treatment of the circuit board 3 is completed, the gear row 5 is pulled back to the original position by the horizontal cylinder 4 to release the fixation of the circuit board 3 .
[0039] A circuit board coating protection mechanism 2 is provided on one side of the circuit board 3, and the circuit board coating protection mechanism 2 includes a columnar lifting platform 201, an electric azimuth adjustment head 202, a nano coating bracket 205, two material tank mounting platforms 206, a resin coating bracket 207, a resin coating tank 208, a nano coating tank 209, two electric rotating heads 210, two circular external thread plates 211, two circular brushes 212, two small glue pumps 213 and four spray heads 214. The electric azimuth adjustment head 202 is installed on the column The upper end surface of the shaped lifting platform 201, the surfaces of the nano coating bracket 205 and the resin coating bracket 207 facing the electric azimuth adjustment head 202 are fixed to the electric azimuth adjustment head 202, the two material tank mounting platforms 206 are respectively fixed to the nano coating bracket 205 and the resin coating bracket 207, and the resin coating tank 208 and the nano coating tank 209 are respectively installed on the upper end surfaces of the two material tank mounting platforms 206 through a threaded structure, and the resin coating tank 208 and the nano coating tank 209 contain resin coating and nano coating respectively;
[0040] Two small glue pumps 213 are fixedly installed inside the two material tank mounting platforms 206, and the two small glue pumps 213 are communicated with the inside of the resin coating tank 208 and the nano coating tank 209 respectively;
[0041] The two electric rotating heads 210 are respectively fixedly installed on the lower end surfaces of the two material tank mounting platforms 206, the two circular external threaded plates 211 are respectively fixedly installed on the lower end surfaces of the two electric rotating heads 210, the two circular brushes 212 are respectively fixedly installed on the lower end surfaces of the two circular external threaded plates 211, and the four spray heads 214 are respectively located on both sides of the two circular brushes 212, and the spray heads 214 are connected to the nearest small glue pump 213 through a delivery pipe 215.
[0042] The circuit board coating protection mechanism 2 also includes two roller bearing rings 220, the upper end surfaces of the two roller bearing rings 220 are respectively fixed to the lower end surfaces of the two tank mounting platforms 206, and the four spray heads 214 are respectively fixedly installed on both sides of the lower end surfaces of the two roller bearing rings 220, and a protective cover 221 is provided below the roller bearing rings 220 and is installed on the outer surface of the circular external thread plate 211 through a threaded structure; the roller bearing rings 220 can prevent the circular brush 212 from driving the spray head 214 to rotate together during the later rotation process, thereby causing the conveying pipe 215 to be wound around the tank mounting platform 206;
[0043] After the welding process of the circuit board 3 is completed, the circular brush 212 located below the nano coating tank 209 is first moved to the top of the circuit board 3 by the electric azimuth adjustment head 202, and then the protective cover 221 located below the nano coating tank 209 is removed to expose the circular brush 212 to the outside, and then the circular brush 212 is driven down by the columnar lifting platform 201. When the circular brush 212 is in contact with the circuit board 3, the columnar lifting platform 201 is closed, and then the electric rotating head 210 is started to drive the circular brush 212 in contact with the circuit board 3 to rotate;
[0044] When the circular brush 212 fitted with the circuit board 3 rotates, the small glue pump 213 connected to the inside of the nano coating tank 209 is started to extract the nano coating inside the nano coating tank 209 and transport it to the spray head 214 through the delivery pipe 215. The nano coating can be sprayed onto the circuit board 3 through the spray head 214, and the nano coating sprayed on the circuit board 3 can be evenly spread by the rotating circular brush 212. In this process, the rotating circular brush 212 is driven by the electric azimuth adjustment head 202 to move back and forth on the upper end surface of the circuit board 3. After the circular brush 212 moves back and forth on the upper end surface of the circuit board 3 six times, the electric rotating head 210 is turned off, and the circular brush 212 is pulled back to its original height by the columnar lifting platform 201.
[0045] A drying lamp 204 is provided in front of the two protective covers 221, and the upper end surface of the drying lamp 204 is fixedly connected with a drying lamp mounting bracket 203, and the surface of the drying lamp mounting bracket 203 facing the electric position adjustment head 202 is fixed to the electric position adjustment head 202; when the nano coating is applied, the drying lamp 204 is moved to the top of the circuit board 3 by the electric position adjustment head 202, and the drying lamp 204 is started to dry the nano coating. When the nano coating is dried, the circular brush 212 located below the resin coating tank 208 is moved to the electric position adjustment head 202. A layer of resin coating is applied on the outer surface of the circuit board 3 in the same manner as the nano coating. After the resin coating is applied, it is dried again by a drying lamp 204. Through the above technical solution, a layer of nano coating can be applied on the outer surface of the circuit board 3 first and then a layer of resin coating can be applied. The applied nano coating and resin coating can form two thin film protective layers respectively, so as to improve the insulation, moisture-proof, leakage-proof, shock-proof, dust-proof, corrosion-proof, aging-proof and corona-resistant properties of the circuit board 3 itself, thereby improving the service life of the circuit board 3 in harsh environments;
[0046] When the nano-coating and resin coating are applied, the two removed protective covers 221 are put back to their original positions to seal the two circular brushes 212 again. By sealing the circular brushes 212, the gas of the nano-coating and resin coating absorbed by the circular brushes 212 can be prevented from being emitted to the outside and then being absorbed by the human body.
[0047] A supporting base 219 fixed to the lower end surface of the columnar lifting platform 201 is provided below the drying lamp mounting bracket 203, and a moving motor 216 is provided in front of the supporting base 219. The output shaft of the moving motor 216 is connected to a moving threaded rod 217 through a coupling, and the moving threaded rod 217 transversely penetrates the supporting base 219 and is connected to the supporting base 219 through a threaded structure; a guide rod 218 is provided on both sides of the moving threaded rod 217, and the guide rod 218 transversely moves through the supporting base 219; when the circuit board coating protection mechanism 2 is not needed, the moving threaded rod 217 connected thereto can be driven to rotate by the moving motor 216, so as to move the supporting base 219 and the columnar lifting platform 201 fixed between the supporting base 219 forward. Through the above technical solution, the circuit board coating protection mechanism 2 can be moved forward when the circuit board coating protection mechanism 2 is not needed, so as to avoid the situation where the circuit board coating protection mechanism 2 occupies the welding space.
[0048] A protective cover plate is provided below the horizontal bar cylinder 4 and is located on the lower end surface of the tin wire welding platform 1, and the tin wire welding platform 1 and the protective cover plate are fixed by screws; the protective cover plate can protect the horizontal bar cylinder 4, and when the horizontal bar cylinder 4 fails, the protective cover plate can be removed for maintenance.
[0049] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
Claims
1. A tin wire welding device for retention welding, comprising a tin wire welding station (1), characterized in that: A circuit board (3) is placed in the middle of the upper end surface of the tin wire welding table (1), and a circuit board cooling protection mechanism during welding is provided below the circuit board (3). The circuit board cooling protection mechanism during welding comprises a columnar water storage tank (11), a fixing ring (12), a water bag membrane (13), cooling water (14), two U-shaped water cooling pipes (15), two adsorption fixing heads (19), two piston plates (20) and a synchronous transmission mechanism. The two U-shaped water cooling pipes (15) are respectively fixedly mounted on both sides of the inner wall of the columnar water storage tank (11), the cooling water (14) is located inside the U-shaped water cooling pipes (15), the fixing ring (12) is fixed to the upper end surface of the columnar water storage tank (11), the water bag membrane (13) is fixed to the inner side of the fixing ring (12), and the lower end surface of the water bag membrane (13) is in contact with the cooling water (14); The two piston plates (20) are respectively located inside the two U-shaped water-cooling tubes (15), and the synchronous transmission mechanism can synchronously drive the columnar water storage tank (11), the fixing ring (12), the water bag membrane (13), the cooling water (14) and the U-shaped water-cooling tube (15) to move upward while driving the two piston plates (20) to move downward.
2. The tin wire welding equipment for retention welding according to claim 1, characterized in that: A welding gun placement platform is provided on one side of the upper end surface of the tin wire welding platform (1), and a welding gun (23) is placed on the upper end surface of the welding gun placement platform.
3. The tin wire welding equipment for retention welding according to claim 1, characterized in that: The synchronous transmission mechanism comprises a horizontal-bar cylinder (4), a piston rod of the horizontal-bar cylinder (4) being connected to a tooth row (5), the tooth row (5) being meshed with a first gear (6), the axis of the first gear (6) being connected to a first square rotating shaft (7), a first threaded lifting rod (9) being connected to a tin wire welding platform (1) via a threaded structure being provided on the outer side of the top end of the first square rotating shaft (7), a first square slot (10) being provided at the middle position of the lower end surface of the first threaded lifting rod (9), and the first square rotating shaft (7) being inserted into the interior of the first square slot (10).
4. The tin wire welding equipment for retention welding according to claim 3 is characterized in that: A second gear (8) is provided on the upper fixed sleeve of the outer surface of the first square rotating shaft (7), and a third gear (16) is meshed on both sides of the outer surface of the second gear (8). The axis of the third gear (16) is connected to a transmission rotating shaft (17), and a second square rotating shaft (18) is fixedly connected to the middle position of the upper end surface of the transmission rotating shaft (17). A second threaded lifting rod (21) connected to the adsorption fixing head (19) through a threaded structure is provided on the outer side of the second square rotating shaft (18), and a second square slot (22) is provided at the middle position of the lower end surface of the second threaded lifting rod (21). The second square rotating shaft (18) is inserted into the inside of the second square slot (22), and two second threaded lifting rods (21) are respectively fixed between the two piston plates (20).
5. The tin wire welding equipment for retention welding according to claim 4, characterized in that: The cross-sectional shapes of the inner walls of the second threaded lifting rod (21) and the first square slot (10) are both square, the outer surfaces of the second square rotating shaft (18) and the first square rotating shaft (7) are respectively fitted with the inner walls of the second threaded lifting rod (21) and the first square slot (10), and the second square rotating shaft (18) and the first square rotating shaft (7) are respectively slidably connected between the second threaded lifting rod (21) and the first square slot (10).
6. The tin wire welding equipment for retention welding according to claim 1, characterized in that: A circuit board coating protection mechanism (2) is provided on one side of the circuit board (3), and the circuit board coating protection mechanism (2) comprises a columnar lifting platform (201), an electric azimuth adjustment head (202), a nano coating support (205), two material tank mounting platforms (206), a resin coating support (207), a resin coating tank (208), a nano coating tank (209), two electric rotating heads (210), two circular external thread plates (211), two circular brushes (212), two small glue pumps (213) and four spray heads (214), and the electric azimuth adjustment head (202) is installed on The upper end surface of the columnar lifting platform (201), the surfaces of the nano coating support (205) and the resin coating support (207) facing the electric azimuth adjustment head (202) are fixed to the electric azimuth adjustment head (202), the two material tank mounting platforms (206) are respectively fixed to the nano coating support (205) and the resin coating support (207), and the resin coating tank (208) and the nano coating tank (209) are respectively installed on the upper end surfaces of the two material tank mounting platforms (206) through a threaded structure, and the resin coating tank (208) and the nano coating tank (209) contain resin coating and nano coating respectively; The two small glue pumps (213) are respectively fixedly installed inside the two material tank mounting platforms (206), and the two small glue pumps (213) are respectively communicated with the inside of the resin coating tank (208) and the nano coating tank (209); The two electric rotating heads (210) are respectively fixedly mounted on the lower end surfaces of the two material tank mounting platforms (206); the two circular external thread plates (211) are respectively fixedly mounted on the lower end surfaces of the two electric rotating heads (210); the two circular brushes (212) are respectively fixedly mounted on the lower end surfaces of the two circular external thread plates (211); the four spray heads (214) are respectively located on both sides of the two circular brushes (212); and the spray heads (214) are connected to the nearest small glue pump (213) via a delivery pipe (215); The circuit board coating protection mechanism (2) also includes two roller bearing rings (220), the upper end surfaces of the two roller bearing rings (220) are respectively fixed to the lower end surfaces of the two material tank mounting platforms (206), the four spray heads (214) are respectively fixedly installed on both sides of the lower end surfaces of the two roller bearing rings (220), and a protective cover (221) is provided below the roller bearing ring (220) and is installed on the outer surface of the circular external thread plate (211) through a threaded structure.
7. The tin wire welding equipment for retention welding according to claim 6, characterized in that: A drying lamp (204) is provided in front of the two protective covers (221); a drying lamp mounting bracket (203) is fixedly connected to the upper end surface of the drying lamp (204); and a surface of the drying lamp mounting bracket (203) facing the electric azimuth adjustment head (202) is fixed to the electric azimuth adjustment head (202).
8. The tin wire welding equipment for retention welding according to claim 7, characterized in that: A support base (219) fixed to the lower end surface of the columnar lifting platform (201) is provided below the drying lamp mounting bracket (203); a movable motor (216) is provided in front of the support base (219); an output shaft of the movable motor (216) is connected to a movable threaded rod (217) via a coupling; the movable threaded rod (217) passes through the support base (219) transversely and is connected to the support base (219) via a threaded structure.
9. The tin wire welding equipment for retention type welding according to claim 8, characterized in that: A guide rod (218) is provided on both sides of the movable threaded rod (217), and the guide rod (218) is movable transversely and penetrates the supporting base (219).
10. The tin wire welding equipment for retention type welding according to claim 3, characterized in that: A protective cover plate is provided below the horizontal bar cylinder (4) and is located on the lower end surface of the tin wire welding platform (1), and the tin wire welding platform (1) and the protective cover plate are fixed by screws.