Increasing the suction cup fabric application structure and control methods in humid environments

Abstract

This invention relates to a suction cup fabric application structure and control method for improving performance in humid environments, belonging to the technical field of silicon wafer processing equipment. The structure includes a suction cup with a rotating shaft at its lower end, a central hole, and several annularly distributed suction grooves communicating with the central hole at its upper end. A vacuum pump connection hole communicating with the central hole is located within the rotating shaft. A silicon wafer is placed on the upper end of the suction cup, and suction cup fabric is placed between the silicon wafer and the suction cup. A support ring assembly step is located on the outer circumference of the upper end of the suction cup, and a support ring nested within the suction cup is mounted on the support ring assembly step. An edge cavity is formed between the suction cup fabric, the support ring, and the suction cup. Several vacuum branch channels communicating with the edge cavity are located within the suction cup. This design features a simple structure, good structural stability, and convenient operation. By creating a new vacuum cavity at the edge, the edge of the suction cup fabric is fixed, effectively controlling the number of silicon wafer breakages, the loss of suction cup fabric and polishing cloth, and the reduction in utilization rate.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing equipment technology, specifically to a suction cup cloth application structure and control method for improving humid environments. Background Technology

[0002] In the semiconductor wafer edge polishing process, ensuring the silicon wafer is stably held on the rotary table without warping is crucial for guaranteeing polishing results and minimizing breakage. Current technology involves attaching a suction cup fabric to a chuck using adhesive, and then using the chuck fabric to hold the silicon wafer.

[0003] Due to the humid environment and insufficient fixation on the outer periphery of the suction cup cloth, the suction cup cloth may detach after a period of use, resulting in poor silicon wafer adhesion. The greatest losses are silicon wafer breakage, failure of the suction cup cloth and polishing cloth, and reduced utilization rate. Summary of the Invention

[0004] This invention primarily addresses the shortcomings of existing technologies by providing a suction cup fabric application structure and its control method for improving performance in humid environments. This structure boasts advantages such as simplicity, high stability, and ease of operation. By adding a vacuum cavity at the edge, the suction cup fabric edge is fixed, effectively controlling the number of silicon wafer breakages, the loss of suction cup fabric and polishing cloth, and the reduction in operational efficiency.

[0005] The above-mentioned technical problems of the present invention are mainly solved by the following technical solutions:

[0006] A suction cup fabric application structure for improving humid environments includes a suction cup, a rotating shaft at the lower end of the suction cup, a central hole on the suction cup, a plurality of suction grooves arranged in a ring and communicating with the central hole at the upper end of the suction cup, a vacuum pump communication hole communicating with the central hole in the rotating shaft, a silicon wafer at the upper end of the suction cup, and a suction cup fabric between the silicon wafer and the suction cup.

[0007] Preferably, the upper outer circumference of the suction cup is provided with a support ring assembly step, and the support ring assembly step is provided with a support ring nested with the suction cup. An edge cavity is formed between the suction cup cloth, the support ring, and the suction cup. The suction cup is provided with a plurality of vacuum branch channels that communicate with the edge cavity.

[0008] During vacuum adsorption, the application effect is checked and an initial vacuum is built within the edge cavity. The edge cavity ensures sufficient adsorption force to prevent relative movement from causing detachment from the edge to the center. The support ring serves as support for the edge of the suction cup fabric and simultaneously facilitates the formation of the edge cavity.

[0009] Preferably, an auxiliary adsorption gas path is provided between the vacuum branch channel and the vacuum pump connection hole, and a one-way valve is provided between the vacuum branch channel and the auxiliary adsorption gas path. The vacuum branch channel establishes an interconnection of gas paths between the one-way valves in the edge cavity.

[0010] Preferably, the suction cup fabric includes an outer ring and an inner ring. The outer ring is connected to the central hole, and the inner ring is fitted to the edge cavity. Several radial strips are provided between the outer ring and the inner ring, and several annular strips integrated with the radial strips are provided between two adjacent radial strips.

[0011] A method for controlling the application of suction cup fabric in humid environments includes the following steps:

[0012] Step 1: Remove the release paper from the adhesive side of the suction cup cloth.

[0013] Step 2: Align the suction cup and suction cup cloth center by center and apply them near the center hole.

[0014] Step 3: Press and apply the adhesive from the center outwards, ensuring that the suction cup's suction grooves are not completely covered by the suction cup cloth.

[0015] Step 4: After installing the suction cup, place a clean and well-maintained standard silicon wafer fixture on the suction cup cloth, and then connect it to the vacuum pump through the vacuum pump connection hole inside the rotating shaft to perform suction vacuum.

[0016] Step 5: Break the vacuum and remove the standard silicon wafer fixture. The process of applying suction cup cloth is now complete.

[0017] As a preferred embodiment, during silicon wafer processing, an auxiliary adsorption gas path is connected to the vacuum pump's communication hole. By employing a horizontally placed one-way valve structure without a return spring, the centrifugal force during suction cup rotation ensures that the sealing bead inside the one-way valve blocks the vacuum branch channel, guaranteeing stable pressure in the edge cavity during silicon wafer processing. The presence of the one-way valve ensures that only vacuum can establish a connection with the edge cavity, preventing water and air from entering the edge cavity.

[0018] As a preferred option, when the machine is in standby mode, water is sprayed upwards from the vacuum pump connection hole and the center hole to keep the suction cup cloth moist.

[0019] Preferably, during silicon wafer processing, vacuum is drawn from the adsorption tank to the central hole and the vacuum pump connection hole, and then extracted by the vacuum pump. The silicon wafer is adsorbed on the suction cup and rotated by the rotating shaft.

[0020] Preferably, during silicon wafer handling, gas diffuses from the vacuum pump connection hole and the central hole into the adsorption tank to prevent the suction cup cloth and the silicon wafer from sticking together.

[0021] The present invention can achieve the following effects:

[0022] This invention provides a suction cup fabric application structure and control method for increasing the effectiveness of the technology in humid environments. Compared with existing technologies, it has the advantages of simple structure, good structural stability, and convenient operation. By adding a vacuum cavity at the edge, the edge of the suction cup fabric is fixed, effectively controlling the number of silicon wafer breakages, the loss of suction cup fabric and polishing fabric, and the reduction in utilization rate. Attached Figure Description

[0023] Figure 1 This is a structural cross-sectional view of the present invention.

[0024] Figure 2 This is a top view of the suction cup structure of the present invention.

[0025] Figure 3 This is a top view of the suction cup fabric of the present invention.

[0026] In the diagram: 1. Silicon wafer; 2. Suction cup cloth; 3. Vacuum pump connecting hole; 4. Adsorption tank; 5. Vacuum branch channel; 6. Support ring; 7. Suction cup; 8. One-way valve; 9. Rotating shaft; 10. Auxiliary adsorption gas path; 11. Support ring assembly step; 12. Center hole; 13. Outer ring; 14. Annular strip; 15. Radial strip; 16. Inner ring. Detailed Implementation

[0027] The technical solution of the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0028] Example: Figure 1 , Figure 2 and Figure 3 As shown, a suction cup cloth application structure for improving humid environments includes a suction cup 7, a rotating shaft 9 at the lower end of the suction cup 7, a central hole 12 on the suction cup 7, and six annularly distributed suction grooves 4 at the upper end of the suction cup 7 that communicate with the central hole 12. A vacuum pump connection hole 3, communicating with the central hole 12, is located inside the rotating shaft 9. A silicon wafer 1 is located at the upper end of the suction cup 7, and a suction cup cloth 2 is placed between the silicon wafer 1 and the suction cup 7. The suction cup cloth 2 includes an outer ring 13 and an inner ring 16. The outer ring 13 communicates with the central hole 12, and the inner ring (16) is fitted with the edge cavity. Six radial strips 15 are provided between the outer ring 13 and the inner ring 16, and eight annular strips 14 integral with the radial strips 15 are provided between each two adjacent radial strips 15. The upper outer circumference of the suction cup 7 is provided with a support ring mounting step 11. A support ring 6 nested within the suction cup 7 is mounted on the support ring mounting step 11. An edge cavity is formed between the suction cup cloth 2, the support ring 6, and the suction cup 7. Three vacuum branch channels 5, spaced at 120-degree intervals and connected to the edge cavity, are provided inside the suction cup 7. During vacuum adsorption, the application effect is checked, and an initial vacuum is established within the edge cavity. An auxiliary adsorption gas path 10 is provided between the vacuum branch channel 5 and the vacuum pump connection hole 3, and a one-way valve 8 is provided between the vacuum branch channel 5 and the auxiliary adsorption gas path 10.

[0029] A method for controlling the application of suction cup fabric in humid environments includes the following steps:

[0030] Step 1: Remove the release paper from the adhesive side of suction cup cloth 2.

[0031] Step 2: Align the suction cup 7 and suction cup cloth 2 and apply them near the center hole 12.

[0032] Step 3: Press and apply the adhesive from the center outwards, while ensuring that the suction groove 4 on the suction cup 7 is not completely covered by the suction cup cloth 2.

[0033] Step 4: After installing the suction cup 7, place a standard silicon wafer fixture with a good and clean surface on the suction cup cloth 2, and then connect it to the vacuum pump through the vacuum pump communication hole 3 in the rotating shaft 9 to perform adsorption vacuum.

[0034] Step 5: Break the vacuum and remove the standard silicon wafer fixture. The process of applying suction cup cloth 2 is now complete.

[0035] During silicon wafer 1 processing, the auxiliary adsorption gas path 10 is connected to the vacuum pump connection hole 3. A horizontally positioned one-way valve 8 without a return spring is used. Utilizing the centrifugal force of the rotating suction cup 7, the sealing bead inside the one-way valve 8 blocks the vacuum branch channel 5, ensuring stable pressure in the edge cavity during silicon wafer 1 processing. The presence of the one-way valve 8 ensures that only vacuum can establish a connection with the edge cavity, preventing water and air from entering. Vacuum from the adsorption tank 4 converges at the central hole 12 and the vacuum pump connection hole 3, and is then extracted by the vacuum pump. The silicon wafer 1 is adsorbed onto the suction cup 7 and rotated by the rotating shaft 9.

[0036] During silicon wafer handling, gas diffuses from the vacuum pump connecting hole 3 and the central hole 12 into the adsorption tank 4 to prevent the suction cup cloth 2 and the silicon wafer 1 from sticking together.

[0037] When the machine is in standby mode, water is sprayed upwards from the vacuum pump connecting hole 3 and the center hole 12 to keep the suction cup cloth moist.

[0038] In summary, this method for controlling the application of suction cup cloth in humid environments has the advantages of simple structure, good structural stability, and convenient operation. By adding a vacuum cavity at the edge, the edge of the suction cup cloth is fixed, effectively controlling the number of silicon wafer breakages, the loss of suction cup cloth and polishing cloth, and the reduction in utilization rate.

[0039] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present invention are covered by the patent scope of the present invention.

Claims

1. A suction cup fabric adhesion structure for improved performance in humid environments, characterized in that: The device includes a suction cup (7), a rotating shaft (9) at the lower end of the suction cup (7), a central hole (12) on the suction cup (7), and several suction grooves (4) arranged in a ring and connected to the central hole (12) at the upper end of the suction cup (7). A vacuum pump connecting hole (3) connected to the central hole (12) is provided in the rotating shaft (9). A silicon wafer (1) is provided at the upper end of the suction cup (7), and a suction cup cloth (2) is provided between the silicon wafer (1) and the suction cup (7). A support ring assembly step (11) is provided on the outer circle of the upper end of the suction cup (7). A support ring (6) nested with the suction cup (7) is provided on the support ring assembly step (11). An edge cavity is formed between the suction cup cloth (2), the support ring (6), and the suction cup (7). Several vacuum branch channels (5) connected to the edge cavity are provided in the suction cup (7). When adsorbing vacuum, the application effect is checked and an initial vacuum is built in the edge cavity.

2. The method for controlling the application of suction cup fabric in humid environments according to claim 1, characterized in that: An auxiliary adsorption gas path (10) is provided between the vacuum branch channel (5) and the vacuum pump connecting hole (3), and a one-way valve (8) is provided between the vacuum branch channel (5) and the auxiliary adsorption gas path (10).

3. The method for controlling the application of suction cup fabric in humid environments according to claim 1, characterized in that: The suction cup cloth (2) includes an outer ring (13) and an inner ring (16). The outer ring (13) is connected to the central hole (12), and the inner ring (16) is fitted to the edge cavity. A number of radial strips (15) are provided between the outer ring (13) and the inner ring (16). A number of annular strips (14) integrated with the radial strips (15) are provided between two adjacent radial strips (15).

4. A method for controlling the application of suction cup fabric in humid environments according to claim 2 includes the following steps: Step 1: Remove the release paper from the adhesive side of the suction cup cloth (2); Step 2: Align the suction cup (7) and suction cup cloth (2) with their centers and apply the cloth near the center hole (12); Step 3: Press and apply from the center outwards, while ensuring that the suction groove (4) on the suction cup (7) is not completely covered by the suction cup cloth (2); Step 4: After installing the suction cup (7), place a standard silicon wafer fixture with a good and clean surface on the suction cup cloth (2), and then connect it to the vacuum pump through the vacuum pump communication hole (3) in the rotating shaft (9) to perform adsorption vacuum. Step 5: The process of breaking the vacuum and removing the standard silicon wafer fixture, and applying the suction cup cloth (2) is completed.

5. The method for controlling the application of suction cup fabric in humid environments according to claim 4, characterized in that: During silicon wafer (1) processing, the auxiliary adsorption gas path (10) is connected to the vacuum pump connection hole (3). By adopting a horizontal one-way valve (8) structure without a return spring, the centrifugal force of the suction cup (7) during rotation is used to seal the vacuum branch channel (5) with the sealing bead inside the one-way valve (8) when the suction cup rotates, ensuring that the pressure of the edge cavity is stable during silicon wafer (1) processing. The presence of the one-way valve (8) ensures that only vacuum can establish a connection with the edge cavity, and water and air cannot enter the edge cavity.

6. The method for controlling the application of suction cup fabric in humid environments according to claim 4, characterized in that: When the machine is in standby mode, water is sprayed upward from the vacuum pump connecting hole (3) and the center hole (12) to keep the suction cup cloth moist.

7. The method for controlling the application of suction cup fabric in humid environments according to claim 4, characterized in that: During the processing of silicon wafer (1), the vacuum is drawn from the adsorption tank (4) to the center hole (12) and the vacuum pump connecting hole (3) and then extracted by the vacuum pump. The silicon wafer (1) is adsorbed on the suction cup (7) and rotated by the rotating shaft (9).

8. The method for controlling the application of suction cup fabric in humid environments according to claim 4, characterized in that: During silicon wafer handling, gas diffuses from the vacuum pump connecting hole (3) and the center hole (12) to the adsorption tank (4) to prevent the suction cup cloth (2) and silicon wafer (1) from sticking together.

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