Implementation method of internal cooling and internal lubricating grinding wheel system

Abstract

The invention discloses an internal cooling and internal lubrication grinding wheel system implementation method which comprises the steps that firstly, the internal cooling mode of a grinding wheel is determined, and a combined cooling mode or a single cooling mode can be selected and comprises conventional liquid cooling, conventional air cooling, nanofluid cooling, liquid nitrogen cooling, carbon dioxide cooling, oscillating heat pipe cooling and semiconductor cooling; secondly, determining lubricating modes in the grinding wheel, wherein the lubricating modes comprise pouring type lubrication, minimal quantity lubrication and grease lubrication; and then according to the selected internal cooling and internal lubrication combination, the overall structure of the grinding wheel base body and a corresponding control module are designed, and finally the internal cooling and internal lubrication grinding wheel system is assembled and debugged. Various forms of internal cooling and internal lubrication in the grinding system are comprehensively considered, and internal cooling and internal lubrication grinding wheel systems with different effects are obtained through the design thought that different internal cooling and different internal lubrication modes are combined; the method is of great significance to design breakthrough of an internal-cooling and internal-lubricating grinding wheel system for grinding machining and improvement of grinding quality of the grinding wheel.

Description

Technical Field

[0001] The invention relates to the technical field of precision grinding, in particular to a method for realizing an internally cooling and internally lubricating grinding wheel system. Background Art

[0002] As an efficient and high-precision material removal method, grinding wheel grinding is widely used in parts processing fields with high precision and high surface quality requirements such as mechanical manufacturing, aerospace, automobiles, and medical equipment. During the grinding process, a large amount of grinding heat and huge grinding force will be generated in the grinding area between the grinding wheel and the workpiece. If the heat is not dissipated and lubricated in time, burns, cracks and other undesirable phenomena will occur on the surface of the workpiece, seriously affecting the processing quality of the workpiece. Traditional cooling and lubrication methods generally use grinding coolant for cooling and lubrication, but due to the air flow layer generated by the rotation around the grinding wheel, it is difficult for the grinding coolant to enter the grinding area, so effective cooling and lubrication cannot be performed.

[0003] At present, domestic and foreign scholars have conducted a lot of research on internal cooling grinding. Compared with the external pouring cooling method, the internal cooling grinding method has the characteristics of directly spraying the coolant from the inside of the grinding wheel through the coolant flow channel opened on the body to the grinding area, which can effectively avoid the influence of the air flow layer generated by the rotation around the grinding wheel, thereby significantly reducing the grinding temperature and preventing or reducing thermal damage to the workpiece surface. However, traditional internal cooling grinding wheels, such as the introduction of nanofluid coolant alone, are more based on single internal cooling and do not effectively combine the role of internal lubrication. Although cooling and lubrication composite solutions have been developed, their comprehensive effect is not very good. In addition, some researchers have used the built-in heat pipe structure of the grinding wheel for cooling, but have not considered the role of internal lubrication in the grinding area.

[0004] In summary, current research has mainly considered the role of internal cooling of the grinding wheel, while ignoring the influence of internal lubrication, and has not achieved good technical breakthroughs. However, cooling and lubrication are inseparable parts of the grinding process, so it is urgent to develop a grinding wheel system that combines internal cooling and internal lubrication to break through existing technologies and improve grinding quality. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a method for implementing an internally cooled and internally lubricated grinding wheel system, which comprehensively considers various forms of internal cooling and internal lubrication in the grinding system, and obtains internally cooled and internally lubricated grinding wheel systems with different effects by combining different internal cooling and different internal lubrication methods to solve the problems of grinding heat dissipation and lubrication in grinding processing and improve the grinding processing quality.

[0006] A method for implementing an internally cooled and internally lubricated grinding wheel system, comprising:

[0007] First, determine the internal cooling method of the grinding wheel. You can choose a combined cooling method or a single cooling method. The cooling methods include conventional liquid cooling, conventional air cooling, nanofluid cooling, liquid nitrogen cooling, carbon dioxide cooling, oscillating heat pipe, and semiconductor cooling.

[0008] Secondly, determine the internal lubrication method of the grinding wheel, which includes pouring lubrication, micro-lubrication, and grease lubrication;

[0009] Then, according to the combination of the internal cooling mode and the internal lubrication mode, the grinding wheel base structure is designed, and the grinding wheel base structure includes structural components, sealing components, external rotating components, and external pipelines;

[0010] Furthermore, according to the internal cooling method and the internal lubrication method, the corresponding control module is designed to ensure the reasonable delivery of cooling liquid, cooling gas, lubricating liquid, and the electrical transmission control of semiconductors;

[0011] Finally, complete the assembly and debugging of the internal cooling and internal lubrication grinding wheel system;

[0012] Among them, the combination of internal cooling and internal lubrication can be in various forms. One or two combined cooling methods and one internal lubrication method can be selected according to the actual working conditions and the complexity of the grinding wheel design;

[0013] The structural components in the grinding wheel matrix include a main shaft, a grinding wheel mounting plate, and a grinding wheel disc. The main shaft and the grinding wheel disc are usually provided with internal flow channels and internal chambers, and the grinding wheel disc is provided with flow channels and surface micro-textures. The sealing components are used for sealing between internal flow channels or chambers and between the internal flow channels or chambers and the outside world. The external rotating component is mainly used for effective gas, fluid and electricity transmission during the rotation of the grinding wheel. The flow channels and chambers are provided inside. The external pipeline is mainly used as a medium to connect the internal flow channel of the grinding wheel with the external gas and liquid channel.

[0014] The grinding wheel matrix needs to be designed according to the selected cooling method and lubrication method. When designing, while ensuring the cooling and lubrication effect of the grinding wheel, it is necessary to consider whether there is interference between the cooling methods and between the cooling method and the lubrication method. At the same time, it is necessary to consider related process issues to ensure that the grinding wheel structural components are easy to process, simple in structure, easy to assemble and disassemble, of moderate size and weight, and compatible with the relevant machine tool interface;

[0015] The control module includes a PC host computer, a PLC, a control valve, a flow meter, a grinding wheel base, a semiconductor, a delivery pump, a cooling gas device, a cooling liquid device, and a lubricating liquid device. The cooling gas device, the cooling liquid device, and the lubricating liquid device respectively pass through their respective delivery pumps, the corresponding control valves, and the flow meter into the grinding wheel base. The PC host computer is connected to the PLC, and the PLC is connected to the delivery pump, the control valve, and the flow meter. The PLC feeds back the opening of the control valve and the flow of the flow meter to the PC host computer for data monitoring. The PC host computer controls the opening of the control valve and the opening and closing of the delivery pump by controlling the PLC. When semiconductor refrigeration is used, the PLC is connected to the built-in semiconductor in the grinding wheel base. The PC host computer controls the input current and voltage of the semiconductor by controlling the PLC, thereby changing the cooling temperature of the semiconductor.

[0016] Regarding the debugging of the internal cooling and internal lubrication grinding wheel system, first, the external gas-liquid delivery flow and gas-liquid delivery method are debugged. The gas-liquid delivery method is selected according to the specific working conditions. The gas-liquid delivery method includes intermittent delivery and continuous delivery. Intermittent delivery requires control and debugging of the intermittent opening and closing time of the delivery; second, the process debugging of the gas-liquid delivery flow and the valve opening data is carried out to ensure good cooling and lubrication during the processing; third, when semiconductor cooling is selected, the delivery current and voltage need to be adjusted to ensure effective cooling of the semiconductor.

[0017] Compared with the prior art, the technical effect of the present invention is: it provides a design method that comprehensively considers various forms of internal cooling and internal lubrication in the grinding system and combines different internal cooling and different internal lubrication methods to obtain an internal cooling and internal lubrication grinding wheel system with different effects and low cost, which is of great significance for the breakthrough in the design of internal cooling and internal lubrication grinding wheel systems in grinding processing and the improvement of grinding wheel grinding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a flow chart of a method for implementing an internal cooling and internal lubrication grinding wheel system according to an embodiment of the present invention;

[0019] Figure 2 is a diagram of a grinding wheel system according to a method for implementing an internal cooling and internal lubrication grinding wheel system according to an embodiment of the present invention;

[0020] Figure 3 1. is a control module composition diagram of a method for implementing an internal cooling and internal lubrication grinding wheel system according to an embodiment of the present invention; DETAILED DESCRIPTION

[0021] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0022] like Figure 1 , Figure 2 , Figure 3 As shown, the present invention provides a method for implementing an internally cooled and internally lubricated grinding wheel system, comprising:

[0023] Step S11, determine and select the internal cooling method of the grinding wheel, which can be a combined cooling method or a single cooling method, and the cooling methods include conventional liquid cooling, conventional air cooling, nanofluid cooling, liquid nitrogen cooling, carbon dioxide cooling, oscillating heat pipe, and semiconductor cooling;

[0024] Step S12, determining to select the internal lubrication method of the grinding wheel, the internal lubrication method includes pouring lubrication, micro-lubrication, and grease lubrication;

[0025] Step S13, designing a grinding wheel base structure according to a combination of an internal cooling method and an internal lubrication method, wherein the grinding wheel base structure includes structural components, sealing components, external rotating components, and external pipes;

[0026] Step S14, designing a corresponding control module according to the internal cooling method and the internal lubrication method to ensure the reasonable delivery of cooling liquid, cooling gas, and lubricating liquid, as well as the electrical transmission control of the semiconductor;

[0027] Step S15, completing the assembly and debugging of the internal cooling and internal lubrication grinding wheel system;

[0028] There are many forms of internal cooling and internal lubrication combinations. One or two combined cooling methods and one internal lubrication method can be selected according to the actual working conditions and the complexity of the grinding wheel design.

[0029] The structural components in the grinding wheel matrix include a main shaft, a grinding wheel mounting plate, and a grinding wheel disc. The main shaft and the grinding wheel disc are usually provided with internal flow channels and internal chambers, and the grinding wheel disc is provided with flow channels and surface micro-textures. The sealing components are used for sealing between internal flow channels or chambers and between the internal flow channels or chambers and the outside world. The external rotating component is mainly used for effective gas, fluid and electricity transmission during the rotation of the grinding wheel. The flow channels and chambers are provided inside. The external pipeline is mainly used as a medium to connect the internal flow channel of the grinding wheel with the external gas and liquid channel.

[0030] The grinding wheel matrix needs to be designed according to the selected cooling method and lubrication method. When designing, while ensuring the cooling and lubrication effect of the grinding wheel, it is necessary to consider whether there is interference between the cooling methods and between the cooling method and the lubrication method. At the same time, it is necessary to consider related process issues to ensure that the grinding wheel structural components are easy to process, simple in structure, easy to assemble and disassemble, of moderate size and weight, and compatible with the relevant machine tool interface;

[0031] The control module includes a PC host computer, a PLC, a control valve, a flow meter, a grinding wheel base, a semiconductor, a delivery pump, a cooling gas device, a cooling liquid device, and a lubricating liquid device. The cooling gas device, the cooling liquid device, and the lubricating liquid device respectively pass through their respective delivery pumps, the corresponding control valves, and the flow meter into the grinding wheel base. The PC host computer is connected to the PLC, and the PLC is connected to the delivery pump, the control valve, and the flow meter. The PLC feeds back the opening of the control valve and the flow of the flow meter to the PC host computer for data monitoring. The PC host computer controls the opening of the control valve and the opening and closing of the delivery pump by controlling the PLC. When semiconductor refrigeration is used, the PLC is connected to the built-in semiconductor in the grinding wheel base. The PC host computer controls the input current and voltage of the semiconductor by controlling the PLC, thereby changing the cooling temperature of the semiconductor.

[0032] Regarding the debugging of the internal cooling and internal lubrication grinding wheel system, first, the external gas-liquid delivery flow and gas-liquid delivery method are debugged. The gas-liquid delivery method is selected according to the specific working conditions. The gas-liquid delivery method includes intermittent delivery and continuous delivery. Intermittent delivery requires control and debugging of the intermittent opening and closing time of the delivery; second, the process debugging of the gas-liquid delivery flow and the valve opening data is carried out to ensure good cooling and lubrication during the processing; third, when semiconductor cooling is selected, the delivery current and voltage need to be adjusted to ensure effective cooling of the semiconductor.

[0033] Although embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that the present invention is not limited to the details of the specific embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any figure mark in a claim should not be regarded as limiting the claim involved.

Claims

1. A method for implementing an internal cooling and internal lubrication grinding wheel system, characterized in that: include: Determine and select the internal cooling method of the grinding wheel, which can be a combined cooling method or a single cooling method, and the cooling method includes conventional liquid cooling, conventional air cooling, nanofluid cooling, liquid nitrogen cooling, carbon dioxide cooling, oscillating heat pipe, and semiconductor cooling; Determine and select the internal lubrication method of the grinding wheel, which includes pouring lubrication, minimal lubrication, and grease lubrication; According to the combination of the internal cooling method and the internal lubrication method, a grinding wheel base structure is designed, wherein the grinding wheel base structure includes a structural component, a sealing component, an external rotating component, and an external pipeline; According to the internal cooling method and the internal lubrication method, a corresponding control module is designed to ensure the reasonable delivery of cooling liquid, cooling gas, lubricating liquid, and electrical transmission control of semiconductors; Complete the assembly and debugging of the internal cooling and internal lubrication grinding wheel system.

2. The method for implementing an internally cooled and internally lubricated grinding wheel system according to claim 1, characterized in that: The combination of the internal cooling method and the internal lubrication method can be in various forms. One or two combined cooling methods can be selected to match one internal lubrication method according to the actual working conditions and the complexity of the grinding wheel design.

3. The method for implementing an internally cooled and internally lubricated grinding wheel system according to claim 1, characterized in that: The grinding wheel base structure includes a main shaft, a grinding wheel mounting disk, and a grinding wheel disk. Internal flow channels and internal chambers are provided in the main shaft and the grinding wheel disk. Flow channels and surface micro-textures are provided on the grinding wheel disk. The sealing component is used for sealing between internal flow channels or chambers and between the internal flow channels or chambers and the outside world. The external rotating component is mainly used for effective gas, fluid and electricity transmission during the rotation of the grinding wheel. Flow channels and chambers are provided inside, and the external pipeline serves as a medium to connect the internal flow channel of the grinding wheel with the external gas-liquid channel.

4. The method for implementing an internally cooled and internally lubricated grinding wheel system according to claim 1, characterized in that: The grinding wheel base structure is designed according to the selected cooling method and lubrication method to ensure the cooling and lubrication effect of the grinding wheel, while considering whether there is interference between the cooling methods and between the cooling method and the lubrication method. Furthermore, relevant process issues are considered at the same time to ensure that the grinding wheel structural components are easy to process, simple in structure, easy to assemble and disassemble, of moderate size and weight, and compatible with relevant machine tool interfaces.

5. The method for implementing an internally cooled and internally lubricated grinding wheel system according to claim 1, characterized in that: The control module includes a PC host computer, a PLC, a control valve, a flow meter, a grinding wheel base, a semiconductor, a delivery pump, a cooling gas device, a cooling liquid device, and a lubricating liquid device. The cooling gas device, the cooling liquid device, and the lubricating liquid device respectively pass through their respective delivery pumps, the corresponding control valves, and the flow meter to enter the grinding wheel base. The PC host computer is connected to the PLC, and the PLC is connected to the delivery pump, the control valve, and the flow meter. The PLC feeds back the opening of the control valve and the flow of the flow meter to the PC host computer for data monitoring. The PC host computer controls the opening of the control valve and the opening and closing of the delivery pump by controlling the PLC. When the semiconductor refrigeration is used, the PLC is connected to the built-in semiconductor in the grinding wheel base, and the PC host computer controls the input current and voltage of the semiconductor by controlling the PLC, thereby changing the cooling temperature of the semiconductor.

6. The method for implementing an internally cooled and internally lubricated grinding wheel system according to claim 1, characterized in that: The debugging of the internal cooling and internal lubrication grinding wheel system is, first, to debug the external gas-liquid delivery flow and gas-liquid delivery mode. The gas-liquid delivery mode is selected according to the specific working conditions. The gas-liquid delivery mode includes intermittent delivery and continuous delivery. The intermittent delivery requires control and debugging of the intermittent opening and closing time of the delivery; second, to debug the process of gas-liquid delivery flow and valve opening data to ensure good cooling and lubrication during the processing; Third, when semiconductor cooling is selected, the transmission current and voltage need to be adjusted to ensure effective cooling of the semiconductor.

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