Anode pulse electroplating method and porefilling electroplating electrode

Abstract

The invention provides an anode pulse electroplating method and a hole-filling electroplating electrode, and the anode pulse electroplating method comprises the following steps: pretreating an electrode substrate to obtain an anode body; preparing a hole-filling electroplating solution; the cathode body, the anode body and the hole-filling electroplating liquid are assembled in an electroplating bath with pulse current introduced, pulse electroplating is carried out, the electroplating bath is provided with a plurality of electroplating areas, and the flowing directions of the hole-filling electroplating liquid located in the electroplating areas are different; defect points of the electroplated layer on the anode body in each electroplating area are detected, pulse electroplating parameters are adjusted according to the number of the defect points until the number of the defect points reaches a preset low value, the pulse electroplating parameters comprise the conversion period of the flowing direction of the hole-filling electroplating liquid, and the number of the defect points and the conversion period are in an inverse relation. Through the arrangement, defects are effectively reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of electroplating, and in particular relates to an anode pulse electroplating method and a hole-filling electroplating electrode. Background Art

[0002] Anodic plating is a process in which metal ions are deposited on an electrode substrate through an electrochemical reaction. In this process, the anode body (usually the metal or alloy required for electroplating) and the cathode body (the substrate to be electroplated) are immersed in the plating solution, and an electric current is applied to reduce the metal ions on the cathode surface to form an electroplated layer.

[0003] In order to improve the quality and efficiency of the coating, pulse current is used for electroplating in related technologies. During the electroplating process, the pulse current will switch rapidly at specific time intervals to form alternations of high current pulses and low current or zero current. This waveform can accurately control the deposition rate of metal ions.

[0004] However, the rapid switching of pulse current can lead to uneven deposition rate of metal ions, resulting in defects. In the high current stage, the deposition rate increases rapidly, resulting in a rough surface and the formation of particles or defects, while in the low current stage, the deposition rate of metal ions slows down, resulting in discontinuous coating and pits. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide an anodic pulse electroplating method and a hole-filling electroplating electrode, aiming to solve the problem that defects are prone to occur during the anodic pulse electroplating process.

[0006] To solve the above technical problems, the present invention is implemented as follows: an anodic pulse electroplating method, comprising: S1, pre-treating the electrode substrate to obtain an anode body; S2, preparing hole filling plating solution; S3, assembling the cathode body, the anode body and the hole-filling electroplating solution in an electroplating tank into which a pulse current is passed, and performing pulse electroplating, wherein the electroplating tank is provided with a plurality of electroplating areas, and the flow direction of the hole-filling electroplating solution in each of the electroplating areas is different; S4. Detect the defect points of the electroplating layer on the anode body in each of the electroplating areas respectively, and adjust the pulse plating parameters according to the number of the defect points until the number of the defect points is less than a preset low value, wherein the pulse plating parameters include a change period of the flow direction of the hole-filling plating solution, and the number of the defect points is inversely proportional to the change period.

[0007] In some embodiments of the present invention, the step of respectively detecting defective points of the electroplating layer on the anode body in each of the electroplating regions comprises: Acquire current response data of the electroplating layer on the anode body in each of the electroplating areas during the pulse electroplating process within a preset time period; filtering and denoising the current response data and plotting them into a time series set; Marking the current spikes in the time series that exceed a preset current response threshold; Determine whether the current amplitude change of the current spike is greater than a preset current change threshold; If the current amplitude change is greater than the preset current change threshold, recording the defect point; Counting the number of defect points and determining whether the number of defect points is less than a preset lower value; If yes, then the pulse plating parameters are not adjusted; If not, the step of adjusting the pulse plating parameters according to the number of defect points is performed.

[0008] In some embodiments of the present invention, the step of adjusting the pulse plating parameters according to the number of defect points includes: Preset multiple ranges of the number of defect points, each range corresponding to an adjustment value of the transformation period; Determine the range of the number of the defect points counted, and change the transformation period to an adjustment value of the corresponding range; The step of acquiring the current response data of the electroplating layer on the anode body in each of the electroplating areas during the pulse electroplating process is repeated.

[0009] In some embodiments of the present invention, the pulse plating parameters further include pulse duty cycle, pulse frequency and peak current; The step of adjusting the pulse plating parameters according to the number of defect points comprises: Preset multiple range domains of the number of the defect points, each range domain corresponds to the pulse duty cycle value, the pulse frequency value and the peak current value, wherein the multiple range domains are arranged in ascending or descending order; Determine the range of the number of the defect points counted, and change the pulse duty cycle value, the pulse frequency value, and the peak current value, wherein when the number of the defect points increases, the pulse duty cycle value increases, the pulse frequency value decreases, and the peak current value increases; The step of acquiring the current response data of the electroplating layer on the anode body in each of the electroplating areas during the pulse electroplating process is repeated.

[0010] In some embodiments of the present invention, step S1 comprises: S1.1, placing the electrode substrate in a cleaning agent and performing ultrasonic cleaning; S1.2, performing surface treatment on the cleaned electrode substrate, sequentially performing grinding, pickling, washing, and drying; S1.3, applying a nano-carbon coating on the surface of the electrode substrate after the surface treatment to obtain the anode body.

[0011] In some embodiments of the present invention, the hole filling electroplating solution includes a plating metal salt solution and a repairing metal salt solution, and the step S2 includes: S2.1, dissolving a coating metal salt in deionized water and stirring until completely dissolved, wherein the coating metal salt comprises at least one of nickel sulfate, copper sulfate and nickel chloride; S2.2, adding a surfactant and a stabilizer to obtain the coating metal salt solution, wherein the surfactant includes at least one of polyvinyl alcohol, sodium polyacrylate, and sodium lauryl sulfate, and the stabilizer includes at least one of ammonia water, citric acid, and sodium acetate; S2.3. Dissolve the repair metal salt in deionized water and stir until it is completely dissolved to obtain the repair metal salt solution, wherein the repair metal salt includes at least one of copper chloride, silver chloride, and zinc chloride.

[0012] In some embodiments of the present invention, step S3 includes: S3.1. Fix the cathode body and the pretreated anode body in the electroplating tank at intervals; S3.2, injecting the plating metal salt solution into each of the electroplating areas of the electroplating tank so that the plating metal salt solution immerses the cathode body and the anode body; S3.3. Place the repair metal salt solution in the discharge valve in the electroplating tank, wherein the discharge valve is used to control the addition of the repair metal salt solution into the plating metal salt solution in each of the electroplating areas.

[0013] The present invention discloses a hole-filling electroplating electrode, which is prepared by the anodic pulse electroplating method as described above. The hole-filling electroplating electrode comprises an electrode substrate and a bonding layer and a metal electroplating layer arranged on the surface of the electrode substrate, wherein the bonding layer is arranged between the electrode substrate and the metal electroplating layer.

[0014] Compared with the prior art, the anodic pulse electroplating method and the hole-filling electroplating electrode in the present invention have the following beneficial effects: By changing the flow direction of the plating solution, it helps to break the local concentration gradient, promote the rapid deposition of metal ions, improve the plating efficiency, and more effectively transport metal ions to the electrode surface, thereby improving the uniformity of the coating and reducing defects caused by uneven deposition. It can also guide the repair metal ions to more accurately fill defects in the plating layer, enhance the self-repair ability, and extend the service life of the electrode.

[0015] Adjusting the flow direction change cycle according to the number of defect points allows the electroplating process to adapt to the actual state of the electrode surface in real time, thereby effectively controlling the deposition rate and reducing the generation of defects. When there are a large number of defect points, shortening the flow direction change cycle can speed up the delivery of repair metal ions, quickly fill defects, and reduce the damage range of the electroplating layer. With the optimization of the flow direction change cycle, the generation rate of defect points can be effectively reduced, thereby improving the overall quality and reliability of the final electroplating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic flow chart of an anodic pulse electroplating method in one embodiment of the present invention; Figure 2 It is a partial flow diagram of the anodic pulse plating method in one embodiment of the present invention. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0018] Please refer to Figure 1 and Figure 2 The present invention provides an anodic pulse electroplating method, comprising: S1, pre-treating the electrode substrate to obtain an anode body; S2, preparing hole filling plating solution; S3, assembling the cathode body, the anode body and the hole-filling plating solution in a plating tank into which a pulse current is passed, and performing pulse plating, wherein the plating tank is provided with a plurality of plating areas, and the flow direction of the hole-filling plating solution in each plating area is different; S4. Detect the defect points of the electroplating layer on the anode body in each electroplating area respectively, and adjust the pulse plating parameters according to the number of defect points until the number of defect points reaches a preset low value, wherein the pulse plating parameters include a change period of the flow direction of the hole-filling plating solution, and the number of defect points is inversely proportional to the change period.

[0019] Changing the flow direction of the electroplating solution helps break the local concentration gradient, promotes the rapid deposition of metal ions, improves electroplating efficiency, and more effectively delivers metal ions to the electrode surface, thereby improving the uniformity of the coating and reducing defects caused by uneven deposition. It can also guide the repair metal ions to more accurately fill the defects in the electroplating layer, enhance the self-repair ability, and extend the service life of the electrode.

[0020] Adjusting the flow direction change cycle according to the number of defect points allows the electroplating process to adapt to the actual state of the electrode surface in real time, thereby effectively controlling the deposition rate and reducing the generation of defects. When there are a large number of defect points, shortening the flow direction change cycle can speed up the delivery of repair metal ions, quickly fill defects, and reduce the damage range of the electroplating layer. With the optimization of the flow direction change cycle, the generation rate of defect points can be effectively reduced, thereby improving the overall quality and reliability of the final electroplating layer.

[0021] The change of the flow direction of the hole-filling plating solution in each plating area can be achieved by the forward and reverse rotation of the circulating pump in the prior art. A plurality of plating areas are arranged in the plating tank, and the hole-filling plating solutions between the plurality of plating areas can be kept connected or disconnected. If the specification of the electrode substrate is small, it is arranged in the plating area alone. If the specification of the electrode substrate is large, the electrode substrate can be arranged on a plurality of plating areas, but the flow direction of the hole-filling plating solution in each part is different.

[0022] The specific steps of step S1 are as follows: S1.1. Place the electrode substrate in a cleaning agent and perform ultrasonic cleaning. The cleaning agent can be deionized water, ethanol or isopropanol. Ultrasonic cleaning uses the principle that high-frequency sound waves generate tiny bubbles in a liquid. When the bubbles expand and contract rapidly in the liquid, they generate a strong impact force. This process is called cavitation, which can effectively remove dirt, grease and other impurities on the surface of the electrode substrate, improve the surface cleanliness of the electrode substrate, and ensure adhesion during the subsequent electroplating process. The ultrasonic frequency is 20 kHz to 40 kHz.

[0023] S1.2. The cleaned electrode substrate is subjected to surface treatment, and polishing, pickling, washing, and drying are performed in sequence; the steps of polishing, pickling, washing, and drying in sequence can significantly improve the surface quality of the electrode substrate. Polishing can remove large particles of dirt, pickling can remove oxides and tiny particles, washing can remove acid residues, and drying can prevent moisture from affecting the adhesion of subsequent coatings. Through polishing and pickling, the surface roughness of the electrode substrate is increased, the mechanical adhesion of the subsequent coating is enhanced, the surface oxide layer is removed, the chemical activity of the electrode substrate is improved, and good bonding of the coating is ensured.

[0024] S1.3. Apply a nano-carbon coating on the surface of the electrode substrate after the surface treatment to obtain an anode body.

[0025] The nanocarbon coating can be applied by vapor deposition, sol-gel method, ultrasonic spraying and other technologies. For example, by sol-gel method, nanocarbon is dissolved in a solvent to form a sol, which is then coated on the electrode substrate and heated to gel into a coating.

[0026] The nanocarbon layer has a large specific surface area and can provide more binding sites, thereby enhancing the adhesion between the metal coating and the substrate. Nanocarbon materials improve the conductivity of the electrode substrate, improve current distribution, and increase electroplating efficiency. Nanocarbon materials have excellent conductivity and corrosion resistance and can provide additional functions for the electrode. The presence of nanocarbon coating can provide additional protection, reduce oxidation and corrosion of the electrode substrate during the electroplating process, and thus extend the service life of the electrode.

[0027] The hole-filling electroplating solution includes a plating metal salt solution and a repairing metal salt solution. The plating metal salt solution provides the main metal ions (such as nickel, copper, etc.) required to form the electroplating layer, and forms a uniform plating layer on the electrode surface through electrochemical deposition. Under the condition of applying current, the metal ions are reduced and deposited on the cathode to form a solid metal plating layer. The repairing metal ions (such as copper, silver, zinc, etc.) contained in the repairing metal salt solution can actively migrate to the defective position when the plating layer has small defects or is damaged, and fill the gap by re-deposition. The presence of repairing metal ions enables the plating layer to self-repair after being damaged and restore its original physical and chemical properties.

[0028] The use of two metal salt solutions at the same time can ensure the thickness and uniformity of the coating, thereby improving the overall quality. By providing sufficient metal ions, the adhesion between the coating and the substrate is improved, reducing the risk of peeling.

[0029] The specific steps of step S2 are as follows: S2.1. Dissolve the coating metal salt in deionized water and stir until it is completely dissolved, wherein the coating metal salt includes at least one of nickel sulfate, copper sulfate, and nickel chloride.

[0030] Dissolving the plating metal salt (such as nickel sulfate, copper sulfate or nickel chloride) in deionized water ensures uniform distribution of metal ions, which is critical for deposition uniformity in the subsequent electroplating process. Fully dissolved metal salts help form high-quality electroplated layers and reduce non-uniformity and defects during the deposition process.

[0031] S2.2, adding a surfactant and a stabilizer to obtain a coating metal salt solution, wherein the surfactant includes at least one of polyvinyl alcohol, sodium polyacrylate, and sodium dodecyl sulfate, and the stabilizer includes at least one of ammonia water, citric acid, and sodium acetate.

[0032] Adding surfactants and stabilizers can effectively prevent the precipitation and aggregation of metal salt solutions, maintain the stability of the solution, and ensure the continuous supply of metal ions during the electroplating process. The addition of surfactants can improve the adhesion of metal ions on the substrate surface, promote uniform deposition, and improve the adhesion and density of the electroplated layer.

[0033] S2.3, dissolving the repair metal salt in deionized water, stirring until completely dissolved, to obtain a repair metal salt solution, wherein the repair metal salt includes at least one of copper chloride, silver chloride, and zinc chloride. The presence of the repair metal helps to improve the overall corrosion resistance and wear resistance of the electroplating layer, thereby extending the service life of the coating.

[0034] The specific steps of step S3 are as follows: S3.1. Fix the cathode body and the pre-treated anode body in the electroplating tank. Reasonable spacing and fixing methods ensure uniform electric field distribution between electrodes, which helps to improve electrodeposition efficiency. Ensure physical isolation between the cathode and anode bodies, reduce the risk of short circuit, and ensure the stability of the electroplating process.

[0035] S3.2. Inject the plating metal salt solution into each electroplating area of ​​the electroplating tank so that the plating metal salt solution immerses the cathode body and the anode body.

[0036] Full immersion ensures uniform distribution of the plating metal salt throughout the plating area, thereby achieving uniform plating layer formation. Adequate metal ion supply can increase deposition rate, shorten plating time, and improve production efficiency. Uniform solution concentration helps reduce defects in the plating layer and ensure the quality of the finished product.

[0037] S3.3. Place the repair metal salt solution in the discharge valve in the electroplating tank, where the discharge valve is used to control the addition of the repair metal salt solution to the coating metal salt solution in each electroplating area. By controlling the timing and amount of the addition of the repair metal salt solution, it is ensured that during the coating formation process, possible defects are filled in time to achieve self-repair. According to the defects monitored in real time during the electroplating process, the amount of repair metal salt added is adjusted to improve the flexibility and pertinence of the process. Timely addition of repair metal ions helps to improve the corrosion resistance of the coating and enhance the overall performance.

[0038] Combined with the detection of defect points of the electroplating layer on the anode body in each electroplating area in step S4, when the number of defect points reaches a preset defect value, the discharge valve discharges the repair metal salt solution into the plating metal salt solution in each electroplating area, and the preset defect value is used to determine whether there are defects on the surface of the electroplating layer on the anode body. The rate at which the discharge valve discharges the repair metal salt solution is positively correlated with the number of defect points. When the number of defect points increases, the discharge rate of the discharge valve increases, and when the number of defect points decreases, the discharge rate of the discharge valve decreases.

[0039] Step S4 is specifically as follows: Step 101 : obtaining current response data of the electroplating layer on the anode body in each electroplating area during the pulse electroplating process within a preset time period.

[0040] Current response data refers to the current change information obtained from the electroplating equipment through the real-time monitoring system during the electroplating process. During the pulse electroplating process, the system records the instantaneous current value applied to the electrode at different time points. This reflects the change of current over time, including the peak and trough values ​​of the pulse current, in A. By collecting current response data, the current change during the electroplating process can be monitored in real time, which helps to identify potential defects. Providing data support lays the foundation for subsequent defect analysis and parameter adjustment.

[0041] Step 102: Filter and remove noise from the current response data and plot them into a time series set.

[0042] Filtering and denoising can eliminate background noise, improve data accuracy, and ensure the reliability of subsequent analysis. Plotting data into a time series set helps to intuitively understand the current change trend and facilitate defect identification.

[0043] Step 103: Mark the current spikes in the time series that exceed a preset current response threshold. The preset current response threshold is determined by experiments, for example, 2.2A.

[0044] By marking the current spikes that exceed the threshold, possible defects can be quickly located, saving time for subsequent analysis. Automatic marking can be achieved, reducing manual intervention and improving detection efficiency and accuracy.

[0045] Step 104: determine whether the current amplitude change at the current spike is greater than a preset current change threshold. The preset current change threshold is determined by experiments, for example, 1 mA to 5 mA.

[0046] The large fluctuation of the current indicates that the deposition rate is inconsistent in some areas, that is, defective points appear in the surface coating of the anode body.

[0047] If the current amplitude change is greater than the preset current change threshold, then step 105 is executed. If the current amplitude change of the current spike is less than the preset current change threshold, then step 104 is executed.

[0048] Step 105: Record defect points.

[0049] Step 106: Count the number of defect points and determine whether the number of defect points reaches a preset low value; if so, execute step 107; if not, execute step 108. The preset low value is determined by experiments, for example, 30 per square meter.

[0050] Step 107: Do not adjust the pulse plating parameters.

[0051] Step 108: Preset multiple ranges of the number of defect points, each range corresponding to an adjustment value of the transformation period.

[0052] Step 109: Return the number of defect points counted to the range domain, and change the transformation period to the adjustment value of the corresponding range domain.

[0053] The setting range and adjustment value of the conversion period are determined through experiments, for example, as shown in Table 1.

[0054] Table 1: By presetting the range of defect points corresponding to the adjustment value of the transformation cycle, the pulse plating parameters can be optimized in a targeted manner, thereby improving the consistency and integrity of the coating. This method can dynamically adjust the pulse plating parameters according to the number of defects detected in real time, making the plating process more adaptable and helping to quickly respond to changes in production. Through reasonable parameter adjustment, the generation of defects can be reduced, thereby reducing the cost of subsequent processing and maintenance and improving product reliability.

[0055] Step 101 is executed again until the number of defect points is less than a preset low value.

[0056] In other embodiments, the pulse plating parameters also include pulse duty cycle, pulse frequency, and peak current; The steps of adjusting the pulse plating parameters according to the number of defects include: Preset multiple ranges of the number of defect points, each range corresponding to a pulse duty cycle value, a pulse frequency value, and a peak current value, wherein the multiple ranges are arranged in ascending or descending order; Return the number of defect points counted to the range domain, change the pulse duty cycle value, pulse frequency value and peak current value, wherein, when the number of defect points increases, the pulse duty cycle value increases, the pulse frequency value decreases, and the peak current value increases; Step 101 is executed again until the number of defect points is less than a preset low value.

[0057] By dynamically adjusting the pulse duty cycle, pulse frequency and peak current, the electroplating process can be optimized, making the deposition of the coating more uniform, reducing defect generation and improving the electroplating quality.

[0058] Real-time adjustment based on the number of defect points allows pulse plating parameters to adapt to different production conditions and raw material characteristics, improving the flexibility and reliability of the system. Timely adjustment of pulse plating parameters can reduce the generation of defect points, thereby reducing the scrap rate, shortening the production cycle, and thus improving overall production efficiency.

[0059] By adjusting the pulse plating parameters, such as increasing the pulse duty cycle and peak current, the physical and chemical properties of the coating can be improved, and its corrosion resistance and wear resistance can be improved. By reasonably controlling the pulse plating parameters, the consumption of current and chemicals can be reduced, and the waste of resources can be reduced while ensuring the quality of the coating.

[0060] The set range domain and pulse duty cycle value, pulse frequency value and peak current value are measured through experiments, for example, as shown in Table 2.

[0061] Table 2: The present invention also proposes a hole-filling electroplating electrode, which is prepared by an anodic pulse electroplating method. The hole-filling electroplating electrode includes an electrode base and a bonding layer and a metal electroplating layer arranged on the surface of the electrode base, and the bonding layer is arranged between the electrode base and the metal electroplating layer.

[0062] As an intermediary between the electrode substrate and the metal plating layer, the bonding layer can improve the bonding force between the two, increase the adhesion of the plating layer, reduce the risk of peeling due to external forces or environmental changes, and extend the service life of the electrode.

[0063] The presence of the bonding layer can improve the distribution of current on the electrode surface, reduce uneven electroplating caused by local overcurrent, improve the conductivity of the electrode, and enhance its efficiency in electrochemical reactions.

[0064] The electrode substrate may be at least one of titanium, iron, magnesium, copper, aluminum, chromium, nickel, manganese, ruthenium, rhodium, palladium, tantalum, iridium, platinum, and gold.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An anodic pulse electroplating method, characterized in that: include: S1, pre-treating the electrode substrate to obtain an anode body; S2, preparing hole filling plating solution; S3, assembling the cathode body, the anode body and the hole-filling electroplating solution in an electroplating tank into which a pulse current is passed, and performing pulse electroplating, wherein the electroplating tank is provided with a plurality of electroplating areas, and the flow direction of the hole-filling electroplating solution in each of the electroplating areas is different; S4. Detect the defect points of the electroplating layer on the anode body in each of the electroplating areas respectively, and adjust the pulse plating parameters according to the number of the defect points until the number of the defect points is less than a preset low value, wherein the pulse plating parameters include a change period of the flow direction of the hole-filling plating solution, and the number of the defect points is inversely proportional to the change period.

2. The anodic pulse plating method according to claim 1, characterized in that: The step of respectively detecting defective points of the electroplating layer on the anode body in each of the electroplating areas comprises: Acquire current response data of the electroplating layer on the anode body in each of the electroplating areas during the pulse electroplating process within a preset time period; filtering and denoising the current response data and plotting them into a time series set; Marking the current spikes in the time series that exceed a preset current response threshold; Determine whether the current amplitude change of the current spike is greater than a preset current change threshold; If the current amplitude change is greater than the preset current change threshold, recording the defect point; Counting the number of defect points and determining whether the number of defect points is less than a preset lower value; If yes, then the pulse plating parameters are not adjusted; If not, the step of adjusting the pulse plating parameters according to the number of defect points is performed.

3. The anodic pulse plating method according to claim 2, characterized in that: The step of adjusting the pulse plating parameters according to the number of defect points comprises: Preset multiple ranges of the number of defect points, each range corresponding to an adjustment value of the transformation period; Determine the range of the number of the defect points counted, and change the transformation period to an adjustment value of the corresponding range; The step of acquiring the current response data of the electroplating layer on the anode body in each of the electroplating areas during the pulse electroplating process is repeated.

4. The anodic pulse plating method according to claim 2 or 3, characterized in that: The pulse plating parameters also include pulse duty cycle, pulse frequency and peak current; The step of adjusting the pulse plating parameters according to the number of defect points comprises: Preset multiple range domains of the number of the defect points, each range domain corresponds to the pulse duty cycle value, the pulse frequency value and the peak current value, wherein the multiple range domains are arranged in ascending or descending order; Determine the range of the number of the defect points counted, and change the pulse duty cycle value, the pulse frequency value, and the peak current value, wherein when the number of the defect points increases, the pulse duty cycle value increases, the pulse frequency value decreases, and the peak current value increases; The step of acquiring the current response data of the electroplating layer on the anode body in each of the electroplating areas during the pulse electroplating process is repeated.

5. The anodic pulse plating method according to claim 1, characterized in that: The step S1 comprises: S1.1, placing the electrode substrate in a cleaning agent and performing ultrasonic cleaning; S1.2, performing surface treatment on the cleaned electrode substrate, sequentially performing grinding, pickling, washing, and drying; S1.3, applying a nano-carbon coating on the surface of the electrode substrate after the surface treatment to obtain the anode body.

6. The anodic pulse plating method according to claim 1, characterized in that: The hole filling electroplating solution includes a plating metal salt solution and a repairing metal salt solution, and the step S2 includes: S2.1, dissolving a coating metal salt in deionized water and stirring until completely dissolved, wherein the coating metal salt comprises at least one of nickel sulfate, copper sulfate and nickel chloride; S2.2, adding a surfactant and a stabilizer to obtain the coating metal salt solution, wherein the surfactant includes at least one of polyvinyl alcohol, sodium polyacrylate, and sodium lauryl sulfate, and the stabilizer includes at least one of ammonia water, citric acid, and sodium acetate; S2.

3. Dissolve the repair metal salt in deionized water and stir until it is completely dissolved to obtain the repair metal salt solution, wherein the repair metal salt includes at least one of copper chloride, silver chloride, and zinc chloride.

7. The anodic pulse plating method according to claim 1, characterized in that: The step S3 comprises: S3.

1. Fix the cathode body and the pretreated anode body in the electroplating tank at intervals; S3.2, injecting the plating metal salt solution into each of the electroplating areas of the electroplating tank so that the plating metal salt solution immerses the cathode body and the anode body; S3.

3. Place the repair metal salt solution in the discharge valve in the electroplating tank, wherein the discharge valve is used to control the addition of the repair metal salt solution into the plating metal salt solution in each of the electroplating areas.

8. A hole-filling electroplating electrode, characterized in that: The hole-filling electroplating electrode is prepared by the anodic pulse plating method as described in any one of claims 1 to 7, and includes an electrode base and a bonding layer and a metal electroplating layer arranged on the surface of the electrode base, wherein the bonding layer is arranged between the electrode base and the metal electroplating layer.

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