Substrate electroplating device and method

Abstract

The invention provides a substrate electroplating device. At least two anodes, at least two power supplies and at least one control switch; wherein the anodes and the power supplies are in one-to-one correspondence, each anode is connected to the anode of the corresponding power supply, and the control switch is used for enabling at least two anodes to be connected to the anode of the same power supply when the control switch is switched on. Through a single power supply and multi-power supply switching use mode, the problem of current fluctuation caused by mutual interference among multiple power supplies in an electroplating water entering stage is effectively solved under the condition that the electroplating effect of a multi-anode electroplating process stage is not influenced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and in particular to a substrate electroplating device and method. Background Art

[0002] During the wafer entry phase of the wafer electroplating process, the power supply needs to output a ramp current to maintain a constant current density on the wafer immersed in the plating solution. For multi-anode electroplating equipment, taking dual anodes as an example, the two anodes are controlled by independent power supplies, and the output currents of the two independent power supplies will inevitably interfere with each other. Especially during the power mode switching stage, for example, when the power mode switches from the constant voltage mode before entering the water to the constant current mode during the entry stage, the output currents of the two independent power supplies will briefly deviate from the preset value. Figure 2 As shown, it is a schematic diagram of a current-time curve of a power supply output of an exemplary substrate electroplating device. Due to the interference between the two power supplies, undesirable fluctuations are generated in the X region on the current curves of the two power supplies.

[0003] Since the duration of the copper electroplating water entry stage is usually in the millisecond level, the current fluctuation caused by the interference between power supplies will have a great impact on the stability of the copper electroplating process during the water entry stage. Therefore, how to provide a method that can reduce or even eliminate the current fluctuation caused by the mutual interference between multiple power supplies during the multi-anode electroplating water entry stage becomes a problem that needs to be solved. Summary of the invention

[0004] In view of the shortcomings of the prior art described above, an object of the present invention is to provide a substrate electroplating device and method for solving the technical problem of current fluctuation caused by mutual interference between multiple power supplies in the water immersion stage of multi-anode electroplating of wafers in the prior art.

[0005] To achieve the above-mentioned purpose and other related purposes, the present invention provides a substrate electroplating device, comprising at least two anodes, at least two power supplies and at least one control switch; wherein the anodes and the power supplies correspond one to one, each of the anodes is connected to the positive pole of the corresponding power supply, and the control switch is used to connect the at least two anodes to the positive pole of the same power supply when the control switch itself is turned on.

[0006] Optionally, the anode includes a first anode and a second anode, the power supply includes a first power supply and a second power supply, and the control switch includes a first control switch; the positive electrode of the first power supply is connected to the first anode to form a first anode control circuit, and the positive electrode of the second power supply is connected to the second anode to form a second anode control circuit; the first anode control circuit includes a first contact, the second anode control circuit includes a second contact, and the first control switch is connected between the first contact and the second contact.

[0007] Optionally, the anode further includes a third anode, the power supply also includes a third power supply, and the control switch also includes a second control switch; the positive pole of the third power supply is connected to the third anode to form a third anode control circuit, the third anode control circuit includes a third contact, and the second control switch is connected between the second contact and the third contact.

[0008] Optionally, a diode is connected between the anode and the corresponding positive electrode of the power supply.

[0009] Optionally, the control switch is connected to the anode via a contact, and the diode is arranged between the corresponding positive pole of the power supply and the contact.

[0010] Optionally, the control switch comprises a contactor.

[0011] The present invention also proposes a substrate electroplating method, which is suitable for the aforementioned substrate electroplating device, comprising: in the water entry stage of the substrate, turning on the control switch, starting one power supply, turning off the remaining power supplies, and all the anodes are controlled by the started power supply; in the electroplating process stage of the substrate, disconnecting the control switch, starting the remaining power supplies, and each of the anodes is controlled by its corresponding power supply.

[0012] Optionally, the anode includes a first anode and a second anode, the power supply includes a first power supply and a second power supply, and the control switch includes a first control switch; the positive electrode of the first power supply is connected to the first anode to form a first anode control circuit, and the positive electrode of the second power supply is connected to the second anode to form a second anode control circuit; the first anode control circuit includes a first contact, the second anode control circuit includes a second contact, and the first control switch is connected between the first contact and the second contact; the substrate electroplating method also includes: in the water entry stage of the substrate, turning on the first control switch, starting the first power supply, turning off the second power supply, the first anode and the second anode are connected to the first power supply and controlled by the first power supply; in the electroplating process stage of the substrate, disconnecting the first control switch, starting the second power supply, the first anode is controlled by the first power supply, and the second anode is controlled by the second power supply.

[0013] Optionally, the anode also includes a third anode, the power supply also includes a third power supply, and the control switch also includes a second control switch; the positive electrode of the third power supply is connected to the third anode to form a third anode control circuit, the third anode control circuit includes a third contact, and the second control switch is connected between the second contact and the third contact; the substrate electroplating method also includes: in the water entry stage of the substrate, the first control switch and the second control switch are turned on, the first power supply is started, the second power supply and the third power supply are turned off, and the first anode, the second anode, and the third anode are connected to the first power supply and controlled by the first power supply; in the electroplating process stage of the substrate, the first control switch and the second control switch are disconnected, the first power supply and the second power supply are started, the first anode is controlled by the first power supply, the second anode is controlled by the second power supply, and the third anode is controlled by the third power supply.

[0014] As described above, the present invention provides a substrate electroplating device and method, which have the following beneficial effects:

[0015] 1) By switching between single power supply and multiple power supplies, the current fluctuation problem caused by mutual interference between multiple power supplies in the electroplating water entry stage is effectively eliminated without affecting the electroplating effect in the multi-anode electroplating process stage.

[0016] 2) Switching between single power supply and multiple power supplies brings more operability and stability to electroplating technology process programming.

[0017] 3) The original circuit of the machine can be used for transformation, and there is no need to redesign and transform the electroplating chamber, which is low in cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a schematic structural diagram of an exemplary substrate electroplating device;

[0019] Figure 2 A schematic diagram showing a current-time curve of an exemplary substrate electroplating device;

[0020] Figure 3a and Figure 3b It is a schematic diagram showing the structure of the substrate electroplating device in the first embodiment of the present invention.

[0021] Figure 3c It is a schematic structural diagram of a substrate electroplating device in another implementation manner of the first embodiment of the present invention;

[0022] Figure 4 It is a schematic diagram showing a current-time curve of a substrate electroplating device in the first embodiment of the present invention;

[0023] Figure 5aIt is a schematic diagram showing the structure of the substrate electroplating device in the second embodiment of the present invention, wherein the control switch is in the disconnected state;

[0024] Figure 5b It is a schematic diagram of the structure of the substrate electroplating device in the second embodiment of the present invention, wherein the control switch is in the on state;

[0025] Figure 6 It is a schematic diagram showing a current-time curve of a substrate electroplating device in the second embodiment of the present invention;

[0026] Figure 7 A schematic flow chart showing a substrate electroplating method according to a third embodiment of the present invention; and

[0027] Figure 8 It shows a schematic flow chart of the substrate electroplating method in the fourth embodiment of the present invention. DETAILED DESCRIPTION

[0028] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0029] It should be noted that the drawings of the present disclosure only illustrate the basic concept of the present invention in a schematic manner. Although the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation, the form, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout may also be more complicated.

[0030] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are only examples of devices consistent with some aspects of the present invention as detailed in the attached claims.

[0031] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0032] In the description of the present disclosure, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two elements. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0033] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other.

[0034] In the description of the present disclosure, it is necessary to understand that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" that may be used to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0035] Embodiment 1

[0036] See also Figure 1 and Figure 2 , Figure 1 Shown is a schematic structural diagram of an exemplary substrate electroplating device; Figure 2 The figure shows a current-time curve diagram of an exemplary substrate electroplating device, wherein curve L10 shows the current-time curve of the first control loop, and curve L20 shows the current-time curve of the second control loop.

[0037] like Figure 1 As shown, the substrate electroplating device includes an electroplating tank 10, and the electroplating tank 10 includes a cathode chamber 101 located at the top and an anode chamber 102 located at the bottom. The cathode chamber 101 and the anode chamber 102 are filled with electroplating solution, and an ion membrane 30 is arranged between the cathode chamber 101 and the anode chamber 102. When the electroplating process is performed, the substrate 20 to be electroplated is arranged in the cathode chamber 101, and the anodes P1 and P2 are arranged in the anode chamber 102. It should be understood that the specific structure and working process of the electroplating tank 10 and the ion membrane 30 belong to the prior art, and the present invention does not specifically limit this, so it will not be described in detail here.

[0038] Taking the dual-anode electroplating device as an example, the two anodes P1 and P2 correspond to two independently working programmable power supplies (usually abbreviated as PPS). The positive electrode of the first power supply PPS1 is connected to the first anode P1, and the negative electrode is connected to the substrate 20 to form a first control loop; the positive electrode of the second power supply PPS2 is connected to the second anode P2, and the negative electrode is connected to the substrate 20 to form a second control loop.

[0039] Combination Figure 2 Before the substrate 20 enters the water (enters the electroplating solution), the first power source PPS1 and the second power source PPS2 are in constant voltage mode to provide a protective voltage to the substrate 20, so that an electrochemical reaction occurs when the substrate 20 contacts the electroplating solution, thereby preventing the electroplating solution from corroding the seed layer on the surface of the substrate 20. After the substrate 20 contacts the electroplating solution, the first control loop and the second control loop are both turned on. Figure 2 As shown, both current curves L10 and L20 start to rise from 0 ampere (A).

[0040] A trigger current is set in a control loop of one of the two anodes P1 and P2. In this example, the trigger current is set in a first control loop where the first anode P1 is located. Figure 2 As shown, at time T1, when the current in the first control loop reaches the preset trigger current, the first power supply PPS1 and the second power supply PPS2 start mode switching, that is, switching from constant voltage mode to constant current mode. Due to the inherent characteristics of the power supply, during the mode switching process, the output current curve of the power supply will drop briefly.

[0041] Ideally, when the power supply is switched to constant current mode, the current should increase to a preset value according to the preset curve and maintain for a period of time, then drop to the process current and enter the formal electroplating process stage. In this example, the preset current curve is a ramp, that is, when the power supply is switched to constant current mode, the current should increase linearly to the preset value. However, if Figure 2 As shown in FIG. 1 , after time T1, the current curves L10 and L20 do not increase linearly as expected after a short drop, but appear as shown in FIG. Figure 2 The fluctuations are shown in the X area.

[0042] In order to prevent the influence of unsafe and unstable factors such as current backflow, a protection diode is usually required between the positive electrode and the anode of the programmable power supply. Figure 1, the anode of diode D1 is connected to the first power supply PPS1, and the cathode is connected to the first anode P1; the anode of diode D2 is connected to the second power supply PPS2, and the cathode is connected to the second anode P2. Due to the characteristics of the power supply itself, when two or more power supplies start mode switching at the same time, complete synchronization cannot be achieved, and one power supply will start switching first. Figure 2 In this example, the first power supply PPS1 starts switching first, the diode D1 is turned on, the first control loop is turned on, and the current curve L10 rises linearly after a short drop. At this time, the voltage at the cathode of the diode D2 is approximately equal to the voltage at the cathode of the diode D1, D2 is reversely cut off, and the second control loop cannot be turned on. The voltage output by the second power supply PPS2 continues to rise until time T2, when the voltage output by the second power supply PPS2 makes the voltage drop across the positive and negative electrodes of the diode D2 greater than the conduction voltage of the diode D2, the diode D2 is turned on, the second control loop is turned on, and the current curve L20 begins to rise.

[0043] like Figure 2 As shown in the figure, during this process, at time T1, the first power supply PPS1 starts to switch to the constant current mode, and at time T2 after time T1, the second control loop is turned on, and the turn-on of the second control loop lags behind the turn-on of the first control loop, causing the current curve L20 of the second control loop to lag behind the current curve L10 of the first control loop. When the second control loop is turned on at time T2, it will in turn affect the current curve L10 of the first control loop, resulting in the following Figure 2 The abnormal fluctuations are shown in the X area.

[0044] If the protection diode is not provided, there will be a potential safety hazard on the one hand, and on the other hand, there will still be mutual interference between the first power supply PPS1 and the second power supply PPS2, because the first anode P1 and the second anode P2 are both immersed in the electroplating solution and share a common cathode (substrate 20), and the first power supply PPS1 and the second power supply PPS2 are equivalent to acting in parallel on the same load, and the first control loop and the second control loop cannot be completely independent, and the voltages between the two will affect each other. Especially during the water entry stage, when the first power supply PPS1 and the second power supply PPS2 are started synchronously and switched from the constant voltage mode to the constant current mode, mutual interference is inevitable, which is an uncontrollable factor and will still cause unexpected fluctuations in the current curve L10 and the current curve L20.

[0045] The duration of the substrate electroplating immersion stage is usually in milliseconds. Therefore, during the immersion stage, the current fluctuation caused by interference between power supplies will have a greater impact on the stability of the electroplating process.

[0046] At least to solve the above-mentioned problems, one aspect of the present invention provides a substrate electroplating device, comprising: at least two anodes and at least two power supplies, and at least one control switch; wherein each anode is connected to the positive pole of the corresponding power supply, and the control switch is used to connect at least two anodes to the positive pole of the same power supply when the control switch itself is turned on.

[0047] See also Figure 3a and Figure 3b , Figure 3a It is a schematic diagram of the structure of the substrate electroplating device in the first embodiment of the present invention, wherein the control switch is in the disconnected state; Figure 3b The schematic diagram of the structure of the substrate electroplating device in the first embodiment of the present invention is shown, wherein the control switch is in the on state. The electroplating tank 1 includes a cathode chamber 11 located at the top and an anode chamber 12 located at the bottom. The cathode chamber 11 and the anode chamber 12 are filled with electroplating liquid. An ion membrane 3 is arranged between the cathode chamber 11 and the anode chamber 12. When the electroplating process is performed, the substrate 2 to be electroplated is arranged in the cathode chamber 11.

[0048] In this embodiment, the anode includes two anodes, a first anode P1 and a second anode P2, the power supply includes two power supplies, a first power supply PPS1 and a second power supply PPS2, and the control switch includes a first control switch. The positive pole of the first power supply PPS1 is connected to the first anode P1 to form a first anode control circuit, and the positive pole of the second power supply PPS2 is connected to the second anode P2 to form a second anode control circuit. The negative poles of the first power supply PPS1 and the second power supply PPS2 are both electrically connected to the substrate 2 to form two current loops. The loop where the first anode control circuit is located is the first loop, and the loop where the second anode control circuit is located is the second loop; the first anode control circuit includes a first contact 4, the second anode control circuit includes a second contact 5, and the first control switch is connected between the first contact 4 and the second contact 5.

[0049] Preferably, in this embodiment, the first control switch is a contactor KM. It should be understood that in other possible embodiments, the first control switch may also be other types of switch devices, and those skilled in the art may make a reasonable selection according to actual requirements of circuit control.

[0050] Preferably, the power supply is a programmable power supply, including but not limited to a linear programmable power supply, a switching programmable power supply, etc.

[0051] like Figure 3b As shown, when the substrate 2 enters the water, the contactor KM is turned on, the second power supply PPS2 is turned off, and the first anode P1 and the second anode P2 are connected in parallel to the positive electrode of the first power supply PPS1. That is, at this time, the first anode P1 and the second anode P2 are both controlled by the first power supply PPS1. Figure 3aAs shown, after the substrate 2 is immersed in water, the electroplating process is carried out, the contactor KM is disconnected, the second power supply PPS2 is started, and the first anode P1 and the second anode P2 are controlled separately by the first power supply PPS1 and the second power supply PPS2. Since the electroplating process usually lasts for tens of seconds or hundreds of seconds, each power supply is used to independently control each anode during the process, and even if there is mutual interference between the power supplies during the startup phase, it will not have a substantial impact on the process.

[0052] Combination Figure 4 , which shows a schematic diagram of the current-time curve of the substrate electroplating device in the first embodiment of the present invention, wherein curve L1 shows the current-time curve of the first circuit, and curve L2 shows the current-time curve of the second circuit. At time T3, the substrate 2 is completely immersed in water, the contactor KM is disconnected, and the second power supply PPS2 is started. Figure 4 It can be seen that at time 0-T3, since both the first anode P1 and the second anode P2 are controlled by the first power supply PPS1, the curve L2 is always at the 0 ampere (A) position. Since only the first power supply PPS1 is working, there is no mutual interference between multiple power supplies, and the curve L1 will not have abnormal fluctuations caused by power supply interference. The only fluctuation ( Figure 4 The Y area in the middle is the tiny fluctuation generated when the first power supply PPS1 switches from the constant voltage mode to the constant current mode. This tiny fluctuation is determined by the working characteristics of the power supply, cannot be eliminated, and will not have a substantial impact on the electroplating.

[0053] It should be noted that Figure 3a and Figure 3b The positions of the first contact 4 and the second contact 5 shown in FIG. Figure 3c As shown, in another implementation of the present embodiment, the first contact 4 may be located on the first anode P1, and the first contact 5 may be located on the second anode P2. Optionally, in other possible implementations of the present embodiment, the first contact 4 may also be located on the positive pole of the first power supply PPS1, and the first contact 5 may be located on the second anode P2. The first contact 4 is located on the first anode control circuit, and the second contact 5 is located on the second anode control circuit. The first power supply PPS1 and the first anode P1 are both part of the first anode control circuit, and the second power supply PPS2 and the second anode P2 are both part of the second anode control circuit. Those skilled in the art may adjust the positions of the first contact 4 and the second contact 5 in accordance with the teachings of the present disclosure and in combination with actual conditions.

[0054] It should be understood that Figure 3a , Figure 3b and Figure 3cAs shown, in this embodiment, a diode D1 is connected between the positive electrode of the first power supply PPS1 and the first anode P1, and a diode D2 is connected between the positive electrode of the second power supply PPS2 and the second anode P2. Therefore, in order not to affect the protection function of the diode D1 and the diode D2, the diodes D1 and D2 should be respectively arranged between the corresponding positive electrodes of the power supply and the contacts, and the contacts include the first contact 4 and the second contact 5, that is, the diode D1 should be arranged between the positive electrode of the first power supply PPS1 and the first contact 4, and the diode D2 should be arranged between the positive electrode of the second power supply PPS2 and the second contact 5. In other words, the first contact 4 should be between the cathode of the diode D1 and the first anode P1, and the second contact 5 should be between the cathode of the diode D2 and the second anode P2.

[0055] Embodiment 2

[0056] See also Figure 5a and Figure 5b , Figure 5a It is a schematic diagram showing the structure of the substrate electroplating device in the second embodiment of the present invention, wherein the control switch is in the disconnected state; Figure 5b It shows a schematic diagram of the structure of the substrate electroplating device in the second embodiment of the present invention, wherein the control switch is in the on state.

[0057] Compared with the first embodiment, the present embodiment adds a third anode P3 and a third power supply PPS3, and adds a second control switch. The positive electrode of the third power supply PPS3 is connected to the third anode P3 to form a third anode control circuit, the third anode control circuit includes a third contact 6, the second control switch is connected between the second contact 5 and the third contact 6, and the negative electrode of the third power supply PPS3 is electrically connected to the substrate 2 to form a third loop where the third anode control circuit is located.

[0058] Similar to the first embodiment, the control switch of this embodiment is selected as a contactor. For the convenience of description, the first control switch between the first anode control circuit and the second anode control circuit is the contactor KM1, and the second control switch between the second anode control circuit and the third anode control circuit is the contactor KM2.

[0059] like Figure 5b As shown, when the substrate 2 enters the water, the contactors KM1 and KM2 are turned on, the second power supply PPS2 and the third power supply PPS3 are turned off, and the first anode P1, the second anode P2, and the third anode P3 are connected to the positive electrode of the first power supply PPS1. That is, at this time, the first anode P1, the second anode P2, and the third anode P3 are all controlled by the first power supply PPS1. Figure 5aAs shown, after the substrate 2 is immersed in water, the electroplating process stage is carried out, the contactors KM1 and KM2 are disconnected, the second power supply PPS2 and the third power supply PPS3 are started, and the first anode P1, the second anode P2 and the third anode P3 are individually controlled by the first power supply PPS1, the second power supply PPS2 and the third power supply PPS3 respectively.

[0060] Combination Figure 6 , which is a schematic diagram of the current-time curve of the substrate electroplating device in the second embodiment of the present invention, wherein curve L21 shows the current-time curve of the first loop, curve L22 shows the current-time curve of the second loop, and curve L23 shows the current-time curve of the third loop. At T3, the substrate 2 is completely immersed in water and enters the formal electroplating process stage, the contactors KM1 and KM2 are disconnected, and the second power supply PPS2 and the third power supply PPS3 are started.

[0061] from Figure 6 It can be seen that at time 0-T3, since the first anode P1, the second anode P2 and the third anode P3 are all controlled by the first power supply PPS1, the curves L22 and L23 are always at the 0 ampere (A) position. Since only the first power supply PPS1 is working, there is no mutual interference between multiple power supplies, and the curve L21 will not have abnormal fluctuations caused by power supply interference. The only fluctuation ( Figure 6 The middle Z area) is a tiny fluctuation generated when the first power supply PPS1 switches from constant voltage mode to constant current mode. This tiny fluctuation is determined by the working characteristics of the power supply, cannot be eliminated, and will not have a substantial impact on electroplating.

[0062] It should be understood that the first and second embodiments are only exemplary embodiments of the present invention. In other possible embodiments, the number of anodes and power supplies may be greater, and accordingly, the number of control switches also increases. The present invention does not limit the number and specific connection method of the control switches. The control switch should meet the following requirements: when the control switch itself is turned on, multiple anodes are connected in parallel to the positive pole of the same power supply, thereby realizing that multiple anodes are controlled by one power supply; when the control switch itself is turned off, it does not affect the control of each independent anode by each independent power supply.

[0063] Embodiment 3

[0064] Another aspect of the present invention discloses a substrate electroplating method, which is applicable to the aforementioned substrate electroplating device. The substrate electroplating method comprises: in the stage of substrate entering water, turning on the control switch, starting one power supply, turning off the other power supplies, and the anode is controlled by the started power supply; in the electroplating process stage of the substrate, turning off the control switch, starting the other power supplies, and each anode is controlled by its corresponding anode.

[0065] Taking the substrate electroplating device applicable to the first embodiment as an example, refer to Figure 7 During the water entry stage of the substrate, the contactor KM is turned on, the first power supply PPS1 is started, the second power supply PPS2 is turned off, the first anode P1 and the second anode P2 are connected to the first power supply PPS1 and controlled by the first power supply PPS1; during the electroplating process stage of the substrate, the contactor KM is disconnected, the second power supply PPS2 is started, the first anode P1 is controlled by the first power supply PPS1, and the second anode P2 is controlled by the second power supply PPS2.

[0066] Embodiment 4

[0067] Taking the substrate electroplating device applicable to the second embodiment as an example, refer to Figure 8 In the water entry stage of the substrate, contactor KM1 and contactor KM2 are turned on, the first power supply PPS1 is started, the second power supply PPS2 and the third power supply PPS3 are turned off, the first anode P1, the second anode P2 and the third anode P3 are connected to the first power supply PPS1 and controlled by the first power supply PPS1; in the electroplating process stage of the substrate, contactor KM1 and contactor KM2 are disconnected, the second power supply PPS2 and the third power supply PPS3 are started, the first anode P1 is controlled by the first power supply PPS1, the second anode P2 is controlled by the second power supply PPS2, and the third anode P3 is controlled by the third power supply PPS3.

[0068] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A substrate electroplating device, characterized in that: include: at least two anodes, at least two power supplies, and at least one control switch; The anodes correspond to the power sources one by one, each anode is connected to the positive electrode of the corresponding power source, and the control switch is used to connect the at least two anodes to the same positive electrode of the power source when the control switch is turned on.

2. The substrate electroplating device according to claim 1, characterized in that: The anode includes a first anode and a second anode, the power supply includes a first power supply and a second power supply, and the control switch includes a first control switch; The positive electrode of the first power supply is connected to the first anode to form a first anode control circuit, and the positive electrode of the second power supply is connected to the second anode to form a second anode control circuit; The first anode control circuit includes a first contact, the second anode control circuit includes a second contact, and the first control switch is connected between the first contact and the second contact.

3. The substrate electroplating device according to claim 2, characterized in that: The anode further comprises a third anode, the power supply further comprises a third power supply, and the control switch further comprises a second control switch; The positive electrode of the third power supply is connected to the third anode to form a third anode control circuit. The third anode control circuit includes a third contact, and the second control switch is connected between the second contact and the third contact.

4. The substrate electroplating device according to claim 1, characterized in that: A diode is connected between the anode and the corresponding positive electrode of the power supply.

5. The substrate electroplating device according to claim 4, characterized in that: The control switch is connected to the anode via a contact, and the diode is arranged between the corresponding positive electrode of the power supply and the contact.

6. The substrate electroplating device according to claim 1, characterized in that: The control switch includes a contactor.

7. A substrate electroplating method, applicable to the substrate electroplating device as claimed in claim 1, characterized in that: include: During the water entry stage of the substrate, the control switch is turned on, one power supply is started, and the other power supplies are turned off, and all the anodes are controlled by the started power supply; During the electroplating process of the substrate, the control switch is disconnected, the remaining power supplies are started, and each of the anodes is controlled by the corresponding power supply.

8. The substrate electroplating method according to claim 7, characterized in that: The anode includes a first anode and a second anode, the power supply includes a first power supply and a second power supply, and the control switch includes a first control switch; the positive electrode of the first power supply is connected to the first anode to form a first anode control circuit, and the positive electrode of the second power supply is connected to the second anode to form a second anode control circuit; The first anode control circuit includes a first contact, the second anode control circuit includes a second contact, and the first control switch is connected between the first contact and the second contact; The substrate electroplating method further comprises: during the water entry stage of the substrate, turning on the first control switch, starting the first power supply, turning off the second power supply, and connecting the first anode and the second anode to the first power supply and being controlled by the first power supply; During the electroplating process of the substrate, the first control switch is turned off, the second power supply is started, the first anode is controlled by the first power supply, and the second anode is controlled by the second power supply.

9. The substrate electroplating method according to claim 8, characterized in that: The anode further comprises a third anode, the power supply further comprises a third power supply, and the control switch further comprises a second control switch; The positive electrode of the third power supply is connected to the third anode to form a third anode control circuit. The third anode control circuit includes a third contact, and the second control switch is connected between the second contact and the third contact; The substrate electroplating method further comprises: during the water entry stage of the substrate, turning on the first control switch and the second control switch, starting the first power supply, turning off the second power supply and the third power supply, and the first anode, the second anode, and the third anode are connected to the first power supply and controlled by the first power supply; During the electroplating process stage of the substrate, the first control switch and the second control switch are disconnected, the first power supply and the second power supply are started, the first anode is controlled by the first power supply, the second anode is controlled by the second power supply, and the third anode is controlled by the third power supply.

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