Active damping system

Abstract

The invention discloses an active vibration reduction system. The active vibration reduction system comprises a lower device, and the lower device comprises a base, a base table located above the base and a lower displacement device for driving the base table to move relative to the base; one side of the base away from the base is provided with a first reference surface; a scanning probe of the probe distance sensing device is located above the first reference surface, and the probe distance sensing device is used for detecting the distance between the first reference surface and the scanning probe; and the main control module is electrically connected with the lower displacement device and the probe distance sensing device, and the main control module controls the lower displacement device to drive the base table to move relative to the base according to the distance between the first reference surface and the scanning probe measured by the scanning probe. Compared with the prior art, the active vibration reduction system is better in vibration reduction effect.

Description

Technical Field

[0001] The present invention relates to the field of vibration reduction technology, and in particular to an active vibration reduction system. Background Art

[0002] The operation of various ultra-high precision instruments requires an ultra-high precision vibration reduction (shock reduction) environment. The vibration source generally comes from the contact between the instrument and the air in the environment and the mechanical contact between the instrument and the environment. Air contact can be achieved through an acoustic isolation box, and mechanical contact can be achieved by placing the ultra-high precision instrument on a vibration reduction system with mechanical contact. The mechanical contact can be three-dimensional mechanical contact in space, and most of the mechanical contact comes from the bottom of the instrument, that is, the vibration is transmitted from the bottom to the instrument above, that is, the vibration source in the Z direction. Of course, the vibration transmitted from the bottom can be lateral vibration, that is, vibration in the XY direction. But in most cases, this XY direction vibration is relatively weak compared to the Z direction vibration.

[0003] Generally, there are two vibration reduction technology solutions to achieve the vibration reduction system of mechanical contact:

[0004] 1) Passive vibration reduction system. The typical passive vibration reduction is a spring system, such as Figure 1 From top to bottom, there are the instrument 91 to be stabilized, the spring 92 (passive shock absorber), and the vibration source 93. Arrow A is a schematic diagram of the high-frequency amplitude of the vibration source 93 greater than or equal to 100Hz, and arrow A1 indicates that the presence of the spring 92 in the high-frequency vibration greater than or equal to 100Hz greatly reduces the amplitude of the instrument 91 to be stabilized; arrow B is a schematic diagram of the low-frequency amplitude of the vibration source 93 less than or equal to 20Hz, and arrow B1 indicates that in the low-frequency vibration less than or equal to 20Hz, the amplitude of the instrument 91 to be stabilized does not decrease even if the spring 92 exists. In other words, the passive vibration reduction system is generally composed of the damped object (instrument)-spring-damping system, mainly using coil springs (Coil Spring), vibration isolation rubber pads (Elastomer Pad), and air springs (Air Spring) to reduce the vibration transmitted from the foundation, or isolate the vibration source so that its vibration is not transmitted to the foundation in turn. The vibration isolation principle is that the spring, rubber pad or air spring absorbs the energy of the vibration. The advantage of this system is that it can achieve the maximum vibration isolation effect with a simple structure, but its disadvantage is that the resonance and vibration isolation performance in the low frequency (<3Hz) segment is extremely low, and it requires a long stabilization time. In addition, a stable instrument needs to be placed on the spring, or the instrument needs to be suspended by the spring. For higher frequency vibrations, the spring can filter these vibrations very well. In general, passive vibration reduction can effectively filter high-frequency vibrations and can limit the amplitude to less than 0.1 nanometers / second. However, for lower frequency vibrations, generally below 50-100 Hz, the effect of passive vibration reduction of springs is suddenly reduced.

[0005] 2) Active vibration reduction system. Figure 2 From top to bottom, there are the instrument 91 that needs to be stabilized, the active vibration absorber 94, and the vibration source 93. Arrow E is a schematic diagram of the low-frequency amplitude of the vibration source 93 less than or equal to 20Hz, and arrow E1 indicates that the presence of the active vibration absorber 94 in the low-frequency vibration less than or equal to 20Hz greatly reduces the amplitude of the instrument 91 that needs to be stabilized; arrow F is a schematic diagram of the high-frequency amplitude of the vibration source 93 greater than or equal to 100Hz, and arrow F1 indicates that in the high-frequency vibration greater than or equal to 100Hz, the amplitude of the instrument 91 that needs to be stabilized does not decrease even if the active vibration absorber 94 exists. In other words, for low-frequency vibration (generally ≤20Hz), the effect of passive vibration reduction is suddenly reduced. At this time, active vibration reduction intervention is required. The active vibration reduction system is to install a vibration sensor and a displacement device on the basis of the passive vibration reduction system. The vibration of the table is detected by the vibration sensor, and then fed back to the control system, and the displacement of the vibration is offset by applying a displacement in the opposite direction of the vibration to the table. The active vibration reduction system can not only greatly improve the vibration reduction effect of the passive vibration reduction system in the low frequency band, but also avoid resonance. Figure 2 As shown in , the active vibration absorber 94 is placed between the instrument 91 (reference surface M1) to be stabilized and the surface of the vibration source 93 (reference surface M0), or between the instrument 91 (reference surface M1) to be stabilized and the passive vibration absorber (spring) below, or between the passive vibration absorber (spring) below and the surface of the vibration source 93 (reference surface M0). The principle of active vibration reduction is that when the vibration source 93 vibrates upward (downward), the active vibration absorber 94 between the instrument 91 to be stabilized and the vibration source 93 will shrink (expand) in the longitudinal direction, so that the position of the bottom of the instrument 91 to be stabilized (reference surface M1) will drop because the surface of the vibration source 93 (reference surface M0) is upward but because of the contraction of the active vibration absorber. One rise (fall) and one contraction (expansion) cause the instrument to neither move upward (down) nor downward (up), and keep the instrument 91 (reference surface M1) to be stabilized motionless, thereby achieving a vibration reduction effect.

[0006] Although, for vibrations between 1 and 50 Hz, the active vibration reduction effect should be very good. However, the current active vibration reduction can only limit the amplitude to within 100 nanometers. However, there is currently no suitable vibration reduction device for achieving a vibration reduction effect of less than 1 nanometer. The reason is not a problem with the principle of active vibration reduction, but the existing sensors for measuring vibration displacement are not accurate enough. Based on the above technical problems, the inventor proposed the technical solution of this patent application. Summary of the invention

[0007] The object of the present invention is to provide an active vibration reduction system to achieve a better vibration reduction effect.

[0008] In order to solve the above technical problems, an embodiment of the present invention provides an active vibration reduction system, comprising:

[0009] A lower device, the lower device comprising: a base, a pedestal located above the base, and a lower displacer driving the pedestal to move relative to the base; the pedestal has a first reference surface on a side facing away from the base;

[0010] a probe distance sensing device, wherein a scanning probe of the probe distance sensing device is located above the first reference surface and is used to detect the distance between the first reference surface and the scanning probe;

[0011] A main control module is electrically connected to the lower displacer and the probe distance sensor device, and controls the lower displacer to drive the base to move relative to the base according to the distance between the first reference surface and the scanning probe measured by the scanning probe.

[0012] Compared with the prior art, the embodiments of the present invention use a probe distance sensor system as a sensing mechanism to measure the vibration transmitted from the ground to sub-nanometer precision, and then the distance between the first reference surface and the scanning probe of the probe distance sensor system can be changed by the lower positioner, that is, a compensation mechanism of active vibration reduction is formed, so as to achieve the stability of the relative distance between the two opposite surfaces that need vibration reduction to obtain sub-nanometer precision. Thus, the existing active vibration reduction system with tens and hundreds of nanometer precision is greatly improved to an active vibration reduction system with sub-nanometer precision.

[0013] In one embodiment, the active vibration reduction system further comprises:

[0014] The upper device is located above the lower device, and the part of the probe distance sensor device that fixes the probe is connected to the upper device. The upper device has a second reference surface on one side facing the lower device.

[0015] In one embodiment, the upper device comprises: a mounting platform having the second reference surface, and an upper displacer for driving the mounting platform to move;

[0016] The main control module is electrically connected to the upper displacer and the probe distance sensor. The main control module controls the upper displacer to drive the mounting platform to move relative to the first reference surface according to the distance between the first reference surface and the second reference surface measured by the scanning probe.

[0017] In one embodiment, the probe distance sensor device has a plurality of devices, and the lower displacement device has a plurality of devices.

[0018] In one embodiment, the active vibration reduction system further comprises: a sample stage disposed on the base;

[0019] There are at least four probe distance sensor devices, and the scanning probes of each probe distance sensor device are respectively located at different corner ends of the base; the sample stage is located between the areas surrounded by the scanning probes of each probe distance sensor device.

[0020] In one embodiment, the upper device is used to connect to a scanning probe microscope system for scanning a sample, and the scanning probe microscope system is connected to the upper device.

[0021] In one embodiment, the probe distance sensing device is a probe atomic force microscope, a probe electrostatic force microscope, a probe tunneling electron microscope or a probe conductive contact mode sensor;

[0022] The lower displacer includes a piezoelectric drive or an electromagnetic drive motor.

[0023] In one embodiment, when the probe distance sensing device is a probe conductive contact mode sensor;

[0024] The probe of the probe conductive contact mode sensor vibrates at a preset frequency, and the probe contacts the first reference surface to form conductivity; the main control module obtains the time required for the probe to contact the first reference surface during vibration based on the conductivity formed by the probe contacting the first reference surface.

[0025] In one embodiment, the probe distance sensing device includes: a cantilever connected to the scanning probe, a support arm connected to one end of the cantilever facing away from the scanning probe and the lower device, and a counterweight block arranged on the cantilever; the cantilever is located above the first reference plane, and the cantilever is an elastic arm, and the cantilever can be operated to vibrate relative to the first reference plane when the base vibrates.

[0026] An embodiment of the present invention provides an active vibration reduction system, comprising:

[0027] a lower device, wherein a top surface of the lower device has a first reference surface;

[0028] An upper device, the upper device is located above the lower device, and the upper device comprises: a mounting table, and an upper displacer for driving the mounting table to move; the mounting table has a second reference surface on a side facing the lower device;

[0029] A probe distance sensing device, the probe distance sensing device is connected to the upper device, and a scanning probe of the probe distance sensing system is located above the first reference surface and is used to detect the distance between the first reference surface and the second reference surface;

[0030] A main control module is electrically connected to the upper displacer and the probe distance sensor device, and controls the upper displacer to drive the mounting platform to move relative to the lower device according to the distance between the first reference plane and the second reference plane measured by the scanning probe.

[0031] An embodiment of the present invention provides an active vibration reduction system, comprising:

[0032] A lower device, the lower device comprising: a base, a pedestal located above the base, and a lower displacer driving the pedestal to move relative to the base; the pedestal has a first reference surface on a side facing away from the base;

[0033] An upper device, the upper device is located above the lower device, and a side of the upper device facing the lower device has a second reference surface;

[0034] A probe distance sensor device, wherein a fixed probe portion of the probe distance sensor device is connected to the lower device, and a scanning probe of the probe distance sensor device faces the second reference surface and is used to detect the distance between the first reference surface and the second reference surface;

[0035] A main control module is electrically connected to the lower displacer and the probe distance sensor device, and controls the upper displacer to drive the base to move relative to the base according to the distance between the first reference plane and the second reference plane measured by the scanning probe.

[0036] An embodiment of the present invention provides an active vibration reduction system, comprising:

[0037] a lower device, wherein a top surface of the lower device has a first reference surface;

[0038] An upper device, the upper device is located above the lower device, and the upper device comprises: a mounting table, and an upper displacer for driving the mounting table to move; the mounting table has a second reference surface on a side facing the lower device;

[0039] A probe distance sensor device, wherein a fixed probe portion of the probe distance sensor device is connected to the lower device, and a scanning probe of the probe distance sensor device faces the second reference surface and is used to detect the distance between the first reference surface and the second reference surface;

[0040] A main control module is electrically connected to the upper displacer and the probe distance sensor device, and controls the upper displacer to drive the mounting platform to move relative to the lower device according to the distance between the first reference plane and the second reference plane measured by the scanning probe. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0042] Figure 1 is a schematic structural diagram of a passive vibration reduction mechanism in the background technology of the present invention;

[0043] Figure 2 is a schematic structural diagram of an active vibration reduction mechanism in the background technology of the present invention;

[0044] Figure 3 is a schematic structural diagram of an active vibration reduction system according to an embodiment of the present invention;

[0045] Figure 4 is a schematic structural diagram of an active vibration reduction system used in a scanning probe microscope system according to an embodiment of the present invention;

[0046] Figure 5 is a structural schematic diagram of a multi-point vibration reduction layout in an active vibration reduction system according to an embodiment of the present invention;

[0047] Figure 6 It is a structural schematic diagram of an active vibration reduction system according to an embodiment of the present invention. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the following will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that in the various embodiments of the present invention, many technical details are provided in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can be implemented.

[0049] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the relevant art will recognize that the embodiments may be practiced without one or more of these specific details. In other cases, well-known devices, structures, and techniques associated with the present application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0050] Unless the context requires otherwise, throughout the specification and claims, the word "comprise" and variations such as "include" and "have" should be construed in an open, inclusive sense, ie, should be interpreted as "including, but not limited to."

[0051] The following will be described in detail with reference to the accompanying drawings to provide a clearer understanding of the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the accompanying drawings are not intended to limit the scope of the present invention, but are only intended to illustrate the essential spirit of the technical solution of the present invention.

[0052] References throughout the specification to "one embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout the specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0053] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. It should be noted that the term "or" is generally employed in its sense including "and / or" unless the context clearly dictates otherwise.

[0054] In the following description, in order to clearly show the structure and working mode of the present invention, many directional words will be used for description, but the words "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", "down", etc. should be understood as convenient terms and should not be understood as restrictive terms.

[0055] The working mode of the scanning probe microscope (i.e., the working mode of the probe distance sensing device and the scanning probe microscope system in the following embodiments) is mainly the atomic force microscopy measurement mode. Other working modes include scanning probe conductive microscopy, scanning probe magnetic force microscopy, scanning tunneling electron microscopy, scanning probe Kelvin microscopy, scanning probe lithography, and scanning probe single ion implantation.

[0056] The measurement modes of the atomic force microscope in all working modes of the scanning probe can be divided into two types, namely:

[0057] Probe working mode 1 (constant height mode): Keep the probe at a constant height to scan and measure the surface of the sample. Due to the ups and downs of the sample surface, the probe feels different attraction of the van der Waals force on the sample surface; the closer the probe is to the sample surface, the greater the attraction of the van der Waals force; conversely, the farther the probe is from the sample surface, the smaller the attraction of the van der Waals force. Through the relationship between the attraction of the van der Waals force and the distance between the probe and the sample surface, the scanning diagram of the distance from the probe to the sample surface can be calculated, that is, the three-dimensional morphology of the sample surface.

[0058] Probe working mode 2 (constant force mode): keep the van der Waals attraction between the probe and the sample surface unchanged, that is, as the probe moves and scans to the next measurement point, due to the ups and downs of the sample surface, the different height distances between the measurement point and the probe cause the probe to feel different van der Waals attraction on the sample surface, so the probe is raised or lowered to achieve the same van der Waals force as the previous measurement point. At this time, the amount of movement of the probe in the height direction from the surface is the height difference between the two measurement points on the sample surface. The height difference obtained by two-dimensional scanning of the sample surface can form a three-dimensional topography.

[0059] Since the measurement mode of the scanning probe microscope forms a scanning line or scanning surface by measuring one measurement point at a time, its speed depends on the measurement time of each scanning point. Generally, the measurement time or sampling time required for these measurement points is in the millisecond level or even sub-millisecond level. The increase in measurement speed will lead to an increase in the number of measurements for each measurement point within the same overall measurement time, thereby increasing the signal-to-noise ratio of the measurement point.

[0060] Since the ideal precision of the scanning probe microscope is at the nanometer, sub-nanometer or even picometer level, within this dynamic range, the noise caused by the environment in which the scanning probe microscope is located has become a huge problem and challenge that is always difficult to overcome. Even if the sample to be measured is placed on a passive vibration-absorbing base, with active shock absorbers and a soundproof cover, it is generally difficult to solve the noise problem in high-precision measurement. So far, there is no more suitable device and method to significantly reduce environmental vibration and noise. In addition, the existing vibration and noise reduction devices have greatly increased the cost and complexity of the system, especially hindering the widespread application of scanning probe microscopes in industrial environments and high-speed measurement fields.

[0061] There are two situations in which the existing ground vibration has a negative effect on the instrument that needs to be stable:

[0062] Case 1, causes the entire mechanism to carry the overall vibration of the instrument, that is, Figure 1 and Figure 2M1 and M2 vibrate along with the surface M0 of the vibration source, i.e. the ground.

[0063] Case 2, relative vibration between different reference surfaces. Although this vibration comes from ground vibration, the overall vibration brought by ground vibration is decomposed into relative vibration of each surface inside the entire mechanism. Even if there is an overall vibration like case 1, it is not equal to the vibration of a certain surface relative to another surface inside the entire mechanism. If the overall vibration does not cause relative vibration between certain specific surfaces inside, even if the overall vibration occurs, these vibrations will still not affect the spacing between these specific surfaces, so there is little need for overall vibration reduction. However, if the overall vibration drives the vibration between specific internal surfaces, this vibration must be overcome. There are two ways to overcome it: one is to reduce the overall vibration, that is, case 1, but the problem with this type of vibration reduction is that the vibration reduction amplitude is not large enough. Another type is to reduce the vibration between specific internal surfaces, directly reducing the part that really needs vibration reduction inside. Case 2 The relative vibration must be the relative displacement between two points or two planes with respect to a certain equilibrium point. So first, we must define which two surfaces are, and then we can try to reduce the relative movement between the two surfaces.

[0064] The following describes embodiments of the present invention with reference to the accompanying drawings. A first embodiment of the present invention relates to an active vibration reduction system 100. Figure 3 In the structural schematic diagram of the active vibration reduction system shown in the figure, the active vibration reduction system 100 includes: a lower device 1, an upper device 5, a probe distance sensor device 2 and a main control module 3. The lower device 1 includes: a base 11, a base 12 located above the base 11, and a lower displacer 13 that drives the base 12 to move relative to the base 11. The side of the base 12 facing away from the base 11 has a first reference surface N1. The scanning probe 21 of the probe distance sensor device 2 is located above the first reference surface N1 and is used to detect the distance D between the first reference surface N1 and the scanning probe 21. The main control module 3 is electrically connected to the lower displacer 13 and the probe distance sensor device 2. The upper device 5 is located above the lower device 1, and the probe distance sensor device 2 is connected to the upper device 5. The upper device 5 has a second reference surface N2 on the side facing the lower device 1. When in use, a scanning probe microscope system 6 for scanning a sample 7 can be connected to the upper device 5. When the distance between the first reference plane N1 and the scanning probe 21 (i.e., the distance between the first reference plane N1 and the second reference plane N2) is less than the preset distance, the lower displacer 13 drives the base 12 to move downward, i.e., moves toward the base 11; when the distance between the first reference plane N1 and the scanning probe 21 (i.e., the distance between the first reference plane N1 and the second reference plane N2) is greater than the preset distance, the lower displacer 13 drives the base 12 to move upward, i.e., moves away from the base 11, so that the distance between the first reference plane N1 and the scanning probe 21 is within the preset distance range.

[0065] Specifically, Figure 3 As shown, the vibration comes from the lower device 1, such as from the ground contacted by the lower device 1. What needs to be damped is the vibration between the upper device 5 and the lower device 1, and the base 12 and the upper device 5 need to be stably damped. The probe distance sensor device 2 includes a mounting device 22 for the scanning probe 21, and a displacement device is provided on the mounting device 22, and the displacement device is composed of a coarse displacement device and / or a precise displacement device. The coarse displacement device and / or the precise displacement device realize the movement of the scanning probe 21, "representing" the upper device 5 to approach the first reference surface N1 of the lower device 1, forming a nanometer-level distance from the lower surface, thereby realizing the control of the distance of the lower surface by the probe through the atomic force control mode.

[0066] The method for realizing active vibration reduction control is to use the scanning probe 21 to approach the first reference surface N1 of the lower device 1, and fix the probe within a distance of only 10-50 nanometers from the first reference surface N1 through the atomic force control mode. When the lower device 1 moves upward due to vibration, the distance between the scanning probe 21 and the first reference surface N1 of the lower device 1 will decrease, so the atomic force sensed by the scanning probe 21 will increase significantly, and the lower displacer 13 drives the base 12 to move downward, so that the first reference surface N1 of the lower device 1 moves downward, so that the vibration of the first reference surface N1 is eliminated to achieve the result of surface stability.

[0067] In other embodiments, the upper device 5 may be omitted, and the probe distance sensor device 2 may be installed on other mounting brackets, which may be installed on the side or in other directions. In this case, there is no second reference surface N2, so the area to be damped may be defined as the area between the scanning probe 21 and the first reference surface N1. The main control module 3 controls the lower displacer 13 to drive the base 12 to move relative to the base 11 according to the distance between the first reference surface N1 and the scanning probe 21 measured by the scanning probe 21.

[0068] The probe distance sensor device 2 is used as a sensing mechanism to measure the vibration transmitted from the ground to a sub-nanometer precision. Then, the distance between the first reference surface N1 and the scanning probe 21 of the probe distance sensor device 2 can be changed by the lower position device, that is, a compensation mechanism of active vibration reduction is formed, so as to achieve the stability of the relative distance between the two relative surfaces that need vibration reduction to obtain sub-nanometer precision. Thus, the existing active vibration reduction system 100 with a precision of tens and hundreds of nanometers is greatly improved to an active vibration reduction system 100 with sub-nanometer precision. In the prior art, passive vibration reduction and active vibration reduction system 100 are generally used to stabilize the probe distance sensor device 2, but in this embodiment, the probe distance sensor device 2 is used as a sensing mechanism for the first time to manufacture an active vibration reduction table with ultra-highest sensitivity.

[0069] Further, the probe distance sensor device 2 is a probe atomic force microscope, a probe electrostatic force microscope, a probe tunnel electron microscope or a probe conductive contact mode sensor. The lower displacer 13 includes a piezoelectric drive or an electromagnetic drive motor.

[0070] Specifically, taking the probe distance sensing device as a probe conductive contact mode sensor as an example, the probe of the probe conductive contact mode sensor vibrates at a preset frequency, and the probe contacts the first reference surface to form conductivity. The main control module obtains the time required for the probe to contact the first reference surface during vibration based on the conductivity formed by the probe contacting the first reference surface. In other words, the probe is self-controlled to vibrate by approaching and leaving the first reference surface at a certain frequency. When there is no environment causing the first reference surface to move, the vibration of the probe itself will cause the probe to contact the first reference surface at a certain time to form conductivity. However, if the first reference surface approaches the probe with the environmental vibration, the time when the probe contacts the first reference surface will be advanced or delayed due to the change in the distance from the probe to the first reference surface. The time of advance or delay is the amplitude of the vibration of the reaction surface. This amplitude can be used as a feedback signal to drive the displacer to move the first reference surface in the opposite direction, thereby achieving the purpose of vibration reduction.

[0071] like Figure 3 As shown, the active vibration reduction system 100 further includes: a sample stage 14 disposed on the base 12. When in use, the sample 7 is placed on the sample stage 14, and then the probe distance sensor device 2 system is used to scan the sample 7. In this embodiment, as shown in FIG. Figure 5 As shown, there are four probe distance sensor devices 2, and the scanning probes 21 of each probe distance sensor device 2 are respectively located at different corners of the base 12, and the sample stage 14 is located between the areas surrounded by the scanning probes 21 of each probe distance sensor device 2. There can also be multiple lower displacers 13, one lower displacer 13 corresponds to one probe distance sensor device 2, and the corresponding lower displacer 13 is controlled to drive the base 12 to move according to the situation scanned by the scanning probe 21 of the probe distance sensor device 2. In other words, Figure 5 In the embodiment, the base 12 may be a rectangle, and a probe distance sensor device 2 is disposed at each of the four corners of the rectangle, and the sample stage 14 is located in the middle area of ​​the base 12. In other embodiments, the number of the probe distance sensor devices 2 is not limited to the above number, and may be more than four or less than four, and the shape of the base 12 is not limited to the rectangle in this embodiment, and other shapes that meet the use requirements are feasible.

[0072] Preferably, there are multiple probe distance sensor devices 2, but of course only one is also acceptable.

[0073] In addition, if Figure 3As shown, the upper device 5 includes: a mounting table 51 having a second reference surface N2, and an upper displacement device 52 for driving the mounting table 51 to move. The main control module 3 is electrically connected to the upper displacement device 52 and the probe distance sensor device 2. The main control module 3 controls the upper displacement device 52 to drive the mounting table 51 to move relative to the first reference surface N1 according to the distance between the first reference surface N1 and the second reference surface N2 measured by the scanning probe 21. Figure 4 The scanning probe microscope system 6 shown is installed on the upper device. The scanning probe microscope system 6 for scanning the sample 7 is fixed on the mounting table 51. The controller of the scanning probe microscope system 6 controls the operation of its probe 61 and the mounting device 62. The mounting device 62 has a displacement device, and the displacement device is composed of a coarse displacement device and / or a fine displacement device. The coarse displacement device and / or the fine displacement device adjust the movement of the probe 61. Specifically, when the distance between the first reference plane N1 and the second reference plane N2 is greater than the preset distance, the main control module 3 controls the upper displacement device 52 to drive the mounting table 51 to move downward, that is, to move the mounting table 51 toward the lower device 1. The upper displacement device 52 includes a piezoelectric driver or an electromagnetic drive motor. When the distance between the first reference plane N1 and the second reference plane N2 is less than the preset distance, the main control module 3 controls the upper displacement device 52 to drive the mounting table 51 to move upward, that is, to move the mounting table 51 in a direction away from the lower device 1. In actual use, the active module can be used to adjust the distance according to actual needs, and control the upper displacer 52 and the lower displacer 13 at the same time, or control one of them.

[0074] It is understandable that in other embodiments, the structure of the active vibration reduction system 100 may be different from that of the present embodiment, and the lower device 1 may be different from the lower device 1 in the present embodiment, such as the lower device 1 without the lower displacer 13. The active vibration reduction system 100 in this embodiment includes: a lower device 1, an upper device 5, a probe distance sensor device 2, and a main control module 3. The top surface of the lower device 1 has a first reference plane N1, and the upper device 5 is located above the lower device 1. The upper device 5 includes: a mounting table 51, and an upper displacer 52 for driving the mounting table 51 to move; the mounting table 51 has a second reference plane N2 on one side facing the lower device 1. The probe distance sensor device 2 is connected to the upper device 5, and the scanning probe 21 of the probe distance sensor device 2 is located above the first reference plane N1, and is used to detect the distance between the first reference plane N1 and the second reference plane N2. The main control module 3 is electrically connected to the upper displacer 52 and the probe distance sensor device 2 . The main control module 3 controls the upper displacer 52 to drive the mounting platform 51 to move relative to the lower device 1 according to the distance between the first reference plane N1 and the second reference plane N2 measured by the scanning probe 21 .

[0075] Another embodiment involves another active vibration reduction system, in which the probe distance sensor device 2 is connected to the lower device 1 instead of the upper device 5, and the probe distance sensor device 2 scans the second reference surface N2 in the upper device 5. The active vibration reduction system 100 includes: a lower device 1, an upper device 5, a probe distance sensor device 2 and a main control module 3. The lower device 1 includes: a base 11, a base 12 located above the base 11, and a lower displacer 13 driving the base 12 to move relative to the base 11. The side of the base 12 facing away from the base 11 has a first reference surface N1. Upper device 5 The upper device 5 is located above the lower device 1, and the side of the upper device 5 facing the lower device 1 has a second reference surface N2; the probe distance sensor device 2 is connected to the lower device 1, and the scanning probe 21 of the probe distance sensor device 2 faces the second reference surface N2, which is used to detect the distance between the first reference surface N1 and the second reference surface N2. The main control module 3 is electrically connected to the lower displacer 13 and the probe distance sensor 2 . The main control module 3 controls the upper displacer 52 to drive the base 12 to move relative to the base 11 according to the distance between the first reference plane N1 and the second reference plane N2 measured by the scanning probe 21 .

[0076] Another embodiment involves an active vibration reduction system, in which the probe distance sensor device 2 is connected to the lower device 1 instead of the upper device 5. The probe distance sensor device 2 scans the second reference surface N2 in the upper device 5. In this structure, the distance between the first reference surface N1 and the second reference surface N2 is changed by moving the second reference surface N2 relative to the first reference surface N1 of the lower device 1. The active vibration reduction system 100 includes: a lower device 1, an upper device 5, a probe distance sensor device 2, and a main control module 3. The top surface of the lower device 1 has a first reference surface N1. The upper device 5 is located above the lower device 1, and the upper device 5 includes: a mounting platform 51, and an upper displacement device 52 for driving the mounting platform 51 to move; the mounting platform 51 has a second reference surface N2 on one side facing the lower device 1. The probe distance sensor device 2 is connected to the lower device 1, and the scanning probe 21 of the probe distance sensor device 2 faces the second reference surface N2, which is used to detect the distance between the first reference surface N1 and the second reference surface N2. The main control module 3 is electrically connected to the upper displacer 52 and the probe distance sensor device 2. The main control module 3 controls the upper displacer 52 to drive the mounting table 51 to move relative to the lower device 1 according to the distance between the first reference plane N1 and the second reference plane N2 measured by the scanning probe 21. Of course, in this structure, an upper displacer 52 electrically connected to the main control module 3 can also be set in the upper device 5, and the first reference plane N1 is driven to move relative to the second reference plane N2 by the upper displacer 52. The structure in the upper device 5 can be the same as the structure of the upper device 5 in the above example, and will not be described in detail here.

[0077] Another embodiment relates to an active vibration reduction system 200, such as Figure 6 The active vibration reduction system 200 includes a lower device 1 and a probe distance sensor device 201. The probe distance sensor device 201 includes: a cantilever 81 connected to the scanning probe 21, a support arm 82 connected to the end of the cantilever 81 away from the scanning probe 21 and the lower device 1, and a counterweight 83 arranged on the cantilever 81. The cantilever 82 is located above the first reference plane N1, and the cantilever 82 is an elastic arm. The cantilever 82 can be operated to vibrate relative to the first reference plane N1 when the base 11 vibrates. Specifically, the cantilever 82 is supported above the lower device 82 by the support arm 82, and the cantilever 82 allows the scanning probe 21 to rotate above the lower device 1. When the lower device 1 is in a stationary state without vibration, the scanning probe is stationary and above the lower device 1, and the distance between the first reference plane N1 of the lower device 1 and the scanning probe 21 remains unchanged; when vibration occurs, the first reference plane N1 of the lower device 1 moves upward. Due to the presence of the counterweight 83, the position of the scanning probe 21 remains unchanged under the action of inertia at the moment when the lower device 1 vibrates. At this time, the distance between the first reference plane N1 and the scanning probe 21 changes, and the main control module controls the lower displacer to drive the base to move relative to the base according to the distance between the first reference plane N1 and the scanning probe 21 measured by the scanning probe 21.

[0078] Preferred embodiments of the present invention have been described above in detail, but it should be understood that aspects of the embodiments can be modified, if necessary, to employ aspects, features and concepts of the various patents, applications and publications to provide further embodiments.

[0079] These and other changes can be made to the embodiments in light of the above detailed description.In general, in the claims, the terms used should not be considered limited to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which these claims are entitled.

[0080] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present invention, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present invention.

Claims

1. An active vibration reduction system, characterized in that: include: A lower device, the lower device comprising: a base, a pedestal located above the base, and a lower displacer driving the pedestal to move relative to the base; the pedestal has a first reference surface on a side facing away from the base; a probe distance sensing device, wherein a scanning probe of the probe distance sensing device is located above the first reference surface and is used to detect the distance between the first reference surface and the scanning probe; A main control module is electrically connected to the lower displacer and the probe distance sensor device, and controls the lower displacer to drive the base to move relative to the base according to the distance between the first reference surface and the scanning probe measured by the scanning probe.

2. The active vibration reduction system according to claim 1, characterized in that: The active vibration reduction system further comprises: The upper device is located above the lower device, and the part of the probe distance sensor device that fixes the probe is connected to the upper device. The upper device has a second reference surface on one side facing the lower device.

3. The active vibration reduction system according to claim 2, characterized in that: The upper device comprises: a mounting platform having the second reference surface, and an upper displacer for driving the mounting platform to move; The main control module is electrically connected to the upper displacer and the probe distance sensor. The main control module controls the upper displacer to drive the mounting platform to move relative to the first reference surface according to the distance between the first reference surface and the second reference surface measured by the scanning probe.

4. The active vibration reduction system according to claim 1, characterized in that: The probe distance sensor device has a plurality of parts, and the lower displacement device has a plurality of parts.

5. The active vibration reduction system according to claim 4, characterized in that: The active vibration reduction system further includes: a sample stage disposed on the base; There are at least four probe distance sensor devices, and the scanning probes of each probe distance sensor device are respectively located at different corner ends of the base; the sample stage is located between the areas surrounded by the scanning probes of each probe distance sensor device.

6. The active vibration reduction system according to claim 2, characterized in that: The upper device is used to connect to a scanning probe microscope system for scanning samples, and the scanning probe microscope system is connected to the upper device.

7. The active vibration reduction system according to claim 1, characterized in that: The probe distance sensing device is a probe atomic force microscope, a probe electrostatic force microscope, a probe tunneling electron microscope or a probe conductive contact mode sensor; The lower displacer includes a piezoelectric drive or an electromagnetic drive motor.

8. The active vibration reduction system according to claim 7, characterized in that: When the probe distance sensing device is a probe conductive contact mode sensor; The probe of the probe conductive contact mode sensor vibrates at a preset frequency, and the probe contacts the first reference surface to form conductivity; the main control module obtains the time required for the probe to contact the first reference surface during vibration based on the conductivity formed by the probe contacting the first reference surface.

9. The active vibration reduction system according to claim 1, characterized in that: The probe distance sensing device includes: a cantilever connected to the scanning probe, a support arm connected to one end of the cantilever facing away from the scanning probe and the lower device, and a counterweight block arranged on the cantilever; the cantilever is located above the first reference plane, and the cantilever is an elastic arm, and the cantilever can be operated to vibrate relative to the first reference plane when the base vibrates.

10. An active vibration reduction system, characterized in that: include: a lower device, wherein a top surface of the lower device has a first reference surface; An upper device, the upper device is located above the lower device, and the upper device comprises: a mounting table, and an upper displacer for driving the mounting table to move; the mounting table has a second reference surface on a side facing the lower device; A probe distance sensing device, the probe distance sensing device is connected to the upper device, and a scanning probe of the probe distance sensing system is located above the first reference surface and is used to detect the distance between the first reference surface and the second reference surface; A main control module is electrically connected to the upper displacer and the probe distance sensor device, and controls the upper displacer to drive the mounting platform to move relative to the lower device according to the distance between the first reference plane and the second reference plane measured by the scanning probe.

11. An active vibration reduction system, characterized in that: include: A lower device, the lower device comprising: a base, a pedestal located above the base, and a lower displacer driving the pedestal to move relative to the base; the pedestal has a first reference surface on a side facing away from the base; An upper device, the upper device is located above the lower device, and a side of the upper device facing the lower device has a second reference surface; A probe distance sensor device, wherein a fixed probe portion of the probe distance sensor device is connected to the lower device, and a scanning probe of the probe distance sensor device faces the second reference surface and is used to detect the distance between the first reference surface and the second reference surface; A main control module is electrically connected to the lower displacer and the probe distance sensor device, and controls the upper displacer to drive the base to move relative to the base according to the distance between the first reference plane and the second reference plane measured by the scanning probe.

12. An active vibration reduction system, characterized in that: include: a lower device, wherein a top surface of the lower device has a first reference surface; An upper device, the upper device is located above the lower device, and the upper device comprises: a mounting table, and an upper displacer for driving the mounting table to move; the mounting table has a second reference surface on a side facing the lower device; A probe distance sensor device, wherein a fixed probe portion of the probe distance sensor device is connected to the lower device, and a scanning probe of the probe distance sensor device faces the second reference surface and is used to detect the distance between the first reference surface and the second reference surface; A main control module is electrically connected to the upper displacer and the probe distance sensor device, and controls the upper displacer to drive the mounting platform to move relative to the lower device according to the distance between the first reference plane and the second reference plane measured by the scanning probe.

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