PCB (Printed Circuit Board) defect detection device and use method thereof

Abstract

The invention relates to the technical field of circuit board detection, and provides a PCB defect detection device and a use method thereof.The device comprises a supporting shell, a detection plate is arranged at the upper end of the supporting shell, a movable plate is slidably connected to the position, corresponding to the upper end of the detection plate, of the surface of the supporting shell, and a detection groove is formed in the outer surface of the detection plate; a heat preservation structure is arranged on the outer surface of the detection plate, a jacking structure is connected between the detection plate and the supporting shell, and the lower end of the movable plate is connected with a positioning structure. The heat preservation structure comprises a partition plate fixedly connected to the outer surface of the movable plate. According to the technical scheme, the problems that when an existing PCB defect detection device and method are used, the circuit board is generally subjected to high-temperature detection after being heated, but the heated circuit board is directly placed on the circuit board defect detection device to be detected, certain heat is dissipated in the middle link, and the detection efficiency is poor are solved. Therefore, part of defective products cannot be detected, and a certain number of defective products are easy to appear.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board detection, and in particular to a PCB circuit board defect detection device and a use method thereof. Background Art

[0002] PCB circuit board defect detection device is an important device to judge whether the PCB circuit board meets the use requirements in the production of PCB circuit board. It is mainly used to detect whether the performance of PCB circuit board meets the requirements, such as the detection of PCB circuit board solder joints and power-on detection, etc. After searching, the authorization announcement number is CN113552468B, which is a method for quality inspection of PCB boards. The method for quality inspection of PCB boards uses a pressing and energizing method to light up the electronic screen for inspection, so that the operator can observe more intuitively and reduce the situation that the operator misses the inspection of the circuit board. The overall device is automatically controlled in real time to achieve semi-automation, thereby improving the accuracy of the entire inspection of the circuit board, and the inspection efficiency of the circuit board can also be greatly improved, reducing the labor intensity of the operator and the inaccurate inspection. However, when the above-mentioned existing PCB circuit board defect detection device and method are used, the circuit board usually has a high-temperature detection, which means that the detection is performed after heating, but the heated circuit board is directly placed on the circuit board defect detection device for detection. This intermediate link will dissipate a certain amount of heat, which will cause some defective products to fail to be detected, and a certain number of defective products are likely to appear. For this reason, we propose a PCB circuit board defect detection device and a method for using the same. Summary of the invention

[0003] The present invention proposes a PCB circuit board defect detection device and a method of using the same, which solves the problem of the existing PCB circuit board defect detection device and method mentioned in the background technology. When in use, the circuit board usually has a high-temperature detection, which means that the detection is performed after heating, but the heated circuit board is directly placed on the circuit board defect detection device for detection. The intermediate link will dissipate a certain amount of heat, which will cause some defective products to fail to be detected, and a certain number of defective products are likely to occur.

[0004] The technical solution of the present invention is as follows: A PCB circuit board defect detection device comprises a supporting shell, a detection plate is arranged at the upper end of the supporting shell, a movable plate is slidably connected to the surface of the supporting shell corresponding to the upper end of the detection plate, a detection groove is opened on the outer surface of the detection plate, a heat preservation structure is arranged on the outer surface of the detection plate, a push-up structure is connected between the detection plate and the supporting shell, and a positioning structure is connected to the lower end of the movable plate; The insulation structure includes a partition fixedly connected to the outer surface of the movable plate, an insulation cavity is opened between the outer side of the partition and the detection plate, ventilation holes are opened at both ends of the partition, fans are fixedly connected at the two ends corresponding to the inside of the insulation cavity of the detection plate, one end of the fan for blowing air is fixedly connected to a heating tube through a bracket, and a closing component is connected to the outer surface of the detection plate, and the closing component is used to maintain the connection inside the insulation cavity when opened, and to keep the two ends of the insulation cavity with the fan partially connected to the ventilation holes and the detection slot area when closed.

[0005] As a further technical solution of the present invention, the closing component includes a movable baffle plate slidably connected to the outside of the partition plate, the two ends of the movable baffle plate are fixedly connected to the baffle plate in the groove, the upper end of the baffle plate in the groove is fixedly connected to the T-shaped plate, a damping part and a buffer spring are respectively connected between the inner side of the upper end of the T-shaped plate and the detection plate, the inner side of the detection plate is fixedly connected to the middle baffle plate, and the outer surface of the detection plate is provided with strip holes.

[0006] As a further technical solution of the present invention, the pushing structure includes an opening opened on the outer surface of the detection plate, and an electric telescopic rod is fixedly connected to the lower end of the opening on the outer surface of the support shell, and the output end of the electric telescopic rod is fixedly connected to the top plate.

[0007] As a further technical solution of the present invention, the positioning structure includes a fixed rod fixedly connected to the bottom of the movable plate, the lower end of the fixed rod is fixedly connected to a protruding plate, the outer surface of the fixed rod is slidably connected to a pressing piece, and a pushing spring is arranged between the cavity formed between the pressing piece and the fixed rod.

[0008] As a further technical solution of the present invention, a telescopic cylinder is fixedly connected to the upper end of the movable plate on the outer surface of the supporting shell, and the output end of the telescopic cylinder is fixedly connected to the movable plate. A guide assembly is arranged between the movable plate and the supporting shell, and the guide assembly is used to maintain the stability of the movable plate driven by the telescopic cylinder to move up and down. A buffer assembly is connected between the detection plate and the supporting shell, and the buffer assembly is used to maintain the stability of the detection plate. A telescopic detection head is fixedly connected to the outer surface of the supporting shell, and the telescopic detection head is used to perform power-on detection on the circuit board. A through hole is provided on the outer surface of the detection plate for the output end of the telescopic detection head to pass through. A detection camera is fixedly connected to the lower end of the movable plate, and the detection camera is used to take high-definition images of the circuit board. A display screen is fixedly connected to the outer surface of the supporting shell, and a signal connection is made between the detection camera and the display screen. The display screen is used to identify and analyze, and display whether the currently detected circuit board is qualified.

[0009] As a further technical solution of the present invention, the number of the ventilation holes is several groups and distributed in an array, the fans are fixed to the detection board by screws, the number of the fans is two groups, and the blowing directions of the two groups of fans are completely opposite, the heating tube is used to emit the detection heat when the circuit board is heated, and the circulation of hot air inside the insulation cavity is realized by the blowing of the two groups of fans.

[0010] As a further technical solution of the present invention, the movable baffle is slidably connected to the partition plate and the detection plate, the lower end of the movable baffle corresponds to the position of the strip hole, the buffer spring is used to push the T-shaped plate upward, the number of the buffer springs and the damping member is equal, and the two correspond one to one, the axes of the corresponding buffer springs and damping members coincide with each other, and the movable baffle is moved downward by pressing the T-shaped plate downward by the movable plate, so that the ventilation hole is connected to the detection groove and the insulation cavity, and the open loops at both ends of the insulation cavity are closed, the baffle in the groove passes through the inside of the insulation cavity to the outside of the detection plate, and the baffle in the groove is slidably connected to the detection plate.

[0011] As a further technical solution of the present invention, the lower end of the electric telescopic rod is fixedly connected to the support shell by screws, the output end of the electric telescopic rod is fixedly connected to the top plate, and the number of the top moving structures is several groups and distributed in a ring array.

[0012] As a further technical solution of the present invention, the fixed rod and the movable plate are fixedly connected by bolts, the pressing piece moves up and down along the fixed rod and the protruding plate, the diameter of the protruding plate matches the diameter of the pressing piece, and the pressing piece is pushed downward by the pushing spring.

[0013] A method for using a PCB circuit board defect detection device, the method comprising the following contents: Step 1: Insert; the user inserts the PCB into the opening of the testing slot corresponding to the circuit board, and keeps the PCB stable; Step 2: Detection: Use the detection camera to take a picture of the surface of the PCB circuit board, transmit the picture to the display screen, and use the display screen to identify and analyze whether the solder joints on the surface of the PCB circuit board are qualified; Qualified: After judging as qualified, the telescopic cylinder is controlled to extend, driving the movable plate to move downward, and the PCB circuit board is kept stable by the extension of the electric telescopic rod and the downward push of the pressing piece. Then, the PCB circuit board is powered on for detection by extending the telescopic detection head. After the detection is qualified, it enters the next process; Unqualified: Unqualified PCB circuit boards will be taken out and returned to the factory for repair or scrapping; Maintenance: After maintenance, go to step 2 again; Scrap: After maintenance failure, it will directly enter the scrapping process.

[0014] The working principle and beneficial effects of the present invention are: In the present invention, the temperature of the heated PCB circuit board can be maintained during the detection process through the effect of the heat preservation structure, so that the circuit board can still maintain its temperature, thereby eliminating the influence of temperature dissipation on the final detection result when the circuit board enters the detection link after being heated, and can make the detection result more accurate, thereby greatly reducing the use of some defective products caused by this, and avoiding potential safety and performance hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0016] Figure 1 It is a schematic diagram of the structure of the device of the present invention; Figure 2 For the present invention Figure 1 A schematic diagram of the structure from another perspective; Figure 3 It is a schematic diagram of a partial structure of the thermal insulation structure of the present invention; Figure 4 For the present invention Figure 3 A partial enlarged view of Figure 5 For the present invention Figure 4 A partial enlarged view of Figure 6 It is a top view of the thermal insulation structure principle of the present invention; Figure 7 It is a schematic diagram of the local structure between the detection board and the supporting shell of the present invention; Figure 8 It is a schematic diagram of the local structure of the detection camera of the present invention; Fig. 9 It is a schematic diagram of the partial structure of the positioning structure of the present invention.

[0017] In the figure: 1. supporting shell; 2. detection plate; 3. movable plate; 4. detection slot; 5. insulation structure; 51. partition; 52. strip hole; 53. insulation cavity; 54. ventilation hole; 55. fan; 56. heating tube; 57. movable baffle; 58. baffle in the slot; 59. T-shaped plate; 510. damping member; 511. buffer spring; 512. middle baffle; 6. pushing structure; 61. opening; 62. electric telescopic rod; 63. top plate; 7. positioning structure; 71. fixing rod; 72. protruding plate; 73. pressing member; 74. pushing spring; 8. telescopic cylinder; 9. display screen; 10. detection camera; 11. buffer assembly; 12. guide assembly; 13. through hole; 14. telescopic detection head. DETAILED DESCRIPTION

[0018] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Example 1 like Figure 1 to Figure 6 and Figure 8 As shown, this embodiment proposes a PCB circuit board defect detection device, including a supporting shell 1, a detection plate 2 is arranged at the upper end of the supporting shell 1, a movable plate 3 is slidably connected to the surface of the supporting shell 1 corresponding to the upper end of the detection plate 2, a detection groove 4 is opened on the outer surface of the detection plate 2, a heat preservation structure 5 is arranged on the outer surface of the detection plate 2, a jacking structure 6 is connected between the detection plate 2 and the supporting shell 1, and a positioning structure 7 is connected to the lower end of the movable plate 3; a telescopic cylinder 8 is fixedly connected to the outer surface of the supporting shell 1 corresponding to the upper end of the movable plate 3, the output end of the telescopic cylinder 8 is fixedly connected to the movable plate 3, a guide component 12 is arranged between the movable plate 3 and the supporting shell 1, and the guide component 12 is used to keep the telescopic cylinder 8 in place. The cylinder 8 drives the movable plate 3 to move up and down to ensure stability. A buffer component 11 is connected between the detection plate 2 and the supporting shell 1. The buffer component 11 is used to maintain the stability of the detection plate 2. A telescopic detection head 14 is fixedly connected to the outer surface of the supporting shell 1. The telescopic detection head 14 is used to perform power-on detection on the circuit board. A through hole 13 is provided on the outer surface of the detection plate 2 for the output end of the telescopic detection head 14 to pass through. A detection camera 10 is fixedly connected to the lower end of the movable plate 3. The detection camera 10 is used to take high-definition images of the circuit board. A display screen 9 is fixedly connected to the outer surface of the supporting shell 1. The detection camera 10 and the display screen 9 are signal connected. The display screen 9 is used for identification and analysis to display whether the current detection circuit board is qualified.

[0020] The insulation structure 5 includes a partition 51 fixedly connected to the outer surface of the movable plate 3, an insulation cavity 53 is opened between the outer side of the partition 51 and the detection plate 2, and ventilation holes 54 are opened at both ends of the partition 51. Fans 55 are fixedly connected at the corresponding two ends of the insulation cavity 53 of the detection plate 2, and one end of the fan 55 for blowing air is fixedly connected to a heating tube 56 through a bracket. A closing component is connected to the outer surface of the detection plate 2. The closing component is used to maintain the connectivity inside the insulation cavity 53 when opened, and to keep the insulation cavity 53 with the two ends of the fan 55 partially connected to the ventilation holes 54 and the detection slot 4 when closed.

[0021] The closing assembly includes a movable baffle 57 slidably connected to the outer side of the partition 51, the two ends of the movable baffle 57 are fixedly connected with the in-groove baffle 58, the upper end of the in-groove baffle 58 is fixedly connected with a T-shaped plate 59, a damping member 510 and a buffer spring 511 are respectively connected between the inner side of the upper end of the T-shaped plate 59 and the detection plate 2, a middle baffle 512 is fixedly connected to the inner side of the detection plate 2, and a strip hole 52 is opened on the outer surface of the detection plate 2.

[0022] The number of ventilation holes 54 is several groups and distributed in an array. The fan 55 is fixed to the detection board 2 by screws. The number of fans 55 is two groups, and the blowing directions of the two groups of fans 55 are completely opposite. The heating tube 56 is used to emit the detection heat when the circuit board is heated. The circulation of hot air inside the insulation cavity 53 is achieved by blowing air from the two groups of fans 55.

[0023] The movable baffle 57 is slidably connected to the partition 51 and the detection plate 2. The lower end of the movable baffle 57 corresponds to the position of the strip hole 52. The buffer spring 511 is used to push the T-shaped plate 59 to move upward. The number of buffer springs 511 and damping members 510 is equal, and the two correspond one to one. The axes of the corresponding buffer springs 511 and damping members 510 coincide with each other. The movable baffle 57 is moved downward by pressing the T-shaped plate 59 downward by the movable plate 3, so that the ventilation hole 54 is connected to the detection groove 4 and the insulation cavity 53, and the open loops at both ends of the insulation cavity 53 are closed. The baffle 58 in the groove passes through the inside of the insulation cavity 53 to the outside of the detection plate 2, and the baffle 58 in the groove is slidably connected to the detection plate 2.

[0024] In this embodiment, the temperature of the heated PCB circuit board can be maintained during the detection process, so that the circuit board still maintains its temperature, thereby eliminating the impact of temperature dissipation when the circuit board enters the detection link after heating on the final detection result, which can make the detection result more accurate, thereby greatly reducing the use of some defective products caused by this and avoiding potential safety and performance risks.

[0025] Example 2 like Figure 7 As shown, on the basis of Example 1, it is further proposed that the jacking structure 6 includes an opening 61 opened on the outer surface of the detection plate 2, and an electric telescopic rod 62 is fixedly connected to the lower end of the opening 61 on the outer surface of the support shell 1, and the output end of the electric telescopic rod 62 is fixedly connected to the top plate 63.

[0026] The lower end of the electric telescopic rod 62 is fixedly connected to the supporting shell 1 by screws, and the output end of the electric telescopic rod 62 is fixedly connected to the top plate 63. The number of the top moving structures 6 is several groups and distributed in a ring array.

[0027] In this embodiment, the circuit board can be lifted up, which makes it convenient for the user to take out and place the circuit board. At the same time, the circuit board can be pushed to the middle position inside the detection slot 4, and the upper and lower surfaces of the circuit board can be heated and insulated more evenly in cooperation with the insulation structure 5, thereby achieving a better insulation effect.

[0028] Example 3 like Fig. 9 As shown, on the basis of Example 2, a positioning structure 7 is further proposed, which includes a fixed rod 71 fixedly connected to the bottom of the movable plate 3, a protruding plate 72 is fixedly connected to the lower end of the fixed rod 71, a pressing piece 73 is slidably connected to the outer surface of the fixed rod 71, and a push spring 74 is arranged between the cavity formed between the pressing piece 73 and the fixed rod 71.

[0029] The fixing rod 71 is fixedly connected to the movable plate 3 by bolts, and the pressing member 73 moves up and down along the fixing rod 71 and the protruding plate 72. The diameter of the protruding plate 72 matches the diameter of the pressing member 73, and the pressing member 73 is pushed downward by the pushing spring 74.

[0030] In this embodiment, the circuit board can be kept stable by cooperating with the pushing structure 6 and pressing by the positioning structure 7, thereby facilitating subsequent power-on detection of the circuit board and reducing the possibility of poor contact.

[0031] A method for using a PCB circuit board defect detection device, the method comprising the following contents: Step 1: Insertion: The user inserts the PCB into the opening of the circuit board corresponding to the detection slot 4, and keeps the PCB circuit board stable; Step 2: Detection: The surface of the PCB circuit board is photographed by the detection camera 10 and transmitted to the display screen 9, and the display screen 9 identifies and analyzes whether the solder joints on the surface of the PCB circuit board are qualified; Qualified: After judging qualified, the telescopic cylinder 8 is controlled to extend, driving the movable plate 3 to move downward, and the PCB circuit board is kept stable by the extension of the electric telescopic rod 62 and the downward push of the pressing member 73. Then, the PCB circuit board is powered on for detection by extending the telescopic detection head 14. After the detection is qualified, it enters the next process; Unqualified: Unqualified PCB circuit boards will be taken out and returned to the factory for repair or scrapping; Maintenance: After maintenance, go to step 2 again; Scrap: After maintenance failure, it will directly enter the scrapping process.

[0032] In summary, the working principle of the present invention is as follows: When in use, the user first places the PCB into the opening of the detection slot 4 corresponding to the circuit board, and keeps the PCB stable; Then, the surface of the PCB circuit board is photographed by the detection camera 10 and transmitted to the display screen 9, and the display screen 9 identifies and analyzes whether the solder joints on the surface of the PCB circuit board are qualified; After judging that it is qualified, the telescopic cylinder 8 is controlled to extend, driving the movable plate 3 to move downward, and the PCB circuit board is kept stable by the extension of the electric telescopic rod 62 and the downward push of the pressing member 73. Then, the PCB circuit board is powered on for detection by extending the telescopic detection head 14. After the detection is qualified, it enters the next process; When the movable plate 3 presses the circuit board downward, the circuit board is first pushed by the pressing member 73, and then the pushing spring 74 will shrink a certain distance, and the circuit board will be supported by the top plate 63. At the same time, the fan 55 and the heating tube 56 are started in advance to blow the heat emitted by the heating tube 56 to circulate in the heat preservation cavity 53. When the movable plate 3 moves downward to position and fix the circuit board by the pressing member 73, the T-shaped plate 59 will be pushed downward by the movable plate 3, and the T-shaped plate 59 will drive the baffle plate 58 in the groove together with the movable baffle 57 to move downward together. Move until the baffle plate 58 in the groove contacts the inner wall of the detection board 2. At this time, the two ends of the baffle plate 58 in the groove are closed near the bending part. At the same time, the downward movement of the movable baffle plate 57 will expose the vent hole 54. The heat of the circulating blowing will be blown out from the vent hole 54 and blown again by another set of fans 55 to form a cycle. The area of ​​the detection groove 4 forms a hot air circulation area, so that the circuit board can be heated and kept at a certain temperature. The influence of heat dissipation on the circuit board detection result can be eliminated, making the final detection result more accurate. The damping member 510 and the buffer spring 511 can effectively maintain the stability of the up and down movement of the T-shaped plate 59, the baffle plate 58 in the groove and the movable baffle plate 57. At the same time, during the upward movement of the movable plate 3, the T-shaped plate 59, the baffle plate 58 in the groove and the movable baffle plate 57 can be moved upward to form a reset effect.

[0033] After the heat preservation of the heat preservation structure 5 and the positioning of the circuit board by the movable plate 3 and the positioning structure 7, the circuit board is then tested for power-on by the telescopic detection head 14.

[0034] By extending and pushing the electric telescopic rod 62, the circuit board can be pushed upward, thereby facilitating the removal of the circuit board.

[0035] It should be noted that the heat preservation structure 5 can also directly act on the circuit board for heating.

[0036] It should be noted that the entire process can be managed and controlled automatically with the help of PLC, robotic arms and other structures, without the need for manual inspection.

[0037] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCB circuit board defect detection device, comprising a supporting housing (1), characterized in that: The upper end of the support shell (1) is provided with a detection plate (2); a movable plate (3) is slidably connected to the surface of the support shell (1) corresponding to the upper end of the detection plate (2); a detection groove (4) is provided on the outer surface of the detection plate (2); a heat insulation structure (5) is provided on the outer surface of the detection plate (2); a push-up structure (6) is connected between the detection plate (2) and the support shell (1); and a positioning structure (7) is connected to the lower end of the movable plate (3); The heat-insulating structure (5) comprises a partition (51) fixedly connected to the outer surface of the movable plate (3); a heat-insulating cavity (53) is provided between the outer side of the partition (51) and the detection plate (2); ventilation holes (54) are provided at both ends of the partition (51); fans (55) are fixedly connected at the corresponding ends of the interior of the heat-insulating cavity (53) of the detection plate (2); one end of the fan (55) for blowing air is fixedly connected to a heating pipe (56) via a bracket; a sealing component is connected to the outer surface of the detection plate (2); the sealing component is used to maintain the communication inside the heat-insulating cavity (53) when it is opened, and to maintain the two ends of the heat-insulating cavity (53) with the fan (55) partially connected to the ventilation holes (54) and the detection slot (4) when it is closed.

2. The PCB circuit board defect detection device according to claim 1, characterized in that: The sealing component comprises a movable baffle (57) slidably connected to the outside of the partition (51), the two ends of the movable baffle (57) are fixedly connected to the inner baffles (58) of the groove, the upper end of the inner baffle (58) is fixedly connected to the T-shaped plate (59), the inner side of the upper end of the T-shaped plate (59) and the detection plate (2) are respectively connected to a damping member (510) and a buffer spring (511), the inner side of the detection plate (2) is fixedly connected to the middle baffle (512), and the outer surface of the detection plate (2) is provided with strip-shaped holes (52).

3. The PCB circuit board defect detection device according to claim 2, characterized in that: The push-up structure (6) comprises an opening (61) formed on the outer surface of the detection plate (2); an electric telescopic rod (62) is fixedly connected to the lower end of the opening (61) on the outer surface of the support shell (1); and an output end of the electric telescopic rod (62) is fixedly connected to a top plate (63).

4. The PCB circuit board defect detection device according to claim 2, characterized in that: The positioning structure (7) comprises a fixing rod (71) fixedly connected to the bottom of the movable plate (3); a protruding plate (72) is fixedly connected to the lower end of the fixing rod (71); a pressing piece (73) is slidably connected to the outer surface of the fixing rod (71); and a pushing spring (74) is provided between the cavity formed between the pressing piece (73) and the fixing rod (71).

5. The PCB circuit board defect detection device according to claim 1, characterized in that: A telescopic cylinder (8) is fixedly connected to the outer surface of the support shell (1) at a position corresponding to the upper end of the movable plate (3); an output end of the telescopic cylinder (8) is fixedly connected to the movable plate (3); a guide component (12) is provided between the movable plate (3) and the support shell (1); the guide component (12) is used to maintain the stability of the movable plate (3) driven by the telescopic cylinder (8) to move up and down; a buffer component (11) is connected between the detection plate (2) and the support shell (1); the buffer component (11) is used to maintain the stability of the detection plate (2); and the outer surface of the support shell (1) is fixedly connected to the outer surface of the support shell (1). A telescopic detection head (14) is provided, the telescopic detection head (14) is used to perform power-on detection on the circuit board, the outer surface of the detection plate (2) is provided with a through hole (13) through which the output end of the telescopic detection head (14) can pass, the lower end of the movable plate (3) is fixedly connected to a detection camera (10), the detection camera (10) is used to take a high-definition image of the circuit board, the outer surface of the support shell (1) is fixedly connected to a display screen (9), the detection camera (10) and the display screen (9) are connected by signals, and the display screen (9) is used to identify and analyze, and display whether the currently detected circuit board is qualified.

6. The PCB circuit board defect detection device according to claim 1, characterized in that: The ventilation holes (54) are provided in a plurality of groups and are arranged in an array. The fans (55) are fixed to the detection board (2) by screws. The fans (55) are provided in two groups, and the blowing directions of the two groups of fans (55) are completely opposite. The heating tube (56) is used to emit detection heat when the circuit board is heated. The two groups of fans (55) blow air to achieve the circulation of hot air inside the heat preservation cavity (53).

7. The PCB circuit board defect detection device according to claim 2, characterized in that: The movable baffle (57) is slidably connected to the partition (51) and the detection plate (2). The lower end of the movable baffle (57) corresponds to the position of the strip hole (52). The buffer spring (511) is used to push the T-shaped plate (59) upward. The number of the buffer springs (511) and the damping member (510) is equal and the two correspond to each other. The axes of the corresponding buffer springs (511) and the damping member (510) coincide with each other. The movable baffle (57) is moved downward by pressing the T-shaped plate (59) downward by the movable plate (3), so that the ventilation hole (54) is connected to the detection groove (4) and the heat preservation cavity (53), and the open circuit at both ends of the heat preservation cavity (53) is closed. The inner groove baffle (58) passes through from the inside of the heat preservation cavity (53) to the outside of the detection plate (2). The inner groove baffle (58) and the detection plate (2) are slidably connected.

8. The PCB circuit board defect detection device according to claim 3, characterized in that: The lower end of the electric telescopic rod (62) is fixedly connected to the support shell (1) via a screw, the output end of the electric telescopic rod (62) is fixedly connected to a top plate (63), and the top moving structures (6) are provided in a plurality of groups and are distributed in a ring array.

9. The PCB circuit board defect detection device according to claim 4, characterized in that: The fixing rod (71) is fixedly connected to the movable plate (3) by bolts, and the pressing piece (73) moves up and down along the fixing rod (71) and the protruding plate (72). The diameter of the protruding plate (72) matches the diameter of the pressing piece (73), and the pressing piece (73) is pushed downward by the pushing spring (74).

10. A method for using the PCB circuit board defect detection device according to any one of claims 1 to 9, characterized in that: The usage includes the following: Step 1: Insertion: The user inserts the PCB into the opening of the detection slot (4) corresponding to the circuit board, and keeps the PCB stable; Step 2: Detection: photographing the surface of the PCB circuit board through the detection camera (10), transmitting the photograph to the display screen (9), and identifying and analyzing whether the solder joints on the surface of the PCB circuit board are qualified through the display screen (9); Pass: After judging that the circuit is qualified, the telescopic cylinder (8) is controlled to extend, driving the movable plate (3) to move downward, and the PCB circuit board is kept stable by the extension of the electric telescopic rod (62) and the downward push of the pressing member (73). Then, the PCB circuit board is powered on by the extension of the telescopic detection head (14) for detection. After the detection is qualified, the next process is entered; Unqualified: Unqualified PCB circuit boards will be taken out and returned to the factory for repair or scrapping; Maintenance: After maintenance, go to step 2 again; Scrap: After maintenance failure, it will directly enter the scrapping process.

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