Electron beam image angle correction method, device, electronic equipment and storage medium

Abstract

The present disclosure provides a method, device, electronic device and storage medium for electron beam image angle correction, wherein the method includes: placing a sample to be tested on a moving platform; obtaining a first electron beam image of the sample to be tested at a current position; determining a motion coordinate system, wherein the X-axis and Y-axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image; moving the sample to be tested a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested; performing Fourier transform on the first electron beam image and the second electron beam image to determine the offset between the first electron beam image and the second electron beam image; determining the angular deviation value between the first electron beam image and the second electron beam image according to the offset; and performing angle correction on the electron beam image according to the angular deviation value.

Description

Technical Field

[0001] The present disclosure relates to the technical field of scanning electron microscopes, and in particular to a method, device, electronic device, and storage medium for electron beam image angle correction. Background Art

[0002] Microscopes are the eyes that humans use to study the objective world. Among them, scanning transmission electron microscopy (STEM) is a widely used microscope with nanoscale characterization capabilities, and is often used in the fields of biology, semiconductors, and materials science. However, when observing images generated by electron beam scanning, the inherent angular deviation between the electron beam detector and the motion platform causes inconsistencies between the observation coordinate system and the actual motion coordinate system, which directly causes the observed image motion trajectory to deviate from the preset motion direction. Although this problem can be improved to a certain extent by manually adjusting the deflector angle, this process is not only cumbersome to operate, but also inefficient, and it is difficult to meet the needs of efficient and accurate image analysis. Summary of the Invention

[0003] The present disclosure provides a method, device, electronic device and storage medium for correcting the angle of an electron beam image, so as to at least solve the above technical problems existing in the prior art.

[0004] According to a first aspect of the present disclosure, a method for correcting an electron beam image angle is provided, wherein the method comprises:

[0005] Place the sample to be tested on the motion platform;

[0006] Acquire a first electron beam image of the sample to be tested at a current position;

[0007] Determine a motion coordinate system, wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image;

[0008] Moving the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested;

[0009] performing Fourier transformation on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image;

[0010] determining an angular deviation value between the first electron beam image and the second electron beam image according to the offset;

[0011] Angle correction is performed on the electron beam image according to the angle deviation value.

[0012] In one embodiment, performing Fourier transform on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image includes:

[0013] The first electron beam image and the second electron beam image are subjected to Fourier transformation using the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image.

[0014]

[0015] Wherein, F1(u,v) represents the frequency domain graph of the first electron beam image, F2(u,v) represents the frequency domain graph of the second electron beam image, u and v are variables in the frequency domain graph, and (x0,y0) represents the offset between the first electron beam image and the second electron beam image;

[0016] According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2):

[0017]

[0018] Where H(u,v) represents the cross power spectrum, A1 and A2 represent the amplitudes of F1 and F2 respectively, and δ(x0,y0) represents the impulse function. a pulse function representing the offset;

[0019] The offset is determined when the value of the impulse function is maximum.

[0020] In one embodiment, determining an angular deviation value between the first electron beam image and the second electron beam image according to the offset includes:

[0021] The offset is converted into the angular deviation value by an inverse tangent function, wherein the inverse tangent function is shown in the following formula (3):

[0022] θ=arctan (y 0 / x0) (3)

[0023] Where θ is the angle deviation value.

[0024] In one embodiment, performing angle correction on the electron beam image according to the angle deviation value includes:

[0025] The angle deviation value is input into a deflector to perform angle correction on the electron beam image.

[0026] According to a second aspect of the present disclosure, there is provided an electron beam image angle correction device, wherein the device comprises:

[0027] A clamping unit, used to place the sample to be tested on the motion platform;

[0028] A first acquisition unit is used to acquire a first electron beam image of the sample to be tested at a current position;

[0029] a first determining unit, configured to determine a motion coordinate system, wherein an X axis and a Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and an origin coincides with a center of the electron beam image;

[0030] a second acquisition unit, configured to move the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested;

[0031] a second determining unit, configured to perform Fourier transform on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image;

[0032] a third determining unit, configured to determine an angular deviation value between the first electron beam image and the second electron beam image according to the offset;

[0033] A correction unit is used to perform angle correction on the electron beam image according to the angle deviation value.

[0034] In one embodiment, the second determining unit is specifically configured to: perform Fourier transform on the first electron beam image and the second electron beam image using the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image.

[0035]

[0036] Wherein, F1(u,v) represents the frequency domain graph of the first electron beam image, F2(u,v) represents the frequency domain graph of the second electron beam image, u and v are variables in the frequency domain graph, and (x0,y0) represents the offset between the first electron beam image and the second electron beam image;

[0037] According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2):

[0038]

[0039] Where H(u,v) represents the cross power spectrum, A1 and A2 represent the amplitudes of F1 and F2 respectively, and δ(x0,y0) represents the impulse function. a pulse function representing the offset;

[0040] The offset is determined when the value of the impulse function is maximum.

[0041] In one embodiment, the third determining unit is specifically configured to convert the offset into the angular deviation value by using an inverse tangent function, wherein the inverse tangent function is as shown in the following formula (3):

[0042] θ=arctan (y 0 / x0) (3)

[0043] Where θ is the angle deviation value.

[0044] In one possible implementation manner, the correction unit is specifically configured to input the angle deviation value into a deflector to perform angle correction on the electron beam image.

[0045] According to a third aspect of the present disclosure, there is provided an electronic device, including:

[0046] at least one processor; and

[0047] a memory communicatively connected to the at least one processor; wherein,

[0048] The memory stores instructions that can be executed by the at least one processor. The instructions are executed by the at least one processor to enable the at least one processor to perform the method described in the present disclosure.

[0049] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause the computer to execute the method described in the present disclosure.

[0050] The electron beam image angle correction method, device, electronic device and storage medium disclosed in the present invention first obtain a first electron beam image of the sample to be tested at the current position and a second electron beam image after moving a preset distance along the X-axis direction of the motion coordinate system, and then perform Fourier transformation on the first electron beam image and the second electron beam image to obtain the offset between the two images, and then obtain the angle deviation value, thereby performing angle correction on the electron beam image. The present invention follows the principle of high efficiency, and the overall process is simple and does not require a large amount of computing resources, ensuring that efficient data processing is achieved without affecting the smoothness of the overall operation process of the system; the present invention abandons the traditional manual adjustment method, which not only greatly simplifies the operation steps and reduces the complexity of the operation, but also ensures that the observation results of the electron beam image directly reflect the observer's expectations by accurately calculating and automatically adjusting the relevant parameters, thereby improving the accuracy of the correction, thereby bringing higher observation accuracy and reliability to the overall observation system, making the observation experience more in line with the observer's intuitive feelings.

[0051] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings, in which several embodiments of the present disclosure are shown by way of example and not limitation, wherein:

[0053] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0054] Figure 1 A flowchart of a method for correcting an electron beam image angle provided by an embodiment of the present disclosure;

[0055] Figure 2 Schematic diagram of the electron beam image of the sample to be tested;

[0056] Figure 3 Schematic diagram of the relative position of the sample to be tested before and after movement;

[0057] Figure 4 A schematic structural diagram of an electron beam image angle correction device provided in an embodiment of the present disclosure;

[0058] Figure 5 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0059] To make the purposes, features, and advantages of the present disclosure more apparent and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative work shall fall within the scope of protection of the present disclosure.

[0060] The present disclosure provides a method for correcting the angle of an electron beam image. Figure 1 The flowchart of the electron beam image angle correction method provided by the embodiment of the present disclosure is as follows: Figure 1 As shown, the method includes:

[0061] Step 101: Place the sample to be tested on a motion platform.

[0062] Figure 2 is a schematic diagram of the electron beam image of the sample to be tested. Figure 2 As shown in the figure, the XY coordinate system is the motion coordinate system of the motion platform. The X-axis and Y-axis of the motion coordinate system are parallel to the two adjacent rectangular sides of the electron beam image, respectively, and the origin coincides with the center of the electron beam image. The X'Y' coordinate system is the user coordinate system. The sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction. The first direction is perpendicular to the second direction. The X-axis of the user coordinate system is parallel to the first direction, the Y-axis is parallel to the second direction, and the origin coincides with the center of the sample to be tested. The user coordinate system is also the coordinate system that is ultimately desired to be transformed. It can be seen from observation that there is an angular deviation between the motion coordinate system and the user coordinate system, which needs to be corrected.

[0063] Step 102: Acquire a first electron beam image of the sample to be tested at the current position.

[0064] Figure 3 It is a schematic diagram of the relative position of the sample before and after it is moved. It should be explained that for the convenience of understanding, Figure 3 The position of the sample to be measured in the electron beam image before and after the movement is integrated into a schematic diagram.

[0065] like Figure 3 As shown, before the sample 10 to be tested moves (ie, the current position), the center point is located at O1.

[0066] Step 103 : determining a motion coordinate system, wherein the X axis and the Y axis of the motion coordinate system are parallel to two adjacent rectangular sides of the electron beam image, respectively, and the origin coincides with the center of the electron beam image.

[0067] like Figure 3 As shown, the XY coordinate system in the figure is the motion coordinate system.

[0068] Step 104 : Move the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested.

[0069] Specifically, for example, the software sends instructions to control the motion platform to move in the negative direction of the X-axis of the motion coordinate system, driving the sample to be tested to move in the negative direction of the X-axis, so that the electron beam image moves in the positive direction of the X-axis, and captures the electron beam image after the movement is completed.

[0070] In another embodiment, the motion platform may be controlled to move toward the positive direction of the X-axis, so that the electron beam image moves toward the negative direction of the X-axis.

[0071] In the embodiment of the present disclosure, the example of moving the sample to be tested in the negative direction of the X axis is used for explanation. Figure 3 As shown, the center point of the sample 10 to be tested is located at O2 after the movement.

[0072] Step 105 : Perform Fourier transform on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image.

[0073] In one embodiment, performing Fourier transform on the first electron beam image and the second electron beam image to determine the offset between the first electron beam image and the second electron beam image includes:

[0074] The first electron beam image and the second electron beam image are Fourier transformed using the following formula (1) to obtain the frequency domain images of the first electron beam image and the second electron beam image:

[0075]

[0076] Wherein, F1(u,v) represents the frequency domain graph of the first electron beam image, F2(u,v) represents the frequency domain graph of the second electron beam image, u and v are variables in the frequency domain graph, and (x0,y0) represents the offset between the first electron beam image and the second electron beam image;

[0077] According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2):

[0078]

[0079] Where H(u,v) represents the cross power spectrum, A1 and A2 represent the amplitudes of F1 and F2 respectively, and δ(x0,y0) represents the impulse function. a pulse function representing the offset;

[0080] When the value of the impulse function is maximum, the offset is determined.

[0081] Specifically, let f1(x, y) and f2(x, y) be the two electron beam images taken before and after the sample is moved, namely the first electron beam image and the second electron beam image. x and y represent the pixel coordinate values ​​in the X-axis and Y-axis directions, respectively, which can be any pixel coordinate values ​​within the image range. The translation relationship satisfies formula (4). The offset is set to (x0, y0), as follows: Figure 3 As shown, x0 is the offset along the X-axis direction of the user coordinate system, and y0 is the offset along the Y-axis direction of the user coordinate system. It needs to be explained that Figure 3 The user coordinate system is not shown in the Figure 2 , you can set the horizontal direction to the X-axis direction of the user coordinate system, and the vertical direction to the Y-axis direction of the user coordinate system.

[0082] f2(x,y)=f1(x+x0,y+y0) (4)

[0083] Next, the first electron beam image and the second electron beam image are Fourier transformed and converted into the frequency domain to obtain the above formula (1):

[0084]

[0085] Dividing both sides of formula (1) by F1(u,v) yields the cross-power spectrum, as shown in formula (2):

[0086]

[0087] in, That is the pulse function of the offset (x0, y0).

[0088] According to the properties of the impulse function: δ(x0,y0) is the largest at x0 and y0. By traversing all the coordinate points in the image, we can determine the x0 and y0 where the impulse function has the largest value, and thus determine the offset.

[0089] Step 106 : determining an angular deviation value between the first electron beam image and the second electron beam image according to the offset.

[0090] In one embodiment, determining the angular deviation between the first electron beam image and the second electron beam image according to the offset includes:

[0091] The offset is converted into an angular deviation value by the inverse tangent function, where the inverse tangent function is shown in the following formula (3):

[0092] θ=arctan (y 0 / x0) (3)

[0093] Where θ is the angle deviation value.

[0094] like Figure 3 As shown in the figure, the angle deviation value θ is the angle between the moving direction of the sample 10 to be tested and the X-axis of the user coordinate system.

[0095] Step 107: performing angle correction on the electron beam image according to the angle deviation value.

[0096] In one embodiment, performing angle correction on the electron beam image according to the angle deviation value includes:

[0097] The angle deviation value is input into the deflector to perform angle correction on the electron beam image.

[0098] It should be explained that the deflector hardware is generally set to an angle of 0-90 degrees to achieve the rotation of the electron beam image between 0 and 90 degrees. If the angle deviation value exceeds 90 degrees, the part exceeding 90 degrees can be achieved through image software post-processing. For example, for a deflection angle of 100 degrees, the deflector is set to a parameter of 10 degrees, and the obtained image is rotated another 90 degrees to finally achieve image rotation.

[0099] In the embodiment of the present disclosure, by first obtaining a first electron beam image of the sample to be tested at the current position and a second electron beam image after moving a preset distance along the X-axis direction of the motion coordinate system, and then performing Fourier transform on the first electron beam image and the second electron beam image, the offset between the two images is obtained, and then the angle deviation value is obtained, so as to perform angle correction on the electron beam image. The present disclosure follows the principle of high efficiency, and the overall process is simple and does not require a large amount of computing resources, ensuring that efficient data processing is achieved without affecting the smoothness of the overall operation process of the system; the present disclosure abandons the traditional manual adjustment method, which not only greatly simplifies the operation steps and reduces the complexity of the operation, but also ensures that the observation results of the electron beam image directly reflect the observer's expectations by accurately calculating and automatically adjusting the relevant parameters, thereby improving the accuracy of the correction, thereby bringing higher observation accuracy and reliability to the overall observation system, making the observation experience more in line with the observer's intuitive feelings.

[0100] The embodiment of the present disclosure also provides an electron beam image angle correction device, Figure 4 This is a schematic diagram of the structure of the electron beam image angle correction device provided by the embodiment of the present disclosure, as shown in FIG. Figure 4 As shown, the device includes:

[0101] The clamping unit 401 is used to place the sample to be tested on the motion platform;

[0102] A first acquisition unit 402 is used to acquire a first electron beam image of the sample to be tested at a current position;

[0103] A first determining unit 403 is used to determine a motion coordinate system, wherein the X axis and the Y axis of the motion coordinate system are parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image;

[0104] A second acquisition unit 404 is configured to move the sample to be measured by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be measured;

[0105] A second determining unit 405 is configured to perform Fourier transform on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image;

[0106] A third determining unit 406 is configured to determine an angular deviation value between the first electron beam image and the second electron beam image according to the offset;

[0107] The correction unit 407 is configured to perform angle correction on the electron beam image according to the angle deviation value.

[0108] In one embodiment, the second determining unit 405 is specifically configured to: perform Fourier transform on the first electron beam image and the second electron beam image according to the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image,

[0109]

[0110] Wherein, F1(u,v) represents the frequency domain graph of the first electron beam image, F2(u,v) represents the frequency domain graph of the second electron beam image, u and v are variables in the frequency domain graph, and (x0,y0) represents the offset between the first electron beam image and the second electron beam image;

[0111] According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2):

[0112]

[0113] Where H(u,v) represents the cross power spectrum, A1 and A2 represent the amplitudes of F1 and F2 respectively, and δ(x0,y0) represents the impulse function. a pulse function representing the offset;

[0114] When the value of the impulse function is maximum, the offset is determined.

[0115] In one embodiment, the third determining unit 406 is specifically configured to convert the offset into an angle deviation value by using an inverse tangent function, wherein the inverse tangent function is shown in the following formula (3):

[0116] θ=arctan (y 0 / x0) (3)

[0117] Where θ is the angle deviation value.

[0118] In one embodiment, the correction unit 407 is specifically configured to input the angle deviation value into the deflector to perform angle correction on the electron beam image.

[0119] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.

[0120] Figure 5 A schematic block diagram of an example electronic device 500 that can be used to implement embodiments of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are provided as examples only and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0121] like Figure 5 As shown, the device 500 includes a computing unit 501, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 502 or a computer program loaded from a storage unit 508 into a random access memory (RAM) 503. Various programs and data required for the operation of the device 500 can also be stored in the RAM 503. The computing unit 501, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0122] Various components in device 500 are connected to I / O interface 505, including: an input unit 506, such as a keyboard, mouse, etc.; an output unit 507, such as various types of displays, speakers, etc.; a storage unit 508, such as a magnetic disk, optical disk, etc.; and a communication unit 509, such as a network card, modem, wireless communication transceiver, etc. The communication unit 509 allows device 500 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0123] The computing unit 501 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 501 performs the various methods and processes described above, such as the electron beam image angle correction method. For example, in some embodiments, the electron beam image angle correction method can be implemented as a computer software program tangibly embodied in a machine-readable medium, such as the storage unit 508. In some embodiments, part or all of the computer program can be loaded and / or installed onto the device 500 via the ROM 502 and / or the communication unit 509. When the computer program is loaded into the RAM 503 and executed by the computing unit 501, one or more steps of the electron beam image angle correction method described above can be performed. Alternatively, in other embodiments, the computing unit 501 can be configured to perform the electron beam image angle correction method by any other suitable means (e.g., via firmware).

[0124] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on a chip (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0125] The program code for implementing the method of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device so that when the program code is executed by the processor or controller, the functions / operations specified in the flow chart and / or block diagram are implemented. The program code can be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0126] In the context of the present disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in conjunction with an instruction execution system, device or equipment. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium can include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0127] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0128] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.

[0129] A computer system may include a client and a server. The client and server are generally remote from each other and typically interact through a communication network. The client-server relationship arises through computer programs running on the respective computers and having a client-server relationship with each other. The server may be a cloud server, a server in a distributed system, or a server integrated with a blockchain.

[0130] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved. This is not a limitation herein.

[0131] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0132] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A method for correcting the angle of an electron beam image, characterized in that: The method comprises: Place the sample to be tested on the motion platform; Acquire a first electron beam image of the sample to be tested at a current position; Determine a motion coordinate system, wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image; Moving the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested; performing Fourier transformation on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image; determining an angular deviation value between the first electron beam image and the second electron beam image according to the offset; performing angle correction on the electron beam image according to the angle deviation value; The performing Fourier transform on the first electron beam image and the second electron beam image to determine the offset between the first electron beam image and the second electron beam image includes: The first electron beam image and the second electron beam image are subjected to Fourier transformation using the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image. （1） in, represents the frequency domain image of the first electron beam, Frequency domain diagram representing the second electron beam image, and is the variable in the frequency domain diagram, represents the offset between the first electron beam image and the second electron beam image; According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2): （2） in, represents the cross power spectrum, A1 and A2 represent the amplitudes of F1 and F2 respectively, represents the impulse function, a pulse function representing the offset; When the value of the pulse function is maximum, determining the offset; Determining an angular deviation value between the first electron beam image and the second electron beam image according to the offset includes: The offset is converted into the angular deviation value by an inverse tangent function, wherein the inverse tangent function is shown in the following formula (3): （3） in, is the angle deviation value.

2. The method according to claim 1, characterized in that The step of performing angle correction on the electron beam image according to the angle deviation value includes: The angle deviation value is input into a deflector to perform angle correction on the electron beam image.

3. An electron beam image angle correction device, characterized in that: The device comprises: A clamping unit, used to place the sample to be tested on the motion platform; A first acquisition unit is used to acquire a first electron beam image of the sample to be tested at a current position; a first determining unit, configured to determine a motion coordinate system, wherein an X axis and a Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and an origin coincides with a center of the electron beam image; a second acquisition unit, configured to move the sample to be tested by a preset distance along the X-axis direction of the motion coordinate system to obtain a second electron beam image of the sample to be tested; a second determining unit, configured to perform Fourier transform on the first electron beam image and the second electron beam image to determine an offset between the first electron beam image and the second electron beam image; a third determining unit, configured to determine an angular deviation value between the first electron beam image and the second electron beam image according to the offset; a correction unit, configured to perform angle correction on the electron beam image according to the angle deviation value; The second determining unit is specifically configured to: perform Fourier transform on the first electron beam image and the second electron beam image using the following formula (1) to obtain frequency domain images of the first electron beam image and the second electron beam image. （1） in, represents the frequency domain image of the first electron beam, Frequency domain diagram representing the second electron beam image, and is the variable in the frequency domain diagram, represents the offset between the first electron beam image and the second electron beam image; According to the frequency domain images of the first electron beam image and the second electron beam image, the pulse function of the offset is obtained by the following formula (2): （2） in, represents the cross power spectrum, A1 and A2 represent the amplitudes of F1 and F2 respectively, represents the impulse function, a pulse function representing the offset; When the value of the pulse function is maximum, determining the offset; The third determining unit is specifically configured to convert the offset into the angular deviation value by using an inverse tangent function, wherein the inverse tangent function is as shown in the following formula (3): （3） in, is the angle deviation value.

4. The device according to claim 3, characterized in that The correction unit is specifically configured to input the angle deviation value into a deflector to perform angle correction on the electron beam image.

5. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 2.

6. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to enable a computer to execute the method according to any one of claims 1-2.

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