High-temperature test platform for semiconductor chip

Abstract

The invention discloses a high-temperature test platform of a semiconductor chip, which comprises a test fixture, an accommodating cavity used for placing a chip is formed in the test fixture, a cover plate is rotatably mounted at a position, corresponding to the accommodating cavity, of the top of the test fixture, and two electric ceramic plates with the same specification are distributed at a position, corresponding to the accommodating cavity, of the bottom of the test fixture; the two electric ceramic plates synchronously move in opposite directions to close the accommodating cavity and heat the chip; the bottom of the containing cavity is communicated with a blanking channel, the bottom of the blanking channel is communicated with the interior of a cooling box arranged below the testing jig, and a transfer plate capable of moving in the vertical direction is further arranged in the blanking channel. Through forward and reverse rotation of the cover plate, the chip can be quickly transferred from the test fixture to the cooling equipment, a new to-be-tested chip can be filled and fixed, and the whole taking and placing efficiency of the chip is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a high-temperature testing platform for semiconductor chips. Background Art

[0002] After the chip is manufactured, it needs to undergo corresponding functional tests, and most of the defects of the chip can only be manifested at high temperatures, so the chip needs to be placed at high temperatures for testing. After the high-temperature test, it is difficult to remove the chip from the test fixture or put a new fixture to be tested, because the temperature of the chip that has just completed the test and the test fixture are high, and it is easy for personnel to get burned when manually taking and placing them. In addition, the chip that has completed the test needs to be quickly cooled down to facilitate the subsequent process. After the chip is taken out of the test fixture, it is transferred to a dedicated cooling device for cooling treatment. If it is simply operated manually, it cannot be completed at all. Using a manipulator to replace manual labor can certainly improve work efficiency, but there are certain requirements for the movement accuracy of the manipulator, and the cost of the manipulator itself and the subsequent maintenance cost are not very friendly to the enterprise. In view of this, the present invention is proposed. Summary of the invention

[0003] In order to solve the technical problems existing in the above-mentioned prior art, the present invention provides a high-temperature testing platform for semiconductor chips.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-temperature test platform for semiconductor chips, comprising a test fixture, wherein a receiving cavity for placing a chip is formed inside the test fixture, a cover plate is rotatably installed at a position corresponding to the receiving cavity on the top of the test fixture, and two electric ceramic plates of the same specifications are distributed at a position corresponding to the receiving cavity on the bottom, and the two electric ceramic plates synchronously move toward each other to complete the closing of the receiving cavity and heat the chip; A blanking channel is provided at the bottom of the accommodating cavity. The bottom of the blanking channel is connected to the interior of a cooling box arranged under the test fixture. A transfer plate that can move in a vertical direction is also arranged inside the blanking channel. When the cover plate rotates to open the top of the accommodating cavity, the two electric ceramic plates move synchronously in opposite directions to open the bottom of the accommodating cavity. The chip inside the accommodating cavity falls onto the transfer plate, and the chip is transferred to the interior of the cooling box by the transfer plate moving downward in the vertical direction.

[0005] Preferably, a slide rail is formed at the bottom of the test fixture corresponding to the sliding tracks of the two electric ceramic plates, the two electric ceramic plates are embedded in the slide rail and slidably connected thereto, the ends of the two electric ceramic plates facing away from each other are integrally formed with a connecting strip, one end of the connecting strip extends to the outside of the slide rail and is fixedly connected to a rack, the two racks are respectively distributed on both sides of the slide rail, and a second linear gear and a third linear gear are rotatably installed at the positions of the two racks at the bottom of the test fixture, the bottoms of the second linear gear and the third linear gear are fixedly connected to a first pulley, a second belt is sleeved between the two first pulleys, the second belts are distributed in right-angle corners, and a guide wheel is rotatably installed on the inner side of the corner to guide the second belt.

[0006] Preferably, the rotating shaft of the cover plate passes downward through the test fixture and is fixedly sleeved with a second pulley, and the central axis of the second pulley and the second linear gear is sleeved with a first belt. The maximum rotation angle of the cover plate is 90°, and when the cover plate rotates 90°, the two electric ceramic plates move in opposite directions to make the bottom of the accommodating cavity completely open.

[0007] Preferably, four sets of rotating plates are rotatably installed on the sliding tracks of the two electric ceramic plates corresponding to the bottom of the test fixture, and a slot body is formed inside the test fixture at the position corresponding to each rotating plate, and a sliding rod is arranged inside each slot body, and the sliding rod extends toward the accommodating cavity and is integrally connected with a card column, and the card column can penetrate the test fixture and slide into the accommodating cavity, and the sliding rod is connected to the bottom end of the rotating plate by a hinge rod, and a slide groove is formed inside the hinge rod along its length direction, and a limiting column is fixedly connected to the inner wall of the slot body, and the limiting column penetrates the slide groove on the hinge rod; A spring is sleeved on the outside of the sliding rod, one end of the spring is connected to one end of the sliding rod located in the slot body, and the other end is connected to the inner wall of the slot body, and the spring is in a compressed state in the initial state.

[0008] Preferably, both ends of the slide rail are closed and slidably connected with sliders, and the slider and the corresponding electric ceramic plate are both provided with magnetic attraction on the side facing each other, and the bottom of the slider is fixedly connected with a force bar along its length direction, and a stop block is installed on the sliding track of the corresponding force bar on the slide rail, and the stop block is used to separate the slider and the electric ceramic plate when they both move synchronously toward the accommodating cavity, and to keep the rotating plate in a horizontal state under the squeezing of the slider.

[0009] Preferably, one end of each rack close to the accommodating cavity is fixedly connected with a push rod, and the push rod is used to push the corresponding slider to reset when the two electric ceramic plates move towards each other to close the bottom of the accommodating cavity.

[0010] Preferably, the bottom of the transfer plate is fixedly connected to a limit plate, the limit plate is connected to the movable end of an electric telescopic rod fixed at the center of the interior of the cooling box, the external sliding sleeve of the connecting rod is provided with a blocking plate, and the cross-section of the blocking plate is larger than the blanking channel, a blanking platform is installed inside the cooling box on the moving path of the blocking plate, and a clip strip is formed at the edge of the blanking platform for limiting the downward movement of the blocking plate.

[0011] Preferably, the interior of the cooling box is symmetrically fixed with second shaft rods on both sides of the electric telescopic rod, and the top ends of the two second shaft rods are fixedly sleeved with toggle plates. The two toggle plates rotate synchronously toward the blanking table with the second shaft rod as the center, so that the chips on the transfer plate are pushed onto the blanking table.

[0012] Preferably, the top end of the second shaft rod near the front side of the cooling box passes through the toggle plate and then extends upward to the outside of the cooling box and then is fixedly sleeved with an external gear, the rotating shaft of the cover plate extends downward to the top of the cooling box and then is fixedly connected with an internal gear, the external gear and the internal gear are internally meshed, and the speed ratio of the external gear to the internal gear is 2:1; The bottom of the cooling box is fixedly connected to a transmission box, and four first linear gears of the same specifications are distributed in sequence inside the transmission box, and the four first linear gears are meshed externally in sequence. The bottom ends of the two second shafts penetrate the transmission box downward and are fixedly connected to the centers of the two outermost first linear gears respectively.

[0013] Compared with the prior art, the present invention provides a high temperature test platform for semiconductor chips, which has the following beneficial effects: (1) The present invention installs a cover plate on the top of the accommodating chamber of the test fixture in a horizontally rotatable manner, and installs two electric ceramic plates symmetrically in the horizontal direction on the bottom of the accommodating chamber. During the rotation and opening of the cover plate, the two electric ceramic plates move synchronously in opposite directions, so that the bottom of the accommodating chamber opens, and the tested chip falls onto the transfer plate. Then the electric telescopic rod drives the transfer plate to move downward until the transfer plate moves to the upper end of the blocking plate. At this time, when the cover plate rotates in the opposite direction to reset, the two toggle plates inside the cooling box can push the chip on the transfer plate to the drop table. The transfer of the chip from the test fixture to the cooling device in the present invention can be realized by mechanical automation operation, which is fast and convenient, and can avoid excessive investment costs due to the use of a manipulator. The transfer of the chip can be completed by rotating the cover plate in the forward and reverse directions, and the new chip to be tested can also be loaded and fixed, and the overall chip placement efficiency is greatly improved.

[0014] (2) The sealing plate and the limiting plate in the present invention can close the connection between the blanking channel and the cooling box, so that a closed space is formed inside the cooling box, preventing the cold source from flowing upward into the blanking channel. When the chip needs to be transferred to the blanking table inside the cooling box, the electric telescopic rod drives the transfer plate to move downward. At this time, the sealing plate moves downward synchronously with the transfer plate under the action of gravity until the sealing plate contacts the card strip at the edge of the blanking table. The transfer plate continues to move downward and finally stops on the sealing plate. When the transfer plate is reset, the transfer plate moves upward first until the limiting plate contacts the sealing plate. At this time, the two move upward synchronously. When the sealing plate contacts the top of the cooling box, the transfer plate also moves to the top of the blanking channel and contacts the electric ceramic plate. The sealing plate can not only seal the cooling box, but also cooperate with the transfer plate to transfer the chip to the blanking platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic diagram of the three-dimensional structure of the entire test platform in the embodiment; Figure 2 It is a schematic diagram of a cutaway cooling box in the entire test platform in the embodiment; Figure 3 It is a schematic diagram of the entire test platform in the embodiment cut along another angle; Figure 4 This is a schematic diagram of the position of the transfer plate in the blanking channel in the initial state in the embodiment; Figure 5 This is a schematic diagram of the structure of the bottom of the test fixture in the embodiment; Figure 6 It is a schematic diagram of assembling two electric ceramic plates at the bottom of the test fixture in the embodiment; Figure 7 is a schematic diagram of two electric ceramic plates in a closed state at the bottom of a test fixture in an embodiment; Figure 8 This is a schematic diagram of the distribution of four rotating plates at the bottom of the test fixture in the embodiment; Fig. 9 Schematic diagram of the connection between the rotating plate and the test fixture in the embodiment; Fig.10 Schematic diagram of the connection between the sliding rod and the rotating plate in the embodiment; Fig.11 This is a schematic diagram of the transfer plate moving to the bottom of the cooling box in the embodiment; Fig.12 It is a schematic diagram of the process of two shifting plates shifting chips from the transfer plate to the blanking table in the embodiment.

[0016] In the figure: 1. cooling box; 2. test fixture; 3. cover plate; 4. support rod; 5. blanking channel; 6. first shaft rod; 7. internal gear; 8. refrigerator; 9. blanking table; 10. blocking plate; 11. transmission box; 12. toggle plate; 13. electric telescopic rod; 14. external gear; 15. first linear gear; 16. second shaft rod; 17. transfer plate; 18. connecting rod; 19. limit plate; 21. second linear gear; 22. The third linear gear; 23. The electric ceramic plate; 24. The rack; 25. The first belt; 26. The second belt; 27. The guide wheel; 28. The slider; 29. ​​The rotating plate; 30. The connecting strip; 31. The stop block; 32. The push rod; 33. The force strip; 34. The accommodating chamber; 35. The slide rail; 36. The clamping column; 37. The limiting column; 38. The hinged rod; 39. The sliding rod; 40. The spring; 41. The slide groove; a. The chip.

[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0018] like Figure 1-12 As shown, the present embodiment proposes a high-temperature test platform for semiconductor chips, including a test fixture 2, wherein a receiving cavity 34 for placing chip a is formed inside the test fixture 2, the cross-section of the receiving cavity 34 is just adapted to the chip a, and the top and bottom of the receiving cavity 34 are both open structures, wherein a cover plate 3 is rotatably installed at the position of the top of the test fixture 2 corresponding to the receiving cavity 34, and two electric ceramic plates 23 of the same specifications are distributed at the position of the bottom corresponding to the receiving cavity 34, and the cover plate 3 is rotated and opened in the horizontal direction. After the chip a is placed in the receiving cavity 34, the two electric ceramic plates 23 synchronously move toward each other to close the bottom of the receiving cavity 34 and contact with the bottom of the chip a, and the two electric ceramic plates 23 work to generate heat to form a heat exchange with the chip a, thereby realizing high-temperature heating of the chip a, and the electric ceramic plates 23 and the test fixture 2 both adopt currently known mature technologies, and after the chip a is heated to the target temperature, the test fixture 2 works to complete the test of the chip a.

[0019] In this embodiment, two electric ceramic plates 23 for heating chip a are arranged at the bottom of the test fixture 2 to prevent it from being directly exposed to the outside, thereby preventing people from accidentally touching it and getting burned. In order to facilitate the heating treatment of chip a, a heating device can also be installed inside the cover plate 3. When the cover plate 3 is rotated to cover the accommodating cavity 34 and contact with chip a, the heating device inside the cover plate 3 can also heat the top of chip a, so that chip a can be quickly heated to the target temperature.

[0020] The reason why the electric ceramic plate 23 is set at the bottom of the test fixture 2 in this embodiment is to prevent it from being accidentally touched by personnel, and to facilitate the chip a to be separated from the accommodating cavity 34. In the prior art, personnel or a manipulator takes the chip a out of the accommodating cavity 34 and transfers it to a dedicated cooling device to cool the chip a after the test. In this embodiment, two electric ceramic plates 23 are used to make the chip a separate from the accommodating cavity 34 and directly enter the cooling box 1. For this purpose, this embodiment chooses to provide a blanking channel at the bottom of the accommodating cavity 34. 5, the bottom of the blanking channel 5 is connected with the interior of the cooling box 1 arranged under the test fixture 2. After the chip a is separated from the accommodating cavity 34, it passes through the blanking channel 5 and enters the cooling box 1 for cooling treatment. The interior of the blanking channel 5 is provided with a transfer plate 17 that can move in the vertical direction. When the cover plate 3 rotates to open the top of the accommodating cavity 34, the two electric ceramic plates 23 move synchronously in opposite directions to open the bottom of the accommodating cavity 34. The chip a in the accommodating cavity 34 falls onto the transfer plate 17, and the transfer plate 17 moves downward in the vertical direction to transfer the chip a to the interior of the cooling box 1.

[0021] Specifically, Figure 5 , 6As shown in 7, a slide rail 35 is formed at the bottom of the test fixture 2 corresponding to the sliding track of the two electric ceramic plates 23. The two electric ceramic plates 23 are embedded in the slide rail 35 and are slidably connected thereto. In order to ensure that the two electric ceramic plates 23 always slide inside the slide rail 35, in this embodiment, protrusions are formed on both sides of each electric ceramic plate 23, and grooves corresponding to the protrusions are opened on the inner wall of the slide rail 35. The ends of the two electric ceramic plates 23 facing away from each other are integrally formed with a connecting strip 30, and one end of the connecting strip 30 extends to the outside of the slide rail 35 and is fixedly connected to a rack 24. The two racks 24 are respectively distributed on both sides of the slide rail 35, and the second linear gear 21 and the third linear gear 22 are rotatably installed at the positions of the two racks 24 at the bottom of the test fixture 2. The bottoms of the second linear gear 21 and the third linear gear 22 are fixedly connected to the first pulley, and a second belt 26 is sleeved between the two first pulleys. The second belt 26 is distributed in a right-angle corner, and a guide wheel 27 is rotatably installed on the inner side of the corner to guide the second belt 26. By driving the second linear gear 21 to rotate, the third linear gear 22 can be driven to rotate synchronously therewith, and the two racks 24 will move toward or away from each other synchronously.

[0022] In the above scheme, for the drive of the second linear gear 21, in this embodiment, the rotation axis of the cover plate 3 is selected to pass through the test fixture 2 downward and then fixedly sleeved with the second pulley, and the second pulley and the central axis of the second linear gear 21 are sleeved with the first belt 25. The maximum rotation angle of the cover plate 3 is 90°, and two baffles are fixed on the top of the test fixture 2 corresponding to the rotation trajectory of the cover plate 3, thereby forming a limit for the rotation of the cover plate 3, so that the cover plate 3 can be rotated exactly 90° each time. The rotation of the cover plate 3 can be manually operated to attach Figure 1 Taking the perspective shown as an example, the cover plate 3 rotates counterclockwise by 90°, and the second linear gear 21 can be driven to rotate synchronously therewith through the action of the second pulley. The second linear gear 21 engages with the rack 24 during the rotation of 90°, so that the two electro-ceramic plates 23 move in opposite directions to completely open the bottom of the accommodating cavity 34. After the bottom of the accommodating cavity 34 is opened, the chip a falls into the blanking channel 5. At this time, the personnel can put the new chip a to be tested into the accommodating cavity 34, and then the cover plate 3 moves in the opposite direction to reset and cover the top of the accommodating cavity 34, and the two electro-ceramic plates 23 are also reset to contact the bottom of the chip a to be tested.

[0023] When the cover plate 3 is opened, the bottom of the accommodating cavity 34 is also open. Therefore, in order to allow the newly placed chip a to stay in the accommodating cavity 34, Figure 8-10As shown, in this embodiment, four groups of rotating plates 29 are rotatably installed on the sliding tracks of the two electric ceramic plates 23 at the bottom of the test fixture 2, and a groove body is formed inside the test fixture 2 at the position corresponding to each rotating plate 29, and a sliding rod 39 is arranged inside each groove body, and the sliding rod 39 extends toward the accommodating cavity 34 and is integrally connected with a clamping column 36, and the clamping column 36 can penetrate the test fixture 2 and slide into the accommodating cavity 34, and the sliding rod 39 is connected to the bottom end of the rotating plate 29 by a hinge rod 38, and a slide groove 41 is formed inside the hinge rod 38 along its length direction, and a limiting column 37 is fixedly connected to the inner wall of the groove body, and the limiting column 37 penetrates the slide groove 41 on the hinge rod 38. When the cover 3 rotates counterclockwise to open, the two electric ceramic plates 23 move synchronously away from each other. When the cover 3 rotates to nearly 90 degrees, the two electric ceramic plates 23 slide toward each other at one end to the edge of the accommodating cavity 34. At this time, the accommodating cavity 34 is completely open. The ends of the two electric ceramic plates 23 facing away from each other are still a distance away from the corresponding rotating plate 29. The setting of this distance is to provide enough time for the chip a to escape from the accommodating cavity 34. The cover 3 continues to rotate, and the ends of the two electric ceramic plates 23 facing away from each other move to contact with the corresponding rotating plate 29, thereby acting on the rotating plate 29. The plate 29 rotates toward the inside of the groove body. During the rotation of the rotating plate 29, the hinged rod 38 drives the sliding rod 39 to slide in the direction of the accommodating chamber 34 under the limiting action of the limiting column 37. At the same time, the hinged rod 38 also slides relative to the fixed limiting column 37. When the cover plate 3 rotates to 90°, the electric ceramic plate 23 just drives the corresponding rotating plate 29 to rotate to a horizontal state. The clamping column 36 extends from the test fixture 2 to the inside of the accommodating chamber 34. The four clamping columns 36 limit the new chip a in the accommodating chamber 34, and the newly inserted chip a is supported on the four clamping columns 36.

[0024] When the cover plate 3 rotates in the reverse direction to reset, the two electric ceramic plates 23 also move synchronously toward each other to close the bottom of the accommodating cavity 34. In order to enable the new chip a to contact the electric ceramic plate 23 for heating, the four clamping columns 36 need to be reset, so that the chip a inside the accommodating cavity 34 can slide further downward to contact the electric ceramic plate 23. In view of this, in this embodiment, a spring 40 is sleeved on the outside of the sliding rod 39, one end of the spring 40 is connected to one end of the sliding rod 39 located in the groove body, and the other end is connected to the inner wall of the groove body, and the spring 40 is connected to the inner wall of the groove body. The spring 40 is in a compressed state in its initial state, so that the clamping column 36 can always be located inside the test fixture 2 when it is not in operation, and will not extend into the accommodating cavity 34 to clamp the chip a. When the two electric ceramic plates 23 move in opposite directions and exert a force on the rotating plate 29, the sliding rod 39 slides toward the accommodating cavity 34. At this time, the spring 40 is further compressed. When the electric ceramic plate 23 is separated from the rotating plate 29 during the resetting process, the four clamping columns 36 will automatically reset under the reaction of the spring 40.

[0025] After the new chip a is supported by the four clamping columns 36 inside the accommodating cavity 34, the cover plate 3 rotates in the opposite direction to close the top of the accommodating cavity 34, and the two electric ceramic plates 23 move toward each other to close the bottom of the accommodating cavity 34. However, during the movement of the electric ceramic plates 23 toward each other, they gradually lose contact with the rotating plate 29. When the electric ceramic plates 23 are completely out of contact with the rotating plate 29, the opposite sides of the two electric ceramic plates 23 just move to the edge of the bottom of the accommodating cavity 34, and the four clamping columns 36 will quickly reset under the action of the spring 40. Since the distance between the two electric ceramic plates 23 is exactly equal to the width of the chip a, the new chip a may still fall directly into the blanking channel 5. In order to avoid this situation, refer to Figure 7In this embodiment, both ends of the slide rail 35 are closed and slidably connected with a slider 28. The slider 28 and the corresponding electric ceramic plate 23 are both provided with magnetic attraction on one side facing each other. When the electric ceramic plate 23 moves in opposite directions to exert a force on the rotating plate 29 and rotates it to a horizontal state, the electric ceramic plate 23 is just in contact with the slider 28, and the two are adsorbed together under the action of the magnetic force. Then, when the electric ceramic plate 23 moves toward each other, the electric ceramic plate 23 and the slider 28 first slide synchronously, and the bottom of the slider 28 is fixedly connected with a force bar 33 along its length direction. , and a stop block 31 is installed on the sliding track of the slide rail 35 corresponding to the force bar 33. When the slider 28 slides until the force bar 33 contacts the stop block 31, the electric ceramic plate 23 continues to slide, and the slider 28 stops sliding under the blocking action of the stop block 31, and the slider 28 is just below the rotating plate 29. The rotating plate 29 always remains in a horizontal state under the action of the slider 28. Then the four clamping columns 36 in the accommodating cavity 34 always support and limit the chip a until the two electric ceramic plates 23 move toward each other to completely close the bottom of the accommodating cavity 34.

[0026] After the two electric ceramic plates 23 move toward each other and contact each other, the four clamping columns 36 need to be automatically reset, and the reset of the clamping columns 36 depends entirely on the slider 28. As long as the slider 28 can be moved away from under the rotating plate 29, the clamping columns 36 will automatically reset under the action of the spring 40. In order to reset the slider 28, in this embodiment, a push rod 32 is fixedly connected to one end of each rack 24 close to the accommodating cavity 34. As the two electric ceramic plates 23 move toward each other, the push rod 32 gradually approaches the force bar 33. When the two electric ceramic plates 23 move to contact each other, the push rod 32 can just push the corresponding slider 28 to reset. At this time, the rotating plate 29 loses the obstruction of the slider 28, and the clamping columns 36 can be reset.

[0027] The chip a separated from the accommodating chamber 34 is transferred to the cooling box 1 by means of the transfer plate 17. The bottom of the transfer plate 17 is fixedly connected to the limit plate 19. The limit plate 19 is connected to the movable end of the electric telescopic rod 13 fixed at the inner center of the cooling box 1. The transfer plate 17 is initially located below the electric ceramic plate 23 (the distance between the transfer plate 17 and the electric ceramic plate 23 is adapted to the height of the chip a). After the electric ceramic plate 23 moves back to back to open the accommodating chamber 34, the chip a that has completed the test falls on the transfer plate 17, and then the transfer plate 17 is driven by the electric telescopic rod 13 to move in the vertical direction, so that the transfer plate 17 can be moved upward. The chip a on the cooling box is transferred to the cooling box 1. Since the cooling box 1 is provided with a refrigerator 8 to cool the chip a, its internal temperature is relatively low. The electric ceramic plate 23 is used to perform high-temperature heating treatment on the chip a. Therefore, if the cooling box 1 is internally connected to the blanking channel 5, the cold source inside the cooling box 1 will flow upward into the blanking channel 5. Since the transfer plate 17 slides relative to the blanking channel 5, the sealing performance of the two will be greatly reduced. In order to reduce the wear of the transfer plate 17, the cross-section of the transfer plate 17 is usually smaller than that of the blanking channel 5, which will cause the loss of heat source. In order to avoid this phenomenon, as Figure 4 , 11 As shown, in this embodiment, the plugging plate 10 is slidably sleeved on the outside of the connecting rod 18, and the cross section of the plugging plate 10 is larger than the blanking channel 5. A blanking platform 9 is installed on the moving path of the plugging plate 10 inside the cooling box 1. A clip is formed at the edge of the blanking platform 9 for limiting the downward movement of the plugging plate 10. In the initial state, the transfer plate 17 is located Figure 4 The position shown in the figure, at this time, the blocking plate 10 closes the connection between the blanking channel 5 and the cooling box 1 under the action of the limit plate 19, so that the cooling box 1 forms a closed space, preventing the cold source from flowing upward into the blanking channel 5. When the chip a needs to be transferred to the blanking table 9 inside the cooling box 1, the electric telescopic rod 13 drives the transfer plate 17 to move downward. At this time, the blocking plate 10 moves downward synchronously with the transfer plate 17 under the action of gravity until the blocking plate 10 contacts the card strip at the edge of the blanking table 9. At this time, the blocking plate 10 remains fixed, and the transfer plate 17 continues to move downward. Finally, the transfer plate 17 stops moving on the blocking plate 10, and finally appears as shown in the figure. Fig.11 In the state shown, the chip a on the transfer plate 17 can be transferred to the blanking table 9.

[0028] In the above scheme, for the transfer of chip a, in this embodiment, second shaft rods 16 are symmetrically fixed on both sides of the electric telescopic rod 13 inside the cooling box 1, and the top ends of the two second shaft rods 16 are fixedly sleeved with a toggle plate 12. The two toggle plates 12 are synchronously rotated toward the blanking table 9 with the second shaft rod 16 as the center, so that the chip a on the transfer plate 17 is pushed onto the blanking table 9. It should be supplemented that since the two toggle plates 12 are located on both sides of the electric telescopic rod 13, the length of the two toggle plates 12 is limited. It is necessary to ensure that they have sufficient length to push the chip a onto the blanking table 9, and to ensure that the two will not interfere with the electric telescopic rod 13 when rotating. The working process of the two toggle plates 12 rotating to push the chip a is as follows Fig.12 shown.

[0029] In addition, since the blocking plate 10 and the transfer plate 17 move in the vertical direction inside the cooling box 1, the initial position and movement process of the two toggle plates 12 are further limited in this embodiment, specifically: the top end of the second shaft 16 near the front side of the cooling box 1 passes through the toggle plate 12 and then extends upward to the outside of the cooling box 1 and is fixedly sleeved with an external gear 14, the rotating shaft of the cover plate 3 extends downward to the top of the cooling box 1 and is fixedly connected with an internal gear 7, the external gear 14 and the internal gear 7 are internally meshed, and the speed ratio of the external gear 14 to the internal gear 7 is 2:1, and the two toggle plates 12 are initially located as shown in the figure. Figure 2 The position shown in the figure will not affect the lifting and lowering movement of the blocking plate 10 and the transfer plate 17. When the cover plate 3 is rotated 90° counterclockwise to open, the two toggle plates 12 rotate 180° to the other side. After the chip a falls on the transfer plate 17, the electric telescopic rod 13 drives the transfer plate 17 to move downward to Fig.11 When the chip a is in the position shown, a new chip a is placed in the accommodating cavity 34, and then the cover plate 3 is rotated clockwise to reset. At this time, the two toggle plates 12 rotate 180° in the opposite direction to push the chip a on the transfer plate 17 onto the blanking table 9. It should also be noted that, since the two toggle plates 12 rotate 180° inside the cooling box 1, this embodiment reserves space above the refrigerator 8 for the toggle plates 12 to rotate, and a card strip is also connected to one side of the refrigerator 8 to limit the blocking plate 10.

[0030] Since the two toggle plates 12 rotate synchronously on both sides of the electric telescopic rod 13 to exert force on the chip a, it is necessary to keep the rotation directions of the two opposite. In view of this, Figure 2 , 3As shown, in this embodiment, a transmission box 11 is fixedly connected to the bottom of the cooling box 1, and four first linear gears 15 of the same specifications are distributed in sequence inside the transmission box 11, and the four first linear gears 15 are meshed externally in sequence. The bottom ends of the two second shafts 16 penetrate downward through the transmission box 11 and are fixedly connected to the centers of the two outermost first linear gears 15 respectively. The meshing transmission of the four first linear gears 15 of the same specifications can make the two toggle plates 12 rotate synchronously in opposite directions.

[0031] In the description of the present invention, the terms "first", "second", "another", and "yet another" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0033] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A high-temperature test platform for semiconductor chips, comprising a test fixture (2), wherein a receiving cavity (34) for placing a chip (a) is formed inside the test fixture (2), characterized in that: A cover plate (3) is rotatably mounted at a position corresponding to the accommodating cavity (34) on the top of the test fixture (2), and two electric ceramic plates (23) of the same specification are distributed at a position corresponding to the accommodating cavity (34) on the bottom. The two electric ceramic plates (23) synchronously move towards each other to close the accommodating cavity (34) and heat the chip (a); The bottom of the accommodating cavity (34) is connected to a material dropping channel (5), and the bottom of the material dropping channel (5) is connected to the inside of a cooling box (1) arranged below the test fixture (2). A transfer plate (17) that can move in a vertical direction is also arranged inside the material dropping channel (5). When the cover plate (3) rotates to open the top of the accommodating cavity (34), the two electric ceramic plates (23) synchronously move in opposite directions to open the bottom of the accommodating cavity (34), and the chip (a) inside the accommodating cavity (34) falls onto the transfer plate (17). The transfer plate (17) moves downward in the vertical direction to transfer the chip (a) to the inside of the cooling box (1).

2. A high temperature test platform for semiconductor chips according to claim 1, characterized in that: The bottom of the test fixture (2) is formed with a slide rail (35) corresponding to the sliding track of the two electric ceramic plates (23), the two electric ceramic plates (23) are embedded in the slide rail (35) and are slidably connected thereto, the ends of the two electric ceramic plates (23) facing away from each other are integrally formed with a connecting strip (30), one end of the connecting strip (30) extends to the outside of the slide rail (35) and is fixedly connected to a rack (24), the two racks (24) are respectively distributed on both sides of the slide rail (35), the bottom of the test fixture (2) corresponds to the position of the two racks (24) and is respectively rotatably mounted with a second linear gear (21) and a third linear gear (22), the bottoms of the second linear gear (21) and the third linear gear (22) are both fixedly connected with a first pulley, a second belt (26) is sleeved between the two first pulleys, the second belt (26) is distributed at a right angle corner, and a guide wheel (27) is rotatably mounted on the inner side of the corner to guide the second belt (26).

3. A high temperature test platform for semiconductor chips according to claim 2, characterized in that: The rotation axis of the cover plate (3) passes through the test fixture (2) downward and is fixedly sleeved with a second pulley, and the central axis of the second pulley and the second linear gear (21) is sleeved with a first belt (25). The maximum rotation angle of the cover plate (3) is 90°, and when the cover plate (3) rotates 90°, the two electric ceramic plates (23) move in opposite directions so that the bottom of the accommodating cavity (34) is completely open.

4. A high temperature test platform for semiconductor chips according to claim 3, characterized in that: Four groups of rotating plates (29) are rotatably mounted on the sliding tracks of the two electric ceramic plates (23) at the bottom of the test fixture (2), and a slot body is formed inside the test fixture (2) at the position corresponding to each rotating plate (29), and a sliding rod (39) is arranged inside each slot body, and the sliding rod (39) extends toward the accommodating cavity (34) and is integrally formed with a clamping column (36), and the clamping column (36) can penetrate the test fixture (2) and slide into the accommodating cavity (34), and the sliding rod (39) and the bottom end of the rotating plate (29) are connected by a hinge rod (38), and a slide groove (41) is formed inside the hinge rod (38) along its length direction, and a limiting column (37) is fixedly connected to the inner wall of the slot body, and the limiting column (37) penetrates the slide groove (41) on the hinge rod (38); A spring (40) is sleeved on the outside of the sliding rod (39), one end of the spring (40) is connected to one end of the sliding rod (39) located in the groove body, and the other end is connected to the inner wall of the groove body, and the spring (40) is in a compressed state in the initial state.

5. A high temperature test platform for semiconductor chips according to claim 4, characterized in that: Both ends of the slide rail (35) are closed and slidably connected to a slider (28); the slider (28) and the corresponding electric ceramic plate (23) are both provided with magnetic attraction on the sides facing each other; the bottom of the slider (28) is fixedly connected to a force bar (33) along its length direction; and a stop block (31) is installed on the sliding track of the corresponding force bar (33) on the slide rail (35); the stop block (31) is used to separate the slider (28) and the electric ceramic plate (23) when they move synchronously toward the accommodating cavity (34), and to keep the rotating plate (29) in a horizontal state under the pressure of the slider (28).

6. A high temperature test platform for semiconductor chips according to claim 5, characterized in that: One end of each rack (24) close to the accommodating cavity (34) is fixedly connected to a push rod (32), and the push rod (32) is used to push the corresponding slider (28) to reset when the two electric ceramic plates (23) move towards each other to close the bottom of the accommodating cavity (34).

7. A high temperature test platform for semiconductor chips according to any one of claims 1 to 6, characterized in that: The bottom of the transfer plate (17) is fixedly connected to a limit plate (19), the limit plate (19) is connected to the movable end of an electric telescopic rod (13) fixed at the center of the interior of the cooling box (1), the outer sliding sleeve of the connecting rod (18) is connected to a blocking plate (10), and the cross-section of the blocking plate (10) is larger than the blanking channel (5), and a blanking platform (9) is installed on the moving path of the blocking plate (10) inside the cooling box (1), and a clamping strip for limiting the downward movement of the blocking plate (10) is formed at the edge of the blanking platform (9).

8. The high temperature test platform for semiconductor chips according to claim 7, characterized in that: Inside the cooling box (1), second shafts (16) are symmetrically fixed on both sides of the electric telescopic rod (13), and the top ends of the two second shafts (16) are fixedly sleeved with a toggle plate (12). The two toggle plates (12) are synchronously rotated toward the blanking table (9) with the second shafts (16) as the center, so that the chip (a) on the transfer plate (17) is pushed onto the blanking table (9).

9. A high temperature test platform for semiconductor chips according to claim 8, characterized in that: The top end of the second shaft (16) near the front side of the cooling box (1) passes through the toggle plate (12) and then extends upward to the outside of the cooling box (1) and then is fixedly sleeved with an external gear (14); the rotating shaft of the cover plate (3) extends downward to the top of the cooling box (1) and then is fixedly connected with an internal gear (7); the external gear (14) and the internal gear (7) are internally meshed, and the speed ratio of the external gear (14) to the internal gear (7) is 2:1; The bottom of the cooling box (1) is fixedly connected to a transmission box (11), and four first linear gears (15) of the same specification are distributed in sequence inside the transmission box (11), and the four first linear gears (15) are meshed externally in sequence, and the bottom ends of the two second shafts (16) penetrate downward through the transmission box (11) and are respectively fixedly connected to the centers of the two outermost first linear gears (15).

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