Embedded part generation method and device, computer equipment, storage medium and program product

Abstract

The invention relates to an embedded part generation method and device, computer equipment, a storage medium and a program product, and relates to the technical field of embedded part generation. The method comprises the steps that in response to an embedded part generation instruction for a bearing component, component information of a target component indicated by the embedded part generation instruction and coordinates of a connecting point between the target component and the bearing component are obtained; the target component is connected with the bearing component through the generated embedded part; a target embedded part matched with the component information is screened out from the multiple candidate embedded parts; the connecting point coordinates serve as position coordinates of the target embedded part, component interference detection is conducted on the target embedded part based on the position coordinates, and a component interference detection result of the target embedded part is obtained; and when the component interference detection result shows that the target embedded part does not have component interference, generating a three-dimensional embedded part model of the target embedded part. By adopting the method, the generation accuracy of the embedded part can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of embedded part generation, and in particular to a method, device, computer equipment, storage medium and program product for generating embedded parts. Background Art

[0002] During the construction of nuclear power plants, a large number of process pipelines, equipment, brackets, steel structures, etc. are fixed to the civil engineering structure of the plant using embedded parts. These embedded parts are huge in number and diverse in type. They are an important carrier for connecting process equipment with civil engineering items, and are of great significance for ensuring the safe and stable operation of nuclear power plants.

[0003] Traditional embedded parts generation methods generally rely on manual execution and cannot guarantee the accuracy of embedded parts generation. Summary of the invention

[0004] Based on this, it is necessary to provide a method, device, computer equipment, computer-readable storage medium and computer program product for generating embedded parts, which can improve the accuracy of embedded parts generation, in order to solve the above technical problems.

[0005] In a first aspect, the present application provides a method for generating an embedded part, comprising: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction, and the coordinates of a connection point between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; from a plurality of candidate embedded parts, screening out a target embedded part that matches the component information; using the coordinates of the connection point as the position coordinates of the target embedded part, and based on the position coordinates, performing component interference detection on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference in the target embedded part, generating a three-dimensional embedded part model of the target embedded part.

[0006] In one of the embodiments, the connection point coordinates are used as the position coordinates of the target embedded part, and based on the position coordinates, component interference detection is performed on the target embedded part to obtain a component interference detection result of the target embedded part, including: using the connection point coordinates as the position coordinates of the target embedded part to determine an enclosing area centered on the position coordinates; for each enclosing boundary of the enclosing area, component screening is performed to obtain the adjacent components closest to each enclosing boundary; component spacing detection is performed between the target embedded part and each adjacent component to obtain component spacing detection results between the target embedded part and each adjacent component; based on each component spacing detection result, the component interference detection result of the target embedded part is determined.

[0007] In one of the embodiments, a target embedded part matching the component information is screened out from a plurality of candidate embedded parts, including: screening out at least one selected embedded part matching the component information from a plurality of candidate embedded parts; respectively obtaining the embedded part model of each selected embedded part, and taking the selected embedded part with the smallest embedded part model as the target embedded part.

[0008] In one of the embodiments, at least one selected embedded part matching the component information is screened out from a plurality of candidate embedded parts, including: obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of each of the plurality of candidate embedded parts; matching the component information with each embedded parts attribute information respectively to obtain information matching results between the component information and each embedded parts attribute information respectively; and selecting the candidate embedded part that matches the information matching result as the selected embedded part.

[0009] In one of the embodiments, when the component interference detection result indicates that there is no component interference with the target embedded part, a three-dimensional embedded part model of the target embedded part is generated, including: when the component interference detection result indicates that there is no component interference with the target embedded part, obtaining target attribute information of the target embedded part; based on the target attribute information, constructing a three-dimensional model of the target embedded part to obtain a three-dimensional embedded part model of the target embedded part.

[0010] In one of the embodiments, the method further includes: when the component interference detection result indicates that the target embedded part has component interference, updating the position coordinates of the target embedded part to obtain updated coordinates; and performing component interference detection on the target embedded part based on the updated coordinates.

[0011] In the second aspect, the present application also provides a device for generating embedded parts, including: an information acquisition module, used to respond to an embedded part generation instruction for a load-bearing component, obtain the component information of the target component indicated by the embedded part generation instruction, and the connection point coordinates between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; an embedded part screening module, used to screen out the target embedded parts that match the component information from multiple candidate embedded parts; a component interference detection module, used to use the connection point coordinates as the position coordinates of the target embedded part, and based on the position coordinates, perform component interference detection on the target embedded part to obtain a component interference detection result of the target embedded part; an embedded part generation module, used to generate a three-dimensional embedded part model of the target embedded part when the component interference detection result indicates that there is no component interference in the target embedded part.

[0012] In a third aspect, the present application also provides a computer device, comprising a memory and a processor, the memory storing a computer program, and the processor implementing the following steps when executing the computer program: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction, and the coordinates of a connection point between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; from a plurality of candidate embedded parts, screening out a target embedded part that matches the component information; using the connection point coordinates as the position coordinates of the target embedded part, and based on the position coordinates, performing component interference detection on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference in the target embedded part, generating a three-dimensional embedded part model of the target embedded part.

[0013] In a fourth aspect, the present application also provides a computer-readable storage medium having a computer program stored thereon, which implements the following steps when the computer program is executed by a processor: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction, and the coordinates of the connection points between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; from a plurality of candidate embedded parts, screening out a target embedded part that matches the component information; using the connection point coordinates as the position coordinates of the target embedded part, and based on the position coordinates, performing component interference detection on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference in the target embedded part, generating a three-dimensional embedded part model of the target embedded part.

[0014] In a fifth aspect, the present application also provides a computer program product, comprising a computer program, which implements the following steps when executed by a processor: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction, and the coordinates of the connection points between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; from multiple candidate embedded parts, screening out a target embedded part that matches the component information; using the connection point coordinates as the position coordinates of the target embedded part, and based on the position coordinates, performing component interference detection on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference in the target embedded part, generating a three-dimensional embedded part model of the target embedded part.

[0015] The above-mentioned embedded component generation method, device, computer equipment, computer readable storage medium and computer program product, in response to the embedded component generation instruction for the load-bearing component, first obtain the component information of the target component indicated by the embedded component generation instruction, and the connection point coordinates between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded component. Then, from multiple candidate embedded components, the target embedded component matching the component information is screened out. Then, the connection point coordinates are used as the position coordinates of the target embedded component, and based on the position coordinates, the target embedded component is subjected to component interference detection to obtain the component interference detection result of the target embedded component, and when the target embedded component does not have component interference, a three-dimensional embedded component model of the target embedded component is generated. In this way, the present application does not require manual intervention, and on the one hand, the embedded components are screened to select the optimal embedded component. On the other hand, through component interference detection, the accuracy and stability of the installation after the embedded component generation can be effectively avoided due to the interference of surrounding components, thereby improving the accuracy of the embedded component generation and the accuracy and stability of the embedded component installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is an application environment diagram of a method for generating embedded parts in one embodiment;

[0018] Figure 2 Schematic diagram of a flow chart of a method for generating embedded parts in one embodiment;

[0019] Figure 3 A schematic diagram of a flow chart of calculating the distance between an embedded part and an adjacent component in one embodiment;

[0020] Figure 4 is a schematic diagram of an embedded part and surrounding components in one embodiment;

[0021] Figure 5 A schematic diagram of an embedded part and surrounding components in another embodiment;

[0022] Figure 6 A schematic diagram of a process for screening embedded parts in one embodiment;

[0023] Figure 7 A schematic diagram of a process for screening embedded parts in another embodiment;

[0024] Figure 8A schematic diagram of a process for constructing a three-dimensional model of an embedded part in one embodiment;

[0025] Fig. 9 It is a schematic flow chart of a method for generating embedded parts in a specific embodiment;

[0026] Fig.10 A schematic flow chart of a method for generating embedded parts in another specific embodiment;

[0027] Fig.11 is a structural block diagram of a device for generating embedded parts in one embodiment;

[0028] Fig.12 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] The method for generating embedded parts provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown. Among them, the terminal 102 communicates with the server 104 through the network. The data storage system can store the data that the server 104 needs to process. The data storage system can be integrated on the server 104, or it can be placed on the cloud or other network servers. The terminal 102 can be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, and Internet of Things devices. The server 104 can be an independent physical server, or a server cluster or distributed system composed of multiple physical servers, or a cloud server that provides cloud computing services.

[0031] Specifically, in response to the embedded component generation instruction for the load-bearing component initiated by the terminal 102, the server 104 first obtains the component information of the target component indicated by the embedded component generation instruction and the connection point coordinates between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded component. Then, from multiple candidate embedded components, the target embedded component that matches the component information is screened out. Then, the connection point coordinates are used as the position coordinates of the target embedded component, and based on the position coordinates, the target embedded component is subjected to component interference detection to obtain the component interference detection result of the target embedded component. Finally, when the component interference detection result indicates that there is no component interference in the target embedded component, a three-dimensional embedded component model of the target embedded component is generated.

[0032] In an exemplary embodiment, Figure 2 As shown, a method for generating embedded parts is provided, and the method is applied to Figure 1 The server 104 in FIG. 1 is used as an example to illustrate, including:

[0033] Step S202, in response to an embedded component generation instruction for a load-bearing component, obtain component information of a target component indicated by the embedded component generation instruction and the coordinates of a connection point between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded component.

[0034] Among them, the load-bearing member may refer to a member used to bear loads in a building structure, such as a column, a wall, a beam, etc. The embedded part generation instruction refers to an instruction to install embedded parts on the load-bearing member, so that the target member can be connected to the load-bearing member through the generated embedded parts. The target member may refer to a member that needs to be connected and fixed to other members. Component information may refer to the attribute information of the target member, including but not limited to size, shape, load, purpose, corrosion resistance, etc. The connection point coordinates refer to the coordinates of the connection point between the target member and the load-bearing member, also known as the fixed point, which can generally be used as the position coordinates of the embedded part.

[0035] For example, when a load-bearing component needs to be installed with an embedded part, or when a target component needs to be fixed on a load-bearing component, a user can initiate an embedded part generation instruction for the load-bearing component through a terminal. After receiving the instruction, the server can parse the instruction to obtain relevant attribute information of the target component and the coordinates of the connection point between the target component and the load-bearing component.

[0036] Step S204: Filter out target embedded parts that match the component information from multiple candidate embedded parts.

[0037] The candidate embedded parts may be various embedded parts pre-stored by the server, that is, the server will pre-establish an embedded parts database or embedded parts list to comprehensively record the information of each candidate embedded part. The target embedded part refers to the candidate embedded part that matches the component information.

[0038] Exemplarily, after acquiring the component information of the target component, the server may perform information matching among a plurality of pre-stored candidate embedded parts based on the component information, so as to match a candidate embedded part that matches the component information as the target embedded part.

[0039] Step S206, taking the connection point coordinates as the position coordinates of the target embedded part, and performing component interference detection on the target embedded part based on the position coordinates to obtain a component interference detection result of the target embedded part.

[0040] The position coordinates can also be understood as the surface center coordinates of the target embedded part. Component interference detection refers to the process of detecting whether there is interference between the target embedded part and the surrounding components. The component interference detection result is used to indicate whether there is interference between the target embedded part and the surrounding components, which can include whether there is component interference or not.

[0041] Exemplarily, the server uses the coordinates of the connection point between the target component and the load-bearing component as the position coordinates of the target embedded part, and based on the position coordinates, detects whether there is interference between the target embedded part and surrounding components.

[0042] Step S208: When the component interference detection result indicates that there is no component interference in the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.

[0043] The three-dimensional embedded part model refers to the three-dimensional model of the target embedded part, and subsequent professionals can install the embedded parts on the load-bearing components based on the three-dimensional model of the target embedded part.

[0044] Exemplarily, when the component interference detection result indicates that there is no component interference in the target embedded part, the server can construct a 3D model of the target embedded part to obtain a 3D embedded part model of the target embedded part. The 3D model construction can use a special 3D modeling tool, which is not limited in this embodiment.

[0045] In this embodiment, in response to the embedded component generation instruction for the load-bearing component, the server first obtains the component information of the target component indicated by the embedded component generation instruction and the connection point coordinates between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded component. Then, the target embedded component matching the component information is screened out from multiple candidate embedded components. Then, the connection point coordinates are used as the position coordinates of the target embedded component, and the component interference detection of the target embedded component is performed based on the position coordinates to obtain the component interference detection result of the target embedded component. When there is no component interference in the target embedded component, a three-dimensional embedded component model of the target embedded component is generated. In this way, this embodiment does not require manual intervention. On the one hand, the embedded components are screened to select the optimal embedded component. On the other hand, through component interference detection, the accuracy and stability of the installation after the embedded component generation can be effectively avoided due to the interference of surrounding components, thereby improving the accuracy of the embedded component generation and the accuracy and stability of the embedded component installation.

[0046] In an exemplary embodiment, Figure 3 As shown, the connection point coordinates are used as the position coordinates of the target embedded part, and based on the position coordinates, component interference detection is performed on the target embedded part to obtain the component interference detection result of the target embedded part, including:

[0047] Step S302: Using the connection point coordinates as the position coordinates of the target embedded part, and determining an enclosing area centered on the position coordinates.

[0048] Among them, the enclosing area refers to the enclosing core formed with the position coordinates as the center, such as Figure 4 As shown, Figure 4 The opening, the existing embedded parts, the allowable eccentricity range of the target embedded parts, and the surrounding component boundaries are also shown. There are multiple enclosing boundaries in the enclosing area, and the distance between the position coordinates and the enclosing boundary can be set according to the actual situation.

[0049] Exemplarily, the server uses the connection point coordinates as the position coordinates of the target embedded part, and can use the position coordinates as the center and extend outward a certain distance to form an enclosing area of ​​the target embedded part.

[0050] Step S304 , for each enclosing boundary of the enclosing area, component screening is performed to obtain adjacent components closest to each enclosing boundary.

[0051] The enclosing boundaries are the boundaries that make up the enclosing area. The adjacent components refer to the existing components or existing embedded parts that are closest to each enclosing boundary. It should be noted that the distance here refers to the distance between the center point of the boundary of the adjacent component and the enclosing boundary, such as Figure 5 The min d (minimum distance) in .

[0052] Exemplarily, the server spreads outwards for each enclosing boundary of the enclosing area to find existing components or embedded parts around, calculates the distance between the center point of the component boundary of these components and the enclosing boundary, and takes the surrounding components with the smallest distance as adjacent components.

[0053] Step S306, performing component spacing detection between the target embedded component and each adjacent component, respectively, to obtain component spacing detection results between the target embedded component and each adjacent component respectively.

[0054] Wherein, component spacing detection is the process of detecting the distance relationship between the target embedded part and the adjacent component. The component spacing detection result is used to characterize the distance relationship between the target embedded part and the adjacent component. It should be noted that the distance relationship between the target embedded part and the adjacent component can be determined directly based on the distance between the boundary center point of the adjacent component and the encircling boundary. For example, when the distance between the boundary center point of the adjacent component and the encircling boundary is within the allowable distance range, it is considered that the distance between the target embedded part and the adjacent component is within the safe range, otherwise it is considered that the distance between the target embedded part and the adjacent component is not within the safe range, and there is a risk of interference. Of course, the distance relationship between the target embedded part and the adjacent component can also be determined according to the distance between the center position coordinates of the adjacent component and the position coordinates of the target embedded part. For example, when the distance between the center position coordinates of the adjacent component and the position coordinates of the target embedded part is within the allowable distance range, it is also considered that the distance between the target embedded part and the adjacent component is within the safe range, otherwise it is considered that the distance between the target embedded part and the adjacent component is not within the safe range, and there is a risk of interference. In practical applications, other component spacing detection bases can also be defined according to actual operating conditions, and this embodiment does not limit this.

[0055] Exemplarily, after the server screens out the adjacent components, the server may calculate the spacing between the target embedded component and each adjacent component, thereby obtaining the distance relationship between the target embedded component and each adjacent component.

[0056] Step S308: determining the component interference detection result of the target embedded part based on the detection results of the spacing between the components.

[0057] Exemplarily, when the component spacing detection result indicates that the spacing between the target embedded part and each adjacent component is within the allowable distance range, it means that the distance between the target embedded part and the adjacent component is within the safe range and there is no mutual interference. When the component spacing detection result indicates that the spacing between the target embedded part and each adjacent component is not within the allowable distance range, it means that the distance between the target embedded part and the adjacent component is not within the safe range and there is a risk of mutual interference.

[0058] In one embodiment, it should be noted that, in addition to determining whether the spacing between the target embedded part and the surrounding components meets the requirements, it is also possible to detect whether the concrete margin meets the minimum concrete margin requirements, detect whether the allowable eccentricity range of the target embedded part meets the maximum eccentricity distance, etc. Specific detection requirements can be set according to actual conditions, and this embodiment does not limit this.

[0059] In this embodiment, by calculating the spacing between the target embedded part and the adjacent components, the distance relationship between the target embedded part and the adjacent components is determined, and then it is determined whether there is a component interference risk between the target embedded part and the adjacent components, thereby improving the accuracy of embedded part generation.

[0060] In an exemplary embodiment, Figure 6 As shown, from multiple candidate embedded parts, target embedded parts matching the component information are screened out, including:

[0061] Step S602: Screen out at least one selected embedded part that matches the component information from a plurality of candidate embedded parts.

[0062] Step S604, respectively obtaining the embedded part model of each selected embedded part, and taking the selected embedded part with the smallest embedded part model as the target embedded part.

[0063] The selected embedded parts refer to candidate embedded parts that match the component information. Further screening, namely model screening, is required in the selected embedded parts to obtain the final target embedded parts. The embedded part models include but are not limited to the width, thickness, diameter, length, etc. of the embedded parts.

[0064] For example, the server will first select a batch of selected embedded parts that match the component information from multiple candidate embedded parts. Among these selected embedded parts, the server will further obtain the model information such as width, thickness, diameter, length, etc. of each selected embedded part. The selected embedded part with the smallest embedded part model is used as the final target embedded part.

[0065] In this embodiment, by selecting the embedded part with the smallest model as the target embedded part among the selected embedded parts that meet the requirements, it is beneficial to reduce material consumption and reduce the cost of embedded part production and installation.

[0066] In an exemplary embodiment, Figure 7 As shown, at least one selected embedded part matching the component information is screened out from a plurality of candidate embedded parts, including:

[0067] Step S702, obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of each of a plurality of candidate embedded parts.

[0068] The embedded part attribute information refers to the attribute information of the candidate embedded parts, including but not limited to the embedded part model, minimum component spacing requirement, minimum concrete edge distance requirement, maximum eccentric distance requirement, maximum load, etc.

[0069] Exemplarily, the server may establish a standard embedded parts list in advance, which records various candidate embedded parts and attribute information of each candidate embedded part, namely, embedded part model, minimum component spacing requirement, minimum concrete margin requirement, maximum eccentric distance requirement, maximum load, etc.

[0070] Step S704, matching the component information with each embedded part attribute information respectively, and obtaining information matching results between the component information and each embedded part attribute information respectively.

[0071] Step S706: taking the candidate embedded parts that are matched according to the information matching result as selected embedded parts.

[0072] The information matching result can be understood as the matching degree between the component information and the embedded part attribute information. In this embodiment, the matching is mainly performed through load information, that is, the load of the target component is matched with the maximum load of each candidate embedded part. Of course, other information can also be selected for matching in practical applications, and this embodiment does not limit this.

[0073] Exemplarily, the server matches the load of the target component with the maximum load of each candidate embedded part. When the load of the target component does not exceed the maximum load of the candidate embedded part, the information matching result is matched, and the matched candidate embedded part is selected as the embedded part. If the load of the target component exceeds the maximum load of the candidate embedded part, the information matching result is not matched, and the candidate embedded part is eliminated.

[0074] In this embodiment, by matching the component information of the target component with the embedded part attribute information of each candidate embedded part in the embedded parts list, the candidate embedded parts with matching information are selected as selected embedded parts, thereby improving the accuracy of embedded parts screening and further improving the accuracy of the entire embedded parts generation.

[0075] In an exemplary embodiment, Figure 8 As shown, when the component interference detection result indicates that there is no component interference in the target embedded part, a three-dimensional embedded part model of the target embedded part is generated, including:

[0076] Step S802: when the component interference detection result indicates that there is no component interference in the target embedded part, obtain target attribute information of the target embedded part.

[0077] Step S804: construct a three-dimensional model of the target embedded part based on the target attribute information to obtain a three-dimensional embedded part model of the target embedded part.

[0078] The target attribute information refers to the attribute information of the target embedded part, including but not limited to the embedded part model, type, purpose, size, etc. of the target embedded part.

[0079] Exemplarily, when the component interference detection result indicates that there is no component interference with the target embedded part, it means that the target embedded part is the optimal embedded part for the load-bearing component, and the embedded part generation operation can be performed. The server calls the pre-deployed 3D model building tool, inputs the relevant attribute information of the target embedded part into the 3D model building tool, and the 3D model building tool builds a 3D model of the target embedded part based on the attribute information.

[0080] In this embodiment, a three-dimensional model of the target embedded part is constructed based on the attribute information of the target embedded part, thereby improving the accuracy of the three-dimensional embedded part model, that is, improving the accuracy of the entire embedded part generation.

[0081] In an exemplary embodiment, the embedded part generation method further includes: when the component interference detection result indicates that the target embedded part has component interference, updating the position coordinates of the target embedded part to obtain updated coordinates. Based on the updated coordinates, component interference detection is performed on the target embedded part.

[0082] The updated coordinates refer to the updated position coordinates.

[0083] Exemplarily, when the component interference detection result indicates that the target embedded part has component interference, the server will update the position coordinates, that is, recalculate a position coordinate for the target embedded part, and perform component interference detection on the target embedded part based on the updated position coordinates.

[0084] In this embodiment, when there is component interference in the target embedded part, the position coordinates of the target embedded part will be recalculated, thereby ensuring the reliability of the generation and installation of the embedded part.

[0085] In a specific embodiment, if Fig. 9 As shown, Fig. 9 The flowchart of the method for generating embedded parts is shown. It includes:

[0086] S1: In response to an embedded component generation instruction for a load-bearing component, load information of a target component indicated by the embedded component generation instruction and the coordinates of a connection point between the target component and the load-bearing component are acquired.

[0087] S2: Filter out the target embedded parts that match the load information from multiple candidate embedded parts in the embedded parts list, use the connection point coordinates as the position coordinates of the target embedded parts, and generate an enclosing core centered on the position coordinates.

[0088] S3: Calculate the distance relationship between the target embedded part and the adjacent components surrounding the core, and determine whether there is component interference between the target embedded part and the adjacent components based on the distance relationship.

[0089] S4: If it does not exist, generate a three-dimensional embedded part model of the target embedded part according to the position coordinates.

[0090] S5: If yes, return to step S2.

[0091] Further references Fig.10 , Fig.10 Another flow chart of the embedded parts generation method is shown. Among them, the server will first establish an embedded parts list, and add the restriction requirements and load requirements of various candidate embedded parts to the list. For the embedded parts generation instruction initiated by the user, the server will read the connection point coordinates between the target component and the load-bearing component, as well as the load information of the target component. Then enter the embedded parts screening module, and after screening out the target embedded parts, generate the position coordinates and enclosing core of the target embedded parts. Then search for the adjacent components of the target embedded parts, and calculate the distance relationship between the adjacent components and the target embedded parts. According to the distance relationship, it is judged whether there is component interference between the target embedded parts and the adjacent components. Of course, it can also be further judged here whether the concrete margin meets the minimum concrete margin requirements, whether the allowable eccentricity range of the target embedded parts meets the maximum eccentricity distance, etc., so it belongs to a multi-condition judgment. When these conditions are met, a three-dimensional model of the target embedded parts is generated, and the generation of the final entity embedded parts can be completed through the process system later. If these conditions are not met, the position coordinates are recalculated.

[0092] In this embodiment, in response to the embedded component generation instruction for the load-bearing component, the server first obtains the component information of the target component indicated by the embedded component generation instruction and the connection point coordinates between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded component. Then, the target embedded component matching the component information is screened out from multiple candidate embedded components. Then, the connection point coordinates are used as the position coordinates of the target embedded component, and the component interference detection of the target embedded component is performed based on the position coordinates to obtain the component interference detection result of the target embedded component. When there is no component interference in the target embedded component, a three-dimensional embedded component model of the target embedded component is generated. In this way, this embodiment does not require manual intervention. On the one hand, the embedded components are screened to select the optimal embedded component. On the other hand, through component interference detection, the accuracy and stability of the installation after the embedded component generation can be effectively avoided due to the interference of surrounding components, thereby improving the accuracy of the embedded component generation and the accuracy and stability of the embedded component installation.

[0093] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0094] Based on the same inventive concept, the embodiment of the present application also provides a device for generating embedded parts for implementing the method for generating embedded parts involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of the device for generating one or more embedded parts provided below can refer to the limitations of the method for generating embedded parts above, and will not be repeated here.

[0095] In an exemplary embodiment, Fig.11 As shown, a device for generating embedded parts is provided, including: an information acquisition module 1102, which is used to respond to an embedded part generation instruction for a load-bearing component, obtain component information of a target component indicated by the embedded part generation instruction, and the coordinates of the connection points between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; an embedded part screening module 1104, which is used to screen out a target embedded part that matches the component information from a plurality of candidate embedded parts; a component interference detection module 1106, which is used to use the connection point coordinates as the position coordinates of the target embedded part, and based on the position coordinates, perform component interference detection on the target embedded part to obtain a component interference detection result of the target embedded part; an embedded part generation module 1108, which is used to generate a three-dimensional embedded part model of the target embedded part when the component interference detection result indicates that there is no component interference in the target embedded part.

[0096] In one of the embodiments, the component interference detection module 1106 is also used to: use the connection point coordinates as the position coordinates of the target embedded part to determine the enclosing area centered on the position coordinates; perform component screening on each enclosing boundary of the enclosing area to obtain the adjacent components closest to each enclosing boundary; perform component spacing detection between the target embedded part and each adjacent component to obtain the component spacing detection results between the target embedded part and each adjacent component; and determine the component interference detection result of the target embedded part based on the component spacing detection results.

[0097] In one of the embodiments, the embedded part screening module 1104 is further used to: screen out at least one selected embedded part that matches the component information from multiple candidate embedded parts; obtain the embedded part model of each selected embedded part respectively, and take the selected embedded part with the smallest embedded part model as the target embedded part.

[0098] In one of the embodiments, the embedded parts screening module 1104 is also used to: obtain an embedded parts list; the embedded parts list records the embedded parts attribute information of multiple candidate embedded parts; respectively match the component information with each embedded parts attribute information to obtain the information matching results between the component information and each embedded parts attribute information; and select the candidate embedded parts that match the information matching results as selected embedded parts.

[0099] In one of the embodiments, the embedded part generation module 1108 is also used to: when the component interference detection result indicates that there is no component interference in the target embedded part, obtain the target attribute information of the target embedded part; based on the target attribute information, construct a three-dimensional model of the target embedded part to obtain a three-dimensional embedded part model of the target embedded part.

[0100] In one of the embodiments, the device is further used for: when the component interference detection result indicates that the target embedded part has component interference, updating the position coordinates of the target embedded part to obtain updated coordinates; and performing component interference detection on the target embedded part based on the updated coordinates.

[0101] Each module in the above-mentioned embedded component generation device can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute operations corresponding to each of the above modules.

[0102] In an exemplary embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in FIG. Fig.12As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store the generation data of the embedded parts. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for generating embedded parts is implemented.

[0103] Those skilled in the art will understand that Fig.12 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0104] In an exemplary embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the following steps when executing the computer program: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction and the coordinates of a connection point between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded part; from a plurality of candidate embedded parts, a target embedded part matching the component information is screened out; the connection point coordinates are used as the position coordinates of the target embedded part, and based on the position coordinates, component interference detection is performed on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference of the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.

[0105] In one embodiment, when the processor executes the computer program, the following steps are also implemented: using the connection point coordinates as the position coordinates of the target embedded part, determining an enclosing area centered on the position coordinates; performing component screening for each enclosing boundary of the enclosing area to obtain the adjacent components closest to each enclosing boundary; performing component spacing detection between the target embedded part and each adjacent component to obtain component spacing detection results between the target embedded part and each adjacent component; and determining the component interference detection result of the target embedded part based on the component spacing detection results.

[0106] In one embodiment, when the processor executes the computer program, the following steps are also implemented: from multiple candidate embedded parts, at least one selected embedded part matching the component information is screened out; the embedded part model of each selected embedded part is obtained respectively, and the selected embedded part with the smallest embedded part model is used as the target embedded part.

[0107] In one embodiment, when the processor executes the computer program, the following steps are also implemented: obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of each of a plurality of candidate embedded parts; matching the component information with each embedded parts attribute information respectively to obtain information matching results between the component information and each embedded parts attribute information respectively; and selecting the candidate embedded parts that are matched by the information matching results as selected embedded parts.

[0108] In one embodiment, when the processor executes the computer program, the following steps are also implemented: when the component interference detection result indicates that there is no component interference in the target embedded part, the target attribute information of the target embedded part is obtained; based on the target attribute information, a three-dimensional model of the target embedded part is constructed to obtain a three-dimensional embedded part model of the target embedded part.

[0109] In one embodiment, when the processor executes the computer program, the following steps are also implemented: when the component interference detection result indicates that there is component interference in the target embedded part, the position coordinates of the target embedded part are updated to obtain updated coordinates; based on the updated coordinates, component interference detection is performed on the target embedded part.

[0110] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: in response to an embedded part generation instruction for a load-bearing component, component information of a target component indicated by the embedded part generation instruction and the coordinates of the connection points between the target component and the load-bearing component are obtained; the target component is connected to the load-bearing component through the generated embedded part; from multiple candidate embedded parts, a target embedded part that matches the component information is screened out; the connection point coordinates are used as the position coordinates of the target embedded part, and based on the position coordinates, component interference detection is performed on the target embedded part to obtain a component interference detection result of the target embedded part; when the component interference detection result indicates that there is no component interference of the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.

[0111] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: using the connection point coordinates as the position coordinates of the target embedded part, determining an enclosing area centered on the position coordinates; performing component screening for each enclosing boundary of the enclosing area to obtain the adjacent components closest to each enclosing boundary; performing component spacing detection between the target embedded part and each adjacent component to obtain component spacing detection results between the target embedded part and each adjacent component; and determining the component interference detection result of the target embedded part based on the component spacing detection results.

[0112] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: from multiple candidate embedded parts, at least one selected embedded part matching the component information is screened out; the embedded part model of each selected embedded part is obtained respectively, and the selected embedded part with the smallest embedded part model is used as the target embedded part.

[0113] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of multiple candidate embedded parts; matching the component information with each embedded parts attribute information respectively to obtain information matching results between the component information and each embedded parts attribute information respectively; and selecting the candidate embedded parts that match the information matching results as the selected embedded parts.

[0114] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: when the component interference detection result indicates that there is no component interference in the target embedded part, the target attribute information of the target embedded part is obtained; based on the target attribute information, a three-dimensional model of the target embedded part is constructed to obtain a three-dimensional embedded part model of the target embedded part.

[0115] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: when the component interference detection result indicates that there is component interference in the target embedded part, the position coordinates of the target embedded part are updated to obtain updated coordinates; based on the updated coordinates, component interference detection is performed on the target embedded part.

[0116] In one embodiment, a computer program product is provided, comprising a computer program, which implements the following steps when executed by a processor: in response to an embedded part generation instruction for a load-bearing component, obtaining component information of a target component indicated by the embedded part generation instruction and the coordinates of the connection points between the target component and the load-bearing component; connecting the target component to the load-bearing component through the generated embedded part; screening out a target embedded part that matches the component information from a plurality of candidate embedded parts; using the connection point coordinates as the position coordinates of the target embedded part, and performing component interference detection on the target embedded part based on the position coordinates to obtain a component interference detection result of the target embedded part; and generating a three-dimensional embedded part model of the target embedded part when the component interference detection result indicates that there is no component interference of the target embedded part.

[0117] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: using the connection point coordinates as the position coordinates of the target embedded part, determining an enclosing area centered on the position coordinates; performing component screening for each enclosing boundary of the enclosing area to obtain the adjacent components closest to each enclosing boundary; performing component spacing detection between the target embedded part and each adjacent component to obtain component spacing detection results between the target embedded part and each adjacent component; and determining the component interference detection result of the target embedded part based on the component spacing detection results.

[0118] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: from multiple candidate embedded parts, at least one selected embedded part matching the component information is screened out; the embedded part model of each selected embedded part is obtained respectively, and the selected embedded part with the smallest embedded part model is used as the target embedded part.

[0119] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of multiple candidate embedded parts; matching the component information with each embedded parts attribute information respectively to obtain information matching results between the component information and each embedded parts attribute information respectively; and selecting the candidate embedded parts that match the information matching results as the selected embedded parts.

[0120] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: when the component interference detection result indicates that there is no component interference in the target embedded part, the target attribute information of the target embedded part is obtained; based on the target attribute information, a three-dimensional model of the target embedded part is constructed to obtain a three-dimensional embedded part model of the target embedded part.

[0121] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: when the component interference detection result indicates that there is component interference in the target embedded part, the position coordinates of the target embedded part are updated to obtain updated coordinates; based on the updated coordinates, component interference detection is performed on the target embedded part.

[0122] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0123] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0124] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0125] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for generating embedded parts, characterized in that: The method comprises: In response to an embedded component generation instruction for a load-bearing component, component information of a target component indicated by the embedded component generation instruction and the coordinates of a connection point between the target component and the load-bearing component are acquired; the target component is connected to the load-bearing component through the generated embedded component; Selecting a target embedded part that matches the component information from multiple candidate embedded parts; Using the connection point coordinates as the position coordinates of the target embedded part, and performing component interference detection on the target embedded part based on the position coordinates to obtain a component interference detection result of the target embedded part; When the component interference detection result indicates that there is no component interference in the target embedded part, a three-dimensional embedded part model of the target embedded part is generated.

2. The method according to claim 1, characterized in that The method of using the connection point coordinates as the position coordinates of the target embedded part, and performing component interference detection on the target embedded part based on the position coordinates to obtain a component interference detection result of the target embedded part includes: Taking the connection point coordinates as the position coordinates of the target embedded part, and determining an enclosing area centered on the position coordinates; For each enclosing boundary of the enclosing area, component screening is performed to obtain adjacent components closest to each enclosing boundary; Performing component spacing detection between the target embedded component and each of the adjacent components respectively, and obtaining component spacing detection results between the target embedded component and each of the adjacent components respectively; Based on the component spacing detection results, the component interference detection result of the target embedded part is determined.

3. The method according to claim 1, characterized in that The step of selecting a target embedded part matching the component information from a plurality of candidate embedded parts comprises: Selecting at least one selected embedded part that matches the component information from a plurality of candidate embedded parts; The embedded part model of each selected embedded part is obtained respectively, and the selected embedded part with the smallest embedded part model is used as the target embedded part.

4. The method according to claim 3, characterized in that The step of selecting at least one selected embedded part that matches the component information from a plurality of candidate embedded parts comprises: Obtaining an embedded parts list; the embedded parts list records the embedded parts attribute information of each of a plurality of candidate embedded parts; Matching the component information with each of the embedded part attribute information respectively to obtain information matching results between the component information and each of the embedded part attribute information respectively; The candidate embedded parts that match the information matching result are taken as selected embedded parts.

5. The method according to claim 1, characterized in that When the component interference detection result indicates that there is no component interference in the target embedded part, generating a three-dimensional embedded part model of the target embedded part includes: When the component interference detection result indicates that there is no component interference with the target embedded part, obtaining target attribute information of the target embedded part; Based on the target attribute information, a three-dimensional model of the target embedded part is constructed to obtain a three-dimensional embedded part model of the target embedded part.

6. The method according to claim 1, characterized in that The method further comprises: When the component interference detection result indicates that the target embedded part has component interference, updating the position coordinates of the target embedded part to obtain updated coordinates; Based on the updated coordinates, component interference detection is performed on the target embedded part.

7. A device for generating embedded parts, characterized in that: The device comprises: An information acquisition module, for acquiring, in response to an embedded component generation instruction for a load-bearing component, component information of a target component indicated by the embedded component generation instruction and the coordinates of a connection point between the target component and the load-bearing component; the target component is connected to the load-bearing component through the generated embedded component; An embedded part screening module is used to screen out a target embedded part matching the component information from a plurality of candidate embedded parts; A component interference detection module, used to use the connection point coordinates as the position coordinates of the target embedded part, and based on the position coordinates, perform component interference detection on the target embedded part to obtain a component interference detection result of the target embedded part; The embedded part generation module is used to generate a three-dimensional embedded part model of the target embedded part when the component interference detection result indicates that there is no component interference in the target embedded part.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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