System and method for testing memory device

Abstract

A system for testing a memory device is provided. The system comprises a plurality of testing devices, a transmission device and a data processing device. The testing devices perform a plurality of tests different from each other on the memory device, and output a plurality of test results of the tests. The transmission device transmits the memory device to the test devices and the first memory device. The first storage device stores the test results and a form of a part of the test memory devices in the test devices. The data processing device stores production data of the memory device. When the transmission device determines that the memory device is defective according to at least one of the test results, the data processing device generates a report according to at least one of the test results and the production data to improve the manufacturing efficiency.

Description

Technical Field

[0001] The present disclosure relates to a system and method for testing a memory device, and more particularly to a system and method for testing a memory device using identity instructions. Background Art

[0002] As the process technology of memory devices develops rapidly, the circuits of memory devices are designed to have smaller size and higher density. Higher circuit density helps to improve the speed and performance of memory, but higher error rate and manufacturing difficulties arise. Generally speaking, in order to ensure the reliability and yield of the product, memory testing is indispensable. Summary of the invention

[0003] In some embodiments, a system for testing a memory device is provided. The system includes a plurality of test devices, a transmission device, and a data processing device. The test devices perform a plurality of tests different from each other on the memory device, and output a plurality of test results of the tests. The transmission device transmits the memory device to the test devices, and includes a first storage device. The first storage device stores the test results and a form of a portion of the memory device tested in the test devices. The data processing device stores production data of the memory device. When the transmission device determines that the memory device is defective according to at least one of the test results, the data processing device generates a report according to at least one of the test results and the production data.

[0004] In some embodiments, the transmission device further includes a camera. The camera captures an image of a first test device among the test devices. In response to a first test result among the test results indicating that the memory device fails the first test among the tests, the transmission device determines that the first test device or the memory device is defective based on the image.

[0005] In some embodiments, the system further comprises an identity reading device. When the transmission device determines that the memory device is defective, the transmission device transmits the memory device to the identity reading device. The identity reading device identifies the identity of the memory device and outputs the identity to the data processing device. The data processing device obtains production data from the second storage device of the data processing device to generate a report.

[0006] In some embodiments, the data processing device generates a report having location data of the die in the memory device, the location data indicating the location of the die corresponding to the identity in the wafer.

[0007] In some embodiments, when the memory device is defective, the data processing device records the memory device in a list of multiple memory devices that have failed a test and determines homogeneity among multiple production data of the memory devices that have failed a test.

[0008] In some embodiments, when the memory device is defective, the data processing device determines the cause of the defect of the memory device according to the homogeneity.

[0009] In some embodiments, the production data includes wafer acceptance test data, wafer probe test data, and final test data, the final test data indicating test results of packaged wafers in the memory device.

[0010] In some embodiments, the transmitting device transmits the memory device to each of the test devices to execute a corresponding one of the tests according to the table.

[0011] In some embodiments, a system for testing a memory device is provided, comprising a first test device, a transmission device, and a data processing device. The first test device performs read and write operations on the first memory device to perform a first test on the first memory device. The transmission device places the first memory device on a test platform of the first test device. The data processing device stores a first identity of the first memory device and production data corresponding to the first identity, and generates a report based on the first test and the production data.

[0012] In some embodiments, the transmission device outputs the first identity and the test result of the first test to the data processing device to generate a report.

[0013] In some embodiments, when the first test device finishes the first test, the transmission device takes out the first memory device from the first test device and removes the second identity of the first test device from the first table, which records multiple identities of multiple test devices that have not tested the first memory device.

[0014] In some embodiments, the system further includes a second test device. The second test device performs a second test on the first memory device. The transmission device transmits the first memory device from the first test device to the second memory device according to the first table.

[0015] In some embodiments, the transmission device records the first test in a second table when the first test device outputs a first test result indicating that the first memory device has failed the first test, and records the second test in a second table when the second test device outputs a second test result indicating that the first memory device has failed the second test.

[0016] In some embodiments, the transmission device determines whether the first test device operates normally through a camera.

[0017] In some embodiments, when the first test device operates normally and outputs a first test result indicating that the first memory device fails the first test, the transmission device determines that the first memory device is defective.

[0018] In some embodiments, a first test device performs a first test on a plurality of second memory devices and a data processing device stores a table. When a transmission device determines that a tested second memory device among the second memory devices is defective, the data processing device records the tested second memory device in the table. The data processing device generates a yield of the second memory devices according to the table.

[0019] In some embodiments, the data processing device stores a plurality of wafer acceptance test data, wafer probe test data and final test data of the second memory devices, and determines the homogeneity among a plurality of defective memory devices in the second memory devices according to the wafer acceptance test data, wafer probe test data and final test data.

[0020] In some embodiments, a method for testing a memory device is provided. The method includes: transmitting a plurality of memory devices between a plurality of test devices through a transmission device to perform a plurality of tests on the memory devices; when a first test device among the test devices outputs a result indicating that a first memory device among the memory devices has failed a first test among the tests, determining whether the first test device operates normally through the transmission device; when the first test device operates normally and the first memory device has failed the first test, determining that the first memory device is defective and outputting the identity of the first memory device to a data processing device; generating a report through the data processing device based on the result and wafer acceptance test data, wafer probe test data, and final test data corresponding to the identity; and classifying the first memory device according to the report and transmitting the first memory device to a recycling tank according to the classification.

[0021] In some embodiments, determining whether the test device operates normally includes: capturing an image of the first test device through a camera of the transmission device; and determining whether the test device operates normally according to the image.

[0022] In some embodiments, the method further includes: when the first memory device is defective, transmitting the first memory device to an identity reading device to read the identity stored in the first memory device; and outputting the identity to a data processing device through the identity reading device to record that the first memory device is defective. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The aspects of one embodiment of the present invention will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0024] Figure 1 is a schematic diagram of a system according to some embodiments of the present disclosure;

[0025] Figure 2 is a schematic diagram of a system according to some embodiments of the present disclosure;

[0026] Figure 3 According to some embodiments, Figure 1 and Figure 2 Schematic diagram of the system;

[0027] Figure 4 According to some embodiments, Figures 1 to 3 A schematic diagram of the system; and

[0028] Figure 5 is a flow chart of a method according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0029] The following disclosure provides many different embodiments or examples for realizing the different features of the subject matter provided. The following describes specific examples of components and arrangements to simplify an embodiment of the present invention. Of course, these are merely examples and are not intended to be limiting. For example, forming a first feature above or on a second feature in the following description may include an embodiment in which the first and second features are directly contacted, and may also include an embodiment in which additional features are formed between the first and second features so that the first and second features may not be in direct contact. In addition, the present disclosure may repeat component symbols or letters in various examples. This repetition is for simplicity and clarity purposes and does not itself specify the relationship between the various embodiments or configurations discussed.

[0030] The terms used in this specification generally have their ordinary meaning in the art and in the specific context in which each term is used. The use of examples in this specification, including examples of any term discussed herein, is illustrative only and in no way limits the scope and meaning of an embodiment of the case or any exemplary term. Likewise, an embodiment of the case is not limited to the various embodiments given in this specification.

[0031] The words “include,” “including,” “have,” “contain,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0032] The reference to "one embodiment" or "some embodiments" in the specification means that the specific features, structures, implementations or characteristics described in the embodiment are included in at least one embodiment of the present invention. Therefore, when "in one embodiment" or "in some embodiments" is mentioned in different places in the specification, it does not necessarily refer to the same embodiment. These features, structures, implementations or characteristics can be combined into one or more embodiments in any suitable manner.

[0033] Further, for ease of description, spatially relative terms such as "below," "under," "below," "above," and "above" may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0034] As used herein, "approximately", "about", "approximately" or "substantially" shall generally refer to any approximation of a given value or range, where it varies depending on the various fields involved, and its scope shall be consistent with the broadest interpretation understood by those skilled in the art to cover all such modifications and similar structures. In some embodiments, it shall generally refer to within 20 percent of a given value or range, preferably within 10 percent, and more preferably within 5 percent. The numerical values ​​given herein are approximate, meaning that if not explicitly stated, the terms "approximately", "about", "approximately" or "substantially" can be inferred, or other approximate values ​​are meant.

[0035] Please refer to Figure 1 and Figure 2 . Figure 1 and Figure 2 1 is a schematic diagram of a system 100 according to some embodiments of the present disclosure. To illustrate, the system 100 includes a transmission device 110 , a test device 120 , and a data processing device 130 .

[0036] According to some embodiments of the present disclosure, the transmission device 110 is a movable machine / robot for transmitting a memory device (e.g., a static random-access memory (SRAM) or a dynamic random-access memory (DRAM)) to the test device 120. In some embodiments, when the test device 120 finishes testing the memory device, the data processing device 130 generates a report based on the test results output by the test device 120. More relevant details will be described below.

[0037] like Figure 1 As shown, in some embodiments, the transmission device 110 includes a processor 111, a storage device 112, a communication device 113, a camera 114, and a robotic arm 115. The processor 111 is coupled to the storage device 112, the communication device 113, the camera 114, and the robotic arm 115.

[0038] The test device 120 includes a processor 121, a test platform 122, a communication device 123, and a display device 124. The processor 121 is coupled to the test platform 122, the communication device 123, and the display device 124. The communication device 113 is connected to the communication device 123 via communication.

[0039] The data processing device 130 includes a processor 131, a storage device 132, and a communication device 133. The processor 131 is coupled to the storage device 132 and the communication device 133. The communication device 113 is connected to the communication device 133 via communication.

[0040] In some embodiments, the test device 120 is a programmable test machine for testing memory. In some embodiments, the test device 120 includes a computer, a tablet computer, a smart phone, or any suitable electronic device that needs to be installed with memory to operate.

[0041] In some embodiments, to perform a test on the memory device, the transfer device 110 transfers the memory device to the test device 120 and places the memory device on the test platform 122 of the test device 120. In some embodiments, the transfer device 110 places the memory device on the test platform 122 via the robot arm 115 to couple the memory device to the pins of the test platform 122. Then, when the memory device is coupled to the test device 120, the test device 120 performs the test.

[0042] In some embodiments, when the test device 120 operates with the memory device, the test device 120 performs a test. In the test, the test device 120 repeatedly performs the same operation for a period of time. In some embodiments, when the test device 120 fails and cannot correctly perform the operation, the processor 121 determines that the memory device has failed the test. In practice, the operations repeatedly performed in the test may be, for example, a sleep operation, a reboot operation, an idle operation, a memory read / write operation, a three-dimensional scene rendering operation, etc.

[0043] In some embodiments, when the test device 120 finishes the test, the test device 120 outputs the test result to the transmission device 110. In some embodiments, the test result indicates whether the memory device passes the test. For example, when the test device 120 determines that the memory device fails the test, the test device 120 outputs the test result indicating that the test fails to the transmission device 110.

[0044] According to some embodiments, when the transmission device 110 receives a test result indicating that the memory device has failed the test, the transmission device 110 determines whether the test device 120 operates normally or whether the memory device is defective.

[0045] In some embodiments, the camera 114 captures an image of the test device 120 and the processor 111 determines whether the test device 120 is operating normally based on the image. When the processor 111 detects an abnormality in the image, the processor 111 determines that the test device 120 is operating abnormally. According to different embodiments, the abnormality may be a wrong connection of a line / wire, a damaged hardware structure, or a test platform being shielded by foreign objects (such as dust). In some embodiments, the processor 111 determines that the test device 120 is operating abnormally when the display device 124 is black or distorted.

[0046] In some embodiments, the robot arm 115 is also used to determine whether the test device 120 is operating normally. For example, the robot arm 115 detects the torque value of the valve used to clamp the storage device. When the torque value is not within a preset range, the processor 111 determines that the test device 120 is not operating normally. In some embodiments, the robot arm 115 detects the depth of the screw. Similarly, when the depth exceeds the preset range, the processor 111 determines that the test device is not operating normally.

[0047] According to some embodiments, when the test device 120 does not function properly, the robot arm 115 is also used to repair the test device 120. For example, the robot arm 115 tightens the screw until the depth of the screw is within a preset range. In some embodiments, after the robot arm 115 repairs the test device 120, the transmission device 110 controls the test device 120 to perform the test on the memory device again.

[0048] In some embodiments, when the transmission device 110 receives a test result from the testing device 120 indicating that the memory device has failed the test and the processor 111 determines that the testing device 120 operates normally (eg, no abnormality is found in the image), the processor 111 determines that the memory device is defective.

[0049] In some embodiments, the storage device 112 stores the test results and the determination result of whether the test device 120 operates normally or whether the memory device is defective.

[0050] In some embodiments, when the test is finished, the transmission device 110 outputs the memory device's identity (ID), the test result, and the determination result of whether the test device 120 operates normally or whether the memory device is defective to the data processing device 130 to store the result in the storage device 132. In practice, the identity includes the production batch number of the memory device.

[0051] According to different embodiments, the data processing device 130 further stores IDs of multiple memory devices and production data corresponding to the IDs. In some embodiments, the production data includes parameters and process records of wafer manufacturing and packaging processes.

[0052] In some embodiments, the production data includes wafer acceptance test (WAT) data, wafer probing data, and final test data. In some embodiments, the WAT data includes test results of basic electronic parameters of the wafer (e.g., surface resistance of the metal layer). In some embodiments, the wafer probing data includes results of wafer probe tests for testing the functionality (e.g., reading and writing) of the wafer of the memory device. In some embodiments, the final test data includes functional test results of the packaged wafer of the memory device. In some embodiments, the data transfer rate of the memory device in the final test is set faster than the data transfer rate in the wafer probe test.

[0053] In some embodiments, when the processor 111 determines that the memory device is defective, the transmission device 110 outputs the ID of the memory device and the test result to the data processing device 130 to generate a report to determine why the memory device fails the test.

[0054] Next, the processor 131 obtains the production data of the memory device from the storage device 132 according to the ID of the memory device. For example, the processor 131 obtains the wafer probe data including the ID. The processor 131 generates a report according to the ID of the memory device, the test result and the production data.

[0055] In some embodiments, the storage devices 112 and 132 include any fixed or removable random access memory, read-only memory (ROM), flash memory, or similar elements or combinations thereof.

[0056] like Figure 2 As shown, in some embodiments, the system 100 further includes a plurality of test devices 120 (labeled as 120 a - 120 c ). Each of the test devices 120 a - 120 c is communicatively connected to the communication device 113 .

[0057] In some embodiments, the test devices 120a-120c each perform a different test from the other. For example, the test device 120a performs a standby operation test, the test device 120b performs a restart operation test, and the test device 120c performs an idle operation test.

[0058] In order to correctly transfer the memory device to each test device 120 (test devices 120a-120c), the transfer device 110 records the test device 120 that has not tested the memory device. In some embodiments, the storage device 112 stores a list of the test devices 120 that have tested the memory device. When the test device 120 finishes the test, the processor 111 removes the ID of the test device 120 from the list.

[0059] For example, when the test device 120a finishes executing the test, the transmission device 110 takes out the memory device from the test device 120a and removes the ID of the test device 120a from the list. Then, the transmission device 110 transmits the memory device to the test device 120b recorded in the list and places the memory device on the test platform 122 of the test device 120b to execute the test.

[0060] In various embodiments, the storage device 112 stores a table that records the IDs of the test devices 120 that have performed tests on the memory device. The transmission device 110 transmits the memory device to each test device 120 according to the table.

[0061] According to some embodiments, the transmission device 110 records the failed test of the memory device in the memory device 112. For example, when the memory device fails the test of the test device 120a, the transmission device 110 records the test of the test device 120a in the failed test list of the memory device. Similarly, when the memory device fails the test of the test device 120b, the transmission device 110 records the test of the test device 120b in the failed test list of the memory device.

[0062] According to some embodiments, in operation, when the list of test devices 120 that have not tested the memory device is empty, the transmission device 110 determines that the test of the test device 120 (120a-120c) is completed.

[0063] In some embodiments, when all test devices 120 finish testing, the transmission device outputs the memory device ID and the test results of the test devices 120 and the determination result of whether the memory device has defects for each test / test device 120 to the data processing device 130 to generate a report.

[0064] In some embodiments, the data processing device 130 generates a report in response to the transmission device 110 determining that the memory device has a defect for the test of the at least one test device 120. The data processing device 130 generates the report based on the production data and the test result of the at least one test, for example, based on the test result of the test device 120a.

[0065] Figure 1 and Figure 2The configuration is given for illustrative purposes. Figure 1 and Figure 2 For example, in some embodiments, the system 100 further includes a display device to display the report generated by the data processing device 130 .

[0066] Please refer to Figure 3 . Figure 3 According to some embodiments, Figure 1 and Figure 2 Schematic diagram of system 300 of system 100. Figure 1 and Figure 2 For ease of understanding, Figure 3 Similar components in the present invention are marked with the same reference numerals. For the sake of brevity, the specific operations of similar components that have been discussed in detail in the above paragraphs are omitted herein.

[0067] Compared to Figure 1 and Figure 2 The system 100, the system 300 further includes an ID reading device 140. The ID reading device 140 is used to identify the ID of the memory device. In some embodiments, when the transmission device 110 determines that the memory device is a defective product, the transmission device 110 transmits the memory device to the ID reading device 140 to read the ID of the memory device.

[0068] like Figure 3 As shown, in some embodiments, the identity reading device 140 includes a processor 141, a test platform 142, and a communication device 143. The processor 141 is coupled to the test platform 142 and the communication device 143. The communication devices 113 and 143 are communicatively connected to each other.

[0069] In some embodiments, the transmission device 110 transmits the memory device to the ID reading device 140 and places the memory device on the test platform 142. The processor 141 then reads the ID stored in the memory device and outputs the ID to the transmission device 110. The transmission device 110 then outputs the ID and the test result to the data processing device 130 to generate a report.

[0070] According to different embodiments, the processors 111, 121, 131 and 141 are a central processing unit (CPU), or other programmable general-purpose or special-purpose microcontrol unit (MCU), microprocessor, digital signal processor (DSP), programmable controller, application specific integrated circuit (ASIC), graphics processing unit (GPU), arithmetic logic unit (ALU), complex programmable logic device (CPLD), field programmable gate array (FPGA) or other similar components or combinations of the above components.

[0071] In some embodiments, the communication devices 113, 123, 133, and 143 include wireless devices based on IEEE 802.11 (e.g., Wi-Fi), Bluetooth, ZigBee, near-field communication (NFC), or other suitable wireless communication standards. In different embodiments, the communication device 113 includes a wireless device based on Ethernet, universal serial bus (USB), or

[0072] Wired devices of other suitable wired communication standards.

[0073] Figure 3 The configuration is given for illustrative purposes. Figure 3 Various implementations are within the contemplated scope of the present disclosure. For example, in some embodiments, the system 300 further includes a plurality of test devices 120, such as Figure 2 The test devices 120a-120c in.

[0074] Please refer to Figure 4 . Figure 4 According to some embodiments, Figure 1 and Figure 2 System 100 and corresponding Figure 3 Schematic diagram of system 400 of system 300. Figures 1 to 3 For ease of understanding, Figure 4Similar components in the present invention are marked with the same reference numerals. For the sake of brevity, the specific operations of similar components that have been discussed in detail in the above paragraphs are omitted herein.

[0075] Compared to Figure 3 The communication device 133 of the system 300 , the communication device 133 of the system 400 is communicatively connected to the communication device 143 instead of being connected to the communication device 113 .

[0076] In some embodiments, when the test is finished, the transmission device 110 transmits the memory device to the ID reading device 140 and outputs the test results and the determination result of whether the memory device is defective for each test to the ID reading device 140. Then, the ID reading device 140 reads the ID of the memory device.

[0077] After the ID is read, the identity reading device outputs the ID, the test results, and the determination result of whether each test is defective by the memory device to the data processing device 130 through the communication device 143 to generate a report.

[0078] Figure 4 The configuration is given for illustrative purposes. Figure 4 Various implementations are within the contemplated scope of the present disclosure. For example, in some embodiments, the system 400 further includes a plurality of test devices 120, such as Figure 2 The test devices 120a-120c in.

[0079] Please refer to Figure 5 , Figure 5 is a flow chart of a method 500 according to some embodiments of the present disclosure. Figure 5 More operations may be provided before, between, and after the operations shown. Also, for other embodiments of method 500, some of the operations described below may be replaced or removed. At least some of the operations in method 500 may be used to perform operations such as Figures 1 to 4 The systems 100, 300 and 400 in FIG. The method 500 includes operations 501-504, which will be discussed below.

[0080] For reference Figures 1 to 4 In operation 501, the transfer device 110 transfers a plurality of memory devices between the test devices 120 (120a-120c) to perform tests on the memory devices.

[0081] In operation 502, the test device 120a performs a first test on a first memory device among the plurality of memory devices and outputs a first test result to the transmission device 110. When the first test result indicates that the first memory device fails the first test, the transmission device 110 determines whether the test device 120a operates normally.

[0082] In some embodiments, the camera 114 captures an image of the testing device 120 a and determines whether the testing device 120 a operates normally based on the image.

[0083] In operation 503 , when the testing device 120 a operates normally and the first memory device fails the first test, the transmission device 110 determines that the first memory device is defective and the ID of the first memory device is output to the data processing device 130 .

[0084] In some embodiments, when the first memory device is defective, the transmission device 110 transmits the first memory device to the ID reading device 140 to read the ID stored in the first memory device. Then, the ID reading device 140 outputs the ID of the first memory device to the data processing device 130 to record the first memory device as a defective product.

[0085] In operation 504 , the data processing device 130 generates a report according to the first test result and the WAT data corresponding to the ID of the first memory device, the wafer probe data, and the final test data.

[0086] In some embodiments, the storage device 132 stores the location data of the chips of the memory device in the corresponding wafer. In some embodiments, the data processing device 130 generates a report with the location data of the chips of the first memory device according to the ID of the first memory device. The location data indicates the location of the chip corresponding to the ID of the first memory device in the wafer.

[0087] In some embodiments, the storage device 132 further stores a memory device table corresponding to each test device 120 to generate a yield of the memory devices corresponding to each test device 120. For example, when the first memory device fails the test of the test device 120a and is determined to be a defective product, the data processing device 130 records the ID of the first memory device in the memory device table corresponding to the test device 120a. The data processing device 130 generates a yield of the memory device for the test of the test device 120a based on the memory device table of the test device 120a. For example, the yield is the number of IDs recorded in the memory device table divided by the total number of memory devices.

[0088] In some embodiments, when one of the memory devices is determined to be defective, the data processing device 130 records the ID of the defective memory device in a defective memory device table stored in the storage device 132. The data processing device 130 determines the homogeneity (sameness) of the production data of the memory devices recorded in the defective memory device table. For example, the data processing device 130 may determine that the results of wafer acceptance tests of a plurality of memory devices corresponding to the test device 120a as defective are similar to each other.

[0089] In some embodiments, when the memory device has a defect, the data processing device 130 determines the cause of the memory device defect based on the homogeneity. For example, when the first memory device and the defective memory device with a wafer production process error have similar production data and test results, the data processing device 130 may determine that the defect of the first memory device is caused by the wafer production process error. In some embodiments, the data processing device 130 records the number of occurrences of each defect cause and records the most frequently occurring defect cause in the report generated by the data processing device 130.

[0090] In some embodiments, the first memory device is classified according to the report. For example, when the first memory device is determined to have a defect caused by a first reason, the transmission device 110 transmits the first memory device to a first recycling tank. Similarly, when the first memory device is determined to have a defect caused by a second reason different from the first reason, the transmission device 110 transmits the first memory device to a second recycling tank.

[0091] In some embodiments, at least one second memory device is produced according to the report. In some embodiments, at least one second memory device is produced according to the defect cause recorded in the report. Specifically, for example, the data processing device 130 determines the homogeneity between multiple defective memory devices and generates a report indicating that these defective memory devices are packaged by the same packaging machine. Then, the packaging machine is adjusted according to the report and at least one second memory device is produced after the packaging machine is adjusted.

[0092] As described above, the present disclosure provides a system and method for testing memory devices. The transmission device of the system generates a judgment result of whether the test device is defective and the data processing device of the system stores the result and generates a report including the yield of the memory device, the homogeneity of the defective memory device, production data and defect cause analysis. This report helps improve the wafer production process, mask design and circuit design of the memory device.

[0093] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of an embodiment of the present invention. Those skilled in the art should understand that an embodiment of the present invention can be easily used as a basis for designing or modifying other processes and structures to implement the same purpose and / or achieve the same advantages of the embodiments introduced in the present invention. Those skilled in the art should also recognize that such equivalent structures do not depart from the spirit and scope of an embodiment of the present invention, and various changes, substitutions and modifications can be performed in an embodiment of the present invention without departing from the spirit and scope of an embodiment of the present invention.

[0094]

Explanation of symbols

[0095] 100: System

[0096] 110: Transmission device

[0097] 111: Processor

[0098] 112: Storage device

[0099] 113: Communication device

[0100] 114: Camera

[0101] 115:Robotic Arm

[0102] 120: Test device

[0103] 120a: Test device

[0104] 120b: Test device

[0105] 120c: Test device

[0106] 121: Processor

[0107] 122:Test Platform

[0108] 123: Communication device

[0109] 124: Display device

[0110] 130: Data processing device

[0111] 131: Processor

[0112] 132: Storage device

[0113] 133:Communication device

[0114] 140: Identity reading device

[0115] 141: Processor

[0116] 142:Test Platform

[0117] 143: Communication device

[0118] 500:Method

[0119] 501-505: Operation.

Claims

1. A system for testing a memory device, characterized in that: Include: a plurality of test devices for performing a plurality of tests different from each other on the memory device and outputting a plurality of test results of the plurality of tests; A transmission device, used for transmitting the memory device to the plurality of test devices, and comprising: A first storage device for storing the plurality of test results and a table of the plurality of test devices for testing a portion of the memory device; and A data processing device is used to store production data of the memory device, wherein when the transmission device determines that the memory device is defective based on at least one of the multiple test results, the data processing device is also used to generate a report based on the at least one of the multiple test results and the production data.

2. The system according to claim 1, wherein the transmission device further comprises: a camera for capturing an image of a first test device among the plurality of test devices, The transmission device is further configured to determine, based on the image, that the first test device or the memory device is defective in response to a first test result among the plurality of test results indicating that the memory device fails a first test among the plurality of tests.

3. The system according to claim 2, wherein: Also includes: an identity reading device, wherein when the transmission device determines that the memory device is defective, the transmission device transmits the memory device to the identity reading device, wherein the identity reading device identifies the identity of the memory device and outputs the identity to the data processing device, The data processing device obtains the production data from the second storage device of the data processing device to generate the report. 4 . The system of claim 3 , wherein the data processing device is further configured to generate the report having location data of the die of the memory device, the location data indicating the location of the die corresponding to the identity in a wafer.

5. The system according to claim 3, wherein when the memory device is defective, the data processing device is further used to record the memory device in a list of multiple memory devices that failed the test and determine the homogeneity between multiple production data of the multiple memory devices that failed the test. 6 . The system according to claim 5 , wherein when the memory device is defective, the data processing device is further configured to determine a cause of the defect of the memory device based on the homogeneity.

7. The system of claim 1, wherein the production data includes wafer acceptance test data, wafer probe test data, and final test data, the final test data indicating test results of packaged wafers in the memory device.

8. The system of claim 1, wherein the transmission device is further configured to transmit the memory device to each of the plurality of test devices to execute a corresponding one of the plurality of tests according to the table.

9. A system for testing a memory device, characterized in that: Include: a first test device for performing read and write operations on a first memory device to perform a first test on the first memory device; a transmission device, used for placing the first memory device on a test platform of the first test device; as well as The data processing device is used to store the first identity of the first memory device and the production data corresponding to the first identity, and to generate a report according to the first test and the production data. 10 . The system of claim 9 , wherein the transmission device is further configured to output the first identity and the test result of the first test to the data processing device to generate the report.

11. The system according to claim 9, wherein when the first test device finishes the first test, the transmission device is further used to take out the first memory device from the first test device and remove the second identity of the first test device from the first table, The first table records multiple identities of multiple testing devices that have not tested the first memory device.

12. The system according to claim 11, wherein: Also includes: a second test device, further configured to perform a second test on the first memory device, The transmission device is further used for transmitting the first memory device from the first test device to the second test device according to the first table.

13. The system of claim 12, wherein the transmission device is further configured to record the first test in a second table when the first test device outputs a first test result, wherein the first test result indicates that the first memory device has failed the first test, and When the second test device outputs a second test result, the second test is recorded in the second table, wherein the second test result indicates that the first memory device fails the second test.

14. The system according to claim 9, wherein the transmission device is further used to determine whether the first test device operates normally through a camera.

15. The system of claim 14, wherein when the first test device operates normally and outputs a first test result indicating that the first memory device has failed the first test, the transmission device determines that the first memory device is defective.

16. The system according to claim 15, wherein the first test device is further configured to perform the first test on a plurality of second memory devices and the data processing device is further configured to store a table, When the transmission device determines that a tested second memory device among the plurality of second memory devices is defective, the data processing device records the tested second memory device in the table, The data processing device is further configured to generate yields of the plurality of second memory devices according to the table.

17. The system according to claim 16, wherein the data processing device is further configured to store a plurality of wafer acceptance test data, wafer probe test data and final test data of the plurality of second memory devices, The data processing device is further configured to determine the homogeneity between multiple defective memory devices in the multiple second memory devices according to the multiple wafer acceptance test data, wafer probe test data and final test data.

18. A method for testing a memory device, characterized in that: Include: Transferring a plurality of memory devices between a plurality of test devices by a transfer device to perform a plurality of tests on the plurality of memory devices; when a first test device among the plurality of test devices outputs a result indicating that the first memory device among the plurality of memory devices has failed a first test among the plurality of tests, determining by the transmission device whether the first test device operates normally; When the first test device operates normally and the first memory device fails the first test, determining that the first memory device is defective and outputting the identity of the first memory device to a data processing device; generating a report by the data processing device according to the result and the wafer acceptance test data, wafer probe test data and final test data corresponding to the identity; as well as The first storage device is classified according to the report and the first storage device is transferred to a recycle bin according to the classification.

19. The method of claim 18, wherein determining whether the test device operates normally comprises: capturing an image of the first testing device by a camera of the transmission device; and Whether the testing device operates normally is determined according to the image.

20. The method according to claim 18, wherein: Also includes: When the first memory device is defective, transmitting the first memory device to an identity reading device so as to read the identity stored in the first memory device; as well as The identity is output to the data processing device through the identity reading device to record that the first memory device is defective.

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