High-low voltage power distribution cabinet heat dissipation structure and power distribution cabinet

By setting movable components on the side panel of the distribution cabinet, the heat dissipation area of ​​the heat dissipation port can be adjusted, which solves the problem of poor heat dissipation effect of the distribution cabinet at high loads and improves the heat dissipation efficiency.

CN119905918APending Publication Date: 2025-04-29ANHUI ZHONGYI ELECTRICAL EQUIP CO LTD
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Patent Information

Application Number
CN202510067297.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-16
Publication Date
2025-04-29

AI Technical Summary

Technical Problem

Once the heat dissipation port of the existing distribution cabinet is fixed, the heat dissipation area cannot be adjusted, resulting in poor heat dissipation effect when the electrical equipment is running at high load.

Method used

A high and low voltage distribution cabinet heat dissipation structure is designed. By providing components that can move up and down on the side panel of the distribution cabinet, the heat dissipation area of ​​the heat dissipation port becomes larger as the parts are relatively far away, so that the heat dissipation area can be adjusted.

Benefits of technology

The heat dissipation efficiency of the distribution cabinet at high load is improved, and the heat dissipation effect is further improved by combining air cooling and water cooling.

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Abstract

The invention discloses a high-low voltage power distribution cabinet heat dissipation structure and a power distribution cabinet, and particularly relates to the field of power distribution cabinet heat dissipation structures, the high-low voltage power distribution cabinet heat dissipation structure comprises a power distribution cabinet side plate, the power distribution cabinet side plate comprises a first component and a second component which can relatively move up and down, any one of the first component and the second component is fixed with a power distribution cabinet bottom plate, and the other one is fixed with a power distribution cabinet top plate; the heat dissipation opening is formed in the side plate of the power distribution cabinet, the heat dissipation area of the heat dissipation opening is increased along with the relative separation of the first component and the second component, the first component is a batch of single plates fixed to the bottom plate of the power distribution cabinet, the second component is another batch of single plates fixed to the top plate of the power distribution cabinet, and the first component and the second component are arranged in a staggered mode; according to the invention, the heat dissipation efficiency of the power distribution cabinet under high load is improved by designing a structure with an adjustable heat dissipation area, and the heat dissipation efficiency is further improved by combining air cooling and water cooling with a cooling pipeline laying system with a freely adjustable path.
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Description

Technical Field

[0001] The present invention relates to the field of heat dissipation structures of power distribution cabinets, and more specifically, to a heat dissipation structure of high and low voltage power distribution cabinets and a power distribution cabinet. Background Art

[0002] It is an electrical device used for power distribution and management inside buildings. It can control, protect and monitor the operation of the power system to ensure the stability and safety of power supply.

[0003] Once the heat dissipation port of the power distribution cabinet is stamped, the heat dissipation area cannot be adjusted. When the electrical equipment in the power distribution cabinet is running at high load, the heat dissipation effect is poor. Summary of the invention

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a high and low voltage power distribution cabinet heat dissipation structure and a power distribution cabinet. The technical problem to be solved by the present invention is: how to improve the heat dissipation effect of the power distribution cabinet.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat dissipation structure of a high and low voltage distribution cabinet and a distribution cabinet, including a side panel of the distribution cabinet, including a component one and a component two that can move up and down relatively, either component one or component two is fixed to the bottom panel of the distribution cabinet, and the other is fixed to the top panel of the distribution cabinet; a heat dissipation port is opened on the side panel of the distribution cabinet, and the heat dissipation area of ​​the heat dissipation port increases as component one and component two are relatively far away from each other.

[0006] In a preferred embodiment, component one is cover plate one, component two is cover plate two, cover plate one and cover plate two can slide up and down, cover plate one covers the side of cover plate two, when cover plate one and cover plate two move relative to each other, the heat dissipation openings respectively located on cover plate one and cover plate two can be aligned or staggered with each other.

[0007] In a preferred embodiment, component one is a batch of single boards fixed to the bottom plate of the power distribution cabinet, component two is another batch of single boards fixed to the top plate of the power distribution cabinet, and component one and component two are arranged alternately; the heat dissipation port includes a single port and an open and closed port, the single port is opened on each single board, and the open and closed port is the space generated by the interlacing when component one and component two move relative to each other, and the space becomes larger as component one and component two move away from each other.

[0008] In a preferred embodiment, an elastic grid is arranged at the opening and closing mouth, the top edge of the elastic grid at the bottom is connected to component two, and the bottom edge hangs freely, the bottom edge of the elastic grid at the top is connected to component one, and the top edge is blocked by the top panel of the distribution cabinet.

[0009] In a preferred embodiment, component one and component two are fixed by a pin.

[0010] In a preferred embodiment, component one and component two are connected by a damping sliding connection.

[0011] In a preferred embodiment, a cooling pipe laying system is provided on both component one and component two, each cooling pipe laying system includes a rotatable pipe, several pipes can form a coolant circuit, the pipes located at the two ends are connected to the corresponding external coolant supply sources, and two adjacent pipes are connected through pipe joints.

[0012] In a preferred embodiment, the cooling pipe laying system further comprises a crossbeam and a clamp, the crossbeam is connected to the corresponding component one and component two, the clamp is rotatably connected to the crossbeam, and the pipe is detachably connected to the clamp.

[0013] In a preferred embodiment, the cooling pipe laying system also includes a crossbeam, a clamp and a slider. The crossbeam is connected to the corresponding component one and component two. The clamp is rotatably connected to the slider. The slider is slidably connected to a slide groove opened in the crossbeam, and the pipe is detachably connected to the clamp.

[0014] A power distribution cabinet is provided with any of the above-mentioned heat dissipation structures.

[0015] Technical effects and advantages of the present invention:

[0016] The present invention improves the heat dissipation efficiency of the distribution cabinet under high load by designing a structure with adjustable heat dissipation area, and at the same time, it is matched with a cooling pipe laying system with freely adjustable paths to combine air cooling and water cooling to further improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide further understanding of the technical solutions of the present invention and constitute a part of the present invention. The embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0018] Figure 1 It is a structural diagram of a heat dissipation structure of a high and low voltage distribution cabinet in the present invention.

[0019] Figure 2 It is a schematic diagram of the stacking state of the cover plate 1 and the cover plate 2 in the present invention.

[0020] Figure 3 It is a schematic diagram of the staggered rising of single plates in the present invention.

[0021] Figure 4 It is a schematic diagram of the structure of the cooling pipe laying system in the present invention.

[0022] Figure 5 for Figure 4 A is an enlarged view of the middle image.

[0023] Figure 6It is a schematic diagram of the layout position of the slider in the present invention.

[0024] Figure 7 It is a schematic diagram of one of the cooling pipe laying forms in the present invention.

[0025] Figure 8 It is a schematic diagram of another cooling pipe laying form in the present invention.

[0026] The figures are marked as follows: 10, side panel of distribution cabinet; 11, cover plate one; 12, cover plate two; 13, single board; 20, heat dissipation port; 21, single port; 22, opening and closing port; 30, cooling pipe laying system; 31, crossbeam; 32, clamp; 33, pipe; 34, slider. DETAILED DESCRIPTION

[0027] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that the description of the present disclosure will be more comprehensive and complete and the concepts of the example embodiments will be fully conveyed to those skilled in the art. The accompanying drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0028] In addition, the described features, structures or characteristics may be combined in one or more example embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the example embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced while omitting one or more of the specific details, or other methods, components, steps, etc. may be adopted. In other cases, well-known structures, methods, implementations or operations are not shown or described in detail to avoid obscuring various aspects of the present disclosure.

[0029] Example 1

[0030] like Figure 1 , Figure 2 A heat dissipation structure of a high and low voltage distribution cabinet comprises a distribution cabinet side panel 10 and a heat dissipation port 20. The heat dissipation port 20 is provided in the distribution cabinet side panel 10 for heat dissipation.

[0031] The side panel 10 of the distribution cabinet includes a cover plate 11 and a cover plate 12, which are slidably connected to each other. The cover plate 11 and the cover plate 12 are both provided with heat dissipation openings 20. When the cover plate 11 and the cover plate 12 slide relatively, the heat dissipation openings 20 located on the cover plate 11 and the cover plate 12 are aligned or staggered to achieve the purpose of adjusting the heat dissipation area.

[0032] Preferably, when the cover plate 1 11 and the cover plate 2 12 completely slide to the end of the movable path, the heat dissipation openings 20 on the cover plate 1 11 and the cover plate 2 12 are completely aligned, and this is the moment when the heat dissipation area is the largest; correspondingly, when the cover plate 1 11 and the cover plate 2 12 are in the initial state, the heat dissipation openings 20 on the cover plate 1 11 and the cover plate 2 12 are only generally aligned, and the heat dissipation area is half of the heat dissipation openings 20.

[0033] It should be noted that the cover plate 11 is fixed to the bottom plate of the distribution cabinet, the cover plate 2 12 is fixed to the top plate, the cover plate 11 and the cover plate 2 12 are controlled by a hydraulic cylinder, the cylinder seat of the hydraulic cylinder is fixed on the bottom plate, the telescopic rod of the hydraulic cylinder is fixedly connected to the cover plate 2 12, and the specific structure and operation logic of the hydraulic cylinder are existing technologies, so they are not repeated here.

[0034] The advantage of this design is that when the load of electrical equipment in the distribution cabinet is small, in addition to ensuring normal heat dissipation requirements, the heat dissipation area can be appropriately reduced to reduce the volume of dust entering the distribution cabinet with the airflow.

[0035] Example 2

[0036] like Figure 1 , Figure 3 , Figure 4 The side panel 10 of the distribution cabinet is composed of a number of slidingly connected single plates 13, wherein some of the single plates 13 arranged at intervals are fixedly connected to the bottom plate of the distribution cabinet, and another part of the single plates 13 are fixedly connected to the top plate of the distribution cabinet, and the single plates 13 connected to the bottom plate and the single plates 13 connected to the top plate are staggered.

[0037] For the convenience of description, the single board 13 connected to the bottom panel is defined as a lower single board 13 , and the single board 13 connected to the top panel is defined as an upper single board 13 .

[0038] The upper single plate 13 is driven by a hydraulic cylinder, a cylinder seat of the hydraulic cylinder is fixed on the bottom plate, and a telescopic rod of the hydraulic cylinder is fixed to the upper single plate 13. The structure and control logic of the hydraulic cylinder are prior art, so they are not described in detail.

[0039] The heat dissipation port 20 includes a single port 21 and an opening and closing port 22. A plurality of single ports 21 are provided on the upper and lower single plates 13. When the upper and lower single plates 13 slide relative to each other, the space formed between the bottom plate and the top plate is the opening and closing port 22. As the displacement of the upper and lower single plates 13 increases, the opening area of ​​the opening and closing port 22 gradually increases to achieve the effect of adjustable heat dissipation area.

[0040] Preferably, a grid is laid on the opening 22 .

[0041] Preferably, the grid is made of elastic material and can be curled. The grid located at the bottom is fixed to the bottom of the upper single board 13, and the grid located at the top is fixed to the lower single board 13. When the upper and lower single boards 13 are separated, the grid can self-adjust according to the expansion space size of the opening and closing mouth 22.

[0042] Example 3

[0043] like Figure 4-Figure 8 On the basis of Example 2, a cooling pipe laying system 30 is also designed, which is matched with the technical solution of Example 2 to further improve the heat dissipation effect of the entire distribution cabinet.

[0044] The single plate 13 is a sheet metal part with two ends bent, and the single opening 21 is formed by punching the sheet metal part.

[0045] In one case of the present embodiment, the cooling pipe laying system 30 includes a crossbeam 31, a clamp 32 and a pipe 33. The crossbeam 31 is connected to the two ends of the heat dissipation port 20 in a damping sliding manner. The crossbeam 31 is rotatably connected with the clamp 32, and the clamp 32 is snap-connected with the pipe 33. The clamp 32 is deformable, and the pipe 33 is inserted into the clamp by squeezing the pipe 33 into the clamp. When disassembly is required, the pipe 33 can be pulled out.

[0046] The clamp 32 can rotate relative to the crossbeam 31, so it can drive the pipe 33 to rotate. A cooling pipe laying system 30 is installed in each single board 13. By rotating the cooling pipe laying system 30, the following can be achieved: Figure 5 The coolant pipe layout shown in L1.

[0047] Because the position between the upper and lower single plates 13 is adjustable, the flexibility of the cooling pipe laying system 30 in path design is improved on the basis that the pipe 33 is rotatable.

[0048] It should be known that both ends of the pipe 33 are provided with threads. When connecting two pipes 33, another pipe joint with threads is used for connection. After several pipes 33 located on a single board 13 are connected, it is necessary to additionally connect the corresponding pipes 33 and the external pipe for providing coolant.

[0049] like Figure 6 As shown in L2 in FIG. 1 , the pipeline can also be designed using a three-way joint.

[0050] In another situation of this embodiment, the cooling pipe laying system 30 includes a crossbeam 31, a clamp 32, a pipe 33 and a slider 34. The crossbeam 31 is connected to the two ends of the heat dissipation port 20 in a damping sliding manner. A slide groove is provided on the crossbeam 31, and a slider 34 is slidably connected in the slide groove. The clamp 32 is rotatably connected to the slider 34, and the pipe 33 is clamped and connected to the clamp 32. The clamp 32 is deformable, and the pipe 33 is squeezed into the clamp 32 to allow the pipe 33 to be clamped into the pipe 33. When disassembly is required, the pipe 33 can be pulled out.

[0051] The cooling pipe laying system 30 can be designed to be dense at the bottom and sparse at the top so as to improve the heat dissipation efficiency for the bottom environment. Vice versa, the cooling pipe laying system 30 can be reasonably designed to flexibly adjust the local efficient heat dissipation capacity.

[0052] Working principle of the present invention:

[0053] The present invention improves the heat dissipation efficiency of the power distribution cabinet under high load by designing a structure with adjustable heat dissipation area, and at the same time, it is matched with a cooling pipe laying system 30 with freely adjustable paths to combine air cooling and water cooling to further improve the heat dissipation efficiency.

[0054] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

[0055] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0056] Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0057] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure of a high and low voltage distribution cabinet, characterized in that include: A side plate (10) of a power distribution cabinet comprises a component 1 and a component 2 which can move up and down relatively, wherein either the component 1 or the component 2 is fixed to the bottom plate of the power distribution cabinet, and the other is fixed to the top plate of the power distribution cabinet; The heat dissipation opening (20) is provided on the side plate (10) of the power distribution cabinet, and the heat dissipation area of ​​the heat dissipation opening (20) increases as the first component and the second component are relatively far away from each other.

2. The heat dissipation structure of a high and low voltage distribution cabinet according to claim 1 is characterized in that: The component one is a cover plate one (11), and the component two is a cover plate two (12). The cover plate one (11) and the cover plate two (12) can slide up and down, and the cover plate one (11) covers the side surface of the cover plate two (12). When the cover plate one (11) and the cover plate two (12) move relatively, the heat dissipation openings (20) respectively located on the cover plate one (11) and the cover plate two (12) can be aligned or staggered with each other.

3. The heat dissipation structure of a high and low voltage distribution cabinet according to claim 1 is characterized in that: The component one is a batch of single boards (13) fixed to the bottom plate of the power distribution cabinet, and the component two is another batch of single boards (13) fixed to the top plate of the power distribution cabinet. The component one and the component two are arranged alternately. The heat dissipation opening (20) comprises a single opening (21) and an opening and closing opening (22); the single opening (21) is opened on each single board (13); the opening and closing opening (22) is a space generated by the interlacing of component one and component two when they move relative to each other, and the space becomes larger as component one and component two move away from each other.

4. A heat dissipation structure for high and low voltage distribution cabinets according to claim 3, characterized in that: An elastic grid is arranged at the opening (22), the top edge of the elastic grid at the bottom is connected to component two, and the bottom edge hangs freely, and the bottom edge of the elastic grid at the top is connected to component one, and the top edge is blocked by the top plate of the distribution cabinet.

5. The heat dissipation structure of a high and low voltage distribution cabinet according to claim 3 is characterized in that: The component one and the component two are fixed by a pin shaft.

6. The heat dissipation structure of a high and low voltage distribution cabinet according to claim 3 is characterized in that: The component one and the component two are connected by damping sliding.

7. The heat dissipation structure of a high and low voltage distribution cabinet according to claim 3 is characterized in that: The first component and the second component are both provided with a cooling pipe laying system (30), each cooling pipe laying system (30) includes a rotatable pipe (33), a plurality of pipes (33) can form a cooling liquid circuit, the pipes (33) at the two ends are connected to a corresponding external cooling liquid supply source, and two adjacent pipes (33) are connected via a pipe joint.

8. The heat dissipation structure of a high and low voltage distribution cabinet according to claim 7 is characterized in that: The cooling pipe laying system (30) further comprises a crossbeam (31) and a clamp (32); the crossbeam (31) is connected to corresponding component one and component two; the clamp (32) is rotatably connected to the crossbeam (31); and the pipe (33) is detachably connected to the clamp (32).

9. The heat dissipation structure of a high and low voltage distribution cabinet according to claim 7, characterized in that: The cooling pipe laying system (30) further comprises a crossbeam (31), a clamp (32) and a slider (34); the crossbeam (31) is connected to corresponding component one and component two; the clamp (32) is rotatably connected to the slider (34); the slider (34) is slidably connected to a slide groove provided in the crossbeam (31); and the pipe (33) is detachably connected to the clamp (32).

10. A power distribution cabinet, characterized in that: A heat dissipation structure as described in any one of claims 1 to 9 is installed.

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