Heat dissipation type sound box

Abstract

The invention relates to a heat dissipation type sound box, which comprises a main shell, a loudspeaker, a first vibrating diaphragm, a second vibrating diaphragm and a main body to be subjected to heat dissipation, a sound cavity is formed in the inner side of the main shell, and the loudspeaker is connected to one side face of the main shell and communicated with the sound cavity; the first vibrating diaphragm and the second vibrating diaphragm are connected to two opposite side surfaces of the main shell and are communicated with the sound cavity; the first vibrating diaphragm, the second vibrating diaphragm, the loudspeaker and the main shell encircle the sound cavity into a closed space; and the main body to be cooled is fixedly arranged on the outer side of the main shell and is arranged corresponding to the first vibrating diaphragm or the second vibrating diaphragm. The loudspeaker, the first vibrating diaphragm and the second vibrating diaphragm are arranged, the drum paper of the loudspeaker moves back and forth when the loudspeaker works, air in the sound cavity is compressed and released, the speed of taking away heat generated by the to-be-cooled body is increased, and the purpose of rapid heat dissipation is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of speaker boxes, and in particular to a heat dissipation speaker box. Background Art

[0002] In audio products, due to the presence of the main chip and the power amplifier, a large amount of heat will be generated during the operation of the product.

[0003] The current traditional method is to dissipate heat through natural heat dissipation, but the efficiency of natural heat dissipation is low and does not meet the heat dissipation needs; or to add an independent radiator structure, but this will occupy a large space and require a high cost, which is not conducive to the development of products towards miniaturization.

[0004] Therefore, the prior art has defects and needs to be improved. Summary of the invention

[0005] The present application provides a passive diaphragm heat dissipation speaker to solve the problems that the natural heat dissipation method is inefficient and does not meet the heat dissipation requirements, and that adding an independent radiator structure will occupy a large space and require high costs.

[0006] In a first aspect, the present application provides a passive diaphragm heat dissipation speaker, comprising a main housing, a speaker, a first diaphragm, a second diaphragm and a body to be heat-dissipated;

[0007] A sound cavity is arranged inside the main shell, the speaker is connected to one side of the main shell and communicates with the sound cavity; the first diaphragm and the second diaphragm are connected to two opposite sides of the main shell and communicate with the sound cavity; the first diaphragm, the second diaphragm, the speaker and the main shell enclose the sound cavity to form a closed space;

[0008] The main body to be cooled is fixedly arranged outside the main shell and is arranged corresponding to the first diaphragm or the second diaphragm. The first diaphragm or the second diaphragm generates airflow to accelerate the flow of air at the main body to be cooled when working.

[0009] In a possible implementation manner, the heat dissipation body may include the heat sink and a PCB board group, and the PCB board group is connected to one surface of the heat sink.

[0010] In a possible implementation manner, the second diaphragm is disposed corresponding to the other surface of the heat sink.

[0011] In a possible implementation manner, the distance between the second diaphragm and the heat sink is 3-7 mm.

[0012] In a possible implementation, a rear shell may also be included, the rear shell is connected to the main shell, and the body to be cooled is arranged between the rear shell and the main shell.

[0013] In a possible implementation manner, a heat dissipation hole is provided on the rear shell adjacent to the body to be dissipated.

[0014] In a possible implementation, a front shell may be further included, the front shell being connected to a side of the main shell away from the rear shell, and the first diaphragm and the speaker being covered by the front shell.

[0015] In a possible implementation manner, a first sound outlet corresponding to the speaker and a second sound outlet corresponding to the first diaphragm are respectively formed on the front shell.

[0016] In a possible implementation, an interface group may also be included, wherein the interface group is partially disposed between the rear shell and the main shell and partially exposed on the exterior of the rear shell, and the PCB board group is electrically connected to the speaker and the interface group, respectively.

[0017] In a possible implementation manner, the body to be cooled may be disposed on the outside of the first diaphragm, and the first diaphragm is disposed corresponding to the other side of the heat sink.

[0018] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0019] In the embodiment of the present application, a speaker, a first diaphragm and a second diaphragm are arranged. When the speaker is working, the drum paper moves back and forth to compress and release the air in the sound cavity, thereby driving the movement of the first diaphragm and the second diaphragm, so that the first diaphragm and the second diaphragm push the nearby air to generate airflow, so that the airflow at the heat dissipation body located on the periphery of the first diaphragm or the second diaphragm flows, thereby accelerating the speed of carrying away the heat generated by the heat dissipation body, thereby achieving the purpose of rapid heat dissipation. At the same time, there is no need to add an independent radiator structure, which saves production costs and is conducive to the development of products in the direction of miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0023] Figure 1 A stereoscopic image from one perspective of a heat dissipation speaker provided in an embodiment of the present application.

[0024] Figure 2 It is a cross-sectional view of the main housing, the speaker, the first diaphragm and the second diaphragm according to the embodiment of the present application.

[0025] Figure 3 It is a three-dimensional diagram of the main housing, the speaker, the first diaphragm and the second diaphragm according to the embodiment of the present application.

[0026] Figure 4 A stereoscopic image from another perspective of a heat dissipation speaker provided in an embodiment of the present application.

[0027] Figure 5 A three-dimensional diagram of a heat dissipation speaker provided in an embodiment of the present application excluding the rear shell portion.

[0028] Description of reference numerals:

[0029] 1. Main shell; 2. Speaker; 3. First diaphragm; 4. Second diaphragm; 5. Main body to be cooled; 6. Sound cavity; 7. Front shell; 8. Back shell; 9. First sound outlet; 10. Second sound outlet; 11. Heat sink; 12. PCB board assembly; 13. Heat dissipation holes; 14. Interface assembly. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0031] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0032] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0033] In order to solve the technical problems in the prior art, the present application provides a passive diaphragm heat dissipation speaker, which can be realized by setting a speaker, a first diaphragm and a second diaphragm. When the speaker is working, its drum paper moves back and forth to compress and release the air in the sound cavity, thereby driving the first diaphragm and the second diaphragm to move, so that the first diaphragm and the second diaphragm push the nearby air to generate airflow, so that the airflow at the heat dissipation body located on the periphery of the first diaphragm or the second diaphragm flows, thereby accelerating the speed of taking away the heat generated by the heat dissipation body, thereby achieving the purpose of rapid heat dissipation. At the same time, there is no need to add an independent radiator structure, which saves production costs and is conducive to the development of products in the direction of miniaturization.

[0034] Figure 1-5A passive diaphragm heat dissipation speaker provided in the embodiment of the present application includes a main housing 1, a speaker 2, a first diaphragm 3, a second diaphragm 4 and a main body 5 to be heat-dissipated, a sound cavity 6 is arranged in the main housing 1, the speaker 2 is connected to one end of the main housing 1 and communicates with the sound cavity 6, the first diaphragm 3 and the second diaphragm 4 are connected to opposite ends of the main housing 1 and communicate with the sound cavity 6, the first diaphragm 3, the second diaphragm 4 and the speaker 2 surround the sound cavity 6 to form a closed space, and the main body 5 to be heat-dissipated is fixedly arranged on the outside of the main housing 1 and is arranged corresponding to the first diaphragm 3 or the second diaphragm 4. The sound cavity 6 is surrounded by the first diaphragm 3, the second diaphragm 4 and the speaker 2 to form a closed space, which also facilitates the first diaphragm 3 and the second diaphragm 4 to move synchronously when the drum paper of the speaker 2 moves forward and backward, which is conducive to generating airflow at the first diaphragm 3 or the second diaphragm 4; in the present invention, the main body 5 to be heat-dissipated is arranged corresponding to the second diaphragm 4. Among them, by arranging the first diaphragm 3 and the second diaphragm 4 at the opposite ends of the main shell 1, the movement directions are opposite during operation, which can offset most of the vibrations generated by the two, which is beneficial to reducing the noise or abnormal sound generated by the first diaphragm 3 and the second diaphragm 4 during movement.

[0035] When the speaker 2 is working, its drum paper moves back and forth, compressing and releasing the air in the sound cavity 6, thereby driving the first diaphragm 3 and the second diaphragm 4 to move, so that the first diaphragm 3 and the second diaphragm 4 push the nearby air to generate airflow, causing the airflow to flow at the heat dissipation body 5 located on the side of the second diaphragm 4, thereby accelerating the speed of removing the heat generated by the heat dissipation body 5, thereby achieving the purpose of rapid heat dissipation.

[0036] In some embodiments, the heat dissipation body 5 can also be arranged corresponding to the first diaphragm 3, and it can be arranged on the outside of the first diaphragm 3. In this embodiment, the position of the speaker 2 can be adjusted, for example, it can be arranged on other sides of the main shell 1. Without further explanation, in this embodiment, when the heat dissipation body 5 dissipates heat, the first diaphragm 3 pushes the nearby air to generate airflow, so that the airflow at the heat dissipation body 5 located on the side of the first diaphragm 3 flows, thereby accelerating the speed of taking away the heat generated by the heat dissipation body 5, thereby achieving the purpose of rapid heat dissipation. The setting position of the heat dissipation body 5 can be specifically limited according to the actual application scenario.

[0037] See also Figure 1The passive diaphragm heat dissipation speaker box further includes a front shell 7 and a rear shell 8, wherein the rear shell 8 is connected to the main shell 1, and the heat dissipation body 5 is arranged between the rear shell 8 and the main shell 1; the front shell 7 is connected to the end of the main shell 1 away from the rear shell 8, and the first diaphragm 3 and the speaker 2 are covered by the front shell 7. It can be understood that the first diaphragm 3 and the speaker 2 are not blocked by the front shell 7, and the front shell 7 only provides structural protection. A certain distance of space is reserved between the first diaphragm 3 and the front shell 7, and between the speaker 2 and the front shell 7. The front shell 7 is provided with a first sound outlet 9 corresponding to the speaker 2 and a second sound outlet 10 corresponding to the first diaphragm 3.

[0038] See also Figure 5 The heat dissipation body 5 includes a heat sink 11 and a PCB board group 12. The PCB board group 12 is connected to one side of the heat sink 11, and the second diaphragm 4 is arranged corresponding to the other side of the heat sink 11. Most of the heat generated by the PCB board group 12 is transferred to the heat sink 11. The arrangement of the heat sink 11 is also conducive to promoting the heat dissipation of the PCB board group 12. At the same time, the air flow generated by the second diaphragm 4 moves to the heat sink 11, quickly taking away the heat at the heat sink 11, and realizing the dissipation of most of the heat of the PCB board. Furthermore, a heat dissipation hole 13 is opened on the rear shell 8 adjacent to the heat dissipation body 5. The arrangement of the heat dissipation hole 13 increases the smoothness of the air flow, which accelerates the natural heat dissipation of the PCB board group 12, the natural heat dissipation of the heat sink 11, and the heat dissipation of the heat sink 11 by the air flow generated by the movement of the second diaphragm 4.

[0039] In the present invention, the distance between the second diaphragm 4 and the heat sink 11 is 3-7 mm, which is not too close so that the heat sink 11 blocks the movement of the second diaphragm 4, nor too far so that the gas flow rate is reduced and the speed of air flowing to the heat sink 11 is weakened.

[0040] See also Figure 4 , and also includes an interface group 14, which is partially arranged between the rear shell 8 and the main shell 1 and partially exposed on the surface of the rear shell 8. The PCB board group 12 is electrically connected to the speaker 2 and the interface group 14. The setting of the interface group 14 realizes the connection between the product and the external power supply and equipment, and enriches the functions of the product.

[0041] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0042] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0047] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

[0048] The above is a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation speaker, characterized in that: It includes a main housing, a speaker, a first diaphragm, a second diaphragm and a main body to be cooled; A sound cavity is arranged inside the main shell, the speaker is connected to one side of the main shell and communicates with the sound cavity; the first diaphragm and the second diaphragm are connected to two opposite sides of the main shell and communicate with the sound cavity; the first diaphragm, the second diaphragm, the speaker and the main shell enclose the sound cavity to form a closed space; The main body to be cooled is fixedly arranged outside the main shell and is arranged corresponding to the first diaphragm or the second diaphragm. The first diaphragm or the second diaphragm generates airflow to accelerate the flow of air at the main body to be cooled when working.

2. The heat dissipation speaker according to claim 1, characterized in that: The main body to be cooled includes the heat sink and a PCB board group, and the PCB board group is connected to one surface of the heat sink.

3. The heat dissipation speaker according to claim 2, characterized in that: The second diaphragm is arranged corresponding to the other surface of the heat sink.

4. The heat dissipation speaker according to claim 3, characterized in that: The distance between the second diaphragm and the heat sink is 3-7 mm.

5. The heat dissipation speaker according to claim 2, characterized in that: It also includes a rear shell, which is connected to the main shell, and the body to be cooled is arranged between the rear shell and the main shell.

6. The heat dissipation speaker according to claim 5, characterized in that: A heat dissipation hole is provided on the rear shell adjacent to the main body to be dissipated.

7. The heat dissipation speaker according to claim 5, characterized in that: It also includes a front shell, which is connected to a side of the main shell away from the rear shell, and the first diaphragm and the speaker are covered by the front shell.

8. The heat dissipation speaker according to claim 7, characterized in that: The front shell is provided with a first sound outlet corresponding to the speaker and a second sound outlet corresponding to the first diaphragm.

9. The heat dissipation speaker according to claim 2, characterized in that: It also includes an interface group, which is partially arranged between the rear shell and the main shell, and partially exposed on the surface of the rear shell. The PCB board group is electrically connected to the speaker and the interface group respectively.

10. The heat dissipation speaker according to claim 2, characterized in that: The main body to be cooled is arranged on the outside of the first diaphragm, and the first diaphragm is arranged corresponding to the other side of the heat sink.

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