Embedded element circuit board and manufacturing method thereof

Abstract

The invention provides an embedded element circuit board capable of enhancing heat dissipation capability and a manufacturing method thereof. The embedded element circuit board comprises a circuit substrate, an embedded structure arranged in the circuit substrate, a conductive structure located on the side wall of the circuit substrate and a metal block arranged on the surface of the circuit substrate. Each embedded structure comprises a circuit layer, an electronic component, an insulating material and two heat conduction structures, and the embedded structures are electrically connected to the circuit substrate through the conductive structures. The electronic component is located on the circuit layer and electrically connected with the circuit layer. The insulating material covers the circuit layer and the electronic component. The heat conduction structures are respectively arranged on two opposite sides of the electronic component, and two opposite end faces of the insulating material are respectively exposed out of the heat conduction structures. Therefore, the heat dissipation rate of the embedded element circuit board can be improved.

Description

Technical Field

[0001] The invention relates to a circuit board, and in particular to a circuit board with embedded components. Background Art

[0002] With the development of current technology, circuit boards can integrate multiple high-density electronic components together, and the embedded component technology can set electronic components in the grooves of the circuit board. However, when multiple electronic components are distributed in a multi-layer circuit board structure with high density (usually 6 to 36 components), it is easy to affect the heat dissipation efficiency. In addition, since electronic components are usually coated with molding materials, and the thermal conductivity of general molding materials is low, the heat energy generated by the electronic components accumulates in the circuit board, which in turn reduces the life of the electronic components. Summary of the invention

[0003] Therefore, the present invention provides a circuit board with embedded components and a manufacturing method thereof to increase the heat dissipation efficiency of the circuit board.

[0004] The present invention provides a circuit board with embedded components, comprising a circuit substrate, a plurality of embedded structures arranged in the circuit substrate, a conductive structure and a metal block. Each of the embedded structures comprises a circuit layer, an electronic component, an insulating material and two heat-conducting structures. The electronic component is located on the circuit layer and is electrically connected to the circuit layer. The insulating material covers the circuit layer and the electronic component. The heat-conducting structures are respectively located on opposite sides of the electronic component, wherein opposite end surfaces of the insulating material expose the heat-conducting structures respectively. The conductive structure is located on the side wall of the embedded structure, and the embedded structure is electrically connected to the circuit substrate through the conductive structure. The metal block is arranged on the surface of the circuit substrate.

[0005] In at least one embodiment of the present invention, the thermal expansion coefficient of the insulating material is less than 10 ppm / °C.

[0006] In at least one embodiment of the present invention, each of the embedded structures further includes a sintered material, and the sintered material is located between one of the thermally conductive structures and the electronic component.

[0007] In at least one embodiment of the present invention, the sintering material includes silver.

[0008] In at least one embodiment of the present invention, the embedded component circuit board further includes a metal layer, which is located between the embedded structure and the metal block and connects one of the heat-conducting structures and the metal block.

[0009] In at least one embodiment of the present invention, the embedded structure is electrically connected to the metal block through the metal layer.

[0010] In at least one embodiment of the present invention, the embedded component circuit board further comprises a bonding material. The bonding material is located between the embedded structure and the circuit substrate, and the bonding material exists between two adjacent embedded structures.

[0011] In at least one embodiment of the present invention, each of the buried structures further includes a plurality of conductive buried vias, and the electronic component is electrically connected to the circuit layer through the conductive buried vias.

[0012] In at least one embodiment of the present invention, a thickness of one of the heat-conducting structures ranges from 100 μm to 400 μm.

[0013] The present invention also provides a method for manufacturing a circuit board with embedded components, comprising providing a plurality of embedded structures, each of which comprises a circuit layer, an electronic component insulating material, and two heat-conducting structures. The electronic component is located on the circuit layer and is electrically connected to the circuit layer. The insulating material covers the circuit layer and the electronic component. The heat-conducting structures are respectively located on opposite sides of the electronic component, wherein the heat-conducting structures are respectively exposed on opposite end surfaces of the circuit substrate; providing a first substrate; removing a portion of the first substrate to form a plurality of first openings; arranging an embedded structure in the first opening; providing a second substrate; removing a portion of the second substrate to form a second opening; arranging a metal block in the second opening; providing a bonding substrate; and after arranging the embedded structure in the first opening and the metal block in the second opening, the first substrate and the second substrate are respectively bonded on opposite sides of the bonding substrate, and one of the heat-conducting structures faces the metal block.

[0014] In at least one embodiment of the present invention, providing an embedded structure includes providing an insulating substrate; removing a portion of the insulating substrate to form a first groove; depositing one of the thermally conductive structures in the first groove; disposing an electronic component on one of the thermally conductive structures; forming a circuit layer on the electronic component; forming an insulating material on the circuit layer; removing a portion of the insulating material to form a second groove; and depositing another thermally conductive structure in the second groove.

[0015] Based on the above, the present invention uses the heat-conducting structures located on opposite sides of the electronic component to increase the heat dissipation path of the embedded structure, so that the heat energy generated by the electronic component is conducted to the metal block more quickly and dissipated to the external environment. In this way, the heat energy accumulated in the electronic component can be reduced, which helps to increase the life of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be understood from the following detailed description and the accompanying drawings. It should be noted that various features are not drawn to the standard scale in industry practice. In fact, the size of various features may be arbitrarily increased or decreased for clarity of discussion.

[0017] Figure 1 A cross-sectional view of a circuit board with embedded components according to at least one embodiment of the present invention is shown.

[0018] FIG. 2A to FIG. 2E A cross-sectional view is shown of a method for manufacturing a circuit board with embedded components according to at least one embodiment of the present invention.

[0019] FIG. 3A to FIG. 3D A cross-sectional view is shown of a method for manufacturing a circuit board with embedded components according to at least one embodiment of the present invention. DETAILED DESCRIPTION

[0020] The present invention will be described in detail with the following examples. It should be noted that the following description of the embodiments of the present invention is only for illustration and is not intended to exhaustively disclose all embodiments or to limit the specific embodiments of the present invention. For example, the description of "a first feature formed on a second feature" includes multiple implementations, including the first feature being in direct contact with the second feature, and also including additional features being formed between the first feature and the second feature so that the two are not in direct contact. In addition, the same element symbols used in the drawings and the specification will represent the same or similar elements as much as possible.

[0021] Spatially relative terms, such as "lower," "below," "beneath," "above," and related terms, are used herein to simply describe the relationship of an element or feature as shown in the figures to another element or feature. These spatially relative terms also cover different orientations when using or operating the device in addition to the orientation depicted in the figures. In addition, when the element is rotatable (rotated 90 degrees or other angles), the spatially relative descriptors used herein can also be interpreted accordingly.

[0022] Furthermore, when the words "about," "approximately," etc. are used to describe a number or a range of numbers, the words are intended to cover numbers within a reasonable range and to take into account the natural differences in manufacturing processes that can be understood by a person of ordinary skill in the art. The range of numbers covers a reasonable range of the described number, for example, within + / -10% of the described number, which is based on known manufacturing tolerances that are related to the characteristics of the manufactured feature. For example, a material layer having a thickness of "approximately 5 nanometers" can cover a range of sizes from 4.25 nanometers to 5.75 nanometers, where the manufacturing tolerance for depositing the material layer is + / -15%, which is known to a person of ordinary skill in the art. Further, the present invention may repeat numbers and / or designations in various examples. This repetition is for simplicity and clarity of description and is not intended to indicate a relationship between the various embodiments and / or configurations discussed herein.

[0023] The present invention provides a circuit board 10 with embedded components. Figure 1The embedded component circuit board 10 includes a circuit substrate 100, embedded structures 120 and 120', a conductive structure 140, and a metal block 160. The embedded structures 120 and 120' are disposed in the circuit substrate 100, and each embedded structure (such as the embedded structure 120) includes a circuit layer 122, an electronic component 124, an insulating material 126, and two heat-conducting structures 128a and 128b.

[0024] The electronic component 124 is located on the circuit layer 122 and is electrically connected to the circuit layer 122. Figure 1 As shown, the circuit layer 122 is disposed above the electronic component 124, wherein the electronic component 124 is electrically connected to the circuit layer 122 through a plurality of conductive buried vias 125. In the present embodiment, the electronic component 124 may be an unpackaged die, but the present invention is not limited thereto. In other embodiments, the electronic component 124 may also be a packaged chip. Although in the present embodiment, only one electronic component 124 is included in one embedded structure 120, the number of electronic components 124 is not limited thereto. In other embodiments, the number of electronic components 124 in one embedded structure 120 may also be more than two.

[0025] The insulating material 126 covers the circuit layer 122 and the electronic component 124. In detail, the insulating material 126 covers the opposite sides of the circuit layer 122 and covers a portion of the surface of the electronic component 124. In particular, the insulating material 126 may include a material having a coefficient of thermal expansion (CTE) less than 10 ppm / °C (i.e., a low coefficient of thermal expansion material). However, in order to avoid misalignment (under temperature changes) between the electronic component 124 and the insulating material 126 due to a large difference in coefficient of thermal expansion, the selection of the insulating material 126 must depend on the electronic component 124. For example, when the coefficient of thermal expansion of the electronic component 124 falls within the range of 3 ppm / °C to 6 ppm / °C, the insulating material 126 may include a material having a coefficient of thermal expansion ranging from 9 ppm / °C to 10 ppm / °C, such as polyphenylene oxide (PPO), polyphenylene ether (PPE) or the like, but the present invention is not limited thereto.

[0026] The heat-conducting structure 128a and the heat-conducting structure 128b are respectively located on opposite sides of the electronic element 124. In addition, the heat-conducting structure 128a and the heat-conducting structure 128b are also respectively located on opposite sides of the circuit layer 122. In other words, the circuit layer 122 and the electronic element 124 are located between the heat-conducting structure 128a and the heat-conducting structure 128b. Figure 1As shown, the insulating material 126 only partially covers the heat-conducting structure 128a and the heat-conducting structure 128b, and the two opposite end surfaces 126f and the end surface 126s of the insulating material 126 expose the heat-conducting structure 128a and the heat-conducting structure 128b respectively. In this way, the heat generated by the electronic component 124 can be transferred upward to the outside through the conductive buried via 125, the circuit layer 122 and the heat-conducting structure 128a in sequence, and can also be transferred downward to the metal block 160 through the heat-conducting structure 128b.

[0027] In particular, the material of the heat conducting structure 128a and the heat conducting structure 128b may include copper, and the thickness of the heat conducting structure 128a and the heat conducting structure 128b may range from 100 μm to 400 μm. For example, in this embodiment, the thickness T1 of the heat conducting structure 128a is about 200 μm, but the invention is not limited thereto.

[0028] The embedded structure 120 further includes a sintered material 127, and the sintered material 127 is located between one of the heat-conducting structures (e.g., the heat-conducting structure 128b) and the electronic component 124. In particular, the sintered material 127 may include a metal material with a high thermal conductivity coefficient, such as silver. In addition, the embedded structure 120 further includes a pad layer 128p located between the sintered material 127 and the heat-conducting structure 128b. The material of the pad layer 128p may be the same as the material of the heat-conducting structure 128b, such as copper. In other words, the pad layer 128p is substantially equivalent to an extension layer of the heat-conducting structure 128b.

[0029] In this embodiment, a metal layer (not shown) is respectively disposed on opposite sides of the electronic component 124. Specifically, one metal layer is disposed between the conductive buried via 125 and the electronic component 124, and the other metal layer is disposed between the sintered material 127 and the electronic component 124. The materials of the two metal layers may include copper, nickel, and silver. Since the metal layer is directly attached to the outer surface of the electronic component 124, a heat conduction path is provided for the electronic component 124, which facilitates the conduction of the heat generated by the electronic component 124 to the outside.

[0030] Please refer to Figure 1 , the conductive structure 140 of the embedded component circuit board 10 is located on the side wall 120w of the embedded structure 120, and is electrically connected to the circuit layer 122 of the embedded structure 120. Since the conductive structure 140 is electrically connected to the circuit layer 102 on the circuit substrate 100, the embedded structure 120 is electrically connected to the circuit substrate 100 through the conductive structure 140. In this embodiment, the conductive structure 140 is substantially equivalent to a conductive blind hole in the circuit substrate 100.

[0031] It is worth mentioning that the embedded component circuit board 10 further includes a bonding material 180. Figure 1As shown, the bonding material 180 is located between the embedded structure 120 and the circuit substrate 100. Specifically, the bonding material 180 is located on the sidewall 120w of the embedded structure 120 and covers a portion of the sidewall 120w. In addition, the bonding material 180 is present between two adjacent embedded structures (e.g., between the embedded structure 120 and the embedded structure 120').

[0032] The metal block 160 is disposed on the surface 100s of the circuit substrate 100, and a portion of the circuit layer 104 and a portion of the insulating layer 106 of the circuit substrate 100 are present between the metal block 160 and the embedded structure 120 (and the embedded structure 120'). The embedded component circuit board 10 further includes a metal layer 170, which is located between the embedded structure 120 (and the embedded structure 120') and the metal block 160, and connects the thermal conductive structure 128b and the metal block 160. The metal layer 170 may include, for example, copper paste, silver paste, or similar conductive heat dissipation materials.

[0033] In this embodiment, the metal block 160 may be a bus bar including copper, and the embedded structure 120 (and the embedded structure 120') is electrically connected to the metal block 160 through the metal layer 170 and the circuit layer 104. In other words, the embedded structure 120, the circuit substrate 100 and the metal block 160 may be electrically connected to each other. However, the present invention is not limited thereto, and in other embodiments where the metal block 160 is not a bus bar, the metal block 160 may not be electrically connected to the embedded structure 120.

[0034] In particular, although not shown in Figure 1 However, the circuit substrate 100 may further include at least one solder mask. The solder mask covers the circuit layer 102 and exposes a portion of the circuit layer 102. On the other hand, the embedded component circuit board 10 may further include a non-plated through hole 190 (NPTH). The non-plated through hole 190 connects one side of the circuit substrate 100 with one side of the metal block 160 for screws or other similar fixing elements to be locked, so that the metal block 160 can be fixed to the circuit substrate 100.

[0035] The present invention provides a method for manufacturing a circuit board with embedded components. Taking the circuit board with embedded components 10 as an example, the manufacturing method may include the following steps: FIG. 2A to FIG. 2E as well as FIG. 3A to FIG. 3D First, provide multiple steps such as Figure 1 The embedded structure 120 is shown in FIG. 1 , and the steps for forming the embedded structure 120 are shown in FIG. FIG. 2A to FIG. 2E .like Figure 2AFirst, an insulating substrate 200 is provided. The insulating substrate 200 includes a layer of insulating material 202a and a double metal layer 204, and the insulating material 202a is sandwiched between the double metal layers 204. In this embodiment, these metal layers 204 can be metal foils (such as copper foils) and are respectively attached to opposite sides of the insulating material 202a. In other embodiments, the double metal layer 204 can be directly formed on the insulating material 202a by a coating process (such as chemical vapor deposition, physical vapor deposition, electroplating or chemical electroplating).

[0036] Next, please refer to Figure 2B , a portion of the insulating substrate 200 is removed by, for example, mechanical or laser grooving to form a groove (not shown). And a thermal conductive structure 128b is formed in this groove by, for example, thick copper electroplating (Thick Copper). It is particularly worth mentioning that before forming the thermal conductive structure 128b, a mask layer can be first set on the insulating substrate 200, and the area to be electroplated on the insulating substrate 200 is exposed by a photolithography process. Then, the metal layer 204 is patterned by photolithography and etching to form a pad layer 128p on the thermal conductive structure 128b. In addition, although not shown in the figure, after forming the pad layer 128p, a metal layer containing gold or silver (not shown) can be formed on the pad layer 128p and part of the metal layer 204 by chemical plating (such as nickel immersion gold). The thickness of this metal layer can range from 0.03μm to 0.13μm.

[0037] Please refer to Figure 2C , a sintered material 127 is formed on the pad layer 128p by, for example, stencil printing and sintering. In particular, the thickness of the sintered material 127 can range from 50 μm to 150 μm. Then, the electronic component 124 is disposed on the thermal conductive structure 128b by, for example, pre-baking, dispensing, and punching. In detail, the electronic component 124 is disposed through the pad layer 128p above the thermal conductive structure 128b.

[0038] Next, refer to Figure 2D, an insulating material 202b is disposed on the electronic component 124 by means of hot pressing. In order to make the insulating material 202b adhere to and cover the electronic component 124, multiple layers of insulating material films (not shown) with openings may be stacked and adhered on the heat-conducting structure 128b to form a groove for accommodating the electronic component 124. When the insulating material film is heated to form the insulating material 202b, the molten insulating material film may be adhered to the surface of the electronic component 124. It is worth mentioning that before hot pressing, the surface of the insulating substrate 200 may be treated by, for example, brown oxide to increase the surface adhesion.

[0039] After the insulating material 202b is formed, a copper foil (not shown) is attached to the insulating material 202b, and the copper foil is patterned by, for example, photolithography, etching, and electroplating to form the circuit layer 122 and the conductive buried via 125. In particular, in this embodiment, the gate region and the source region on the circuit layer 122 can be defined by photolithography and etching processes.

[0040] Please refer to Figure 2E After forming the circuit layer 122, another insulating material 202c is disposed on the circuit layer 122 by means of heat pressing. In particular, the combination of the insulating material 202a, the insulating material 202b and the insulating material 202c is substantially equivalent to Figure 1 The insulating material 126 in the circuit layer 122 is removed. Then, a portion of the insulating material 202c is removed by, for example, mechanical or laser grooving to form a groove (not shown). And a heat-conducting structure 128a is formed in the groove by, for example, thick copper electroplating. It is particularly mentioned that the above steps also include forming a conductive blind hole 205 on the circuit layer 122. The heat-conducting structure 128a and the conductive blind hole 205 are respectively located on the gate region and the source region of the circuit layer 122.

[0041] It is worth mentioning that before forming the heat-conducting structure 128a, a mask layer can be first disposed on the insulating material 202c, and a photolithography process is performed to expose the area to be electroplated on the insulating material 202c. In addition, a metal layer (not shown) can also be formed on the insulating material 202c by electroplating, and the metal layer can be patterned into the circuit layer 206.

[0042] After forming the thermal conductive structure 128a, the circuit layer 206, the insulating material 202c, the insulating material 202b, the insulating material 202a, the circuit layer 122 and the metal layer 204 may be cut by mechanical or laser cutting to form a plurality of embedded structures 120 (and embedded structures 120').

[0043] Please refer to Figure 3A First, a first substrate 300 is provided. The thickness of the first substrate 300 may range from 0.3 mm to 0.6 mm, and the material of the first substrate 300 may include, for example, a composite material composed of epoxy resin and glass fiber or the like. Next, a portion of the first substrate 300 is removed to form a plurality of first openings 300t. After the plurality of first openings 300t are formed, a tape 305 (for example, polyethylene terephthalate tape) is attached to one side of the first substrate 300. Next, a plurality of first openings 300t are provided. FIG. 2A to FIG. 2E The embedded structure 120 (and embedded structure 120') is formed by a series of steps. It is particularly noted that the embedded structure 120 is disposed on the bonding tape 305 and is connected to the inner wall (not shown) of the first opening 300t by the bonding material 180. The bonding material 180 may include insulating materials such as epoxy resin.

[0044] refer to Figure 3B After the embedded structure 120 is disposed in the first opening 300t, the bonding tape 305 (indicated at Figure 3A ). Then, a plurality of conductive vias 304v are formed on the first substrate 300 by mechanical grinding, mechanical drilling and electroplating, and a plugging material (not shown) is filled in the conductive vias 304v. In addition, after the electroplating process, the circuit layer 102 and the circuit layer 104 are formed by, for example, photolithography and etching.

[0045] refer to Figure 3C , the manufacturing method of the embedded component circuit board of at least one embodiment of the present invention further includes providing a second substrate 320. The thickness range of the second substrate 320 can fall between 0.5 mm and 2.0 mm, and the material of the second substrate 320 can include, for example, a composite material composed of epoxy resin and glass fiber or the like. Then, a portion of the second substrate 320 is removed to form a second opening 320t. After the second opening 320t is formed, a bonding tape 305' is set on one side of the second substrate 320. Then, a metal block 160 is set in the second opening 320t. It is particularly mentioned that the metal block 160 is set on the bonding tape 305' and is connected to the inner wall (not shown) of the second opening 320t through a bonding material 380. The bonding material 380 can include an insulating material such as epoxy resin.

[0046] like Figure 3CAs shown, a metal layer 170 is disposed on the first substrate 300 by, for example, steel plate printing. Next, a bonding substrate 306 is provided. After the embedded structure 120 is disposed in the first opening 300t and the metal block 160 is disposed in the second opening 320t, the first substrate 300 and the second substrate 320 are respectively bonded to opposite sides of the bonding substrate 306 by, for example, hot pressing bonding. In particular, one of the heat-conducting structures (for example, the heat-conducting structure 128b) in the embedded structure 120 faces the metal block 160, and the metal layer 170 is located between the first substrate 300 and the second substrate 320.

[0047] Next, please refer to Figure 3D After the first substrate 300 and the second substrate 320 are attached to the bonding substrate 306, non-electroplating through holes 190 can be formed in the first substrate 300, the bonding substrate 306 and the second substrate 320 by, for example, mechanical drilling. In addition, although not shown in the figure, the present embodiment further includes forming a non-electroplating through hole 190 in the circuit layer 102 (such as Figure 3B Then, the first substrate 300, the bonding substrate 306 and the second substrate 320 are cut by mechanical cutting (for example, CNC processing) to form the following: Figure 1 The embedded component circuit board 10 in the embodiment of the present invention.

[0048] Accordingly, the design of providing heat-conducting structures on both sides of the embedded structure allows the heat generated by the electronic components to be directly transferred to the metal block through the heat-conducting structures and dissipated to the external environment, thereby improving the efficiency of heat dissipation. In this way, the heat energy accumulated in the electronic components can be reduced, preventing the electronic components from malfunctioning due to temperature rise, which helps to increase the life of the electronic components.

[0049] Although the embodiments of the present invention have been disclosed as above, they are not intended to limit the embodiments of the present invention. Any technician in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the embodiments of the present invention. Therefore, the protection scope of the embodiments of the present invention shall be determined by the definition of the attached claims.

[0050]

Explanation of symbols

[0051] 10: Embedded component circuit board

[0052] 100: Circuit board

[0053] 100s: Surface

[0054] 102,104,122,206: Circuit layer

[0055] 106: Insulation layer

[0056] 120,120':Buried structure

[0057] 120w: Sidewall

[0058] 124: Electronic components

[0059] 125: Conductive buried via

[0060] 126,202a,202b,202c: Insulation materials

[0061] 126f,126s: end face

[0062] 127: Sintered material

[0063] 128a, 128b: Thermally conductive structure

[0064] 128p: pad layer

[0065] 140: Conductive structure

[0066] 160:Metal Block

[0067] 170:Metal layer

[0068] 180,380:Jointing materials

[0069] 190: Non-plated through hole

[0070] 200: Insulation substrate

[0071] 204:Metal layer

[0072] 205: Conductive blind via

[0073] 300: first substrate

[0074] 300t: First opening

[0075] 304v: Conductive vias

[0076] 305,305': Laminating tape

[0077] 306: Bonding substrate

[0078] 320: Second substrate

[0079] 320t: Second opening

[0080] T1: Thickness.

Claims

1. A circuit board with embedded components, characterized in that: Include: Circuit substrate; A plurality of embedded structures are disposed in the circuit substrate, each of the embedded structures comprising: Circuit layer; An electronic component, located on the circuit layer and electrically connected to the circuit layer; Insulating material, covering the circuit layer and the electronic components; as well as Two heat-conducting structures are respectively located at two opposite sides of the electronic component, wherein the heat-conducting structures are respectively exposed at two opposite end surfaces of the insulating material; A conductive structure, located on a side wall of the embedded structure, wherein the embedded structure is electrically connected to the circuit substrate through the conductive structure; as well as The metal block is arranged on the surface of the circuit substrate.

2. The embedded component circuit board according to claim 1, wherein the thermal expansion coefficient of the insulating material is less than 10 ppm / °C.

3. The embedded component circuit board according to claim 1, wherein each of the embedded structures further comprises: The sintered material is located between one of the heat-conducting structures and the electronic component. The embedded component circuit board according to claim 3 , wherein the sintered material comprises silver.

5. The embedded component circuit board according to claim 1, wherein: Also includes: The metal layer is located between the embedded structure and the metal block, and connects one of the heat-conducting structures and the metal block. 6 . The embedded component circuit board according to claim 5 , wherein the embedded structure is electrically connected to the metal block through the metal layer.

7. The embedded component circuit board according to claim 1, wherein: Also includes: The bonding material is located between the embedded structure and the circuit substrate, and the bonding material exists between two adjacent embedded structures.

8. The embedded component circuit board according to claim 1, wherein each of the embedded structures further comprises: A plurality of conductive buried vias, wherein the electronic component is electrically connected to the circuit layer through the conductive buried vias.

9. A method for manufacturing a circuit board with embedded components, characterized in that: Include: A plurality of embedded structures are provided, each of the embedded structures comprising: Circuit layer; An electronic component, located on the circuit layer and electrically connected to the circuit layer; Insulating material, covering the circuit layer and the electronic components; as well as Two heat-conducting structures are respectively located on two opposite sides of the electronic component, wherein the heat-conducting structures are respectively exposed on two opposite end surfaces of the circuit substrate; providing a first substrate; removing a portion of the first substrate to form a plurality of first openings; The embedded structure is arranged in the first opening; providing a second substrate; removing a portion of the second substrate to form a second opening; A metal block is arranged in the second opening; providing a bonding substrate; as well as After the embedded structure is disposed in the first opening and the metal block is disposed in the second opening, the first substrate and the second substrate are respectively attached to opposite sides of the bonding substrate, and one of the heat conducting structures faces the metal block.

10. The method according to claim 9, wherein: Providing the embedded structure comprises: providing an insulating substrate; removing a portion of the insulating substrate to form a first groove; Depositing one of the heat-conducting structures in the first groove; The electronic component is arranged on one of the heat-conducting structures; forming the circuit layer on the electronic component; forming the insulating material on the circuit layer; removing a portion of the insulating material to form a second groove; as well as In the second groove, another one of the heat conducting structures is deposited.

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