Heat dissipation design method and PCB assembly

Abstract

The invention discloses a heat dissipation design method and a PCB assembly, and the method comprises the steps: determining a risk component with a heating risk based on the power consumption of each electronic component in a plurality of electronic components to be designed in a PCB; obtaining a first thermal resistance parameter and a second thermal resistance parameter of the risk component, the first thermal resistance parameter being a thermal resistance from a node of the electronic component to a packaging upper surface, the second thermal resistance parameter being a thermal resistance from the node of the electronic component to a packaging lower surface, or a thermal resistance from the node of the electronic component to a PCB; the first thermal resistance parameter is compared with the second thermal resistance parameter; based on the fact that the second thermal resistance parameter is larger than the first thermal resistance parameter, a heat dissipation piece is arranged on the packaging upper surface of the risk component; based on the fact that the second thermal resistance parameter is smaller than or equal to the first thermal resistance parameter, whether the second thermal resistance parameter is smaller than a preset thermal resistance value or not is judged, and if yes, a heat dissipation piece corresponding to the risk component is arranged on the side, back to the risk component, of the PCB.

Description

Technical Field

[0001] The invention relates to the technical field of thermal design of PCB boards, and in particular to a heat dissipation design method and a PCB board assembly. Background Art

[0002] When there is a thermal risk in electronic components, consideration is given to adding heat sinks to help reduce the temperature.

[0003] In the existing heat dissipation scheme, it is difficult to determine which side of the PCB board (the front and back of the PCB board) the heat sink is installed on to achieve the heat dissipation target. Therefore, it is usually necessary to set the heat sink on both sides of the PCB board, and conduct experiments to verify the corresponding heat dissipation results, and then select the appropriate heat dissipation position, which leads to high design and time costs and low efficiency in the design of the heat sink. Another existing solution is to directly install the heat sink on both sides of the PCB board, and fix the two heat sinks with screws and nuts to enhance the heat dissipation effect, which leads to high cost of the heat sink and large volume of the PCB board assembly.

[0004] Therefore, there is an urgent need to provide a heat dissipation design method that has good heat dissipation effect, saves design and time costs of heat sinks, saves heat sink costs and is conducive to miniaturization of PCB board components. Summary of the invention

[0005] The technical problem solved by the present invention is to provide a heat dissipation design method and a PCB board assembly, so as to have good heat dissipation effect, save the design and time cost of the heat dissipation component, save the cost of the heat dissipation component and facilitate the miniaturization of the PCB board assembly.

[0006] In order to solve the above technical problems, the technical solution of the present invention provides a heat dissipation design method, comprising:

[0007] Among several electronic components to be designed on the PCB board, determine the risk components with heating risk based on the power consumption of each electronic component;

[0008] Obtaining a first thermal resistance parameter and a second thermal resistance parameter of the risk component, wherein the first thermal resistance parameter is the thermal resistance from the node of the electronic component to the upper surface of the package, and the second thermal resistance parameter is the thermal resistance from the node of the electronic component to the lower surface of the package, or the thermal resistance from the node of the electronic component to the PCB board;

[0009] Comparing the first thermal resistance parameter with the second thermal resistance parameter:

[0010] Based on the fact that the second thermal resistance parameter is greater than the first thermal resistance parameter, a heat sink is provided on the upper surface of the package of the risk component;

[0011] Based on the fact that the second thermal resistance parameter is less than or equal to the first thermal resistance parameter, determine whether the second thermal resistance parameter is less than a preset thermal resistance value: if satisfied, set a heat sink corresponding to the risk component on the side of the PCB board facing away from the risk component.

[0012] Optionally, the preset thermal resistance value is K times the first thermal resistance parameter of the risk component, and the range of K is 0 to 0.4.

[0013] Optionally, the preset thermal resistance value is determined based on thermal resistance information of the PCB board.

[0014] Optionally, the method for determining risky components with heating risks based on the power consumption of each electronic component includes: among multiple electronic components to be designed on a PCB board, determining electronic components whose power consumption exceeds a preset power consumption threshold as risky components.

[0015] Optionally, the method for determining risk components with heating risks based on the power consumption of each electronic component includes: among multiple electronic components to be designed on a PCB board, determining an electronic component whose power consumption exceeds a preset power consumption threshold as a risk component to be confirmed; performing a first simulation based on first modeling information to obtain a first thermal analysis simulation result of the PCB board and several electronic components to be designed on the PCB board, the first modeling information including a model and a stacking structure of the PCB, and device parameters of the risk component to be confirmed, the device parameters including power consumption and a thermal resistance from a node of the electronic component to an upper surface of a package, the device parameters also including at least one of a thermal resistance from a node of the electronic component to a lower surface of the package and a thermal resistance from a node of the electronic component to a PCB board, the first thermal analysis simulation result including an internal junction temperature of the device of the risk component to be confirmed; and determining a risk component to be confirmed having an internal junction temperature of the device exceeding a preset temperature range as the risk component.

[0016] Optionally, the preset temperature range is -40°C to 150°C.

[0017] Optionally, the first thermal analysis simulation result also includes a heat distribution diagram of the PCB board corresponding to the first modeling information.

[0018] Optionally, based on the fact that the second thermal resistance parameter is less than or equal to the first thermal resistance parameter, it is determined whether the second thermal resistance parameter is less than a preset thermal resistance value: if not satisfied, a first simulation verification is performed, and based on the result of the first simulation verification, a heat sink corresponding to the risk component is provided on the PCB board, including:

[0019] Performing a second simulation based on the second modeling information to obtain second thermal analysis simulation results of the PCB board and a number of electronic components to be designed on the PCB board, wherein the second modeling information includes a model and a stacking structure of the PCB, device parameters of the risk components, and a heat sink model disposed on the upper surface of the package of the risk components, and the second thermal analysis simulation results include an internal junction temperature of the risk component when the risk component is provided with a heat sink on the upper surface of its package;

[0020] Performing a third simulation based on the third modeling information to obtain a third thermal analysis simulation result of the PCB board and a number of electronic components to be designed on the PCB board, wherein the third modeling information includes a model and a stacking structure of the PCB, device parameters of the risk components, and a heat sink model corresponding to the risk components and arranged on a side of the PCB board facing away from the risk components, wherein the third thermal analysis simulation result includes a device internal junction temperature of the risk components when a heat sink corresponding to the risk components is arranged on a side of the PCB board facing away from the risk components;

[0021] The internal junction temperature of the device of the second thermal analysis simulation result is compared with the internal junction temperature of the device of the third thermal analysis simulation result: if the internal junction temperature of the device of the second thermal analysis simulation result is lower than the internal junction temperature of the device of the third thermal analysis simulation result, a heat sink is provided on the upper surface of the package of the risk component; if the internal junction temperature of the device of the second thermal analysis simulation result is higher than the internal junction temperature of the device of the third thermal analysis simulation result, a heat sink corresponding to the risk component is provided on the side of the PCB board facing away from the risk component.

[0022] Optionally, the material of the heat sink includes at least one of metal, thermally conductive resin, thermally conductive glue and thermally conductive silicone grease.

[0023] Optionally, the types of risky components include: ARM, FPGA, power conversion module and driver chip.

[0024] Optionally, it also includes: after determining the setting scheme of the heat sink, verifying the setting scheme result of the heat sink; the method for verifying the setting scheme result of the heat sink includes: performing a fourth simulation based on fourth modeling information to obtain a fourth thermal analysis simulation result of the PCB board and several electronic components to be designed on the PCB board, the fourth modeling information includes the model and stacking structure of the PCB, the device parameters of the risk components, and the heat sink model set on the upper surface of the package of the risk components, and the fourth thermal analysis simulation result includes the device internal junction temperature of the risk component when the risk component is provided with a heat sink on the upper surface of its package; performing a fifth simulation based on fifth modeling information to obtain a fifth thermal analysis simulation result of the PCB board and several electronic components to be designed on the PCB board, the fifth modeling information includes the model and stacking structure of the PCB, the device parameters of the risk components, and the heat sink model corresponding to the risk components set on the side of the PCB board facing away from the risk components, and the fifth thermal analysis simulation result includes the device internal junction temperature of the risk component when the heat sink corresponding to the risk component is set on the side of the PCB board facing away from the risk components.

[0025] The technical solution of the present invention also provides a PCB board assembly, including: a PCB board, on which a plurality of electronic components are arranged, and the plurality of electronic components include risk components; a heat sink, which is arranged on a side of the PCB board facing away from the risk components and corresponds to the risk components; wherein the second thermal resistance parameter of the risk component is less than a preset thermal resistance value when the heat sink is not arranged, and the second thermal resistance parameter is the thermal resistance from the node of the electronic component to the lower surface of the package, or the thermal resistance from the node of the electronic component to the PCB board.

[0026] Optionally, the preset thermal resistance value is K times the first thermal resistance parameter of the risk component, the first thermal resistance parameter is the thermal resistance from the node of the electronic component to the upper surface of the package, and the range of K is 0 to 0.4.

[0027] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0028] In the heat dissipation design method provided by the technical solution of the present invention, after determining the risk component with the risk of heating, based on the second thermal resistance parameter being greater than the first thermal resistance parameter, a heat sink is set on the upper surface of the package of the risk component, and based on the second thermal resistance parameter being less than or equal to the first thermal resistance parameter, it is judged whether the second thermal resistance parameter is less than a preset thermal resistance value: if satisfied, a heat sink corresponding to the risk component is set on the side of the PCB board facing away from the risk component. Therefore, when performing heat dissipation design, not only the risk components with risks that need to be dissipated are screened out, but also on the basis of considering the heat dissipation capacity of the upper and lower heat dissipation channels of the risk components themselves, on the upper surface of the package of the risk components, and on the side of the PCB board facing away from the risk components, a heat sink with better heat dissipation capacity and better ability to help heat dissipation is set, thereby achieving good heat dissipation effect, saving the design and time cost of the heat sink, saving the object cost of the heat sink, and facilitating the miniaturization of PCB board components.

[0029] In the PCB board assembly provided by the technical solution of the present invention, since the second thermal resistance parameter of the risk component is less than the preset thermal resistance value when the heat sink is not provided, the second thermal resistance parameter is the thermal resistance from the node of the electronic component to the lower surface of the package, or the thermal resistance from the node of the electronic component to the PCB board, and the heat sink is provided on the side of the PCB board facing away from the risk component and corresponds to the risk component. Therefore, the heat sink is provided at a position with better heat dissipation capacity and better ability to help heat dissipation, thereby achieving good heat dissipation effect, saving design and time costs of the heat sink, saving the object cost of the heat sink and facilitating miniaturization of the PCB board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a flow chart of a heat dissipation design method according to an embodiment of the present invention;

[0031] Figure 2 is a flowchart of step S100 of another embodiment of the present invention;

[0032] Figure 3 is a flowchart of step S420 of an embodiment of the present invention;

[0033] Figure 4 It is a structural schematic diagram of a PCB board assembly according to an embodiment of the present invention. DETAILED DESCRIPTION

[0034] As described in the background technology, there is an urgent need to provide a heat dissipation design method that has good heat dissipation effect, saves design and time costs of heat dissipation components, saves heat dissipation component costs and is conducive to miniaturization of PCB board components.

[0035] To solve the above technical problems, the technical solution of the present invention provides a heat dissipation design method and a PCB board assembly, wherein the heat dissipation design method comprises: determining risk components with heat risk among a number of electronic components to be designed on a PCB board based on the power consumption of each electronic component; obtaining a first thermal resistance parameter and a second thermal resistance parameter of the risk component, wherein the first thermal resistance parameter is the thermal resistance from the node of the electronic component to the upper surface of the package, and the second thermal resistance parameter is the thermal resistance from the node of the electronic component to the lower surface of the package, or the thermal resistance from the node of the electronic component to the PCB board; comparing the first thermal resistance parameter with the second thermal resistance parameter: providing a heat sink on the upper surface of the package of the risk component based on the fact that the second thermal resistance parameter is greater than the first thermal resistance parameter; judging whether the second thermal resistance parameter is less than a preset thermal resistance value based on the fact that the second thermal resistance parameter is less than or equal to the first thermal resistance parameter: if satisfied, providing a heat sink corresponding to the risk component on the side of the PCB board facing away from the risk component. By selecting positions on the PCB board with better heat dissipation capacity and better ability to help heat dissipation to set up heat sinks, the purpose of achieving good heat dissipation effect, saving design and time costs of heat sinks, saving the object cost of heat sinks and facilitating miniaturization of PCB board components is achieved.

[0036] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0037] Please refer to Figure 1 , heat dissipation design methods include:

[0038] Step S100: among a plurality of electronic components to be designed on a PCB board, determine risky components with a heating risk based on the power consumption of each electronic component.

[0039] Step S200, obtaining a first thermal resistance parameter and a second thermal resistance parameter of a risk component.

[0040] Next, the first thermal resistance parameter is compared with the second thermal resistance parameter:

[0041] Based on the second thermal resistance parameter being greater than the first thermal resistance parameter, executing step S300, disposing a heat sink on the upper surface of the package of the risk component;

[0042] Based on the second thermal resistance parameter being less than or equal to the first thermal resistance parameter, continue to determine whether the second thermal resistance parameter is less than a preset thermal resistance value: if satisfied, execute step S410 to set a heat sink corresponding to the risk component on the side of the PCB board facing away from the risk component.

[0043] The above steps are described in detail below with reference to the accompanying drawings.

[0044] In this embodiment, with respect to step S100, among a number of electronic components to be designed on a PCB board, determining risk components with a risk of heating based on the power consumption of each electronic component further includes: among a plurality of electronic components to be designed on a PCB board, determining an electronic component whose power consumption exceeds a preset power consumption threshold as a risk component.

[0045] Generally, electronic components with high power consumption generate heat and thus pose a risk of overheating. In this step, electronic components with high power consumption are treated as risky components.

[0046] Specifically, the preset power consumption threshold may be an empirical value, such as 1 W. Of course, empirical values ​​of other numerical values ​​may also be used as the preset power consumption threshold.

[0047] Risky components are usually one of the main chips. Specifically, the types of risky components include ARM, FPGA, power conversion module, driver chip, etc.

[0048] In another embodiment, please refer to Figure 2 For step S100, among a plurality of electronic components to be designed on a PCB board, a method for determining risky components with heating risks based on the power consumption of each electronic component includes:

[0049] Step S110, among the multiple electronic components to be designed on the PCB board, determining the electronic components whose power consumption exceeds a preset power consumption threshold as risk components to be confirmed;

[0050] Step S120, performing a first simulation based on the first modeling information to obtain a first thermal analysis simulation result of the PCB board and a plurality of electronic components to be designed on the PCB board.

[0051] The first modeling information includes: the model and stacking structure of the PCB, and the device parameters of the risk components to be confirmed.

[0052] Specifically, the PCB model and stacking structure include the PCB stacking spacing, copper foil thickness, copper foil structure and other PCB related design models and design data.

[0053] Specifically, the device parameters include: power consumption and thermal resistance from the node of the electronic component to the upper surface of the package. The device parameters also include: at least one of the thermal resistance from the node of the electronic component to the lower surface of the package and the thermal resistance from the node of the electronic component to the PCB board.

[0054] For ease of explanation and illustration, the thermal resistance from the junction of the electronic component to the upper surface of the package is defined as RθJC (Junction-to-case thermal resistance)-top, the thermal resistance from the junction of the electronic component to the lower surface of the package is defined as RθJC-bot, and the thermal resistance from the junction of the electronic component to the PCB board is defined as RθJB (Junction-to-board thermal resistance).

[0055] That is, the device parameters of the risk component to be confirmed include: one of RθJC-bot and RθJB of the risk component to be confirmed, the power consumption of the confirmed risk component, and RθJC-top of the confirmed risk component.

[0056] The first thermal analysis simulation result includes the internal junction temperature of the risk components to be confirmed. Therefore, the heating condition of each risk component to be confirmed is simulated through step S120.

[0057] In some embodiments, the first thermal analysis simulation result further includes a heat distribution diagram of the PCB board corresponding to the first modeling information.

[0058] In practical applications, the first thermal analysis simulation result can be obtained by inputting the first modeling information into a finite element analysis solver.

[0059] The finite element analysis solver can be IcePak, PowerDC, etc.

[0060] Please continue to refer to Figure 2 , with respect to step S100, among a plurality of electronic components to be designed on a PCB board, the method for determining risky components with heating risks based on the power consumption of each electronic component also includes:

[0061] Step S130 , determining the to-be-confirmed risk component having an internal junction temperature of the device exceeding a preset temperature range as a risk component.

[0062] The preset temperature range may be an empirical value range or an experimental value range. Further, the preset temperature threshold range is a required junction temperature range when the electronic component works stably.

[0063] Preferably, for industrial electrical components, the preset temperature threshold range may be -40° C. to 125° C., or -40° C. to 150° C. Of course, the preset temperature threshold range may also be in other ranges according to the device characteristics of the electronic components.

[0064] Through step S110 to step S130, electronic components with heating risks are screened out as risk components among the electronic components whose power consumption exceeds the preset power consumption threshold. Therefore, the screening of risk components with heating risks is more accurate, which is beneficial to further achieve good heat dissipation effect, save the design and time cost of the heat sink, save the object cost of the heat sink, and is beneficial to the miniaturization of PCB board components.

[0065] Please continue to refer to Figure 1 For step S200, the first thermal resistance parameter and the second thermal resistance parameter of the risk component are obtained, wherein the first thermal resistance parameter is the thermal resistance from the node of the electronic component to the upper surface of the package, and the second thermal resistance parameter is the thermal resistance from the node of the electronic component to the lower surface of the package, or the thermal resistance from the node of the electronic component to the PCB board.

[0066] That is to say, the first thermal resistance parameter of the risk component is RθJC-top of the risk component, and the second thermal resistance parameter of the risk component is RθJC-bot or RθJB of the risk component.

[0067] Since the lower surface of the package of the risk component is set on the PCB board, the actual difference between the two is small or zero. Therefore, selecting RθJC-bot or RθJB of the risk component as the second thermal resistance parameter of the risk component can obtain a similar or equal conclusion.

[0068] By acquiring the first thermal resistance parameter and the second thermal resistance parameter of the risk component, the heat dissipation capacity of the upper and lower heat dissipation channels of the risk component itself can be determined.

[0069] Please continue to refer to Figure 1 The method of comparing the first thermal resistance parameter with the second thermal resistance parameter further includes: determining whether the second thermal resistance parameter of the risk component is greater than the first thermal resistance parameter.

[0070] Specifically, it is determined whether the second thermal resistance parameter of the risk component is greater than the first thermal resistance parameter:

[0071] If yes, executing step S300, disposing a heat sink on the upper surface of the package of the risk component;

[0072] If not, continue to determine whether the second thermal resistance parameter is less than the preset thermal resistance value:

[0073] If the conditions are met, step S410 is executed to provide a heat sink corresponding to the risk component on the side of the PCB board facing away from the risk component.

[0074] In the above heat dissipation design method, after determining that there is a risk component with a risk of heating, a heat sink is set on the upper surface of the package of the risk component based on the second thermal resistance parameter being greater than the first thermal resistance parameter, and based on the second thermal resistance parameter being less than or equal to the first thermal resistance parameter, it is further determined whether the second thermal resistance parameter is less than a preset thermal resistance value: if satisfied, a heat sink corresponding to the risk component is set on the side of the PCB board facing away from the risk component. Therefore, when performing heat dissipation design, not only are risk components with risks that need to be dissipated screened out, but also, on the basis of considering the heat dissipation capacity of the upper and lower heat dissipation channels of the risk component itself, a heat sink with better heat dissipation capacity and better ability to help heat dissipation is set on the upper surface of the package of the risk component and on the side of the PCB board facing away from the risk component, thereby achieving both good heat dissipation effect, saving design and time costs of heat sinks, saving the object cost of heat sinks, and facilitating miniaturization of PCB board components.

[0075] Specifically, compared with the heat conduction loss that occurs when the heat sink is installed on the upper surface of the package of the risk component, the heat conduction loss caused by the influence of the PCB board when the heat sink is installed on the PCB board below the risk component is greater. Therefore, by setting a heat sink on the upper surface of the package of the risk component based on the second thermal resistance parameter being greater than the first thermal resistance parameter, and judging whether the second thermal resistance parameter is less than the preset thermal resistance value based on the second thermal resistance parameter being less than or equal to the first thermal resistance parameter: if it is satisfied, setting a heat sink corresponding to the risk component on the side of the PCB board facing away from the risk component can more specifically judge and screen out locations with better heat dissipation capabilities and better ability to help dissipate heat.

[0076] It should be noted that, in the case of multiple risk components, each risk component has its own heat sink, so there is a corresponding relationship between the two.

[0077] It should be understood that, since the first thermal resistance parameter is compared with the second thermal resistance parameter: based on the second thermal resistance parameter being greater than the first thermal resistance parameter, step S300 is executed to set a heat sink on the upper surface of the package of the risk component; and based on the second thermal resistance parameter being less than or equal to the first thermal resistance parameter, it is continued to be determined whether the second thermal resistance parameter is less than the preset thermal resistance value: if satisfied, step S410 is executed to set a heat sink corresponding to the risk component on the side of the PCB board facing away from the risk component. Therefore, other judgment methods can also be used to compare the first thermal resistance parameter with the second thermal resistance parameter to determine the judgment step of executing step S410 and executing step S300, for example, to determine whether the second thermal resistance parameter of the risk component is less than or equal to the first thermal resistance parameter, and so on.

[0078] Preferably, the preset thermal resistance value is K times the first thermal resistance parameter of the risk component, and the range of K is 0 to 0.4.

[0079] In other embodiments, the preset thermal resistance value may also be determined based on thermal resistance information of the PCB board.

[0080] The material of the heat sink can be metal, thermally conductive resin, thermally conductive glue, thermally conductive silicone grease, etc. The structure of the heat sink can be a plate structure, a fin structure, a flat heat dissipation glue structure, etc.

[0081] Please continue to refer to Figure 1 The heat dissipation design method also includes: continuing to determine whether the second thermal resistance parameter is less than a preset thermal resistance value: if not satisfied, executing step S420, performing a first simulation verification, and based on the result of the first simulation verification, setting a heat dissipation member corresponding to the risk component on the PCB board.

[0082] Please refer to Figure 3 , for step S420, a first simulation verification is performed, and based on the result of the first simulation verification, a method for setting a heat sink corresponding to the risk component on the PCB board includes:

[0083] Step S421, performing a second simulation based on the second modeling information to obtain second thermal analysis simulation results of the PCB board and a plurality of electronic components to be designed on the PCB board;

[0084] Step S422: Perform a third simulation based on the third modeling information to obtain a third thermal analysis simulation result of the PCB board and a plurality of electronic components to be designed on the PCB board.

[0085] The second modeling information includes the model and stacking structure of the PCB, the device parameters of the risk component, and the heat sink model set on the upper surface of the package of the risk component. The second thermal analysis simulation result includes the device internal junction temperature of the risk component when the risk component is provided with a heat sink on the upper surface of its package.

[0086] The second simulation can simulate the heating condition of the risk component when the heat sink is arranged on the upper surface of the package of the risk component.

[0087] The third modeling information includes the model and stacking structure of the PCB, the device parameters of the risk component, and the heat sink model corresponding to the risk component arranged on the side of the PCB board facing away from the risk component. The third thermal analysis simulation result includes the device internal junction temperature of the risk component when the heat sink corresponding to the risk component is arranged on the side of the PCB board facing away from the risk component.

[0088] The third simulation can simulate the heating condition of the risk components when the heat sink is arranged on the side of the PCB board facing away from the risk components.

[0089] In some embodiments, the second thermal analysis simulation result further includes a heat distribution diagram of the PCB board corresponding to the second modeling information. The third thermal analysis simulation result further includes a heat distribution diagram of the PCB board corresponding to the third modeling information.

[0090] The specific methods of performing the second simulation and the third simulation are similar to the methods of performing the first simulation, so please refer to the aforementioned related descriptions of the first simulation.

[0091] Please continue to refer to Figure 3 , for step S420, a first simulation verification is performed, and based on the result of the first simulation verification, the method of setting a heat sink corresponding to the risk component on the PCB board also includes:

[0092] Compare the device internal junction temperature of the second thermal analysis simulation result with the device internal junction temperature of the third thermal analysis simulation result:

[0093] If the internal junction temperature of the device in the second thermal analysis simulation result is lower than the internal junction temperature of the device in the third thermal analysis simulation result, executing step S423, disposing a heat sink on the upper surface of the package of the risk component;

[0094] If the internal junction temperature of the device in the second thermal analysis simulation result is greater than the internal junction temperature of the device in the third thermal analysis simulation result, step S424 is executed to set a heat sink corresponding to the risk component on the side of the PCB board facing away from the risk component.

[0095] Since the heat conduction loss caused by the influence of the PCB board when the heat sink is installed on the PCB board below the risk component is greater than the heat conduction loss caused by the heat sink installed on the upper surface of the package of the risk component, it is difficult to directly determine the optimal setting position of the heat sink when the second thermal resistance parameter is greater than or equal to the preset thermal resistance value. By simulating and comparing the heating conditions of the risk component when the heat sink is set at two different positions, and executing step S423 or step S424 respectively based on the above comparison results, the optimal setting position of the heat sink is more accurately screened and determined, thereby being conducive to having a good heat dissipation effect, saving the design and time cost of the heat sink, saving the object cost of the heat sink, and being conducive to the purpose of miniaturization of the PCB board assembly.

[0096] Please continue to refer to Figure 1 In this embodiment, after determining the setting scheme of the heat sink, the heat dissipation design method further includes: step S500, verifying the setting scheme result of the heat sink.

[0097] Specifically, in step S500, the method for verifying the result of the heat sink setting solution includes:

[0098] Step S510, performing a fourth simulation based on the fourth modeling information to obtain a fourth thermal analysis simulation result of the PCB board and a plurality of electronic components to be designed on the PCB board;

[0099] Step S520: Perform a fifth simulation based on the fifth modeling information to obtain a fifth thermal analysis simulation result of the PCB board and the plurality of electronic components to be designed on the PCB board.

[0100] Among them, the fourth modeling information includes the model and stacking structure of the PCB, the device parameters of the risk component, and the heat sink model set on the upper surface of the package of the risk component. The fourth thermal analysis simulation result includes the device internal junction temperature of the risk component when the risk component is provided with a heat sink on the upper surface of its package. The fourth simulation can simulate: when the heat sink is set on the upper surface of the package of the risk component, the heating condition of the risk component.

[0101] Among them, the fifth modeling information includes the model and stacking structure of the PCB, the device parameters of the risk components, and the heat sink model of the corresponding risk components arranged on the side of the PCB board facing away from the risk components. The fifth thermal analysis simulation result includes the device internal junction temperature of the risk component when the heat sink corresponding to the risk component is arranged on the side of the PCB board facing away from the risk components. The fifth simulation can simulate: when the heat sink is arranged on the side of the PCB board facing away from the risk components, the heating condition of the risk components.

[0102] It should be understood that step S500 is a verification step, the purpose of which is to verify through simulation whether the setting position of the heat sink meets the predicted effect. The difference between step S500 and step S421 and step S422 in step S420 is that step S500 does not depend on the execution condition of step S420. In other words, step S500 can also be executed when the second thermal resistance parameter is not less than the preset thermal resistance value. Accordingly, the numerical range of each parameter in step S500 is greater than and includes the numerical range of each parameter in step S420. In addition, correspondingly, step S500 and step S420 can coexist or exist independently of each other.

[0103] In another embodiment, step S500 may not be performed.

[0104] Figure 4 It is a schematic structural diagram of a PCB board assembly according to an embodiment of the present invention.

[0105] An embodiment of the present invention further provides a PCB board assembly, including: a PCB board 1 and a heat sink 2 .

[0106] A plurality of electronic components are arranged on the PCB board 1, and the plurality of electronic components include a risk component 3. The heat sink 2 is arranged on a side of the PCB board 1 facing away from the risk component 3 and corresponds to the risk component 3.

[0107] The second thermal resistance parameter of the risk component 3 is less than the preset thermal resistance value when the heat sink 2 is not provided. The second thermal resistance parameter is the thermal resistance from the node of the electronic component to the lower surface of the package, or the thermal resistance from the node of the electronic component to the PCB board 1.

[0108] Preferably, the preset thermal resistance value is K times the first thermal resistance parameter of the risk component, and the range of K is 0 to 0.4.

[0109] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A heat dissipation design method, characterized in that: include: Among several electronic components to be designed on the PCB board, determine the risk components with heating risk based on the power consumption of each electronic component; Obtaining a first thermal resistance parameter and a second thermal resistance parameter of the risk component, wherein the first thermal resistance parameter is the thermal resistance from the node of the electronic component to the upper surface of the package, and the second thermal resistance parameter is the thermal resistance from the node of the electronic component to the lower surface of the package, or the thermal resistance from the node of the electronic component to the PCB board; Comparing the first thermal resistance parameter with the second thermal resistance parameter: Based on the fact that the second thermal resistance parameter is greater than the first thermal resistance parameter, a heat sink is provided on the upper surface of the package of the risk component; Based on the fact that the second thermal resistance parameter is less than or equal to the first thermal resistance parameter, determine whether the second thermal resistance parameter is less than a preset thermal resistance value: if satisfied, set a heat sink corresponding to the risk component on the side of the PCB board facing away from the risk component.

2. The heat dissipation design method according to claim 1, characterized in that: The preset thermal resistance value is K times the first thermal resistance parameter of the risk component, and the range of K is 0 to 0.

4.

3. The heat dissipation design method according to claim 1, characterized in that: The preset thermal resistance value is determined based on the thermal resistance information of the PCB board.

4. The heat dissipation design method according to claim 1, characterized in that: The method for determining risky components with heating risks based on the power consumption of each electronic component includes: among multiple electronic components to be designed on a PCB board, determining electronic components whose power consumption exceeds a preset power consumption threshold as risky components.

5. The heat dissipation design method according to claim 1, characterized in that: The method for determining risky components with heating risks based on the power consumption of each electronic component includes: Among multiple electronic components to be designed on the PCB board, electronic components whose power consumption exceeds a preset power consumption threshold are determined as risk components to be confirmed; Performing a first simulation based on the first modeling information to obtain a first thermal analysis simulation result of the PCB board and a number of electronic components to be designed on the PCB board, wherein the first modeling information includes a model and a stacking structure of the PCB, and device parameters of the risk components to be confirmed, wherein the device parameters include power consumption and a thermal resistance from a node of the electronic component to an upper surface of a package, and the device parameters also include at least one of a thermal resistance from a node of the electronic component to a lower surface of a package and a thermal resistance from a node of the electronic component to a PCB board, and the first thermal analysis simulation result includes a device internal junction temperature of the risk components to be confirmed; The risk component to be confirmed, which has an internal junction temperature of the device exceeding a preset temperature range, is determined as the risk component.

6. The heat dissipation design method according to claim 5, characterized in that: The preset temperature range is -40°C to 150°C.

7. The heat dissipation design method according to claim 5, characterized in that: The first thermal analysis simulation result also includes a heat distribution diagram of the PCB board corresponding to the first modeling information.

8. The heat dissipation design method according to claim 1, characterized in that: Based on the fact that the second thermal resistance parameter is less than or equal to the first thermal resistance parameter, determining whether the second thermal resistance parameter is less than a preset thermal resistance value: If not, a first simulation verification is performed, and based on the result of the first simulation verification, a heat sink corresponding to the risk component is provided on the PCB board, including: Performing a second simulation based on the second modeling information to obtain second thermal analysis simulation results of the PCB board and a number of electronic components to be designed on the PCB board, wherein the second modeling information includes a model and a stacking structure of the PCB, device parameters of the risk components, and a heat sink model disposed on the upper surface of the package of the risk components, and the second thermal analysis simulation results include an internal junction temperature of the risk component when the risk component is provided with a heat sink on the upper surface of its package; Performing a third simulation based on the third modeling information to obtain a third thermal analysis simulation result of the PCB board and a number of electronic components to be designed on the PCB board, wherein the third modeling information includes a model and a stacking structure of the PCB, device parameters of the risk components, and a heat sink model corresponding to the risk components and arranged on a side of the PCB board facing away from the risk components, wherein the third thermal analysis simulation result includes a device internal junction temperature of the risk components when a heat sink corresponding to the risk components is arranged on a side of the PCB board facing away from the risk components; The internal junction temperature of the device of the second thermal analysis simulation result is compared with the internal junction temperature of the device of the third thermal analysis simulation result: if the internal junction temperature of the device of the second thermal analysis simulation result is lower than the internal junction temperature of the device of the third thermal analysis simulation result, a heat sink is provided on the upper surface of the package of the risk component; if the internal junction temperature of the device of the second thermal analysis simulation result is higher than the internal junction temperature of the device of the third thermal analysis simulation result, a heat sink corresponding to the risk component is provided on the side of the PCB board facing away from the risk component.

9. The heat dissipation design method according to claim 1, characterized in that: The material of the heat sink includes at least one of metal, thermally conductive resin, thermally conductive glue and thermally conductive silicone grease.

10. The heat dissipation design method according to claim 1, characterized in that: The types of risky components include: ARM, FPGA, power conversion module and driver chip.

11. The heat dissipation design method according to claim 1, characterized in that: Also includes: After determining the arrangement scheme of the heat sink, verifying the arrangement scheme result of the heat sink; The method for verifying the result of the setting scheme of the heat sink comprises: Performing a fourth simulation based on the fourth modeling information to obtain a fourth thermal analysis simulation result of the PCB board and a number of electronic components to be designed on the PCB board, the fourth modeling information including a model and a stacking structure of the PCB, device parameters of the risk components, and a heat sink model disposed on the upper surface of the package of the risk components, the fourth thermal analysis simulation result including an internal junction temperature of the risk component when the risk component is provided with a heat sink on the upper surface of its package; A fifth simulation is performed based on the fifth modeling information to obtain a fifth thermal analysis simulation result of the PCB board and several electronic components to be designed on the PCB board, the fifth modeling information including the model and stacking structure of the PCB, the device parameters of the risk components, and a heat sink model corresponding to the risk components arranged on the side of the PCB board facing away from the risk components, and the fifth thermal analysis simulation result includes the internal junction temperature of the risk components when a heat sink corresponding to the risk components is arranged on the side of the PCB board facing away from the risk components.

12. A PCB board assembly, characterized in that: include: A PCB board, wherein a plurality of electronic components are arranged on the PCB board, and a plurality of the electronic components include risky components; A heat sink, arranged on a side of the PCB board facing away from the risk component and corresponding to the risk component; Among them, the second thermal resistance parameter of the risk component when the heat sink is not set is less than the preset thermal resistance value, and the second thermal resistance parameter is the thermal resistance from the node of the electronic component to the lower surface of the package, or the thermal resistance from the node of the electronic component to the PCB board.

13. The PCB board assembly according to claim 12, characterized in that: The preset thermal resistance value is K times the first thermal resistance parameter of the risk component, the first thermal resistance parameter is the thermal resistance from the node of the electronic component to the upper surface of the package, and the range of K is 0 to 0.4.

Images