Multilayer printed circuit board for millimeter wave active phased array antenna and manufacturing method thereof

Abstract

The application discloses a kind of multilayer printed circuit board of millimeter wave active phased array antenna and manufacturing method, multilayer printed circuit board includes the 1st layer board, the 2nd layer board, the 14th layer board, the 19th layer board, the 22nd layer board, first via, second via and third via, the outer surface of the 1st layer board is provided with radio frequency module and power module;The 2nd layer board is provided with power division network module;The 14th layer board is used to transmit radio frequency signal;The 19th layer board is provided with radiation excitation module;The 22nd layer board is provided with antenna array radiation module, and antenna array radiation module and radiation excitation module gap coupling;First via is used to realize signal transmission between radio frequency module and power division network module;Second via is used to realize radio frequency signal output by radio frequency module to the 14th layer board transmission;Third via is used to realize radio frequency signal transmission of the 14th layer board to radiation excitation module.It has the advantages such as high integration, reasonable spatial layout, low production cost, stable signal transmission performance etc..

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board, in particular to a multilayer printed circuit board for millimeter wave active phased array antenna and a manufacturing method of the multilayer printed circuit board. BACKGROUND

[0002] Traditional communication antennas are mechanical passive phase shifters, which are large in size and weight, not suitable for automatic production, high in processing cost, slow in phase shift control, and poor in precision.

[0003] The phased array antenna radio frequency system includes various components, such as an antenna array, a radio frequency module array, a feed network, a wave control module, a power module, etc. The traditional phased array antenna system has the following disadvantages: 1. Different printed boards are used to carry different modules, which results in a large number of printed boards in the entire phased array antenna system, a complex electrical connection relationship between the modules, a complicated spatial layout, and a high installation and debugging difficulty; 2. Each printed board has a large number of layers, and the cost of combining and connecting the layers is high. Moreover, the combined printed board is large in size, which is not convenient for application in limited space.

[0004] It can be seen that the prior art has the technical problems of low integration of the radio frequency modules in the phased array antenna radio frequency system, a large number of printed boards, a complicated spatial layout, high production and application cost of the phased array antenna radio frequency system, and difficulty in application in limited space. SUMMARY

[0005] The present application aims to at least solve one of the technical problems in the prior art, and provides a multilayer printed circuit board for millimeter wave active phased array antenna and a manufacturing method of the multilayer printed circuit board, which has the advantages of high integration, reasonable spatial layout, low production and manufacturing cost, and stable signal transmission performance.

[0006] In a first aspect, the present application provides a multilayer printed circuit board for millimeter wave active phased array antenna, comprising a first layer board, a second layer board, a fourteenth layer board, a nineteenth layer board, a twenty-second layer board, a first via, a second via, and a third via, wherein:

[0007] An outer surface of the first layer board is provided with a radio frequency module and a power module, the radio frequency module is provided with a radio frequency interface and a communication interface, and the power module is provided with a power interface;

[0008] The second layer board is located below the first layer board, and the second layer board is provided with a power division network module, which is implemented by an embedded thin film resistor;

[0009] The fourteenth layer board is located below the second layer board, and the fourteenth layer board is used for transmitting radio frequency signals.

[0010] The 19th layer board is located below the 14th layer board, and the 19th layer board is provided with a radiation excitation module;

[0011] The 22nd layer board is located below the 19th layer board, and the 22nd layer board is provided with an antenna array radiation module, and the antenna array radiation module is gap-coupled with the radiation excitation module;

[0012] The first via hole penetrates from the 1st layer board to the 2nd layer board to realize signal transmission between the radio frequency module and the power division network module;

[0013] The second via hole penetrates from the 1st layer board to the 14th layer board to realize transmission of the radio frequency signal output by the radio frequency module to the 14th layer board;

[0014] The third via hole penetrates from the 14th layer board to the 19th layer board to realize transmission of the radio frequency signal of the 14th layer board to the radiation excitation module.

[0015] The multi-layer printed circuit board of the millimeter wave active phased array antenna provided by the embodiment of the application has at least the following beneficial effects: the radio frequency module, the power supply module, the power division network module, the radiation excitation module and the antenna array radiation module are integrated and laminated by using the multi-layer board, the radio frequency signal received from the radio frequency interface is transmitted to the power division network module of the 2nd layer board through the first via hole and returned to the radio frequency module of the 1st layer board, then transmitted to the 14th layer board through the second via hole, and transmitted to the radiation excitation module of the 19th layer board through the third via hole, and finally transmitted to the antenna array radiation module of the 22nd layer board through gap coupling by the radiation excitation module, the phased array antenna function is realized through the unique lamination mode, the radio frequency signal is transmitted to the intermediate layer through the via hole, the radio frequency signal crosstalk is avoided, and stable signal transmission is realized; the multi-layer printed circuit board of the millimeter wave active phased array antenna has the advantages of high integration, reasonable spatial layout, low production cost, stable signal transmission performance and the like.

[0016] The multi-layer printed circuit board provided by some embodiments of the application further comprises a 5th layer board, a 10th layer board, a 12th layer board and a fourth via hole;

[0017] The 5th layer board is located between the 2nd layer board and the 14th layer board, and the 5th layer board is provided with radio frequency control lines;

[0018] The 10th layer board is located between the 5th layer board and the 14th layer board, and the 10th layer board is provided with radio frequency control lines;

[0019] The 12th layer board is located between the 10th layer board and the 14th layer board, and the 12th layer board is provided with radio frequency control lines;

[0020] The fourth via hole passes through the first layer board to the twelfth layer board to realize electrical connection between the radio frequency control trace and the radio frequency module.

[0021] According to some embodiments of the present application, the multi-layer printed circuit board further comprises a third layer board.

[0022] The third layer board is located between the second layer board and the fifth layer board, and the third layer board is provided with a radio frequency control trace.

[0023] According to some embodiments of the present application, the multi-layer printed circuit board further comprises a seventh layer board.

[0024] The seventh layer board is located between the fifth layer board and the tenth layer board, and the seventh layer board is used for transmitting a power voltage of a first voltage level.

[0025] The fourth via hole is further used for realizing electrical connection between the seventh layer board and the power module.

[0026] According to some embodiments of the present application, the multi-layer printed circuit board further comprises a ninth layer board.

[0027] The ninth layer board is located between the seventh layer board and the tenth layer board, and the ninth layer board is used for transmitting a power voltage of a second voltage level.

[0028] The fourth via hole is further used for realizing electrical connection between the ninth layer board and the power module.

[0029] According to some embodiments of the present application, the multi-layer printed circuit board further comprises a twenty-first layer board and a fifth via hole.

[0030] The twenty-first layer board is located between the nineteenth layer board and the twenty-second layer board, and the twenty-first layer board is grounded and realizes gap coupling with the nineteenth layer board through copper-clad hollowing.

[0031] The fifth via hole passes through the twenty-first layer board to the twenty-second layer board to realize electrical connection between the twenty-first layer board and the antenna array radiation module.

[0032] According to some embodiments of the present application, the multi-layer printed circuit board further comprises a fifteenth layer board, a sixteenth layer board, a seventeenth layer board and an eighteenth layer board located between the fourteenth layer board and the nineteenth layer board.

[0033] The fifteenth layer board and the eighteenth layer board are wireless circuit layer boards.

[0034] The sixteenth layer board and the seventeenth layer board are ground circuit layer boards.

[0035] In a second aspect, the embodiments of the present application provide a manufacturing method of a multi-layer printed circuit board, comprising:

[0036] drilling the first layer board and the second layer board to obtain a first via, the first via penetrating from the first layer board to the second layer board;

[0037] firstly laminating the first layer board and the second layer board, the third layer board and the fourth layer board, and drilling to obtain a seventh via, the seventh via penetrating from the first layer board to the fourth layer board;

[0038] secondly laminating the first layer board and the second layer board, the third layer board and the fourth layer board, the fifth layer board and the sixth layer board, the seventh layer board and the eighth layer board, the ninth layer board and the tenth layer board, the eleventh layer board and the twelfth layer board, the thirteenth layer board and the fourteenth layer board, the fifteenth layer board and the sixteenth layer board, and drilling to obtain a second via, a fourth via, an eighth via and a ninth via, the second via penetrating from the first layer board to the fourteenth layer board, the fourth via penetrating from the first layer board to the twelfth layer board, the eighth via penetrating from the first layer board to the sixteenth layer board, and the ninth via penetrating from the thirteenth layer board to the sixteenth layer board;

[0039] drilling the twenty-first layer board and the twenty-second layer board to obtain a fifth via, the fifth via penetrating from the twenty-first layer board to the twenty-second layer board;

[0040] thirdly laminating the seventeenth layer board and the eighteenth layer board, the nineteenth layer board and the twentieth layer board, the twenty-first layer board and the twenty-second layer board, the twenty-third layer board and the twenty-fourth layer board, and drilling to obtain a sixth via, the sixth via penetrating from the seventeenth layer board to the twenty-first layer board;

[0041] fourthly laminating the first layer board and the second layer board, the third layer board and the fourth layer board, the fifth layer board and the sixth layer board, the seventh layer board and the eighth layer board, the ninth layer board and the tenth layer board, the eleventh layer board and the twelfth layer board, the thirteenth layer board and the fourteenth layer board, the fifteenth layer board and the sixteenth layer board, the seventeenth layer board and the eighteenth layer board, the nineteenth layer board and the twentieth layer board, the twenty-first layer board and the twenty-second layer board, the twenty-third layer board and the twenty-fourth layer board, and drilling to obtain a third via and a tenth via, the third via penetrating from the fourteenth layer board to the nineteenth layer board, and the tenth via penetrating from the first layer board to the twenty-fourth layer board.

[0042] According to the manufacturing method provided by some embodiments of the present application, the second via is formed by drilling through holes in the first to sixteenth layers and back drilling and resin filling the thirteenth to sixteenth layers;

[0043] The fourth via is formed by drilling through holes in the first to sixteenth layers and back drilling and resin filling the thirteenth to sixteenth layers;

[0044] The ninth via is formed by drilling through holes in the first to sixteenth layers and back drilling and resin filling the first to twelfth layers.

[0045] According to the manufacturing method provided by some embodiments of the present application, the third via is formed by drilling through holes in the first to twenty-fourth layers and back drilling and resin filling the first to thirteenth layers and the twentieth to twenty-fourth layers;

[0046] The sixth via is formed by drilling through holes in the seventeenth to twenty-fourth layers and back drilling and resin filling the twenty-second to twenty-fourth layers.

[0047] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art upon examination of the following or can be learned by practice of the present application. The objects and other advantages of the present application can be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0048] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the present application and, together with the description, further serve to explain the principles of the application and to enable a person skilled in the pertinent art to make and use the application.

[0049] The present application will be further described by way of example with reference to the accompanying drawings in which:

[0050] Figure 1 is a module block diagram of the multilayer printed circuit board provided by the embodiments of the present application;

[0051] Figure 2 is a layer distribution diagram of the multilayer printed circuit board provided by the embodiments of the present application;

[0052] Figure 3 is a flow chart of the manufacturing method of the multilayer printed circuit board provided by the embodiments of the present application. DETAILED DESCRIPTION

[0053] In the description of the embodiments of the present application, one or more is meant to be one or more, more than two is meant to be two or more, greater than, less than, more than, etc. are understood to not include the number, above, below, within, etc. are understood to include the number, "at least one" means one or more, "at least one of the following" and the like means any combination of the items, including single or multiple items. If there is a description of "first", "second", etc., it is only used to distinguish technical features for the purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0054] In the description of the embodiments of the present application, one or more is meant to be one or more, more than two is meant to be two or more, greater than, less than, more than, etc. are understood to not include the number, above, below, within, etc. are understood to include the number, "at least one" means one or more, "at least one of the following" and the like means any combination of the items, including single or multiple items. If there is a description of "first", "second", etc., it is only used to distinguish technical features for the purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0055] It should be noted that the terms such as setting, installing, connecting, etc. in the embodiments of the present application should be understood broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in the embodiments of the present application in combination with the specific content of the technical solutions. For example, the term "connection" can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium.

[0056] It should be noted that the technical features involved in each of the embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0057] Traditional communication antennas are mechanical passive phase shifters, which are large in size and weight, not suitable for automatic production, high in processing cost, slow in control phase shift, and poor in precision.

[0058] The phased array antenna RF system contains various components, such as: antenna array, RF module array, feed network, wave control module, power module, etc. The traditional phased array antenna system has the following shortcomings: 1. Different printed boards are used to carry different modules, which results in a large number of printed boards in the entire phased array antenna system, complex electrical connection relationship between modules, complicated spatial layout, and high installation and debugging difficulty; 2. Each printed board has multiple layers, the cost of combining layers with each other is high, and the size of the finished printed board after combination is also large, which is not convenient for application under limited space conditions.

[0059] It can be seen that the prior art has the technical problems of low integration of each RF module in the phased array antenna RF system, a large number of printed boards, complex spatial layout, resulting in high production and application cost of the phased array antenna RF system, and difficulty in application under limited space conditions.

[0060] Based on this, the embodiment of the present application provides a kind of multilayer printed circuit board of millimeter wave active phased array antenna and the production method of multilayer printed circuit board, with high integration, space layout is reasonable, production cost is low, signal transmission performance stable advantage.

[0061] The embodiment of the present application is further described below with reference to the drawings.

[0062] Referring to Figure 1 And Figure 2 The first aspect embodiment of the present application provides a kind of multilayer printed circuit board of millimeter wave active phased array antenna, including the first layer board L1, the second layer board L2, the 14th layer board L14, the 19th layer board L19, the 22nd layer board L22, the first via K01, the second via K02 and the third via K03, wherein:

[0063] The outer surface of the first layer board L1 is provided with radio frequency module and power module, radio frequency module is provided with radio frequency interface and communication interface, and power module is provided with power interface;

[0064] The second layer board L2 is below the first layer board L1, and the second layer board L2 is provided with power dividing network module, and power dividing network module is realized by embedding thin film resistance;

[0065] The 14th layer board L14 is below the second layer board L2, and the 14th layer board L14 is used to transmit radio frequency signal;

[0066] The 19th layer board L19 is below the 14th layer board L14, and the 19th layer board L19 is provided with radiation excitation module;

[0067] The 22nd layer board L22 is below the 19th layer board L19, and the 22nd layer board L22 is provided with antenna array radiation module, and antenna array radiation module is gap coupled with radiation excitation module;

[0068] The first via K01 is from the first layer board L1 to the second layer board L2, to realize the signal transmission between radio frequency module and power dividing network module;

[0069] The second via K02 is from the first layer board L1 to the 14th layer board L14, to realize that radio frequency signal output by radio frequency module is transmitted to the 14th layer board L14;

[0070] The third via K03 is from the 14th layer board L14 to the 19th layer board L19, to realize that the radio frequency signal of the 14th layer board L14 is transmitted to radiation excitation module.

[0071] The multilayer printed circuit board provided by the embodiment of the application integrates the radio frequency module, the power module, the power division network module, the radiation excitation module and the antenna array radiation module through the multilayer board, the radio frequency signal received from the radio frequency interface is transmitted to the power division network module on the second layer L2 through the first via K01 and returned to the radio frequency module on the first layer L1, then transmitted to the fourteenth layer L14 through the second via K02 and the nineteenth layer L19 through the third via K03, and finally transmitted to the antenna array radiation module on the twenty-second layer L22 through the gap coupling of the radiation excitation module, the phased array antenna function is realized through the unique lamination mode, the radio frequency signal is transmitted through the via to the intermediate layer, the radio frequency signal crosstalk is avoided, and the stable signal transmission is realized; the multilayer printed circuit board has the advantages of high integration, reasonable spatial layout, low production cost, stable signal transmission performance and the like.

[0072] With reference to Figure 2 In the multilayer printed circuit board provided by some embodiments of the application, the fifth layer L5, the tenth layer L10, the twelfth layer L12 and the fourth via K04 are further included.

[0073] The fifth layer L5 is located between the second layer L2 and the fourteenth layer L14, and the fifth layer L5 is provided with radio frequency control wires.

[0074] The tenth layer L10 is located between the fifth layer L5 and the fourteenth layer L14, and the tenth layer L10 is provided with radio frequency control wires.

[0075] The twelfth layer L12 is located between the tenth layer L10 and the fourteenth layer L14, and the twelfth layer L12 is provided with radio frequency control wires.

[0076] The fourth via K04 penetrates from the first layer L1 to the twelfth layer L12 to realize the electrical connection between the radio frequency control wires and the radio frequency module.

[0077] In the embodiment, the radio frequency control wires adopt the wires on the fifth layer L5, the tenth layer L10 and the twelfth layer L12, which well realizes the connection from the connector to the radio frequency module, avoids the interference and realizes the stable signal transmission.

[0078] With reference to Figure 2 In the multilayer printed circuit board provided by some embodiments of the application, the third layer L3 is further included.

[0079] The third layer L3 is located between the second layer L2 and the fifth layer L5, and the third layer L3 is provided with radio frequency control wires.

[0080] In the embodiment, the reserved radio frequency control wires are further provided on the third layer L3 as a backup.

[0081] Referring to Figure 2 In some embodiments of the multi-layer printed circuit board provided by the application, a seventh layer L7 is further included;

[0082] The seventh layer L7 is located between the fifth layer L5 and the tenth layer L10, and the seventh layer L7 is used for transmitting a power voltage of a first voltage level.

[0083] The fourth via hole K04 is further used for realizing electrical connection between the seventh layer L7 and the power module.

[0084] In this embodiment, the power voltage of the first voltage level transmitted by the seventh layer L7 can be 1.2V, and the power voltage is transmitted by using an inner electric layer to avoid interference.

[0085] Referring to Figure 2 In some embodiments of the multi-layer printed circuit board provided by the application, a ninth layer L9 is further included;

[0086] The ninth layer L9 is located between the seventh layer L7 and the tenth layer L10, and the ninth layer L9 is used for transmitting a power voltage of a second voltage level.

[0087] The fourth via hole K04 is further used for realizing electrical connection between the ninth layer L9 and the power module.

[0088] In this embodiment, the power voltage of the second voltage level transmitted by the ninth layer L9 can be 3.3V, and the power voltage is transmitted by using an inner electric layer to avoid interference.

[0089] Referring to Figure 2 In some embodiments of the multi-layer printed circuit board provided by the application, a twenty-first layer L21 and a fifth via hole K05 are further included.

[0090] The twenty-first layer L21 is located between the nineteenth layer L19 and the twenty-second layer L22, and the twenty-first layer L21 is grounded and gap-coupled to the nineteenth layer L19 by a copper-clad hollow.

[0091] The fifth via hole K05 penetrates from the twenty-first layer L21 to the twenty-second layer L22 to realize electrical connection between the twenty-first layer L21 and the antenna array radiation module.

[0092] In this embodiment, the radiation excitation module of the nineteenth layer L19 is gap-coupled to the twenty-first layer L21, and then connected to the antenna array radiation module of the twenty-second layer L22 through the fifth via hole K05, to realize electrical connection of the radio frequency signal.

[0093] Referring to Figure 2In some embodiments of the present application, the multilayer printed circuit board further comprises a 15th layer L15, a 16th layer L16, a 17th layer L17 and an 18th layer L18 between the 14th layer L14 and the 19th layer L19.

[0094] The 15th layer L15 and the 18th layer L18 are wireless circuit layers.

[0095] The 16th layer L16 and the 17th layer L17 are ground circuit layers.

[0096] In this embodiment, through the 15th layer L15 to the 18th layer L18, the isolation between the radio frequency signals transmitted by the 14th layer L14 and the radiation excitation module provided by the 19th layer L19 is achieved, avoiding mutual interference.

[0097] In addition, referring to Figure 2 In some embodiments of the present application, the multilayer printed circuit board further comprises a 4th layer L4 between the 3rd layer L3 and the 5th layer L5, a 6th layer L6 between the 5th layer L5 and the 7th layer L7, an 8th layer L8 between the 7th layer L7 and the 9th layer L9, an 11th layer L11 between the 10th layer L10 and the 12th layer L12, a 13th layer L13 between the 12th layer L12 and the 14th layer L14, a 20th layer L20 between the 19th layer L19 and the 21st layer L21, a 23rd layer below the 22nd layer, and a 24th layer below the 23rd layer. The 4th layer L4, the 6th layer L6, the 8th layer L8, the 11th layer L11 and the 13th layer L13 are used for grounding, and the 20th layer L20, the 23rd layer and the 24th layer are empty layers without copper foil and wireless circuit.

[0098] In addition, continuing to refer to Figure 2 The multilayer printed circuit board is further provided with a sixth via hole K06, a seventh via hole K07, an eighth via hole K08, a ninth via hole K09 and a tenth via hole K10. The sixth via hole K06 penetrates from the 17th layer L17 to the 21st layer L21; the seventh via hole K07 penetrates from the 1st layer L1 to the 4th layer L4; the eighth via hole K08 penetrates from the 1st layer L1 to the 16th layer L16; the ninth via hole K09 penetrates from the 13th layer L13 to the 16th layer L16; and the tenth via hole K10 penetrates from the 1st layer L1 to the 24th layer L24.

[0099] In addition, the medium layer is arranged between the first layer plate L1 and the second layer plate L2, between the third layer plate L3 and the fourth layer plate L4, between the fifth layer plate L5 and the sixth layer plate L6, between the seventh layer plate L7 and the eighth layer plate L8, between the ninth layer plate L9 and the tenth layer plate L10, between the eleventh layer plate L11 and the twelfth layer plate L12, between the thirteenth layer plate L13 and the fourteenth layer plate L14, between the fifteenth layer plate L15 and the sixteenth layer plate L16, between the seventeenth layer plate L17 and the eighteenth layer plate L18, between the nineteenth layer plate L19 and the twentieth layer plate L20, between the twenty-first layer plate L21 and the twenty-second layer plate L22, and between the twenty-third layer plate L23 and the twenty-fourth layer plate L24.

[0100] The PP plate is arranged between the second layer plate L2 and the third layer plate L3, between the fourth layer plate L4 and the fifth layer plate L5, between the sixth layer plate L6 and the seventh layer plate L7, between the eighth layer plate L8 and the ninth layer plate L9, between the tenth layer plate L10 and the eleventh layer plate L11, between the twelfth layer plate L12 and the thirteenth layer plate L13, between the fourteenth layer plate L14 and the fifteenth layer plate L15, between the sixteenth layer plate L16 and the seventeenth layer plate L17, between the eighteenth layer plate L18 and the nineteenth layer plate L19, between the twentieth layer plate L20 and the twenty-first layer plate L21, between the twenty-second layer plate L22 and the twenty-third layer plate L23.

[0101] With reference to Figure 3 In a second aspect, the present application provides a manufacturing method of a multi-layer printed circuit board, which comprises but is not limited to steps S310 to S360, and specifically:

[0102] In step S310, the first layer plate L1 and the second layer plate L2 are drilled to obtain a first via K01, and the first via K01 penetrates from the first layer plate L1 to the second layer plate L2.

[0103] In step S320, the first layer plate L1 and the second layer plate L2, the third layer plate L3 and the fourth layer plate L4 are first laminated, and drilled to obtain a seventh via K07, and the seventh via K07 penetrates from the first layer plate L1 to the fourth layer plate L4.

[0104] Step S330: the first layer plate L1 and the second layer plate L2, the third layer plate L3 and the fourth layer plate L4, the fifth layer plate L5 and the sixth layer plate L6, the seventh layer plate L7 and the eighth layer plate L8, the ninth layer plate L9 and the tenth layer plate L10, the eleventh layer plate L11 and the twelfth layer plate L12, the thirteenth layer plate L13 and the fourteenth layer plate L14, the fifteenth layer plate L15 and the sixteenth layer plate L16 are secondly pressed, and drilling processing is performed to obtain the second via hole K02, the fourth via hole K04, the eighth via hole K08 and the ninth via hole K09; the second via hole K02 passes through the first layer plate L1 to the fourteenth layer plate L14; the fourth via hole K04 passes through the first layer plate L1 to the twelfth layer plate L12; the eighth via hole K08 passes through the first layer plate L1 to the sixteenth layer plate L16; the ninth via hole K09 passes through the thirteenth layer plate L13 to the sixteenth layer plate L16;

[0105] Step S340: the twenty-first layer plate L21 and the twenty-second layer plate L22 are drilled to obtain the fifth via hole K05; the fifth via hole K05 passes through the twenty-first layer plate L21 to the twenty-second layer plate L22;

[0106] Step S350: the seventeenth layer plate L17 and the eighteenth layer plate L18, the nineteenth layer plate L19 and the twentieth layer plate L20, the twenty-first layer plate L21 and the twenty-second layer plate L22, the twenty-third layer plate L23 and the twenty-fourth layer plate L24 are thirdly pressed, and drilling processing is performed to obtain the sixth via hole K06; the sixth via hole K06 passes through the seventeenth layer plate L17 to the twenty-first layer plate L21;

[0107] Step S360: the first layer plate L1 and the second layer plate L2, the third layer plate L3 and the fourth layer plate L4, the fifth layer plate L5 and the sixth layer plate L6, the seventh layer plate L7 and the eighth layer plate L8, the ninth layer plate L9 and the tenth layer plate L10, the eleventh layer plate L11 and the twelfth layer plate L12, the thirteenth layer plate L13 and the fourteenth layer plate L14, the fifteenth layer plate L15 and the sixteenth layer plate L16, the seventeenth layer plate L17 and the eighteenth layer plate L18, the nineteenth layer plate L19 and the twentieth layer plate L20, the twenty-first layer plate L21 and the twenty-second layer plate L22, the twenty-third layer plate L23 and the twenty-fourth layer plate L24 are fourthly pressed, and drilling processing is performed to obtain the third via hole K03 and the tenth via hole K10; the third via hole K03 passes through the fourteenth layer plate L14 to the nineteenth layer plate L19; the tenth via hole K10 passes through the first layer plate L1 to the twenty-fourth layer plate L24.

[0108] In the manufacturing method provided by some embodiments of the present application, the second via hole K02 is realized by drilling through holes on the first layer plate L1 to the sixteenth layer plate L16 and back drilling and resin filling on the fifteenth layer plate L15 to the sixteenth layer plate L16;

[0109] The fourth via hole K04 is realized by drilling through holes on the first layer plate L1 to the sixteenth layer plate L16 and back drilling and resin filling on the thirteenth layer plate L13 to the sixteenth layer plate L16;

[0110] The ninth via hole K09 is realized by drilling through holes on the first layer plate L1 to the sixteenth layer plate L16 and back drilling and resin filling on the first layer plate L1 to the twelfth layer plate L12.

[0111] In the manufacturing method provided by some embodiments of the present application, the third via hole K03 is realized by drilling through holes on the first layer plate L1 to the twenty-fourth layer plate L24 and back drilling and resin filling on the first layer plate L1 to the thirteenth layer plate L13 and the twentieth layer plate L20 to the twenty-fourth layer plate L24.

[0112] The sixth via hole K06 is realized by drilling through holes on the seventeenth layer plate L17 to the twenty-fourth layer plate L24 and back drilling and resin filling on the twenty-second layer plate L22 to the twenty-fourth layer plate L24.

[0113] The present application provides a multilayer printed circuit board for a millimeter wave active phased array antenna and a manufacturing method of the multilayer printed circuit board, and the multilayer printed circuit board is integrally formed, so as to solve the problems of low integration, complex spatial layout and difficult realization of the limit space condition of each radio frequency module in the phased array antenna radio frequency system in the prior art, reduce the manufacturing cost and improve the performance stability.

[0114] As will be appreciated by one of ordinary skill in the art, all or some of the steps, systems, and techniques disclosed herein can be embodied in software, firmware, hardware, or any suitable combination thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application- specific integrated circuit. Such software can be distributed on computer readable media, which can comprise computer storage media or non-transitory media and communication media or transitory media. As will be appreciated by one of ordinary skill in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Further, as will be appreciated by one of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.

[0115] The embodiments of the present application disclosed above are only used to explain the present application and not intended to limit the present application. Various changes can be made without departing from the spirit of the present application.

Claims

1. A multilayer printed circuit board for a millimeter wave active phased array antenna, characterized in that: The first to the twenty-fourth layers of boards and the first to the fifth vias are sequentially arranged from top to bottom; in: The outer surface of the first layer board is provided with a radio frequency module and a power supply module, the radio frequency module is provided with a radio frequency interface and a communication interface, and the power supply module is provided with a power supply interface; The second layer of the board is provided with a power division network module, which is implemented by embedded thin film resistors; The third layer is equipped with RF control traces; The fifth layer is provided with RF control traces; The 7th layer is used to transmit the power supply voltage of the first voltage level; The ninth layer is used to transmit the power supply voltage of the second voltage level; The 10th layer is equipped with RF control traces; The 12th layer is equipped with RF control traces; The 14th layer is used to transmit radio frequency signals; The 15th layer is a non-circuit layer; The 16th and 17th layers are ground circuit layers; The 18th layer is a non-circuit layer; The 19th layer is equipped with a radiation excitation module; The 21st layer is grounded and is hollowed out by copper cladding to achieve gap coupling with the 19th layer; The 22nd layer is provided with an antenna array radiation module, and the antenna array radiation module is gap-coupled with the radiation excitation module; The 4th, 6th, 8th, 11th and 13th layers are used for grounding; The 20th, 23rd, and 24th layers are empty layers, without copper foil or circuits. A first via is formed from the first layer of the board to the second layer of the board to enable signal transmission between the radio frequency module and the power division network module; A second via hole passes through the first layer of the board to the fourteenth layer of the board, so as to transmit the radio frequency signal output by the radio frequency module to the fourteenth layer of the board; A third via hole passes through the 14th layer of board to the 19th layer of board to transmit the radio frequency signal of the 14th layer of board to the radiation excitation module; A fourth via is formed from the first layer of the board to the twelfth layer of the board to achieve electrical connection between the RF control trace and the RF module; A fifth via hole passes through the 21st layer of board to the 22nd layer of board to achieve electrical connection between the 21st layer of board and the antenna array radiation module.

2. The multilayer printed circuit board according to claim 1, wherein The fourth via is also used to achieve electrical connection between the seventh layer board and the power module.

3. The multilayer printed circuit board according to claim 1, wherein The fourth via is also used to achieve electrical connection between the ninth layer board and the power module.

4. A method for manufacturing a multilayer printed circuit board for a millimeter wave active phased array antenna according to any one of claims 1 to 3, characterized in that: include: Drilling the first and second layer boards to obtain first vias; The first via hole passes through the first layer of board to the second layer of board; The first layer board and the second layer board, the third layer board and the fourth layer board are pressed together for the first time, and drilled to obtain a seventh via hole; the seventh via hole passes through the first layer board to the fourth layer board; The first layer board and the second layer board, the third layer board and the fourth layer board, the fifth layer board and the sixth layer board, the seventh layer board and the eighth layer board, the ninth layer board and the tenth layer board, the eleventh layer board and the twelfth layer board, the thirteenth layer board and the fourteenth layer board, and the fifteenth layer board and the sixteenth layer board are pressed together for the second time, and drilled to obtain a second via hole, a fourth via hole, an eighth via hole, and a ninth via hole; the second via hole passes through from the first layer board to the fourteenth layer board; the fourth via hole passes through from the first layer board to the twelfth layer board; the eighth via hole passes through from the first layer board to the sixteenth layer board; and the ninth via hole passes through from the thirteenth layer board to the sixteenth layer board; Drilling the 21st and 22nd layer boards to obtain a fifth via hole; the fifth via hole passes through the 21st layer board to the 22nd layer board; Laminating the 17th and 18th layer boards, the 19th and 20th layer boards, the 21st and 22nd layer boards, and the 23rd and 24th layer boards for the third time, and drilling the boards to obtain a sixth via hole, the sixth via hole passing from the 17th layer board to the 21st layer board; The first layer board and the second layer board, the third layer board and the fourth layer board, the fifth layer board and the sixth layer board, the seventh layer board and the eighth layer board, the ninth layer board and the tenth layer board, the eleventh layer board and the twelfth layer board, the thirteenth layer board and the fourteenth layer board, the fifteenth layer board and the sixteenth layer board, the seventeenth layer board and the eighteenth layer board, the nineteenth layer board and the twentieth layer board, the twenty-first layer board and the twenty-second layer board, and the twenty-third layer board and the twenty-fourth layer board are pressed together for the fourth time and drilled to obtain a third via hole and a tenth via hole; the third via hole passes through the fourteenth layer board to the nineteenth layer board; the tenth via hole passes through the first layer board to the twenty-fourth layer board.

5. The production method according to claim 4, characterized in that: The second via is realized by drilling a through hole from the first layer to the sixteenth layer and back drilling from the fifteenth layer to the sixteenth layer and filling with resin; The fourth via hole is realized by drilling a through hole from the first layer to the sixteenth layer and back drilling from the thirteenth layer to the sixteenth layer and filling with resin; The ninth via hole is realized by drilling a through hole from the first layer board to the sixteenth layer board and back drilling from the first layer board to the twelfth layer board and filling with resin.

6. The production method according to claim 4, characterized in that: The third via hole is realized by drilling a through hole from the first layer to the 24th layer, and back-drilling from the first layer to the 13th layer and from the 20th layer to the 24th layer, and then filling with resin; The sixth via hole is realized by drilling a through hole from the 17th layer board to the 24th layer board and back drilling from the 22nd layer board to the 24th layer board and filling with resin.

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